JP4450726B2 - Interlayer connection device and interlayer connection method - Google Patents

Description

  The present invention relates to an interlayer connection device and an interlayer connection method for connecting layers of a multilayer wiring board.

  An example of a conventional wiring processing method is described in Patent Document 1. In the wiring method described in this publication, in order to perform wiring processing at a low cost to a through hole with a high aspect ratio provided in a base, a metal column made of conductive metal fine particles is formed in the through hole by a gas deposition method. ing. Specifically, after the metal fine particles are suspended in the gas, they are collided toward the fine through-holes formed in the substrate at a high speed. As a result, the through holes are filled with metal fine particles, and the layers are connected.

JP 2003-347453 A

  In the method described in Patent Document 1, since metal fine particles are suspended in a gas and then collide with a through hole of a base at high speed to generate a metal conductor, copper as an electric circuit formed in the substrate is formed. It is necessary to electrically connect the foil and the generated metal conductor. Since copper is a metal that is very easily oxidized, it easily reacts with oxygen in the air to form a copper oxide film that is an insulator. Since the copper oxide film is an insulator, electrical connection cannot be achieved unless it is removed. In addition, a via hole used for interlayer connection is created by drilling a hole in the insulating layer with a laser. However, if a smear is generated by removing the insulating layer during laser processing, the interlayer connection is hindered.

  When metal fine particles are ejected from a nozzle at a high speed, in the conventional method, only one via hole can be connected per nozzle in one ejection process. Accordingly, when a substrate having a large number of via holes is processed with one nozzle, a great amount of time is required.

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to improve the reliability of electrical connection between a copper foil forming an electric circuit and a generated metal conductor. Another object of the present invention is to process a substrate having a large number of via holes in a short time.

  A feature of the present invention that achieves the above object is that, in an interlayer connection device for a multilayer substrate in which a number of via holes are formed, a vacuum vessel in which the multilayer substrate is disposed, an aerosol generation chamber connected to the vacuum vessel, and an aerosol A gas introduction unit connected to the generation chamber for controlling the supply of gas to the aerosol generation chamber, and a metal fine particle introduction unit for controlling the introduction of conductive metal fine particles filling the via holes into the aerosol generation chamber. This is because a nozzle array in which nozzles corresponding to the arrangement of via holes are formed at the connection with the chamber.

  In this feature, the gas supplied from the gas introduction part may be at least one of an inert gas and a gas not containing oxygen, such as nitrogen, and includes an exhaust system capable of exhausting the vacuum container to 1 kPa or less. It is preferable to introduce the gas after the pressure becomes a vacuum pressure. The particle diameter of the metal fine particles is preferably 0.3 to 10 μm.

Still another feature of the present invention that achieves the above object is to provide an interlayer connection method in which a plurality of via holes are disposed in a reduced-pressure atmosphere, and the vacuum chamber in which the substrate is placed is evacuated. via a gas containing no oxygen such as an inert gas or nitrogen gas, to produce an aerosol with introduced a metal fine particle diameter 0.3~10μm connected to aerosol generation chamber into the vacuum chamber, the generated aerosol A nozzle array having a large number of nozzles formed corresponding to the holes is sprayed into the via holes to form metal conductors in the via holes and connect the layers of the substrate. And before producing | generating the aerosol of metal microparticles | fine-particles, the aerosol of abrasive | polishing agent and gas may be produced | generated, and this aerosol may be injected to a board | substrate and a via hole may be created with an abrasive | polishing agent.

  According to the present invention, since the metal fine particle aerosol is supplied to the via hole through the nozzle, the copper oxide film and smear on the surface of the copper foil can be surely removed, and the reliability of interlayer connection is improved. In addition, since a nozzle arrangement pattern corresponding to the via hole pattern is formed in the nozzle array and a plurality of via holes are processed simultaneously, the processing time is shortened.

  In a multilayer wiring board, electrical circuits made of copper foil and insulating layers are alternately stacked. The electrical circuits separated by the insulating layer are electrically connected by filling a hole called a via hole opened in the insulating layer with a conductive substance.

