JP4440609B2 - Surface treatment method for workpieces - Google Patents

Description

The present invention is suitable for, for example, electroplating of an object to be processed, and sequentially supplies a processing fluid used for each process of electroplating to perform a series of processes rationally and quickly, thereby improving productivity and mass production. strive was possible to obtain a plating film of good around thin per a dense and homogeneous, about the surface treatment how the object to be processed.

Electroplating requires various processing equipment and many processing steps, is inferior in workability and productivity, requires an increase in equipment costs and a wide work space, and generates scattered processing liquids and harmful gases. because forced to work under the circumstances, the improvement than for some time has been desired.
In order to meet such demands, the applicant communicated with the circulation path of the fluid to be treated including the reaction tank during the surface treatment of the object to be treated, and circulated the fluid to be treated through the circulation path from start to finish. A surface treatment method and a treatment apparatus for a treated product have been developed and have already been proposed (for example, Patent Document 1).

  The method and the processing apparatus are intended for the reuse of the degreasing cleaning fluid, and the circulation path includes a reaction tank and a separation tank, a condensation recovery tank and a refrigerator, a pressure pump and a heater, etc. Since the fluid is cooled and liquefied, and then pressurized and heated to circulate, it requires a lot of processing, expensive and many facilities, and requires a lot of power and cost for its operation. As a result, the productivity is poor, and a large installation space is required for the installation of the equipment.

  As a solution to such problems, a washing chamber, a heating chamber, and a cooling chamber are interposed in the circulation path, and a heat pump is disposed outside the circulation path between the heating chamber and the cooling chamber, There is a medium circulation system that rationally controls the temperature of a cleaning medium that moves in a circulation path so as to save energy and control deposition of the cleaning medium (for example, Patent Document 2).

  In addition, a liquefaction supply tank, a plurality of pressure-resistant cleaning containers and a waste liquid recovery tank are inserted in the circulation path, and after cleaning, carbon dioxide, which is a cleaning fluid, is stored from each cleaning container in a balloon tank, and this stored fluid is appropriately stored. There is a cleaning method and an apparatus for applying pressure to each cleaning container (for example, Patent Document 3).

However, these methods and devices heat and cool the cleaning medium of the circulation path, and thus require expensive and many facilities, and require a lot of power and cost to operate, resulting in poor productivity. There is a problem that a large installation space is required to install the equipment.
Moreover, the method and apparatus are limited to cleaning the object to be cleaned, and when the object to be cleaned is electroplated, the object to be cleaned after treatment must be transferred to a separate electroplating apparatus. There is irrational.
Also, if the plating solution is circulated through the circulation path of the apparatus, metal ions in the plating solution are deposited upon cooling and adhere to the pipeline, increasing the pipeline resistance and smoothing the circulation. The above method cannot be adopted because the properties are impaired or the circulation becomes impossible.

Japanese Patent Laid-Open No. 2003-147591 JP 2000-153244 A JP 2000-308862 A

The present invention solves such problems, and is suitable for electroplating of workpieces, for example, by sequentially circulating and supplying a processing fluid used for each electroplating process, and performing a series of processes rationally and quickly to produce endeavor to increase the mass production of sex was possible to obtain a plating film of good around thin per a dense and homogeneous, and an object thereof is to provide a surface treatment how the object to be processed.

The invention of claim 1 includes, in a sealable reaction vessel interposed through a single inlet and outlet part to the circulation path of the surface treatment fluid and the object to be treated and yang electrode arranged opposite to said reactor supercritical or A臨field carbon dioxide, and pickling solution or electrolyte solution, introducing a surfactant, a surface of the object to be treated was pickling now other after formation thereof emulsion electroplating In the treatment method, pickling solution or electrolytic solution and surfactant, supercritical or subcritical carbon dioxide are supplied to the circulation path upstream from the reaction vessel, and these are introduced into the reaction vessel and mixed. In addition to forming these emulsions, at the time of pickling or electroplating the object to be treated , an emulsion containing a pickling solution or an electrolytic solution in a supercritical or subcritical state is circulated through the circulation path and the reaction vessel to react. supercritical or subcritical state in the bath Compared with the pickling method or electroplating method performed under emulsion, moving the emulsion at high speed, in contact with the high speed to be treated, with the resulting high precision pickling, the object to be treated at the time of electroplating of eliminating the concentration distribution or density distribution of the metal ions in the plating solution by the potential gradient, which was flat and uniform, so that the resulting uniform and fine licked Kki film.

