JP4336164B2 - Method for manufacturing composite sheet, method for manufacturing composite laminate, and method for manufacturing ceramic substrate - Google Patents

Description

  INDUSTRIAL APPLICABILITY The present invention is suitably used for manufacturing a wiring board applied to various wiring boards, semiconductor element storage packages, and the like. The present invention relates to a method for producing a composite sheet, a method for producing a composite laminate, and a method for producing a ceramic substrate, which are used to produce a ceramic substrate having the same.

  In recent years, heat generated from a semiconductor device has been increased with higher integration of semiconductor elements. In order to eliminate the malfunction of the semiconductor device, a wiring substrate capable of releasing such heat to the outside of the device is required. On the other hand, as an electrical characteristic, signal delay becomes a problem due to an increase in calculation speed, and it has been required to use a wiring conductor having a small wiring conductor loss, that is, a low resistance.

  As a wiring board on which such a semiconductor element is mounted, a ceramic in which alumina ceramics is used as an insulating base and a wiring layer made of a refractory metal such as tungsten or molybdenum is deposited on the surface or inside thereof from the viewpoint of reliability. Wiring boards are frequently used. However, in a wiring layer made of a refractory metal that has been widely used in the past, the resistance can only be lowered to about 13 μΩ · cm. Therefore, in order to reduce the resistance value of the wiring conductor in the multilayer wiring board as described above and allow a large current to flow, the insulating base constituting the multilayer wiring board is formed by a thick copper (Cu) film or electroless plating. Forming a wiring conductor has been performed.

  However, in such a wiring conductor, the line width of the wiring pattern is limited by the area of the multilayer wiring board in order to increase the density of the wiring, and cannot be formed wider than a certain level. It was difficult to obtain a wiring conductor with a sufficient thickness at a low cost in a short time without adversely affecting the subsequent processes, and the above-mentioned reduction in resistance was not satisfied.

Therefore, in order to reduce the resistance value of the wiring conductor and allow a large current to flow, a through hole is formed in the ceramic grease sheet constituting the multilayer wiring board, and copper (Cu) having a low electric resistance value is formed in the through hole. A wiring conductor paste made of a low melting point metal such as silver or silver (Ag) has been proposed as a low resistance wiring conductor (see, for example, Patent Documents 1 and 2).
JP-A-5-21635 JP-A 63-194

However, when the low resistance wiring conductor is formed by the method of the cited documents 1 and 2, irregularities occur on the surface of the wiring conductor paste after drying, a stacking failure occurs when the first sheet is stacked, and the stack is deformed. There was a problem of inviting. In addition, when forming a complicated pattern, there is a problem that a filling failure of the paste occurs and a connection failure with other circuits occurs.

  Therefore, the present invention provides a method for producing a composite sheet, a method for producing a composite laminate, in which the surface is flat, prevents the occurrence of poor lamination and connection failure, and other components are uniformly embedded in a part of the first sheet. And a method of manufacturing a ceramic substrate.

The present invention replaces a part of the first sheet with a part of the second sheet by pressure treatment, and easily produces a composite sheet in which different components are uniformly embedded, and reduces the gap at the sheet boundary. Since the surface can be flattened, it is possible to prevent the occurrence of poor stacking and poor connection.

In other words, the composite sheet production method of the present invention, the first sheet to the second laminate obtained sheets are laminated, and pressed from the second sheet side, one of the first sheet and decryption process for manufacturing the composite sheet of the part was replaced with a portion of said second sheet, and a part of said first sheet and said second sheet in the composite sheet obtained in the complexing step integrating step of the solvent is supplied to the boundary, and the swelling step of infiltrating the solvent on at least one sheet swollen with front Kisakai boundaries, pressurized in the thickness direction of the composite sheet obtained by swelling step It is characterized by comprising.

Further, according to the present invention, by firing the above composite sheet produced by the manufacturing method, the first other sheets and / or other composite sheets stacked to be made with the composite laminate, electrostatic A ceramic substrate having a metal layer applied as a part of an air circuit or a heat radiator can be manufactured .

