JP4462056B2 - Chip mounting apparatus and chip mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for picking up a chip stably and mounting it on a substrate. <P>SOLUTION: In the apparatus for picking up a chip from a sheet sticking the chip by an adhesive substance generating gas through irradiation with light and mounting the chip on a substrate, a means for irradiating the sheet with light from the lower surface side in order to reduce adhesion holding force is fixed with a planar light shielding member 9 provided with a light transmitting portion T and a light shielding portion N. Under a state where the light shielding member 9 is aligned with a chip 6 to be picked up, profile and dimensions of the light transmitting portion T are set such that the light transmitting portion T does not project to the outside of an inner edge line 6b set in closed shape while spaced apart by predetermined with d inward from the outline 6a of the chip 6. Consequently, impact of irradiation on an adjacent chip 6 is eliminated and the chip 6 can be picked up stably and mounted on the substrate. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

  The present invention relates to a chip mounting apparatus and a chip mounting method for picking up a chip adhered to a sheet and mounting it on a substrate.

  A die bonding apparatus that mounts individual semiconductor chips cut out from a semiconductor wafer onto a substrate such as a lead frame is a pickup apparatus that removes semiconductor chips held in a state of being adhered to a sheet from the sheet for each individual piece. I have. In this pickup device, as a method of peeling the adhered semiconductor chip from the sheet, a method using ultraviolet irradiation is put into practical use instead of a conventionally used push-up method using an ejector pin (for example, a patent) Reference 1).

This system uses a pressure-sensitive adhesive that reduces the adhesive strength by UV irradiation as a pressure-sensitive adhesive that adheres the semiconductor chip to the sheet, and the semiconductor is applied to the sheet by irradiating the semiconductor chip with UV light. The adhesive force for holding the chip is reduced, and the semiconductor chip can be easily picked up by the suction collet.
JP-A-8-288318

  However, in the peeling of the chip by the ultraviolet irradiation shown in the above-mentioned patent document example, the following problems have occurred due to the setting of the ultraviolet irradiation range. In chip pick-up, it is desirable to reduce the sticking holding power only for the chip to be taken out and to keep the other chips stuck stably on the sheet. However, if the irradiation range is not appropriately set in the ultraviolet irradiation, a situation may occur in which the ultraviolet rays are irradiated not only on the chip to be taken out but also on the sheet on which the adjacent chip is adhered and held. For this reason, not only the chip to be taken out but also the adhering holding force of the adjacent chip is unnecessarily reduced, resulting in a displacement of the chip, which hinders stable chip pickup.

  Accordingly, an object of the present invention is to provide a chip mounting apparatus and a chip mounting method capable of stably picking up a chip and mounting the chip on a substrate.

The chip mounting apparatus of the present invention is a chip mounting apparatus that picks up the chip from a sheet in which the chip is adhered and held on the upper surface by an adhesive substance that generates gas by light irradiation, and mounts the chip on the substrate. A substrate holding unit for holding, a sheet holding unit for holding the sheet, a pickup unit for picking up the chip from the sheet, a mounting unit for mounting the picked-up chip on the substrate, and a lower part of the sheet holding unit A light irradiating means for irradiating the sheet with light from below to reduce the sticking holding force of the chip by the adhesive substance, and provided between the upper surface of the light irradiating means and the lower surface of the sheet. A light-shielding member having a light-transmitting part that transmits the light and a light-shielding part that blocks the light, and the light-shielding member is picked up on the sheet. In a state combined with a position on the flop target chip, without protruding outside the set inner lines closed shape the translucent portion is separated by a predetermined width inwardly from the outer shape line of the chip, the light-shielding portion, the It includes a closed light-shielding region that is enclosed by the light transmitting part .

The chip mounting method of the present invention is a chip mounting method for picking up the chip from a sheet in which the chip is stuck and held on the upper surface by an adhesive substance that generates gas by light irradiation, and mounting the chip on a substrate. A light irradiation step for reducing the sticking holding force of the chip by the adhesive substance by irradiating light from below, a pickup step for picking up the chip from the sheet, and mounting for mounting the picked-up chip on a substrate An irradiation range in which the light is irradiated on the sheet in the light irradiation step does not protrude outside the inner edge line set at a predetermined width inward from the outline of the chip , and the light The non-irradiation range that is not irradiated includes a closed non-irradiation region enclosed by the irradiation range .