The invention of claim 1 supplies pickling solution or electrolytic solution, surfactant, supercritical or subcritical carbon dioxide to a circulation path upstream from the reaction vessel, and introduces these into the reaction vessel. The emulsion containing the pickling solution or the electrolytic solution in a supercritical or subcritical state is picked up between the circulation path and the reaction tank at the time of pickling or electroplating the workpiece. since circulating, compared with the pickling method or electroplating method performed under supercritical or subcritical conditions the emulsion in the reaction vessel, moving the emulsion in the high-speed, in contact with the high speed to be treated, with resulting high precision pickling, during electroplating to eliminate the concentration distribution or density distribution of the metal ions in the plating solution due to the potential gradient of the object, which was flat and uniform, uniform and dense The effect obtained by Kki film.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an illustrated embodiment for electroplating an object to be processed as the surface treatment of the object to be processed will be described. FIG. 1 shows a basic configuration of the present invention, in which 1 is a bottomed bottom that is a reaction tank. A cylindrical pressure vessel that can be hermetically sealed through a lid (not shown), accommodates an object 2 to be processed such as a wiring board, and has a predetermined surface treatment such as degreasing, Pickling (oxide film removal), electroplating, etc. are possible.

The pressure vessel 1 accommodates the workpiece 2 and the anode plate 3 as an anode member inside, and connects them to the negative electrode side and the positive electrode side of the power source 5 via the lead wire 4. Energization is enabled through the switch 6.
The switch 6 is turned ON only at the time of electroplating, and the power-on timing is set before the workpiece 2 and the anode plate 3 are immersed in a plating solution described later, and can prevent displacement plating of the workpiece 2 I have to.

The pressure vessel 1 is inserted into first and second circulation paths 7 and 8 which are independent from each other, and the first circulation path 7 can be used for degreasing and washing which is a pretreatment for electroplating. Reference numeral 8 denotes a pickling (oxide film removal) treatment that is a pretreatment of electroplating and a main treatment, that is, electroplating and post-treatment.
The first and second circulation paths 7 and 8 are both configured by connecting the circulation conduits 9 and 10 in an annular shape, and the pressure vessel 1, the cooler 11 and the heater 12 are connected to the first circulation path 7. The pressure vessel 1 and the circulation pump 13 are inserted in the second circulation path 8, and a mixer (mixer) 14 is inserted on the upstream side of the pressure vessel 1.
In the embodiment, a hermetic pump is used as the circulation pump 13 and a static mixer is used as the mixer 14. However, the present invention is not limited thereto.

  Switching valves 15 and 16 are inserted at appropriate positions in the first and second circulation paths 7 and 8, and these switching valves 15 and 16 discharge the circulation paths 7 and 8 from the circulation conduits 9 and 10 at appropriate times. It is possible to switch to the pipes 17 and 18, and when the processing fluid is discharged, the moving fluid of the circulation paths 7 and 8 is moved to the storage tanks 19 and 20 which are pressure vessels so as to be accommodated.

  The storage tanks 19 and 20 are provided with appropriate pressure control valves such as a relief valve, and the storage fluids 21 and 22 stored in the storage tanks 19 and 20 are heated or decompressed and separated and recovered for each component. It is desirable to recycle the recovered components to the storage tanks described later for reuse. In the figure, reference numeral 23 denotes a refrigerant conduit piped inside and outside the cooler 11 and communicates with a refrigerator (not shown).

Gas conduits 24 and 25 are connected to the first and second circulation paths 7 and 8, and gas containers 26 and 27 containing high-pressure carbon dioxide as an inert gas are connected to the conduits 24 and 25.
Among these, a pressurizing pump 28 and a heater 29 are inserted in the gas conduit 25, and the carbon dioxide is adjusted to 6 to 8 MPa and approximately 50 ° C. with these, and is supplied to the circulation pump 13 in a timely manner. It is possible.