  In the conventional interlayer connection method, plating is used in the step of filling the via hole with a conductive material. At that time, a hole is made in the insulating layer using a laser, and the smear which is the insulating layer left uncut at the time of drilling is removed. Thereafter, a thin copper film is formed in the via hole by electroless copper plating. A thick copper film is produced from this thin copper film using electrolytic copper plating. This creates a conductive material in the via hole.

  However, in this interlayer connection method, an environment-impacting substance such as copper sulfate is frequently used in electroless copper plating or electrolytic copper plating, resulting in a problem that the environmental load increases and the cost for waste liquid treatment increases. . Further, with the miniaturization of information equipment, the miniaturization of wiring boards has progressed, and the diameter of via holes has become 50 μm or less, but it is difficult to cope with such small diameter via holes by conventional methods.

  The present invention avoids such problems of the prior art, and enables filling of small-diameter holes without using a method of increasing environmental load such as plating. Several specific examples will be described below with reference to the drawings.

  FIG. 1 is a front sectional view of an embodiment of an interlayer connection device 100 according to the present invention, and FIG. 2 is a sectional view of a nozzle array 24 used in the interlayer connection device 100. The interlayer connection device 100 includes a gas introduction unit 80, a metal powder introduction unit 82, an aerosol generation chamber 20 that generates aerosol from the gas and the metal powder introduced from the gas introduction unit 80 and the metal powder introduction unit 82, It has a vacuum container 11 for processing the aerosol generated in the aerosol generation chamber 20 to the laminated substrate 14 and an exhaust system 84 for evacuating the vacuum container 11.

  The gas introduction unit 80 includes a gas cylinder 16 that pressurizes and stores an inert gas such as argon or a gas that does not contain oxygen such as nitrogen, a mass flow controller 17 that adjusts the flow rate connected to the gas cylinder 16 via a pipe 16a, A gas heater 26 for controlling the temperature of the gas in the pipe 16a and sending it to the aerosol generation chamber 20 is provided. The gas flows from the gas cylinder 16 in the direction of the arrow 31 and is injected into the aerosol generation chamber 20 from the gas supply hole 20 a formed in the side surface of the aerosol generation chamber 20.

  The metal powder introduction part 82 has a tank 10 formed in a funnel shape, and a powder supply amount adjuster 18 connected to the lower part of the tank 10 by a pipe 10e. The metal powder introduction part 82 is attached to the upper part of the aerosol generation chamber 20. In the tank 10, conductive metal fine particles 1 such as copper, silver, and gold are stored, and a powder supply amount adjuster 18 adjusts the amount of dropping. The metal fine particles 1 dropped from the powder supply amount adjuster 20 flow into the aerosol generation chamber 20 from the introduction hole 20b formed in the upper surface of the aerosol generation chamber 20.

  A stirring device 86 is provided that stirs and mixes the metal fine particles 1 introduced into the aerosol generation chamber 20 and a gas to generate an aerosol. The stirring device 86 transmits the stirring blade 23 provided on the aerosol generation chamber 10 side, the stirring motor 21 that rotationally drives the stirring blade 23, and the power of the stirring motor 21 to the stirring blade 23 on the aerosol generation chamber 20 side. In addition, a rotation introducing device 22 for sealing the stirring motor 21 side and the aerosol generation chamber 20 side is provided. The stirring motor 21 is attached to the upper surface of the aerosol generation chamber 20.

  The aerosol generation chamber 20 is a cylindrical container or a prismatic container, and the container bottom is open. The aerosol generation chamber 20 is disposed above the vacuum vessel 11 having a larger upper surface area than the aerosol generation chamber 20. An opening 11 a is also formed in the aerosol generator 20 mounting portion of the vacuum vessel 11. A vacuum door 30 is provided on the side surface of the vacuum vessel 11 so as to be openable and closable, and a multilayer substrate to be processed can be carried into the vacuum vessel 11.

