JP4422282B2 - Powder contact member of powder packaging device and method for manufacturing the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a powder contact member of a powder packaging device and a method for manufacturing the same. More specifically, the present invention prevents contamination of powder by preventing powder from adhering to or colliding with powder contact members such as dispensing disks, scraping devices, hoppers, chutes, etc. in powder packaging devices. In addition, the present invention relates to a powdered contact member and a method for manufacturing the same that improve cleaning properties.
[0002]
[Prior art]
A powder packaging device that divides and packs powder for each dose has members (hereinafter referred to as powder contact members) such as a distribution disk, a scraping device, a hopper, and a chute. Since these powdered contact members remain attached to the powdered contact members even after the packaging process, it is necessary for the pharmacist to clean each powdered contact member every time the prescription is changed.
[0003]
In order to automatically clean such a powder contact member, various types of cleaners including a cleaner or the like have been proposed. However, once the powder made of calcium lactate adheres to the powder contact member, it cannot be completely sucked by the vacuum cleaner. In addition, there are powders that are easily charged with static electricity and powders with fine particles, which cannot be removed even if they are sucked with a vacuum cleaner. Such powders had to be wiped off with a wet towel. Performing such a cleaning operation during the packaging operation is very troublesome and interrupts the packaging operation, resulting in a decrease in packaging efficiency.
[0004]
On the other hand, the powder contact member of the powder packaging apparatus has been used for many years in which 304 stainless steel is mirror-finished in consideration of the effects of various types of drug adhesion. In recent years, from the viewpoint of cost reduction, resin molded products have been used for some members such as hoppers, but 304 stainless steel is still used for members that require accuracy such as distribution trays. Since resin molded parts are easily charged with static electricity, the powder adhesion characteristics tend to deteriorate compared to 304 stainless steel. By adopting a conductive resin to reduce the contact potential difference with the drug, the drug adhesion characteristics can be improved somewhat. However, it is not realistic to take measures to reduce the contact potential difference between many types of drugs and drug contact members.
[0005]
Further, the adsorption energy of the object decreases as the Hamaker constant decreases, but stainless steel has a large constant, and the contact area of the powder particles increases due to mirror surface processing, thereby increasing the adhesion. Therefore, it is necessary to select a substance having a small Hamaker constant as the powder contact member, and to give an appropriate roughness in micron units to the contact surface to reduce the contact area.
[0006]
Conventionally, as shown in FIG. 11, the distribution disk 101 is annular and has a round groove 102, is made of 304 stainless steel, and is polished to a level close to a mirror surface with an abrasive. Then, the powder that is uniformly deposited on the distribution disk 101 is scraped by contact with the silicon rubber 104 of the scraping device 103 and supplied to the packaging device. However, when the powder made of calcium lactate is divided by such a distribution disc 101, calcium lactate particles are sandwiched between the silicon rubber 104 of the scraping device 103 and the surface of the round groove 102 of the distribution disc 101, and the scraping device. Compressed by 103 silicon rubber 104. As a result, as shown in FIG. 12, the lactic acid component contained in the calcium lactate 105 floats on the surface of the particles in a liquid state, and the liquid lactic acid component 106 adheres to the surface of the round groove 102 of the distribution disk 101 while involving the calcium, As shown in FIG. 11, there was a problem of sticking.
[0007]
[Problems to be solved by the invention]
The present invention relates to a powder packaging apparatus that packs powder powder by taking a single dose, so that the powder powder does not adhere or collide, and even if it adheres, it can be easily removed by striking, vibrating, or sucking. It is an object of the present invention to apply a powder contact member of a device and a manufacturing method thereof.
[0008]
[Means for Solving the Problems]
Before describing the means for solving the problems, the principle of drug adhesion will be described. When the medicine used in the medicine packaging apparatus is powder, it is known that the adhesion of the powder to the wall surface of the object is caused by the adsorption energy of the object, static electricity, and the liquid crosslinking force. For most drugs, the adsorption energy of the object and static electricity are the main causes of adhesion. As described above, some drugs, such as calcium lactate, cause water in the particles to float on the surface when applied with pressure or vibration, and adhere to the object through the water.
