JP4326257B2 - Laser processing system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing system that performs processing for forming a predetermined number of microholes by irradiating a processing medium of a sheet to be conveyed with laser light.
[0002]
[Prior art]
In recent years, it has become popular to perform laser processing by irradiating a processing medium such as paper with a laser beam. Application examples of laser processing include, for example, watermark formation and anti-counterfeiting processing. In addition to forming a through-hole in the thickness direction on the processing medium, it is formed obliquely with respect to the thickness direction. Has also been done. Realization of simplification of the system configuration in the case of forming such an oblique through hole is desired.
[0003]
2. Description of the Related Art Conventionally, for example, what is described in the following patent documents is known as performing a predetermined process by irradiating a processing medium such as paper with a laser beam, for example, performing a forgery prevention process.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 2003-11558
In the laser processing described in the above-mentioned patent document, an identification mark for authenticity determination is formed by an assembly of microscopic holes formed by irradiating laser light at three different angles, and the three different angles. Are disclosed as being oblique (downward to the left), vertical, and oblique (downward to the right) with respect to the thickness direction.
[0006]
[Problems to be solved by the invention]
By the way, in the above-mentioned patent document, when the identification mark for authenticity determination is formed at three different angles, the laser irradiation angle with respect to the thickness direction of the processing medium (gift certificate) is determined by the laser oscillator or a predetermined lens configuration. It is conceptually shown that the processing medium (gift certificate) is tilted at the angle with respect to the laser irradiation angle adjusted or fixed (perpendicular to the thickness direction of the processing medium). In forming the microholes at a predetermined angle in the processing medium by the laser irradiation, it is important to simplify the mechanism configuration for setting the predetermined angle.
[0007]
That is, the present invention has been made in view of the above problems, and an object of the present invention is to provide a laser processing system that can easily configure a predetermined angle in a processing region with respect to the processing surface of a single wafer processing medium.
[0008]
[Means for Solving the Problems]
In order to solve the above-described problems, in the invention of claim 1, a single-wafer processing medium conveyed on the processing stage is irradiated with a laser beam so as to have a predetermined angle with respect to the thickness direction of the single-wafer processing medium. A laser processing system for performing processing for forming a predetermined number of microholes, wherein a laser beam is transferred to the single-wafer processing medium transported on the processing stage, or the transport direction of the single-wafer processing medium or the transport Laser irradiation means for forming the predetermined number of micro holes by scanning and irradiating in a direction perpendicular to the conveying direction, which is different from the direction, and vertical driving means comprising a vertical rod for moving the processing stage up and down, and A scanning rod having the same driving configuration as the vertical driving means is provided, the scanning rod is rotatably connected to a vertical rod of the vertical driving means, and the processing stage is moved by the laser irradiation means. Chromatography The irradiated by moving in a direction different from the scanning direction and configured fixed to the scanning drive means between the straight line pairs of the scanning driving means for scanning the sheet processing medium on the working stages as two pairs, a straight line the fixed scanning drive means, and tilting means for tilting the lower portion of the opposed sheet processing medium on the working stages in their respective set kick the end of the processing stage at a predetermined angle, at least, the laser irradiation The means is driven based on predetermined processing data, and the angle of the minute hole formed by laser irradiation on the single-wafer processing medium is determined, and the tilting means is driven up and down to specify the tilt angle of the processing stage. And a control processing means for adjusting.
[0009]
In the invention of claim 2, "the processing stage comprises a fixing means for fixing the sheet processing medium conveyed on the machining stage" Ru configuration der.
[0010]
Thus, the laser machining processing stage relative sheet processing medium, vertical movement drive means comprising a vertical rod for vertically moving the person the working stages for the laser irradiation direction, and the same as the vertical driving unit A scanning rod is provided in a driving configuration and is rotatably connected to the vertical rod, and the laser beam from the laser irradiation means is scanned in a direction perpendicular to the conveying direction of the sheet processing medium or a direction different from the conveying direction. By moving in a direction different from the laser irradiation scanning direction, scanning drive means for scanning the sheet processing medium on the processing stage as a set is provided at each corner portion, so that the sheet processing medium on the processing stage is set at a predetermined angle. Tilt and scan. In other words, each corner of the processing stage is moved up and down to tilt the single-wafer processing medium at a desired angle and scan in a direction different from the laser irradiation direction, thereby simplifying the configuration without changing the configuration of the laser irradiation means. Thus, it is possible to easily form micro holes of a predetermined angle in the single-wafer processing medium.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a schematic configuration diagram of a laser processing system according to the present invention. In FIG. 1, a laser processing system 11 is provided with a processing stage (described with reference to FIG. 2A) 12, and existing belt conveying means 13 and 14 are arranged on both sides thereof. A sheet processing medium such as paper or film (61 shown in FIG. 4) is conveyed by the belt conveying means 13 and 14 with the processing stage 12 interposed.
