JP4423829B2 - Bottom spool case reproducing apparatus and reproducing method - Google Patents

Bottom spool case reproducing apparatus and reproducing method Download PDF

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Publication number
JP4423829B2
JP4423829B2 JP2001249327A JP2001249327A JP4423829B2 JP 4423829 B2 JP4423829 B2 JP 4423829B2 JP 2001249327 A JP2001249327 A JP 2001249327A JP 2001249327 A JP2001249327 A JP 2001249327A JP 4423829 B2 JP4423829 B2 JP 4423829B2
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Prior art keywords
spool case
bottom spool
spool
case
protrusion
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JP2003059965A (en
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浩 大塚
博志 大宮司
克哉 大石
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、ボンディングワイヤ用スプールが収納され、底スプールケース、および蓋スプールケースの一対からなる合成樹脂製のスプールケースのうち、底スプールケースの再生装置および再生方法に関する。
【０００２】
【従来の技術】
ＩＣやトランジスタのボンディング用の金、銅、アルミニウムなどの極細線は、ボンディングワイヤ用のスプールに巻かれる。スプールは、ボンディングワイヤを巻き付け、貫通する孔の開いた円筒状の胴部と、該胴部の両端全周から伸び出て、ボンディングワイヤの脱落を防止するフランジ部とからなる。材質は、アルマイトなどの合金からなる。
【０００３】
このスプールは、スプールケースが形成する空間内に収納されて、搬送される。スプールケースは、底スプールケースおよび蓋スプールケースの一対からなる。
【０００４】
底スプールケースおよび蓋スプールケースを、図面に基づいて説明する。図２は、スプールケースを示す一部破断斜視図である。
【０００５】
底スプールケース１０は、基部１１の中央に、底面の外径がスプールの胴部の孔の内径よりもやや小さい円錐台状の嵌合隆１２が形成され、該嵌合隆１２の側面に設けられ、嵌合隆１２の軸方向に長いドーム状の突起１４が、１個、あるいは複数個（図示した例では４個）形成される。突起１４の形状および位置は、スプールの孔の内面に当接するように決められる。さらに、蓋スプールケース２０の縁部２１と着脱容易に嵌め合わされるように、縁部１３が形成される。
【０００６】
蓋スプールケース２０および底スプールケース１０の材質は、擦過屑などの出ない合成樹脂からなる。
【０００７】
スプールの収納は、スプールの胴部の孔に、底スプールケース１０の嵌合隆１２を押込み嵌めを行い、前記突起１４が、スプールの胴の内周面に押されて弾性変形することにより、スプールは底スプールケース１０から脱落しなくなる。
【０００８】
しかし、スプールケースは、合成樹脂製であるため、底スプールケース１０にスプールを、繰り返し嵌め合わせると、前記突起１４が摩耗によりへこんだり変形し、スプールが底スプールケース１０から自由に動き回るように、保持力を失う（嵌合いが悪くなる）。
【０００９】
保持力を失ったスプールケースを使用して、梱包や輸送時に、スプールが振動したり、回転することにより、巻かれていたボンディングワイヤが解きほぐれると、解きほぐれた分のボンディングワイヤが製造に使用できなくなり、歩留まりが悪化したり、ボンディングワイヤの品質が劣化する問題があった。
【００１０】
そこで、スプールを固定できなくなったスプールケースを廃棄処分するが、廃棄に費用がかかったり、産業廃棄物になることから、環境上も好ましくはない。
【００１１】
【発明が解決しようとする課題】
本発明は、このような問題点を解決するために、容易に底スプールケースの突起を復元可能な方法および装置を提供することを目的とする。
【００１２】
【課題を解決するための手段】
本発明の底スプールケース再生装置は、ボンディングワイヤを巻くスプールの貫通孔に嵌合するための円錐台状の嵌合隆、および該嵌合隆の側面のドーム状の突起を形成した底スプールケース、および蓋スプールケースの一対からなる合成樹脂製のスプールケースのうち、底スプールケースを再生する装置であって、底スプールケースを固定する手段と、前記突起の内側形状を有する型治具と、温度設定可能な加熱手段と、該加熱手段に接して加熱される位置から、前記突起の内側を押圧する位置に、前記型治具を移動させ、設定可能な時間だけ保持する手段とを備える。
【００１３】
本発明の底スプールケースの再生方法は、前記再生装置を使用し、底スプールケースを固定し、設定温度に達した前記型治具を、設定時間だけ突起の内側から押圧することにより、該突起を復元する。