  A plate-like nozzle array 24 in which a large number of nozzles 25 are formed is placed on the upper surface of the opening 11a. The nozzle 25 is a hole that penetrates the nozzle array 24. As shown in FIG. 2, in the nozzle 25, the large diameter part 25a is formed in the aerosol production | generation chamber 20 side, and the small diameter part 25b is formed in the vacuum vessel 11 side. Therefore, in the nozzle 25, the flow path of the metal fine particles 1 is narrowed. The diameter of the small diameter portion 25b is slightly larger than the diameter of the via hole to be processed.

  Here, when the gas is ejected from the nozzle 25 to a reduced pressure atmosphere of about 1 kPa or less, the gas can be increased to the sound speed by the small diameter portion 25 b of the nozzle 25. Since the metal fine particles 1 flow along with the gas, the metal fine particles 1 are also accelerated to near the speed of sound by the small diameter portion 25b of the nozzle 25. However, in order to accelerate the metal fine particles 1 to the speed of sound, when the copper fine particles having a diameter of 1 μm are ejected at a gas pressure of 2 atm using argon gas, the length of the small diameter portion 25b is required to be 3 mm or more. The length of the small diameter portion 25b is increased in proportion to the diameter of the metal fine particles 1, and is inversely proportional to the molecular weight and pressure of the gas used.

  The exhaust system 84 is connected to the vacuum pump 15 that discharges the gas in the vacuum vessel 11 and the metal fine particles 1 that have not been used for processing to the outside of the vacuum vessel, and the vacuum pump 15 and the pipe 15b, and collects the metal fine particles 1. And a filter 12 for the purpose. On the side surface of the vacuum vessel 11, a hole 11 c through which the vacuum pump 15 discharges the gas in the vacuum vessel 11 as indicated by the arrow 33 is formed.

  In the vacuum vessel 11, a substrate 14 on which a number of via holes 50 to be processed are formed is disposed. At that time, the nozzle array 24 in which the nozzles 25 are formed at positions corresponding to the via holes 50 formed in the substrate 14 is previously attached to the opening 11 a of the vacuum vessel 11. The substrate is placed on the stage 13 in order to adjust the positioning of the via hole and the nozzle 25 and the height position of the substrate 14. Further, a substrate heater 27 for heating the substrate is provided between the substrate 14 and the stage 13 and is used to accelerate the processing of the substrate.

A method of interlayer connection using the interlayer connection device configured as described above will be described with reference to FIG.
(1) First, the metal fine particles 1 to be treated are filled in the tank 10. The surface is filled with, for example, copper fine particles as little as possible in the oxide film. On the other hand, for example, an argon gas cylinder is connected to the pipe 16a. The substrate 14 to be processed is transferred from the vacuum door 30 into the vacuum container, and the substrate 14 is set on the stage 13.

(2) The inside of the vacuum vessel 11 is depressurized to about 1 kPa or less by the vacuum pump 15.
(3) Gas is supplied to the aerosol generation chamber 20. At the same time, the gas heater 26 is operated to adjust the temperature of the inflowing gas. Since the speed of sound of gas is proportional to the 1/2 power of the absolute temperature of the gas, the temperature of the gas in the aerosol is adjusted by the gas heater 26. When the sound velocity of the gas is adjusted, the velocity of the ejected metal fine particles is also adjusted. The aerosol is ejected downward from the nozzles 25 of the nozzle array 24 into the vacuum container 11 which is a decompressed atmosphere, that is, in the direction of the arrow 32.

(4) The stage 13 is operated to adjust the position of the via hole in the substrate 14 and the position of the nozzle 25 in the nozzle array 24. A via hole 50 is positioned directly below each nozzle 25.
(5) The metal fine particles 1 are supplied to the aerosol generation chamber 20 via the powder supply amount adjuster 18. The agitating blade 23 is driven to generate an aerosol in the aerosol generation chamber 20. (6) The aerosol is ejected from the nozzle 25, and the via hole 50 is filled with the metal fine particles 1 to carry out interlayer connection processing.
(7) When the interlayer connection process is completed, the supply of the metal fine particles 1 to the aerosol generation chamber 20 is stopped, and the operation of the interlayer connection processing apparatus 100 is terminated.

