JP4385578B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an imaging apparatus having a plurality of imaging modes.
[0002]
[Prior art]
Conventionally, as an additional function of an image sensor mounted on an electronic camera, a thinning-out reading function is known in which photoelectric outputs are read out at predetermined intervals. By using this thinning readout function, it is possible to reduce the number of pixels read from the image sensor and shorten the image readout time.
Such a thinning-out reading function is disclosed in detail in Patent Document 1, for example.
In an electronic camera, a smoother monitor display can be easily realized by updating and displaying an image (hereinafter referred to as “high-speed image”) obtained at high speed by the thinning-out reading function on the monitor on the back side.
In addition, the electronic camera can easily realize AF (automatic focus control) and AE (automatic exposure) that are superior in followability by detecting subject contrast and brightness from high-speed images obtained at short time intervals. You can also.
[Patent Document 1]
JP 2002-125145 A
[0003]
[Problems to be solved by the invention]
By the way, the high-speed image obtained by the thinning-out readout function described above has a sufficient amount of information for monitor display and control operation, but the amount of information is generally small for viewing and often has an insufficient resolution. .
Therefore, an object of the imaging apparatus of the present invention is to generate a high-quality high-speed image while shortening the high-speed image readout time.
[0004]
[Means for Solving the Problems]
The present invention will be described below.
[0005]
<Claim 1>
According to another aspect of the present invention, an imaging apparatus includes a plurality of light receiving elements that are two-dimensionally arranged on the light receiving surface and generate a photoelectric output corresponding to the amount of received light, and a reading unit that reads the photoelectric output generated by the light receiving element. In particular, this readout unit has a grid imaging mode in which the photoelectric output generated on the light receiving surface is sampled and read out in a grid array, and an oblique grid imaging mode in which the photoelectric output is sampled and read out in a diagonal grid array. , Grid imaging mode, and diagonal grid Imaging One of the modes is It is a low-definition imaging mode compared to the other, By one exposure and transfer operation , Add and read out the photoelectric output generated by a plurality of adjacent light receiving elements, An image is generated.
《Claims 2 》
Claim 2 The imaging apparatus according to claim 1. In In the imaging apparatus described above, the reading unit includes a grid imaging mode and an oblique grid. Imaging The sampling position of the photoelectric output of one of the modes is set as the position of the light receiving element, and the grating imaging mode and the oblique grating Imaging The other photoelectric output sampling position in the mode is an isotropic sampling position and a position between a plurality of light receiving elements.
《Claims 3 》
Claim 3 The imaging apparatus according to claim 1 or claim 2. 2 In the imaging apparatus according to the item 1, the plurality of light receiving elements are arranged in a grid on the light receiving surface. In the oblique grid imaging mode, the reading unit generates an image by performing a single exposure and transfer operation, and adds and reads out the photoelectric output of the light receiving surface for each section of the oblique grid array. The section of the lattice arrangement has two light receiving elements in the direction in which the photoelectric output is transferred.
《Claims 4 》
Claim 4 The imaging apparatus according to claim 1 or claim 2. 2 In the image pickup apparatus described in (1), the plurality of light receiving elements are arranged in an oblique grid on the light receiving surface. In the grid imaging mode, the reading unit generates an image by performing a single exposure and transfer operation, and adds and reads out the photoelectric output of the light receiving surface for each section of the grid array. The section of the grid array has two light receiving elements in the direction of the oblique grid array.
《Claims 5 》
Claim 5 The imaging apparatus of claim 3 or Claim 4 The image pickup apparatus described in 1 is characterized in that an optical low-pass filter that blurs a light image in a direction substantially orthogonal to the adding direction of photoelectric outputs is provided on the light receiving surface.
《Claims 6 》
Claim 6 The imaging apparatus of claim 3 Or claims 5 The image pickup apparatus according to any one of the above, characterized in that the light receiving surface is provided with a color filter array in which the addition sections of photoelectric outputs are arranged in substantially the same color.
《Claims 7 》
Claim 7 The imaging apparatus of claim 1 to claim 1. 6 The image pickup apparatus according to any one of the above, further comprising an image processing unit that interpolates the output of the oblique grid imaging mode and generates image data in which pixels are arranged in a grid pattern.
《Claims 8 》
Claim 8 The imaging apparatus of claim 1 to claim 1. 7 In the imaging device according to any one of the above, the reading unit described above includes a plurality of vertical CCDs, a first horizontal transfer unit, and a second horizontal transfer unit.
This vertical CCD is provided between columns of a plurality of light receiving elements along the vertical direction on the light receiving surface, and vertically transfers the photoelectric output output from the light receiving elements.
The first horizontal transfer unit is provided at one end of the plurality of vertical CCDs, and horizontally transfers the photoelectric output output from one end.
The second horizontal transfer unit is provided at the other end of the plurality of vertical CCDs, and horizontally transfers the photoelectric output output from the other end.
In particular, in these vertical CCDs, two transfer electrodes are arranged for one light receiving element. Further, the transfer electrodes are electrically cross-connected between the light receiving elements arranged in the horizontal direction as shown in FIGS. 2 and 10, for example.
《Claims 9 》
Claim 9 The imaging apparatus of claim 8 In the imaging device according to claim 1, a grating imaging mode and an oblique grating Imaging One of the modes is characterized in that photoelectric outputs generated by a plurality of adjacent light receiving elements are added by a vertical CCD.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments according to the present invention will be described below with reference to the drawings.
[0007]
<< First Embodiment >>
The first embodiment is an embodiment in which a high-speed image in an oblique lattice arrangement is read from light receiving elements in a lattice arrangement.
FIG. 1 is a block diagram showing a schematic configuration of the electronic camera 11 according to the first embodiment.
[0008]
In FIG. 1, a photographing lens 12 is attached to the electronic camera 11. On the image space side of the photographing lens 12, a mechanical shutter 14 and an image sensor 13 are arranged along the optical axis. An optical low-pass filter (OLPF) 13b and a color filter array (not shown) are arranged on the light receiving surface of the image sensor 13.
The output of the image sensor 13 is connected to the bus 18 via the A / D converter 15, the signal processor 16 and the buffer memory 17. An image processing unit 19, a recording unit 20, a microprocessor 22, and the like are connected to the bus 18.
[0009]
The microprocessor 22 controls the mechanical shutter 14, the image sensor 13, the image processing unit 19, the recording unit 20, and the like described above.
FIG. 2 is a diagram showing the internal structure of the image sensor 13 described above.
