JP4369498B2 - Image read / write integrated head and image processing apparatus having the same - Google Patents

Description

  The present invention relates to an image reading / writing integrated head having both an image reading function and a printing function, and an image processing apparatus including the same.

  A specific example of the image processing apparatus is a facsimile machine. This facsimile apparatus needs to have both an image reading function and a printing function, and it is desired to be manufactured as small as possible. Therefore, conventionally, there is an image reading / writing integrated head as shown in FIG. As shown in FIG. 16 of the present application, this conventional image reading / writing integrated head Y has a case 1e with a transparent cover 19e attached to the upper surface portion. Inside the case 1e, a light source 3e and a lens 5e for illuminating the reading area Se on the surface of the transparent cover 19e are provided. A substrate 4e is assembled to the bottom surface of the case 1e. A plurality of light receiving elements 20e and a plurality of heating elements 6e are mounted in a line on the front surface 40 and the back surface 41 of the substrate 4e.

In the image reading / writing integrated head Y, the document D is conveyed by the platen roller P ₁ so as to be in close contact with the surface of the transparent cover 19e. In this conveyance process, the surface of the document D is illuminated by the light source 3e. Then, the light reflected by the surface of the document D is focused by the lens 5e, an image of the document D is formed on each light receiving element 20e, and read image data is output from each light receiving element 20e. On the other hand, the recording paper K of heat-sensitive type is transferred by a platen roller P ₂ so as to close contact with the heating elements 6e. In this transport process, the plurality of heating elements 6e are selectively driven to generate heat, and an image is printed on the recording paper K. The image reading / writing integrated head Y having such a configuration can be made smaller in overall size than the case where the image reading head and the image printing head are separately configured, and the image processing apparatus can be made smaller and thinner. This is preferable for achieving the above.

JP-A-9-284470

  However, the conventional image reading / writing integrated head Y has the following problems.

  First, conventionally, a plurality of light receiving elements 20e and a plurality of heating elements 6e are separately mounted on the front and back surfaces 40 and 41 of one substrate 4e. Therefore, in order to manufacture the image read / write integrated head Y in the related art, after mounting the plurality of light receiving elements 20e on the front surface 40 of the substrate 4e, the substrate 4 is turned upside down and then the plurality of heating elements 6e on the back surface 41 of the substrate 4. Must be mounted, and the substrate 4e must be reversed. Also, the wiring patterns related to the plurality of light receiving elements 20e and the plurality of heat generating elements 6e must be provided on each of the front surface 40 and the back surface 41 of the substrate 4e. Become. Therefore, the productivity of the image reading / writing integrated head is poor.

Secondly, conventionally, the place where the plurality of heating elements 6e are provided is limited to the back surface 41 of the substrate 4e on which the plurality of light receiving elements 20e are mounted. For this reason, the platen roller P ₂ for recording paper is also provided at a position facing the back surface 41 of the substrate 4. Thus, in the conventional position and the position of the platen roller P ₂ of a plurality of heating elements 6e from being always constrained in a fixed position relative to the substrate 4e. Therefore, in the past, it has been difficult to variously change the arrangement of the _two platen rollers P ₁ and P ₂ with respect to the image reading / writing integrated head Y according to the usage.

  The invention of the present application has been conceived under such circumstances, and can improve productivity, and can easily change specifications such as the arrangement of platen rollers. An object is to provide a head and an image processing apparatus.

  In order to solve the above problems, the present invention takes the following technical means.

  The image read / write integrated head provided by the first aspect of the present invention includes an upper surface portion, a bottom surface portion opposite to the upper surface portion, a first side surface portion, and a second side surface opposite to the first side surface portion. A case having a portion, a transparent plate for contacting and conveying the document, a first substrate assembled to the case, and at least one light source disposed in the case for illuminating the document A plurality of light receiving elements mounted on the upper surface of the case inner surface side of the first substrate so as to be able to receive reflected light from the document, and a plurality of heating elements for printing an image on a recording sheet. The image reading / writing integrated head is provided, wherein the transparent plate is disposed on the first side surface, the first substrate is assembled along the bottom surface portion, and the bottom surface Along the section, the first A second substrate separate from the first substrate is provided so as to be adjacent to the substrate so that a part of the width direction thereof protrudes from the second side surface, The heating element is mounted on the upper surface of the protruding portion of the second substrate.

