JP4395915B2 - Resin composition for heat resistant color filter and heat resistant color filter using the same - Google Patents

Description

【００１１】
また、本発明は、上記発明による耐熱性カラーフィルタ用樹脂組成物において、 前記Ｇ値が１以上の有機高分子化合物が、化学式（２）で表される有機高分子化合物であることを特徴とする耐熱性カラーフィルタ用樹脂組成物である。
【００１２】
【化４】

【００１３】
また、本発明は、上記発明による耐熱性カラーフィルタ用樹脂組成物を用いたことを特徴とする耐熱性カラーフィルタである。
【００１４】
【発明の実施の形態】
本発明を一実施の形態に基づいて以下に詳細に説明する。
一般に、有機高分子化合物は熱、光、あるいは放射線等のエネルギーを吸収することにより、架橋反応または切断反応、あるいは架橋反応と切断反応を同時に起こす。
Ｇ．Ｎ．Ｂａｂｕらにより、Ｍａｃｒｏｍｏｌｅｃｕｌｅｓ（１７巻、２４４９ｐ、１９８４年）に示されるように、有機高分子化合物１ｇが１００ｅＶの放射線を吸収した時に生じる主鎖切断数をＧｓ、有機高分子化合物１ｇが１００ｅＶの放射線を吸収した時に生じる架橋数をＧｘとし、主鎖切断数と架橋数との差（Ｇｓ−Ｇｘ）をＧ値とすると、Ｇ値、すなわち（Ｇｓ−Ｇｘ）は次式から求めることができる。
【００１５】
１／Ｍｎ＊＝１／Ｍｎ，０＋［（Ｇｓ−Ｇｘ）Ｄ］／１００ＮＡ
この式において
Ｍｎ，０：初期の数平均分子量
Ｍｎ＊ ：エネルギー吸収後の数平均分子量
Ｄ ：エネルギー吸収量（ｅＶ）
ＮＡ ：アボガドロ数（６．０２３×Ｅ２３）
【００１６】
主鎖切断数Ｇｓが大きく、架橋数Ｇｘが小さいほど、炭化反応を起こさず有機高分子化合物の分解反応、すなわち、解重合が起こるため加熱処理により容易に有機高分子化合物が気化・消失する。
本発明による耐熱性カラーフィルタ用樹脂組成物においては、このような有機高分子化合物を用いることを特徴とするものである。
このような有機高分子化合物を用いることにより、透過率が低下して分光特性が悪化することのない耐熱性カラーフィルタを作製することが可能となるものである。
【００１７】
また、本発明では前記化学式（１）、及び化学式（２）で表される有機高分子化合物を用いることを特徴としているものである。
化学式（１）で表される有機高分子化合物は、主鎖に４級炭素を有しているため、エネルギーを吸収した際に、主鎖切断反応が優先し解重合を起こすが、この４級炭素に置換して官能基が電子吸引基である場合には、さらに主鎖切断反応を促進するものとなる。なお、この電子吸引基としては、Ｆ、Ｃｌ、Ｂｒ、Ｉ、ＣＮ、ＮＯ₂ 、ＣＯＯＲ、ＣＯＲ等が挙げられる。
また、化学式（２）で表されるポリ（アルケン−スルフォン）はＳ−Ｃの結合エネルギーが小さいため、エネルギー吸収により容易に分解反応を起こすものである。
【００１８】
また、上記とは逆に、主鎖切断数Ｇｓが小さく、架橋数Ｇｘが大きいほど、主鎖の分解反応が起こりにくいため、炭化反応が優先的に起こり、耐熱性カラーフィルタの透過率を低下させ、色特性の良好な耐熱性カラーフィルタを作製することが困難なものとなる。
本発明では、主鎖切断数Ｇｓが架橋数Ｇｘより１以上大きい有機高分子化合物を用いることを特徴し、Ｇ値（Ｇｓ−Ｇｘ）が１より小さいと主鎖切断反応が不十分であり、耐熱性カラーフィルタ層の透過率を低下させてしまう。このような高分子としては、主鎖に３級炭素を有するものが挙げられ、具体的にはポリアルリロニトリル、ポリ塩化ビニル、ポリビニルアルコール、ポリスチレン等が挙げられる。
【００１９】
本発明による耐熱性カラーフィルタ用樹脂組成物は、低融点ガラス、無機顔料を有機高分子化合物及び溶剤と練り合わせたペースト状のものである。
低融点ガラスとしては、ホウケイ酸鉛ガラス等を用いることができるが、特にこれに限定されたものではない。
無機顔料としては、例えば赤色顔料としてはＦｅ２Ｏ３、緑色顔料としてはＴｉＯ２−ＣｏＯ−ＮｉＯ−ＺｎＯ、青色顔料としてはＣｏＯ−Ａｌ２Ｏ３等を用いることができるが、これらに限定されたものではない。また、用途によっては他の色の無機顔料を用いることもできる。
【００２０】