A plurality of light receiving elements 31 are arranged in a grid on the light receiving surface of the imaging element 13. On these light receiving elements 31, an on-chip microlens (not shown) and a color filter array are provided.
[0010]
As shown in FIG. 2, the color filter array is configured by arranging color filters of three colors (a color, b color, and c color). That is, a color filter of a color (for example, G color) is arranged in the light receiving elements 31 in the even-numbered columns. On the other hand, in the odd-numbered light receiving elements 31, b color (for example, B color) and c color (for example, R color) are alternately arranged with two pixels adjacent in the vertical direction as one section. In addition, it is preferable that the positions of the b color and the c color are switched for every adjacent odd row.
[0011]
On such a light receiving surface, an optical low-pass filter 13b that blurs a light image in the horizontal direction of the light receiving surface (including a case where a multiple image is formed) is disposed. The optical low-pass filter 13 b is adjusted so that the interval for shifting the optical image is substantially equal to the horizontal interval of the light receiving element 31.
A vertical CCD 33 having four-phase transfer electrodes φV <b> 1 to φV <b> 4 is provided between the columns of the light receiving elements 31. A transfer gate 32 is provided between the vertical CCD 33 and the light receiving element 31. The electrodes of the transfer gate 32 are formed by extending transfer electrodes φV1 and φV3. Further, horizontal transfer units 36a and 36b are provided at both ends of the vertical CCD 33, respectively.
[0012]
A control pulse is given from the control circuit 35 to the transfer gate 32, the vertical CCD 33, and the horizontal transfer units 36a and 36b. The control circuit 35 switches the imaging mode (grating imaging mode / diagonal grating imaging mode) by switching the output sequence of the control pulses.
FIG. 3A is a diagram showing pixel sampling points in the lattice imaging mode. In the grid imaging mode, as shown in this figure, the photoelectric output generated for each light receiving element 31 is sampled and read out in a grid array.
On the other hand, FIG. 3B is a diagram showing pixel sampling points in the oblique grid imaging mode. In the oblique grid imaging mode, as shown in this figure, the photoelectric output generated for each light receiving element 31 is sampled and read out in an oblique grid arrangement.
[0013]
[Wiring of transfer electrodes φV1 to φV4]
Hereinafter, the wiring structure of the transfer electrodes φV1 to φV4, which is an important feature of the present embodiment, will be described in detail.
The vertical CCD 33 in the image pickup device 13 is provided with two transfer electrodes corresponding to one light receiving device 31. As shown schematically in FIG. 2, the transfer electrodes arranged two by two are cross-connected between the vertical CCDs 33 adjacent in the horizontal direction. (Here, φV1 and φV2 are cross-connected, and φV3 and φV4 are cross-connected.)
As a result, the transfer electrodes are arranged in the order of φV1, φV2, φV3, and φV4 in the even columns. On the other hand, in the odd columns, the transfer electrodes are arranged in the order of φV2, φV1, φV4, and φV3.
[0014]
Due to the wiring structure of the transfer electrodes φV1 to φV4, the vertical CCD 33 has the following characteristics.
(1) In the even and odd columns, the transfer electrodes φV1 to φV4 are arranged in reverse order. (Therefore, the signal charge transfer direction is reversed between the odd and even columns.)
(2) Furthermore, the four phases of the transfer stage of the vertical CCD 33 are shifted in the column direction between the even and odd columns. For this reason, the photoelectric output addition section described later is an oblique lattice array.
[0015]
In FIG. 2, the positions of the transfer gates 32 are shifted in the odd and even columns. However, the transfer gate 32 can be aligned in the horizontal direction by shifting the odd-numbered transfer electrodes upward in FIG. Even in this state, the transfer electrodes (φV1 and φV2, φV3 and φV4) arranged two by two on the light receiving element 31 are respectively cross-connected between the vertical CCDs 33 adjacent in the horizontal direction (that is, the claims) 8 Meet the requirements).
[0016]
[Correspondence with Invention]
Hereinafter, the correspondence between the items described in each claim and this embodiment will be described.
Note that the correspondence relationship here illustrates one interpretation for reference, and does not limit the present invention.
The light receiving element described in the claims corresponds to the light receiving element 31.
The reading unit described in the claims corresponds to the transfer gate 32, the vertical CCD 33, the horizontal transfer unit 36 a, the horizontal transfer unit 36 b, and the control circuit 35.
The optical low-pass filter described in the claims corresponds to the optical low-pass filter 13b.
The color filter array described in the claims corresponds to the color filter array (see FIG. 2) disposed on the light receiving surface of the image sensor 13.
The image processing unit described in the claims corresponds to the image processing unit 19.
The vertical CCD described in the claims corresponds to the vertical CCD 33.
The first horizontal transfer path recited in the claims corresponds to the horizontal transfer unit 36a.
The second horizontal transfer path recited in the claims corresponds to the horizontal transfer unit 36b.
[0017]
[Description of operation in grid imaging mode]
Hereinafter, the operation in the grid imaging mode in the first embodiment will be described.
First, the microprocessor 22 opens the mechanical shutter 14 after performing the reset operation (discharge of unnecessary charges) of the light receiving element 31.
In this state, when a predetermined exposure time elapses, the microprocessor 22 controls the mechanical shutter 14 to close, and puts the light receiving surface of the image sensor 13 in a light-shielding state. In this light shielding state, the microprocessor 22 sends a command signal for the lattice imaging mode to the control circuit 35 in the imaging device 13.
[0018]
In accordance with the command signal for the grid imaging mode, the control circuit 35 applies a voltage exceeding the threshold voltage to the transfer electrode φV1. Then, the photoelectric output is transferred from the light receiving elements 31 in every other row to the transfer stage of the transfer electrode φV1 (see FIG. 4A).
In this state, the control circuit 35 gives control pulses for four-phase driving to the transfer electrodes φV1 to φV4. As a result, in the vertical CCDs 33 in the odd-numbered columns, every other row of photoelectric outputs is sequentially transferred vertically toward the horizontal transfer unit 36a. The horizontal transfer section 36a takes in one row of photoelectric outputs output from the odd-numbered vertical CCDs 33. In this state, the control circuit 35 gives a horizontal transfer control pulse to the horizontal transfer unit 36a, and sequentially transfers the photoelectric output horizontally. By repeating such an operation, the horizontal transfer unit 36a outputs an image signal corresponding to the photoelectric output of the odd-numbered columns.