  According to the present invention, in the light irradiation step, the light is irradiated to the irradiation range set so as not to protrude outside the inner edge line set inward by a predetermined width from the outline of the chip. The influence of light irradiation on the chips can be eliminated to prevent the sticking holding force of these chips from being unnecessarily reduced, and the chips can be stably picked up and mounted on the substrate.

(Embodiment 1)
FIG. 1 is a side view of a chip mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a configuration explanatory diagram of a light irradiation unit of the chip mounting apparatus according to the first embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4, FIG. 5, and FIG. 6 show the shape of the light shielding member attached to the light irradiation part of the chip mounting apparatus according to the first embodiment of the present invention. FIG. 7, FIG. 8, FIG. 9 are diagrams for explaining the operation of the chip pickup method according to the first embodiment of the present invention.

  First, the structure of the chip mounting apparatus will be described with reference to FIG. In FIG. 1, a component supply stage 2 is disposed on a base 1. The component supply stage 2 includes a jig holder 3, and the jig holder 3 detachably holds the jig 4 on which the sheet 5 is mounted. A semiconductor chip 6 (hereinafter simply abbreviated as “chip 6”) is held on the sheet 5 in a state of being separated into individual pieces.

  The sheet 5 used as the carrier of the chip 6 is formed by forming a light-transmitting material such as a transparent resin into a sheet shape, and a pressure-sensitive adhesive (adhesive substance) having the following properties is formed into a thin film on the upper surface of the sheet 5. An adhesive layer 5a is formed. As the pressure-sensitive adhesive, a compound having a property of generating gas when irradiated with light (for example, a compound having a property of generating nitrogen gas by being decomposed by ultraviolet irradiation such as an azide group) A pressure-sensitive adhesive containing the composition is used.

  That is, the sheet 5 has a plurality of chips 6 adhered and held on the upper surface by an adhesive having the property of generating gas when irradiated with light, and the component supply stage 2 is mounted on the jig 4. Is supported by the jig holder 3. Therefore, the component supply stage 2 is a sheet holding unit that holds the sheet 5. By using the sheet 5 having such an adhesive layer 5a as a carrier for holding the chip 6 as described above, the chip 6 can be easily peeled when the chip 6 is picked up from the sheet 5 as will be described later. it can.

  Below the sheet 5 held by the jig holder 3, a light irradiation unit 8 is disposed so as to be horizontally movable by a light irradiation unit moving mechanism 7 including an X-axis table 7X and a Y-axis table 7Y. As shown in FIG. 2, the light irradiation unit 8 includes a cylindrical light guide unit 8a and a UV light source unit 8b built under the light guide unit 8a. A plate member is provided on the upper surface of the light guide unit 8a. A certain light shielding member 9 is detachably mounted.

The light shielding member 9 is configured by depositing a light shielding film 9b on a specific range of the surface of the transparent glass plate 9a. When the UV light source unit 8b is turned on and ultraviolet rays are projected upward, the light shielding film 9b is formed. In the range, the ultraviolet rays are blocked, and in the range where the light shielding film 9b is not formed, the ultraviolet rays are blocked by the glass plate 9.
Irradiates upward through a. Therefore, in the light shielding member 9, the area where the light shielding film 9b is not formed is a translucent portion T (hatched portion) through which the ultraviolet light is transmitted, and the area where the light shielding film 9b is formed blocks the ultraviolet light. The light-shielding part N to be used.

  As a configuration of the light shielding member 9, instead of using the glass plate 9a on which the light shielding film 9b is formed, a metal plate or the like on which an opening is formed may be used as the light shielding member. In this case, the ultraviolet rays are transmitted upward through the opening, and the ultraviolet rays are shielded in a range other than the opening. That is, in this case, the opening provided in the plate forms the translucent portion T, and the portion other than the opening becomes the light shielding portion N.