According to the present invention, the metal component can be uniformly filled into the through holes of the first sheet easily by the pressure treatment. In addition, since a part of the second sheet is integrally embedded in the through hole of the first sheet without a gap and is combined, one of the second sheets is inserted into the through hole of the first sheet . It becomes easy to handle a single sheet with embedded parts . In addition, by changing the punch shape in accordance with the complicated shape of the through hole, a part of the second sheet can be embedded in the through hole of any shape.

Further, in order to be easily handled in multiple joint-stock over preparative alone it can also be easily performed lamination during lamination with other composite sheets and the first sheet.

In addition, it prevents the formation of irregularities in the filling area, such as when the conductive paste is filled in the through-holes, and prevents laminating defects and deformation of the laminated body when laminating with other composite sheets or the first sheet. can do.

Furthermore, the gap between the first sheet and a part of the second sheet generated during sintering can be reduced.

Further, by firing the composite sheet , a metal layer for forming a circuit can be formed on the surface or inside of the ceramic substrate, and the occurrence of stacking faults in the formed metal layer forming portion or the surface of the metal layer can be formed. It is possible to form a high quality circuit while suppressing a decrease in flatness.

According to the present invention, a composite sheet in which the first sheet and a part of the second sheet are partially integrated can be easily formed by one or two punching processes. Moreover, the composite sheet thus produced suppresses the occurrence of deformation and filling failure of the ceramic substrate when forming the ceramic substrate having the metal layer, increases the flatness of the metal layer, and increases the mounting reliability of the electronic component. be able to.

  The manufacturing method of the composite sheet of this invention is demonstrated based on the process drawing of FIG.

First, the first sheet 1 and the second sheet 2 are produced. The first sheet 1 may have any thickness depending on the application, but 50 to 300 μm is appropriate for the composite with the second sheet 2. In addition, the second sheet 2 is preferably substantially the same thickness as the first sheet 1, and the thickness t ₂ of the second sheet 2 is equal to the thickness t ₁ of the first sheet 1. in _contrast, it is desirable that the 0.9t ₁ ~1.1t 1.

  Then, as shown in FIG. 1A, a punching press composed of an upper press 4 (not shown) as a driving unit and a lower press 6 in which an opening 5 is formed is prepared, and the first sheet 1 is prepared. Is placed on the lower press 6 and the second sheet 2 is laminated on the upper side of the first sheet 1 as shown in FIG. At this time, as will be described later, the first sheet 1 is preferably lightly temporarily fixed with an adhesive or the like.

And as shown in FIG.1 (c), while supporting the upper press 4 which is a drive part, and the 1st sheet | seat 1, the upper press 4 is driven and the drive stop position of the upper press 4 is made into the 1st sheet | seat. 1 is set on the upper surface side. Thereby, simultaneously with the punching of the first sheet 1 and the second sheet 2, the upper sheet 4 is pressed to remove a part 1 a of the first sheet, and the second sheet 2 is removed in the removed space. A part of the punched portion 2a is embedded.

Thereafter, the upper punch 4 and the punched second sheet 2 are peeled and removed, and the first sheet 1 is peeled off from the lower punch 6, thereby making the first sheet 1 as shown in FIG. of a part replaced with a part of the second sheet 2 can be manufactured integrated composite sheet a. In this way, the portion where the first sheet is replaced is formed with the punched portion 12a of the second sheet made of other components with a uniform thickness.

Next, as shown in FIG. 1 ( e ), in the obtained composite sheet A, a solvent is present at the boundary between the first sheet 1 and the punched portion 2 a of the second sheet embedded in the first sheet. Is applied, and a process of swelling and pressurizing the boundary portion is applied to prevent deformation and to obtain a composite sheet A ′ having a reduced gap.

  Next, as shown in FIG. 1 (g), in the obtained composite sheet A, a solvent is formed at the boundary between the first sheet 1 and the punched portion 2a of the second sheet embedded in the first sheet. Is applied, and a process of swelling and pressurizing the boundary portion is applied to prevent deformation and to obtain a composite sheet A ′ having a reduced gap.