[0009]
Adsorption energy, which is the first factor, is an attractive force between objects. The adsorption energy of the object is represented by the Hamaker constant. The larger the Hammer constant, the higher the adsorption energy of the object and the easier it is to adhere. In a complex system composed of different substances, the Hamaker constant coupling rule shown below is established.
[Expression 1]
A ₁₂ = √ (A ₁₁ A ₂₂ )
A ₁₂ : Hammer constant between the substance 1 and the substance 2 A ₁₁ : Hammer constant between the substance 1 and the substance 1 A ₂₂ : Hammer constant between the substance 2 and the substance 2
Further, the adsorption energy of the object is different between the case of a sphere-to-sphere and the case of a sphere-to-plane. In the case of a sphere-to-sphere, since the contact area is smaller than the sphere-to-plane, the adsorption energy is small. In the powder packaging device, the powder and the powder contact member are in a plane-to-sphere configuration, so that the adsorption energy is large and the powder tends to adhere to the powder contact member. Normally, an object is said to be in contact at 0.4 nanomicrons. However, if the object has a surface roughness, the object has a characteristic that the adsorption energy of the object becomes small. For example, in the case of contact between spheres of 10 microns, if both have a roughness of 0.1 microns, the adsorption energy of the object is reduced to 1 / 60,000 compared to the case where there is no roughness. Therefore, in order to reduce the adsorption energy of the object, it is necessary to employ a material having a small Hamaker constant on the surface and to give an appropriate roughness to reduce the contact area.
[0011]
Adsorption due to static electricity, which is the second factor, includes adhesion due to contact charging that acts regardless of whether the particle or contact surface is charged, and adhesion due to static electricity that occurs when the particle or contact surface is charged.
[0012]
Adhesion due to contact charging is caused by an action in which charges are moved and stabilized due to a difference in contact potential between contacting objects. In the same material, there is no difference in contact potential, so that adhesion is less likely to occur due to contact charging. However, even with the same material, a slight difference in contact potential may occur due to differences in production location and processing method. The adhesion stress (Maxwell stress) Pce due to contact charging is expressed by the following equation.
[Expression 2]
Pce = − (1/2) εE ²
ε: dielectric constant of the object E: electric field strength of the object
In the previous equation, when the electric field E is Vc / z, the following equation is obtained.
[Equation 3]
Pce = −εVc ² / 2z ²
Vc: Capacitance z: Distance between objects (usually 0.4 nm or less)
[0014]
In the case of a ball-to-plane contact as in a powder packaging device, if the previous equation is integrated with the area element ds, the adhesion due to contact charging is expressed by the following equation.
[Expression 4]
Fce = ∫Pceds≈Pce · S
S: Contact area (= πa ² )
[0015]
Here, in consideration of the fact that a soft substance such as powder particles becomes large like a rubber ball at the time of contact, the radius of the contact circle is expressed by the following equation according to the Hertz theory.
[Equation 5]
a = (3Fkd / 8) ^1/3
k: Elastic property constant (= (1-ν ₁ ² ) / E ₁ + (1-ν ₂ ² ) / E ₂ )
[0016]
The adhesion due to contact charging increases as the particle size increases. However, in actuality, the separation force that is separated by gravity, centrifugal force, vibration, or the like is proportional to the cube of the particle size, so that relatively smaller particles are more likely to adhere and are difficult to separate.
[0017]
Adhesion due to static electricity occurs when an object is charged. This adhesion force increases as the charge amount increases, but disappears as soon as the charged electrons are lost. The electrostatic adhesion force between the charged particles approaching is expressed by the following equation.
