JP4333425B2 - Sensor device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a sensor device including at least a plurality of substrates having sensor elements, and a method for manufacturing the same.

  Conventionally, for example, Non-Patent Document 1 is disclosed as a sensor device formed by combining at least a plurality of substrates having sensor elements.

  The magnetic sensor shown in Non-Patent Document 1 is a magnetic sensor having three Hall elements for detecting a three-axis magnetic field, and is constituted by two substrates. The first substrate (n-Si wafer) has three Hall elements formed by ion implantation, and a predetermined region including two Hall elements (for example, x, y detection) is polyimide on the substrate surface. It is processed into a cantilever shape having The two cantilevers are bent by thermal contraction of polyimide so that the Hall element formation surface is perpendicular to the substrate surface. The two cantilevers are formed at predetermined positions with respect to the substrate so that the angle formed by the Hall element formation surfaces is approximately 90 degrees. Further, the second substrate (n-Si wafer) has a cavity portion formed by anisotropic etching for housing and fixing the cantilever.

Then, the second substrate is fixed on the first substrate with the cantilever bent portion inserted into the cavity, and the cantilever is brought into close contact with the inner wall surface of the cavity by electrostatic force, and further heated. Thereby, the magnetic sensor formed by combining two substrates using polyimide as an adhesive layer (intermediate layer) is formed.
Yoshiyuki Watanabe et al., Hall effect type triaxial magnetic sensor manufactured by micro assembly technology, IEEJ Transactions E, 2002, Vol. 122, No. 4, p212-216

  In the case of the magnetic sensor described above, the cantilever of the first substrate is bent, and the cantilever is fixed to the inner wall surface of the cavity portion of the second substrate, so that the Hall element formation surfaces (the first substrate surface and the second substrate surface) The angle formed by the folding surface of the cantilever fixed to the inner wall surface of the cavity portion of the substrate is held at a predetermined angle.

  However, in order to bend the cantilever in this way, it is necessary to thin the bent portion, and the bent portion may cause a crack in the bent portion, and in some cases, the bent portion may be cut. . Further, in order to set the angle formed by the Hall element formation surfaces to a predetermined angle, it is necessary to position and fix the second substrate with respect to the first substrate with high accuracy.

  SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a sensor device including a plurality of substrates that do not require bending of the substrates and allows easy positioning of the substrates, and a method for manufacturing the same.

  In order to achieve the above object, the sensor device according to claim 1 is a sensor device comprising a combination of at least a plurality of substrates having sensor elements, and at least a removal region having a predetermined depth with respect to the substrate surface. The sensor element forming surface includes a mother substrate having one location and an insertion substrate into which at least a part is inserted into the removal region, and the insertion substrate is inserted into the removal region and fixed to the mother substrate. It is characterized by having a predetermined angle.

  Thus, according to the sensor device of the present invention, the mother board and the insertion board are positioned by inserting the insertion board into the removal region provided in the mother board. Therefore, positioning for determining the relative positions of the two substrates is easier than before.

  In addition, the angle formed between the separate substrate surfaces on which the sensor elements are formed is the angle formed between the formation surfaces of the sensor elements. Therefore, even if the substrates are not bent as in the prior art, by adjusting the angle formed between the substrates, the angle formed between the formation surfaces of the sensor elements can be set to a predetermined angle. Therefore, the sensor device of the present invention can detect different phases (multi-axis).

  It should be noted that at least a sensor device formed by combining a plurality of substrates having sensor elements may be configured by combining only a plurality of substrates having sensor elements, or together with a plurality of substrates having sensor elements. It may be configured by combining substrates that do not have.

  Here, the predetermined angle formed by the sensor element forming surfaces may be at least in a state where the sensor element forming surfaces are not in the same plane. This is preferable because the angle calculation based on the output from becomes easy.

  As a configuration in which the sensor element formation surfaces form an angle of approximately 90 degrees with each other, for example, as described in claim 2, each of the mother substrates has two removal regions and is inserted into the removal region. In the case where the substrate has a sensor element, the sensor element forming surfaces of the insertion substrate may be at an angle of approximately 90 degrees with the insertion substrate inserted in the removal region.

  In this case, in the state where the insertion substrate is inserted and fixed in the removal region, the two removal regions are formed on the mother substrate so that the angle formed by the surfaces of the two insertion substrates provided with the sensor elements is approximately 90 degrees. For example, in a state where the insertion substrate is inserted and fixed in the removal region, the angle formed by the formation surfaces of the sensor elements provided on the insertion substrate can be set to approximately 90 degrees.

  Further, as described in claim 3, when the mother board and the insertion board each have a sensor element and the removal area has a side surface substantially perpendicular to the surface of the mother board, the insertion board is inserted into the removal area. In a state where the sensor element is fixed to the mother board, the sensor element forming surfaces can form an angle of approximately 90 degrees with each other.

  As described above, when the removal region has a side surface substantially perpendicular to the surface of the mother substrate, the surfaces of the mother substrate and the insertion substrate are substantially the same with each other in a state where the insertion substrate is inserted and fixed in the removal region. An angle of 90 degrees is formed. Therefore, the angle formed by the formation surfaces of the sensor elements respectively formed on the mother board and the insertion board can be approximately 90 degrees.

