JP4436580B2 - Speaker manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a speaker used in various audio devices.
[0002]
[Prior art]
Prior art will be described with reference to FIGS. FIG. 5 is a half sectional front view of a receiver which is a kind of speaker used in mobile communication equipment, FIG. 6 is an exploded perspective view thereof, and FIG. 7 is a manufacturing process diagram thereof. According to the figure, reference numeral 1 denotes a resin frame having a lead wire joint portion 8 of the voice coil 5 joined to the diaphragm 6, and reference numeral 2 denotes a yoke attached to the bottom opening of the frame 1. 3 is a magnet joined to the inner center of the yoke 2, and 4 is a plate joined to the top of the magnet 3. The yoke 2, the magnet 3 and the plate 4 constitute a magnetic circuit part B. ing. Reference numeral 9 denotes an adhesive for joining the diaphragm 6 and the voice coil 5, and 10 is an adhesive for joining the diaphragm 6 and the frame 1. Reference numeral 7 denotes a protector for protecting the diaphragm 6.
[0003]
Next, a method for manufacturing the speaker will be described. After the diaphragm 6 is molded from a hoop-shaped resin film with a mold (molding process), the outer periphery of the diaphragm 6 is cut with a high-precision die. (Outer diameter cutting step), the voice coil 5 and the diaphragm 6 are joined by the adhesive 9 (first joining step), and the magnetic circuit portion constituted by the yoke 2, the magnet 3 and the plate 4 is made of resin. After forming the joined part by forming the frame 1 by insert molding (second joining step), the joined part of the diaphragm 6 and the voice coil 5 is placed in the magnetic gap a of the magnetic circuit section. In this manner, the frame 1 and the magnetic circuit portion B are joined to the joining component 1a formed by the adhesive 10 (third joining step), and the lead wire of the voice coil 5 is connected to the lead wire joining portion 8 of the frame 1. Solder to After production method to complete the protector 7 junction (Fourth bonding step) to were common.
[0004]
[Problems to be solved by the invention]
However, the above-described speaker has a problem that a minute adhesive application process and a curing process are required, and the occurrence of defects due to adhesive burrs and the adhesive application / curing process become a bottleneck, resulting in high costs.
[0005]
The present invention solves the above-described problems, and an object of the present invention is to provide a speaker manufacturing method capable of reducing the cost of a small speaker such as a receiver.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, as described in 請 Motomeko 1 of the present invention, by joining a resin frame attached to the bottom of the magnetic circuit having a magnetic gap, a voice coil fitted into the magnetic gap to the lower surface In the method of manufacturing a speaker comprising a resin diaphragm whose outer periphery is joined to the resin frame, the hoop-shaped diaphragm positioned by the upper mold is placed above the frame inserted into the lower mold and the voice coil. First, as a first laser joining process, the diaphragm is thermally welded to the voice coil by laser irradiation to the diaphragm joining part contacting the upper end of the voice coil, and then as a second laser joining process. in process sequence that is thermally welded to the frame diaphragm by the laser irradiation to the diaphragm joint is in contact with the vicinity of the frame periphery, the voice coil and the resin off Is intended to bond them by irradiating laser from the diaphragm-side contact portion between the and over arm resin diaphragm, one of the bonding target by irradiation, absorbs the laser beam to convert the laser energy to heat Alternatively, both are melted and bonded, and the adhesive application and curing steps can be reduced.
[0007]
In the speaker according to claim 1 of the present invention, a hoop-shaped resin diaphragm formed by providing a plurality of diaphragm-shaped portions at intervals is positioned by an upper mold and inserted into a lower mold. It joins continuously to the voice coil and the resin frame , and can contribute to mechanization and automation of speaker production.
[0008]
According to a second aspect of the speaker of the present invention, there is provided a step of cutting the outer diameter of the diaphragm-shaped portion by laser irradiation as a subsequent step of the speaker manufacturing method according to the first aspect. This makes it possible to automate and mechanize the manufacture of a finished speaker based on a resin-made diaphragm. In addition, the shape of the diaphragm is not limited to a circular shape, but it may be an elongated shape such as an ellipse or a track, or it may be cut by laser irradiation. It is possible to provide a highly productive manufacturing method with little mold switching loss.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The speaker manufacturing method of the present invention will be described below with reference to FIGS. In the description, the same parts as those in the prior art will be given the same reference numerals and description thereof will be omitted.
[0010]
1 is a cross-sectional view for explaining a process of joining a diaphragm of a receiver, which is a kind of speaker according to an embodiment of the present invention, to a voice coil and a frame, and a process of cutting the outer diameter of the diaphragm. FIG. 3 is an exploded perspective view of the receiver, FIG. 3 is a manufacturing process diagram showing each process of the manufacturing, and FIG. 4 is a plan view illustrating a state where a diaphragm is formed on a hoop-shaped sheet.