[Formula 6]
Fe = −πσ ₁ σ ₂ d ² / ε ₀
σ _i : surface charge density (= −q _i / πD _pi ² )
q _i : electric charge D _pi : particle diameter d: reduced particle diameter ε ₀ : dielectric constant of vacuum
Adsorption due to static electricity is generated by + charging vs. -charging, and repels when the charging potential has the same polarity. In order to minimize such adsorption due to static electricity, it is necessary to select a conductive material in which the contact potential difference is made as small as possible and the charging potential easily moves.
[0019]
Adsorption by liquid crosslinking force, which is the third factor, is a phenomenon in which a film of water is formed on the outer surface of the powder particles, and this film and film are adsorbed by the surface tension of water. Powders used in powder packing devices usually do not develop up to adsorption by liquid cross-linking force because of the small amount of water. However, adsorption due to liquid cross-linking force occurs due to mechanical factors such as compression, sliding and vibration during drug division and transfer. That is, when pressure acts on the powder or vibrations act for a long time, the water in the powder particles comes out to form a film, and adsorption due to the liquid crosslinking force occurs. In order to suppress the adsorption due to the liquid crosslinking force, it is conceivable that the contact surface of the powder contact member is subjected to water repellent treatment.
[0020]
As described above, when the countermeasures against the powder adhesion are summarized, the following measures can be considered for the adsorption by the adsorption energy of the object.
(1) The powder contact surface is coated with a substance having a small Hamaker constant.
(2) The powder contact surface is selected according to the Hamaker constant coupling rule.
(3) Provide moderate roughness on the powder contact surface.
In addition, the following measures can be considered for adsorption due to static electricity.
(1) Surface-treat the powder contact surface or select a material to lower the contact potential difference.
(2) The surface is hardened or roughened with respect to the particle diameter of the powder to reduce the contact area.
(3) Suppress charging and promote charge movement.
The following measures can be considered for adsorption by liquid crosslinking force.
(1) The water repellent effect is enhanced by the surface treatment of the powder contact surface.
[0021]
The present invention has been made on the basis of the above knowledge, and the first invention is a powder packaging apparatus in which powder is uniformly deposited on a distribution disk, and the powder on the distribution disk is scraped and packaged for each dose. In the powder contact member to which the powder in contact comes, a non-adhesive plating layer that does not allow powder to adhere to the powder contact surface of the powder contact member is provided. The non-adhesive plating layer is preferably formed by co-depositing a tetrafluororesin together with plating by plating. Alternatively, the non-adhesive plating layer is preferably formed by forming grooves, holes or cracks on the plating surface and impregnating with a tetrafluororesin. Here, the surface occupation ratio of the tetrafluoride resin of the non-adhesive plating layer is preferably 10% or more.
[0022]
According to the present invention, since the non-adhesive plating layer is provided on the powder contact member in the powder packaging device, adhesion of powder and chattering can be suppressed, and even if it adheres, it can be easily removed by striking, vibrating, or sucking. it can.
[0023]
The powder contact member is a distribution disk, and the distribution disk preferably has a brush protrusion for removing the powder remaining on the distribution disk, and the brush protrusion is preferably formed of a foamed resin. Thereby, a non-adhesive plating layer is protected from damage deterioration by the contact of a brush protrusion.