【００１４】
【発明の実施の形態】
本発明の底スプールケース再生装置および再生方法は、合成樹脂製底スプールケースの熱可塑性を利用したものである。
【００１５】
本発明の底スプールケース再生装置および再生方法を、図面を参照して説明する。図２は、本発明の一実施例を示す平面図であり、図１は、図２のＩ−Ｉ断面図である。
【００１６】
固定台１には、底スプールケース１０を位置決めして固定する型止め１ａが形成され、底スプールケース１０の嵌合隆１２の位置に孔が開けられる。シリンダー部４により、４方向に向けて円弧状に移動可能に、型治具２を取り付ける。さらに、中央寄りに移動した型治具２が接触する位置に、ヒーター部３を配置する。
【００１７】
ヒーター部３は、温度設定を可能に、電力を供給する機器（図示せず）に接続される。ヒーター部３は、既知の技術による発熱体でよい。ヒーター部３の温度は、底スプールケースの合成樹脂の熱変形温度付近に設定するとよい。
【００１８】
シリンダー部４は、駆動タイミングを調整可能に、電力を供給する機器（図示せず）に接続される。シリンダー部４および駆動タイミング発生手段は、既知の技術による。例えば、市販のシリンダー部に、タイマーを組み合わせた回路であればよい。また、ストローク調整を可能とする機構を備えるとよい。
【００１９】
底スプールケースの再生方法は、以下のように行う。
【００２０】
再生装置を起動することにより、ヒーター部３は設定温度に維持され、接触している型治具２の温度も、熱伝導により同じ温度に達する。保持力を失った底スプールケース１０を、固定台１の型止め１ａに被せて固定し、シリンダー部４を駆動させる。シリンダー部４は、底スプールケース１０の突起１４の内側から型治具２を押圧し、熱により形状を復元させる。
【００２１】
設定された押圧時間の経過後に、シリンダー部４が型治具２を元の位置に戻し、復元された突起１４は冷えて保持力を再び得ることができる。
【００２２】
（実施例１）
新品の塩化ビニール製の５個の底スプールケースが、スプールを保持する力（保持力）を測定した。
【００２３】
保持力の測定は、引張り強度試験機（ＡＩＫＯＨエンジニアリング社製、型式ＡＥ−１０）に、底スプールケースおよびスプールを固定して、測定した。
【００２４】
これらの底スプールケースに、保持力が無くなるまでスプールを抜き差しして、突起を摩耗させた。
【００２５】
その後、保持力を失った底スプールケースを、設定温度を８０℃に、押圧時間を７ｓに、ストローク量を１．５ｍｍに、それぞれ設定した本発明の再生装置により、突起の形状を復元した。再生した底スプールケースの保持力を、前述と同様に測定した。
【００２６】
新品時の保持力、摩耗時の保持力、および再生後の保持力を、表１に示す。
【００２７】
【表１】

Figure 0004423829
【００２８】
表１に示したように、本発明により、底スプールケースの保持力が再生されたことが分かる。
【００２９】
【発明の効果】
本発明により、合成樹脂製の底スプールケースの保持力を再生することができる。従って、従来、廃棄処分となっていた底スプールケースが繰り返し使用可能となり、環境面でも産業廃棄物を低減させることが可能であり、工業的に極めて顕著な効果を得ることができる。
【図面の簡単な説明】
【図１】 本発明の一実施例を示す断面図である（図２のＩ−Ｉ断面図である）。
【図２】 本発明の一実施例を示す平面図である。
【図３】 スプールケースを示す一部破断斜視図である。
【符号の説明】
１ 固定台
１ａ 型止め
２ 型治具
３ ヒーター部
４ シリンダー部
１０ 底スプールケース
１１、２２ 基部
１２ 嵌合隆
１３、２１ 縁部
１４ 突起
２０ 蓋スプールケース[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a playback device and a playback method for a bottom spool case out of a synthetic resin spool case in which a bonding wire spool is housed and which is composed of a pair of a bottom spool case and a lid spool case.
[0002]
[Prior art]
Extra fine wires such as gold, copper, and aluminum for bonding ICs and transistors are wound around a spool for bonding wires. The spool is composed of a cylindrical barrel portion around which a bonding wire is wound and opened, and a flange portion that extends from the entire circumference of both ends of the barrel portion to prevent the bonding wire from falling off. The material is made of an alloy such as anodized.
