JP4438058B2 - Heating and cooling device - Google Patents

Description

The present invention relates to a pressurized thermal cooling equipment.

  Conventionally, when a substrate constituting a predetermined apparatus is manufactured, the substrate is sometimes heat-treated. Patent Document 1 (Japanese Patent Application Laid-Open No. 2003-59788) describes a substrate heating apparatus for performing the heat treatment.

  A substrate heating apparatus described in Patent Document 1 includes a heating plate for heating a substrate, a heat reflecting plate disposed so as to face the substrate through the heating plate, and a substrate through the heat reflecting plate. And a stage disposed to face each other. Furthermore, a passage for cooling water to pass through is formed in this stage, and a heat reflecting ring is provided around the heating plate.

  In the substrate heating apparatus described in Patent Document 1, the heat generated from the heating plate is reflected by the heat reflecting plate, and the substrate is also heated by the reflected heat. It becomes possible.

In addition, in Patent Document 2 (Japanese Patent Laid-Open No. 07-216550), in order to improve the cooling efficiency after heating, a metal plate is provided in parallel to the heated substrate, and the surface of the metal plate facing the substrate is It is described that a radiant heat absorption layer is provided.
JP 2003-59788 A JP 07-216550 A

  However, in the substrate heating apparatus described in Patent Document 1, when the substrate is cooled, the heat released from the substrate is reflected by the heat reflecting plate, and the reflected heat is directed toward the substrate again. Becomes slower. Moreover, in the apparatus described in Patent Document 2, the heating efficiency during heating is significantly reduced.

An object of the present invention is to provide a pressurized heat cooling equipment capable of performing heating and cooling of the substrate in the substrate at a high speed.

In order to achieve the above object, the heating / cooling device of the present invention comprises a substrate for an image display device having a glass base material and a glass member provided only on one surface of the glass base material in a reduced-pressure atmosphere. A heating and cooling device for heating and cooling,
A chamber whose interior is maintained in a reduced pressure atmosphere;
A plurality of support pins arranged in the chamber for supporting the substrate, a heat reflecting member facing the substrate supported by the support pins, and between the substrate supported by the support pin and the heat reflecting member And a plurality of heating elements for heating the substrate positioned with a space between each other;
The heat reflecting member is moved so that the area of the surface of the heat reflecting member facing the substrate supported by the support pins is reduced so that the substrate is cooled after the heating of the substrate by the heating element is completed. Movable means,
The support pin supports the substrate in contact with the other surface of the glass substrate where the glass member is not provided;
The heating element and the heat reflecting member are located in the chamber so as to face only the other surface of the substrate supported by the support pins .

  According to the present invention, it is possible to heat the substrate and cool the substrate at high speed.

  Embodiments of the present invention will be described below with reference to the drawings.

[Example 1]
FIG. 1 is a cross-sectional view schematically showing a heating / cooling apparatus according to a first embodiment of the present invention. Furthermore, FIG. 1 is a cross-sectional view schematically showing a heating / cooling device when performing the heat treatment.

  In FIG. 1, the heating and cooling device includes a heating element 4, a heat reflecting member 5, a chamber 6, a cooling plate 7, and a heat reflecting member 8.

  In the chamber 6, a plurality of support pins (not shown) for supporting a substrate 3 (work) on which the member 2 is provided only on one surface 1 a of the base material 1 are installed.

  The substrate 3 to be heat-treated is placed on the support pins so that the other surface 1 b of the base material 1 is in contact with the support pins in the chamber 6.

  The heating element 4 is installed at a position facing the other surface 1b of the substrate 3 when the substrate 3 is placed on the support pins so that the other surface 1b of the base material 1 is in contact with the support pins in the chamber 6. Has been.

  When the substrate 3 is placed on the support pins such that the other surface 1b of the base material 1 is in contact with the support pins in the chamber 6, the cooling plate 7 is placed on the other surface 1b of the substrate 3 via the heating element 4. It is arranged at a position opposite to. Further, the cooling plate 7 is provided with a cooling function (not shown) such as a water pipe or an air cooling pipe, so that the cooling plate 7 can be cooled to a predetermined temperature.