  In the image reading / writing integrated head according to the present invention, the following effects are obtained.

First, when the image reading / writing integrated head according to the present invention is manufactured, the plurality of light receiving elements are mounted on the upper surface of the first substrate, while the plurality of heating elements are mounted on the upper surface of the second substrate. It will be mounted on. In addition, wiring patterns related to the plurality of light receiving elements and the plurality of heating elements are formed on the upper surface of the first substrate and the upper surface of the second substrate, respectively. Therefore, according to the present invention, although the number of substrates on which the light receiving elements and the heat generating elements are mounted is larger than before, it is not necessary to invert those substrates so that the components can be placed on the substrates. Mounting work and wiring pattern forming work are facilitated. As a result, it is possible to increase the production efficiency of the image read / write integrated head and to reduce the manufacturing cost as compared with the conventional case.

  Secondly, in the present invention, a transparent plate is mounted on the first side surface of the case, and a plurality of heating elements are formed on the upper surface of the protruding portion from the second side surface of the second substrate. Then, the platen roller for transporting the document in close contact with the first side surface of the case is disposed, and the platen roller for transporting the recording paper is disposed on the outer side of the second side surface of the case. Become. Then, there is almost no difference in the position in the height direction of both platens, and the downsizing of the image reading apparatus in which the image reading / writing integrated head is assembled is achieved.

  In a preferred embodiment of the present invention, the driver IC chip further includes a control circuit for driving the plurality of heating elements to generate heat, and the plurality of driver IC chips are provided inside the case. In FIG. 2, the semiconductor device is mounted on the upper surface of the first substrate or the upper surface of the second substrate.

  In another preferred embodiment of the present invention, the plurality of light receiving elements are provided with a plurality of IC chips, and the plurality of IC chips are controlled to drive the plurality of heating elements. A control circuit to do this is also built in.

  In another preferred embodiment of the present invention, a support member assembled to the case is provided, and the first substrate and the second substrate are attached to the support member. .

  According to such a configuration, it is possible to appropriately attach the first substrate and the second substrate using the support member. Thus, in this invention, it can also be set as the structure assembled | attached indirectly via the supporting member instead of assembling the 1st board | substrate and the 2nd board | substrate directly with respect to a case.

  In another preferred embodiment of the present invention, the light source is mounted on the upper surface of the first substrate.

  According to such a configuration, the operation of mounting the light source on the first substrate can be easily performed together with the operation of mounting the plurality of light receiving elements on the first substrate. The work of incorporating into the integrated head is also facilitated.

  According to a second aspect of the present invention, an image processing apparatus is provided. This image processing apparatus includes an image reading / writing integrated head provided by the first aspect of the present invention.

  In the image processing apparatus provided by the second aspect of the present invention, the same effect as that obtained by the first aspect of the present invention can be expected.

  Other features and advantages of the present invention will become more apparent from the following description of embodiments of the invention.

  Hereinafter, reference examples and preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 and 2 show a reference example of an image reading / writing integrated head according to the present invention. The image read / write integrated head A of this embodiment includes a case 1, a transparent plate 19, a lens array 5, a first substrate 4A, a plurality of sensor IC chips 2, a plurality of light sources 3, a second substrate 4B, and a plurality of heating elements. 6. A plurality of driver IC chips 60, a heat dissipation plate 49, and other components to be described later are provided. Each sensor IC chip 2 has a plurality of light receiving elements 20 built therein.

  Case 1 is made of, for example, a white synthetic resin. Therefore, the surface of each part of the case 1 is a white surface having a high light reflectance. The overall schematic shape of the case 1 is an elongated block extending in a fixed direction, and includes an upper surface portion 10a, a bottom surface portion 10b opposite to the upper surface portion 10a, a first side surface portion 10d, and a second side surface portion 10c. have. In this case 1, a space portion 11 having an upper portion and a lower portion opened, an upward opening-like concave groove 13 separated from the space portion 11 and the partition wall 12, and a downward opening shape provided directly below the concave groove 13. Are provided in the longitudinal direction of the case 1.