According to the present invention, it is preferable that a drilling step of forming a through hole in advance at a predetermined position of the first sheet is provided prior to the compounding step. Thus, by keeping open the first sheet and the second sheet through holes in the punching process by a press on the first sheet prior to performing the complexation with part of, the second sheet- The portion can be easily inserted into a through hole provided in the first sheet.

  Next, as shown in FIG. 2D, the second sheet 12 is placed on the surface of the first sheet 11 in which the through holes 13 are formed. Then, the upper press 14 is driven as shown in FIG. At this time, the drive amount of the upper press 14 is adjusted, and the drive stop position of the lower surface of the upper press is set on the upper surface side of the first sheet 11. As a result, the punched portion 12 a of the second sheet 12 can be embedded in the through hole 13 formed in the first sheet 11 simultaneously with the punching of the second sheet 12.

Thereafter, by removing the upper punch 14 and the second sheet 12, the second sheet 12a is inserted into the through-hole 13 formed at a predetermined position of the first sheet 11, as shown in FIG. A composite sheet B partially embedded and integrated can be produced.

  Next, as shown in FIG. 2G, in the obtained composite sheet B, a solvent is present at the boundary between the first sheet 11 and the punched portion 12a of the second sheet embedded in the first sheet. Is added, and a process of swelling and pressurizing the boundary portion is applied to prevent deformation and to obtain a composite sheet B ′ having a reduced gap.

According to the present invention, as described above, the solvent 17 is applied to the boundary between the first sheet 1, 11 of the composite sheet A, B and a part of the second sheet 2 , 12 and penetrates it. It is important to obtain the composite sheets A ′ and B ′ by performing a swelling treatment for expanding the boundary portion.

In this swelling process, when the swelling treatment is performed at the boundary between the first sheet 1, 11 and a part of the second sheet 2 , 12 , it is necessary to infiltrate at least one of the sheets with a solvent. is there.

Even when the first sheets 1 and 11 and the second sheets 2 and 12 are made of different materials, at least one of the sheets may be swollen. In order to improve the adhesion, a solvent is infiltrated into both sheets. It is preferable to swell. For example, it is possible to swell both sheets by impregnating a solvent into a slight gap between the first sheet 1, 11 and a part of the second sheet 2 , 12.

  The solvent used in the expansion order varies depending on the types of the first sheets 1 and 11 and the second sheets 2 and 12 used in combination therewith, and is appropriately selected. For glass / alumina / acrylic resin bead composite sheets belonging to composite sheets, esters such as butyl acetate, ketones such as acetone, alcohols such as isopropyl alcohol (IPA), aromatics such as toluene and xylene, or butyl carbitol acetate (BCA), Dioctyl phthalate (DOP), Dimethyl phthalate (DMP), Diethyl phthalate (DEP) or Dibutyl phthalate (DBP) is one of the ceramic / metal sheet composite sheet composite sheets In the case of certain alumina / copper / tungsten composite sheets, butyl carbitol acetate (B Alumina / forsterite composites that are one of ceramic / ceramic composite sheets such as CA), dioctyl phthalate (DOP), dimethyl phthalate (DMP), diethyl phthalate (DEP) or dibutyl phthalate (DBP). In the case of a sheet, a solvent such as butyl carbitol acetate (BCA), dioctyl phthalate (DOP), dimethyl phthalate (DMP), diethyl phthalate (DEP), or dibutyl phthalate (DBP) is used.

  In this swelling treatment, for example, a small amount of solvent may be dropped while scanning a thin tube along the boundary, or the porous body is absorbed by a porous body such as a sponge. You may apply | coat a solvent by making it contact.

Next, it is important to press the swollen composite sheets A ′, B ′ or the composite laminate in the thickness direction. By this pressurization, the first sheets 1 and 11 and a part of the second sheets 2 and 12 are integrated, and composite sheets A ′ and B ′ from which these gaps are removed can be produced.