  The heat reflecting member 5 has a higher heat reflectance (lower heat emissivity) than the cooling plate 7 and is movable. Here, the emissivity will be briefly described. Part of the thermal energy radiated to the surface of the object is reflected and partly absorbed. If the ratio of reflection and the ratio of absorption are the reflectance r and the absorption ratio α, respectively, the transmittance is generally 0 (in the case of a non-transparent material such as a metal), so r + α = 1. In the case of a black body, α = 1. If the emissivity of the object surface is ε, ε and α are equal at the same temperature. Hereinafter, in the present specification, there may be a case where the emissivity is described as a magnitude relationship, but the above relationship (the sum of the thermal emissivity and the thermal reflectance is 1) should be considered.

  When the heating element 4 applies heat to the substrate 3, the heat reflecting member 5 is disposed between the heating element 4 and the cooling plate 7. Therefore, when the heating element 4 applies heat to the substrate 3, the heat reflecting member 5 reflects the heat generated from the heating element 4, applies heat to the substrate 3 by the reflected heat, and the heating element 4. This prevents the heat generated from the heat from reaching the cooling plate 7 directly. In addition, let the magnitude | size of the area of the surface (heat reflective surface) of the heat reflection member 5 which opposes the board | substrate 3 in this state be 1st magnitude | size.

  When the substrate 3 is cooled, the heat reflecting member 5 is moved in the direction of arrow A, and the heat reflecting member 5 does not exist between the heating element 4 and the cooling plate 7. Therefore, when cooling the substrate 3, the cooling plate 7 faces the other surface 1 b of the substrate 3 with the heating element 4 interposed therebetween. In this state, the area of the surface of the heat reflecting member 5 (heat reflecting surface) facing the substrate 3 (specifically, there is no surface of the heat reflecting member 5 facing the substrate 3 in this state). , The size of the area of the surface is 0).

  The heat reflecting member 8 is fixed in the chamber 6. The heat reflecting member 8 is disposed so as to surround the substrate 3 and the heating element 4.

  The chamber 6 is provided with a vacuum pump (not shown) for depressurizing the inside of the chamber. By the operation of this vacuum pump, the gas in the chamber 6 is exhausted to the outside of the chamber 6 to form a depressurized atmosphere in the chamber 6. Is done.

  FIG. 2 is a cross-sectional view schematically showing a heating / cooling device when performing the cooling process. In FIG. 2, the same components as those shown in FIG.

  In FIG. 2, the heat reflecting member 5 is not disposed between the heating element 4 and the cooling plate 7, and the cooling plate 7 faces the other surface 1 b of the substrate 3.

  Next, the operation of the first embodiment will be described with reference to FIG. 1 and FIG.

  The substrate 3 to be heat-treated is placed on the support pins in the chamber 6 so that the other surface 1 b of the base material 1 is in contact with the support pins in the chamber 6. The heat reflecting member 5 is disposed between the heating element 4 and the cooling plate 7 as shown in FIG. Therefore, the substrate 3 and the heating element 4 are surrounded by the heat reflecting member 5 and the heat reflecting member 8.

  A gas in the chamber 6 is exhausted by a vacuum pump attached to the chamber 6, and a reduced pressure atmosphere is formed in the chamber 6.

  Subsequently, the heating element 4 generates heat and heats the substrate 3. When the heat generating element 4 is caused to generate heat, the heat generated from the heat generating element 4 toward the heat reflecting member 5 is reflected by the heat reflecting member 5, and the reflected heat heats the substrate 3. That is, the substrate 3 is heated by the heating element 4 and also by the heat reflecting member 5. The substrate 3 is also heated by the heat reflecting member 8.

  When the heat treatment ends, the heat reflecting member 5 moves in the direction of arrow A, and the heat reflecting member 5 does not exist between the heating element 4 and the cooling plate 7 as shown in FIG. Further, the heat generation of the heating element 4 is stopped. Therefore, the substrate 3 is cooled by the cooling plate 7.

  In this embodiment, the heat reflecting member 5 reflects the heat generated by the heating element 4 to heat the substrate 3. Therefore, the heating efficiency is improved as compared with the state where the heat reflecting member 5 does not exist.

  Further, when the substrate 3 is cooled, the heat reflecting member 5 is moved so that the surface area of the heat reflecting member 5 facing the substrate 3 is larger than the surface area of the heat reflecting member 5 during heating. Since the width is reduced, it is possible to reduce the heat generated from the substrate 3 from being supplied to the substrate 3 again by the heat reflecting member 5.

  In particular, in the present embodiment, the cooling step is executed in a state where the heat reflecting member 5 is disposed at a position not facing the substrate 3, so that heat generated from the substrate 3 during the cooling step is caused by the heat reflecting member 5. It is possible to prevent supply to the substrate 3 again.