有機高分子化合物としてはポリメチルメタクリレート、ポリ（α−クロロエチルアクリレート）、ポリ（α−シアノエチルアクリレート）、ポリ（α−メチルスチレン）、ポリ（１−ブテンスルフォン）等が好適である。
ペースト状に調製するには、上記低融点ガラス、無機顔料、有機高分子化合物、及び溶剤をサンドミル、ボールミル、アトライター、三本ロール等の分散機により練り合わせて調製する。
【００２１】
また、本発明による耐熱性カラーフィルタ用樹脂組成物を用いた際のパターニング方法としては、印刷法を用いた場合にはスクリーン印刷法や平版オフセット印刷法等を用いることができるが、これらに限定されたものではない。
また、フォトリソグラフィー法を用いた場合にはペーストを基板上に塗布した後、この塗膜上に感光性樹脂を塗布し、所定のフォトマスクを介しての露光、及び現像・エッチングを行ない、パターン形成する方法を用いることができるが、これらに限定されたものではない。
【００２２】
【実施例】
以下、実施例にて本発明を具体的に説明する。
（Ｇ値の測定法）
Ｇ値（主鎖切断数Ｇｓと架橋数Ｇｘの差）は次のようにして求める。
有機高分子化合物を２０重量％の濃度になるようにシクロヘキサノンに溶解する。この液をガラス基板上にスピンコーターを用いて、塗布膜厚２０μｍになるように塗布する。
ゲルパーミエーションクロマトグラフィ（東ソー製、ＬＳ−８０００）を用いて有機高分子化合物の初期の数平均分子量を求める。次にエリア型電子線照射装置キュアトロン（日新ハイボルテージ社製）を用いて、有機高分子化合物を塗布したガラス基板を、酸素濃度１００ｐｐｍ以下で、加速電圧１７５ｋＶにて、照射量１０Ｍｒａｄの電子線を照射する。
電子線を照射後、ガラス基板から有機高分子化合物を剥ぎ取り、エネルギー吸収後の数平均分子量を求める。
前記に示す式より、Ｇ値（主鎖切断数Ｇｓと架橋数Ｇｘの差）を算出する。
なお、以下に示す実施例１〜実施例５、及び比較例１〜比較例４におけるＧ値の測定は、この測定法に従った。
【００２３】
＜実施例１＞
青色無機顔料（アサヒ化成（株）製、：「アサヒスーパーブルーＣＲ」）５部、ホウケイ酸鉛ガラス（日本電気硝子（株）製：「ＧＡ−９」）５０部、有機高分子化合物としてポリメチルメタリレート５部、シクロヘキサノン（関東化学（株）製）５０部を三本ロールミルで練り合わせて青色ペーストを調製した。
【００２４】
上記のようにして調製した青色ペーストをガラス基板上に、３００メッシュのスクリーン印刷版を用いて、幅１００μｍ、長さ４ｍｍのパターンを印刷した。次にガラス基板を５８０℃で１０分間焼成することにより、青色の耐熱性カラーフィルタを得た。この耐熱性カラーフィルタは無機成分で構成されたものであり、その透過率は波長４５０ｎｍにおいて９７．０％であった。
波長４００〜７００ｎｍにおける分光透過率の測定結果を図１に示す。また、表１に示すように、上記の方法により求めたポリメチルメタクリレートのＧ値（Ｇｓ−Ｇｘ）は１．６３であった。
【００２５】
【表１】

【００２６】
＜実施例２＞
有機高分子化合物としてポリ（α−クロロエチルアクリレート）を用い、他の条件は実施例１と同一にして耐熱性カラーフィルタを作製した。
【００２７】
＜実施例３＞
有機高分子化合物としてポリ（α−シアノエチルアクリレート）を用い、他の条件は実施例１と同一にして耐熱性カラーフィルタを作製した。
【００２８】
＜実施例４＞
有機高分子化合物としてポリ（α−メチルスチレン）を用い、他の条件は実施例１と同一にして耐熱性カラーフィルタを作製した。
【００２９】
＜実施例５＞
有機高分子化合物としてポリ（ブテン−１−スルフォン）を用い、他の条件は実施例１と同一にして耐熱性カラーフィルタを作製した。
【００３０】
上記実施例２〜実施例５における耐熱性カラーフィルタの、波長４５０ｎｍにおける透過率、及び、ポリ（α−クロロエチルアクリレート）、（α−シアノエチルアクリレート）、ポリ（α−メチルスチレン）、ポリ（ブテン−１−スルフォン）のＧ値（Ｇｓ−Ｇｘ）を表１に示す。
【００３１】
＜比較例１＞
有機高分子化合物として、ポリメチルアクリレートを用いて、実施例１と同様にして、青色ペーストをスクリーン印刷法により、ガラス基板上にパターン形成し、５８０℃にて１０分間焼成した。この耐熱性カラーフィルタの透過率は波長４５０ｎｍにおいて８７％であり、実施例１のようにポリメチルメタクリレートを用いた場合に比較して、透過率が低下している。