[0003]
This spool is housed in a space formed by the spool case and conveyed. The spool case is composed of a pair of a bottom spool case and a lid spool case.
[0004]
The bottom spool case and the lid spool case will be described with reference to the drawings. FIG. 2 is a partially broken perspective view showing the spool case.
[0005]
The bottom spool case 10 is formed with a frustoconical fitting ridge 12 in the center of the base 11 whose outer diameter on the bottom is slightly smaller than the inner diameter of the hole in the body of the spool. Thus, one or a plurality of dome-shaped protrusions 14 (four in the illustrated example) that are long in the axial direction of the fitting ridge 12 are formed. The shape and position of the protrusion 14 are determined so as to contact the inner surface of the hole of the spool. Furthermore, the edge part 13 is formed so that the edge part 21 of the lid | cover spool case 20 may be easily fitted and detached.
[0006]
The material of the lid spool case 20 and the bottom spool case 10 is made of a synthetic resin that does not generate scraping scraps.
[0007]
The spool is stored by pressing the fitting ridge 12 of the bottom spool case 10 into the hole of the spool body, and the protrusion 14 is pushed by the inner peripheral surface of the spool body and elastically deforms. The spool will not fall out of the bottom spool case 10.
[0008]
However, since the spool case is made of synthetic resin, when the spool is repeatedly fitted to the bottom spool case 10, the protrusion 14 is dented or deformed due to wear, and the spool moves freely from the bottom spool case 10. Loss holding power (fits worse).
[0009]
When a spool case that has lost its holding power is used and the spool is vibrated or rotated during packing or transportation, if the wound bonding wire is unwound, the unbonded bonding wire is used for manufacturing. There is a problem in that the yield cannot be improved, and the quality of the bonding wire deteriorates.
[0010]
Therefore, the spool case in which the spool can no longer be fixed is disposed of. However, it is not preferable from the viewpoint of cost because disposal is expensive and industrial waste is generated.
[0011]
[Problems to be solved by the invention]
In order to solve such problems, an object of the present invention is to provide a method and an apparatus capable of easily restoring a protrusion of a bottom spool case.
[0012]
[Means for Solving the Problems]
A bottom spool case reproducing apparatus according to the present invention includes a truncated cone-shaped fitting ridge for fitting into a through hole of a spool around which a bonding wire is wound, and a bottom spool case formed with a dome-shaped protrusion on a side surface of the fitting ridge. And a device for regenerating the bottom spool case out of a synthetic resin spool case consisting of a pair of lid spool cases, a means for fixing the bottom spool case, and a mold jig having an inner shape of the protrusion, A heating unit capable of setting a temperature; and a unit configured to move the mold jig from a position heated in contact with the heating unit to a position where the inside of the protrusion is pressed and hold the mold jig for a settable time.
[0013]
The method for regenerating the bottom spool case of the present invention uses the regenerating device, fixes the bottom spool case, and presses the mold jig that has reached a set temperature from the inside of the protrusion for a set time. To restore.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
The bottom spool case reproducing apparatus and the reproducing method of the present invention utilize the thermoplasticity of a synthetic resin bottom spool case.
[0015]
A bottom spool case reproducing apparatus and a reproducing method of the present invention will be described with reference to the drawings. 2 is a plan view showing an embodiment of the present invention, and FIG. 1 is a cross-sectional view taken along the line II of FIG.
[0016]
The fixed base 1 is formed with a mold stopper 1a for positioning and fixing the bottom spool case 10 and a hole is formed at the position of the fitting ridge 12 of the bottom spool case 10. The mold jig 2 is attached by the cylinder portion 4 so as to be movable in an arc shape in four directions. Furthermore, the heater part 3 is arrange | positioned in the position which the type | mold jig | tool 2 moved to the center contact | connects.
[0017]
The heater unit 3 is connected to a device (not shown) that supplies power so that the temperature can be set. The heater unit 3 may be a heating element according to a known technique. The temperature of the heater unit 3 may be set near the heat deformation temperature of the synthetic resin of the bottom spool case.
[0018]
The cylinder part 4 is connected to a device (not shown) for supplying electric power so that the drive timing can be adjusted. The cylinder part 4 and the drive timing generation means are based on known techniques. For example, a circuit in which a timer is combined with a commercially available cylinder unit may be used. Moreover, it is good to provide the mechanism which enables stroke adjustment.