  Further, when the substrate 3 is cooled, the surface of the heat reflecting member 5 facing the substrate 3 is made smaller than the surface of the heat reflecting member 5 at the time of heating. The substrate 3 can be cooled by the cooling plate 7 having a high emissivity. In other words, the amount of heat generated from the substrate 3 that is reflected by the cooling plate 7 and returns to the substrate 3 is much smaller than the amount of heat that is reflected by the heat reflecting member 5 and returns to the substrate 3. Is possible. Further, as described above, the cooling plate 7 is provided with a cooling function (not shown) such as a water pipe or an air cooling pipe, and can cool the cooling plate 7 to a predetermined temperature. Is rapidly absorbed by the cold plate 7.

  As described above, in the present embodiment, the cooling process is performed in a state where the heat reflecting member 5 does not exist between the substrate 3 and the cooling plate 7, so that the cooling of the substrate 3 by the cooling plate 7 is performed efficiently. Is possible.

  Therefore, according to the present embodiment, each of heating and cooling of the substrate 3 can be performed at high speed.

  Hereinafter, a specific example of the present embodiment will be shown. In addition, a present Example is not restricted to the example shown below.

  Glass of 600 mm length, 900 mm width, 2.8 mm thickness is used as the base material 1, and 800 mm length, 5 mm width, 0.5 mm thickness glass is used as a member (spacer described later) installed on the base material 1. It was. As the heat reflecting members 5 and 8, a member obtained by paper finishing the copper surface was used, and a region surrounded by the heat reflecting members 5 and 8 was set to have a width of 1000 mm and a depth of 700 mm.

  As the cooling plate 7, SUS whose surface is blasted is used. The cooling plate 7 is movable in a direction parallel to the substrate 3 and is always cooled by a water pipe (not shown). A sheath heater was used as the heating element 4 that heats the substrate 3.

  Next, an example of a specific operation when the above-described member is used will be described. In addition, a present Example is not restricted to the example shown below.

As shown in FIG. 1, the substrate 3 is positioned and placed on support pins (not shown). After placing the substrate 3, the inside of the chamber 6 was evacuated to 2 × 10 ⁻⁶ Pa.

  After the pressure in the chamber 6 was reduced, the heater 4 was heated for 10 minutes and heated to 750 ° C.

  The substrate 3 was heated to 400 ° C. by the heating of the heater 4 and held in this state for 30 minutes to degas the substrate 3.

  Next, the heat reflecting member 5 disposed opposite to the other surface of the substrate 3 is moved in a direction horizontal to the substrate 3 (the direction of arrow A in FIG. 1), and as shown in FIG. The surface and the cooling plate 7 face each other. Thereafter, the heater 4 was turned off to cool the substrate 3.

  When the substrate 3 is heated and cooled by the above method, the heat of the heater 4 is reflected by the heat reflecting member 5 during the heating process, so that the heating efficiency of the substrate 3 is good, and the substrate is more than the case where the heat reflecting member 5 is not provided. The heating rate of 3 was faster.

  In addition, during the cooling process, the surface of the heat reflecting member 5 facing the substrate 3 is narrower than the surface of the heat reflecting member 5 at the time of heating so that the heat absorption rate is higher than that of the heat reflecting member 5. Since the substrate 3 is cooled by the plate 7, the cooling efficiency of the substrate 3 is good, and the substrate 3 has a larger area than the surface of the heat reflecting member 5 opposed to the substrate 3 when heated. The cooling rate of became faster.

  Further, when the substrate 3 is heated and cooled by the above-described method, the substrate 3 transfers heat by the surface having a uniform surface state (in this embodiment, the surface 1b on which the member 2 is not installed). In the substrate 3, the temperature difference between the surface 1 a on the side where the member 2 is installed and the member 2 is difficult to occur, and the substrate 3 was not damaged due to the difference in thermal expansion between the base material 1 and the member 2.

  Therefore, according to this embodiment, the substrate 3 is not damaged, both the temperature raising rate and the cooling rate can be increased, the yield of the substrate 3 is good, and the heat treatment time can be shortened.

  In the present embodiment, the heat reflecting member 5 is disposed at a position facing the substrate 3 via the heating element 4 during the heating process, and the heat reflecting member 5 is disposed at a position not facing the substrate 3 during the cooling process. In the cooling process, the width of the surface of the heat reflecting member 5 facing the substrate 3 is made smaller than the width of the surface of the heat reflecting member 5 in the heating process, but facing the substrate 3 in the cooling process. The method of making the width of the heat reflecting surface of the heat reflecting member 5 narrower than the width of the heat reflecting surface of the heat reflecting member 5 at the time of heating is not limited to the above, and can be changed as appropriate.