Of the via holes 50 provided in the substrate 14, if there are any via holes 50 that need to be filled with the metal fine particles 1 in order to form an electric circuit, return to the procedure (4). Then, the stage 13 is driven to move the substrate 14. Then, metal pillars are formed in the via holes 50 where no interlayer connection is made. When the interlayer connection processing of all electric circuits on the substrate 14 is completed,
(8) The gas supply from the gas cylinder 16 is stopped. Next, exhaust by the vacuum pump 15 is stopped.
(9) The inside of the vacuum vessel 11 is released to the atmosphere, and the substrate 14 is taken out from the vacuum door 30. Thereby, all the processes are completed.

  FIG. 3 is a perspective view of the substrate 14 to be processed. On the resin 3 that is an insulating layer, a copper foil 4 that forms an electric circuit 28 is attached. Via holes 50 for interlayer connection are formed in the end portion and the intermediate portion of the copper foil 4 so as to reach the lower layer copper foil. In FIG. 3, 16 electric circuits 28 are arranged per substrate. FIG. 4 is a perspective view of the nozzle array 24 used for the interlayer connection processing of the substrate 14 shown in FIG. In the nozzle array 24 shown in FIG. 4, the nozzles 25 are formed at positions corresponding to the via holes 50 formed in one electric circuit. Therefore, in order to process the entire substrate, the step of ejecting the metal fine particles 1 into the via holes 50 and connecting the layers is performed 16 times.

  An increase in the number of interlayer connection processes leads to a long processing time, and therefore, as shown in FIG. 5, a nozzle array 24b in which nozzles 25 for two electrical circuits are formed can be used. It is also possible to process more circuits at once. However, as the number of nozzles 25 increases, the capacity of the evacuation system 84 also increases. When nozzles having a diameter of 0.1 mm are used, a gas amount of about 0.05 L / min flows through each nozzle 25. Therefore, in the interlayer connection device using the vacuum pump 15 having a pumping speed of 60000 L / min, the limit of the number of nozzles 25 is about 12,000 in order to keep the pressure in the vacuum vessel 15 at 1 kPa or less.

  Details of the interlayer connection will be described with reference to cross-sectional views of the substrate 14 shown in FIGS. FIG. 7A is a cross section of the substrate 14 before the interlayer connection process. In the substrate 14, a copper layer 4 a is formed on the upper side of the resin layer 3 that is an insulating layer, and a copper layer 4 b is formed on the lower side by adhesion, plating, or the like. These copper layers 4a and 4b form an electric circuit. A via hole 50 is opened in the resin layer 3 in order to electrically connect electric circuits formed in the upper and lower copper layers 4a and 4b.

  Since copper is a metal that is easily oxidized, the surfaces of the copper layers 4a and 4b are covered with a copper oxide film 5 that is an insulator. The via hole 50 is formed so as to remove the upper copper layer 4a and the copper oxide film 5 and the resin layer 3 formed on the surface thereof. However, in order to prevent the lower copper layer 4b from being damaged, the removal of the resin layer 3 is often incomplete, and the resin layer 3 is drilled at the bottom of the via hole 50 with a laser or the like. In some cases, a smear 6 that is a remaining shaving when formed is formed. If the oxide film 5 and smear 6 remain, even if the metal conductor is generated in the via hole 50 and the upper copper layer 4a and the lower copper layer 4b are connected, they are not electrically connected. Occurs.