  In the pick-up operation for taking out the chip 6 from the component supply stage 2, the light irradiation unit 8 is moved horizontally by the light irradiation unit moving mechanism 7 so that the translucent part T is positioned directly below the chip 6 to be picked up. In this state, the UV light source unit 8b is turned on to irradiate the lower surface of the sheet 5 located directly below the chip 6 to be picked up with ultraviolet rays (see FIG. 7). Thereby, ultraviolet rays permeate | transmit the sheet | seat 5, and are irradiated to the adhesion layer 5a, and nitrogen gas is emitted from the adhesion layer 5a. Then, the generated nitrogen gas stays at the interface between the chip 6 and the adhesive layer 5a to form a gas layer, whereby the holding force for the adhesive layer 5a to stick and hold the chip 6 is greatly reduced, and the sheet 5 of the chip 6 is reduced. Peeling from becomes easy.

  That is, in the above configuration, the UV light source unit 8b provided in the light irradiation unit 8 is provided below the component supply stage 2 that is a sheet holding unit, and irradiates the sheet 5 with light from below, thereby forming a chip by the adhesive layer 5a. 6 is a light irradiating means for reducing the sticking holding power of No. 6. The light shielding member 9 is provided between the upper surface of the light irradiating means and the lower surface of the sheet 5, and has a light transmitting portion T that transmits light and a light shielding portion N that blocks light. The translucent part T corresponds to an irradiation range in which ultraviolet rays are irradiated on the sheet 5 in the above-described light irradiation, and the light shielding part N corresponds to a non-irradiation range in which ultraviolet rays are not irradiated on the sheet 5.

  Next, the shape of the translucent part T in the light shielding member 9 will be described with reference to FIG. FIG. 3A shows a state in which the light shielding member 9 is aligned with the chip 6 to be picked up on the sheet 5. Here, 6a indicated by a two-dot chain line indicates the outline of the chip 6, and the outline Ta (translucent portion T and the transparent portion T) of the translucent portion T (hatched portion) set to a similar shape to the outline 6a. The boundary line of the light shielding portion N) is inside the outer shape line 6 a of the chip 6. That is, in the example shown here, the translucent part T is similar in shape to the target chip 6 and is set to a size smaller than the chip 6.

  FIG. 3B shows details of the relative relationship between the size of the translucent portion T and the size of the chip 6. In FIG. 3B, 6b indicated by a one-dot chain line is an inner edge line of the chip 6, and is set inside the outer line 6a of the chip 6 by a predetermined margin width d along the outer line 6a. Here, the margin width d takes into consideration the shape error of the chip 6, the shape error of the transmission part T in the light shielding member 9, and the positioning error when the light irradiation part 8 is horizontally moved and aligned with the chip 6 to be picked up. Is set.

  In determining the shape and dimensions of the light transmitting portion T, factors such as the amount of nitrogen gas per unit area generated by the ultraviolet ray irradiation of the adhesive layer 5a are taken into account, but here, as the upper limit size of the light transmitting portion T, The shape / dimension is set as the upper limit so that the outer shape line Ta does not protrude outward from the inner edge line 6b. Thereby, even if the shape error of the chip 6 and the light shielding member 9 and the positioning error described above exist in a state where the light irradiation unit 8 is moved and aligned with the chip 6 to be picked up, the light transmitting unit The situation where T does not protrude outside the outline 6a of the chip 6 does not occur, and as will be described later, it is possible to prevent the holding force reduction effect due to ultraviolet irradiation from being unnecessarily applied to the adjacent chip 6 and to pick up the chip. Has the effect of stabilizing.

  That is, in the present embodiment, in a state where the light shielding member 9 is aligned with the chip 6 to be picked up on the sheet 5, the translucent portion T is closed with a predetermined width d inward from the outline 6 a of the chip 6. It does not protrude outside the inner edge line 6b set in.