[Example 2]
Next, a second embodiment of the present invention will be described. The present embodiment is an example showing another method in which the width of the surface of the heat reflecting member facing the substrate 3 is narrower than the width of the surface during heating in the cooling step.

  3 and 4 are cross-sectional views schematically showing a heating / cooling device according to a second embodiment of the present invention. Furthermore, FIG. 3 is a cross-sectional view schematically showing a heating / cooling device when performing the heat treatment, and FIG. 4 is a cross-sectional view schematically showing the heating / cooling device when performing the cooling treatment. FIG. 3 and 4, the same reference numerals are given to the same components as those shown in FIG.

  3 and 4, the heating and cooling device includes a heating element 4, a chamber 6, a cooling plate 7, a heat reflecting member 8, and a heat reflecting member 9.

  The heat reflecting member 9 has a heat reflecting surface, and can be rotated in the direction of arrow B (see FIG. 4) about the shaft 91 as a rotation axis. Is small.

  When the heat generating member 4 gives heat to the substrate 3, the heat reflecting member 9 is shown in FIG. 3 so that the heat generated from the heat generating member 4 is reflected by the heat reflecting member 9 most to the substrate 3. Thus, the one surface 9a of the heat reflecting member 9 is fixed to a position that is horizontal with the other surface 1b of the substrate 3.

  Further, when the substrate 3 is cooled, the substantial reflecting surface of the heat reflecting member 9 facing the substrate 3 is made smaller than the width of the surface during heating so that the substrate 3 is cooled by the cooling plate 7. As shown in FIG. 4, one surface 9 a of the heat reflecting member 9 is fixed at a position perpendicular to the other surface 1 b of the substrate 3 so as to be cooled.

  Next, the operation of the second embodiment will be described with reference to FIGS.

  The substrate 3 to be heat-treated is placed on the support pins in the chamber 6 so that the other surface of the base material 1 is in contact with the support pins in the chamber 6. Further, the heat reflecting member 9 has the one surface 9a of the heat reflecting member 9 as shown in FIG. 3 so that the heat generated from the heating element 4 is reflected by the heat reflecting member 9 most to the substrate 3. The substrate 3 is fixed at a position parallel to the other surface 1b of the substrate 3.

  A gas in the chamber 6 is exhausted by a vacuum pump attached to the chamber 6, and a reduced pressure atmosphere is formed in the chamber 6.

  Subsequently, the heating element 4 generates heat and heats the substrate 3. When the heating element 4 is caused to generate heat, the heat generated from the heating element 4 toward the heat reflecting member 9 is reflected by the heat reflecting member 9, and the reflected heat heats the substrate 3. That is, the substrate 3 is heated by the heating element 4 and also by the heat reflecting member 9.

  When the heat treatment is completed, the position where one surface 9a of the heat reflecting member 9 is perpendicular to the other surface 1b of the substrate 3 as shown in FIG. 4 so that the heat of the substrate 3 is cooled by the cooling plate 7. Fixed to. Further, the heat generation of the heating element 4 is stopped. Therefore, the substrate 3 is cooled by the cooling plate 7.

  In this embodiment, the heat reflecting member 9 reflects the heat generated by the heating element 4 to heat the substrate 3. Therefore, the heating efficiency is improved as compared with the state where the heat reflecting member 9 does not exist. Furthermore, when the substrate 3 is cooled, the heat reflecting member 9 is rotated around the shaft 91 to thereby use the cooling plate 7 having a smaller heat reflectance than the heat reflecting member 9 and a larger heat emissivity. 3 can be cooled. Therefore, each of heating and cooling can be performed at high speed.

Example 3
Next, a third embodiment of the present invention will be described. The present embodiment is an example showing another method in which the width of the surface of the heat reflecting member facing the substrate 3 is narrower than the width of the surface during heating in the cooling step.

  5 and 6 are cross-sectional views schematically showing a heating / cooling device according to a third embodiment of the present invention. Furthermore, FIG. 5 is a cross-sectional view schematically showing a heating / cooling apparatus when performing a heat treatment, and FIG. 6 is a cross-sectional view schematically showing the heating / cooling apparatus when performing a cooling process. FIG. 5 and 6, the same components as those shown in FIG. 1 are denoted by the same reference numerals.

