JP4416448B2 - 化学的機械研磨およびパッドドレッシング方法 - Google Patents

化学的機械研磨およびパッドドレッシング方法 Download PDF

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Publication number
JP4416448B2
JP4416448B2 JP2003283956A JP2003283956A JP4416448B2 JP 4416448 B2 JP4416448 B2 JP 4416448B2 JP 2003283956 A JP2003283956 A JP 2003283956A JP 2003283956 A JP2003283956 A JP 2003283956A JP 4416448 B2 JP4416448 B2 JP 4416448B2
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Prior art keywords
pad
polishing
dressing
platen
rpm
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JP2003283956A
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Japanese (ja)
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JP2004066450A (ja
JP2004066450A5 (enExample
Inventor
スティーブン モロニー ジェラルド
ワン ヒューイ−ミン
ラオ ピーター
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エバラ テクノロジーズ インコーポレーテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2003283956A 2002-07-31 2003-07-31 化学的機械研磨およびパッドドレッシング方法 Expired - Fee Related JP4416448B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40045702P 2002-07-31 2002-07-31
US10/378,024 US7004822B2 (en) 2002-07-31 2003-02-28 Chemical mechanical polishing and pad dressing method

Publications (3)

Publication Number Publication Date
JP2004066450A JP2004066450A (ja) 2004-03-04
JP2004066450A5 JP2004066450A5 (enExample) 2006-08-17
JP4416448B2 true JP4416448B2 (ja) 2010-02-17

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ID=31191050

Family Applications (1)

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JP2003283956A Expired - Fee Related JP4416448B2 (ja) 2002-07-31 2003-07-31 化学的機械研磨およびパッドドレッシング方法

Country Status (3)

Country Link
US (1) US7004822B2 (enExample)
JP (1) JP4416448B2 (enExample)
CN (1) CN100526018C (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105446B2 (en) * 2003-09-04 2006-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for pre-conditioning CMP polishing pad
US7210988B2 (en) * 2004-08-24 2007-05-01 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning
JP2009500182A (ja) * 2005-07-09 2009-01-08 ティービーダブリュ インダストリーズ インク． Ｃｍｐパッドコンディショニング用に改良されたエンドエフェクタアーム装置
WO2007027486A2 (en) * 2005-08-29 2007-03-08 Applied Materials, Inc. Method for conditioning a polishing pad
US20080020682A1 (en) * 2006-07-21 2008-01-24 Applied Materilas, Inc. Method for conditioning a polishing pad
TW200720493A (en) * 2005-10-31 2007-06-01 Applied Materials Inc Electrochemical method for ecmp polishing pad conditioning
US20070158207A1 (en) * 2006-01-06 2007-07-12 Applied Materials, Inc. Methods for electrochemical processing with pre-biased cells
US20070227902A1 (en) * 2006-03-29 2007-10-04 Applied Materials, Inc. Removal profile tuning by adjusting conditioning sweep profile on a conductive pad
US7846006B2 (en) * 2006-06-30 2010-12-07 Memc Electronic Materials, Inc. Dressing a wafer polishing pad
US7846007B2 (en) * 2006-06-30 2010-12-07 Memc Electronic Materials, Inc. System and method for dressing a wafer polishing pad
US8389099B1 (en) 2007-06-01 2013-03-05 Rubicon Technology, Inc. Asymmetrical wafer configurations and method for creating the same
US8348720B1 (en) 2007-06-19 2013-01-08 Rubicon Technology, Inc. Ultra-flat, high throughput wafer lapping process
CN101367200B (zh) * 2007-08-14 2010-05-19 中芯国际集成电路制造(上海)有限公司 一种抛光垫修整头
JP4577368B2 (ja) 2008-01-30 2010-11-10 ブラザー工業株式会社 インクジェット記録装置
KR101616595B1 (ko) * 2009-06-04 2016-04-28 아사히 가라스 가부시키가이샤 판 형상체의 연마 방법
JP5504901B2 (ja) * 2010-01-13 2014-05-28 株式会社Ｓｕｍｃｏ 研磨パッドの形状修正方法
CN102248486B (zh) * 2011-07-25 2013-01-30 清华大学 抛光垫修整方法
CN103381575A (zh) * 2012-05-03 2013-11-06 旺宏电子股份有限公司 平坦化修正臂、应用其的平坦化系统及平坦化方法
CN102909626B (zh) * 2012-09-18 2015-02-25 陈政伟 平磨机
US20140224766A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Groove Design for Retaining Ring
CN104416466A (zh) * 2013-08-26 2015-03-18 中芯国际集成电路制造(上海)有限公司 一种用于化学机械抛光工艺的抛光垫修整方法
DE102015220090B4 (de) * 2015-01-14 2021-02-18 Siltronic Ag Verfahren zum Abrichten von Poliertüchern
CN106141894A (zh) * 2015-04-23 2016-11-23 中芯国际集成电路制造(上海)有限公司 研磨垫整理方法及研磨机台
CN106312696A (zh) * 2016-09-14 2017-01-11 天津华海清科机电科技有限公司 化学机械抛光方法和装置
CN107914213B (zh) * 2016-10-10 2020-06-05 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨方法
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
CN109015335A (zh) * 2018-09-27 2018-12-18 德淮半导体有限公司 化学机械研磨装置及其工作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
TW383644U (en) * 1999-03-23 2000-03-01 Vanguard Int Semiconduct Corp Dressing apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP2001191246A (ja) * 2000-01-06 2001-07-17 Nec Corp 平面研磨装置および平面研磨方法
US6632127B1 (en) * 2001-03-07 2003-10-14 Jerry W. Zimmer Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same

Also Published As

Publication number Publication date
JP2004066450A (ja) 2004-03-04
US7004822B2 (en) 2006-02-28
US20040023602A1 (en) 2004-02-05
CN100526018C (zh) 2009-08-12
CN1485180A (zh) 2004-03-31

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