JP4313614B2 - Release film - Google Patents
Release film Download PDFInfo
- Publication number
- JP4313614B2 JP4313614B2 JP2003148780A JP2003148780A JP4313614B2 JP 4313614 B2 JP4313614 B2 JP 4313614B2 JP 2003148780 A JP2003148780 A JP 2003148780A JP 2003148780 A JP2003148780 A JP 2003148780A JP 4313614 B2 JP4313614 B2 JP 4313614B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- release
- particles
- release layer
- polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002245 particle Substances 0.000 claims description 59
- -1 polydimethylsiloxane Polymers 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 102100039388 Polyamine deacetylase HDAC10 Human genes 0.000 claims description 7
- 101710107444 Polyamine deacetylase HDAC10 Proteins 0.000 claims description 7
- 239000010954 inorganic particle Substances 0.000 claims description 7
- 230000003746 surface roughness Effects 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000010408 film Substances 0.000 description 74
- 239000010410 layer Substances 0.000 description 41
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 38
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 229920000728 polyester Polymers 0.000 description 18
- 229920006267 polyester film Polymers 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 11
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 11
- 238000005259 measurement Methods 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000011146 organic particle Substances 0.000 description 4
- 239000011242 organic-inorganic particle Substances 0.000 description 4
- 229920005990 polystyrene resin Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- BTVWZWFKMIUSGS-UHFFFAOYSA-N dimethylethyleneglycol Natural products CC(C)(O)CO BTVWZWFKMIUSGS-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229940071125 manganese acetate Drugs 0.000 description 2
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 125000002924 primary amino group Chemical class [H]N([H])* 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- BXJGUBZTZWCMEX-UHFFFAOYSA-N 2,3-dimethylbenzene-1,4-diol Chemical compound CC1=C(C)C(O)=CC=C1O BXJGUBZTZWCMEX-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- FNGGVJIEWDRLFV-UHFFFAOYSA-N anthracene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=CC3=C(C(O)=O)C(C(=O)O)=CC=C3C=C21 FNGGVJIEWDRLFV-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 235000021152 breakfast Nutrition 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000000914 phenoxymethylpenicillanyl group Chemical group CC1(S[C@H]2N([C@H]1C(=O)*)C([C@H]2NC(COC2=CC=CC=C2)=O)=O)C 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、離型フィルムに関する。
【0002】
【従来の技術】
離型フィルムは、例えば樹脂シートの成形用、粘着剤離型用、医療用、電気・電子部品製造用の用途に使用されている。
【0003】
離型フィルムから成形される樹脂シート等の成形体において、成形体の表面の平坦化が重要な課題である。フィルムから成形される成形体の品質は、その表面の精度や品質にかかっており、すなわち離型フィルムの表面の精度や品質にかかっていると言っても過言ではない(特開平11−348186号公報)。さらに電気・電子部品製造に使用される離型フィルムは、シリコーンの転写を極力減らすことが検討(特開平11−268194号公報)されてきたが、シリコーン原材料中の低分子シリコーンや架橋反応時の未反応物が完全除去できず、僅かな転写が起こる。成型部品に転写したシリコーンはその後の製造工程において、コンタミネーションや密着性を阻害し、品質や耐久性の不具合をもたらしている。
【0004】
離型フイルムそのものは、ポリエステルフイルムに離型性のある樹脂の層を形成している。通常、ポリエステルフイルム中には加工適性、例えば滑り性、巻き特性を良くするために、粒子が配合されているが、一般に、粒子添加を行なえばハンドリング性が改善される反面、フィルム表面が粗くなる。これを避けて平坦な表面性を作るために粒子の配合をやめると、得られるフイルムは滑り性やエアー抜け性が極端に悪化し、加工中にシワが入ったり、ロール状に巻けないものとなる。