[0019]
On the other hand, in the even-numbered vertical CCDs 33, the photoelectric outputs are sequentially vertically transferred toward the horizontal transfer unit 36b. The horizontal transfer unit 36b captures the photoelectric output output from the even-numbered vertical CCDs 33 in units of rows. In this state, the control circuit 35 gives a horizontal transfer control pulse to the horizontal transfer section 36b, and sequentially transfers the photoelectric output horizontally. With this operation, the horizontal transfer unit 36b outputs an image signal corresponding to the photoelectric output of the even-numbered columns.
[0020]
By such a transfer operation, the image signals of the first field (image signals every other row) are read out in parallel by dividing into even columns and odd columns.
The image signals read out in parallel in this way are processed in parallel via the A / D conversion unit 15 and the signal processing unit 16 and then temporarily recorded in the buffer memory 17.
Next, the control circuit 35 performs the same reading operation on the image signal of the second field (the remaining image signals every other row).
[0021]
By such two times of interlaced transfer, image data in which pixels are arranged in a grid is stored in the buffer memory 17.
The image processing unit 19 performs two-dimensional image processing such as color interpolation processing and pixel interpolation while exchanging the image data in the buffer memory 17 via the bus 18. The image data that has been subjected to image processing in this way is compressed and stored in the memory card 21 via the recording unit 20.
[0022]
[Features of grid imaging mode]
Here, the feature points of the above-described grid imaging mode will be described.
FIG. 5 is a diagram showing a color arrangement of image data read out in the lattice imaging mode. FIG. 6 is a diagram showing apertures in the lattice imaging mode.
Due to the image blurring effect of the optical low-pass filter 13b, the aperture in the lattice imaging mode has a shape in which two apertures of the on-chip microlens are connected in the horizontal direction.
[0023]
As a result, the aperture of the a color component covers the light receiving surface with almost no gap as shown in FIG. On the other hand, the b-color and c-color apertures similarly cover the light receiving surface.
As described above, since the aperture efficiently covers the light receiving surface, it is possible to sufficiently suppress the false signal (false color or the like) using only the optical low-pass filter 13b in only one direction. Therefore, the optical low-pass filter 13b can be thinned, and the optical performance of the electronic camera 11 can be further improved.
In this embodiment, parallel reading is performed by dividing the photoelectric output into even columns and odd columns. As a result, excellent effects such as shortening the image reading time and reducing the horizontal transfer frequency of the image sensor 13 can be obtained.
[0024]
[Explanation of operation in oblique grid imaging mode]
Next, the operation in the oblique grid imaging mode in the first embodiment will be described.
The microprocessor 22 sends a command signal for the oblique grid imaging mode to the control circuit 35 in the imaging device 13. In accordance with this command signal, the control circuit 35 performs electronic shutter control of the image sensor 13. (At this time, the microprocessor 22 may control the exposure time by using the mechanical shutter 14 together.)
When a predetermined exposure time has elapsed, the control circuit 35 applies a voltage exceeding the threshold voltage to the transfer electrodes φV1 and φV3. Then, the photoelectric output of the light receiving element 31 is transferred to the transfer stages φV1 and φV3 via the transfer gate 32. In this state, the control circuit 35 applies a voltage to the transfer electrode φV2 to connect the potential wells immediately below the transfer electrodes φV1 to φV3. As a result, the photoelectric output is added for each section of the oblique lattice as shown by the dotted line in FIG. 4B in the connected potential well. Hereinafter, the photoelectric output after the addition is referred to as “composite output”.
[0025]
Subsequently, the control circuit 35 gives four-phase drive control pulses to the transfer electrodes φV1 to φV4. At this time, in the odd-numbered vertical CCDs 33, the combined output is vertically transferred toward the horizontal transfer unit 36a. The horizontal transfer unit 36a takes in the combined output output from the odd-numbered vertical CCDs 33 in units of rows. In this state, the control circuit 35 gives a horizontal transfer control pulse to the horizontal transfer unit 36a, and sequentially transfers the combined output. By such an operation, the horizontal transfer unit 36a outputs an image signal corresponding to the odd-numbered composite output.
[0026]
On the other hand, in the vertical CCDs 33 in the even columns, the combined output is vertically transferred reversely toward the horizontal transfer unit 36b. The horizontal transfer unit 36b captures the combined output output from the even-numbered vertical CCDs 33 in units of rows. In this state, the control circuit 35 gives a horizontal transfer control pulse to the horizontal transfer unit 36b, and sequentially transfers the combined output. By such an operation, the horizontal transfer unit 36b outputs an image signal corresponding to the combined output of the even-numbered columns.
[0027]
By such a series of transfer operations, an image signal (that is, a high-speed image) in which pixels are arranged in an oblique grid is read out in parallel in an even column and an odd column. These image signals are processed in parallel via the A / D conversion unit 15 and the signal processing unit 16 and then temporarily recorded in the buffer memory 17.
The image processing unit 19 performs two-dimensional image processing such as color interpolation processing and pixel interpolation on the high-speed image in the buffer memory 17. The high-speed image that has been subjected to the image processing in this way is compressed and stored in the memory card 21 via the recording unit 20.
This high-speed image is used for monitor display and control operation in addition to the above-described use as a stored image.
[0028]
[Characteristics of oblique grid imaging mode]
Here, the characteristic points of the oblique grid imaging mode described above will be described.
FIG. 7 is a diagram showing a color arrangement of the composite output read in the oblique grid imaging mode.
FIG. 8 is a diagram illustrating an aperture in the oblique grid imaging mode.
The aperture in the oblique grid imaging mode is expanded to a range of 2 × 2 apertures of the on-chip microlens by “photoelectric output addition processing” and “image blurring effect of the optical low-pass filter 13b”. At this time, the a-color aperture covers the entire light-receiving surface with almost no gap. On the other hand, the b-color and c-color apertures cover the light-receiving surface in a checkered pattern.
[0029]
As described above, since the aperture covers the light receiving surface efficiently, it is possible to sufficiently suppress the false signal (false color or the like) with only the optical low-pass filter 13b in only one direction as in the above-described grating imaging mode. become.
In particular, the aperture at this time is substantially square as shown in FIG. 8, and is very isotropic. Therefore, it is possible to obtain image data having a uniform resolution in the vertical and horizontal directions.