  Therefore, as shown in FIG. 7B, metal fine particles 1 having a diameter of 0.3 μm or more collide with 50 parts of via holes formed in the substrate 14 at about Mach 1 or more. When the metal fine particles 1 collide with the smear 6 remaining in the via hole 50, the smear 6 is scraped off by the energy of the collision, and the temperature rises and the smear 6 as the resin layer 3 is vaporized. Thereby, the smear 6 is removed. If the aerosol temperature is increased by using the gas heater 26 to increase the speed of the metal fine particles 1, the removal performance is further improved. In addition, when using copper for the fine particle powder 1, it is preferable that a collision speed shall be 600 m / s or more.

  As the size of the metal fine particles 1 is larger, the removal performance of the smear 6 is improved. However, if the diameter of the metal particles 1 is 10 μm or more, the substrate 14 itself may be destroyed. Therefore, fine particles having a diameter of 0.3 to 10 μm are used for the metal fine particles 1. In order to improve the removal performance of the smear 6, a small amount of abrasive such as ceramic fine particles may be mixed in the metal fine particles 1. However, if the mixing ratio of ceramic fine particles or the like is large, the ceramic stays in the via hole 50, so that the generation of the metal conductor is delayed. In the case of mixing ceramic, it is desirable that the content be several percent or less.

  In order to remove the copper oxide film 5 on the side surface 51 of the upper copper foil 4a, the diameter of the small diameter portion 25b of the nozzle 25 is slightly larger than the diameter of the via hole 50 so that the metal fine particles 1 collide with the upper copper foil side surface 51. To do. The metal fine particles 1 ejected from the nozzle 25 hardly fly in the reduced pressure atmosphere and fly to the via hole 50 with the discharge diameter of the nozzle 25 and collide with the copper foil side surface 51.

  As the interlayer connection process proceeds, the metal fine particles 1 are deposited in the via hole 50. The state in which this deposition has progressed is shown in FIG. The metal fine particles 1 deposited in the via hole 50 form an integrated metal conductor 50a. The formation mechanism of the metal conductor 50a is as follows. First, when the metal fine particles 1 collide with the lower copper layer or the oxide film on the surface thereof at a high speed, the surface of the metal fine particles 1 is melted by the energy of the collision and fused to the lower copper foil 4b. Next, the next metal fine particles 1 collide with the fused metal fine particles 1, and the metal fine particles 1 are fused to each other by the energy of the collision. Repeat this process.

  Therefore, when copper, a copper alloy, tin, zinc, or the like that easily forms an alloy with copper is used as the material of the metal fine particles 1, the bonding with the copper layer is facilitated and the electrical connection is stabilized. Further, when the temperature of the aerosol is increased, the temperature of the metal fine particles 1 itself contained in the aerosol is increased and the speed of the metal fine particles 1 is also increased. Thereby, fusion is promoted. If the temperature of the substrate 14 is raised, the temperature of the copper foil 4b rises, and the copper foil 4b and the metal fine particles 1 are likely to be fused, and the via hole 50 can be reliably electrically connected.

  When the metal conductor 50a generated by applying vibration or the like to the substrate 14 is removed from the via hole 50, the reliability of interlayer connection is lowered. In order to avoid this problem, the diameter of the upper part of the via hole 50 is made smaller than the diameters of the center and the lower part. Thereby, the metal conductor 50a can be prevented from coming off from the via hole.

  FIG. 8 shows a processed state of the substrate 14 in which the upper diameter of the via hole 50 is made smaller than the lower diameter. In this modification, the metal conductor 50a formed in the via hole 50 is difficult to remove, and the reliability of the substrate 14 is improved. The procedure for creating the via hole 50 shown in FIG. 8 will be described with reference to FIG. FIG. 9A is a cross-sectional view of the substrate 14 before the via hole 50 is opened in the resin layer 3. In the state of FIG. 9A, the same substrate as the normal substrate 14 is used. FIG. 8B shows how the via hole 50 is formed in the substrate 14 using the laser beam 2. The lens 7 is disposed on the upper portion of the via hole 50. The lens 7 is adjusted so that the condensing point 8 of the laser beam 2 is positioned above the via hole 50. If the laser beam 2 is continuously irradiated in this state, the via hole 50 having a small upper diameter as shown in FIG.