【0005】
また、フィルムが離型塗布層を伴うと、塗布層がポリエステルフィルムの表面の突起を覆い隠すため、さらに加工適性が低下する。従来、離型フィルムから成形される成形体または成形シートでは、その表面特性への要求が厳しくなく、ある程度の粗面であっても品質上の問題となることがなかった。しかしながら、近年、離型フィルムを用いた成形シートの表面特性の要求は非常に厳しくなってきた。
【0006】
たとえば、塩化ビニル樹脂やウレタン樹脂のシートでは、これらの樹脂溶液を離型フイルム上に流延しシートを成形する。これらのシートでは、成形面に特に高い光沢性が要求されることがある。
【0007】
また、粘着テープ用の離型フイルムでは、離型フイルム表面の凹凸が粘着テープの粘着剤層の表面に形状転写するため、例えばガラス面に粘着テープを貼るときに、形状転写した凹部に空気が入り、きれいな外観を得ることができなくなる。そのため、表面の平坦性が要求される。
【0008】
さらに、電子部品の工程材料などに用いられる離型フイルムでは、特に表面特性への要求が高い。例えば、セラミックコンデンサーの薄層シートを作成する場合、離型フイルム上にセラミック粉体とバインダー剤を液状媒体に分散させたセラミックススラリを塗布し、3μm以下の非常に薄いシートを作成する。シートが薄層化すればするほど、離型フイルムの表面凹凸が直接成形シートの不良率増加につながる。また、ディスプレイ用途の工程材料として使用される場合も成型シートの薄層化により離形フィルム表面の平滑化が要求されている。
【0009】
半導体分野で使用される離型フィルムは、表面の平坦性は必要であるが、さらにシリコーンの転写を非常に問題視しており、シリコーン転写の無い離型フィルムの要求が非常に高くなってきている。
【0010】
【特許文献1】
特開平11−348186号公報
【0011】
【特許文献2】
特開平11−268194号公報
【0012】
【発明が解決しようとする課題】
本発明の目的は、かかる従来技術の欠点を解消し、離形フィルム表面の大きな突起が成形シートに転写しない優れた表面特性を有するとともに、加工適性に優れ、シリコーン転写の無い離型フイルムを提供することにある。
【0013】
【課題を解決するための手段】
すなわち本発明は、ポリエステルフィルムの表面に、微細な不活性粒子を含有し厚みが300nm以下の離形層を有する離形フィルムであって、離型層の中心線表面粗さRaが5nm以下、十点平均粗さRzが30nm以下であって、離型層は、長鎖アルキル基を含みポリジメチルシロキサンを含まない化合物から構成され、離形層の厚み(t[nm])と不活性粒子の平均粒径(d[nm])が下記式を満足し、
0.3d≦t≦2.5d
離形フィルムの表面の突起数と突起高さの関係が下記式を満足する離形フィルムである。
HD5(突起高さ5nm以上の個数)≧500個/mm 2
HD10(突起高さ10nm以上の個数)≦100個/mm 2
【0014】
以下、本発明を詳細に説明する。
【0015】
[ポリエステルフイルム]
[ポリエステル]
本発明において、ベースのフィルムとしてポリエステルフィルムが用いられる。本発明において、ポリエステルとは、芳香族ジカルボン酸を主たる酸成分とし、脂肪族グリコールを主たるグリコール成分とするポリエステルである。かかるポリエステルは実質的に線状であり、そしてフイルム形成性、特に溶融成形によるフイルム成形性を有する。
【0016】
芳香族ジカルボン酸としては、例えばテレフタル酸,ナフタレンジカルボン酸,イソフタル酸,ジフェノキシエタンジカルボン酸,ジフェニルジカルボン酸,ジフェニルエーテルジカルボン酸,ジフェルスルホンジカルボン酸,ジフェニルケトンジカルボン酸,アンスラセンジカルボン酸を挙げることができる。
【0017】
脂肪族グリコールとしては、例えばエチレングリコール,トリメチレングリコール,テトラメチレングリコール,ペンタメチレングリコール,ヘキサメチレングリコール,デカメチレングリコールの如き炭素数2〜10のポリメチレングリコール、シクロヘキサンジメタノールの如き脂環族ジオールを挙げることができる。
【0018】
本発明において、ポリエステルとしては、アルキレンテレフタレートまたはアルキレンナフタレートを主たる構成成分とするものが好ましく用いられる。
【0019】
かかるポリエステルとして、ポリエチレンテレフタレートまたはポリエチレン−2,6−ナフタレートが好ましい。
【0020】
ポリエチレンテレフタレートには、全ジカルボン酸成分の例えば80モル%以上がテレフタル酸であり、全グリコール成分の例えば80モル%以上がエチレングリコールである共重合体が包含される。
【0021】
ポリエチレン−2,6−ナフタレートには、全ジカルボン酸成分の例えば80モル%以上が2,6−ナフタレンジカルボン酸であり、全グリコール成分の例えば80モル%以上がエチレングリコールである共重合体が包含される。
【0022】
このような共重合体である場合、20モル%以下はテレフタル酸または2,6−ナフタレンジカルボン酸以外のジカルボン酸成分であることができ、ジカルボン酸成分は、例えば上記芳香族シガルボン酸であることができる。また、例えばアジピン酸,セバチン酸の如き脂環族ジカルボン酸;シクロヘキサン−1,4−ジカルボン酸の如き脂環族ジカルボン酸等であることができる。
【0023】
また、全グリコール成分の20モル%以下はエチレングリコール以外のグリコール成分であることができ、グリコール成分は、例えば上記グリコールであることができ、例えばハイドロキノン,レゾルシン,2,2−ビス(4−ヒドロキシフェニル)プロパンの如き芳香族ジオール;1,4−ジヒドロキシジメチルベンゼンの如き芳香環を有する脂肪族ジオール;ポリエチレングリコール,ポリプロピレングリコール,ポリトテトラメチレングリコールの如きポリアルキレングリコール(ポリオキシアルキレングリコール)等であることができる。
【0024】
また、本発明におけるポリエステルには例えばヒドロキシ安息香酸の如き芳香族オキシ酸,ω−ヒドロキシカプロン酸の如き脂肪族オキシ酸等のオキシカルボン酸に由来する成分を、ジカルボン酸成分およびオキシカルボン酸成分の総量に対し20モル%以下で共重合或は結合するものを包含される。
【0025】
さらにポリエステルには、実質的に線状である範囲の量、例えば全酸成分に対し2モル%以下の量で、3官能以上のポリカルボン酸またはポリヒドロキシ化合物、例えばトリメリット酸、ペンタエリスリトールを共重合したものも包含される。
【0026】
上記ポリエステルは、それ自体公知であり、それ自体公知の方法で製造することができる。上記ポリエステルとしては、ο−クロロフェノール中の溶液として35℃で測定して求めた固有粘度が0.4〜0.9のものが好ましい。
【0027】