  The insertion board may be fixed to the mother board, for example, by inserting the insertion board into a removal region provided substantially equal to the insertion site of the insertion board. In addition, for example, as described in claim 4, the insertion substrate has a protruding portion that protrudes from the substrate surface, and the protruding portion is a portion of the removal region in the mother substrate in a state where the insertion substrate is inserted into the removal region. It may be fixed to the surrounding site. In this case, the protruding portion and the peripheral portion are fixed in a state where the protruding portion is locked and positioned at the peripheral portion of the removal region on the mother substrate. As a fixing method, adhesion by an adhesive, fitting between a protruding portion and a groove portion corresponding to the protruding portion provided in the surrounding portion, or the like can be applied.

  Specifically, as described in claim 5, the insertion board has a plurality of connection terminals electrically connected to the sensor element as protrusions, and the mother board is inserted on the substrate surface excluding the removal region. It is preferable that the connection terminal and the wiring part are electrically connected in a state where the connection terminal is fixed to the peripheral portion of the removal region in the mother substrate.

  Here, it is difficult to provide a wiring portion having a predetermined pattern on the inner wall of the removal region. However, according to the present invention, since the connection terminal is fixed to the peripheral part of the removal region in the mother board, if the wiring part is provided on the substrate surface including the peripheral part, the electrical connection between the connection terminal and the wiring part Connection can be easily secured. In addition, an electrode for detecting the output of each sensor element can be provided on the same plane of the mother board.

  In the fifth aspect, it is preferable that the connection terminal is melted and joined to the wiring portion. In this case, the sensor element provided on the insertion board and the wiring part provided on the mother board are stably electrically connected. Further, the insertion board is stably fixed to the mother board.

  Here, the removal region may be a groove portion that is a non-through hole, or may be a through hole that penetrates both opposing surfaces of the mother substrate as described in claim 7. In the case of a through hole, the mother board and the insertion board can be arranged in the liquid, and the insertion board can be automatically positioned in the through hole of the mother board by the flow of the liquid passing through the through hole as the removal region. .

  Specifically, as described in claim 8, the insertion board has a substantially square surface, and a plurality of sets of connection terminals are provided in parallel to the four sides constituting the surface. In this case, the electrical connection between the sensor element of the insertion board and the wiring part of the mother board can be ensured regardless of which side is inserted into the through hole as the insertion tip.

  In addition, as described in claim 9, the surface of the insertion board has a rectangular shape, and the connection terminal is a straight line connecting points having equal distances from the corner vertices on the two sides constituting the rectangular corner. When provided above, when the insertion board is inserted into the through-hole with the corner portion as an insertion tip, electrical connection between the sensor element of the insertion board and the wiring part of the mother board can be ensured.

  Further, as described in claim 10, when the insertion board has a weight portion made of a material having a specific gravity larger than that of the substrate at the insertion tip, the insertion board uses the weight portion as an insertion tip to form a through hole. Inserted. Therefore, if the connection terminal is formed at a predetermined position of the board with respect to the weight part, it is possible to ensure electrical connection between the sensor element of the insertion board and the wiring part of the mother board.

  In addition, as described in claim 11, when sensor elements having the same size and shape are provided on both opposing surfaces of the insertion substrate, respectively, a region around the through hole sandwiching the through hole is provided. Even if the wiring portion is formed only on one side, the electrical connection between the connection terminal and the wiring portion can be ensured regardless of the front and back surfaces of the insertion board.

  Further, as described in claim 12, when wiring portions are respectively provided in both peripheral portions facing each other with the removal region of the mother board interposed therebetween, both of the opposing substrates of the insertion board are opposite to claim 11. Even if the sensor element and the connection terminal are formed on only one of the front surfaces, the electrical connection between the connection terminal and the wiring portion can be ensured regardless of the front and back surfaces of the insertion board.

  In addition, as a sensor element of Claims 1-12, a Hall element can be applied as described in Claim 13.

  Next, a method for manufacturing a sensor device comprising a combination of a plurality of substrates having at least sensor elements includes a step of forming sensor elements on at least a part of the plurality of substrates, and a plurality of substrates as claimed in claim 14. One of the substrate is used as a mother substrate, a step of forming at least one removal region of a predetermined depth on the mother substrate, and the remaining substrate is used as an insertion substrate, and at least a part of the insertion substrate is inserted into the removal region and inserted. And a step of fixing the substrate to the mother board, wherein the formation surfaces of the sensor elements form a predetermined angle with each other in a state where the insertion board is fixed to the mother board.

  Since the operational effects of the present invention are the same as the operational effects of the invention described in claim 1, the description thereof is omitted.

  The removal region may be formed by etching the mother substrate as described in claim 15, for example. Further, when the mother substrate is composed of a plurality of layers, as described in claim 16, the mother substrate may be formed by stacking layers that have been processed into a predetermined shape in advance.