  The transparent plate 19 serves as a guide when the document D is conveyed, and is made of a synthetic resin or glass plate. The transparent plate 19 is attached to the upper surface portion 10 a of the case 1.

  The lens array 5 is a block-shaped lens holder 50 extending in a certain direction and holding a plurality of imaging lenses 51 arranged in a line. As each lens 51, for example, a SELFOC lens is used. If a SELFOC lens is used as the imaging lens, it is possible to form an image of the document D on the plurality of light receiving elements 20 at an erecting equal magnification. However, the present invention is not limited to this, and each lens 51 may be a single convex lens or a compound lens combining a plurality of convex lenses. Since the lens array 5 is fitted in the concave groove 13 of the case 1, the lens array 5 faces the back surface (lower surface) of the transparent plate 19 with a gap. Of the surface (upper surface) of the transparent plate 19, a linear area facing the lens array 5 is a reading area S.

The first substrate 4A is made of, for example, a glass epoxy resin and has a long rectangular shape. A plurality of sensor IC chips 2 and a plurality of light sources 3 are mounted on the upper surface (front surface) 40a of the first substrate 4A. The plurality of light sources 3 are configured using, for example, LED chips, and are arranged in rows at appropriate intervals in the longitudinal direction of the first substrate 4A. The plurality of light sources 3 are positioned at the bottom of the space portion 11 by mounting the first substrate 4 </ b> A on the bottom surface portion 10 b of the case 1. For this reason, the light emitted from the plurality of light sources 3 travels in the space portion 11 toward the reading region S. As described above, since the case 1 is made of white resin, the plurality of wall surfaces 11a defining the space portion 11 are surfaces having high light reflectance. Therefore, the light emitted from each light source 3 travels while being reflected with high reflectivity by the wall surface 11a, and is efficiently irradiated to the reading region S.

  The plurality of sensor IC chips 2 are semiconductor chips in which an integrated circuit including a plurality of light receiving elements 20 is built, and are arranged in a row connected in the longitudinal direction of the first substrate 4A. The plurality of sensor IC chips 2 are arranged in the recess 14 of the case 1 by attaching the first substrate 4A to the bottom surface portion 10b of the case 1, and light that has passed through the lens array 5 from the reading region S. Each light receiving element 20 can receive light. Each light receiving element 20 has a photoelectric conversion function, and when receiving light on a predetermined light receiving surface, it outputs an output level signal (image signal) corresponding to the amount of received light. For example, 96 light receiving elements 20 are built in one sensor IC chip 2. In this case, in order to read a document having an A4 width at a reading density of 8 dots / mm, a total of 18 sensor IC chips 2 are arranged on the first substrate 4A, and a total of 1728 light receiving elements 20 are arranged in a row. Will be provided.

  The periphery of the plurality of sensor IC chips 2 is surrounded by an auxiliary member 70 mounted in the recess 14. The auxiliary member 70 is made of, for example, black ABS resin, and has a low light reflectance on the surface thereof. If the periphery of each sensor IC chip 2 remains the white wall surface of the case 1, light is scattered and reflected by the wall surface, and the light may be mixed into the plurality of light receiving elements 20 as noise. On the other hand, in the configuration of the present embodiment, such scattering and reflection of light can be prevented by the auxiliary member 70, and extra light that becomes noise is prevented from being mixed into the plurality of light receiving elements 20. it can.

  On the upper surface 40a of the first substrate 4A, wiring patterns (not shown) related to the plurality of light sources 3 and the plurality of sensor IC chips 2 are formed. On the first substrate 4A, a connector 48A for electrical wiring connection conducted to the wiring pattern is attached so as not to interfere with the case 1, and the plurality of light sources 3 and the plurality of sensor IC chips 2 from external devices are attached. Driving power supply and input / output of predetermined signals can be performed via this connector 48A.