  The circulation pump 13 is connected to liquid supply pipes 30 and 31 and a water supply pipe 32 through an on-off valve (not shown) so that the liquid supply pipe 30 is connected to a predetermined pickling solution (removed oxide film). The pickling solution 33 is connected to a pickling solution tank 34 containing the solution, and the pickling solution 33 is subjected to a surface activity described later before pickling treatment of the workpiece 2 via an appropriate liquid feed pump (not shown). It can be supplied to the circulation pump 13 together with the agent.

  The liquid feed pipe 31 is connected to a plating solution tank 36 containing a predetermined plating solution (electrolytic solution) 35, and the plating solution 35 is processed through an appropriate liquid feed pump (not shown). Before the plating process 2, it can be supplied to the circulation pump 13 together with a surfactant described later. The water supply pipe 32 is connected to a water supply tank 38 containing cleaning water 37, and supplies the cleaning water 37 to the circulation pump 13 via an appropriate liquid supply pump (not shown), after pickling and plating treatment. The second circulation path 8 can be cleaned in place of the pressurized carbon dioxide.

Additive tanks 41 and 42 containing predetermined surfactants 39 and 40 are installed in the vicinity of the pickling solution tank 34 and the plating solution tank 36, and the surfactants 39 and 40 are appropriately fed with a liquid feed pump. The tanks 34 and 36 can be supplied via (not shown).
In addition, although the above-mentioned embodiment shares the 2nd circulation path 8 as a supply path of the pickling liquid 33 and the plating solution 35, it is also possible to process by arranging the circulation path provided with the same equipment in parallel. It is.

Surface treatment how the present invention thus configured, upon electroplating a surface treatment of the object 2, the second circulation path 8 interposed a pressure vessel 1 for accommodating an object to be processed 2, pickling Since the solution 33 and the plating solution 35 are circulated isothermally, it is only necessary to insert the pressure vessel 1, the circulation pump 13, and the mixer 14 in the circulation path 8, and a heater used for circulation of the cleaning fluid, A cooler is no longer required, the configuration is simple, the device can be made compact and the equipment costs can be reduced, and the operating costs can be reduced, improving productivity.

  Further, according to the present invention, since a series of electroplating processes can be performed basically with a single pressure vessel 1, the structure can be simplified and the equipment cost can be reduced, and no harmful chemicals are used in the plating process. In addition, since a series of processing is performed in a sealed container, it is freed from work under generation of harmful gas and high temperature and high humidity, and improvement of work environment and work safety can be achieved.

Moreover, since the plating solution 35 is circulated at a high speed under high pressure, as will be described later, the concentration distribution of the plating solution accompanying the potential gradient on the surface of the workpiece 2 is eliminated in the pressure vessel 1. Since the metal ions in the plating solution 35 are uniformly diffused in the plating solution 35, the conventional electricity is performed under the concentration distribution of the plating solution accompanying the potential gradient of the surface of the workpiece 2 in the plating solution accommodated in the plating tank. Compared to plating, a uniform and dense plating film can be obtained.
In particular, according to the present invention, since the electroplating is performed in an isothermal state, there is no possibility that metal ions of the plating solution 35 moving through the second circulation path 8 are deposited, and the plating process can be performed smoothly and efficiently.

  Furthermore, the present invention circulates and supplies all the processing fluids used in a series of electroplating processes to the workpiece 2 and uses each processing fluid effectively without waste, and recovers them after use. Productivity is improved because of the reuse.

  In addition, since the present invention performs a series of electroplating processes while the object to be processed 2 is accommodated in the pressure vessel 1, it eliminates the trouble of transferring the object to be processed 2 to the processing tank for each process as in the prior art. In addition, since the processing step is performed separately for the first and second circulation paths 7 and 8, the processing or work can be performed rationally and efficiently.

Using such the present invention how, if electroplating treatment object 2, degreasing an object to be processed 2, after pickling, electroplating.
Among these, the degreasing cleaning is performed in the first circulation path 7, and pickling, electroplating, drying, and the like are performed in the second circulation path 8.

  First, when the object to be processed 2 is degreased and cleaned, the object to be processed 2 and the anode plate 3 are accommodated facing the pressure vessel 1, the lid is attached and the pressure vessel 1 is sealed, and then the object to be processed 2 and the anode plate 3 are sealed. Are connected to the lead wire 4, the switch 6 is turned off, and conduction between the workpiece 2, the anode plate 3 and the power source 5 is cut off.