  Since the operational effects of the inventions according to claims 17 to 22 are the same as the operational effects of the inventions according to claims 2 to 7, the description thereof is omitted.

  When the removal region is a through hole, the insertion substrate and the mother substrate are disposed in the liquid as in claim 23, and the flow of the liquid passing through the removal region of the mother substrate causes at least the insertion substrate to be in the removal region. A part may be inserted. In this case, for example, even if the insertion substrate is small and difficult to handle manually, the insertion substrate can be automatically inserted into the removal region according to the above-described method.

  Since the operational effects of the inventions according to claims 24 to 29 are the same as the operational effects of the inventions according to claims 8 to 13, the description thereof is omitted.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a magnetic sensor will be described as an example of a sensor device having a plurality of sensor elements and combining a plurality of substrates.

(First embodiment)
1A and 1B are diagrams illustrating a schematic configuration of a magnetic sensor according to the present embodiment, in which FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view taken along a line AA in FIG. In FIG. 1B, for convenience, the wiring portion and the like are omitted, and only the substrate and the connection terminals are shown.

  As shown in FIGS. 1A and 1B, the magnetic sensor 100 according to the present embodiment includes two substrates, a mother substrate 10 and an insertion substrate 20, as a plurality of substrates.

  The mother substrate 10 is a p-type silicon substrate, which is a semiconductor substrate, and has one square columnar removal region 11 corresponding to the shape of the insertion site of the insertion substrate 20 and having a side surface substantially perpendicular to the substrate surface. ing. Thus, when the mother substrate 10 is a semiconductor substrate, the removal region 11 having a side surface substantially perpendicular to the substrate surface can be formed by a known trench formation technique (trench etching). Note that the shape and number of the removal regions 11 are not limited to the above example. However, the shape and size of the removal region 11 is substantially the same as the shape of the insertion portion of the insertion substrate 20 in order to position the insertion substrate 20 in the removal region 11, and is the same as the insertion portion of the insertion substrate 20? It is preferable to have a slightly larger size to facilitate insertion.

  Further, the mother substrate 10 has one Hall element 30a on the surface where the removal region 11 is open. In the present embodiment, the Hall element 30a is formed by injecting an n-type impurity such as phosphorus into the mother substrate 10 from the upper surface side and thermally diffusing it. In addition, the Hall element 30a can be formed by sputtering, vapor deposition, or the like using a material such as indium antimony or gallium arsenide. In FIG. 1A, the Hall element 30a is simplified for convenience.

  Further, the mother substrate 10 has a hall element wiring portion 31 provided on the insertion substrate 20 in a predetermined region including the peripheral region of the removal region 11. In this embodiment, the wiring part 31 consists of Al, and four wiring parts 31 are formed so that it may connect to each connection terminal mentioned later.

  The insertion substrate 20 is fixed to the mother substrate 10 while being inserted into the removal region 11 provided in the mother substrate 10, and the surface of the mother substrate 10 and the surface of the insertion substrate 20 are approximately 90 to each other in a fixed state. An angle of degrees.

  Further, the insertion substrate 20 has one Hall element 30b on the surface thereof, like the mother substrate 10. The hall element 30 b is electrically connected to a connection terminal 33 as a protruding portion protruding from the substrate surface via the connecting wiring 32. The insert substrate 20 in this embodiment is a p-type silicon substrate, like the mother substrate 10, and has a Hall element 30b formed by ion implantation. In addition, the Hall element 30b can be formed by sputtering, vapor deposition, or the like using a material such as indium antimony or gallium arsenide. In FIG. 1A, the Hall element 30b is simplified for convenience.

  The connection terminals 33 are solder bumps, and are composed of a total of four bumps: a pair of bumps for flowing a bias current to the Hall element 30b and a pair of bumps for detecting the Hall electromotive force generated in the Hall element 30b. Yes. Then, in a state where the insertion board 20 is inserted into the removal region 11, the connection terminal 33 is locked to the peripheral portion of the removal region 11, and the connection terminal 33 itself is melted to be provided in the peripheral portion of the mother substrate 10. 31 is joined. Therefore, the Hall element 30 b provided on the insertion board 20 is electrically connected to the wiring portion 31 provided on the mother board 10 via the connection terminal 33. In addition, an application electrode for flowing a bias current for all the Hall elements 30a and 30b and a detection electrode for Hall electromotive force are provided on the surface of the mother substrate 10. Therefore, wiring to the application electrode and the detection electrode is easy.

  As described above, in the magnetic sensor 100 according to the present embodiment, the connection terminal 33 provided on the insertion substrate 20 is joined to the wiring portion 31 provided on the mother substrate 10 in a state where the insertion substrate 20 is inserted into the removal region 11. Therefore, the insertion board 20 is stably fixed to the mother board 10. In the fixed state, the formation surfaces of the two Hall elements 30a and 30b form an angle of approximately 90 degrees with each other. Therefore, the output voltages of the Hall elements 30a and 30b are sine waves that are approximately 90 degrees out of phase, making it easy to calculate the angle. Thus, the magnetic sensor 100 according to the present embodiment can be applied as a rotation angle sensor that detects a two-dimensional magnetic field change.