本発明においてポリエステルフィルムは不活性粒子を含有しなくても含有しても良い。含有する場合不活性粒子は、平均粒径が好ましくは1μm未満、さらに好ましくは0.01μm以上1μm未満の不活性粒子である。この不活性粒子は有機粒子、無機粒子のいずれも用いることができ、有機粒子と無機粒子の混合粒子でもよい。不活性粒子は、2成分以上で形成されてもよい。各成分の不活性粒子の長径と短径の比(長径/短径)が1.0〜1.2であることが好ましい。これらの不活性粒子を配合することにより、フイルム表面に非常に微細な凹凸を形成することができる。かかる不活性粒子の具体例としては、炭酸カルシウム,カオリン,酸化ケイ素,硫酸バリウム,酸化チタン,酸化アルミナ等の無機粒子;架橋ポリスチレン樹脂粒子,架橋シリコーン樹脂粒子,架橋アクリル樹脂粒子,架橋ポリスチレン樹脂粒子等の有機樹脂粒子を挙げることができ、無機素材と有機素材がシェルコア構造の形態をとる粒子でも良い。
【0028】
[フィルム]
本発明においてポリエステルフイルムは単層フィルムであってもよく、積層フィルムであってもよい。積層フィルムである場合、少なくとも2つの層からなることができ、共押出にて製造されたものが好ましい。この場合、層を構成するポリエステルは同じものでも違ったものでもよいが、同じものが好ましい。
【0029】
本発明においてポリエステルフイルムが、積層フィルムである場合、フィルムを構成するポリエステルの種類をA、B、Cと表わせば、例えばA/B、A/B/A、A/B/Cの積層構造をとることができる。
【0030】
ポリエステルフィルムの少なくとも片面の表面粗さは、中心線平均粗さRaが5nm以下、十点平均粗さRzが30nm以下である。Raが5nmを超える場合、薄層成型シートでは表面の平滑性が損なわれ、Rzが30nmを超える場合、成型シートに厚み斑を生じ、電子材料用途では電気特性不良を生じる。
【0031】
ポリエステルフイルムの総厚みは、単層フィルムの場合も、積層フィルムの場合も、10〜100μmが好ましく、さらには、15〜50μmが好ましい。
【0032】
ポリエステルフイルム自体は、従来から知られている、あるいは当業界に蓄積されている方法で得ることができる。積層二軸配向フイルムを得るためには、例えば、融点(Tm:℃)ないし(Tm+70)℃の温度でポリエステルを溶融・共押出して固有粘度0.4〜0.8dl/gの積層未延伸フイルムを得る。次いで該積層未延伸フイルムを一軸方向(縦方向又は横方向)に(Tg−10)〜(Tg+70)℃の温度(但し、Tg:ポリエステルのガラス転移温度)で2.5倍以上、好ましくは3倍以上の倍率で延伸し、次いで上記延伸方向と直角方向にTg〜(Tg+70)℃の温度で2.5倍以上、好ましくは3倍以上の倍率で延伸する。さらに必要に応じて縦方向及び/又は横方向に再度延伸してもよい。このようにして全延伸倍率は、面積延伸倍率として9倍以上が好ましく、12〜35倍がさらに好ましく、15〜25倍が特に好ましい。さらにまた、二軸配向フイルムは、(Tg+70)℃〜(Tm−10)℃の温度(ただし、Tm:ポリエステルの融点)で熱固定することができ、例えば、180〜250℃が好ましい。熱固定時間は1〜60秒が好ましい。
【0033】
[離型層]
[樹脂]
本発明においてはポリエステルフイルムの表面に離型層を設ける。この離型層は、長鎖アルキル基を含みポリジメチルシロキサンを含まない化合物から構成される。そのため、離型層はポリジメチルシリコーン成分を有せず、長鎖アルキル基を有する有機樹脂から形成するのがよい。
【0034】
有機樹脂は、熱硬化性および熱可塑性のどちらでも良い。たとえば、アクリル、ポリエステル、アルキッド、メラミン、エポキシ、アミド、イミド、PVAといった樹脂、これらの共重合体である樹脂を主成分とし、側鎖に長鎖アルキル基を持つ。
【0035】
長鎖アルキル基は、炭素数が12以上28以下のアルキル基が好ましい。炭素数が12未満であると剥離特性が悪く、成型体との剥離が悪くなり、炭素数が28を超えると樹脂の溶解性が悪くなり均質な薄膜を形成できなくなり好ましくない。
【0036】
本発明において、離型層は、例えば離型層の成分を含む塗液をフイルムに塗布し、加熱乾燥させることにより塗設することができる。この塗液の塗布方法としては、公知の任意の塗工法が適用できる。適用できる塗布方法として、例えばロールコーター法、ブレードコーター法を挙げることができる。塗布層形成のための加熱乾燥は、70〜170℃で、30〜90秒行なうことが好ましい。
【0037】
離形層の厚みは、300nm以下、好ましくは30nm以上300nm以下、さらに好ましくは50nm以上200nm以下である。離形層厚みが300nmを超えるとブロッキングを起こしやすくなる。30nm未満であると剥離特性が安定化せず、剥離が重くなることがあり好ましくない。
【0038】
[不活性微粒子]
本発明における離形層中には、微細な不活性粒子を含有する。微細な不活性粒子は、平坦な離形層面に多く微細凹凸を付与するが、非常に微細なためその形状は成型シートへ転写しても不具合を生じるレベルではなく、離形層の背面への転写(ブロッキング)や工程適正が改善さる。このような要件を満たすためには、不活性粒子の平均粒径は、好ましくは1〜100nm、さらに好ましくは3〜80nm、さらに好ましくは5〜80nm、さらに好ましくは5〜50nmである。この不活性粒子は有機粒子、無機粒子のいずれも用いることができ、有機粒子と無機粒子の混合粒子でもよい。
【0039】
不活性粒子の具体例としては、炭酸カルシウム,カオリン,酸化ケイ素,硫酸バリウム,酸化チタン,酸化アルミナ、酸化マグネシウム、酸化ジルコニウム等の無機粒子;架橋ポリスチレン樹脂粒子,架橋シリコーン樹脂粒子,架橋アクリル樹脂粒子,架橋ポリスチレン樹脂粒子等の有機樹脂粒子を挙げることができ、無機素材と有機素材がシェルコア構造の形態をとる粒子でも良い。
【0040】
特に微細粒子の場合は無機粒子が好ましく、不活性粒子の長径と短径の比(長径/短径)が1.0〜1.2であることが好ましい。この不活性粒子を配合することにより、離形層表面に非常に微細な凹凸を形成することができる。
【0041】
添加量は、離型層の重量基準に、好ましくは0.1〜25重量%、さらに好ましくは0.3〜5%である。添加量が0.1重量%未満であると滑り性や離形層のブロッキングが起こり、離形層の剥離特性が安定しなくなり25重量%を超えると透明性が落ち、凝集が起こりやすく粗大凝集物が発生して好ましくない。
【0042】
本発明における離形フィルムの離形層の表面粗さは、離形層に用いる樹脂と添加する微細粒子により適宜コントロールすることができる。
【0043】
離型層の中心線表面粗さRaは5nm以下、十点平均粗さRzは30nm以下である。Raが5nmを超えると薄層成型シートでは表面の平滑性が損なわれ、Rzが30nmを超えると成型シートに厚み斑を生じ、電子材料用途では電気特性不良を生じるため好ましくない。
【0044】
離形層の厚み(t[nm])と不活性粒子の平均粒径(d[nm])は下記式を満たす。
0.3d≦t≦2.5d
【0045】
離形層の厚みが0.3d未満であると粒子の脱落がおこり異物発生の原因となる。また、2.5dを超えると表面の微細な凹凸が形成されず滑り性不良となり、ハンドリングや巻取り性、剥離帯電不良を生じる。
【0046】
本発明において、離形フィルム表面の微細な凹凸は、表面の突起数と突起高さの関係が下記式を満たす。
HD5(突起高さ5nm以上の個数)≧500個/mm2
HD10(突起高さ10nm以上の個数)≦100個/mm2
【0047】
HD5が500未満であると、滑り性不良となり、ハンドリングや巻取り性、剥離帯電不良を生じ、HD10が100を超えると成型シート表面に形状が転写し、シートの厚み斑の原因となり好ましくない。