[0030]
Furthermore, since the apertures are arranged in a diagonal lattice, the shortest vertical and horizontal intervals at the center of the aperture are substantially equal to the horizontal and vertical intervals of the light receiving elements 31. Therefore, although the total number of pixels is halved compared to the lattice imaging mode described above, a high-speed image with a large amount of information in the horizontal and vertical directions and an excellent resolution can be obtained.
Further, the color arrangement of the apertures shown in FIG. 8 is equivalent to the pixel arrangement of the two-plate type image pickup apparatus (G image pickup device and RB checkered image pickup device arranged in a pixel-shifted state). Further, the color arrangement of the apertures shown in FIG. 8 is equivalent to the color arrangement in which the Bayer arrangement is inclined 45 degrees. Therefore, as a color interpolation process in the grid imaging mode, an image of a grid array can be formed by interpolating a diagonal grid by a known color interpolation process with a Bayer array and then interpolating the missing grid points by the diagonal grid formation. . Of course, it is also possible to directly interpolate the lattice points that have been lost due to the oblique lattice formation.
[0031]
Furthermore, in this embodiment, the synthesized output is divided into even columns and odd columns and read in parallel. In addition, the total number of pixels in the oblique grid imaging mode is halved compared to the grid imaging mode. Therefore, in the above-described oblique grid imaging mode, it is possible to reduce the time required for image reading by half.
[0032]
In the present embodiment, a high-speed image having an oblique lattice arrangement is obtained. When this high-speed image is used for monitor display, a monitor display image may be generated by picking up pixels corresponding to the grid position from among the diagonal grid pixels. By such processing, it is possible to generate grid array data for monitor display at high speed from a high-speed image of a diagonal grid array.
Next, another embodiment will be described.
[0033]
<< Second Embodiment >>
The second embodiment relates to a monochrome electronic camera. The hardware configuration of this electronic camera is the same as that of the first embodiment except that the color filter array is omitted. The optical low-pass filter 13b may be provided according to the purpose such as moire removal or may be omitted. Therefore, here, the reference numerals of the constituent elements common to the first embodiment are used as they are, and the duplicated explanation regarding the configuration is omitted.
[0034]
[Description of grid imaging mode]
Hereinafter, the monochrome grid imaging mode will be described.
In the grid imaging mode, a monochrome image signal in which pixels are arranged in a square grid is read out through two interlace transfers. Also in this transfer operation, as in the first embodiment (FIG. 4A), the photoelectric output is read in parallel by dividing into even columns and odd columns. As a result, even in the grid imaging mode of the second embodiment, effects such as shortening the image reading time and reducing the horizontal transfer frequency of the imaging device 13 can be obtained.
The monochrome image signal read out in this way is converted into monochrome image data via the A / D converter 15 and the signal processor 16. This monochrome image data is compressed and stored in the memory card 21 by the recording unit 20.
[0035]
[Description of oblique grid imaging mode]
Hereinafter, an operation of reading a monochrome high-speed image using the oblique grid imaging mode will be described.
In the oblique grid imaging mode, first, the photoelectric output is added for each section of the oblique grid array shown in FIG. 9A on the light receiving surface. The high-speed image generated by the addition process is read from the image sensor 13 by progressive transfer.
Also in this transfer operation, similarly to the first embodiment (FIG. 4B), the combined output whose number has been reduced in advance is read out in parallel for the even and odd columns. As a result, even in the oblique grid imaging mode of the second embodiment, excellent effects such as remarkably shortening the image readout time for high-speed images can be obtained.
FIG. 9B is a diagram showing the state of the closest sampling point of this high-speed image. When the pixel pitch of the light receiving element 31 is P, the oblique pitch of the nearest sampling point is √2 · P.
[0036]
At this time, the shortest interval between the closest sampling points in the vertical and horizontal directions is equal to the pitch P of the light receiving elements 31. Therefore, although the total number of pixels is halved compared to the lattice imaging mode described above, the amount of information in the vertical and horizontal directions is large, and image data with excellent resolution can be obtained. For example, in the case of an image having a vertical stripe or a horizontal stripe, it is possible to achieve a resolution equivalent to that in the lattice imaging mode.
[0037]
FIG. 9C is a diagram illustrating a pixel array of an image signal output in the oblique grid imaging mode. The image processing unit 19 reads out the pixel array of the diagonal grid and interpolates the pixel located at the center of the diagonal grid.
FIG. 9D shows the pixel array after this interpolation. As an interpolation method in this case, an interpolation method in which the upper, lower, left and right pixels are simply averaged may be used. Further, an interpolation method that determines the local similarity of images and increases the weighting of the similar direction may be used.
[0038]
By the way, the interpolated image shown in FIG. 9 (D) has a large image size (number of vertical and horizontal pixels) because the original number of pixels is doubled, and although it is superior in resolution, it is heavy as image processing. In addition, there is a disadvantage that the memory consumption is large. Therefore, the image processing unit 19 may be provided with a mode in which the interpolation image is scaled (in this case, 3/4 times in the vertical and horizontal directions) up to the number of pixels corresponding to the amount of information (for example, around the number of sampled pixels) in normal use. Efficient.
[0039]
FIG. 9E is a diagram showing a pixel array after such a scaling process. As such a scaling process, a bicubic method, a bilinear method, a nearest neighbor method, or another interpolation method can be used. Further, by directly using these interpolation methods for the diagonal lattice arrangement shown in FIG. 9C, the image of FIG. 9E can be directly generated without going through the state of FIG. 9D. May be.
[0040]
The high-speed image subjected to the scaling process in this way is compressed and stored in the memory card 21 by the recording unit 20.
Note that the high-speed image here can be used for monitor display, control operation, and the like in addition to the above-described use as a stored image.
Next, another embodiment will be described.
[0041]
<< Third Embodiment >>
The third embodiment is an embodiment in which a high-speed image of a grid arrangement is read from light receiving elements arranged in an oblique grid.
A feature of the electronic camera in the third embodiment is that the image sensor 13 shown in FIG. 1 is replaced with an image sensor 50 shown in FIG. Since other hardware configurations are the same as those in the first embodiment, description thereof is omitted here.
[0042]
Hereinafter, the configuration of the image sensor 50 will be described with reference to FIG.
On the light receiving surface of the image sensor 50, the light receiving elements 51 are arranged at oblique lattice positions. On the light receiving element 51, an on-chip microlens (not shown) and a color filter array are arranged. The color arrangement of this color filter array is equal to the color arrangement obtained by inclining the color filter array of the first embodiment (FIG. 5) at an angle of 45 degrees.