  In addition, the above-mentioned magnetic sensor 100 can be manufactured by the manufacturing process shown below, for example. First, a process for preparing the mother board 10 will be described. A p-type silicon substrate is prepared as the mother substrate 10, and the Hall element 30 a is formed in a portion other than the formation region of the removal region 11. In the present embodiment, an n-type impurity such as phosphorus (P) is ion-implanted into a predetermined region of the mother substrate 10, and after the ion implantation, a heat treatment for activation is performed to form an n-type low-concentration impurity diffusion region. To form the Hall element 30a.

  After the formation of the Hall element 30a, a removal region 11 having a predetermined depth is formed on the mother substrate 10 as shown in FIGS. For example, a silicon oxide film is stacked on the surface of the mother substrate 10 including the Hall element 30a, and is patterned so that the formation region of the removal region 11 is opened, thereby forming an etching mask (not shown). The formation region of the removal region 11 is determined according to the insertion site of the insertion substrate 20. Then, a predetermined region of the mother substrate 10 is trench-etched by plasma through the etching mask. As a result, a quadrangular columnar removal region 11 having a side surface substantially perpendicular to the surface of the mother substrate 10 is formed.

  Then, as shown in FIG. 1A, an Al film is formed on the surface of the mother substrate 10 so as to be in contact with each connection terminal 33 of the insertion substrate 20 at a site around the removal region 11, and patterned to form a wiring portion. 31 is formed. The mother board 10 is prepared by the above process.

  Next, a process for preparing the insertion board 20 will be described. A p-type silicon substrate is prepared as the insertion substrate 20, and a Hall element 30b is formed on the substrate surface. In the present embodiment, an n-type impurity such as phosphorus (P) is ion-implanted into a predetermined region of the insertion substrate 20, and after the ion implantation, a heat treatment for activation is performed to obtain an n-type low-concentration impurity diffusion region. To form the Hall element 30b.

  In addition, an n-type impurity such as phosphorus (P) is ion-implanted so as to be partially connected to the Hall element 30b, and heat treatment for activation is performed to form a high-concentration impurity diffusion region that is a connection wiring 32. To do.

  Further, an interlayer insulating film (not shown) made of, for example, a silicon nitride film is deposited on the surface of the insertion substrate 20. Then, by photolithography and dry etching, a contact hole (not shown) is formed at an end position of the connecting wiring 32 that is not connected to the hall element 30b. As shown in FIGS. A solder bump 33 is formed. At this time, the connection terminal 33 is formed with such a height that the protruding portion forming portion of the insertion substrate 20 is not inserted into the removal region 11. Therefore, the insertion board 20 can be positioned with respect to the mother board 10 by the connection terminals 33 being locked to the surface of the mother board 10 in the insertion step described later. The insertion board 20 is prepared by the above process.

  The height of the connection terminal 33 is limited to the above example as long as the connection terminal 33 is locked to the surface of the mother board 10 and the insertion board 20 can be positioned with respect to the mother board 10. is not. For example, the height of the protrusion is not limited to the above example in the case where positioning and fixing are performed simultaneously by fitting the protrusion into a recess provided in the mother board 10.

  Next, the insertion substrate 20 is inserted into the removal region 11 of the mother substrate 10. As a result, the connection terminal 33 is locked to the surface of the mother board 10 so as to be in contact with the wiring portion 31, and the insertion board 20 is positioned with respect to the mother board 10. Note that the removal region 11 in the present embodiment has the same shape as the insertion portion (the portion up to the connection terminal 33) of the insertion substrate 20 and is provided in substantially the same size. Therefore, the insertion site itself of the insertion substrate 20 is also at least partially in contact with the inner wall of the removal region 11, and the insertion substrate 20 is stably positioned with respect to the mother substrate 10.

  In the positioning state, the connection terminal 33 is melted by heating, and the connection terminal 33 and the wiring portion 31 are joined. The magnetic sensor 100 is formed by the above process.

  As described above, in the present embodiment, by inserting the insertion board 20 into the removal region 11 provided on the mother board 10, the connection terminal 33 is locked to the peripheral portion of the removal area 11, and the mother board 10. Then, the insertion board 20 is positioned. Therefore, positioning for determining the relative positions of the two substrates 10 and 20 is easier than in the prior art.

  In addition, Hall elements 30a and 30b are formed on the respective substrates 10 and 20, and an angle formed between the substrate surfaces is an angle formed between the formation surfaces of the Hall elements 30a and 30b. Therefore, even if the substrate is not bent as in the prior art, by inserting the insertion substrate 20 into the removal region 11 having a side surface perpendicular to the surface of the mother substrate 10, the formation surfaces of the Hall elements 30a and 30b can be reduced. The formed angle can be approximately 90 degrees.

  Note that when the electrodes of all the Hall elements 30a and 30b (for bias current application and Hall electromotive force detection) are to be formed on the mother board 10, the insertion board 20 has a connection terminal 33 as a protrusion. Otherwise, the electrical connection between the Hall element 30b and the wiring part 31 cannot be ensured on the surface of the mother board 10, so that it is necessary to provide the wiring part 31 having a predetermined pattern on the inner wall of the side surface of the removal region 11. However, it is difficult to provide the patterned wiring part 31 on the inner side wall of the removal region 11.