【0048】
離型層には本発明の目的を妨げない範囲で公知の各種添加剤を配合することができる。例えば紫外線吸収剤、顔料、消泡剤、滑剤(タルク、クレー、アルミナ等)、帯電防止剤を必要に応じて添加しても良い。また、離形層とは別に、このような添加剤と樹脂の組み合わせによりポリエステルフィルム表面に塗設しても良い。
【0049】
本発明においては、ポリエステルフイルムと離型層との密着性を高めるためにポリエステルフイルムと離型層との間にコロナ処理や接着層を設けてもよい。この接着層には例えばポリエステル、アクリル、ウレタンのごとき樹脂およびこれらの共重合樹脂、またはシランカップリング剤を好ましく用いることができる。接着層の好ましい厚みは0.005〜0、1μm程度であり、特に0.01〜0.1μmが好ましい。接着層の厚みが上記の範囲であるとポリエステルフイルムと離型層の密着性が良好となる。
【0050】
【実施例】
以下、実施例を挙げて本発明を更に説明する。
なお、フイルムの各特性値は下記の方法で測定した。
【0051】
(1)粒子の平均粒径(d)
島津製作所製CP−50型セントリフュグル パーティクル サイズ アナライザー(Centrifugal Particle Size Analyzer)を用いて測定する。得られる遠心沈降曲線を基に算出した各粒径の粒子とその存在量との積算曲線から、50マスパーセントに相当する粒径を読み取り、この値を上記平均粒径とする(Book「粒度測定技術」日刊工業新聞発行、1975年、頁242〜247参照)。
【0052】
(2)中心線平均粗さ(Ra(nm))
中心線平均粗さ(Ra)は、JIS−B0601で定義される値であり、本発明ではWYKO CORPORATION NT−2000の非接触式表面粗さ計を用いて測定する。測定条件は次の通りである。
(a)測定エリア:0.0462μm
(b)測定倍率 :25倍
【0053】
(3)十点平均粗さRz(nm)
十点平均粗さ(Rz)は、JIS−B0601で定義される値であり、本発明では中心線平均粗さRa測定と同一機種により測定する。得られたデーターの断面曲線より基準長だけ抜き取った部分において、5番目までの山頂の標高の平均値と最深から5番目までの谷底の標高の平均値との差の値を示す。
【0054】
(4)HD5およびHD10
HD5およびHD10は、中心線平均粗さRa測定と同一機種により測定する。得られたデーターより突起密度分布を算出し、突起高さ5nm以上の突起の個数をHD5とし、突起高さ10nm以上の突起の個数をHD10とする。
【0055】
(5)膜厚測定(Tsi(nm))
離型フイルムの断面をミクロトームで割断し、得られた試料をTEMにて観察することにより、離型層の厚みを測定する。
【0056】
(6)シリコーン含有の測定
シリコーンの含有は、離型フィルム表面をESCAにて測定し、Siピークの有無を確認する。ただし、ポリエステルフィルムに酸化ケイ素が含まれる場合は、断面からの元素分析を行いSiピークの有無を判定する。
【0057】
(7)ハンドリング性
ブロッキング:
離形フィルムをロール状に1000巻き、60℃X1ヶ月間のエージング後、フィルムの離形面とその背面で張り付き現象を目視確認する。
○:ブロッキング無し
×:ブロッキング有り
滑り性:
加工機に離型フィルムを通し、ロール表面上で離型フィルムに皺が発生するか目視確認を行う(条件:張力7kg/m幅、速度50m/分)。
○:皺無し
×:皺有り
削れ性:
フィルム表面を黒色画用紙で磨耗し、白紛の発生を目視確認する。
○:白紛無し
×:白紛有り
【0058】
[実施例1]
まず、ジメチルテレフタレートとエチレングリコールとを、エステル交換触媒として酢酸マンガンを用い、重合触媒として三酸化アンチモンを用い、安定剤として亜燐酸を用い、常法により重合し、固有粘度(オルソクロロフェノール、35℃)0.62のポリエチレンテレフタレートAを得た。
【0059】
ポリエチレンテレフタレートAのペレットを170℃で3時間乾燥後の押出機ホッパーに供給し、溶融温度280〜300℃で溶融し、押出ダイを用いて、表面仕上げ0.3s程度、表面温度20℃の回転冷却ドラム上に押出し、厚み540μmの未延伸フイルムを得た。
【0060】
このようにして得られた未延伸積層フイルムを75℃に予熱し、更に低速、高速のロール間で15mm上方より900℃の表面温度のIRヒーター1本にて加熱して3.6倍に延伸し、急冷し、続いてステンターに供給し、105℃にて横方向に3.9倍に延伸した。得られた二軸配向フイルムを205℃の温度で5秒間熱固定し、厚み38μmの熱固定二軸配向積層ポリエステルフイルムを得た。尚、一軸延伸後に離型層のアンカー処理として、水溶性ポリエステル樹脂液をキスコート法にて塗布を実施した。
【0061】
このフイルム上に、主骨格がアミノアルキッド樹脂に側鎖としてC18のアルキル基を持つ樹脂に、更に無機粒子として酸化ケイ素粒子(日本エアロジル製 R972 平均粒径が30nm)を樹脂成分あたり0.5wt%添加。全固型分濃度が1%となる溶液を作成し、常法のロールコーティング法により、乾燥膜厚みが45nmとなるよう塗布した離型フイルムを得た。加熱乾燥は、150℃にて30秒行なった。この離型フイルムの特性を表1に示す。
【0062】
[実施例2]
ジメチルテレフタレートとエチレングリコールとを、エステル交換触媒として酢酸マンガンを用い、重合触媒として三酸化アンチモンを用い、安定剤として亜燐酸を用い、滑剤の不活性粒子として平均粒子径0.1μmの酸化ケイ素を0.12wt%配合して、常法により重合し、固有粘度(オルソクロロフェノール、35℃)0.62のポリエチレンテレフタレートBを得た。
【0063】
尚、一軸延伸後に離型層のアンカー処理として、水溶性ポリエステル樹脂液をキスコート法にて塗布を実施した。
【0064】
このフイルム上に、主骨格がアミノアルキッド樹脂に側鎖としてC18のアルキル基を持つ樹脂に、更に無機粒子として酸化ケイ素粒子(日本エアロジル製 R972 平均粒径が30nm)を樹脂成分あたり0.2wt%添加。全固型分濃度が1%となる溶液を作成し、常法のロールコーティング法により、乾燥膜厚みが45nmとなるよう塗布した離型フイルムを得た。加熱乾燥は、150℃にて20秒行なった。この離型フイルムの特性を表1に示す。
【0065】
[比較例1]
実施例1の離形層中の無機粒子を使用しない以外は、実施例1と同様な方法で離形フィルムを得た。
【0066】
[比較例2]
実施例1の離形層の厚みを1000nmとする以外は、実施例1と同様な方法にて離形フィルムを得た。
【0067】
[比較例3]
実施例1の離形層中に添加する粒子を30%とする以外は、実施例1と同様の方法にて離形フィルムを得た。
【0068】
[比較例4]
実施例1の離型層をポリジメチルシロキサンを主成分とする以外は、実施例1と同様の方法にて離型フィルムを得た。
【0069】
【表1】
【0070】
【発明の効果】
本発明によれば、離形フィルム表面の大きな突起が成形シートに転写しない優れた表面特性を有するとともに、加工適性に優れ、シリコーン転写の無い離型フイルムを提供することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a release film.