  2 and 3, the example in which the light transmitting member 9 is provided with the light transmitting portion T having a shape similar to that of the chip 6 for the substantially square chip 6 is described. Can be detachably attached to the light irradiation unit 8, and various types can be selected according to the characteristics of the target sheet 5 and chip 6. Hereinafter, with reference to FIG. 4, FIG. 5, FIG. 6, the variation of the light shielding member 9 is shown. Here, FIG. 4A, FIG. 4B, FIG. 5A, FIG. 5B, FIG. 6A, and FIG. 6B are square like the example shown in FIG. 4 (c), FIG. 5 (c), and FIG. 6 (c) show an example of the rectangular chip 6 as a target.

  FIG. 4A shows the light shielding member 9 in which a circular light transmitting portion T1 having a diameter D that fits inside the inner edge line 6b is provided at the center position. This pattern is effective when it is desired to intensively peel off the central portion of the target chip 6. FIG. 4B shows an example in which a translucent portion T2 in which band-like portions having a width b1 are arranged in a bowl shape from the central portion toward the outer edge side is shown. This pattern is effective when the total area of the translucent portion T is suppressed to control the amount of nitrogen gas generated inside the square chip 6 to an appropriate amount and the gas generation distribution is to be made as uniform as possible. is there. FIG. 4C shows an example in which a rectangular light transmitting portion T3 is provided inside the rectangular inner edge line 6b.

  FIG. 5A shows an example in which an X-shaped translucent portion T4 composed of two diagonal lines a connecting opposite corner portions is provided in a square formed by the inner edge line 6b. This pattern suppresses the entire area of the translucent part T, and arranges the translucent part in a range corresponding to the corner part of the chip 6, thereby generating nitrogen gas in the vicinity of the corner part and picking up the corner at the time of pickup. This is intended to facilitate peeling of the part.

  FIG. 5B shows an example in which a translucent portion T5 having a shape in which a cross line b is superimposed on the X shape shown in FIG. 5A is provided. This pattern is effective when it is desired to increase the area of the light transmitting part in the vicinity of the central part while ensuring the above-described effect. FIG. 5 (c) shows a hatched portion of the rectangular inner edge line 6b shown in FIG. 4 (c) from both ends of the straight line portion c set in the longitudinal direction at the center portion toward the corner portion of the inner edge line 6b. The example which provided the translucent part T6 of the structure which extended d is shown, and has the same effect as the pattern shown to Fig.5 (a).

  FIG. 6A shows a diameter D2 at the center of the circular light-transmitting part having a diameter D1 when a circular light-transmitting part that fits inside the inner edge line 6b is provided as shown in FIG. 4A. The example which provided the translucent part T7 of the structure which provided this light-shielding part N (closed light-shielding area | region) is shown. In this pattern, a closed light-shielding portion surrounded by a light-transmitting portion is arranged at the center of the target chip 6 so that no ultraviolet gas is irradiated and no nitrogen gas is generated during light irradiation. Is intentionally left behind. Thereby, the state in which the chip 6 is held on the sheet 5 with an appropriate holding force can be maintained.

6 (b) is also in the case where the square transparent portion T8, 2 two of the light-shielding portion is enclosed closed shape of the transparent portion around the center of the transparent portion N a (閉遮light region) An example of setting is shown. According to this pattern, in addition to the effect of holding the chip 6 on the sheet 5 with an appropriate holding force as described above, there is an anti-rotation effect by holding the chip 6 on the sheet 5 by these light shielding portions N. As a result, the displacement of the tip 6 in the Θ direction can be prevented. And FIG. 6 (c), in providing a rectangular transparent portion inside of the rectangular inner edge line 6b, the light transmitting portion of the structure in which a rectangular shaped light shielding portion N (閉遮light region) inside T9 As shown in FIG. 6A, the chip 6 can be held on the sheet 5 with an appropriate holding force.

  In the above pattern, in each example shown in FIGS. 3, 4A, 5C, 5A, 5B, and 5C, the translucent portions T, T1, T3, T4, and T5 are used. , T6 includes a central translucent part set including the central part of the chip 6. In each example shown in FIGS. 5A, 5B, and 5C, the light transmitting portions T4, T5, and T6 are extended light transmitting portions that extend from the center portion of the chip 6 toward the inner edge line 6b. It is a form to include. Further, in each example shown in FIGS. 6A, 6 </ b> B, and 6 </ b> C, the light shielding portion N includes a closed light shielding region surrounded by the light transmitting portions T <b> 7, T <b> 8, and T <b> 9.