  The second substrate 4B is made of, for example, ceramic and has a long rectangular shape similar to that of the first substrate 4A. A plurality of heating elements 6 and a plurality of driver IC chips 60 are mounted on the outer surface side surface 41a of the second substrate 4B. The plurality of heating elements 6 are arranged in a row extending in the longitudinal direction of the second substrate 4B. The plurality of heating elements 6 form a linear heating resistor extending in the longitudinal direction of the second substrate 4B by printing and baking a thick film resistance paste containing, for example, ruthenium oxide as a conductor component. The heating resistor is manufactured by forming a wiring pattern that electrically divides the heating resistor at regular intervals in the longitudinal direction. The plurality of driver IC chips 60 are semiconductor chips in which a control circuit for controlling the heat generation drive of the plurality of heat generating elements 6 is built, and are arranged in rows in the longitudinal direction of the second substrate 4B at appropriate intervals. Are listed. When one driver IC chip 60 corresponds to the heating element 6 having 144 dots, for example, a total of 12 driver IC chips 60 are required to print on a recording paper K having an A4 width at a recording density of 8 dots / mm. The heating elements 6 arranged in total on the second substrate 4B and having a total of 1728 dots are selectively driven to generate heat. Each driver IC chip 60 is sealed with a resin (not shown) to protect it.

  The second substrate 4 </ b> B is attached to the case 1 so that the one surface 41 a faces the side of the case 1 by being fitted into a recess 15 a provided in the side surface portion 10 c of the case 1. On the second substrate 4B, a connector 48B for electrical wiring connection with an external device is attached so as not to interfere with the case 1, and a plurality of heating elements 6 are provided on one surface 41a of the second substrate 4B. In addition, a wiring pattern (not shown) is formed which is related to the plurality of driver IC chips 60 and is electrically connected to the connector 48B.

  The heat radiating plate 49 is made of, for example, a metal having high thermal conductivity, and more specifically, is made of aluminum or an aluminum alloy. The heat radiating plate 49 is assembled to the case 1 so as to be sandwiched between the case 1 and the second substrate 4B by being fitted into a recess 15b provided in the side surface portion 10c of the case 1. Of the back surface of the second substrate 4 </ b> B, at least a portion corresponding to the back region of the plurality of heating elements 6 is in surface contact with the heat radiating plate 49. Therefore, the heat generated from the plurality of heating elements 6 is released to the outside through the heat radiating plate 49, and the temperature of each heating element 6 can be stabilized. This helps to improve the quality of images printed on recording paper.

  In the image read / write integrated head A having the above configuration, a plurality of light sources 3 and a plurality of sensor IC chips 2 are mounted on the upper surface 40a of the first substrate 4A. Moreover, the wiring pattern relevant to them is also formed in the upper surface 40a. On the other hand, the plurality of heating elements 6 and the plurality of driver IC chips 60 are mounted on one surface 41a of the second substrate 4B. Those wiring patterns are also mounted on one side 41a. Therefore, the mounting operation of each component and the wiring pattern forming operation can be performed without inverting the first substrate 4A and the second substrate 4B, and the productivity can be increased.

  FIG. 3 is a schematic cross-sectional view illustrating an example of an image processing apparatus configured to include the image reading / writing integrated head A.

The image processing apparatus B shown in FIG. 3 has a structure in which the image read / write integrated head A and the two platen rollers P ₁ and P ₂ are incorporated in a synthetic resin casing 9. The platen roller P ₁ is provided to face the transparent plate 19, and the document D inserted into the housing 9 from the document insertion port 90 of the housing 9 is brought into contact with the surface of the transparent plate 19 to perform the sub-scanning direction. Can be transported. The document D that has passed between the platen roller P ₁ and the transparent plate 19 is discharged from the discharge port 91 to the outside of the housing. The platen roller P ₂ is provided so as to face the plurality of heat generating elements 6, and feeds out the heat-sensitive long recording paper K from the take-up roll R accommodated in the housing 9 to discharge the paper 91. It is comprised so that it can convey toward. As the recording paper K, a cut sheet in the form of a cut sheet can be used. Further, by using a thermal transfer ribbon, non-heat-sensitive plain paper can be used as recording paper.