Under such circumstances, the gas container 26 is opened, the filled carbon dioxide is sent to the first circulation path 7 through the gas conduit 24, and is cooled and depressurized by the cooler 11 inserted in the circulation path 7. Further, it is pressurized by a pressure pump (not shown) and moved to the heating chamber 12.
If it does in this way, the said carbon dioxide will be heated by the heating chamber 12, and will be prepared in about 8-10 MPa and about 50 degreeC, ie, the supercritical state of a carbon dioxide, or a subcritical state, and will flow into the pressure vessel 1. The carbon dioxide diffuses at a high speed in the pressure vessel 1 and comes into contact with the workpiece 2 and the anode plate 3 vigorously and with high density to remove oil and fat, moisture, foreign matter, etc. adhering to the surface of the workpiece 2. Remove.

After the degreasing and cleaning, the carbon dioxide flows out from the pressure vessel 1 and is led to the circulation conduit 9 and flows into the cooler 13. After cooling, the carbon dioxide is heated by the heater 12 and flows again into the pressure vessel 1 to be processed. The object 2 is degreased and washed.
Thereafter, the object to be treated 2 is degreased and washed without interruption, and when the desired washing accuracy is obtained, the degreasing and washing are finished, and the process proceeds to the next pickling. At that time, the switching valve 15 is operated to store the carbon dioxide in the first circulation path 7 in the storage tank 19, and then the switching valve 15 is restored.

Thus, since the degreasing cleaning is performed by circulating supercritical or subcritical carbon dioxide at high speed, the cleaning fluid can be used in the pressure vessel 1 as compared with the cleaning method in which the cleaning fluid is blown into the pressure vessel 1. Without forming Karman vortices in 1, it moves at high speed and smoothly, and contacts and cleans the workpiece 2 at a constant speed from beginning to end, thereby obtaining a high-speed and high-precision cleaning action.
At this time, carbon dioxide in a supercritical state or a subcritical state moves in parallel along the workpiece 2, so that a high-speed and high-precision cleaning action is maintained without reducing the moving speed and the diffusion speed. .

Next, when pickling the workpiece 2, a predetermined amount of a predetermined surfactant 39 is added to the pickling tank 34, and the mixture of the surfactant 39 and the pickling solution 33 is previously set to a predetermined composition. A predetermined amount of the mixed liquid is prepared and supplied to the circulation pump 13 via a liquid feed pump (not shown), and this is pressurized by the pump 13 and sent out to the second circulation path 8.
The mixed liquid moves in the direction of the arrow in the second circulation path 8, is mixed and stirred by the mixer 14, and moves to the pressure vessel 1. In this case, the amount of the liquid mixture to be supplied is very small as will be described later.

On the other hand, before and after the supply of the pickling solution 33, carbon dioxide is sent out from the gas container 27 to the gas conduit 25, which is pressurized and heated via the pressurizing pump 28 and the heater 29, and the circulation pump 13 is supplied. To supply.
The circulation pump 13 further pressurizes the carbon dioxide, adjusts it to a substantially supercritical state or subcritical state, sends it to the second circulation path 8, moves it in the direction of the arrow, and sends it to the mixer 14. The mixture is stirred at -14 and fed into the pressure vessel 1.

Thus, the pickling solution 33 to which the surfactant 39 is added and the substantially supercritical or subcritical carbon dioxide are mixed in the pressure vessel 1, and the emulsion becomes emulsion and contains the pickling solution 33. Form.
The emulsion diffuses at high speed in the pressure vessel 1, encloses the workpiece 2 and the anode plate 3, and the particulate pickling solution 33 coated with the surfactant 39 is uniformly and highly precisely treated 2. Then, the oxide film on the surface of the workpiece 2 is removed by contacting the anode plate 3.
At this time, since the pickling solution 33 diffuses into the carbon dioxide in a substantially supercritical state or subcritical state through the surfactant 39, a method of immersing the workpiece 2 in the pickling solution as in the prior art. Compared to, a very small amount is sufficient.