  In FIG. 1, a second camera 13 and a substrate holding stage 10 are disposed on a base 1 adjacent to the component supply stage 2. The substrate holding stage 10 has a configuration in which a substrate holding table 11 is placed on a base portion 10a. The substrate holding table 11 is a substrate holding portion that holds a substrate 12 on which the chip 6 is mounted. A horizontal upper frame 15 is installed on the support posts 1 a erected on both ends of the upper surface of the base 1, and a first camera 17 is moved horizontally by the first camera moving mechanism 16 on the upper frame 15. Arranged freely. By moving the first camera 17 by the first camera moving mechanism 16, the first camera 17 is positioned above an arbitrary chip 6 held on the sheet 5 and images the chip 6. And the position of the arbitrary chip 6 is recognized by recognizing this imaging result by a recognition means (not shown).

  A component holding head 19 is disposed on the upper frame 15 so as to be horizontally movable by a component holding head moving mechanism 18. A holding tool 20 is attached to the lower part of the component holding head 19, and the component holding head 19 is moved onto the component supply stage 2 so that the holding tool 20 is aligned with the chip 6 to be picked up and moved up and down. The holding tool 20 contacts the upper surface of the chip 6 and picks up the chip 6 by vacuum suction.

  The component holding head 19 holding the chip 6 by this pickup operation is moved above the substrate holding stage 10, and the holding tool 20 is moved up and down with respect to the substrate 12 held on the substrate holding table 11. The held chip 6 is mounted on the substrate 12. The component holding head moving mechanism 18 and the component holding head 19 include a holding tool 20 that picks up and holds the chip 6 on the sheet 5, and moves back and forth between the component supply stage 2 and the substrate holding stage 10. This is a component mounting mechanism for mounting the circuit board 12 on the board 12. That is, this component mounting mechanism serves as both pickup means for picking up the chip 6 from the sheet 5 and mounting means for mounting the picked-up chip 6 on the substrate 12. Of course, the pickup means and the mounting means may be configured by separate mechanisms.

  A second camera 13 is disposed below a moving path along which the component holding head 19 moves from the component supply stage 2 to the substrate holding stage 10. The second camera 13 is a chip 6 held by a holding tool 20. Is taken from below. And the position of the chip | tip 6 in the state hold | maintained at the holding | maintenance tool 20 is recognized by recognizing this imaging result by a recognition means (illustration omitted). When the chip 6 is mounted on the substrate 12 by the component holding head 19, the alignment of the chip 6 with respect to the substrate 12 is performed reflecting the position recognition result.

  This chip mounting apparatus is configured as described above. Next, the chip mounting operation will be described with reference to FIG. 7, FIG. 8, and FIG. In this chip mounting operation, the chip 6 is picked up and mounted on the substrate from the sheet 5 on which the chip 6 is adhered and held on the upper surface by an adhesive that generates gas when irradiated with light.

  FIG. 7 shows a state where the alignment of the chip 6 with the light irradiation unit 8 and the holding tool 20 is completed, that is, the recognition result of the imaging result obtained by imaging the chip 6 by the first camera 17 recognizes the position of the chip 6. Based on the recognition result, the light irradiation unit 8 is correctly positioned below the chip 6 to be picked up, and the holding tool 20 is positioned directly above the chip 6. In this state, the light transmitting portion T of the light shielding member 9 is aligned with the lower surface of the chip 6 to be picked up, and the light irradiation process is executed in this state. That is, by turning on the UV light source unit 8b and irradiating the sheet 5 with light from below, nitrogen gas is generated from the adhesive layer 5a to reduce the sticking holding force of the chip 6 by the adhesive layer 5a (light irradiation) Process).

