JP4314790B2 - Application method - Google Patents

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Publication number
JP4314790B2
JP4314790B2 JP2002202299A JP2002202299A JP4314790B2 JP 4314790 B2 JP4314790 B2 JP 4314790B2 JP 2002202299 A JP2002202299 A JP 2002202299A JP 2002202299 A JP2002202299 A JP 2002202299A JP 4314790 B2 JP4314790 B2 JP 4314790B2
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Japan
Prior art keywords
coating
die head
coating layer
yield stress
coating liquid
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JP2002202299A
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JP2004041908A (en
Inventor
史志 吉田
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Toppan Inc
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Toppan Inc
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【0001】
【発明の属する技術分野】
本発明は、ガラス、プラスチック等の基板に塗布液を均一な厚さに塗布する塗布方法に関するもので、特に、粒子分散型の塗布液を均一な厚さに塗布する塗布方法に関する。
【0002】
【従来の技術】
一般に、ガラス、プラスチック等の基板に塗布液を均一に塗布した塗布層を形成することは、従来からいろいろな手法が試みられている。そして、塗布方法の一つとして、一定の間隙を有するダイヘッドを用いて塗布する、ダイコート法が、広い幅を1度に塗布形成できるので、多く用いられている。
【0003】
このダイコート法は、図1に示すように、ダイヘッド1の供給口3から塗布液4が供給され、マニホールド5内に溜められる。次に、マニホールド5からスリット6を通って、基材2に塗布し、塗布層7を形成する方法である。そして、塗布するに際し、ダイヘッド1または基材2のどちらか一方を相対的に移動させることで、基材2上に均一な塗布層7を形成する。
【0004】
しかし、このダイコート法により、均一な塗布層を形成する場合、塗布層の塗布方向の均一性、およびダイヘッドの幅方向の均一性、この両方を満足しなければならない。
特に、ダイヘッドの幅方向、幅が広い場合、更に、10μm以下の均一性を維持することが技術的に困難であった。
【0005】
この問題は、塗布液の物性値により、ダイヘッドから吐出される状態が変化するため、実際に基板に塗布された塗布層は、基板幅方向の厚みが均一にならなくなっていまっていた。特に、塗布液が粒子分散型の場合、この傾向が大きい問題があった。
【0006】
この問題を解決するために、ダイヘッドの表面の平滑性を向上させたり、ダイヘッドの流路の形状を変更することが試みられているが、満足した結果が得られていないのが、現状である。
【0007】
【発明が解決しようとする課題】
本発明は、塗布液の物性値により、ダイヘッドから吐出される状態が変化を考慮して、実際に基板に塗布された塗布層が、基板幅方向の厚みが均一となるようにした塗布方法を提供することを目的とする。
また、塗布層の厚みが10μm以下であっても、均一に塗布することができる塗布方法を提供することを目的とする。
【0008】
【課題を解決するための手段】
請求項1に記載の発明は、ダイヘッドの供給口から塗布液が供給され、該塗布液が前記ダイヘッドのマニホールド内に溜められ、次に、前記マニホールドからスリットを通って基板上に塗布液を塗布し、前記ダイヘッドまたは前記基材のどちらか一方を相対的に移動させることで塗布層を形成する塗布方法において、前記塗布層を形成する塗布液が、歪速度が0〜5000(1/sec)の範囲で、塑性粘度と降伏応力値が一定であるビンガム流体であり、且つ、前記塗布層を形成する塗布液の前記降伏応力値が0.005Pa以上0.100Pa以下の範囲内であり、且つ、前記塗布層を形成する塗布液の前記塑性粘度を前記降伏応力値で除した値が0.14以上であることを特徴とする塗布方法である。
【0010】
請求項に記載の発明は、前記塗布液が、粒子分散型の塗布液であることを特徴とする請求項1記載の塗布方法である。
【0011】
請求項に記載の発明は、前記塗布層が、10μm以下の厚さとすることを特徴とする、請求項1または請求項2に記載の塗布方法である。
【0013】