In the image processing apparatus B configured as described above, the platen roller P ₁ is disposed above the image read / write integrated head A, whereas the platen roller P ₂ is disposed on the side (lateral) of the image read / write integrated head A. It becomes a structure. Therefore, compared with a structure in which the two platen rollers P ₁ and P ₂ are arranged so as to sandwich the entire image read / write integrated head A in the thickness direction (for example, the conventional structure shown in FIG. 16), image read / write is performed. In the thickness direction of the integrated head A, the two platen rollers P ₁ and P ₂ can be prevented from becoming large and bulky. Therefore, it is possible to reduce the thickness of the image processing apparatus B.

In this image processing apparatus B, an image reading process for the document D and an image printing process on the recording paper K are performed as follows. That is, when reading the image of the document D, first, when the document D is conveyed in contact with the transparent plate 19 by the rotation of the platen roller P ₁ , the reading area S of the document D is illuminated by the light from the light source 3. The Then, the reflected light from the document D is focused by each lens 31 of the lens array 5, so that an image of the document D is formed on each light receiving element 20 of the plurality of sensor IC chips 2. For this reason, an image signal having an output level corresponding to the amount of light received by each light receiving element 20 is output from the plurality of sensor IC chips 2, and such signals are sequentially taken out of the image reading / writing integrated head A via the connector 48A. It is. On the other hand, print processing of the image on the recording paper K is, when it is allowed to transport supplies during the recording paper K between the platen roller P ₂ and a plurality of heating elements 6, from the outside various through the connector 48B Each driver IC chip 60 that has received the signal is driven by selectively driving the plurality of heating elements 6 to generate heat.

  When the above-described processing is executed, the document D is conveyed in a substantially horizontal direction on the upper surface portion of the case 1 of the image reading / writing integrated head A, whereas the recording paper K is approximately vertical in the side surface portion of the case 1. It is conveyed to. Therefore, the image processing apparatus B can appropriately convey these documents D and recording paper K while avoiding undue interference.

  4 to 15 show other reference examples and preferred embodiments of the image reading / writing integrated head according to the present invention. In the drawings after FIG. 4, the same or similar elements as those in the previous reference example are denoted by the same reference numerals as those in the previous embodiment, and detailed description thereof will be omitted as appropriate.

The image read / write integrated head Aa shown in FIG. 4 according to another reference example is similar to the above image read / write in that the side surface portion 10c of the case 1 is inclined and the second substrate 4B is also inclined in the same manner. The structure is different from that of the integrated head A. The second substrate 4B is inclined so that one surface 41a thereof faces upward. In this image read / write integrated head Aa, since the surface of the transparent plate 19 and the one surface 41a of the second substrate 4B are both upward, when setting the _two platen rollers P ₁ and P ₂ , The platen rollers P ₁ and P ₂ may be pressed against the transparent plate 19 or the plurality of heating elements 6 from above the image reading / writing integrated head A. Therefore, the assembly of the image read / write integrated head Aa and the two platen rollers P ₁ and P ₂ can be facilitated.

Further, the image read / write integrated head Ab shown in FIG. 5 according to another reference example is different from the image read / write integrated head Aa in the manner of inclination of the side surface portion 10c of the case 1 and the second substrate 4B. These are inclined so that one side 41a of the second substrate 4B faces downward. In this image read / write integrated head Ab, the distance between the centers of the _two platen rollers P ₁ and P ₂ can be increased without increasing the size of the image read / write integrated head itself. Therefore, the original D and the recording paper K can be transported more easily without interfering with each other. Thus, in this invention, when attaching the 2nd board | substrate 4B to the side part to which the transparent plate 19 and the 1st board | substrate 4A are not attached among several side parts of the case 1, it is 2nd. The substrate 4B can be set in a posture inclined with respect to the surface of the transparent plate 19.