  On the other hand, in the present embodiment, the connection terminal 33 is formed on the insertion substrate 20, and the wiring portion 31 is formed in a predetermined region including the peripheral portion of the removal region 11 of the mother substrate 10. Therefore, when the insertion board 20 is inserted into the removal region 11 of the mother board 10, the connection terminal 33 can be in contact with the wiring portion 31 on the surface of the mother board 10. That is, the wiring part 31 can be easily formed.

  In the above-described manufacturing process of the magnetic sensor 100, after the insertion substrate 20 is inserted into the removal region 11, the removal region 11 may be filled with resin to fill the gap between the removal region 11 and the insertion substrate 20. Thereby, the fixed state of the insertion board | substrate 20 with respect to the mother board | substrate 10 can be stabilized.

  The formation of the Hall elements 30a and 30b on the mother board 10 and the insertion board 20 may be performed as separate processes. However, if the processes are performed as the same process, the manufacturing process can be shortened.

  Moreover, in this embodiment, the example which forms the removal area | region 11 by an etching was shown. However, when the mother substrate 10 is a laminated substrate formed by laminating a plurality of layers, the removal region 11 can be formed on the mother substrate 10 by laminating each layer processed in advance.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. 2 and 3 are diagrams showing an outline of the manufacturing method of the magnetic sensor 100 in the present embodiment. FIG. 2 is a diagram before insertion, and FIG. 3 is a diagram showing after the insertion. 2 and 3, (a) is a plan view seen from the front surface side of the insertion substrate 20, and (b) is a cross-sectional view seen from the side surface side of the insertion substrate 20. 2 and 3, only the connection terminal 33 of the insertion substrate 20 is shown for convenience, and the formation region of the removal region in the mother substrate 10 is indicated by a broken line.

  Since the magnetic sensor 100 according to the second embodiment is often in common with that according to the first embodiment, a detailed description of the common parts will be omitted, and different parts will be mainly described below.

  The second embodiment is different from the first embodiment in that the removal region is a through hole.

  As shown in FIGS. 2A and 2B, the mother substrate 10 in the present embodiment has a side surface perpendicular to the substrate surface and has a quadrangular columnar removal region 11a that is a through hole. . Although not shown, Hall elements 30a and 30b are formed on the mother board 10 and the insertion board 20, respectively.

  As described above, even if the removal region 11a is a through-hole, the connection terminal 33 formed on the insertion substrate 20 is locked to the peripheral portion of the removal region 11a of the mother substrate 10 and positioned as in the first embodiment. Then, the insertion substrate 20 can be fixed to the mother substrate 10 by bonding to the wiring part 31. Accordingly, in the formed magnetic sensor 100, the forming surfaces of the Hall elements 30a and 30b form an angle of approximately 90 degrees, and the magnetic sensor 100 shown in the present embodiment also has a rotation angle for detecting a two-dimensional magnetic field change. It can be applied as a sensor.

  Here, if the removal region 11 is a non-through hole as shown in the first embodiment, for example, when the insertion substrate 20 is very small, it is difficult to insert it into the removal region 11 manually or by a machine. It is. However, as shown in the present embodiment, when the removal region 11a is a through hole, the insertion substrate 20 can be automatically inserted into the removal region 11a by the flow of liquid passing through the removal region 11a.

  Specifically, the mother substrate 10 and the insertion substrate 20 (in the state before the insertion step in the first embodiment) on which the Hall elements 30a, 30b and the like are formed are filled with a liquid 40 such as pure water ( (Not shown). Then, in a state where the mother board 10 is fixed to a fixing device (not shown), as shown in FIGS. 2A and 2B, the mother board 10 is opposed to the surface on which the wiring portion 31 is formed. The flow of the liquid 40 that passes through the removal region 11a toward the surface to be performed (the white arrow in FIGS. 2A and 2B) is created.

  As a result, as shown in FIGS. 3A and 3B, the insertion substrate 20 is inserted into the removal region 11 a along the flow of the liquid 40, and the connection terminals 33 provided on the insertion substrate 20 are connected to the mother substrate 10. Lock to the surface. Then, in the locked state, the liquid 40 is discharged, or both the substrates 10 and 20 are taken out from the liquid 40, and the connection terminal 33 is melted by heating and joined to the wiring part 31. As described above, the magnetic sensor 100 according to this embodiment can be formed.

  As described above, when the insertion board 20 is automatically inserted into the mother board 10, it is necessary to form the connection board 33 of the insertion board 20 at a predetermined height so as not to be inserted into the removal region 11a.