[0002]
[Prior art]
Release films are used, for example, for resin sheet molding, adhesive release, medical use, and electrical / electronic component manufacturing.
[0003]
In a molded body such as a resin sheet molded from a release film, flattening the surface of the molded body is an important issue. It is no exaggeration to say that the quality of a molded product formed from a film depends on the accuracy and quality of the surface, that is, the accuracy and quality of the surface of the release film (Japanese Patent Laid-Open No. 11-348186). Publication). Furthermore, it has been studied to reduce the transfer of silicone as much as possible for release films used in the production of electric / electronic parts (Japanese Patent Laid-Open No. 11-268194). Unreacted substances cannot be completely removed, and slight transcription occurs. Silicone transferred to the molded part hinders contamination and adhesion in subsequent manufacturing processes, resulting in defects in quality and durability.
[0004]
The release film itself forms a resin layer having releasability on the polyester film. Normally, polyester film is blended with particles to improve processability, for example, slipperiness and winding properties, but generally, the addition of the particles improves handling, but the film surface becomes rough. . If the blending of the particles is stopped in order to avoid this and create a flat surface property, the resulting film will be extremely slippery and air bleed and will not wrinkle or roll in processing. Become.
[0005]
In addition, when the film is accompanied by a release coating layer, the coating layer covers and hides the protrusions on the surface of the polyester film. Conventionally, in a molded body or a molded sheet molded from a release film, there is no strict requirement for the surface characteristics, and even a certain degree of roughness does not cause a quality problem. However, in recent years, the requirements for the surface characteristics of a molded sheet using a release film have become very strict.
[0006]
For example, in the case of a sheet of vinyl chloride resin or urethane resin, these resin solutions are cast on a release film to form a sheet. In these sheets, particularly high gloss may be required on the molding surface.
[0007]
Moreover, in the release film for adhesive tape, since the unevenness of the release film surface is transferred to the surface of the adhesive layer of the adhesive tape, for example, when the adhesive tape is applied to the glass surface, It becomes impossible to get a clean appearance. Therefore, surface flatness is required.
[0008]
Furthermore, release films used as process materials for electronic parts have particularly high demands on surface characteristics. For example, when preparing a thin layer sheet of a ceramic capacitor, a ceramic slurry in which ceramic powder and a binder agent are dispersed in a liquid medium is applied on a release film to form a very thin sheet of 3 μm or less. As the sheet becomes thinner, the surface irregularities of the release film directly lead to an increase in the defective rate of the molded sheet. Also, when used as a process material for display applications, smoothing of the surface of the release film is required by thinning the molded sheet.
[0009]
The release film used in the semiconductor field requires surface flatness, but also considers transfer of silicone as a very problem, and the demand for release film without silicone transfer has become very high. Yes.
[0010]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-348186
[Patent Document 2]
Japanese Patent Laid-Open No. 11-268194
[Problems to be solved by the invention]
An object of the present invention is to solve the drawbacks of the prior art, with a large projection of the releasing film surface has excellent surface characteristics that do not transfer to the molded sheet, excellent processability aptitude, without releasing film of silicone transfer It is to provide.
[0013]
[Means for Solving the Problems]
That is, the present invention, the surface of the port re ester film, a releasing film having a parting layer of 300nm or less in thickness containing fine inert particles, the center line surface roughness Ra of the release layer is 5nm or less The ten-point average roughness Rz is 30 nm or less, and the release layer is composed of a compound containing a long-chain alkyl group and not containing polydimethylsiloxane, and is inactive with the thickness (t [nm]) of the release layer. the average particle diameter of the particles (d [nm]) satisfies the following equation,
0.3d ≦ t ≦ 2.5d
It is a release film in which the relationship between the number of protrusions on the surface of the release film and the protrusion height satisfies the following formula.
HD5 (number of protrusions of 5 nm or more) ≧ 500 pieces / mm 2
HD10 (number of protrusions with a height of 10 nm or more) ≦ 100 / mm 2
[0014]
Hereinafter, the present invention will be described in detail.
[0015]
[Polyester film]
[polyester]
In the present invention, a polyester film is used as the base film. In the present invention, the polyester is a polyester having an aromatic dicarboxylic acid as a main acid component and an aliphatic glycol as a main glycol component. Such polyesters are substantially linear and have film formability, particularly film formability by melt molding.
[0016]
Examples of aromatic dicarboxylic acids include terephthalic acid, naphthalenedicarboxylic acid, isophthalic acid, diphenoxyethanedicarboxylic acid, diphenyldicarboxylic acid, diphenylether dicarboxylic acid, difelsulfone dicarboxylic acid, diphenylketone dicarboxylic acid, and anthracene dicarboxylic acid. Can do.
[0017]
Examples of the aliphatic glycol include polymethylene glycol having 2 to 10 carbon atoms such as ethylene glycol, trimethylene glycol, tetramethylene glycol, pentamethylene glycol, hexamethylene glycol and decamethylene glycol, and an alicyclic diol such as cyclohexanedimethanol. Can be mentioned.
[0018]
In the present invention, as the polyester, those mainly comprising alkylene terephthalate or alkylene naphthalate are preferably used.
[0019]
As such polyester, polyethylene terephthalate or polyethylene-2,6-naphthalate is preferable.
[0020]
Polyethylene terephthalate includes a copolymer in which, for example, 80 mol% or more of all dicarboxylic acid components are terephthalic acid, and for example, 80 mol% or more of all glycol components are ethylene glycol.
[0021]
Polyethylene-2,6-naphthalate includes a copolymer in which 80 mol% or more of all dicarboxylic acid components are 2,6-naphthalenedicarboxylic acid and 80 mol% or more of all glycol components are ethylene glycol, for example. Is done.
[0022]
In the case of such a copolymer, 20 mol% or less can be a dicarboxylic acid component other than terephthalic acid or 2,6-naphthalenedicarboxylic acid, and the dicarboxylic acid component is, for example, the above aromatic cigarbonic acid. Can do. Further, for example, it may be an alicyclic dicarboxylic acid such as adipic acid or sebacic acid; an alicyclic dicarboxylic acid such as cyclohexane-1,4-dicarboxylic acid.