  According to the present embodiment, since the copper oxide film and smear on the surface of the copper foil, which is the electric circuit layer of the multilayer substrate, can be completely removed, the layers can be reliably connected by the substrate. Further, when the diameter of the metal fine particles, the speed at which the metal fine particles collide, and the abrasive are mixed, the removal performance can be changed by adjusting the concentration. Furthermore, when processing a substrate on which a plurality of electric circuits are formed, the processing time can be shortened by using a nozzle array that can simultaneously process one electric circuit or several via holes.

  FIG. 10 is a front sectional view showing another embodiment of the interlayer connection device according to the present invention. This embodiment is different from the embodiment shown in FIG. 1 in that a plurality of fine particles are introduced into the aerosol generation chamber 20. That is, in addition to the first tank 10 for introducing the first fine particles 1 and the first powder supply amount adjuster 18a, the ceramic fine particles 60 as the abrasive as the second fine particles are introduced. The second tank 10b and the second powder supply amount adjuster 18b are provided. Then, the first and second fine particles 1 and 60 dropped from the first and second powder supply amount regulators 18 and 18b are mixed by the mixing tube 10f and guided to the aerosol generation chamber 20. According to the present embodiment, since the metal fine particles 1 and the ceramic fine particles 60 are independently supplied to the aerosol generation chamber, the following processing is possible.

  11 and 12 are sectional views of the substrate 12 to be processed. In this embodiment, unlike the above embodiment, first, as shown in FIG. 11B, only the ceramic fine particles 60 are supplied from the powder supply amount regulator 18b. Since the ceramic fine particles 60 are guided to the via hole 50 where the smear 6 remains, the ceramic fine particles 60 collide with the copper oxide film 5 and the smear 6 to remove the copper oxide film 5 and the smear 6 serving as insulating materials. When the surface of the lower copper foil 4b is seen, the interlayer can be reliably connected by guiding the metal fine particles 1 to the via hole 50 as shown in FIG. According to the present embodiment, since there is an independent polishing step using an abrasive, the copper oxide film 5 and the smear 6 can be reliably removed, and the reliability of the substrate 14 is improved.

  FIG. 12 shows a modification of this embodiment. In this modification, instead of forming the via hole 50 in the resin layer 3 with a laser beam or the like, the ceramic abrasive 60 is also used for forming the via hole 50. Therefore, as shown in FIG. 12A, the via hole is not formed in the substrate 14 before processing. As shown in FIG. 12B, the ceramic fine particles 60 collide with the resin layer 3 to scrape off the resin. When the copper oxide film 5 on the surface of the lower copper foil 4b is also removed and a complete via hole 50 is formed (see FIG. 12C), as shown in FIG. The metal fine particles 1 are guided to the formed via hole 50. According to this modification, it is not necessary to form the via hole 50 in the substrate 14 in advance, and the throughput is improved.

  Still another embodiment of the interlayer connection device according to the present invention is shown in a front sectional view in FIG. This embodiment is different from the embodiment shown in FIG. 1 in that the heating position of the aerosol is changed. In the embodiment shown in FIG. 1, the gas before flowing into the aerosol generation chamber 20 was heated, but in this embodiment, the aerosol generation chamber is composed of two aerosol generation chambers 20 and 20d connected in series, The two aerosol generation chambers 20 and 20d are connected by a pipe 10f.

  In the upper aerosol generation chamber 20d, an opening 20e is formed at the bottom, and a motor 21a and a rotation introducer 22a for the tank 10 and the stirring blade 23a are disposed above. The lower aerosol generation apparatus 20 has the same configuration as that of the embodiment shown in FIG. 1, and a pipe 10f is connected to the opening 20b instead of the powder supply amount adjuster 18. A gas heater 26 is wound around the pipe 10f, and the aerosol generated in the upper aerosol generation chamber 20d is heated and sent to the lower aerosol generation chamber 20.