  5 and 6, the heating and cooling device includes a heating element 4, a chamber 6, a cooling plate 7, a heat reflecting member 8, a heat reflecting member 10a as a first heat reflecting member, and a second heat. And a heat reflecting member 10b as a reflecting member.

  The heat reflecting member 10 a is fixed in the chamber 6 and has a lower heat emissivity than the cooling plate 7.

  The heat reflecting member 10 b can move in a direction horizontal to the other surface 1 b of the substrate 3, and has a lower heat emissivity than the cooling plate 7.

  As shown in FIG. 5, when the heat generating element 4 applies heat to the substrate 3, the heat generated from the heat generating element 4 is reflected by the heat reflecting member 10 a and the heat reflecting member 10 b most to the substrate 3. Further, the heat reflecting member 10b is disposed between the heat reflecting members 10a. In other words, when the heating element 4 applies heat to the substrate 3, the heat reflecting member 10 b is disposed at a position facing the substrate 3 via the heating element 4 without passing through the heat reflecting member 10 a.

  Further, when the substrate 3 is cooled, the surface 10b1 of the heat reflecting member 10b facing the substrate 3 is heat reflecting member 10a as shown in FIG. 6 so that the heat of the substrate 3 is cooled by the cooling plate 7. The heat of the substrate 3 is transmitted to the cooling plate 7 from between the heat reflecting members 10a.

  Next, the operation of the third embodiment will be described with reference to FIGS.

  The substrate 3 to be heat-treated is placed on the support pins in the chamber 6 so that the other surface of the base material 1 is in contact with the support pins in the chamber 6. Further, the heat reflecting member 10b has a heat reflecting member 10b as shown in FIG. 5 so that the heat generated from the heating element 4 is reflected to the substrate 3 most by the heat reflecting member 10a and the heat reflecting member 10b. It arrange | positions between the heat | fever reflection members 10a.

  A gas in the chamber 6 is exhausted by a vacuum pump attached to the chamber 6, and a reduced pressure atmosphere is formed in the chamber 6.

  Subsequently, the heating element 4 generates heat and heats the substrate 3. When the heating element 4 is heated, the heat generated from the heating element 4 toward the heat reflecting member 10a or the heat reflecting member 10b is reflected and reflected by the heat reflecting member 10a or the heat reflecting member 10b. The heat heats the substrate 3. That is, the substrate 3 is heated by the heating element 4 and is also heated by the heat reflecting member 10a and the heat reflecting member 10b.

  When the heat treatment is completed, the heat reflecting member 10b is arranged at a position overlapping the heat reflecting member 10a as shown in FIG. 6 so that the heat of the substrate 3 is cooled by the cooling plate 7, and between the heat reflecting members 10a. Then, the heat of the substrate 3 is transmitted to the cooling plate 7.

  In the present embodiment, the heat reflecting member 10a and the heat reflecting member 10b reflect the heat generated by the heating element 4 to heat the substrate 3, so that the heating efficiency is higher than the state where the heat reflecting member 10a and the heat reflecting member 10b do not exist. improves. Further, when the substrate 3 is cooled, the heat reflection member 10b is disposed at a position overlapping the heat reflection member 10a, so that the cooling plate 7 has a smaller heat reflectivity and a higher heat emissivity than the heat reflection member 10b. Thus, the substrate 3 can be cooled. Therefore, each of heating and cooling can be performed at high speed.

  Needless to say, the present invention is not limited to the above embodiments, and various modifications are possible.

  For example, as the substrate 3, a substrate constituting a container that encloses the image display unit may be used. In other words, in a method for manufacturing an image display device including an image display unit and a container containing the image display unit, the substrate constituting the container containing the image display unit is heated and cooled by the above method. It may be. In this case, the substrate constituting the container containing the image display unit can be heated and cooled at high speed, and the possibility of the substrate being damaged during heating can be reduced. In addition, the container containing the image display unit is positioned between two opposing substrates and the two substrates, and is positioned around a spacer member that defines the substrate interval and around the two substrates. The present invention can also be applied to a configuration including a frame member. That is, the base material on which the spacers are arranged may be heated and cooled as the substrate 3 of the above embodiment.

  Further, for example, the cooling plate 7 may be omitted in each embodiment. In this case, the cooling rate of the substrate 3 is slower than when the cooling plate 7 is provided, but the cooling rate of the substrate 3 is lower than when the cooling process is performed while the heat reflecting member remains in the state of the heating step. Will be faster.