[0024]
Further, the second invention is a method for producing a powder contact member in which a powder in a powder packaging apparatus contacts a powder in a powder packaging device for uniformly depositing powder on the distribution disk, scraping and packaging the powder on a single dose. It has a plating process which forms a non-adhesive plating layer on a powder contact surface of a powder contact member by co-depositing a tetrafluoride resin with plating by plating. As an alternative, a plating process for forming a plating layer on the powder contact surface of the powder contact member, a roughening process for roughening the surface of the plating layer to form grooves, holes, or cracks, and a surface of the plating layer The non-adhesive plating layer may be formed by an impregnation step of impregnating the groove, hole, or crack with tetrafluororesin. Here, the surface occupation ratio of the tetrafluoride resin of the non-adhesive plating layer is preferably 10% or more. Moreover, it is preferable to further have a baking process which bakes the plating layer obtained at the said plating process at the melting temperature of tetrafluororesin.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0026]
FIG. 1 shows a cross section of a distribution disk 1 which is an example of a powder contact member of a drug packaging device according to the present invention. In the distribution disk 1, a non-adhesive plating layer 3 is formed on a base material 2 made of 304 stainless steel. The non-adhesive plating layer 3 is composed of a 1 micron base plating layer 4 and a 10 micron composite plating layer 5. The composite plating layer 5 is formed by co-depositing a tetrafluoride resin together with nickel by an electric field nickel plating process or an electroless nickel plating process described in detail below. Here, the surface eutectoid (occupancy) ratio of the tetrafluoride resin is 10% or more. As shown in FIG. 1 (B), when the surface eutectoid ratio of the tetrafluororesin is 10% or more, it is distributed while entraining powdered calcium lactate, depending on the load of silicon rubber of the scraping device. The sticking to the disk 1 starts to disappear. As shown in FIG. 1 (A), when the surface eutectoid ratio of the tetrafluororesin is 30%, calcium lactate may adhere to the distribution disk 1 no matter how many times the powder powder consisting of calcium lactate is divided. Lost.
[0027]
The method for manufacturing the distribution disk 1 will be described. As shown in FIG. 2, the method includes a pressing step, a base plating step, a composite plating step, and a firing step.
[0028]
In the pressing step, an annular material made of 304 stainless steel is pressed into a predetermined shape, and the base material 2 of the distribution disc 1 having a rounded groove is formed.
[0029]
In the base plating step, since it is generally difficult to plate the material of 304 stainless steel, a base plating layer of nickel or Pt having a thickness of 1 μm or less is formed as a base treatment.
[0030]
In the composite plating step, a composite plating layer 5 of about 10 μm is formed on the base plating layer 4. In the composite plating step, particles of polytetrafluoroethylene (PTFE) having a particle diameter of 0.3 μm are mixed in the plating solution, and PTFE is co-deposited on the nickel plating layer. The amount of eutectoid depends on the dispersion ratio of the PTFE fine powder and the stirring of the liquid. As the dispersion rate of the PTFE fine powder increases, the non-adhesiveness of the powder increases, but the surface hardness decreases. For this reason, it is more stable in quality to keep the dispersion ratio in the range of 25% to 35%. In the composite plating step, the plating solution is agitated in order to efficiently eutect PTFE particles on the plating surface. Examples of the plating base material include nickel and chromium. Examples of the eutectoid material include graphite fluoride and polytetrafluoroethylene PTFE fine powder, and the particle diameter thereof is about 0.3 μm.
[0031]
Such composite plating includes electrolytic plating and electroless plating.
[0032]
Electrolytic plating is performed in a plating tank 6 as shown in FIG. The plating solution is a nickel sulfamate solution, to which nickel chloride, phosphoric acid, phosphorous acid, and a cationic surfactant are added to disperse PTFE. In order to disperse PTFE, it is preferable to provide an air nozzle 7 or the like at the bottom and stir the plating solution. A nickel plate is set on the anode electrode 8, and the distribution disk 1 is set on the cathode electrode 9 as an object to be plated. The anode electrode 8 and the cathode electrode 9 are connected to a DC power source 11 through a current control device 10. The cathode current 9 is maintained at 2 A / dm ³ by the current controller 10. The plating solution is maintained at a temperature of 40-50 ° C. and a pH of 4.0. The plating time is 60 minutes. When electrolytic plating is performed under such conditions, ionized nickel collects on the cathode electrode 9, and the PTFE dispersed in the plating solution by the cationic surfactant is applied to the distribution disk 1 which is an object to be plated of the cathode electrode 9. A film is deposited. As a result, the PTFE on the plating surface is maintained at around 30%.