[0012]
Above the processing stage 12, a laser irradiation means 15 and a camera 16 as an imaging means are arranged. The laser irradiating means 15 forms a predetermined number of minute holes with a predetermined angle with respect to the thickness direction by irradiating the single-wafer processing medium with laser light, and includes a laser generating mechanism and a scanning mechanism (not shown). Existing systems can be used.
[0013]
The laser generation mechanism generates laser light appropriately selected, such as a CO ₂ laser and a YAG laser, using an existing laser generation mechanism, for example. Also, depending on the type of laser processing, for example, when scanning laser light one-dimensionally, a scanning mechanism such as a polygon mirror scanning mechanism or a one-dimensional moving mechanism of a mirror and a condensing lens component is adopted as a scanning mechanism. A galvano scan mechanism is employed when scanning laser light.
[0014]
Note that the irradiation focal point position can be made substantially constant with respect to the single-wafer processing medium by scanning the laser beam in a one-dimensional manner. In this embodiment, for example, scanning is performed in the medium conveyance direction. .
[0015]
The camera 16 images the position of the single-wafer processing medium positioned on the processing stage 12 and performs transfer positioning by a transfer means described later. That is, the first transfer unit 17 is disposed between the belt conveyance unit 13 and the processing stage 12, and the second transfer unit 18 is disposed between the processing stage 12 and the belt conveyance unit 14. The first and second transfer means 17 and 18 are connected to suction means (not shown) and provided with a suction plate at the tip, and both of the suction plates are driven to rotate up and down and substantially in the transport direction.
[0016]
That is, the first transfer means 17 is for sucking the sheet processing medium transported from the belt transport means 13 by the suction disk and transferring it onto the processing stage 12, and based on the image data taken by the camera 16 as described above. Thus, the machining stage 12 is positioned at a predetermined position. Further, the second transfer means 18 is for transferring the single-wafer processing medium on which the laser processing on the processing stage 12 has been performed onto the belt transfer means 14 and transferring it to a predetermined discharge position.
[0017]
For example, the first tilting means 19 is provided at the lower end of the processing stage 12 on the belt conveying means 13 side, for example, and the second tilting means 20 is provided at the end on the belt conveying means 14 side, for example. That is, when the first and second tilting means 19 and 20 are moved up and down with respect to the laser irradiation direction of the laser irradiation means 15, the single-wafer processing medium on the processing stage 12 is tilted at a predetermined angle. is there.
[0018]
Here, FIG. 2 shows an explanatory diagram of the processing stage and the tilting means of FIG. FIG. 2A shows the processing stage 12, in which a predetermined number of suction holes 12A are formed on the surface side on which the sheet processing medium is located. Further, the internal space is communicated with the suction means 22 through the flexible duct 21 at a predetermined lower portion, for example. That is, when the single-wafer processing medium is positioned on the processing stage 12, the suction means 22 sucks and fixes it through the suction hole 12A, and the processing stage 12 is moved by the first and second tilting means 19 and 20. Even if it is inclined, suction is ensured by the flexible duct 21. The flexible duct 21 and the suction means 22 including the suction hole 12A constitute a fixing means.
[0019]
FIG. 2B shows the first and second tilting means 19 and 20. The first tilting means 19 includes the first and second vertical driving means 31 and 32, and the first and second scanning drives. And means 33 and 34. The first and second scanning driving means 33 and 34 are fixed on a straight line, and the first vertical rod 31A of the first vertical driving means 31 and the first scanning rod 33A of the first scanning driving means 33 are rotatable. And the second vertical rod 32A of the second vertical driving means 32 and the second scanning rod 34A of the second scanning driving means 34 are rotatably connected.
[0020]
On the other hand, the second tilting means 20 is composed of third and fourth vertical driving means 35 and 36 and third and fourth scanning driving means 37 and 38. The third and fourth scanning driving means 37 and 38 are fixed on a straight line, and the third vertical rod 35A of the third vertical driving means 35 and the third scanning rod 37A of the third scanning driving means 37 are freely rotatable. In addition, the fourth vertical rod 36A of the fourth vertical driving means 36 and the fourth scanning rod 38A of the fourth scanning driving means 38 are rotatably connected.