[0023]
In addition, 20 mol% or less of the total glycol component can be a glycol component other than ethylene glycol, and the glycol component can be, for example, the above-described glycol, such as hydroquinone, resorcin, 2,2-bis (4-hydroxy). An aromatic diol such as phenyl) propane; an aliphatic diol having an aromatic ring such as 1,4-dihydroxydimethylbenzene; a polyalkylene glycol (polyoxyalkylene glycol) such as polyethylene glycol, polypropylene glycol, polytotetramethylene glycol, etc. Can be.
[0024]
In the polyester of the present invention, a component derived from an oxycarboxylic acid such as an aromatic oxyacid such as hydroxybenzoic acid or an aliphatic oxyacid such as ω-hydroxycaproic acid is used as a dicarboxylic acid component and an oxycarboxylic acid component. Copolymerization or bonding is included in an amount of 20 mol% or less based on the total amount.
[0025]
Further, the polyester contains a tri- or higher functional polycarboxylic acid or polyhydroxy compound such as trimellitic acid or pentaerythritol in an amount within a substantially linear range, for example, an amount of 2 mol% or less based on the total acid component. Copolymerized products are also included.
[0026]
The polyester is known per se and can be produced by a method known per se. The polyester preferably has an intrinsic viscosity of 0.4 to 0.9 determined by measurement at 35 ° C. as a solution in o-chlorophenol.
[0027]
In the present invention, the polyester film may or may not contain inert particles. Inert particles when containing an average particle size of preferably less than 1 [mu] m, more preferably from inert particles less than 1 [mu] m or more 0.01 [mu] m. As the inert particles, either organic particles or inorganic particles can be used, and mixed particles of organic particles and inorganic particles may be used. The inert particles may be formed of two or more components. The ratio of the major axis to the minor axis (major axis / minor axis) of the inert particles of each component is preferably 1.0 to 1.2. By blending these inert particles, very fine irregularities can be formed on the film surface. Specific examples of such inert particles include inorganic particles such as calcium carbonate, kaolin, silicon oxide, barium sulfate, titanium oxide, and alumina oxide; crosslinked polystyrene resin particles, crosslinked silicone resin particles, crosslinked acrylic resin particles, and crosslinked polystyrene resin particles. Organic resin particles such as, for example, may be particles in which an inorganic material and an organic material take the form of a shell core structure.
[0028]
[the film]
In the present invention, the polyester film may be a single layer film or a laminated film. In the case of a laminated film, it can be composed of at least two layers, and is preferably produced by coextrusion. In this case, the polyester constituting the layer may be the same or different, but the same is preferable.
[0029]
In the present invention, when the polyester film is a laminated film, if the types of polyester constituting the film are expressed as A, B, C, for example, a laminated structure of A / B, A / B / A, A / B / C is formed. Can take.
[0030]
As for the surface roughness of at least one side of the polyester film, the center line average roughness Ra is 5 nm or less, and the ten-point average roughness Rz is 30 nm or less. When Ra exceeds 5 nm, the smoothness of the surface is impaired in the thin-layer molded sheet, and when Rz exceeds 30 nm, thickness unevenness occurs in the molded sheet, resulting in poor electrical characteristics in electronic material applications.
[0031]
The total thickness of the polyester film is preferably 10 to 100 μm, more preferably 15 to 50 μm, both in the case of a single layer film and in the case of a laminated film.
[0032]
The polyester film itself can be obtained by a method conventionally known or accumulated in the art. In order to obtain a laminated biaxially oriented film, for example, a polyester unmelted film having an intrinsic viscosity of 0.4 to 0.8 dl / g by melting and co-extruding polyester at a temperature of melting point (Tm: ° C.) to (Tm + 70) ° C. Get. Next, the laminated unstretched film is uniaxially (longitudinal or transverse) at a temperature of (Tg-10) to (Tg + 70) ° C. (where Tg is the glass transition temperature of the polyester) 2.5 times or more, preferably 3 The film is stretched at a magnification of at least twice, and then stretched at a temperature of Tg to (Tg + 70) ° C. in a direction perpendicular to the stretching direction at a magnification of 2.5 times or more, preferably 3 times or more. Furthermore, you may extend | stretch again in the vertical direction and / or a horizontal direction as needed. Thus, the total draw ratio is preferably 9 times or more, more preferably 12 to 35 times, and particularly preferably 15 to 25 times as the area draw ratio. Furthermore, the biaxially oriented film can be heat-set at a temperature of (Tg + 70) ° C. to (Tm−10) ° C. (where Tm is the melting point of polyester), and is preferably 180 to 250 ° C., for example. The heat setting time is preferably 1 to 60 seconds.
[0033]
[Release layer]
[resin]
In the present invention, a release layer is provided on the surface of the polyester film. This release layer is composed of a compound containing a long- chain alkyl group and not containing polydimethylsiloxane. Therefore, the release layer is preferably formed of an organic resin having a long-chain alkyl group without having a polydimethylsilicone component.
[0034]
The organic resin may be either thermosetting or thermoplastic. For example, the main component is a resin such as acrylic, polyester, alkyd, melamine, epoxy, amide, imide, PVA, or a copolymer thereof, and the side chain has a long-chain alkyl group.
[0035]
The long chain alkyl group is preferably an alkyl group having 12 to 28 carbon atoms. If the number of carbon atoms is less than 12, the peeling properties are poor and peeling from the molded article is worsened. If the number of carbon atoms exceeds 28, the solubility of the resin becomes worse and a homogeneous thin film cannot be formed.
[0036]
In the present invention, the release layer can be applied by, for example, applying a coating liquid containing the components of the release layer to the film and drying by heating. As a coating method of this coating liquid, any known coating method can be applied. Examples of applicable coating methods include a roll coater method and a blade coater method. Heat drying for forming the coating layer is preferably performed at 70 to 170 ° C. for 30 to 90 seconds.
[0037]
The thickness of the release layer is 300 nm or less, preferably 30 nm or more and 300 nm or less, and more preferably 50 nm or more and 200 nm or less. When the release layer thickness exceeds 300 nm, blocking tends to occur. If it is less than 30 nm, the peeling properties are not stabilized, and peeling may become heavy, which is not preferable.
[0038]
[Inert fine particles]
The release layer in the present invention contains fine inert particles. The fine inert particles give many fine irregularities on the flat release layer surface, but the shape is so fine that it does not cause a problem even if it is transferred to a molded sheet. Transfer (blocking) and process suitability are improved. In order to satisfy such requirements, the average particle diameter of the inert particles is preferably 1 to 100 nm, more preferably 3 to 80 nm, still more preferably 5 to 80 nm, and further preferably 5 to 50 nm. As the inert particles, either organic particles or inorganic particles can be used, and mixed particles of organic particles and inorganic particles may be used.