【００３２】
透過率低下の原因としては、有機高分子化合物の分解が進みにくいため、炭化反応が副反応として起こっているものと推定される。このため、透過率が低下したものと考えられる。ポリメチルアクリレートは主鎖に３級炭素を有するために主鎖の切断反応より、アクリル酸メチルの脱離反応が優先的に起こり、有機高分子化合物の炭化反応が進んでいくものと推定される。
なお、ポリメチルアクリレートのＧ値は−０．２６で１より小さかった。
この耐熱性カラーフィルタの分光透過率の測定結果を図１に示す。
【００３３】
＜比較例２＞
有機高分子化合物として、ポリスチレンを用い、実施例１と同様にして、耐熱性カラーフィルタを作製した。
【００３４】
＜比較例３＞
有機高分子化合物として、ポリビニルアルコールを用い、実施例１と同様にして、耐熱性カラーフィルタを作製した。
【００３５】
＜比較例４＞
有機高分子化合物として、ポリグリシジルメタクリレートを用い、実施例１と同様にして、耐熱性カラーフィルタを作製した。
【００３６】
上記比較例１〜比較例４における耐熱性カラーフィルタの透過率は波長４５０ｎｍにおいて、表１に示すように、いずれも９０％以下であった。
また、上記比較例において、ポリスチレン、及びポリビニルアルコールは主鎖に３級炭素を有するため、比較例１のポリメチルアクリレートと同様にモノマーの脱離反応が起こり炭化が進み、ポリグリシジルメタクリレートは主鎖に４級炭素を有するにも係わらず、側鎖に架橋基であるエポキシ基を有するため、主鎖切断反応より架橋反応が優先して起こったものと考えられる。
上記比較例１〜比較例４におけるポリスチレン、ポリビニルアルコール、ポリグリシジルメタクリレートのＧ値（Ｇｓ−Ｇｘ）を表１に示す。
【００３７】
【発明の効果】
本発明は、透明基板上にパターン形成した後、高温で加熱して有機高分子化合物を分解させて無機顔料とガラスからなる耐熱性カラーフィルタを製造する際に用いる、無機顔料、低融点ガラス、及び有機高分子化合物を主成分とする耐熱性カラーフィルタ用樹脂組成物であって、該有機高分子化合物１ｇが１００ｅＶの放射線を吸収した時に生じる主鎖切断数をＧｓ、該有機高分子化合物１ｇが１００ｅＶの放射線を吸収した時に生じる架橋数をＧｘとし、主鎖切断数と架橋数との差（Ｇｓ−Ｇｘ）をＧ値とし、該有機高分子化合物のＧ値が１以上の有機高分子化合物を用いるので、
耐熱性カラーフィルタを製造する際に、その加熱工程にて、有機高分子化合物の気化を完全に進行させ、炭化反応を起こさせない耐熱性カラーフィルタ用樹脂組成物、すなわち、炭化反応によりカラーフィルタの透過率が低下して分光特性が悪化することのない耐熱性カラーフィルタ用樹脂組成物となる。
【００３８】
また、本発明は、上記発明による耐熱性カラーフィルタ用樹脂組成物を用いた耐熱性カラーフィルタであるので、炭化反応によりカラーフィルタの透過率が低下して分光特性が悪化することのない耐熱性カラーフィルタとなる。
【図面の簡単な説明】
【図１】本発明の実施例１、及び比較例１における、耐熱性カラーフィルタの分光透過率の測定結果である。[0001]
BACKGROUND OF THE INVENTION
The present invention is provided in various display devices such as plasma display panels, field emission displays, electroluminescence displays, and solid-state image sensors, and has excellent heat resistance used for color separation, reflectance reduction, color synthesis, and the like. The present invention relates to a heat-resistant color filter resin composition for forming a color filter and a heat-resistant color filter using the same.