[0021]
The first to fourth vertical driving means 31, 32, 35, and 36 and the first to fourth scanning driving means 33, 34, 37, and 38 can be realized by an electric cylinder, for example. That is, the first to fourth vertical driving means 31, 32, 35, and 36 move the processing stage 12 up and down to incline the sheet processing medium on the processing stage 12 at a predetermined angle. Further, the first to fourth scanning driving means 33, 34, 37, 38 move the processing stage 12 in a direction different from the laser irradiation scanning direction by the laser irradiation means 15, and the single wafer processing medium on the processing stage 12 is moved. Scanning is performed to cover the laser irradiation range.
[0022]
FIG. 3 is a block diagram of control processing means for controlling the drive of this system. In FIG. 3, the control processing means 41 is connected to an input means 42 for appropriately inputting set machining data. At least the laser irradiation means 15 is driven based on predetermined machining data, and the single wafer processing is performed. The angle of the minute hole formed in the medium by laser irradiation is adjusted by driving the first and second tilting means 19 and 20 up and down to specify the tilt angle of the processing stage 12. For this purpose, the control means 51, bus 52, interfaces (IF) 53A, 53B, machining data file creation means 54, laser irradiation control means 55, vertical drive control type 56, scanning drive control means 57, and conveyance control means 58 are appropriately set. Prepare.
[0023]
The control means 51 controls the drive control of this system and stores a program for this purpose. The IF 53A is for ensuring the consistency of signal exchange with the laser irradiation means 15, the camera 16, the transfer means 17, 18 and the suction means 22, and the IF 53B is the first to fourth vertical drive means 31, 32. , 35, 36 and the first to fourth scanning drive means 33, 34, 37, 38 for the consistency of the output signals.
[0024]
The machining data file creation means 54 creates a machining data file based on the set machining data such as the machining position input from the input means 42. The laser irradiation control means 55 sends processing data such as a laser irradiation position, irradiation timing, and laser power to the laser irradiation means 15 based on the created processing data file. The vertical movement drive control means 56 generates a drive control signal for the first to fourth vertical drive means 31, 32, 35, 36 in accordance with the micro-hole formation angle set by the input means 42. And output. The driving amount may be a table corresponding to the formation angle in advance, for example, and may be calculated by calculation each time depending on the formation angle.
[0025]
The scanning drive control means 57 determines the processing area range (here, the range in the width direction with respect to the transport direction) in accordance with the size of the sheet processing medium set by the input means 42 and the position state on the processing stage 12. ), A drive control signal is generated and output to the first to fourth scanning drive means 33, 34, 37, and 38 in order to scan the processing stage 12. Then, the transfer control means 58 generates a drive control signal for the first transfer means 17 while positioning the single-wafer processing medium on the processing stage 12 based on the image data taken by the camera 16. Along with the output, a drive control signal is generated and output to the second transfer means 18.
[0026]
The illustrations of the drive control for the belt conveying means 13 and 14 and the suction means 22, the sensor for obtaining the timing for driving the first and second transfer means 17 and 18, the sensor for imaging with the camera 16, etc. are shown. Omitted.
[0027]
Next, FIG. 4 shows an explanatory diagram of stage tilt in laser processing by this system. FIGS. 4A to 4D show, as an example, a case where a microhole is formed in a single-sided processing medium with a right-angled inclination of a predetermined angle (the operation principle is the same for a downward-left inclination). As shown in A), for example, the case where the sheet processing medium 61 positioned on each stage 12 is in a horizontal state is used as a reference.
[0028]
Incidentally, when the microhole 61A is formed in the sheet processing medium 61 in a direction perpendicular to the thickness direction, the laser beam is irradiated from the laser irradiation means 15 in this horizontal state to form the microhole 61A. Is. In this case, as described above, the first to fourth scanning driving means 33 and 34 are assumed to be one-dimensionally scanned with laser light irradiation from the front side of the drawing to the back side (conveying direction of the sheet processing medium 61). , 37 and 38 move the processing stage 12 in the direction perpendicular to the transport direction, thereby scanning the single-wafer processing medium 61 in the direction.
[0029]
Therefore, as shown in FIG. 4B, the second and fourth vertical driving means 32, 36 are driven from the reference horizontal state of FIG. 4A, and the second and fourth vertical rods 32A, 36A are inclined. The first and third vertical driving means 31 and 35 are driven, and the first and third vertical rods 31A and 35A are lowered by the driving amount corresponding to the inclination angle. In this case, the irradiation focus of the laser irradiation means 15 is made substantially constant by inclining the stage 12 (sheet processing medium 61) with a drive amount that does not change the position P of the laser irradiation.