[0033]
Electroless plating is performed in a plating tank 12 as shown in FIG. As the plating solution, nickel sulfate or nickel chloride is mixed in a plating solution containing sodium hypophosphite as a reducing agent, and sodium succinate or malic acid is added. Add diethylamine or ammonium sulfate as needed. When diethylamine or ammonium sulfate is added, it is possible to prevent the occurrence of color spots on the plating surface and improve the quality. In the plating solution, PTFE is dispersed by a cationic surfactant. In order to activate the dispersion of PTFE, a pump 13 is connected to the plating tank 12 and the plating solution is circulated and stirred. In the electroless plating, if the distribution disk 1 to be plated is made of stainless steel, it is difficult to plate on the surface. Therefore, at the start, the electrode is inserted and the above-described electrolytic plating is performed, and then the base plating is performed. Electrolytic plating is performed. The plating solution is maintained at a temperature of 90 ° C. and a pH of 5.0. The plating time is 60 minutes. When electroless plating is performed under such conditions, ionized nickel collects in the distribution disk 1 and adheres to the distribution disk 1 as the object to be plated together with PTFE dispersed in the plating solution by the cationic surfactant. Be filmed. As a result, the PTFE on the plating surface is maintained at around 30%.
[0034]
In the firing step, the distribution disc 1 plated in the composite plating step is fired at 200 to 300 ° C. in a vacuum, a hooker gas, or in the atmosphere. This firing increases the surface hardness. FIG. 5 shows an example thereof. The distribution disc 1 that is composite-plated is placed in a vacuum firing furnace 16 that includes a heater 14 and is connected to a vacuum pump 15, and is heated in a range of about 220 to 320 ° C.
[0035]
If such a firing step is not performed, the surface strength of the plated surface cannot be obtained, and thus the wear rate is accelerated. For this reason, it is preferable to use a flexible material such as a sponge or a sliding rubber for the contact surface of the cleaner device or the scraping device with the distribution disk.
[0036]
Since the distribution disc 1 manufactured as described above has the non-adhesive plating layer 3, it is difficult for powder to adhere to it, and the contact friction resistance is reduced, so that the abrasion resistance of the silicon rubber of the scraping device is reduced. Improves.
[0037]
The distribution disk 1 is provided with a cleaner device composed of a sponge brush and a suction mechanism, which will be described later, so that the cleaning performance is improved and mixing with other prescription drugs is prevented.
[0038]
In the case of composite plating, when the powder packaging device is used for a long period of time, PTFE particles adhering to the surface of the composite plating layer 5 of the non-adhesive plating layer 3 of the distribution disk 1 are scattered and the PTFE dispersion rate on the surface is lowered. . As a result, calcium lactate comes to adhere to the distribution disk, resulting in poor cleanability. Therefore, by buffing the surface of the composite plating layer 5 by about 0.6 μm, new PTFE is exposed on the surface, so that the PTFE dispersion rate on the surface is improved and the non-adhesiveness and cleaning properties of the powder are restored. Can do.
[0039]
As a method for forming the non-adhesive plating layer 3, there is an impregnation method in which the plating surface is roughened and a groove or crack is impregnated with a fluororesin in addition to the composite plating of the above-described embodiment. This impregnation method includes a plating step, a roughening step, and an impregnation step. As shown in FIGS. 6 and 7, first, in a plating process, nickel or chromium is plated on the base material 2 of the distribution disk to form a nickel plating layer 17a or a chromium plating layer 17b. Next, in the roughening step, grooves or holes 18a are formed on the surface of the nickel plating layer 17a or the chromium plating layer 17b by etching or electrolytic polishing, or cracks 18b are formed by thermal shock. The groove, hole 18a, or crack 18b has a finer pitch than width and depth, and the arrangement thereof is regular, such as a stitch pattern, to increase the non-adhesive effect of the powder. Finally, in the impregnation step, the fluororesin 19 is impregnated into the grooves, holes 18a, or cracks 18b obtained in the roughening step.