[0002]
[Prior art]
In a liquid crystal display device, a color filter is often used for color display. As this color filter, a color filter prepared by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method or the like is used.
This is a color filter obtained by coloring a resin layer using an organic dye or an organic pigment. For example, in a color filter for a liquid crystal display device, heat resistance of 180 ° C. or higher is required in the manufacturing process of the liquid crystal display device. There is a demand for color filters.
[0003]
Also in plasma display panels, it has been proposed to use a color filter to improve the contrast when displaying an image (Wagai, Nikkei Electronics, November 8, 1993 (No. 594, pp. 215), etc.) ).
Thus, some display devices require a color filter for color display and image quality improvement.
[0004]
In the case of a plasma display panel, the manufacturing process includes a process of baking at about 600 ° C. Therefore, if the color filter for a liquid crystal display device is used as a color filter for a plasma display panel as it is, in the manufacturing process of the plasma display panel Reactions such as combustion and decomposition occur in the organic material constituting the color filter, and the characteristics as the color filter are impaired.
[0005]
As a solution to this problem, it has been proposed to disperse an inorganic pigment in a low-melting glass and use it as a color filter (Sakai et al. Television Society Technical Report ED993 IPD113-8 (1986)).
This is because an organic polymer is obtained by patterning a paste obtained by kneading a low-melting glass and an inorganic pigment with a suitable organic polymer compound and a solvent by a method such as photolithography or screen printing, and then baking the paste. A compound and a solvent are removed to obtain a color filter in which an inorganic pigment is dispersed in a low-melting glass.
In this case, since the obtained color filters are all made of an inorganic material, they can withstand high-temperature processes related to the manufacturing process of the plasma display panel.
[0006]
In this production method, it is necessary for the organic polymer compound to completely burn and vaporize, but in the case where the organic polymer compound undergoes a crosslinking reaction during the heating step or when the introduction of oxygen is insufficient. The problem arises that the carbonization reaction occurs without the vaporization completely progressing.
And when carbonization reaction occurs, the transmittance | permeability of a color filter will fall and spectral characteristics will deteriorate.
[0007]
[Problems to be solved by the invention]
The present invention has been made to solve such problems, and the object of the present invention is to provide a resin composition for a heat-resistant color filter mainly comprising an inorganic pigment, a low-melting glass, and an organic polymer compound. When a heat-resistant color filter made of inorganic pigment and glass is manufactured by decomposing an organic polymer compound by heating at a high temperature after pattern formation on a transparent substrate using an organic material, Resin composition for heat-resistant color filters that does not cause carbonization reaction by completely evaporating the polymer compound, that is, heat resistance that does not deteriorate the spectral characteristics due to the carbonization reaction and decrease the transmittance of the color filter The object is to provide a resin composition for a color filter.
Moreover, it is providing the heat resistant color filter using the resin composition for heat resistant color filters.
[0008]
[Means for Solving the Problems]
The present invention provides an inorganic pigment, a low-melting glass, which is used for producing a heat-resistant color filter composed of an inorganic pigment and glass by forming a pattern on a transparent substrate and then decomposing the organic polymer compound by heating at a high temperature. And a resin composition for a heat-resistant color filter mainly comprising an organic polymer compound, wherein the number of main chain breaks generated when 1 g of the organic polymer compound absorbs radiation of 100 eV is Gs, and the organic polymer compound 1 g Is an organic polymer in which the number of crosslinks that occur when absorbing 100 eV of radiation is Gx, the difference between the number of main chain breaks and the number of crosslinks (Gs−Gx) is the G value, and the G value of the organic polymer compound is 1 or more A heat-resistant color filter resin composition characterized by using a compound.