[0019]
The method for regenerating the bottom spool case is performed as follows.
[0020]
By starting the regenerator, the heater unit 3 is maintained at a set temperature, and the temperature of the mold jig 2 in contact with the heater unit 3 reaches the same temperature due to heat conduction. The bottom spool case 10, which has lost its holding power, is fixed on the mold stopper 1 a of the fixing base 1, and the cylinder portion 4 is driven. The cylinder part 4 presses the mold jig 2 from the inside of the protrusion 14 of the bottom spool case 10 and restores its shape by heat.
[0021]
After the set pressing time elapses, the cylinder portion 4 returns the mold jig 2 to the original position, and the restored projection 14 cools down to obtain the holding force again.
[0022]
Example 1
The force (holding force) by which five new spool cases made of vinyl chloride hold the spool was measured.
[0023]
The holding force was measured by fixing a bottom spool case and a spool to a tensile strength tester (manufactured by AIKOH Engineering Co., Ltd., model AE-10).
[0024]
The spools were inserted into and removed from these bottom spool cases until the holding force disappeared, and the protrusions were worn.
[0025]
Thereafter, the shape of the protrusion was restored to the bottom spool case that lost the holding force by the reproducing device of the present invention in which the set temperature was set to 80 ° C., the pressing time was set to 7 seconds, and the stroke amount was set to 1.5 mm. The holding force of the regenerated bottom spool case was measured in the same manner as described above.
[0026]
Table 1 shows the holding force at the time of a new article, the holding force at the time of wear, and the holding force after regeneration.
[0027]
[Table 1]
Figure 0004423829
[0028]
As shown in Table 1, it can be seen that the holding force of the bottom spool case was regenerated according to the present invention.
[0029]
【The invention's effect】
According to the present invention, the holding force of the bottom spool case made of synthetic resin can be regenerated. Therefore, the bottom spool case that has been disposed of in the past can be used repeatedly, and industrial waste can be reduced in terms of the environment, and an extremely remarkable effect can be obtained industrially.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of the present invention (a cross-sectional view taken along the line II in FIG. 2).
FIG. 2 is a plan view showing an embodiment of the present invention.
FIG. 3 is a partially broken perspective view showing a spool case.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Fixing base 1a Mold stop 2 Mold jig 3 Heater part 4 Cylinder part 10 Bottom spool case 11, 22 Base part 12 Engagement ridges 13, 21 Edge part 14 Protrusion 20 Cover spool case

Claims (2)

ボンディングワイヤを巻くスプールの貫通孔に嵌合するための円錐台状の嵌合隆、および該嵌合隆の側面のドーム状の突起を形成した底スプールケース、および蓋スプールケースの一対からなる合成樹脂製のスプールケースのうち、底スプールケースを再生する装置であって、底スプールケースを固定する手段と、前記突起の内側形状を有する型治具と、温度設定可能な加熱手段と、該加熱手段に接して加熱される位置から、前記突起の内側を押圧する位置に、前記型治具を移動させ、設定可能な時間だけ保持する手段とを備えたことを特徴とする底スプールケース再生装置。Composed of a pair of a frustoconical fitting ridge for fitting into a through hole of a spool around which a bonding wire is wound, a bottom spool case formed with a dome-like protrusion on the side of the fitting ridge, and a lid spool case Among the resin-made spool cases, a device that regenerates the bottom spool case, a means for fixing the bottom spool case, a mold jig having an inner shape of the protrusion, a heating means capable of setting the temperature, and the heating And a means for moving the mold jig from a position where it is heated in contact with the means to a position where the inside of the protrusion is pressed and holding the mold jig for a settable time. . 請求項１に記載の再生装置を使用し、底スプールケースを固定し、設定温度に達した前記型治具を、設定時間だけ突起の内側から押圧することにより、該突起を復元することを特徴とする底スプールケースの再生方法。The reproducing apparatus according to claim 1 is used, the bottom spool case is fixed, and the mold jig that has reached a set temperature is pressed from the inside of the projection for a set time to restore the projection. Recycling method of bottom spool case.
JP2001249327A 2001-08-20 2001-08-20 Bottom spool case reproducing apparatus and reproducing method Expired - Fee Related JP4423829B2 (en)

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