[0040]
In the above embodiment, the surface of the base material 2 of the distribution disk is plated. However, as shown in FIG. 8, a fluororesin 19 can be impregnated between the sintered metal particles 17c. In this case, after impregnating the liquid fluororesin 19, a non-adhesive plating layer can be formed through a baking process. However, if the sintered metal particles 17c are coarse, craters appear on the surface of the distribution disk, which is not preferable in terms of quality. Therefore, it is preferable to reduce the diameter of the sintered metal particles 17c so that the impregnated fluororesin 19 becomes flat as shown in FIG.
[0041]
9 and 10 show specific examples of the cleaner device 20. The cleaner device 20 includes a rotating brush 21, a case 22, a cover 23, and a drive motor 25. The rotating brush 21 is supported by the outer peripheral edge of a circular support plate 25, and is formed by integrally forming an annular portion 26a and a plurality of brush protrusions 26b arranged at equal intervals in the circumferential direction on one surface of the annular portion 26a. (Sponge).
[0042]
The case 22 includes a substantially circular brush accommodating portion 27 that accommodates the rotating brush 21 and a rectangular duct portion 28. An opening 29 where a part of the rotary brush 21 is exposed, and a first hole 30 and a second hole 31 communicating with the duct portion 28 are formed in the peripheral wall of the brush accommodating portion 27. On the edge of the opening 29, a sealing material 32 made of a sponge that seals against the upper surface of the distribution disk 1 is mounted. The first hole 30 is provided in the vicinity of the opening 29, and a seal material 33 that contacts the brush protrusion 26 b is attached to the edge near the opening 29. On the inner edge of the second hole 31, a protrusion 34 that contacts the brush protrusion 26b is formed. The duct portion 28 is formed with a discharge port 35 that is connected to a cleaner (not shown) through a pipe as appropriate. Further, the duct portion 28 is formed so as to be rotatable on an apparatus main body (not shown) via an arm 36. As a result, the cleaner 20 has the operating position where the rotating brush 21 abuts against the rounded groove of the distribution disk 1 as shown in FIG. 9A, and the rotating brush 21 distributes as shown in FIG. 9B. The disc 1 can be turned to a retracted position away from the rounded groove.
[0043]
The cover 22 covers the case 22, and an annular rib 37 that protrudes along the inner side of the brush protrusion row of the rotary brush 21 is formed on the inner surface. The rib 37 is formed with a vent 38 that faces the opening 29 of the case 22. Further, the cover 22 is formed with a first communication port 39 that faces the brush housing portion 27 and a second communication port 40 that faces the duct portion 28. A connection duct portion 41 that connects the first communication port 39 and the second communication port 40 is formed on the outer surface of the cover 22. The drive motor 24 is fixed to the case 22, and its drive shaft is connected to the support plate 25 of the rotary brush 21 to rotate the rotary brush 21.
[0044]
The cleaning operation by the cleaner device 20 will be described. In order to clean the rounded grooves of the distribution disc 1, first, the drive motor 24 is driven and a cleaner (not shown) is driven, and the device is shown in FIG. To the operating position shown in FIG. At the same time, the distribution disk 1 is also rotated. As a result, the powder adhering to the round groove of the distribution disk 1 is scraped off and cleaned by the brush protrusion 26b of the rotary brush 21. The scraped powder is sucked from the opening portion 29 of the case 22, enters the connection duct portion 41 from the vent hole 38 of the cover 22 through the first communication port 39, and passes through the duct portion 28 from the second communication port 40. It is discharged from the discharge port 35. Further, as the rotary brush 21 rotates, the powder that remains attached to the brush protrusion 26b comes into contact with the sealing material 33 of the first hole 30 and jumps off toward the duct portion 28, and further, the second hole In contact with the projecting portion 34 of 31, it is similarly splashed toward the duct portion 28, and is discharged from the discharge port 35 through the duct portion 28. When the cleaning operation is completed, the apparatus is rotated to the retracted position shown in FIG.
[0045]
In addition, although the said embodiment demonstrated the distribution disk as a powder contact member, this invention can be applied not only to a distribution disk but to other powder contact members, such as a hopper.