  The image read / write integrated head Ac shown in FIG. 6 according to another reference example has a configuration in which a light guide transparent member (prism) 39 is accommodated in the space 11 of the case 1. The transparent member 39 is a highly transparent synthetic resin molded product and has a shape extending in the arrangement direction of the plurality of light sources 3. The image reading / writing integrated head Ac is configured such that light emitted from a plurality of light sources 3 travels through the transparent member 39 and then is emitted toward a reading region S from a certain region above the transparent member 39. According to such a configuration, it is not necessary to reflect the light emitted from each light source 3 by the wall surface 11a of the space portion 11, so that the wall surface 11a is not made into a surface having a high light reflectivity in the reading region S. On the other hand, light can be efficiently irradiated. Therefore, it is suitable when the case 1 is made of, for example, a black resin. Further, if the case 1 is made of black resin, the auxiliary member 70 incorporated in the image reading / writing integrated heads A, Aa, Ab described above can be made unnecessary. Thus, in the present invention, the light emitted from the light source 3 may be guided to the reading region S by using an appropriate light guide.

  The image reading / writing integrated head Ad shown in FIG. 7 according to another reference example has the same configuration as that shown in FIG. 16 described as the prior art in the configuration necessary for reading the document image. More specifically, the image reading / writing integrated head Ad has a configuration in which a third substrate 4C on which a plurality of light sources 3 are mounted is assembled in the case 1 so as to face the reading region S. . As described above, in the present invention, the configuration of the portion for reading the document image can be variously modified. However, this image read / write integrated head Ad requires the third substrate 4C, and the number of parts increases. Therefore, from the viewpoint of reducing the number of parts and facilitating the manufacture of the image read / write integrated head, the light source 3 is arranged on one side of the first substrate 4A as in the image read / write integrated head A, Aa to Ac described above. It is preferable to mount on top.

  In the image read / write integrated head Ae shown in FIG. 8 according to another reference example, the case 1A is made of a metal having high thermal conductivity, for example, aluminum or aluminum alloy. The second substrate 4B is attached to the case 1A so that the back surface 41b contacts the case 1A. In the image read / write integrated head Ae, the heat generated from the plurality of heating elements 6 travels through the case 1A and then escapes to the outside. Therefore, it is not necessary to provide a heat sink separately from the case 1A, and the total number of parts can be reduced. Further, since the case 1A has a larger volume and surface area than the heat radiating plate 49 used in the image read / write integrated heads A, Aa to Ad, the case 1A exhibits an excellent heat radiating effect. It is more preferable to stabilize the temperature. Further, when the case 1A is made of metal such as aluminum, it is possible to make the surface of each part of the case 1A have a high light reflectivity, so that the light emitted from each light source 3 can be transmitted through the space 11. This is convenient for guiding to the reading region S while reflecting the plurality of wall surfaces 11a to be defined.

Further, in the image read / write integrated head Af shown in FIG. 9 according to another reference example, a metal radiator plate 49 is sandwiched between the second substrate 4B and the first substrate 4A, so that the second substrate 4B has the structure attached to the back surface of the 1st board | substrate 4A. In this image read / write integrated head Af, the arrangement of the _two platen rollers P ₁ and P ₂ can be the same arrangement as that of the prior art shown in FIG.

  In the image read / write integrated head Ag shown in FIG. 10 according to another reference example, a part of the back surface of the second substrate 4B is in direct contact with the back surface of the first substrate 4A, and the back surface of the second substrate 4B is The other part has a configuration in which a heat sink 49 is sandwiched between the case 1 and the case 1. According to such a configuration, the thickness of the heat radiating plate 49 can be prevented from becoming bulky on the back surface of the first substrate 4A, and the total thickness of the image read / write integrated head is larger than the image read / write integrated head Af shown in FIG. Can be reduced. However, in the present invention, a heat radiating plate is provided on the image reading / writing integrated head when the amount of heat generated from the plurality of heating elements 6 is small, or when deterioration in the quality of the printed image is allowed to some extent. It does not matter if there is no configuration. Therefore, for example, like the image reading / writing integrated head Ah shown in FIG. 11, the second substrate 4B is made to be in contact with the entire back surface of the second substrate 4B or substantially the entire surface in contact with the back surface of the first substrate 4A. It may be configured to be attached to one substrate 4A.