  2 and 3, the example in which the four connection terminals 33 are provided on the insertion board 20 is shown as in the first embodiment. However, when the insertion substrate 20 is inserted into the removal region 11a by the flow of the liquid 40, the insertion substrate 20 is not necessarily inserted into the removal region 11a from a certain position. Therefore, for example, as shown in FIG. 4, the insertion board 20 has a substantially square surface, and four connection terminals 33 are provided in parallel to each side with respect to the four sides constituting the surface. May be. In this case, no matter which side of the insertion substrate 20 is inserted into the removal region 11 a as the insertion tip, electrical connection between the hall element 30 b of the insertion substrate 20 and the wiring portion 31 is ensured via the connection terminal 33. Can do. FIG. 4 is a schematic plan view of the insertion board 20 and shows only the connection terminal 33.

  It is also conceivable that the insertion substrate 20 is inserted into the removal region 11a from the corner of the substrate. Therefore, the connection board which makes 4 sets on the straight line which connected the point from which the distance from the corner | angular vertex in the two sides which comprise the rectangular corner | angular part has a rectangular shape, and the same distance from the corner | angular vertex is formed. 33 may be provided. In this case, even if the insertion substrate 20 is inserted into the removal region 11a with the corner portion as the insertion tip, electrical connection between the hall element 30b of the insertion substrate 20 and the wiring portion 31 is ensured via the connection terminal 33. Can do. In particular, as shown in FIG. 5, when the insertion board 20 has a substantially square surface and four connection terminals 33 are provided for each corner, which corner is the insertion tip. Is preferably inserted into the removal region 11a because the electrical connection between the Hall element 30b of the insertion substrate 20 and the wiring portion 31 can be secured via the connection terminal 33. FIG. 5 is also a schematic plan view of the insertion board 20 and shows only the connection terminal 33.

  As shown in FIG. 6, a weight portion 50 made of a material (for example, glass) having a higher specific gravity than the substrate 20 may be provided at the insertion tip of the insertion substrate 20. In this case, since the insertion board 20 is inserted into the removal region 11a with the weight portion 50 as an insertion tip, if the connection terminal 33 is formed at a predetermined position of the insertion board 20 with respect to the weight portion 50, the connection terminal 33 is used. Thus, electrical connection between the Hall element 30b of the insertion substrate 20 and the wiring portion 31 can be ensured. FIG. 6 is a schematic plan view of the insertion substrate 20, and for convenience, the Hall element 30 b and the connecting wiring 32 are omitted.

  Here, in the case where the Hall element 30b or the like is formed only on one surface of the insertion substrate 20 and the wiring part 31 is formed only on one of the surrounding peripheral portions across the removal region 11a of the mother substrate 10, In the insertion, the formation surface of the hall element 30b and the formation position of the wiring part 31 may not coincide. Therefore, for example, as shown in FIG. 7, if the Hall elements 30b having the same size and shape are formed on both opposing surfaces of the insertion substrate 20, one of the surrounding portions sandwiching the removal region 11a of the mother substrate 10 is formed. Even if the wiring portion 31 is formed only in this manner, the electrical connection between the connection terminal 33 and the wiring portion 31 can be ensured regardless of the front and back surfaces of the insertion substrate 20. FIG. 7 is a schematic side view of the insertion board 20, and only the connection terminals 33 are shown for convenience.

  In addition, as shown in FIG. 8, the wiring portions 31 may be formed in both peripheral portions facing each other with the removal region 11 a of the mother substrate 10 interposed therebetween. In this case, contrary to FIG. 7 described above, even if the Hall element 30b or the like is formed on only one of both opposing surfaces of the insertion substrate 20, the connection terminal 33 and the wiring are connected regardless of the front and back surfaces of the insertion substrate 20. Connection with the unit 31 can be ensured. FIG. 8 is a schematic plan view of the mother board 10, and for convenience, only the wiring region 31 in the removal region 11a and the surrounding area is illustrated.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made.

  In the present embodiment, an example in which the sensor elements are Hall elements 30a and 30b is shown. However, the sensor element is not limited to the above example.

  Further, in the present embodiment, an example in which the magnetic sensor 100 includes two Hall elements 30a and 30b has been described. However, the number of Hall elements formed is not limited to two. For example, as shown in FIG. 9, in the configuration in which two removal regions 11 are formed on the mother substrate 10 and the insertion substrate 20 is inserted and fixed in each removal region 11, a Hall element is provided on each substrate 10, 20. By forming 30a, 30b, and 30c, the angle formed by the formation surfaces of the Hall elements 30a, 30b, and 30c can be set to approximately 90 degrees. In this case, since a three-dimensional magnetic field change can be detected, the magnetic sensor 100 can be applied as a position sensor.

  In the present embodiment, an example in which the substrates 10 and 20 have Hall elements 30a and 30b, respectively, is shown. However, the magnetic sensor may be configured by assembling only a plurality of substrates having Hall elements, or may be configured by combining a plurality of substrates having Hall elements and a substrate not having Hall elements. For example, in FIG. 9 described above, the mother board 10 may have a configuration without the Hall element 30a. In this case, since the formation surfaces of the Hall elements 30b and 30c formed on the insertion substrate 20 are approximately 90 degrees, the magnetic sensor 100 can detect a two-dimensional magnetic field change.