Example 4
FIG. 7 is a perspective view showing a fourth embodiment of the heating and cooling apparatus according to the present invention. In FIG. 7, a part is notched. In the figure, reference numeral 16 denotes a vacuum chamber for performing a heating / cooling process in a vacuum. A work 11 and a heater 12 are arranged in the vacuum chamber 16 at a distance. The workpiece 11 is a processing target, and is, for example, a glass substrate of an image display device.

  In addition, a reflector (heat reflecting member) 14 having a low emissivity is disposed so as to surround the work 11 and the heater 12. That is, a lower surface reflector 14a, a right surface reflector 14b, an upper surface reflector 14c, a left surface reflector 14d, and a front surface reflector 14e are arranged.

  Although omitted in FIG. 7, a back reflector equivalent to the front reflector 14e is also arranged on the back. The front reflector 14e is shown with a part cut away in the drawing for convenience, but has the same shape as the other reflectors. FIG. 8 shows a perspective view of each reflector 14. Each reflector has a strip-like shape as shown in FIG.

  A cooling unit 13 is disposed outside the reflector 14. The cooling unit 13 has a higher emissivity than the reflector. The cooling unit 13 is made of a material having a high heat capacity, and the cooling efficiency can be further improved by circulating cooling water or the like through a cooling pipe provided inside.

  At the time of heating, as shown in FIG. 7, heating is performed by the heater 12 in a state where the interior is covered by each reflector 14, and the heating efficiency of the work 11 is achieved by the effect of the reflector 14 having a high heat reflectance (low thermal emissivity). Has improved. At the time of cooling after heating, as shown in FIG. 9, each reflector 14 rotates about the rotation shaft 15 and stops when it rotates 90 degrees as shown in FIG. Therefore, the heat of the workpiece 11 is radiated not to the reflector 14 but to the surface of the cooling unit 13. Since the cooling unit 13 has a low thermal reflectance and a high thermal emissivity, the cooling unit 13 can easily absorb the heat released by the work 11, and the cooling efficiency of the work 11 can be improved.

  FIG. 10 is a front view of the apparatus of FIG. 7 during heating. At the time of heating, as shown in FIG. 10, the workpiece 11 and the heater 12 are surrounded by the respective reflectors 14 so that there is almost no gap. FIG. 11 shows a state during cooling. At the time of cooling, as shown in FIG. 11, the lower reflector 14 a, the right reflector 14 b, the upper reflector 14 c, the left reflector 14 d, the front reflector 14 e, and the rear reflector (not shown) rotate 90 degrees around the rotation shaft 15. Therefore, although the heating efficiency of the workpiece 11 during heating is increased, each reflector 14 rotates 90 degrees during cooling, so that the heat of the workpiece 11 and the heater 12 is radiated to the cooling unit 13. A curve B shown in FIG. 17 shows a cooling curve when the present invention is used. A curve A shows a case where the reflectors 14a to 14e and the back reflector (not shown) are not rotated. It can be seen that the curve B to which the present invention is applied has significantly improved cooling characteristics compared to the curve A to which the present invention is not applied.

  FIG. 12 is a perspective view illustrating an example of a reflector driving device. FIG. 13 is a plan view and FIG. 14 is a front view. Each rotating shaft 15 associated with each reflector 14 is provided with a gear 17 at the tip. Further, a gear 17 similar to the gear 17 attached to each reflector 14 is attached to the tip of the rotating shaft of the motor 19, and this gear 17 is aligned with the gear 17 of the other reflector. Further, belts 18 are wound around these gears 17, and when the motor 19 is driven, each gear 17 is rotated by the movement of the belt 18, and each reflector 14 is rotated. In this way, the rotation of each reflector is controlled during heating and cooling.

  The reflector driving device shown in FIGS. 12 to 14 drives each row of the lower reflector 14a, the right reflector 14b, the upper reflector 14c, the left reflector 14d, the front reflector 14e, and the rear reflector.

Example 5
FIG. 15 is a perspective view showing a fifth embodiment of the present invention. In FIG. 15, the same parts as those in FIG. In the cooling vacuum chamber 20, the work 11 and the heater 12 are arranged with a distance therebetween. The work 11 and the heater 12 are surrounded by reflectors 14 having high heat reflectance and low heat emissivity, as in FIG. 7, and each reflector 14 rotates around the rotation shaft 15. The inner surface of the cooling vacuum chamber 20 has a high emissivity.