Thus, according to the present invention, the second sheet having substantially the same thickness as that of the first sheets 1 and 11 is inserted into the through holes 3 and 13 of the first sheets 1 and 11 by using a pressing device. The composite sheets A ′ and B ′ in which a part of 2 and 12 are embedded can be easily formed by one or two pressing processes.

  And the site | part which substituted the 1st sheet | seat forms the punching part 12a of the 2nd sheet | seat which consists of other components with uniform thickness.

  According to the present invention, since the sheet is replaced and then subjected to swelling treatment and pressurization, the two sheets are integrated as one sheet, and a composite sheet with little deformation can be produced.

  In addition, the composite sheets A ′ and B ′ have substantially no step or gap at the interface between the two sheets, and the surface is flat, so that even if a circuit pattern is formed on the surface, disconnection and poor connection are prevented. can do.

In addition, when handling the composite sheets A and B in which a part of the first sheets 1 and 11 is replaced with a part of the second sheets 2 and 12 , until the swelling process and the integration process are finished, as will be described later. In order to prevent the second sheets 2 and 12 from being peeled off, it is desirable that both of them be temporarily fixed with an adhesive or the like.

  Next, the manufacturing method of a composite laminated body is demonstrated.

  According to the present invention, such a composite laminate is suitably used, for example, for producing a multilayer structure ceramic substrate having a metal layer. A method for manufacturing the ceramic substrate will be described with reference to the process diagram of FIG. Here, a case where an alumina ceramic green sheet is used as the first sheet and a metal green sheet is used as the second sheet will be described.

  As shown in FIGS. 3A and 3B, the composite sheet A1 produced in FIG. 1 or FIG. 2 and the other composite sheet A2 produced in the same manner and the second sheet not compounded with the second sheet. A composite laminate C is produced by laminating and integrating one sheet B1, B2, B3 together with an adhesive solution or the like. In addition, A1 and A2 perform a swelling process and an integration process.

  Then, by heating the composite laminate C to a temperature at which the first sheet 51 and the second sheet punched portion 52a are sintered, the second sheet punched portion 52a is sintered to form a metal. In addition to forming the layer 57, the first sheet 51 is fired and densified, and as shown in FIG. 3C, a multilayer structure ceramic substrate D including the metal layer 57 can be formed.

In the method of the present invention, when the metal component is embedded in the through hole formed in the first sheet 51, the first sheet having the through hole and the other first sheet are laminated as in the prior art. In order to embed a rigid second sheet in one first sheet with a punch, without the trouble of pouring the paste into the recesses formed, and using a paste-like one in the first sheet Since the composite sheet in which a part of the second sheet is embedded can be handled in a simple manner, it is easy to align the composite sheet with the other first sheet or the other composite sheet and laminate it. A composite laminate in which a metal component is embedded in the through hole of the first sheet can be created.

  Further, in the present invention, since there is no deformation such as a dent as seen when filling the concave portion with the paste in the portion where the metal component is filled, the lamination interface is also used in the lamination integration of the first sheet. Can be prevented, and electrical connection is ensured even if a circuit pattern is formed on the composite sheet.

Moreover, according to the method of the present invention, even when a high pressure of 3 to 7 MPa is applied during the lamination process, the pressure is uniform because the through hole is embedded by a part of the second sheet having high rigidity. In addition, deformation of the composite sheet and the composite laminate can also be suppressed.

  In order to apply the composite sheets A1 and A2 of the present invention to a ceramic wiring board or the like, as shown in FIG. 3, a metallized wiring layer 58 may be appropriately formed on the surfaces of the composite sheets A1 and A2. it can.

  This metallized wiring layer 58 is formed into a predetermined pattern by a well-known screen printing method on a surface of the composite sheets A1 and A2 using a metal paste obtained by adding and mixing an organic binder, a solvent, and a plasticizer to metal powder according to a known method. Apply printing.

  In addition, via conductors 59 can be formed by forming through holes in the composite sheets A1 and A2 by micro drilling or laser processing and filling the through holes with a metal paste, and these via conductors 59 can be formed between different layers. The formed metallized wiring layers 58 can be electrically connected to each other.