  The angle formed by the sensor element forming surfaces is not limited to approximately 90 degrees. The predetermined angle formed by the sensor element forming surfaces may be in a state where at least the sensor element forming surfaces are not in the same plane. The predetermined angle is determined by the angle of the side surface of the removal region 11 with respect to the substrate surface of the mother substrate 10 and / or the angle of the protruding portion (connection terminal 33) protruding from the insertion substrate 20 with respect to the substrate surface. However, as shown in the present embodiment, when the sensor element forming surfaces form an angle of approximately 90 degrees, angle calculation based on the output from each sensor element can be facilitated.

  Further, in the present embodiment, the insertion substrate 20 has the connection terminal 33 as the protruding portion protruding from the substrate surface, and the connection terminal 33 itself is melted by heating and joined to the wiring portion 31. However, the protruding portion is not limited to the above example. For example, the protruding portion may be fixed to the surrounding portion by bonding or the like in a state where the protruding portion is locked and positioned on the surrounding portion of the removal region 11 (11a) in the mother substrate 10. In addition, a concave portion corresponding to the protruding portion may be formed in the peripheral portion of the mother board 10 and fixed by fitting the protruding portion into the concave portion.

  In the present embodiment, the insertion board 20 has the connection terminal 33, and the connection terminal 33 is melted to fix the insertion board 20 to the mother board 10. However, the insertion substrate 20 does not necessarily have the connection terminal 33 (projection). For example, as shown in FIGS. 10A and 10B, the insertion substrate 20 itself is provided with irregularities by etching or the like, and the insertion substrate 20 is inserted into the removal region 11 (11a) formed corresponding to the irregularities. In addition, the insertion board 20 can be fixed to the mother board 10 by fitting. 10A is a plan view seen from the upper surface side, and FIG. 10B is a cross-sectional view taken along the line BB in FIG.

It is a figure which shows schematic structure of the magnetic sensor in this embodiment, (a) is a perspective view, (b) is sectional drawing in the AA cross section of (a). It is a figure which shows the manufacturing method of the magnetic sensor in 2nd Embodiment, and has shown before insertion of an insertion board | substrate. (A) is the top view seen from the surface side of the insertion board | substrate, (b) is sectional drawing seen from the side surface side of the insertion board | substrate. It is a figure which shows the manufacturing method of a magnetic sensor, and has shown after insertion of an insertion board | substrate. (A) is the top view seen from the surface side of the insertion board | substrate, (b) is sectional drawing seen from the side surface side of the insertion board | substrate. It is a top view of the insertion board which shows the modification in a 2nd embodiment. It is a top view of the insertion board which shows the modification in a 2nd embodiment. It is a top view of the insertion board which shows the modification in a 2nd embodiment. It is a side view of the insertion board which shows the modification in a 2nd embodiment. It is a schematic plan view of the mother board which shows the modification in a 2nd embodiment. It is a perspective view which shows the other example. It is a figure which shows another example, (a) is the top view seen from the upper surface side, (b) is sectional drawing in the BB cross section of (a).

Explanation of symbols

10 ... Mother board 11 ... Removal region 11a ... Removal region (through hole)
20 ... Insertion board 30a, 30b, 30c ... Hall element 31 ... Wiring part 33 ... Connection terminal 40 ... Liquid 100 ... Magnetic sensor

Claims (29)