[0011]
1 to 4, the hoop-shaped diaphragm 11 is finally cut to become the diaphragm 6, and the diaphragm-shaped portion 12 and its outer periphery are formed into a hoop-shaped resin sheet by a molding die. The positioning portion 13 is formed by molding (forming process).
[0012]
Next, the lower mold 21 is provided with a voice coil 5 and a resin frame 16 provided with a hole 16a for mounting the magnetic circuit section B in the center. The hoop-shaped diaphragm 11 is placed on the upper mold 20 by the positioning section 13. Position and adsorb.
[0013]
Next, the lower mold 21 and the upper mold 20 are combined, and the hoop-shaped diaphragm 11 is brought into close contact with the voice coil 5 and the frame 16.
[0014]
Next, a laser 17 is irradiated to join the joint between the voice coil 5 and the diaphragm forming part 12 (laser joining 1). Thereafter, a laser 18 is irradiated to join the joint portion of the frame 16 and the diaphragm forming portion 12 (laser joining 2), and the outer periphery of the hoop-like diaphragm is cut by the laser 19, and the diaphragm 6 is connected to the voice coil 5. And the frame 16 are assembled into a single product, and then the protector 7 is joined so as to cover the upper part of the diaphragm 6 as a single product (joining 3 process), and the magnetic circuit portion B is inserted into the central hole 16a of the frame 16 The speaker is completed by adhesive bonding (4 bonding steps).
[0015]
As described above, the laser 9 is applied to the joint between the voice coil 5 and the diaphragm forming portion 12 to join them, so that the adhesive 9 that has been conventionally required is unnecessary. In addition, since the laser 18 is irradiated to the joining portion of the frame 16 and the diaphragm forming portion 12 to join them, the adhesive 10 that has been conventionally required is unnecessary. Thereafter, the outer diameter cutting part of the diaphragm was irradiated with a laser 19 and cut, thereby eliminating the need for a diaphragm outer diameter cutting die that was conventionally required.
[0016]
In addition, it is very easy to perform even if the shape of the voice coil 5, the shape of the frame 16, and the cutting shape of the diaphragm 11 are other than a circular shape (such as a square shape, an elliptical shape, or a circular track shape). Can do.
[0017]
In addition, the laser has been described as being used as three types of lasers 17 and 18 for bonding (bonding 1 and bonding 2) and a laser 19 for cutting, but the type of laser to be used by selecting an object to be bonded and cut is used. It can also be reduced. It is also possible to reduce the type of laser used by changing the laser output.
[0018]
In FIG. 1, reference numeral 23 denotes a mirror of the laser irradiation apparatus, which changes the direction of this one mirror 23 and irradiates the laser over the entire circumference of the object to join and cut the object. However, a mirror may be provided for each type of laser.
[0019]
Further, in the above-described manufacturing method, the diaphragm 6 is handled as the hoop-shaped diaphragm 11 provided with the diaphragm forming portion 12 until the diaphragm 6 is formed in a shape incorporated in the speaker, so that the speaker assembly can be automated and mechanized. It can contribute.
[0020]
【The invention's effect】
As described above, in the speaker of the present invention, the diaphragm and the voice coil are bonded to each other by irradiating the diaphragm and the frame without using an adhesive, thereby applying and curing the adhesive. This contributes to the cost reduction and the stabilization of the joint quality.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a process of joining a diaphragm of a receiver, which is a kind of speaker according to an embodiment of the present invention, to a voice coil and a frame and cutting of the outer diameter of the diaphragm. FIG. 3 is a manufacturing process diagram showing the steps of the manufacturing process. FIG. 4 is a plan view for explaining a state where a diaphragm is formed on a hoop-like sheet in the manufacturing process. FIG. 5 is a conventional mobile communication device. Half-section front view of a receiver, which is a kind of speaker used in the camera [Fig. 6] Fig. 7 is an exploded perspective view of the same. [Fig.
5 Voice coil 12 Diaphragm molding part 16 Frame 17, 18, 19 Laser B Magnetic circuit part

Claims (2)

A speaker manufacturing method comprising: a magnetic circuit having a magnetic gap; a frame coupled to the magnetic circuit; a voice coil fitted into the magnetic cap; and a resin diaphragm bonded to the frame and the voice coil. A plurality of diaphragm-shaped portions are formed continuously with a certain interval, and a hoop-shaped diaphragm positioned by an upper mold is inserted between the frame and the voice coil inserted into the lower mold. After contacting the upper side, the diaphragm is first thermally welded to the voice coil by laser irradiation to the diaphragm joining part contacting the upper end of the voice coil as the first laser joining process, and then the second laser joining process. As a process sequence, the diaphragm is thermally fused to the frame by laser irradiation of the diaphragm joint abutted near the outer periphery of the frame. Method of manufacturing a loudspeaker performing One step in succession.   The method for manufacturing a speaker according to claim 1, further comprising a step of cutting the outer diameter of the diaphragm-shaped portion by laser irradiation as a post-process.

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