[0043]
An optical low-pass filter is disposed on the color filter array. The image blurring direction of this optical low-pass filter is substantially orthogonal to the adding direction described later. Further, the interval at which the optical image of the optical low-pass filter is shifted is substantially equal to the oblique pitch of the light receiving elements 51.
A plurality of separation regions (channel stops) 54 are provided on the light receiving surface. These separation regions 54 divide the light receiving elements 51 into zigzag rows.
[0044]
A vertical CCD 53 having four-phase transfer electrodes φV <b> 1 to φV <b> 4 is provided so as to be sandwiched between adjacent separation regions 54. The vertical CCD 53 is configured by connecting transfer stages to the gaps between the light receiving elements 51 arranged in a zigzag pattern.
Further, a transfer gate 52 is provided between the light receiving element 51 and the vertical CCD 53. These transfer gates 52 are formed by extending the transfer electrode φV1 and the transfer electrode φV3 to the light receiving element 51. Further, horizontal transfer units 56 a and 56 b are provided at both ends of the vertical CCD 53, respectively.
[0045]
A control pulse is supplied from the control circuit 55 to the transfer gate 52, the vertical CCD 53, and the horizontal transfer units 56a and 56b. The control circuit 55 switches the imaging mode (oblique grid imaging mode / grid imaging mode) by switching the output sequence of control pulses.
FIG. 11A is a diagram illustrating pixel sampling points in the oblique grid imaging mode. In the oblique grid imaging mode, as shown in this figure, the photoelectric output generated for each light receiving element 51 is sampled and read out in an oblique grid arrangement.
On the other hand, FIG. 11B is a diagram illustrating pixel sampling points in the lattice imaging mode. In the grid imaging mode, as shown in this figure, the photoelectric output generated for each light receiving element 51 is sampled and read out in a grid array.
[0046]
[Wiring of transfer electrodes φV1 to φV4]
Hereinafter, the wiring structure of the transfer electrodes φV1 to φV4, which is an important feature of the present embodiment, will be described in detail.
Two transfer electrodes are provided on the vertical CCD 53 in the image sensor 13 corresponding to one light receiving element 51. As shown schematically in FIG. 10, the two transfer electrodes arranged two by two are cross-connected between the vertical CCDs 53 adjacent in the horizontal direction. (Here, φV1 and φV2 are cross-connected, and φV3 and φV4 are cross-connected. For the sake of easy understanding, FIG. 10 schematically illustrates the state of the crossing. (It is preferably performed within the width of (channel stop). Such a structure can effectively prevent disturbance of the potential well due to the intersection.)
As a result, the transfer electrodes are arranged in the order of φV1, φV2, φV3, and φV4 in the even columns. On the other hand, in the odd columns, the transfer electrodes are arranged in the order of φV2, φV1, φV4, and φV3.
As a result, the arrangement order of the transfer electrodes φV1 to φV4 is reversed in the even and odd columns. (Therefore, the signal charge transfer direction is reversed between the odd and even columns.)
[0047]
[Correspondence with Invention]
Hereinafter, the correspondence between the items described in each claim and this embodiment will be described.
Note that the correspondence relationship here illustrates one interpretation for reference, and does not limit the present invention.
The light receiving element described in the claims corresponds to the light receiving element 51.
The reading unit described in the claims corresponds to the transfer gate 52, the vertical CCD 53, the horizontal transfer units 56 a and 56 b, and the control circuit 55.
The color arrangement of the color filter array described in the claims is as shown in FIG.
The optical low-pass filter described in the claims corresponds to the optical low-pass filter disposed on the light receiving surface of the image sensor 50.
The color filter array described in the claims corresponds to the color filter array (see FIG. 10) disposed on the light receiving surface of the image sensor 50.
The image processing unit described in the claims corresponds to the image processing unit 19.
The vertical CCD described in the claims corresponds to the vertical CCD 53.
The first horizontal transfer path recited in the claims corresponds to the horizontal transfer unit 56a.
The second horizontal transfer path recited in the claims corresponds to the horizontal transfer unit 56b.
[0048]
[Description of operation in grid imaging mode]
Hereinafter, the operation of the grid imaging mode in the imaging device 50 will be described with reference to FIG.
The microprocessor 22 sends a command signal for the grid imaging mode to the control circuit 55 in the imaging device 50. In accordance with this command signal, the control circuit 55 performs electronic shutter control of the image sensor 50. (At this time, the microprocessor 22 may control the exposure time by using the mechanical shutter 14 together.)
When a photoelectric exposure is accumulated in the light receiving element 51 after a predetermined exposure time has elapsed, the control circuit 55 applies a voltage exceeding the threshold voltage to the transfer electrodes φV1 and φV3. Then, the photoelectric output of the light receiving element 51 is transferred to the transfer stages φV1 and φV3 via the transfer gate 52. In this state, the control circuit 55 applies a voltage to φV2 to connect the potential wells immediately below the transfer electrodes φV1 to φV3. As a result, the photoelectric outputs are added for each section of the lattice arrangement in the connected potential wells, and a combined output as shown in FIG. 12 is generated.
[0049]
Subsequently, the control circuit 55 gives a control pulse for four-phase driving to the transfer electrodes φV1 to φV4. At this time, in the vertical CCD 53 in the odd-numbered column, the combined output is vertically transferred toward the horizontal transfer unit 56a. The horizontal transfer unit 56a takes in the combined output output from the vertical CCD 53 in the odd-numbered columns for one row. In this state, the control circuit 55 gives a horizontal transfer control pulse to the horizontal transfer section 56a, and sequentially transfers the combined output. By repeating such an operation, the horizontal transfer unit 56a outputs an image signal corresponding to the combined output of the odd columns.
[0050]
On the other hand, in the vertical CCD 53 in the even-numbered column, the combined output is sequentially vertically transferred toward the horizontal transfer unit 56b. The horizontal transfer unit 56b captures the combined output output from the vertical CCD 53 in the even-numbered columns in units of rows. In this state, the control circuit 55 gives a horizontal transfer control pulse to the horizontal transfer section 56b, and sequentially transfers the combined output. By such an operation, the horizontal transfer unit 56b outputs an image signal corresponding to the combined output of the even-numbered columns.
[0051]
By such a transfer operation, an image signal in which pixels are arranged in a grid (that is, a high-speed image) is read out in parallel by dividing into even columns and odd columns. These image signals are processed in parallel via the A / D conversion unit 15 and the signal processing unit 16 and then temporarily recorded in the buffer memory 17. The image processing unit 19 performs two-dimensional image processing such as color interpolation processing on the high-speed image in the buffer memory 17. The image data that has undergone such image processing is compressed and stored in the memory card 21 via the recording unit 20.