[0046]
【The invention's effect】
As is clear from the above description, according to the present invention, since the non-adhesive plating layer is formed on the powder transporting member of the powder packaging device, it becomes difficult for the powder to adhere, and the drug can be reliably removed, By the synergistic action with the vibration device and the cleaning device, the adhesion of powder can be effectively removed, and contamination can be prevented and the recovery rate can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a powder contact member having a non-adhesive plating layer of the present invention.
FIG. 2 is a view showing a process for manufacturing the powder contact member of FIG. 1;
FIG. 3 is a schematic view of an electroplating tank.
FIG. 4 is a schematic view of an electroless plating tank.
FIG. 5 is a schematic view of a vacuum firing furnace.
FIG. 6 is a cross-sectional view showing an example of a non-adhesive layer formed by an impregnation method.
FIG. 7 is a cross-sectional view showing another example of a non-adhesive layer formed by an impregnation method.
FIG. 8 is a cross-sectional view showing another example of a non-adhesive layer formed by an impregnation method.
FIGS. 9A and 9B are cross-sectional views of the cleaner device, where FIG.
10 is a cross-sectional view taken along line II of the cleaner device of FIG. 9;
FIG. 11 is a perspective view of a distribution disk and a scraping device as a conventional powder contact member.
FIG. 12 is an enlarged view of powder particles.
[Explanation of symbols]
1 Distribution disk (powder contact member)
3 Non-adhesive plating layer 26 Brush protrusion 53 Groove or hole 54 Crack 55, 62 Fluororesin

Claims (8)

In a powder contact member that contacts powder in a powder packaging device that deposits powder on the distribution disk uniformly and scrapes and packages the powder on the distribution disk one dose at a time, the powder on the powder contact surface of the powder contact member A powder contact member of a powder packaging apparatus , comprising a non-adhesive plating layer that is not adhered, wherein the non-adhesive plating layer is obtained by eutecting a tetrafluoro resin together with plating by plating . In a powder contact member that contacts powder in a powder packaging device that deposits powder on the distribution disk uniformly and scrapes and packages the powder on the distribution disk one dose at a time, the powder on the powder contact surface of the powder contact member A powdered contact member comprising a non-adhesive plating layer that is not adhered , wherein the non-adhesive plating layer is formed by forming grooves, holes, or cracks on the plating surface and impregnating with a tetrafluororesin. The powder contact member according to claim 1 or 2 , wherein the surface occupation ratio of the tetrafluoride resin of the non-adhesive plating layer is 10% or more. The powdered medicine contact member is the partition disk, the distributor disc has a brush projection of removing powdered medicine remaining thereon, the brush protrusion claim 1, characterized in that formed by foamed resin 3 A powder contact member according to any one of the above. In the method for producing a powder contact member in which a powder is contacted in a powder packaging apparatus for depositing powder uniformly on a distribution disk, scraping and packaging the powder on the distribution disk one by one,
A method for producing a powder contact member of a powder packaging device, comprising a plating step of forming a non-adhesive plating layer on a powder contact surface of a powder contact member by co-depositing a tetrafluoro resin together with plating by plating. . In the method for producing a powder contact member in which a powder is contacted in a powder packaging apparatus for depositing powder uniformly on a distribution disk, scraping and packaging the powder on the distribution disk one by one,
A plating step of forming a plating layer by plating on the powder contact surface of the powder contact member;
A roughening step of roughening the surface of the plating layer to form grooves, holes, or cracks;
By the impregnation step of impregnating tetrafluororesin into grooves, holes or cracks on the surface of the plating layer,
A method for producing a powder contact member of a powder packaging device, wherein a non-adhesive plating layer is formed. The method for producing a powder contact member according to claim 5 or 6 , wherein a surface occupation ratio of the tetrafluoride resin of the non-adhesive plating layer is 10% or more. The method for producing a powder contact member according to any one of claims 5 to 7 , further comprising a firing step of firing the plating layer obtained in the plating step at a melting temperature of tetrafluoride resin.

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