  In order to provide the gas heater 26 as close to the nozzle 25 as possible, the gas heater 26 was disposed between the aerosol generation chambers 20 and 20d. Thereby, since the metal fine particles are sufficiently stirred in the aerosol introduced into the aerosol generation chamber 20, the concentration of the metal fine particles ejected from the plurality of nozzles 25 can be made uniform, and the metal generated in each via hole 50. The volume of the conductor 50a can be made uniform.

It is front sectional drawing of one Example of the interlayer connection apparatus which concerns on this invention. It is sectional drawing of one Example of the nozzle array which concerns on this invention. It is a perspective view of a board | substrate. It is a nozzle array sectional view concerning the present invention. It is a nozzle array sectional view concerning the present invention. It is an operation | movement flowchart of the interlayer connection apparatus shown in FIG. It is sectional drawing of a board | substrate. It is sectional drawing of a board | substrate. It is sectional drawing of a board | substrate. It is front sectional drawing of the other Example of the interlayer connection apparatus which concerns on this invention. It is sectional drawing of a board | substrate. It is sectional drawing of a board | substrate. It is front sectional drawing of the further another Example of the interlayer connection apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Metal fine particle, 2 ... Laser beam, 3 ... Resin 4, 4a, 4b ... Copper foil, 5 ... Copper oxide film, 6 ... Smear, 7 ... Lens, 8 ... Condensing point, 10 ... Powder tank, 11 DESCRIPTION OF SYMBOLS ... Vacuum container, 12 ... Filter, 13 ... Stage, 14 ... Substrate, 15 ... Vacuum pump, 16 ... Cylinder, 17 ... Mass flow controller, 18 ... Powder supply amount controller, 20, 20d ... Aerosol production chamber, 21 ... Stirring Motor, 22 ... rotary introducer, 23 ... stirring blade, 24 ... nozzle array, 24b ... small diameter part, 25 ... nozzle, 26 ... gas heater, 27 ... substrate heater, 28 ... electric circuit, 30 ... vacuum door, 31 ... Arrows, 32 ... arrows, 33 ... arrows, 50 ... via holes, 51 ... upper copper foil side surfaces, 60 ... ceramic fine particles.

Claims (6)

  In an interlayer connection device for a multilayer substrate in which a large number of via holes are formed, a vacuum container in which the multilayer substrate is disposed, an aerosol generation chamber connected to the vacuum container, a gas connected to the aerosol generation chamber and gas to the aerosol generation chamber A gas introduction part for controlling supply, and a metal fine particle introduction part for introducing and controlling conductive metal fine particles filling the via hole into the aerosol generation chamber, and a via hole is connected to the connection part between the aerosol generation chamber and the vacuum chamber. An interlayer connection device comprising a nozzle array in which nozzles corresponding to the arrangement are formed. Gas supplied from the gas inlet portion, an interlayer connecting device according to claim 1, wherein the at least one inert gas and nitrogen gas.   3. The interlayer connection device according to claim 2, further comprising an exhaust system capable of exhausting the vacuum container to 1 kPa or less, wherein the gas is introduced after the pressure of the vacuum container reaches a vacuum pressure.   The interlayer connection device according to claim 1, wherein a particle diameter of the metal fine particles is 0.3 to 10 μm. In inter-layer connection process for interlayer connection substrate which multiple via holes are arranged in the reduced pressure atmosphere is formed, a vacuum chamber in which the substrate is placed is evacuated, and an inert gas or nitrogen gas, diameter 0.3 10 μm metal fine particles are introduced into an aerosol generation chamber connected to a vacuum chamber to generate an aerosol, and the generated aerosol is sprayed into a via hole from a nozzle array having a number of nozzles formed corresponding to the via hole. Forming a metal conductor in the via hole and connecting the layers of the substrate. 6. The interlayer according to claim 5, wherein an aerosol of a polishing agent and a gas is generated before generating the metal fine particle aerosol, and the aerosol is sprayed onto a substrate to create a via hole by the polishing agent. Connection method.

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