[0039]
Specific examples of the inert particles include inorganic particles such as calcium carbonate, kaolin, silicon oxide, barium sulfate, titanium oxide, alumina oxide, magnesium oxide, and zirconium oxide; crosslinked polystyrene resin particles, crosslinked silicone resin particles, and crosslinked acrylic resin particles. , Organic resin particles such as crosslinked polystyrene resin particles can be mentioned, and the inorganic material and the organic material may be particles having a shell core structure.
[0040]
In particular, in the case of fine particles, inorganic particles are preferred, and the ratio of the major axis to minor axis (major axis / minor axis) of the inert particles is preferably 1.0 to 1.2. By blending the inert particles, very fine irregularities can be formed on the surface of the release layer.
[0041]
The addition amount is preferably 0.1 to 25% by weight, more preferably 0.3 to 5%, based on the weight of the release layer. If the amount added is less than 0.1% by weight, slipping or blocking of the release layer occurs, and the release characteristics of the release layer become unstable, and if it exceeds 25% by weight, the transparency is lowered and aggregation is likely to occur. An object is generated, which is not preferable.
[0042]
The surface roughness of the release layer of the release film in the present invention can be appropriately controlled by the resin used for the release layer and the fine particles to be added.
[0043]
Center line surface roughness Ra of the release layer is 5nm or less, ten point average roughness Rz Ru der below 30 nm. When Ra exceeds 5 nm, the smoothness of the surface is impaired in the thin-layer molded sheet, and when Rz exceeds 30 nm, thickness unevenness occurs in the molded sheet, and electrical characteristics are poor in the electronic material application, which is not preferable.
[0044]
The thickness (t [nm]) of the release layer and the average particle diameter (d [nm]) of the inert particles satisfy the following formula.
0.3d ≦ t ≦ 2.5d
[0045]
If the thickness of the release layer is less than 0.3d, particles fall off and cause foreign matter. On the other hand, if it exceeds 2.5 d, fine irregularities on the surface are not formed, resulting in poor sliding properties, and handling, winding properties, and peeling electrification failures occur.
[0046]
In the present invention, fine irregularities of a release film surface, the relationship of the projection speed and the projection height of the surface meet the following equation.
HD5 (number of protrusions of 5 nm or more) ≧ 500 pieces / mm 2
HD10 (number of protrusions with a height of 10 nm or more) ≦ 100 / mm 2
[0047]
When the HD5 is less than 500, slipperiness is poor, and handling, winding property, and peeling electrification failure occur. When the HD10 exceeds 100, the shape is transferred to the surface of the molded sheet, which is not preferable because it causes unevenness in the thickness of the sheet.
[0048]
Various known additives can be blended in the release layer as long as the object of the present invention is not hindered. For example, an ultraviolet absorber, a pigment, an antifoaming agent, a lubricant (talc, clay, alumina, etc.), and an antistatic agent may be added as necessary. In addition to the release layer, the polyester film surface may be coated with a combination of such an additive and a resin.
[0049]
In the present invention, a corona treatment or an adhesive layer may be provided between the polyester film and the release layer in order to enhance the adhesion between the polyester film and the release layer. For this adhesive layer, for example, resins such as polyester, acrylic, and urethane, copolymer resins thereof, or silane coupling agents can be preferably used. The preferable thickness of the adhesive layer is about 0.005 to 0 and 1 μm, and particularly preferably 0.01 to 0.1 μm. When the thickness of the adhesive layer is within the above range, the adhesion between the polyester film and the release layer is improved.
[0050]
【Example】
Hereinafter, the present invention will be further described with reference to examples.
Each characteristic value of the film was measured by the following method.
[0051]
(1) Average particle diameter (d)
Measured using a CP-50 Centrifuggle Particle Size Analyzer (Shimadzu Corporation). The particle size corresponding to 50 mass percent is read from the integrated curve of the particles of each particle size calculated based on the obtained centrifugal sedimentation curve and the abundance thereof, and this value is taken as the average particle size (Book “particle size measurement”). Technology ", published by Nikkan Kogyo Shimbun, 1975, pages 242-247).
[0052]
(2) Centerline average roughness (Ra (nm))
The center line average roughness (Ra) is a value defined by JIS-B0601, and in the present invention, it is measured using a non-contact type surface roughness meter of WYKO CORPORATION NT-2000. The measurement conditions are as follows.
(A) Measurement area: 0.0462 μm
(B) Measurement magnification: 25 times
(3) Ten-point average roughness Rz (nm)
The ten-point average roughness (Rz) is a value defined by JIS-B0601 and is measured by the same model as the centerline average roughness Ra measurement in the present invention. In the part extracted by the reference length from the cross-sectional curve of the obtained data, the value of the difference between the average value of the altitude at the top of the fifth peak and the average value of the altitude at the bottom of the valley from the deepest to the fifth is shown.
[0054]
(4) HD5 and HD10
HD5 and HD10 are measured by the same model as the centerline average roughness Ra measurement. The projection density distribution is calculated from the obtained data, and the number of projections with a projection height of 5 nm or more is HD5, and the number of projections with a projection height of 10 nm or more is HD10.
[0055]
(5) Film thickness measurement (Tsi (nm))
The thickness of the release layer is measured by cleaving the cross section of the release film with a microtome and observing the obtained sample with a TEM.
[0056]
(6) Measurement of Silicone Containing Silicone content is determined by measuring the release film surface with ESCA and confirming the presence or absence of Si peak. However, when silicon oxide is contained in the polyester film, elemental analysis from the cross section is performed to determine the presence or absence of the Si peak.
[0057]
(7) Handling property blocking:
The release film is rolled up into 1000 rolls, and after aging at 60 ° C. for 1 month, the sticking phenomenon is visually confirmed on the release surface of the film and its back surface.
○: No blocking ×: Breakfast Russia Kkingu there slip properties:
A release film is passed through the processing machine, and a visual check is performed to check whether wrinkles are generated on the release film on the roll surface (conditions: tension 7 kg / m width, speed 50 m / min).
○: Without wrinkles ×: With wrinkles
The film surface is worn with black drawing paper, and white powder is visually confirmed.
○: No white powder ×: White powder exists [0058]
[Example 1]
First, dimethyl terephthalate and ethylene glycol were polymerized by a conventional method using manganese acetate as a transesterification catalyst, antimony trioxide as a polymerization catalyst, phosphorous acid as a stabilizer, and intrinsic viscosity (orthochlorophenol, 35 C.) 0.62 polyethylene terephthalate A was obtained.