[0009]
Moreover, the present invention is the resin composition for a heat resistant color filter according to the above invention, wherein the organic polymer compound having the G value of 1 or more is an organic polymer compound represented by the chemical formula (1). It is a resin composition for heat resistant color filters.
[0010]
[Chemical 3]

[0011]
In the resin composition for a heat-resistant color filter according to the present invention, the organic polymer compound having the G value of 1 or more is an organic polymer compound represented by the chemical formula (2). It is a resin composition for heat resistant color filters.
[0012]
[Formula 4]

[0013]
Moreover, this invention is a heat resistant color filter characterized by using the resin composition for heat resistant color filters by the said invention.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described in detail below based on one embodiment.
In general, an organic polymer compound absorbs energy such as heat, light, or radiation to cause a crosslinking reaction or a cleavage reaction, or a crosslinking reaction and a cleavage reaction simultaneously.
G. N. As shown in Macromolecules (17, 2449p, 1984) by Babu et al., The number of main chain scissions generated when 1 g of organic polymer compound absorbs 100 eV of radiation is Gs, and the radiation of organic polymer compound 1 g is 100 eV. When the number of cross-links that occur when absorbing is taken as Gx and the difference between the number of main chain breaks and the number of cross-links (Gs−Gx) is taken as the G value, the G value, that is, (Gs−Gx) can be obtained from the following equation.
[0015]
1 / Mn * = 1 / Mn, 0 + [(Gs−Gx) D] / 100NA
In this formula, Mn, 0: initial number average molecular weight Mn *: number average molecular weight after energy absorption D: energy absorption (eV)
NA: Avogadro number (6.023 × E23)
[0016]
The larger the main chain cleavage number Gs and the smaller the number of crosslinks Gx, the more the organic polymer compound vaporizes and disappears by heat treatment because the decomposition reaction of the organic polymer compound, that is, the depolymerization occurs without causing the carbonization reaction.
The resin composition for a heat resistant color filter according to the present invention is characterized by using such an organic polymer compound.
By using such an organic polymer compound, it becomes possible to produce a heat-resistant color filter in which the transmittance is not lowered and the spectral characteristics are not deteriorated.
[0017]
In the present invention, the organic polymer compound represented by the chemical formula (1) and the chemical formula (2) is used.
Since the organic polymer compound represented by the chemical formula (1) has a quaternary carbon in the main chain, when the energy is absorbed, the main chain scission reaction takes precedence and depolymerization occurs. When the functional group is an electron withdrawing group after substitution with carbon, the main chain cleavage reaction is further promoted. Examples of the electron withdrawing group include F, Cl, Br, I, CN, NO ₂ , COOR, COR, and the like.
In addition, since poly (alkene-sulfone) represented by the chemical formula (2) has a small S—C bond energy, it easily undergoes a decomposition reaction by energy absorption.
[0018]
Contrary to the above, as the main chain cleavage number Gs is smaller and the cross-linking number Gx is larger, the main chain decomposition reaction is less likely to occur, so the carbonization occurs preferentially and the transmittance of the heat-resistant color filter is reduced. Therefore, it becomes difficult to produce a heat-resistant color filter with good color characteristics.
In the present invention, an organic polymer compound having a main chain cleavage number Gs of 1 or more than the crosslinking number Gx is used. When the G value (Gs-Gx) is smaller than 1, the main chain cleavage reaction is insufficient, The transmittance of the heat resistant color filter layer is lowered. Examples of such a polymer include those having tertiary carbon in the main chain, and specific examples thereof include polyallylonitrile, polyvinyl chloride, polyvinyl alcohol, and polystyrene.
[0019]
The resin composition for heat-resistant color filters according to the present invention is a paste in which a low-melting glass and an inorganic pigment are kneaded with an organic polymer compound and a solvent.
As the low melting point glass, lead borosilicate glass or the like can be used, but it is not particularly limited thereto.
Examples of inorganic pigments include Fe2O3 as a red pigment, TiO2-CoO-NiO-ZnO as a green pigment, and CoO-Al2O3 as a blue pigment, but are not limited thereto. Depending on the application, inorganic pigments of other colors can be used.
[0020]
As the organic polymer compound, polymethyl methacrylate, poly (α-chloroethyl acrylate), poly (α-cyanoethyl acrylate), poly (α-methylstyrene), poly (1-butene sulfone) and the like are preferable.