  Further, the cooling vacuum chamber 20 has a cooling pipe 21 therein, and circulates cooling water or the like through the cooling pipe 21 to perform the same function as the cooling unit 13 in FIG. Also in the present embodiment, heating and cooling assistance of the workpiece 11 is performed by rotating each reflector 14 by 90 degrees as in the fourth embodiment described with reference to FIG. In this embodiment, the mechanism of the cooling unit must be added to the vacuum chamber 20 itself as compared with the fourth embodiment of FIG. 7, but it is not necessary to install the cooling unit inside the vacuum chamber 20, so Therefore, it can be expected to be effective in reducing costs and shortening tact time.

Example 6
FIG. 16 shows another embodiment of the reflector used in the fourth and fifth embodiments. FIG. 16A is a perspective view, and FIG. 16B is a front view thereof. The reflectors 22 have different emissivities on the front and back sides and rotate around the rotation axis 15. The surface s1 of the reflector 22 has a high heat reflectivity and a low emissivity, and the surface s2 has a low heat reflectivity and a high emissivity. The surface s1 is directed to the workpiece 11 during heating, and the front and back surfaces are centered on the rotary shaft 15 during cooling. The surface s2 is directed by rotating the reflectors 22 having different emissivities by 180 degrees. Since the surface s1 has a low emissivity surface, heating is assisted, and the surface s2 has high emissivity to assist cooling. This reflector 22 is used as all the reflectors 14a to 14e (including the back reflector) of Examples 4 and 5 described with reference to FIGS.

  As a method of realizing the low emissivity and high emissivity of the reflector 22, for example, it is preferable to use the surface s1 as a polished surface and the surface s2 as a ceramic coat because a relatively simple and high effect can be expected. In this embodiment, since it is not necessary to arrange a cooling unit or to form a cooling unit in a vacuum chamber, the facility is relatively inexpensive. However, if the reflectors 22 having different emissivities on the front and back sides satisfy the heat capacity, the function as a cooling aid is lowered, so that the workpiece that has become extremely hot is not cooled but is heated to a relatively low temperature. It is desirable to use it when cooling a workpiece.

  In the following, a case where the present invention is applied to a baking process of a conductive paste material or a dielectric paste material in a manufacturing process of an image processing apparatus or the like will be described.

  18 is a front view showing a state during heating, and FIG. 19 is a front view showing a state during cooling. Although omitted in FIGS. 18 and 19, a back reflector is disposed on the back surface as well as the front reflector 14 e. Further, in FIG. 18, the front reflector 14e is shown in a transparent manner by a two-dot chain line for convenience. Further, although omitted in FIGS. 18 and 19, an air supply pipe for supplying and exhausting air necessary for firing and debinding of a conductive paste material, a dielectric paste material, and the like on the front side and the back side of the work 11. And an exhaust pipe is also arranged.

  A workpiece 11 and a halogen lamp heater 32 are arranged in the cooling chamber 30 with a distance therebetween. A predetermined amount of air is ventilated in the cooling chamber 30 by air supply pipes and exhaust pipes arranged on the front side and the back side of the work 11. The workpiece 11 and the halogen lamp heater 32 are surrounded by the reflectors 14 having a low emissivity as in FIG. 7, and each reflector 14 rotates around the rotation shaft 15.

  The inner surface of the cooling chamber 30 has a high emissivity. The cooling chamber 30 includes a cooling pipe 31 and circulates a cooling medium such as cooling water through the cooling pipe 31 to perform the same function as the cooling unit in FIG. Also in the present embodiment, the radiant heating / cooling of the workpiece 11 is effectively performed by rotating each reflector 14 by 90 degrees as in the above-described embodiment of FIG.

  As a material of the reflector 14 having a high thermal reflectance and a low thermal emissivity, for example, a metal such as gold, silver, copper, or aluminum is preferable, and a polished surface is preferable as a processing state of the surface.

  On the other hand, the inner surface of the cooling chamber 30 having a high emissivity is preferably a ceramic coated surface or a surface in which a metal such as SUS310-S or Inconel is sufficiently oxidized by high-temperature heating.

  Here, since the halogen lamp heater 32 is used as a heat source, the heat capacity is small compared to a sheath heater, a hot plate, etc., the energy (rise) fall is agile, the lamp has a thin cylindrical shape, It is possible to improve the efficiency at the time of cooling compared with the above-mentioned embodiment by being advantageous to the radiation cooling to.