  The first sheet used in the present invention is prepared by adding a suitable organic binder such as an acrylic resin to a ceramic raw material powder prepared at a predetermined ratio and dispersing it in an organic solvent. A first sheet having a predetermined thickness is produced by a casting method such as a doctor blade method or a lip coater method. The thickness of the first sheet is usually 50 to 400 μm. When a sheet thinner than 50 μm is formed, the prepared slurry is applied onto a carrier sheet that has been treated with a release agent by a coating method such as a conventionally known roll coater, gravure coater, blade coater, and the like, and then dried. A sheet can be produced.

  On the other hand, the second sheet used in the present invention is a sheet formed from a mixture of a metal powder and an organic binder. In particular, the organic binder enhances the punching processability by pressing, and at the time of firing. In order to improve the thermal decomposition removability of the resin, an acrylic resin, particularly an acrylic resin having isobutyl methacrylate as the main skeleton is desirable.

  Moreover, as a metal component, it is desirable to consist of 10 to 60 volume% of low melting metal powder, and 40 to 90 volume% of high melting metal powder. As the low melting point metal, at least one selected from the group of Cu, Ag, Au, and Al is used, and as the high melting point metal, at least one selected from the group of tungsten, molybdenum, and manganese is preferably used. Thus, by blending the low-melting point metal and the high-melting point metal in the above range, the rigidity of the second sheet can be increased and at the same time the punching processability of the second sheet can be improved, and further after firing. The resistance of the metal layer can be reduced and the thermal conductivity can be increased.

In firing, it is desirable to form a structure in which the low melting point metal occupies the grain boundary of the high melting point metal particles by firing at a temperature higher than the melting point of the low melting point metal. From this point, by setting the amount of the high melting point metal to 40% by volume or more, the shape of the metal layer can be maintained even when the low melting point metal is melted and the metal layer and a ceramic insulating layer such as Al ₂ O ₃ The generation of stress due to the difference in thermal expansion between the wiring layer and the insulating layer can be suppressed, and cracks can be prevented from occurring in each wiring layer and insulating layer. In addition, by setting the amount of the low melting point metal to 10% by volume or more, it is possible to reduce the resistance of the metal layer and increase the thermal conductivity.

In producing the second sheet , 1 to 10 parts by weight of the organic binder is added to 100 parts by weight of the metal powder, and this is dispersed in an organic solvent such as toluene, hexane, or heptane. A plasticizer may be added to give the sheet flexibility.

  In the present invention, the low melting point metal powder preferably has an average particle size of 0.8 to 12 μm, thereby improving the dispersibility of the powder. Further, the refractory metal powder is desirably dispersed and contained in a matrix made of copper as spherical particles having an average particle diameter of 0.8 to 12 μm or sintered particles of several particles. By setting the thickness to 8 μm or more, the shape retention of the metal layer can be improved and the resistance of the metal layer can be reduced. By setting the thickness to 12 μm or less, the matrix of the low melting point metal is divided by the high melting point metal particles. Can be prevented from increasing in resistance. The average particle diameter of the refractory metal is most desirably dispersed in a size of 1.3 to 5 μm, particularly 1.3 to 3 μm.

  According to the present invention, a ceramic substrate having a circuit pattern can be easily formed by forming a circuit pattern made of a conductive material on the surface or inside of a composite sheet or composite laminate, and further laminating it with another sheet or composite sheet. Can be formed. Since the composite sheet has a uniform thickness, even if a circuit pattern is formed on the composite sheet, it is possible to suppress the occurrence of connection failure.

  Further, by providing a mounting portion on the surface of the metal layer as a ceramic substrate and mounting the electronic component, it is possible to efficiently remove heat generated in the electronic component.

  In the present invention, as described above, the first sheet is not limited to the ceramic molded body, and the second sheet is not limited to the metal powder molded body, but a glass powder molded body, plastic or resin, or composite material. It goes without saying that any compacted body such as a powder can be employed, and these can be freely combined.