At least a sensor device formed by combining a plurality of substrates having sensor elements,
A mother substrate having at least one removal region having a predetermined depth with respect to the substrate surface;
An insertion substrate at least partially inserted into the removal region,
The sensor device, wherein the insertion surfaces of the sensor elements form a predetermined angle with each other in a state where the insertion substrate is inserted into the removal region and fixed to the mother substrate. The mother substrate has the two removal regions,
Each of the insertion substrates inserted into the removal region has the sensor element,
2. The sensor device according to claim 1, wherein in the state where the insertion substrate is inserted into the removal region, the formation surfaces of the sensor elements on the insertion substrate form an angle of approximately 90 degrees with each other. Each of the mother board and the insertion board has the sensor element,
The removal region has a side surface substantially perpendicular to the surface of the mother substrate;
2. The sensor element forming surfaces are formed at an angle of approximately 90 degrees with each other in a state where the insertion substrate is inserted into the removal region and fixed to the mother substrate. Item 3. The sensor device according to Item 2. The insertion substrate has a protruding portion protruding from the substrate surface,
4. The sensor device according to claim 3, wherein the protrusion is fixed to a peripheral portion of the removal region on the mother substrate in a state where the insertion substrate is inserted into the removal region. The insertion board has a plurality of connection terminals electrically connected to the sensor element as the protrusions,
The mother board has a wiring portion of a sensor element provided on the insertion board on the substrate surface excluding the removal region,
5. The sensor device according to claim 4, wherein the connection terminal and the wiring portion are electrically connected in a state where the connection terminal is fixed to a portion around the removal region in the mother board. .   The sensor device according to claim 5, wherein the connection terminal is melted and joined to the wiring portion.   The sensor device according to claim 5, wherein the removal region is a through-hole penetrating both opposing surfaces of the mother substrate.   The sensor device according to claim 7, wherein the insertion board has a substantially square surface, and the connection terminals are provided in parallel to the four sides constituting the surface.   The surface of the insertion board has a rectangular shape, and the connection terminal is provided on a straight line connecting points having equal distances from the corner apexes on two sides constituting the rectangular corner. The sensor device according to claim 7.   The sensor device according to claim 7, wherein the insertion substrate has a weight portion made of a material having a specific gravity greater than that of the substrate at the insertion tip.   The sensor device according to any one of claims 7 to 10, wherein the sensor elements having the same size and shape are provided on both opposing surfaces of the insertion substrate.   The sensor device according to any one of claims 7 to 10, wherein the wiring portions are respectively provided in both peripheral portions facing each other across the removal region of the mother board.   The sensor device according to claim 1, wherein the sensor element is a Hall element. At least a method for manufacturing a sensor device by combining a plurality of substrates having sensor elements,
Forming the sensor element on at least a part of the plurality of substrates;
Forming one of the plurality of substrates as a mother substrate and forming at least one removal region of a predetermined depth on the mother substrate;
The remaining substrate is an insertion substrate, and at least a part of the insertion substrate is inserted into the removal region, and the insertion substrate is fixed to the mother substrate.
A method for manufacturing a sensor device, wherein the insertion surfaces of the sensor elements form a predetermined angle with the insertion substrate fixed to the mother substrate.   The method for manufacturing a sensor device according to claim 14, wherein the removal region is formed by etching the mother substrate.   15. The method of manufacturing a sensor device according to claim 14, wherein the mother substrate includes a plurality of layers, and the removal region is formed by stacking layers that have been processed into a predetermined shape in advance. Forming the two removal regions on the mother substrate;
By forming the sensor element on each of the insertion substrates inserted into the removal region,
17. The method according to claim 14, wherein the insertion surfaces of the sensor elements on the respective insertion substrates form an angle of approximately 90 degrees with each other in a state where the insertion substrate is fixed to the mother substrate. The manufacturing method of the sensor apparatus of description. Forming the sensor elements on the mother substrate and the insertion substrate,
By forming the removal region so as to have a side surface substantially perpendicular to the surface of the mother substrate,
18. The sensor device according to claim 14, wherein the insertion surfaces of the sensor elements form an angle of approximately 90 degrees with each other in a state where the insertion substrate is fixed to the mother substrate. Production method. The insertion substrate further includes a step of forming a protrusion protruding from the substrate surface,
19. The method of manufacturing a sensor device according to claim 18, wherein the protruding portion is fixed to a portion of the mother substrate around the removal region in a state where the insertion substrate is inserted into the removal region. Further comprising a step of forming a wiring portion of the sensor element formed on the insertion substrate on the substrate surface excluding the removal region of the mother substrate,
A plurality of connection terminals protruding from the surface of the substrate while being electrically connected to the sensor element are formed on the surface of the insertion substrate on which the sensor element is formed as the protruding portion, and the insertion substrate is formed in the removal region. The sensor device according to claim 19, wherein in the inserted state, the connection terminal is fixed to a portion around the removal region of the mother board, and the connection terminal is electrically connected to the wiring portion. Manufacturing method.   21. The method of manufacturing a sensor device according to claim 20, wherein the connection terminal is melted in a state where the connection terminal is in contact with the wiring portion and is joined to the wiring portion.   The method for manufacturing a sensor device according to claim 20 or 21, wherein the removal region is formed so as to penetrate both opposing surfaces of the mother substrate.   The insertion substrate and the mother substrate are arranged in a liquid, and at least a part of the insertion substrate is inserted into the removal region by the flow of the liquid passing through the removal region of the mother substrate. Item 23. A method for manufacturing the sensor device according to Item 22.   The insertion substrate has a substantially square surface, the connection terminals are formed in parallel to each of the four sides constituting the surface, and the insertion substrate having the connection terminals is disposed in the liquid. 24. A method of manufacturing a sensor device according to claim 23.   The surface of the insertion board has a rectangular shape, and the connection terminals are arranged on respective straight lines connecting points having equal distances from the corner vertices on each of two sides constituting each corner of the rectangular shape. 24. The method of manufacturing a sensor device according to claim 23, wherein the insertion substrate formed and having the connection terminal is disposed in the liquid.   24. The weight portion made of a material having a specific gravity larger than that of the substrate is bonded to the insertion tip of the insertion substrate, and the insertion substrate having the weight portion is disposed in the liquid. A method for manufacturing a sensor device.   The sensor elements having the same size and shape are formed on both opposing surfaces of the insertion substrate, respectively, and the insertion substrate on which the sensor element is formed is disposed in the liquid. Item 27. A method for manufacturing a sensor device according to any one of Items 23 to 26.   24. The wiring portion is formed in each of peripheral portions facing each other across the removal region of the mother substrate, and the mother substrate on which the wiring portion is formed is disposed in the liquid. The manufacturing method of the sensor apparatus of any one of -26.   The method for manufacturing a sensor device according to any one of claims 14 to 28, wherein the sensor element is a Hall element.

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