  In the above-described embodiment, it is not necessary to perform heating and cooling in different tanks, that is, a large-scale firing furnace with a long furnace length of a conventional multi-tank, so that the chamber can be easily downsized, and a huge apparatus is installed. The area is not required and the effect of cost reduction can be expected.

  As described above, the present invention is not limited to heating and cooling in a vacuum, and can be used, for example, in a heating and cooling process in an inert atmosphere or an air atmosphere, and a sufficient effect can be obtained. That is, the present invention is characterized in that heating and cooling are performed efficiently without opening the atmosphere during heating and cooling regardless of a vacuum atmosphere, an inert atmosphere, an air atmosphere, or the like.

It is sectional drawing which showed the heating-cooling apparatus of one Example of this invention. It is sectional drawing which showed the other form of the heating-cooling apparatus shown in FIG. It is sectional drawing which showed the heating-cooling apparatus of the other Example of this invention. It is sectional drawing which showed the other form of the heating-cooling apparatus shown in FIG. It is sectional drawing which showed the heating-cooling apparatus of other Example of this invention. It is sectional drawing which showed the other form of the heating-cooling apparatus shown in FIG. It is a perspective view which shows the 4th Example of the heating-cooling apparatus by this invention. It is a perspective view of a reflector. It is a perspective view which shows the state which the reflector rotated 90 degree | times. It is a front view at the time of the heating of the apparatus of FIG. It is a front view at the time of cooling of the apparatus of FIG. It is a perspective view which shows an example of the rotational drive apparatus of a reflector. FIG. 13 is a plan view of FIG. 12. It is a front view of FIG. It is a perspective view which shows the 5th Example of this invention. It is the perspective view and front view which show the other Example of a reflector. It is a graph which compares and shows the heating-cooling characteristic of this invention and a comparative example. It is a front view which shows the time of the heating of the other form of the heating-cooling apparatus by this invention. It is a front view which shows the time of cooling of the other form of the heating-cooling apparatus by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Member 3 Substrate 4 Heating element 5 Heat reflection member 6 Chamber 7 Cooling plate 8 Heat reflection member 9 Heat reflection member 10a, 10b Heat reflection member 11 Work 12 Heater 13 Cooling unit 14 Reflector 14a Lower surface reflector 14b Right surface reflector 14c Upper surface Reflector 14d Left reflector 14e Front reflector 15 Rotating shaft 16 Vacuum chamber 17 Gear 18 Belt 19 Motor 20 Cooling vacuum chamber 21 Cooling tube 22 Reflector with different emissivities on both sides s1 Low emissivity surface s2 High emissivity surface 30 Cooling chamber 31 Cooling chamber Arranged cooling pipe 32 Halogen lamp heater

Claims (4)

A heating and cooling device for heating and cooling a substrate for an image display device having a glass substrate and a glass member provided only on one surface of the glass substrate, in a reduced pressure atmosphere,
A chamber whose interior is maintained in a reduced pressure atmosphere;
A plurality of support pins arranged in the chamber for supporting the substrate, a heat reflecting member facing the substrate supported by the support pins, and between the substrate supported by the support pin and the heat reflecting member And a plurality of heating elements for heating the substrate positioned with a space between each other;
The heat reflecting member is moved so that the area of the surface of the heat reflecting member facing the substrate supported by the support pins is reduced so that the substrate is cooled after the heating of the substrate by the heating element is completed. Movable means,
The support pin supports the substrate in contact with the other surface of the glass substrate where the glass member is not provided;
The heating and cooling device, wherein the heating element and the heat reflecting member are positioned in the chamber so as to face only the other surface of the substrate supported by the support pins . The heating / cooling apparatus according to claim 1, wherein the movable unit moves the heat reflecting member to a position not facing the substrate after the heating of the substrate by the heating element is completed . 2. The heating and cooling device according to claim 1, wherein the movable unit moves the heat reflecting member so that an angle of the heat reflecting member with respect to the substrate is changed after the heating of the substrate by the heating element is finished. . The heat reflecting member includes a plurality of first heat reflecting members arranged at a predetermined interval, and a plurality of movable second heat reflecting members.
The movable means moves the second heat reflecting member so that a surface of the second heat reflecting member facing the substrate overlaps the first heat reflecting member after the heating of the substrate by the heating element is completed. The heating / cooling device according to claim 1, wherein the heating / cooling device is moved .

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