このように、塗布する塗布液を、塑性粘度と降伏応力値の比が一定であるビンガム流体を用いること、特に、この比が0.14以上とすることで、均一な塗布層を形成することができる。
【0014】
【発明の実施の形態】
図1に示すように、ダイヘッド1の供給口3から塗布液4が供給され、マニホールド5内に溜められる。次に、マニホールド5からスリット6を通って、基材2に塗布し、塗布層7を形成する方法である。そして、塗布するに際し、ダイヘッド1または基材2のどちらか一方を相対的に移動させることで、基材2上に均一な塗布層7を形成する。
【0015】
ここで、塗布層を形成する塗布液は、歪速度が0〜5000(1/sec)の範囲で、塑性粘度と降伏応力値の比が一定であるビンガム流体を用いることが好ましい。
また、前記塗布液の塑性粘度と降伏応力値の比が0.14以上とすることがより好ましい。
【0016】
このような塑性粘度と降伏応力値の比とすることで、塗布層の厚みが制御しにくい粒子分散型の塗布液であっても、均一な厚さの塗布膜を形成することが可能となった。
【0017】
【実施例】
図1のダイヘッド1のマニホールドは、断面が半円のストレートダイヘッドを用い、塑性粘度と降伏応力値を表1に示すように、それぞれ変化させたビンガム流体からなる塗布液を基板に塗布し、ダイヘッドのスリット出口の幅方向における吐出量を測定し、10μmの塗布層を形成し、厚みの均一性を確認した。
なお、用いたダイヘッドは、スリットの長さが680mm、スリットの幅が30μm、マニホールドの断面半円の半径が4mmのものを用いた。ここで、以下の試験例では、図1の対称平面をダイ対称中心として測定した。
【0018】
【表1】

Figure 0004314790
【0019】
(試験例1)
塗布液として、歪速度が0〜5000(1/sec)の範囲で、塑性粘度を7mP・Sと一定にし、降伏応力値を0.005Pa、0.05Pa、0.10Paの3種類を用い、ダイヘッドのスリット出口の幅方向における吐出量をそれぞれ測定した。
その結果、図2に示すように、降伏応力値が小さい程、均一な塗布が可能であることが解った。
【0020】
(試験例2)
塗布液として、 降伏応力値を0.05Paと一定にし、塑性粘度を3.5mP・S、7mP・S、14mP・Sの3種類を用い、ダイヘッドのスリット出口の幅方向における吐出量をそれぞれ測定した。
その結果、図3に示すように、塑性粘度が大きい程、均一な塗布が可能であることが解った。
【0021】
(試験例3)
塗布液として、 塑性粘度と降伏応力値をそれぞれ変えるが、塑性粘度と降伏応力値の比を0.14とを一定にし、ダイヘッドのスリット出口の幅方向における吐出量をそれぞれ測定した。
その結果、図4に示すように、塑性粘度と降伏応力値がそれぞれ変わっても、その比が一定であれば、厚みが均一な塗布が可能であることが解った。
【0022】
【発明の効果】
本発明の塗布方法のように、塗布する塗布液を、歪速度が0〜5000(1/sec)の範囲で、塑性粘度と降伏応力値の比が一定とすること、さらにビンガム流体を用いること、さらに、塑性粘度と降伏応力値の比が0.14以上とすることで、10μm以下の厚みの塗布層であっても、幅方向に均一な厚みとすることができる。
【0023】
また、顔料等の粒子が入った粒子分散型の塗布液であっても、均一な薄い塗布層を形成することが可能となる。
【図面の簡単な説明】
【図1】本発明の塗布方法の一例を示す説明図である。
【図2】本発明の塗布方法の測定結果を示すグラフである。
【図3】本発明の塗布方法の他の測定結果を示すグラフである。
【図4】本発明の塗布方法の他の測定結果を示すグラフである。
【符号の説明】
1・・・ダイヘッド
2・・・基板
3・・・供給口
4・・・塗布液
5・・・マニホールド
6・・・スリット
7・・・塗布層[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coating method for coating a coating liquid on a substrate such as glass or plastic to a uniform thickness, and more particularly to a coating method for coating a particle dispersion type coating liquid to a uniform thickness.
[0002]
[Prior art]
In general, various methods have been tried to form a coating layer in which a coating solution is uniformly applied to a substrate such as glass or plastic. As a coating method, a die coating method in which coating is performed using a die head having a certain gap is widely used because a wide width can be applied and formed at a time.