[0030]
Then, as shown in FIG. 4C, the first and third scanning drive means 33, 37 are driven to shorten the first and third scanning rods 33A, 37A, and the second and fourth scanning means 34, A state in which the second and fourth scanning rods 34A and 38A are extended by driving 38 is set as a laser processing start position, for example, and as shown in FIG. 4D, the first and third scanning driving means 33 and 37 are The first and third scanning rods 33A, 37A are driven to extend sequentially, and the second and fourth scanning means 34, 38 are driven to shorten the second and fourth scanning rods 34A, 38A in sequence while irradiating laser. As a result, the minute holes 61 </ b> A are formed in the formation region of the sheet processing medium 61.
[0031]
Next, FIG. 5 shows a flowchart of laser processing by this system. Here, a case will be described in which three types of micro holes 61A are formed sequentially with respect to the thickness direction of the sheet processing medium 61, for example, in the vertical direction (90 degrees), right-down oblique and left-down oblique.
[0032]
In FIG. 5, first, after confirming that the single-wafer processing medium 61 is positioned at a predetermined position on the processing stage 12 by the camera 16, the vertical direction is based on the processing data file created from the input set processing data. The processing data for forming the minute hole 61A in the direction is extracted, and the vertical drive control means 56 is fixed to the first to fourth vertical drive means 31, 32, 35, while the sheet processing medium 61 is fixed by suction from the suction means 22. 36 is driven to set the first to fourth vertical rods 31A, 32A, 35A, 36A to the horizontal reference position as shown in FIG. S) 1). In the case of a horizontal state from the beginning, driving is not performed.
[0033]
Further, the scanning drive control means 57 drives the first to fourth scanning driving means 33, 34, 37, and 38 to expand and contract the first to fourth scanning rods 33A, 34A, 37A, and 38A as described above. The laser processing control is performed based on the processing data extracted from the processing data file by the laser irradiation control means 55 while moving to the irradiation start position and expanding and contracting the first to fourth scanning rods 33A, 34A, 37A, and 38A as described above. By sending a signal to the laser irradiation means 15 and driving it, the vertical minute holes 61A are sequentially formed (S2).
[0034]
When all the vertical holes 61A in the vertical direction are formed on the sheet processing medium 61 (S3), processing data for forming the minute holes 61A that are inclined to the right is extracted based on the created processing data file. At the same time, the second and fourth vertical driving means 32, 36 are driven to raise the second and fourth vertical rods 32A, 36A by an adaptive amount, and the first and third vertical driving means 31, 35 are driven to provide the first. Then, the third vertical rods 31A and 35A are lowered by an appropriate amount, and the single-wafer processing medium 61 is inclined obliquely to the right by a predetermined angle (S4).
[0035]
Subsequently, the scanning drive control unit 57 drives the first to fourth scanning driving units 33, 34, 37, and 38 to expand and contract the first to fourth scanning rods 33A, 34A, 37A, and 38A, thereby starting the laser irradiation start position. The laser irradiation control means 55 sends a laser processing control signal to the laser irradiation means 15 based on the processing data extracted from the processing data file while the first to fourth scanning rods 33A, 34A, 37A, 38A are expanded and contracted. By sending out and driving, the minute holes 61A inclined downward to the right at a predetermined angle are sequentially formed (S5).
[0036]
Further, when all the right-sloping diagonal micro holes 61A are formed on the single-wafer processing medium 61 (S6), the machining data for forming the left-sloping diagonal micro holes 61A based on the created processing data file. And the first and third vertical drive means 31, 35 are driven to raise the first and third vertical rods 31A, 35A by an adaptive amount, and the second and fourth vertical drive means 32, 36 are driven. Then, the second and fourth vertical rods 32A, 36A are lowered by an appropriate amount, and the single-wafer processing medium 61 is inclined obliquely downwardly to the left by a predetermined angle (S7).
[0037]
Then, the scanning drive control means 57 drives the first to fourth scanning driving means 33, 34, 37, and 38 to expand and contract the first to fourth scanning rods 33A, 34A, 37A, and 38A to the laser irradiation start position. The laser irradiation control means 55 sends a laser processing control signal to the laser irradiation means 15 based on the processing data extracted from the processing data file while moving and expanding and contracting the first to fourth scanning rods 33A, 34A, 37A, 38A. By driving in this manner, left-slanting diagonal micro holes 61A having a predetermined angle are sequentially formed (S8), and all the left-slanting micro holes 61A are formed (S9).