Note that the high-speed image here can be used for monitor display, control operation, and the like in addition to the above-described use as a stored image.
[0052]
[Features of grid imaging mode]
FIG. 13 is a diagram showing apertures in the lattice imaging mode.
The aperture in the lattice imaging mode is expanded to a range corresponding to four apertures of the on-chip microlens by “photoelectric output addition processing” and “image blurring effect of the optical low-pass filter”. At this time, the a-color aperture covers the entire light-receiving surface with almost no gap. On the other hand, the b-color and c-color apertures cover the light-receiving surface in a checkered pattern.
[0053]
As described above, since the aperture covers the light receiving surface efficiently, it is possible to sufficiently suppress the false signal (false color or the like) using only the optical low-pass filter of only one direction.
Furthermore, as shown in FIG. 13, the aperture shape is substantially rhombus, which is very isotropic. Therefore, a high-speed image with a uniform resolution in the vertical and horizontal directions can be obtained.
[0054]
The aperture color arrangement shown in FIG. 12 is equivalent to the pixel arrangement of the two-plate type imaging device (G color imaging device and RB checkered imaging device arranged in a pixel-shifted state). Also, the aperture color array shown in FIG. 12 is equivalent to the Bayer color array. Therefore, it is possible to employ a sophisticated color interpolation process performed by a two-plate image pickup apparatus or a Bayer array as the color interpolation process in the grid imaging mode.
[0055]
In the present embodiment, the high-speed image is divided into even columns and odd columns and read out in parallel. Further, in this grid imaging mode, the total number of pixels is halved by the addition process on the light receiving surface. Therefore, in the grid imaging mode of the third embodiment, it is possible to significantly shorten the time required for high-speed image reading.
Furthermore, in this embodiment, a high-speed image of a lattice arrangement is obtained. Therefore, the image can be stored as it is without converting the pixel arrangement of the high-speed image. Further, if necessary, an image for monitor display can be generated by simply scaling the high-speed image.
[0056]
[Explanation of operation in oblique grid imaging mode]
Subsequently, the operation of the oblique grid imaging mode in the third embodiment will be described.
First, after the mechanical shutter 14 is closed, the microprocessor 22 sends a command signal for the oblique grid imaging mode to the control circuit 55 in the imaging device 50.
In accordance with the command signal for the oblique grid imaging mode, the control circuit 55 applies a voltage exceeding the threshold voltage to the transfer electrode φV1. Then, the photoelectric output of the light receiving element 51 adjacent to the transfer electrode φV1 is transferred to the transfer stage of the transfer electrode φV1 via the transfer gate 52. In this state, the control circuit 55 drives the vertical CCD 53 and the horizontal transfer units 56a and 56b, and reads out the photoelectric output on the vertical CCD 53 in an odd number column and an even number column in parallel.
[0057]
By such a transfer operation, the image data of the first field is first read out. The image data of the first field is processed through the A / D converter 15 and the signal processor 16 and then temporarily recorded in the buffer memory 17.
Subsequently, the control circuit 55 performs a similar reading operation for the remaining second field image data.
[0058]
The image data shown in FIG. 14 is accumulated in the buffer memory 17 through such two interlace transfers.
The image processing unit 19 performs two-dimensional image processing such as color interpolation processing and pixel interpolation on the image data in the buffer memory 17. The image data that has been subjected to image processing in this way is compressed and stored in the memory card 21 via the recording unit 20.
[0059]
[Characteristics of oblique grid imaging mode]
FIG. 15 is a diagram illustrating an aperture in the oblique grid imaging mode.
Due to the image blurring effect of the optical low-pass filter, the aperture in the oblique grating imaging mode has a shape in which two apertures of the on-chip microlens are connected in an oblique direction.
[0060]
As a result, the aperture of the a color component covers the light receiving surface with almost no gap. On the other hand, b-color and c-color apertures also cover the light-receiving surface. Since the aperture efficiently covers the light receiving surface in this manner, it is possible to sufficiently suppress false signals (false colors, etc.) with only an optical low-pass filter in only one direction.
Furthermore, in this embodiment, photoelectric outputs are read out in parallel by dividing into even and odd columns. As a result, effects such as shortening the image readout time in the oblique grid imaging mode can be obtained.
Next, another embodiment will be described.
[0061]
<< Fourth Embodiment >>
The fourth embodiment relates to a monochrome electronic camera. The hardware configuration of this electronic camera is the same as that obtained by omitting the color filter array and the optical low-pass filter from the third embodiment. Therefore, here, the reference numerals of the constituent elements common to the third embodiment are used as they are, and the duplicated explanation regarding the configuration is omitted.
[0062]
[Description of grid imaging mode]
Hereinafter, the lattice imaging mode will be described.
In the grid imaging mode, first, on the light receiving surface, the photoelectric output is added for each section of the grid array shown in FIG. The high-speed image generated by this addition processing is progressively transferred into even columns and odd columns and read from the image sensor 13.
[0063]
FIG. 16B is a diagram showing the state of the closest sampling point of this high-speed image. Assuming that the diagonal pitch of the light receiving elements 51 is P, the horizontal interval and the vertical interval of the nearest sampling points are √2 · P.
FIG. 16C is a diagram showing the state of addition division of this high-speed image.
FIG. 16D is a diagram illustrating a state of pixel arrangement of a high-speed image.
In this case, the high-speed image has a square arrangement. When high-definition images are processed by a powerful external processing device (such as a personal computer) and high-speed images are processed by an in-camera ASIC (specific application IC), the fact that the high-speed images are square array does not complicate ASIC processing. There are advantages in terms.
[0064]
[Description of oblique grid imaging mode]
Next, the oblique grid imaging mode will be described.
In the oblique grid imaging mode, a monochrome image signal in which pixels are arranged in an oblique grid is read through two interlace transfers.
FIG. 17A shows the sampling position of this monochrome image signal.
[0065]
FIG. 17B is a diagram showing the state of the closest sampling point of this monochrome image data.
When the diagonal pitch of the light receiving elements 51 is P, the diagonal interval between the nearest sampling points is P. On the other hand, the horizontal and vertical distances of the nearest sampling points are as short as about P / √2. Therefore, the amount of information in the vertical and horizontal directions is larger than that of a lattice arrangement having the same number of pixels, and image data with excellent vertical and horizontal resolution can be obtained.