In preparing the paste, the low melting point glass, the inorganic pigment, the organic polymer compound, and the solvent are kneaded with a disperser such as a sand mill, a ball mill, an attritor, or a three roll.
[0021]
Further, as a patterning method when using the heat-resistant color filter resin composition according to the present invention, when a printing method is used, a screen printing method, a lithographic offset printing method, or the like can be used. It is not what was done.
In the case of using a photolithography method, after applying a paste on a substrate, a photosensitive resin is applied onto the coating film, and exposure through a predetermined photomask, development, and etching are performed. Although the method of forming can be used, it is not limited to these.
[0022]
【Example】
Hereinafter, the present invention will be specifically described with reference to examples.
(Measurement method of G value)
The G value (difference between main chain cleavage number Gs and crosslinking number Gx) is determined as follows.
The organic polymer compound is dissolved in cyclohexanone so as to have a concentration of 20% by weight. This solution is applied on a glass substrate using a spin coater so that the coating thickness is 20 μm.
The initial number average molecular weight of the organic polymer compound is determined using gel permeation chromatography (LS-8000, manufactured by Tosoh Corporation). Next, using an area type electron beam irradiation apparatus Curetron (manufactured by Nissin High Voltage), a glass substrate coated with an organic polymer compound is an electron having an oxygen concentration of 100 ppm or less, an acceleration voltage of 175 kV, and an irradiation dose of 10 Mrad. Irradiate the line.
After irradiation with an electron beam, the organic polymer compound is peeled off from the glass substrate, and the number average molecular weight after energy absorption is determined.
The G value (difference between main chain cleavage number Gs and crosslinking number Gx) is calculated from the formula shown above.
In addition, the measurement of G value in Example 1-Example 5 and Comparative Example 1-Comparative Example 4 shown below followed this measuring method.
[0023]
<Example 1>
Blue inorganic pigment (Asahi Kasei Co., Ltd., “Asahi Super Blue CR”) 5 parts, Borosilicate glass (Nippon Electric Glass Co., Ltd .: “GA-9”) 50 parts, Poly as an organic polymer compound A blue paste was prepared by kneading 5 parts of methyl metallate and 50 parts of cyclohexanone (manufactured by Kanto Chemical Co., Ltd.) with a three-roll mill.
[0024]
The blue paste prepared as described above was printed on a glass substrate using a 300-mesh screen printing plate and a pattern having a width of 100 μm and a length of 4 mm. Next, the glass substrate was baked at 580 ° C. for 10 minutes to obtain a blue heat-resistant color filter. This heat-resistant color filter was composed of an inorganic component, and its transmittance was 97.0% at a wavelength of 450 nm.
The measurement result of the spectral transmittance in a wavelength of 400-700 nm is shown in FIG. Moreover, as shown in Table 1, the G value (Gs-Gx) of polymethyl methacrylate obtained by the above method was 1.63.
[0025]
[Table 1]

[0026]
<Example 2>
A poly (α-chloroethyl acrylate) was used as the organic polymer compound, and the other conditions were the same as in Example 1 to produce a heat resistant color filter.
[0027]
<Example 3>
A poly (α-cyanoethyl acrylate) was used as the organic polymer compound, and the other conditions were the same as in Example 1 to produce a heat resistant color filter.
[0028]
<Example 4>
A poly (α-methylstyrene) was used as the organic polymer compound, and the other conditions were the same as in Example 1 to produce a heat resistant color filter.
[0029]
<Example 5>
A poly (butene-1-sulfone) was used as the organic polymer compound, and the other conditions were the same as in Example 1 to produce a heat resistant color filter.
[0030]
The transmittance at a wavelength of 450 nm of the heat-resistant color filters in Examples 2 to 5, and poly (α-chloroethyl acrylate), (α-cyanoethyl acrylate), poly (α-methylstyrene), poly (butene) The G value (Gs-Gx) of -1-sulfone is shown in Table 1.
[0031]
<Comparative Example 1>
As an organic polymer compound, polymethyl acrylate was used and a blue paste was patterned on a glass substrate by screen printing in the same manner as in Example 1 and baked at 580 ° C. for 10 minutes. The transmittance of this heat-resistant color filter is 87% at a wavelength of 450 nm, and the transmittance is reduced as compared with the case where polymethyl methacrylate is used as in Example 1.