  In the image read / write integrated head Ai shown in FIG. 12 according to another reference example, the first substrate 4A and the second substrate 4B are mounted side by side on the surface (upper surface) of the plate-like support member 49A. Since the support member 49A is assembled to the bottom surface of the case 1, each of the first substrate 4A and the second substrate 4B has a configuration assembled to the bottom surface of the case 1. The supporting member 49A is made of, for example, a metal having a high thermal conductivity, and plays a role as a heat radiating plate. Thus, in the present invention, the second substrate 4B may be supported by a member other than the case 1 or the first substrate 4A. Further, if the supporting member 49A serves as a heat sink, it is not necessary to provide a heat sink separately.

  Each driver IC chip 60 of the image read / write integrated head Ai is not mounted on the second substrate 4B, but is mounted on one surface of the first substrate 4A. The case 1 is provided so as to cover each driver IC chip 60. The first substrate 4A and the second substrate 4B are arranged adjacent to each other, and wiring patterns (not shown) formed on the upper surfaces of the first substrate 4A and the second substrate 4B, respectively. ) They are electrically connected to each other. The plurality of heating elements 6 are formed on the upper surface of the protruding portion that protrudes from the second side surface portion 10c of the case 1 in the second substrate 4B. The wiring pattern of the second substrate 4B has, for example, a plurality of individual electrodes for individually connecting a plurality of heating elements 6 to a ground, and a common electrode for supplying power to the plurality of heating elements 6 at once. is doing. As means for connecting the individual electrodes to the wiring pattern of the first substrate 4A, the other ends of the plurality of wires W each having one end connected to the electrode of each driver IC chip 60 are connected to the individual electrodes. Means are adopted. On the other hand, as means for connecting the common electrode to the wiring pattern of the first substrate 4A, an appropriate connecting member such as a lead wire or a metal plate (not shown) is used to connect the common electrode to the first substrate 4A. A means for conducting to a predetermined portion of the wiring pattern is employed. The first board 4A is provided with a connector 48C that is directly connected to the wiring pattern of the first board 4A and also connected to the wiring pattern of the second board 4B through the wiring pattern.

  In the image read / write integrated head Ai having such a configuration, power supply from an external device to each light source 3, each sensor IC chip 2, each driver IC chip 60, and each heating element 6, and input / output of a predetermined signal, All can be done through one connector 48C. Therefore, the electrical wiring connection work can be facilitated. In addition, the overall cost can be reduced by the amount that the total number of connectors can be reduced. Furthermore, if each driver IC chip 60 is mounted on the first substrate 4A, the size of the second substrate 4B can be reduced accordingly. Therefore, for example, when the first substrate 4A is made of an inexpensive glass epoxy resin and the second substrate 4B is made of a more expensive ceramic, the total of the two substrates 4A and 4B is the total. Raw material costs can be reduced.

FIG. 13 shows an image read / write integrated head Aj according to an embodiment of the present invention. The image read / write integrated head Aj has the arrangement of the transparent plate 19 and the lens array 2 shown in FIG. The structure is different from Ai. More specifically, the lens array 2 is provided in a lying position such that the optical axis C of each lens 21 extends substantially parallel to the upper surface 40a in a region facing the upper surface 40a of the first substrate 4A. Yes. Transparent plate 19 so as to face the lens 21, among the both side portions in the width direction of the case 1, the side where the platen roller P ₂ is disposed attached to the first side surface portion 10d of the opposite The first substrate 4A has a posture that intersects the direction of the one-side upper surface 40a. A prism 29 is provided on the front surface (directly above) of the plurality of sensor IC chips 2 to guide the light that has passed through each lens 21 from the reading region S to the plurality of light receiving elements 20 by total reflection. The image read / write integrated head Ai having such a configuration can be set so that the entire case 1 is sandwiched between the _two platen rollers P ₁ and P ₂ . It is more preferable to reduce the overall size. On the other hand, the distance between the centers of the _two platen rollers P ₁ and P ₂ can be increased, and the document D and the recording paper K can be appropriately conveyed.