[0038]
In this way, the processing stage 12 can be moved up and down by the first to fourth vertical driving means 31, 32, 35, 36 to tilt the sheet processing medium 61 at a desired angle. It is possible to easily form micro holes of a predetermined angle in the single-wafer processing medium 61 without changing the configuration.
[0039]
By the way, in the said embodiment, although the case where the two 1st and 2nd inclination means 19 and 20 were provided in the process stage 12 was shown, one end is made into a single inclination means (the other end is made into a fulcrum by a rotation hinge etc.). (Vertical drive means) may be provided. In this case, laser irradiation by the laser irradiation means is performed while changing the focal position as needed.
[0040]
In the above embodiment, the first and second tilting means 19 and 20 are provided at the lower ends of the processing stage 12 in the direction perpendicular to the medium transport direction. However, the processing is performed in the same direction as the medium transport direction. It may be provided at both lower ends of the stage 12. In this case, the laser irradiation scanning direction is perpendicular to the medium conveyance direction.
[0041]
Further, in the above embodiment, the case where the first and second tilting means 19 and 20 are driven up and down by two systems has been shown, but each of the vertical driving means 31, 32, 35 and 36 may be driven separately. Good. As a result, the minute holes 61A can be formed on the single-wafer processing medium 61 at angles in any direction.
[0042]
【The invention's effect】
As described above, according to the present invention, with respect to a processing stage that performs laser processing on a single-wafer processing medium, a vertical movement drive unit that includes a vertical rod that moves the processing stage up and down in the laser irradiation direction, and A scanning rod having the same driving configuration as that of the vertical driving means is rotatably connected to the vertical rod, and the laser light from the laser irradiation means is directed to the conveyance direction of the single-wafer processing medium or a conveyance direction that is different from the conveyance direction. A single wafer on the processing stage is provided at each corner portion as a set of scanning drive means for scanning the single wafer processing medium on the processing stage by moving in a direction different from the laser irradiation scanning direction scanned in the vertical direction. By inclining the processing medium at a predetermined angle, the structure can be easily set to a predetermined angle in the processing area with respect to the processing surface of the single wafer processing medium, In which it is possible to form a small hole.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a laser processing system according to the present invention.
FIG. 2 is an explanatory diagram of the processing stage and the tilting means in FIG.
FIG. 3 is a block configuration diagram of control processing means for driving and controlling the system.
FIG. 4 is an explanatory diagram of stage tilt in laser processing by the present system.
FIG. 5 is a flowchart of laser processing by this system.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Laser processing system 12 Processing stage 13, 14 Belt conveyance means 15 Laser irradiation means 16 Camera 17, 18 Transfer means 19 First inclination means 20 Second inclination means 21 Flexible duct 22 Suction means 31, 32, 35, 36 Up and down Driving means 33, 34, 37, 38 Scanning driving means 41 Control processing means 42 Input means 61 Single wafer processing medium

Claims (2)

A laser processing system that performs processing to form a predetermined number of micro holes with a predetermined angle with respect to the thickness direction of the single wafer processing medium by irradiating the single wafer processing medium conveyed on the processing stage with laser light Because
Scanning and irradiating the single-wafer processing medium transported on the processing stage with a laser beam in a direction perpendicular to the transport direction of the single-wafer processing medium or a direction different from the transport direction. Laser irradiation means for forming the predetermined number of microholes by
A vertical drive means having a vertical rod for moving the machining stage up and down, and a scanning rod having the same drive configuration as the vertical drive means, the scanning rod being rotatably connected to the vertical rod of the vertical drive means and the machining stage Are moved in a direction different from the laser irradiation scanning direction by the laser irradiation means, and two sets of scanning drive means for scanning the single-wafer processing medium on the processing stage are fixed on the straight line. configuration and then, the scan driving unit is fixed in a straight line, and tilting means for tilting the lower portion of the opposed sheet processing medium on the working stages in their respective set kick the end of the processing stage at a predetermined angle,
At least the laser irradiation unit is driven based on predetermined processing data, and the angle of the minute hole formed in the single-wafer processing medium by laser irradiation is set so that the tilting unit is driven up and down to tilt the processing stage. Control processing means for adjusting by specifying,
A laser processing system comprising: The laser processing system according to claim 1, wherein the processing stage includes a fixing unit that fixes the single-wafer processing medium to be transported on the processing stage.

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