  In this light irradiation process, by using the light shielding member 9 described above, the irradiation range in which the ultraviolet rays are irradiated onto the sheet 5 is set to an inner edge line 6b set at a predetermined width inward from the outer shape line 6a of the chip 6. Therefore, the effect of reducing the sticking holding force is not unnecessarily applied to the peripheral chips 6 adjacent to the chip 6 to be picked up.

  Then, when the nitrogen gas generated from the adhesive layer 5a is accumulated in a sufficient amount at the adhesive interface between the chip 6 and the adhesive layer 5a and the gas layer G is formed as shown in FIG. 7, the nitrogen gas is retained as shown in FIG. The tool 20 is lowered and brought into contact with the upper surface of the chip 6, and the chip 6 is held by vacuum suction. Next, as shown in FIG. 9, the holding tool 20 is raised together with the chip 6, and the chip 6 is picked up from the sheet 5 (pickup process). In this pick-up process, the chip 6 can be picked up stably without any chip displacement caused by unnecessarily reducing the holding force of adjacent chips as described above.

  When the chip 6 is picked up, the component holding head 19 is moved above the second camera 13, the chip 6 held by the holding tool 20 is imaged by the second camera 13, and the imaging result is recognized. Thus, the position of the chip 6 held by the component holding head 19 is recognized. Thereafter, the component holding head 19 moves to the substrate holding stage 10, reflects the recognition result, controls the component holding head moving mechanism 18, and aligns the chip 6 held by the holding tool 20 with the substrate 12. Then, the aligned chip 6 is mounted on the substrate 12 (mounting process).

  In the chip mounting operation described above, the light-shielding member 9 to be mounted on the light irradiation unit 8 is, as described above, a light-transmitting unit having various patterns shown in FIGS. 4, 5, and 6 in addition to those shown in FIG. Can be used according to the characteristics of the sheet 5 and the chip 6.

  Here, what is provided with the translucent portions T, T1, T3, T4, T5, and T6 shown in FIGS. 3, 4A, 5C, 5A, 5B, and 5C. When used, the irradiation range in which the sheet 5 is irradiated with ultraviolet rays is in a form including a central irradiation range set including the central portion of the chip 6. When the light shielding member 9 provided with the light transmitting portions T4, T5, and T6 shown in FIGS. 5A, 5B, and 5C is used, the irradiation range is from the center portion of the chip 6 toward the inner edge line. It becomes a form including the extended irradiation range extended. Further, when the light shielding member 9 provided with the light transmitting portions T7, T8, and T9 shown in FIGS. 6A, 6B, and 6C is used, the non-irradiated range where the ultraviolet rays are not irradiated on the sheet 5 is irradiated. It becomes a form including the non-irradiation area of the closed shape enclosed by the range.

(Embodiment 2)
FIG. 10 is a side view of the chip mounting apparatus according to the second embodiment of the present invention, and FIGS. 11, 12, 13, and 14 are operation explanatory views of the chip pickup method according to the second embodiment of the present invention.

First, the structure of the chip mounting apparatus will be described with reference to FIG. In FIG. 10, the base 10
1, a component supply stage 102 having the same configuration as the component supply stage 2 in the first embodiment is disposed so as to be horizontally movable by a component supply stage moving mechanism 107 including an X-axis table 107X and a Y-axis table 107Y. . The component supply stage 102 includes a jig holder 103. The jig holder 103 detachably holds the jig 4 on which the same sheet 5 as that shown in the first embodiment is mounted. The sheet 5 holds the chip 6 in a state of being separated into individual pieces.

  Below the sheet 5 held by the jig holder 3, a light irradiation unit 8 similar to that of the first embodiment is fixedly held on the base 101 via an inverted L-shaped holding bracket 101 b. Various light shielding members 9 shown in the first embodiment are detachably attached to the light irradiation unit 8. The light irradiation unit 8 is disposed at the same horizontal position as a component observation camera 117 described later, and this position is a pickup position P for taking out the chip 6 from the sheet 5 by a holding tool 120 described later.