5% by weight of MnO ₂ with respect to aluminum oxide powder (average particle size 1.8 μm)
After adding and mixing 3% by weight of SiO ₂ and 0.5% by weight of MgO, 3% by weight of acrylic resin as an organic resin for molding and toluene as a solvent were added and mixed in a ball mill for 24 hours. To prepare a slurry. Using this slurry, a first sheet having a length of 300 mm, a width of 300 mm and a thickness of 230 μm was prepared by a doctor blade method.

  In addition, this first sheet has 50% by volume of copper powder having an average particle size of 3 μm, 50% by volume of tungsten powder having an average particle size of 2 μm, 4% by mass of an acrylic binder as an organic resin for printing, a plasticizer A metal paste in which dibutyl phthalate is mixed at a ratio of 10% by mass is prepared, and is applied to the surface of the first sheet in a predetermined pattern by a screen printing method. In addition, a through hole having a diameter of 120 μm was formed in the first sheet by a micro drill, and the via conductor was formed by filling the through hole with the metal paste.

  On the other hand, 50% by volume of copper powder having an average particle size of 3 μm, 50% by volume of tungsten powder having an average particle size of 2 μm, 2% by mass of an acrylic resin as an organic resin for molding, and toluene as a solvent were added. A slurry was prepared by mixing for a period of time. Using this slurry, a second sheet having a length of 300 mm, a width of 300 mm and a thickness of 230 μm was prepared by a doctor blade method.

  Next, a through-hole having a size of 10 mm in length and 30 mm in width was formed in the central portion of the first sheet by a punching apparatus as shown in FIG.

  After laminating the second sheet on the first sheet in which the through holes were formed, the upper punch in the punching device was lowered and lowered to a position where the lower surface of the upper punch was flush with the surface of the first sheet. .

As a result of raising the upper punch and confirming the first sheet, a composite B having a structure in which a part of the second sheet was embedded in the through hole portion of the first sheet was formed.

  Next, while the composite B is in the state of a green sheet, a solvent 17 made of butyl carbitol acetate (BCA) is bounded at the boundary between the first sheet 1 and the second sheet 2a of the composite sheet B by a thin tube. A small amount was applied while scanning along the part, and a swelling treatment was performed to infiltrate the sheet and expand both sheets at the boundary (see FIG. 2 (g)).

  The obtained composite B ′ was pressurized with a pressure of 5 MPa in the thickness direction, and the gap between the first sheet 11 and the second sheet 2a tube was removed and integrated.

  Next, as shown in FIG. 3, the composite A1 produced as described above and the composite A2 in which the second sheet is embedded in the through-hole produced in the same manner are stacked, and the second A total of five sheets of first sheets B1, B2, and B3 on which a normal wiring pattern that was not combined with the sheet was formed were laminated using an adhesion liquid. Moreover, in the lamination, a pressure of 5 MPa was applied to the laminated body while heating to a temperature of 60 degrees.

  As a result of observing the deformation of the first sheet in the portion where the second sheet was embedded in the sample of the composite laminate, no deformation was observed for the first sheet.

  Next, this laminated body was heated and sintered in a reducing atmosphere at 1350 ° C. for 20 hours.

As a result, the ceramic wiring board having a metal layer on the second embedded part's portion of the sheet was obtained.

  As a result of measuring the flatness of the surface of the metal layer by the stylus method with respect to the produced ceramic wiring board, the maximum height difference is 30 μm / 10 mm, a board with excellent flatness is formed, and there is almost no deformation of the board. Was confirmed. In addition, as a result of cutting the metal layer and observing the vicinity of the metal layer with a binocular microscope, no delamination, poor filling, poor connection, or the like was observed at all.

  In Example 1, the swelling step and the integration step were performed in the same manner as in Example 1 except that the composite sheet was produced by processing the first sheet and the second sheet by the method shown in FIG. A composite sheet, a composite laminate pair and a ceramic wiring board were produced.

  As a result of observing the deformation of the first sheet in the portion where the second sheet was embedded in the sample of the obtained composite laminate, as in Example 1, no deformation was observed for the first sheet. There wasn't.