After the pickling, the emulsion flows out of the pressure vessel 1, is guided to the circulation conduit 10, and moves to the circulation pump 13. Then, it is pressurized by the circulation pump 13, guided to the mixer 14, and the components of the emulsion are mixed and stirred, uniformly prepared and fed into the pressure vessel 1, and the workpiece 2 is acidified in the pressure vessel 1. Wash.
Thereafter, the workpiece 2 is pickled without interruption, and when the desired pickling accuracy is obtained, the pickling is finished and the process proceeds to the next electroplating.
At that time, the switching valve 16 is operated to store the emulsion in the second circulation path 8 in the storage tank 20, and then the switching valve 16 is restored.

After pickling, when the pickling solution adhering to the workpiece 2 and the anode plate 3 is removed and dried, carbon dioxide in the gas container 27 is used, and this is prepared in a supercritical or subcritical state as described above. And if it makes it contact the to-be-processed object 2, the expected effect will be acquired rapidly.
Further, the cleaning water 37 in the water supply tank 38 can be pumped and circulated to the second circulation path 8 to wash out the pickling solution, and then blown in carbon dioxide to dry it.

As described above, the pickling is performed by circulating the high-pressure emulsion containing the pickling solution 33 in a substantially supercritical state or subcritical state at a high speed. Therefore, the pickling method involves simply blowing the emulsion into the pressure vessel 1. Compared to the above, the emulsion moves at high speed and smoothly without forming Karman vortices in the pressure vessel 1, and contacts the workpiece 2 at a constant speed throughout the process to obtain high speed and high precision pickling accuracy. It is done.
At that time, since the emulsion moves in parallel along the workpiece 2, the pickling action at high speed and high precision is maintained without reducing the moving speed and the diffusion speed.

Thus, when electroplating the workpiece 2 whose surface has been activated, the gas container 27 is opened, the filled carbon dioxide is sent to the gas conduit 25, and this is passed through the pressurizing pump 28 and the heater 29. Then pressurize and heat and feed into the circulation pump 13.
The circulation pump 13 further pressurizes the carbon dioxide, adjusts it to approximately 8 to 10 MPa, approximately 50 ° C., that is, adjusts the carbon dioxide to a supercritical state or subcritical state, and sends it to the second circulation path 8. Is moved in the direction of the arrow and fed to the mixer 14, mixed and stirred by the mixer 14 and fed to the pressure vessel 1.

  Then, after supplying the carbon dioxide in the above state, before supplying the plating solution 35 to the pressure vessel 1, more strictly before the workpiece 2 comes into contact with the plating solution 35, the switch 6 is turned on, and the workpiece is processed. A state where electricity can be passed is formed between 2 and the anode plate 3.

Meanwhile, before and after the supply of carbon dioxide, a predetermined amount of a surfactant 40 is added to the plating solution tank 36, and a mixed solution of the surfactant 40 and the plating solution 35 is prepared in a predetermined composition in advance. A predetermined amount of the liquid mixture is supplied to the circulation pump 13 via a liquid feed pump (not shown).
The circulation pump 13 further pressurizes the carbon dioxide, adjusts it to a substantially supercritical state or subcritical state, sends it to the second circulation path 8, moves it in the direction of the arrow, and sends it to the mixer 14. The mixture is stirred at -14 and fed into the pressure vessel 1.
In this case, the amount of the mixed solution is very small as described later.

Thus, the plating solution 35 to which the surfactant 40 is added and carbon dioxide in a substantially supercritical state or subcritical state are mixed in the pressure vessel 1, and they are emulsified to form an emulsion containing the plating solution 35. .
The emulsion diffuses at high speed in the pressure vessel 1, wraps the workpiece 2 and the anode plate 3, and forms an electric field via metal ions in the plating solution 35.

For this reason, a current flows between the workpiece 2 and the anode plate 3 placed in a state where electricity can be passed in advance, and the metal ions in the plating solution 35 diffused into the emulsion enter the workpiece 2 on the cathode side. Precipitates to form a plating film.
In this case, the object to be treated 2 is placed in a state where electricity can be applied before contact with the emulsion. Therefore, the substrate 2 can be quickly electrically connected to the anode plate 20 without causing displacement plating when contacted with the emulsion. A chemical reaction is formed and electroplating is performed.
Thus, since the plating solution 35 diffuses into the substantially supercritical or subcritical emulsion through the surfactant 40, compared to the conventional plating method in which the workpiece 2 is immersed in the plating solution. A very small amount is sufficient.