[0066]
The image processing unit 19 interpolates the pixel located at the center of the diagonal grid with respect to the monochrome image data of the diagonal grid.
FIG. 17C is a diagram illustrating a pixel array after such an interpolation process. As an interpolation method in this case, an interpolation method that averages up, down, left, and right pixels may be used. Further, an interpolation method may be used in which local similarity of images is determined and weighting in the similar direction is increased to obtain a weighted average.
[0067]
Incidentally, the interpolated image shown in FIG. 17C simply doubles the original number of pixels, so that the resolution is better, but the image size (number of vertical and horizontal pixels) is large for the original amount of information. Therefore, the image processing unit 19 scales the interpolated image up to the number of pixels commensurate with the amount of information (for example, about the number of pixels sampled) (for example, 3/4 times in length and width) to reduce the image. It is preferable to provide it.
[0068]
FIG. 17D is a diagram illustrating a pixel array after such a scaling process. As such a scaling process, it is preferable to use a bicubic method, a bilinear method, a nearest neighbor method, or another interpolation method to generate pixel values at the lattice positions in FIG. Note that the pixel values at the lattice positions in FIG. 17D may be generated directly by using these interpolation methods for the diagonal lattice arrangement shown in FIG.
The monochrome image data subjected to the scaling process in this way is compressed and stored in the memory card 21 by the recording unit 20.
[0069]
<< Additional items of embodiment >>
In the embodiment described above, the case of using a color filter array of three colors has been described. However, the present invention is not limited to this. For example, as shown in FIG. 18 or FIG. 19, a color filter array in which four colors are arranged may be used.
[0070]
Further, in the above-described embodiment, the photoelectric output addition sections are arranged in the same color.
However, the present invention is not limited to this. For example, different colors (a1, a2, etc.) may be arranged in the addition section of the photoelectric output as in the color arrangement shown in parentheses in FIGS. In this case, in the high-definition imaging mode, more color information can be obtained, and a subtle color difference can be reproduced in the captured image.
[0071]
In the above-described embodiment, two photoelectric outputs are added to generate a combined output. Therefore, the addition process in the image sensor is simple, and the high-speed image readout sequence can be simplified. However, the present invention is not limited to this. For example, three or more photoelectric outputs may be added to generate a combined output.
[0072]
In the embodiment described above, the photoelectric outputs are added on the vertical CCDs 33 and 53. However, the present invention is not limited to this. For example, a configuration in which photoelectric outputs are added on the horizontal transfer unit is also possible.
[0073]
In the above-described embodiment, the control circuits 35 and 55 are built in the image sensors 13 and 50. However, the present invention is not limited to this. For example, the control circuits 35 and 55 may be provided separately from the imaging elements 13 and 50. In this case, the functions of the control circuits 35 and 55 can be partly or wholly assigned to the microprocessor 22 in the electronic camera 11.
[0074]
In the above-described embodiment, the CCD image sensor has been described. However, the present invention is not limited to this. For example, the present invention may be applied to an XY address type (CMOS type or the like) imaging device.
[0075]
In the above-described embodiments (FIGS. 2 and 10), wirings connecting two transfer electrodes are actually crossed in adjacent vertical CCDs. However, the present invention is not limited to such a wiring pattern. The “cross connection” of the present invention is a term that specifies the electrical state of the transfer electrode. Therefore, by detouring or routing the wiring, the electrical state of the transfer electrode is claimed even if the wiring does not seem to intersect. 8 If the requirement of “cross connection” described in the above is satisfied, it is within the scope of the present invention.
[0076]
By the way, in the high-speed image mentioned above, the low-pass effect is produced by the pixel addition process. Therefore, false colors and moire can be effectively suppressed only by applying an optical low-pass filter only in a direction in which the low-pass effect by this addition is insufficient (for example, a direction substantially orthogonal to the pixel addition direction). Therefore, compared with a conventional product that requires an optical low-pass filter that blurs an image in two directions, the thickness and number of optical low-pass filters can be reduced in this embodiment. Costs can be reduced.
[0077]
Furthermore, in the above-described embodiment, the directions in which false colors and moire can be effectively suppressed are substantially the same in the high-definition image and the high-speed image. Therefore, the present embodiment has an excellent feature that false colors and moire can be satisfactorily suppressed in both modes while using a common optical low-pass filter for high-speed images and high-definition images. .
[0078]
The present invention can be implemented in various other forms without departing from the spirit or main features thereof. For this reason, the above-described embodiments are merely examples in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the scope of claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.
[0079]
【The invention's effect】
The conventional thinning-out reading function thins out the pixel array of the grid array to obtain a high-speed image of the same grid array. For this reason, the information amount of the image is simply reduced in the vertical and horizontal directions, resulting in a high-speed image with insufficient resolution.
However, the imaging apparatus of the present invention can select a grid imaging mode in which photoelectric output generated on the light receiving surface is sampled and read out in a grid array and an oblique grid imaging mode in which photoelectric output is sampled and read out in an oblique grid array. Prepare.
[0080]
Therefore, of these two types of imaging modes, the one with the smaller number of pixels in the readout image can be used as the imaging mode for high-speed images. In this case, the high-speed image can be read from the light receiving surface in a short time because the number of pixels decreases in the process of reading the image from the light receiving surface.
[0081]
In the conventional thinning-out reading function, the pixel array of the lattice array is thinned out to obtain a thinned image of the lattice array. For example, in the conventional example, if every other pixel is thinned out in the vertical direction, a thinned image having a pixel number of 1/2 is obtained. In this case, the number of pixels in the vertical direction is unilaterally reduced, and the resolution in the vertical and horizontal directions becomes uneven. On the other hand, if every other pixel is thinned out in the horizontal direction, a thinned image of 1/2 the number of pixels can be obtained. Also in this case, the number of pixels in the horizontal direction is reduced unilaterally, and the resolution in the vertical and horizontal directions becomes uneven. On the other hand, if every other pixel is thinned out in the vertical and horizontal directions, a uniform resolution is obtained in the vertical and horizontal directions. However, the number of pixels falls to ¼, and the entire image is reduced compared to a thinned image with half the number of pixels. The resolution will be reduced.
[0082]
However, in the imaging apparatus of the present invention, one imaging mode is a grid arrangement, and the other imaging mode is an oblique grid arrangement. Therefore, even if the number of pixels on one side is, for example, ½ of the number on the other side, a high-quality image with isotropic resolution can be obtained in both imaging modes.