[0032]
The cause of the decrease in the transmittance is presumed that the carbonization reaction occurs as a side reaction because the decomposition of the organic polymer compound is difficult to proceed. For this reason, it is thought that the transmittance | permeability fell. Since polymethyl acrylate has tertiary carbon in the main chain, it is presumed that the elimination reaction of methyl acrylate occurs preferentially over the main chain cleavage reaction, and the carbonization reaction of the organic polymer compound proceeds. .
The G value of polymethyl acrylate was −0.26, which was smaller than 1.
The measurement result of the spectral transmittance of this heat-resistant color filter is shown in FIG.
[0033]
<Comparative example 2>
A polystyrene was used as the organic polymer compound, and a heat resistant color filter was produced in the same manner as in Example 1.
[0034]
<Comparative Example 3>
A polyvinyl alcohol was used as the organic polymer compound, and a heat resistant color filter was produced in the same manner as in Example 1.
[0035]
<Comparative example 4>
A polyglycidyl methacrylate was used as the organic polymer compound, and a heat resistant color filter was produced in the same manner as in Example 1.
[0036]
The transmittances of the heat-resistant color filters in Comparative Examples 1 to 4 were 90% or less as shown in Table 1 at a wavelength of 450 nm.
In the above comparative example, since polystyrene and polyvinyl alcohol have tertiary carbon in the main chain, the elimination reaction of the monomer occurs like the polymethyl acrylate in comparative example 1 and carbonization proceeds, and polyglycidyl methacrylate is in the main chain. In spite of having a quaternary carbon, it has an epoxy group as a cross-linking group in the side chain, so that it is considered that the cross-linking reaction takes precedence over the main chain scission reaction.
Table 1 shows G values (Gs-Gx) of polystyrene, polyvinyl alcohol, and polyglycidyl methacrylate in Comparative Examples 1 to 4.
[0037]
【The invention's effect】
The present invention provides an inorganic pigment, a low-melting glass, which is used for producing a heat-resistant color filter composed of an inorganic pigment and glass by forming a pattern on a transparent substrate and then decomposing the organic polymer compound by heating at a high temperature. And a resin composition for a heat-resistant color filter mainly comprising an organic polymer compound, wherein the number of main chain breaks generated when 1 g of the organic polymer compound absorbs radiation of 100 eV is Gs, and the organic polymer compound 1 g Is an organic polymer in which the number of crosslinks that occur when absorbing 100 eV of radiation is Gx, the difference between the number of main chain breaks and the number of crosslinks (Gs−Gx) is the G value, and the G value of the organic polymer compound is 1 or more Because the compound is used
When manufacturing a heat-resistant color filter, in the heating process, the vaporization of the organic polymer compound is completely advanced, and the resin composition for a heat-resistant color filter that does not cause a carbonization reaction, that is, the color filter by the carbonization reaction. A resin composition for a heat resistant color filter in which the transmittance is not lowered and the spectral characteristics are not deteriorated.
[0038]
In addition, since the present invention is a heat-resistant color filter using the resin composition for heat-resistant color filters according to the above-described invention, the heat resistance is such that the transmittance of the color filter is not reduced by the carbonization reaction and the spectral characteristics are not deteriorated. It becomes a color filter.
[Brief description of the drawings]
1 is a measurement result of spectral transmittance of a heat-resistant color filter in Example 1 of the present invention and Comparative Example 1. FIG.

Claims (2)

After forming a pattern on a transparent substrate, it is heated at a high temperature to decompose the organic polymer compound to produce a heat-resistant color filter composed of an inorganic pigment and glass. Inorganic pigment, low melting glass, and organic polymer A resin composition for a heat-resistant color filter comprising a compound as a main component, wherein the number of main chain scissions generated when 1 g of the organic polymer compound absorbs 100 eV radiation is Gs, and the radiation of the organic polymer compound 1 g is 100 eV. The number of cross-links that occur when absorbing water is Gx, the difference between the number of main chain breaks and the number of cross-links (Gs−Gx) is the G value, and the organic polymer compound has an G value of 1 or more,
The resin composition for a heat-resistant color filter, wherein the organic polymer compound having a G value of 1 or more is an organic polymer compound represented by the chemical formula (2) .

A heat-resistant color filter using the heat-resistant color filter resin composition according to claim 1 .

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