That is, according to the present invention, the workpiece 2 is brought into contact with the plating solution before the workpiece 2 is energized, and the metal ion in the plating solution is a substrate metal 2 due to the difference in ionization tendency from the substrate metal. This prevents the displacement plating, in which the base metal is eluted instead.
Therefore, it is suitable for the case where the object to be treated 2 is a noble metal such as gold and silver, the elution of the noble metal by displacement plating can be prevented, and the original plating film is not electrodeposited on the displacement plating film. Improved adhesion.

In addition, the metal ions diffuse into the highly diffusible emulsion in a substantially supercritical or subcritical state, and are uniformly and densely diffused in the pressure vessel 1 to be deposited on the workpiece 2. In addition to being able to respond to the plating of the workpiece 2 having a complicated shape, a uniform, dense and thin plating film can be obtained.
In the present invention, since the plating solution 35 is circulated at high speed in the system and the interface of the workpiece 2 that is an electrode is moved at high speed, a potential gradient is formed at the electrode interface by energization of the workpiece 2. Then, the concentration distribution of the plating solution 35 or the density distribution of the metal ions formed by this potential gradient is canceled, and this is flattened and uniformed to form a uniform and dense plating film.

Thus, since the electroplating is performed by circulating an emulsion containing the plating solution 35 in a substantially supercritical state or subcritical state, the emulsion is compared with the electroplating method in which the emulsion is simply blown into the pressure vessel 1. However, without forming Karman vortices in the pressure vessel 1, it can move smoothly at high speed, and a uniform and highly precise plating film can be obtained.
At this time, since the emulsion moves in parallel along the workpiece 2, the high-speed and high-precision metal ion deposition or plating action is maintained without slowing the moving speed and the diffusion speed.

After the plating, the emulsion containing the plating solution flows out from the pressure vessel 1, moves through the circulation conduit 10, is guided to the circulation pump 13, is pressurized by the pump 13, and moves to the mixer 14. At 14, the emulsion is mixed and agitated to be homogenized and flows into the pressure vessel 1.
Thereafter, the workpiece 2 is electroplated without interruption, and when the desired plating state is obtained, the process proceeds to the next drying step. At that time, the switching valve 16 is operated to store the emulsion in the second circulation path 8 in the storage tank 20, and then the switching valve 16 is restored.

After plating, when removing the plating solution 35 adhering to the workpiece 2 and the anode plate 3 and drying, carbon dioxide in the gas container 27 is used, and this is prepared in a supercritical or subcritical state as described above. The desired effect can be quickly obtained by contacting the workpiece 2.
Further, if the cleaning water 37 in the water supply tank 38 is pumped and circulated to the second circulation path 8 and the plating solution 35 is washed away, then carbon dioxide is blown and dried, so that the treatment can be performed inexpensively and easily. Thereafter, the lid is opened, the pressure vessel 1 is opened, and the workpiece 2 after the plating is collected.

2 to 8 show another embodiment of the present invention and another embodiment of the surface treatment apparatus applied to the present invention, and the same reference numerals are used for components corresponding to those of the above-described embodiment. .
Among these, FIG. 2 shows the basic configuration of the second embodiment of the present invention. In this embodiment, the pressure vessel 1 is modularized, that is, configured to be independent and transportable. The first or second circulation path 7 or 8 is inserted in parallel so that each process of electroplating can be executed simultaneously in each pressure vessel 1 to achieve mass production.
That is, between the first and second circulation paths 7 and 8, annular or straight tubular distribution pipes 43 and 44 that can communicate with these circulation paths 7 and 8 are inserted, and between the distribution pipes 43 and 44. A plurality of branch pipes 45 are connected in parallel, and the pressure vessel 1 is inserted in each branch pipe 45.

By modularizing the pressure vessel 1 in this way, the configuration and functions are rational and simplified, and the production and mass production of the production can be facilitated. , 8 in parallel, there is an advantage that the pressure vessel 1 can be easily increased / decreased and the processing system can be stopped without stopping in the event of failure or maintenance.
In this system, the processing fluid moving in the first or second circulation path 7, 8 is guided to the distribution pipe 44 or 43, and is branched from the distribution pipe 44 or 43 to each distribution pipe 45 and supplied to each pressure vessel 1. Then, the treated processing fluid is merged into the distribution pipe 43 or 44, and is returned to the first or second circulation path 7 or 8.