  A substrate holding stage 110 is disposed on the base 101 adjacent to the component supply stage 102. The substrate holding stage 110 has a configuration in which a substrate holding table 111 is fixed on an upper part of a support post 101c erected on a base 101. The substrate holding table 111 holds a substrate 12 on which a chip 6 is mounted. Has become a department.

  A component holding head moving mechanism 116 is installed on the support posts 101a erected on both ends of the upper surface of the base 101. The component holding head 119 is disposed on the component holding head moving mechanism 116 so as to be horizontally movable. ing. A holding tool 120 is attached to the lower part of the component holding head 119. The holding tool 120 is moved up and down by moving the component holding head 119 to the pickup position P set on the component supply stage 102 and moving the holding tool 120 up and down. The chip 6 aligned with the pickup position P is picked up by vacuum suction.

  The component holding head 119 holding the chip 6 is moved above the substrate holding table 110, and the holding tool 120 is moved up and down with respect to the substrate 12 held on the substrate holding table 111, so that the holding tool 120 holds the chip 6. The chip 6 is mounted on the substrate 12. The component holding head moving mechanism 116 and the component holding head 119 include a holding tool 120 that picks up and holds the chip 6 on the sheet 5, and moves back and forth between the component supply stage 102 and the substrate holding stage 110. It is a component mounting mechanism that mounts the circuit board on the board. That is, this component mounting mechanism serves as both pickup means for picking up the chip 6 from the sheet 5 and mounting means for mounting the picked-up chip 6 on the substrate 12. Of course, the pickup means and the mounting means may be configured by separate mechanisms.

  An inverted L-shaped support bracket 115 is fixed to the upper portion of the left support post 101a, and the component observation camera 117 is positioned on the support bracket 115 at the pickup position P by the holding tool 120, that is, directly above the light irradiation unit 8. Is held. By moving the component supply stage 102 horizontally by the component supply stage moving mechanism 107, the chip 6 on the sheet 5 moves relative to the component observation camera 117, and is thereby held by the component observation camera 117 on the sheet 5. An arbitrary chip 6 can be imaged. The position of the chip 6 is recognized by recognizing the imaging result by a recognition means (not shown).

  Next, the chip mounting operation will be described with reference to FIGS. In this chip mounting operation, the chip 6 is picked up and mounted on the substrate from the sheet 5 on which the chip 6 is adhered and held on the upper surface by an adhesive that generates gas when irradiated with light.

FIG. 11 shows a state where the alignment of the chip 6 with the light irradiation unit 8 and the holding tool 120 is completed, that is, the position of the chip 6 is recognized by recognizing the imaging result obtained by imaging the chip 6 with the first camera 17. The state in which the component supply stage 102 is moved horizontally based on the recognition result and the chip 6 to be picked up is positioned at the pickup position P is shown. In this state, the light transmitting portion T of the light shielding member 9 is aligned with the lower surface of the chip 6 to be picked up.

  Next, as shown in FIG. 12, the holding tool 120 is lowered and brought into contact with the upper surface of the chip 6, and the light irradiation step is executed in this state. That is, as shown in FIG. 13, the UV light source portion 8b is turned on, and the adhesive layer 5a located on the back surface of the chip 6 to be picked up is irradiated with ultraviolet rays from the lower surface side of the sheet 5, thereby Nitrogen gas is generated to reduce the sticking retention force of the chip 6 by the adhesive layer 5a (light irradiation step).

  When the generated nitrogen gas is accumulated in a sufficient amount at the interface between the chip 6 and the adhesive layer 5a and the gas layer G is formed, the chip 6 held by raising the holding tool 120 as shown in FIG. Pick up from the sheet 5 (pickup process). When the chip 6 is picked up by the holding tool 120, the component holding head 119 moves to the board holding table 110 and mounts the held chip 6 on the board 12 (mounting process). Also in the second embodiment, the same effect as described above can be obtained by using the light shielding member 9 shown in the first embodiment.