[0083]
In particular, when the high pixel number mode is a lattice arrangement and the low pixel number mode is an oblique lattice arrangement, even if the image is in the low pixel number mode, high resolution can be obtained by limiting it to the vertical and horizontal directions. It becomes possible. This is due to the fact that in the diagonal lattice arrangement, the vertical row spacing or the horizontal column spacing is dense. Considering that the frequency of vertical lines and horizontal lines is high in a general shooting situation, it is possible to obtain a high resolution feeling in the low pixel number mode.
[0084]
On the other hand, when the low pixel number mode is a lattice arrangement and the high pixel number mode is an oblique lattice arrangement, the resolution in the vertical and horizontal directions in the high pixel number mode is greater than the pixel number ratio of the low pixel number mode. Can be increased. Considering the high frequency of vertical and horizontal lines in a general shooting situation, there is an advantage that a very high resolution can be obtained in the high pixel number mode.
[Brief description of the drawings]
FIG. 1 is a block diagram illustrating a schematic configuration of an electronic camera.
FIG. 2 is a diagram showing an image sensor 13;
FIG. 3 is a diagram illustrating pixel sampling points in a grid imaging mode and an oblique grid imaging mode.
FIG. 4 is a diagram illustrating a transfer operation of the image sensor.
FIG. 5 is a diagram showing a color arrangement of image data read out in a lattice imaging mode.
FIG. 6 is a diagram illustrating an aperture in a lattice imaging mode.
FIG. 7 is a diagram illustrating a color arrangement of a composite output read out in an oblique grid imaging mode.
FIG. 8 is a diagram illustrating an aperture in an oblique grid imaging mode.
FIG. 9 is a diagram for explaining the operation of the second embodiment;
10 is a diagram showing an image sensor 50. FIG.
FIG. 11 is a diagram illustrating pixel sampling points in an oblique grid imaging mode and a grid imaging mode.
FIG. 12 is a diagram illustrating a color arrangement of a composite output read out in a lattice imaging mode.
FIG. 13 is a diagram illustrating an aperture in a lattice imaging mode.
FIG. 14 is a diagram showing a color arrangement of image data read out in an oblique grid imaging mode.
FIG. 15 is a diagram illustrating an aperture in an oblique grid imaging mode.
FIG. 16 is a diagram for explaining an operation in a grid imaging mode in the fourth embodiment.
FIG. 17 is a diagram illustrating an operation in an oblique grid imaging mode in the fourth embodiment.
FIG. 18 is a diagram illustrating an example of a four-color arrangement.
FIG. 19 is a diagram illustrating an example of a four-color arrangement.
[Explanation of symbols]
11 Electronic camera
12 Shooting lens
13 Image sensor
13b Optical low-pass filter
14 Mechanical shutter
15 A / D converter
16 Signal processor
17 Buffer memory
18 Bus
19 Image processing section
20 Recording section
22 Microprocessor
31 Light receiving element
32 Transfer gate
33 Vertical CCD
35,55 Control circuit
36a, 36b Horizontal transfer section
50 Image sensor
51 Light receiving element
53 Vertical CCD
54 Separation area
56a, 36b Horizontal transfer section

Claims (9)

A plurality of light receiving elements that are two-dimensionally arranged on the light receiving surface and generate photoelectric outputs according to the amount of received light;
A readout unit for reading out the photoelectric output generated by the light receiving element;
The reading unit is selectable between a grid imaging mode in which the photoelectric output generated on the light receiving surface is sampled and read out in a grid array and an oblique grid imaging mode in which the photoelectric output is sampled and read out in an oblique grid array. And
One of the grid imaging mode and the oblique grid imaging mode is a low-definition imaging mode compared to the other, and is generated by a plurality of adjacent light receiving elements by a single exposure and transfer operation. An imaging apparatus characterized by adding and reading out photoelectric outputs to generate an image. The imaging device according to claim 1,
The readout unit sets the sampling position of the photoelectric output in one of the grid imaging mode and the oblique grid imaging mode as the position of the light receiving element, and the grid imaging mode and the diagonal grid imaging mode. An imaging apparatus, wherein the other photoelectric output sampling position is an isotropic sampling position and a position between the plurality of light receiving elements. In the imaging device according to claim 1 or 2 ,
The plurality of light receiving elements are arranged in a grid on the light receiving surface,
The readout unit generates an image by one exposure and transfer operation in the oblique grid imaging mode, and reads out the photoelectric output of the light receiving surface by adding for each section of the oblique lattice arrangement,
The section of the lattice arrangement has two light receiving elements in a direction in which the photoelectric output is transferred. In the imaging device according to claim 1 or 2 ,
The plurality of light receiving elements are arranged obliquely on the light receiving surface,
In the grid imaging mode, the reading unit generates an image by a single exposure and transfer operation, reads out the photoelectric output of the light receiving surface for each section of the grid array,
The section of the lattice arrangement has two light receiving elements in the direction of the oblique lattice arrangement. In the imaging device according to claim 3 or 4 ,
An image pickup apparatus comprising: an optical low-pass filter that blurs an optical image in a direction substantially orthogonal to the addition direction of the photoelectric outputs. The imaging apparatus according to any one of claims 3 to 5,
An image pickup apparatus comprising: a color filter array on the light receiving surface in which the photoelectric output addition sections are arranged in substantially the same color. The imaging device according to any one of claims 1 to 6 ,
An imaging apparatus comprising: an image processing unit that generates an image data in which pixels are arranged in a grid by interpolating the output of the oblique grid imaging mode. The imaging device according to any one of claims 1 to 7 ,
The reading unit
A plurality of vertical CCDs that are provided between the plurality of light receiving elements along the vertical direction on the light receiving surface and vertically transfer the photoelectric output output from the light receiving elements;
A first horizontal transfer unit that is provided at one end of the vertical CCD and horizontally transfers the photoelectric output output from the one end;
A second horizontal transfer unit provided at the other end of the vertical CCD and horizontally transferring the photoelectric output output from the other end;
The vertical CCD has two transfer electrodes for each light receiving element, and the transfer electrodes of the light receiving elements arranged in the horizontal direction are electrically cross-connected. . The imaging device according to claim 8 ,
In any one of the grid imaging mode and the oblique grid imaging mode, the photoelectric output generated by the plurality of adjacent light receiving elements is added by the vertical CCD.

Images