[0003]
In this die coating method, as shown in FIG. 1, the coating liquid 4 is supplied from the supply port 3 of the die head 1 and stored in the manifold 5. Next, the coating layer 7 is formed by coating the base material 2 from the manifold 5 through the slit 6. And when apply | coating, the uniform coating layer 7 is formed on the base material 2 by moving either the die head 1 or the base material 2 relatively.
[0004]
However, when a uniform coating layer is formed by this die coating method, both uniformity in the coating direction of the coating layer and uniformity in the width direction of the die head must be satisfied.
In particular, when the die head is wide and wide, it is technically difficult to maintain uniformity of 10 μm or less.
[0005]
The problem is that the state discharged from the die head varies depending on the physical property value of the coating liquid, and the thickness of the coating layer actually applied to the substrate is not uniform in the substrate width direction. In particular, when the coating liquid is a particle dispersion type, there is a problem that this tendency is large.
[0006]
In order to solve this problem, attempts have been made to improve the smoothness of the surface of the die head or to change the shape of the flow path of the die head, but the present situation is that satisfactory results have not been obtained. .
[0007]
[Problems to be solved by the invention]
The present invention provides a coating method in which the coating layer actually applied to the substrate has a uniform thickness in the substrate width direction in consideration of changes in the state discharged from the die head depending on the physical properties of the coating solution. The purpose is to provide.
Moreover, even if the thickness of a coating layer is 10 micrometers or less, it aims at providing the coating method which can apply | coat uniformly.
[0008]
[Means for Solving the Problems]
In the first aspect of the present invention, the coating liquid is supplied from the supply port of the die head, the coating liquid is accumulated in the manifold of the die head, and then the coating liquid is applied on the substrate through the slit from the manifold. In the coating method for forming the coating layer by relatively moving either the die head or the substrate, the coating liquid for forming the coating layer has a strain rate of 0 to 5000 (1 / sec). In the range, the plastic viscosity and the yield stress value are constant Bingham fluid, and the yield stress value of the coating liquid forming the coating layer is in the range of 0.005 Pa to 0.100 Pa, and The coating method is characterized in that a value obtained by dividing the plastic viscosity of the coating solution for forming the coating layer by the yield stress value is 0.14 or more .
[0010]
A second aspect of the present invention is the coating method according to the first aspect, wherein the coating liquid is a particle dispersion type coating liquid.
[0011]
A third aspect of the present invention is the coating method according to the first or second aspect, wherein the coating layer has a thickness of 10 μm or less.
[0013]
Thus, a uniform coating layer is formed by using a Bingham fluid whose ratio of plastic viscosity and yield stress value is constant as the coating liquid to be applied, in particular, when this ratio is 0.14 or more. Can do.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
As shown in FIG. 1, the coating liquid 4 is supplied from the supply port 3 of the die head 1 and is stored in the manifold 5. Next, the coating layer 7 is formed by coating the base material 2 from the manifold 5 through the slit 6. And when apply | coating, the uniform coating layer 7 is formed on the base material 2 by moving either the die head 1 or the base material 2 relatively.
[0015]
Here, as the coating solution for forming the coating layer, it is preferable to use a Bingham fluid in which the ratio of the plastic viscosity to the yield stress value is constant within a strain rate range of 0 to 5000 (1 / sec).
The ratio of the plastic viscosity to the yield stress value of the coating solution is more preferably 0.14 or more.
[0016]
By setting such a ratio between the plastic viscosity and the yield stress value, it is possible to form a coating film having a uniform thickness even with a particle dispersion type coating solution in which the thickness of the coating layer is difficult to control. It was.
[0017]
【Example】
The manifold of the die head 1 shown in FIG. 1 uses a straight die head having a semicircular cross section, and as shown in Table 1, a coating solution made of a Bingham fluid having different plastic viscosities and yield stress values is applied to a substrate. The discharge amount in the width direction of the slit outlet was measured, a 10 μm coating layer was formed, and the thickness uniformity was confirmed.
The die head used was one having a slit length of 680 mm, a slit width of 30 μm, and a manifold semicircular radius of 4 mm. Here, in the following test examples, the symmetry plane of FIG. 1 was measured as the die symmetry center.