  As described above, in the chip pickup shown in the first and second embodiments, in the light irradiation performed to reduce the sticking holding force of the chip 6 by the adhesive layer 5a, from the outline 6a of the chip 6 Light is irradiated to the irradiation range set so as not to protrude outside the inner edge line 6b set inside by a predetermined width. Thereby, the influence of the light irradiation to the adjacent chip 6 is eliminated, and a situation in which the adhesion holding force of these chips 6 is unnecessarily reduced does not occur. Therefore, the effect of facilitating the peeling of the chip 6 from the adhesive layer 5a can be secured, and the chip 6 can be stably picked up and mounted on the substrate.

  The chip mounting apparatus and the chip mounting method of the present invention have the effect that the chip can be stably picked up and mounted on the substrate, and the chip held on the sheet in the die bonding apparatus is picked up and mounted on the substrate. It is useful for the application.

1 is a side view of a chip mounting apparatus according to a first embodiment of the present invention. Structure explanatory drawing of the light irradiation part of the chip | tip mounting apparatus of Embodiment 1 of this invention Shape explanatory drawing of the light shielding member with which the light irradiation part of the chip | tip mounting apparatus of Embodiment 1 of this invention is mounted | worn The top view of the light shielding member with which the light irradiation part of the chip | tip mounting apparatus of Embodiment 1 of this invention is mounted | worn The top view of the light shielding member with which the light irradiation part of the chip | tip mounting apparatus of Embodiment 1 of this invention is mounted | worn The top view of the light shielding member with which the light irradiation part of the chip | tip mounting apparatus of Embodiment 1 of this invention is mounted | worn Operation explanatory diagram of the chip pickup method of the first embodiment of the present invention Operation explanatory diagram of the chip pickup method of the first embodiment of the present invention Operation explanatory diagram of the chip pickup method of the first embodiment of the present invention Side view of the chip mounting apparatus according to the second embodiment of the present invention. Operation explanatory diagram of the chip pickup method of Embodiment 2 of the present invention Operation explanatory diagram of the chip pickup method of Embodiment 2 of the present invention Operation explanatory diagram of the chip pickup method of Embodiment 2 of the present invention Operation explanatory diagram of the chip pickup method of Embodiment 2 of the present invention

Explanation of symbols

2,102 Component supply stage 5 Sheet 5a Adhesive layer 6 Chip 8 Light irradiation part 9 Light shielding member 10, 110 Substrate holding stage 12 Substrate T Light transmission part N Light shielding part

Claims (3)

A chip mounting device that picks up the chip from a sheet in which the chip is stuck and held on the upper surface by an adhesive substance that generates gas by irradiation of light and mounts it on the substrate,
A substrate holding portion for holding the substrate; a sheet holding portion for holding the sheet; a pickup means for picking up the chip from the sheet; a mounting means for mounting the picked-up chip on the substrate; and the sheet holding. A light irradiating means for lowering the sticking holding force of the adhesive substance by irradiating the sheet with light from below, between the upper surface of the light irradiating means and the lower surface of the sheet A light-shielding member having a light-transmitting part that transmits light and a light-shielding part that blocks the light,
In a state where the light shielding member is aligned with the chip to be picked up on the sheet, the translucent part protrudes outside the inner edge line set in a closed shape with a predetermined width inside from the outline of the chip. Without
The light blocking portion, wherein the to Ruchi-up mounting device comprises a閉遮light region which is enclosed by the transmissive portion.   The chip mounting apparatus according to claim 1, wherein the light shielding member is a plate member that can be attached to and detached from the light irradiation unit. A chip mounting method for picking up the chip from a sheet in which the chip is stuck and held on the upper surface by an adhesive substance that generates gas by light irradiation and mounting the chip on a substrate,
A light irradiation step of reducing the sticking holding power of the chip by the adhesive material by irradiating light from below on the sheet; a pickup step of picking up the chip from the sheet; and the picked-up chip on the substrate Including the mounting process to be mounted,
The irradiation range in which the light is irradiated on the sheet in the light irradiation step does not protrude outside the inner edge line set by a predetermined width inside from the outline of the chip,
Non irradiation range in which the light is not irradiated, characteristics and to Ruchi-up mounting method comprises a closed shape of the non-irradiated region which is enclosed by the irradiation range.

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