3 and 4 show an application form of the pressure vessel 1 applicable to the second embodiment. In this application form, the plurality of pressure vessels 1 are arranged adjacent to each other, and the installation space is compact. In addition to reducing the size and weight of the apparatus, a plurality of workpieces 2 and anode plates 3 having different shapes are arranged alternately opposite to each other inside each pressure vessel 1, and these are connected to power via a lead wire 4. 5 to streamline and mass-produce the plating of the workpiece 2.
In this way, a plurality of objects to be processed 2 are arranged closely, and a processing fluid such as a plating solution is moved in parallel between the object to be processed 2 and the anode plate 3, thereby reducing the moving speed of the processing fluid. Therefore, the processing fluid is brought into contact with the workpiece 2 smoothly and efficiently so that the surface treatment such as plating can be performed uniformly and at high speed for mass production.

Figure 5 shows another form of application of the said pressure vessel 1, the inside of the circular cylindrical pressure vessel 1 is arranged a substantially arcuate partition wall 46, partitioning the processing chamber 47 of square cross-section on the inside of the partition wall 46 In this processing chamber 47, a plurality of workpieces 2 and anode plates 3 having the same shape are alternately and closely arranged so that surface treatment such as plating of the workpiece 2 having a fixed shape can be mass-produced. .

6 and 7 shows another form of application of the said pressure vessel 1, the pressure vessel 1 is formed in the square pillar or box-shaped instead of cylindrical and place them tightly, its manufacture and In addition to facilitating installation, making the installation space compact, reducing the size and weight of the apparatus, and without requiring the aforementioned partition 46 in each pressure vessel 1, a plurality of workpieces 2 and anodes of the same shape The plates 3 are alternately arranged opposite to each other so as to achieve mass production of surface treatment such as plating of the workpiece 2.

Figure 8 shows yet another form of application of the pressure vessel 1, interposed in series the pressure vessel 1 of the double number of the first or second circulation path 7 and 8, each pressure vessel with a relatively small amount of treatment fluid Therefore, each process of electroplating in 1 can be executed, and the size and weight can be reduced.

Surface treatment how the object to be treated according to the present invention in this way is sequentially circulated supplying the processing fluid used in the process of electroplating, reasonably and quickly perform the series of processing, production and increased productivity In addition, it is possible to obtain a dense, homogeneous and thin-film plating film that is suitable for electroplating of objects to be processed.

1 is a basic configuration diagram showing a first embodiment in which the present invention is applied to electroplating. FIG. It is a basic block diagram which shows the 2nd Embodiment of this invention. A perspective view showing the application of the applicable pressure vessel to the second embodiment, showing the housing conditions, such as the open lid state and the object to be treated. In the plan view of FIG. 3, a slightly enlarged view is shown.

In an enlarged plan view showing the other embodiment of the application of the said pressure vessel shows an accommodation states such as the open lid state and the object to be treated. It is a perspective view which shows another form of the application form of the said pressure vessel, and has shown the accommodation condition of the pressure vessel and to-be-processed object of a cover state. In the plan view of FIG. 6, a slightly enlarged view is shown. It is a basic block diagram which shows another form of the application form of the said pressure vessel .

Explanation of symbols

1 reaction tank (pressure vessel)
2 Object to be processed (cathode member)
3 Anode member (anode plate)
7 First circuit 8 Second circuit 14 Mixer
33 Pickling solution 36 Electrolyte 39 Surfactant 40 Surfactant

Claims (1)

Inside the sealable reaction vessel interposed through a single inlet and outlet part to the circulation path of the surface treatment fluid, to be processed and a positive electrode placed opposite, supercritical or A臨field two in the reactor and carbon oxides, and pickling solution or electrolyte solution, introducing a surfactant, is an object to be processed pickling now other after formation thereof emulsion in the surface treatment method of the object to be electroplated, the reactor A pickling solution or electrolyte, a surfactant, and supercritical or subcritical carbon dioxide are supplied to a more upstream circuit, and these are introduced into a reaction vessel and mixed to form an emulsion thereof. And an emulsion containing a supercritical or subcritical pickling solution or an electrolyte solution circulated between the circulation path and the reaction vessel during pickling or electroplating of the workpiece. Surface treatment method.

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