[0018]
[Table 1]
Figure 0004314790
[0019]
(Test Example 1)
As the coating solution, the strain rate is in the range of 0 to 5000 (1 / sec), the plastic viscosity is kept constant at 7 mP · S, and the yield stress values are 0.005 Pa, 0.05 Pa, and 0.10 Pa. The discharge amount in the width direction of the slit outlet of the die head was measured.
As a result, as shown in FIG. 2, it was found that the smaller the yield stress value, the more uniform coating is possible.
[0020]
(Test Example 2)
Three types of coating liquids are used: the yield stress value is fixed at 0.05 Pa, and the plastic viscosity is 3.5 mP · S, 7 mP · S, and 14 mP · S, and the discharge amount in the width direction of the slit outlet of the die head is measured. did.
As a result, as shown in FIG. 3, it was found that the larger the plastic viscosity, the more uniform coating is possible.
[0021]
(Test Example 3)
As the coating solution, the plastic viscosity and the yield stress value were respectively changed, but the ratio of the plastic viscosity and the yield stress value was kept constant at 0.14, and the discharge amount in the width direction of the slit outlet of the die head was measured.
As a result, as shown in FIG. 4, it was found that even if the plastic viscosity and the yield stress value are changed, if the ratio is constant, it is possible to apply a uniform thickness.
[0022]
【The invention's effect】
As in the coating method of the present invention, the coating liquid to be applied should have a constant ratio of plastic viscosity to yield stress value within a strain rate range of 0 to 5000 (1 / sec), and use a Bingham fluid. Furthermore, by setting the ratio of the plastic viscosity to the yield stress value to be 0.14 or more, even a coating layer having a thickness of 10 μm or less can have a uniform thickness in the width direction.
[0023]
Even with a particle dispersion type coating liquid containing particles such as pigments, a uniform thin coating layer can be formed.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing an example of a coating method of the present invention.
FIG. 2 is a graph showing measurement results of the coating method of the present invention.
FIG. 3 is a graph showing another measurement result of the coating method of the present invention.
FIG. 4 is a graph showing another measurement result of the coating method of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Die head 2 ... Board | substrate 3 ... Supply port 4 ... Coating liquid 5 ... Manifold 6 ... Slit 7 ... Coating layer

Claims (3)

ダイヘッドの供給口から塗布液が供給され、該塗布液が前記ダイヘッドのマニホールド内に溜められ、次に、前記マニホールドからスリットを通って基板上に塗布液を塗布し、前記ダイヘッドまたは前記基材のどちらか一方を相対的に移動させることで塗布層を形成する塗布方法において、
前記塗布層を形成する塗布液が、歪速度が0〜5000(1/sec)の範囲で、塑性粘度と降伏応力値が一定であるビンガム流体であり、且つ、
前記塗布層を形成する塗布液の前記降伏応力値が0.005Pa以上0.100Pa以下の範囲内であり、且つ、
前記塗布層を形成する塗布液の前記塑性粘度を前記降伏応力値で除した値が0.14以上である
ことを特徴とする塗布方法。
A coating liquid is supplied from the supply port of the die head, and the coating liquid is accumulated in the manifold of the die head. Next, the coating liquid is applied onto the substrate through the slit from the manifold, and the die head or the base material is coated. In the coating method of forming a coating layer by relatively moving either one,
The coating liquid for forming the coating layer is a Bingham fluid having a constant plastic viscosity and a yield stress value within a strain rate range of 0 to 5000 (1 / sec), and
The yield stress value of the coating solution for forming the coating layer is in the range of 0.005 Pa to 0.100 Pa, and
The coating method, wherein a value obtained by dividing the plastic viscosity of the coating solution for forming the coating layer by the yield stress value is 0.14 or more .
前記塗布液が、粒子分散型の塗布液であることを特徴とする請求項1記載の塗布方法。The coating method according to claim 1 , wherein the coating liquid is a particle dispersion type coating liquid. 前記塗布層が、10μm以下の厚さとすることを特徴とする、請求項1または請求項2に記載の塗布方法。The coating method according to claim 1 , wherein the coating layer has a thickness of 10 μm or less.
JP2002202299A 2002-07-11 2002-07-11 Application method Expired - Fee Related JP4314790B2 (en)

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