  FIG. 14 shows an image read / write integrated head Ak according to another reference example of the present invention, and FIG. 15 shows an image read / write integrated head Al according to another embodiment of the present invention. These image read / write integrated heads Ak, Al are provided with the image read / write integrated head Ai shown in FIGS. 12 and 13 in that a plurality of IC chips 2A are arranged in a line on one side of the first substrate 4A. , Aj are different in configuration, and other configurations are common to the image read / write integrated heads Ai, Aj. Each IC chip 2A is formed by integrating an integrated circuit including a plurality of light receiving elements 20 and an integrated circuit for controlling heat generation driving of the plurality of heating elements 6 into one chip. According to such a configuration, the total number of IC chips can be reduced as compared with the case where the sensor IC chip 2 and the driver IC chip 60 are mounted on the first substrate 4A, and the image read / write integrated head is manufactured. Can be made easier.

  The specific configuration of each part of the image reading / writing integrated head and the image processing apparatus according to the present invention is not limited to the above-described embodiment, and various design changes can be made. For example, a cold cathode tube or other light source can be used as the light source instead of the LED light source. The image processing apparatus according to the present invention may be configured as a facsimile apparatus, or may be configured as an apparatus that is used by being connected to a personal computer or other equipment.

It is sectional drawing which shows the reference example of the image reading / writing integrated head which concerns on this invention. FIG. 2 is an exploded perspective view of the image reading / writing integrated head shown in FIG. 1. It is a schematic sectional drawing which shows the reference example of the image processing apparatus which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows one Embodiment of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows the other reference example of the image reading / writing integrated head which concerns on this invention. It is sectional drawing which shows other embodiment of the image reading / writing integrated head based on this invention. It is sectional drawing which shows an example of the conventional image reading / writing integrated head.

Explanation of symbols

A, Aa to Al Image reading / writing integrated head B Image processing device P ₁ , P ₂ Platen roller D Document K Recording paper S Reading area 1, 1A Case 2 Sensor IC chip 2A IC chip 3 Light source 4A First substrate 4B Second substrate Substrate 5 Lens array 6 Heating element 19 Transparent plate 20 Light receiving element 40a Upper surface (of the first substrate)
41a single side (second substrate)
49 Heat sink 49A Support member 60 Driver IC chip

Claims (6)

A case having an upper surface portion, a bottom surface portion on the opposite side of the upper surface portion, a first side surface portion and a second side surface portion on the opposite side of the first side surface portion, a transparent plate for bringing the document into contact therewith, A first substrate mounted on the case; at least one light source disposed in the case for illuminating the document; and reflected light from the document to receive light reflected from the document. An image reading / writing integrated head comprising a plurality of light receiving elements mounted on the upper surface on the case inner surface side and a plurality of heating elements for printing an image on recording paper,
The transparent plate is disposed on the first side surface,
The first substrate is assembled along the bottom surface; and
A second substrate separate from the first substrate so as to be adjacent to the first substrate along the bottom surface portion, and a part of the width direction thereof protrudes from the second side surface. Provided to have a part,
The image reading / writing integrated head, wherein the heat generating element is mounted on an upper surface of the protruding portion of the second substrate.   A driver IC chip having a control circuit for driving the plurality of heat generating elements to generate heat; and the plurality of driver IC chips are arranged on the upper surface of the first substrate or the above in the case. The read / write integrated head according to claim 1, which is mounted on an upper surface of the second substrate.   The plurality of light receiving elements includes a plurality of IC chips, and the plurality of IC chips include a control circuit for controlling driving of the plurality of heating elements. The image reading / writing integrated head according to claim 1.   4. The support member according to claim 1, further comprising a support member assembled to the case, wherein the first substrate and the second substrate are attached to the support member. 5. Integrated image read / write head.   The image reading / writing integrated head according to claim 1, wherein the light source is mounted on an upper surface of the first substrate.   An image processing apparatus comprising the image reading / writing integrated head according to claim 1.

Images