  Further, as a result of measuring the flatness of the metal layer surface by the stylus method with respect to the ceramic wiring board, the maximum height difference is 40 μm / 10 mm or less as in Example 1, and a substrate with excellent flatness is formed. It was confirmed that there was almost no deformation of the substrate. In addition, as a result of cutting the metal layer and observing the vicinity of the metal layer with a binocular microscope, no delamination, poor filling, poor connection, or the like was observed at all.

Comparative example

  After forming the through holes in the first sheets A1 and A2 produced in the same manner as in Example 1, only one side of the first sheet having the through holes is laminated without embedding the second sheet. (First sheets A1 and B1, A2 and B2), and concave shapes were formed respectively. The recess was filled with the metal paste described in Example 1 by screen printing and dried at 60 ° C. for 60 minutes.

  And while heating the 1st sheet | seat of A1 and B1, A2 and B2 and the 1st sheet | seat B3 to the 60 degree | times temperature using the contact | adherence liquid with the 1st sheet | seat of a total of 5 layers, Pressure was applied.

  As a result of observing the deformation of the portion filled with the metal paste, a depression was confirmed on the surface of the metal paste.

  Next, this laminate was heated and sintered in a reducing atmosphere at 1350 ° C. for 20 hours to obtain a ceramic wiring board on which a metal layer was formed.

  As a result of measuring the flatness of the metal layer surface by the stylus method with respect to the produced ceramic wiring substrate, the maximum height difference was 150 μm / 10 mm, a metal layer with poor flatness was formed, and deformation of the substrate was recognized. . Further, the metal layer portion was cut, and the vicinity of the metal layer was observed with a binocular microscope. As a result, a gap that seemed to be poorly filled was confirmed at the interface between the insulating base and the metal layer.

It is process drawing for demonstrating an example of the manufacturing method of the composite sheet in this invention. It is process drawing for demonstrating the other example of the manufacturing method of the composite sheet in this invention. It is process drawing for demonstrating the manufacturing method of the ceramic substrate which has a metal layer using the composite sheet of this invention.

Explanation of symbols

1, 11, 51 ... 1st sheet 2, 12 ... 2nd sheet 2a, 12a, 52a ... 2nd sheet punching part 3, 13 ... Through hole 4, 14, .... Upper punch 5, 15 ... Opening 6, 16 ... Lower punch 7, 17 ... Solvent 57 ... Metal layer 58 ... Metallized wiring layer 59 ... Via conductor A, B ...・ Composite sheets A ', B' ... Swelled composite sheet C ... Composite laminate D ... Ceramic substrate

Claims (8)

A first sheet to the second sheet laminate obtained by laminating, by pressing from the second sheet side, replacing a part of the first sheet portion of said second sheet the composite step of producing a composite sheet, and supplies the solvent to the boundary between the part of the first sheet and said second sheet in the composite sheet obtained in the complexing step, before Kisakai A composite sheet comprising: a swelling step in which at least one of the sheets is allowed to permeate and swell at the boundary portion; and an integration step in which the composite sheet obtained in the swelling step is pressed in the thickness direction. Production method.   The method for producing a composite sheet according to claim 1, further comprising a perforating step for forming a through hole in advance at a predetermined position of the first sheet prior to the combining step.   The method for producing a composite sheet according to claim 1 or 2, wherein the first sheet is a ceramic sheet. The method for producing a composite sheet according to claim 3 , wherein the second sheet is a metal sheet. 5. The method for producing a composite sheet according to claim 4 , wherein the second sheet contains 10 to 60% by volume of a low melting point metal powder and 40 to 90% by volume of a high melting point metal powder. . The composite sheet produced by the manufacturing method according to claim 1 is laminated with another first sheet and / or another composite sheet to produce a composite laminate. A manufacturing method of a layered product. The composite sheet produced by the method according to 請 Motomeko 4 or 5, and firing the produced composite laminated body by laminating the other of the first sheet and / or other composite sheets, metal layer A method for producing a ceramic substrate, comprising producing a ceramic substrate. Before the inner surface and / or the Kifuku case laminate, method for producing a ceramic substrate according to claim 7, characterized in that the circuit pattern is formed by conductive material.

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