[0059]
Polyethylene terephthalate A pellets are fed to an extruder hopper after drying at 170 ° C. for 3 hours, melted at a melting temperature of 280 to 300 ° C., and rotated with an extrusion die at a surface finish of about 0.3 s and a surface temperature of 20 ° C. The film was extruded onto a cooling drum to obtain an unstretched film having a thickness of 540 μm.
[0060]
The unstretched laminated film thus obtained is preheated to 75 ° C., and further heated by a single IR heater with a surface temperature of 900 ° C. from above 15 mm between low-speed and high-speed rolls and stretched 3.6 times. Then, it was rapidly cooled, then supplied to a stenter, and stretched 3.9 times in the transverse direction at 105 ° C. The obtained biaxially oriented film was heat-fixed at a temperature of 205 ° C. for 5 seconds to obtain a heat-fixed biaxially oriented laminated polyester film having a thickness of 38 μm. In addition, after uniaxial stretching, the water-soluble polyester resin liquid was apply | coated by the kiss coat method as an anchor process of a release layer.
[0061]
On this film, a resin having a main skeleton of amino alkyd resin having a C18 alkyl group as a side chain and further silicon oxide particles (R972, manufactured by Nippon Aerosil Co., Ltd., having an average particle size of 30 nm) as inorganic particles are 0.5 wt% per resin component. Addition. A solution having a total solid content concentration of 1% was prepared, and a release film coated with a dry film thickness of 45 nm was obtained by a conventional roll coating method. Heat drying was performed at 150 ° C. for 30 seconds. Table 1 shows the characteristics of this release film.
[0062]
[Example 2]
Dimethyl terephthalate and ethylene glycol, manganese acetate as the transesterification catalyst, antimony trioxide as the polymerization catalyst, phosphorous acid as the stabilizer, and silicon oxide with an average particle size of 0.1 μm as the inert particles of the lubricant 0.12 wt% was blended and polymerized by a conventional method to obtain polyethylene terephthalate B having an intrinsic viscosity (orthochlorophenol, 35 ° C.) of 0.62.
[0063]
In addition, after uniaxial stretching, the water-soluble polyester resin liquid was apply | coated by the kiss coat method as an anchor process of a release layer.
[0064]
On this film, a resin having a main skeleton of amino alkyd resin having a C18 alkyl group as a side chain and further silicon oxide particles (R972, manufactured by Nippon Aerosil Co., Ltd., having an average particle size of 30 nm) as inorganic particles are 0.2 wt% per resin component. Addition. A solution having a total solid content concentration of 1% was prepared, and a release film coated with a dry film thickness of 45 nm was obtained by a conventional roll coating method. Heat drying was performed at 150 ° C. for 20 seconds. Table 1 shows the characteristics of this release film.
[0065]
[Comparative Example 1]
A release film was obtained in the same manner as in Example 1 except that the inorganic particles in the release layer of Example 1 were not used.
[0066]
[Comparative Example 2]
A release film was obtained in the same manner as in Example 1 except that the thickness of the release layer in Example 1 was 1000 nm.
[0067]
[Comparative Example 3]
A release film was obtained in the same manner as in Example 1 except that the amount of particles added to the release layer in Example 1 was 30%.
[0068]
[Comparative Example 4]
A release film was obtained in the same manner as in Example 1 except that the release layer of Example 1 was mainly composed of polydimethylsiloxane.
[0069]
[Table 1]
[0070]
【The invention's effect】
According to the present invention, which has excellent surface properties large projections of releasing the film surface is not transferred to the molded sheet, excellent processability aptitude can provide no release film of silicone transfer.
Claims (3)
0.3d≦t≦2.5d
離形フィルムの表面の突起数と突起高さの関係が下記式を満足する離形フィルム。
HD5(突起高さ5nm以上の個数)≧500個/mm 2
HD10(突起高さ10nm以上の個数)≦100個/mm 2 On the surface of the port re ester film, a releasing film having a parting layer is 300nm or less thick containing fine inert particles, the center line surface roughness Ra of the release layer is 5nm or less, ten point average roughness The thickness Rz is 30 nm or less, and the release layer is composed of a compound containing a long-chain alkyl group and not containing polydimethylsiloxane, and the thickness (t [nm]) of the release layer and the average particle diameter of the inert particles (D [nm]) satisfies the following formula ,
0.3d ≦ t ≦ 2.5d
A release film in which the relationship between the number of protrusions on the surface of the release film and the protrusion height satisfies the following formula.
HD5 (number of protrusions of 5 nm or more) ≧ 500 pieces / mm 2
HD10 (number of protrusions with a height of 10 nm or more) ≦ 100 / mm 2
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JP2013133370A (en) * | 2011-12-26 | 2013-07-08 | Toray Eng Co Ltd | Adhesive formed on release film |
JP6273717B2 (en) * | 2013-08-09 | 2018-02-07 | 東洋紡株式会社 | Release film for forming ceramic sheets |
EP3825123A4 (en) | 2018-07-17 | 2022-04-13 | Toray Industries, Inc. | Laminated film |
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JPH11240110A (en) * | 1998-02-25 | 1999-09-07 | Teijin Ltd | Mold-release film |
JP2001031825A (en) * | 1999-07-26 | 2001-02-06 | Nitto Denko Corp | Water dispersible, releasable composition and its production, and releasable and pressure sensitive adhesive sheets base material |
JP2001129953A (en) * | 1999-08-25 | 2001-05-15 | Toray Ind Inc | Biaxially oriented laminated polyester film |
JP2001184623A (en) * | 1999-12-24 | 2001-07-06 | Toray Ind Inc | Polyester film for magnetic recording medium and magnetic recording tape |
JP2001277431A (en) * | 2000-03-31 | 2001-10-09 | Teijin Ltd | Release film |
JP4482780B2 (en) * | 2000-09-19 | 2010-06-16 | 東洋紡績株式会社 | Film laminate for manufacturing ceramic sheets |
JP2002283322A (en) * | 2001-03-23 | 2002-10-03 | Teijin Ltd | Carrier sheet for manufacturing ceramic capacitor and manufacturing method of the sheet |
JP2003025487A (en) * | 2001-07-13 | 2003-01-29 | Teijin Dupont Films Japan Ltd | Antistatic mold release film |
JP4243054B2 (en) * | 2001-10-31 | 2009-03-25 | 富士フイルム株式会社 | Magnetic recording medium |
CN100379553C (en) * | 2002-05-27 | 2008-04-09 | 帝人杜邦菲林日本株式会社 | Releasing film |
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2003
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