JP4301555B2 - Small magnetic sensor module - Google Patents

Description

  The present invention relates to a small magnetic sensor module having a low profile and a magnetic sensing direction being a lateral direction.

  Conventionally, many small magnetic sensors use a Hall element made of a semiconductor to which the Hall effect is applied. Spindle motor rotation position detection sensors such as floppy disks (registered trademark), CD-ROMs, and DVDs, and rotary encoder sensors Etc. are widely used. Further, along with recent demands for miniaturization and thinning of electronic devices, technological development for miniaturization and thinning of motors and encoders has progressed, and there is an increasing demand for miniaturization and thinning of magnetic sensors. In response to these requirements, a small-sized magnetic sensor module capable of surface mounting, in which a Hall element is mounted on a lead frame and sealed with a resin, has been proposed. (For example, refer to Patent Document 1). Hereinafter, a conventional magnetic sensor module will be described with reference to FIGS.

  FIG. 10 is a plan perspective view of a magnetic sensor module using a conventional lead frame, and FIG. 11 is a side perspective view of the conventional magnetic sensor module. 10 and 11, reference numeral 1 denotes a conventional surface mountable magnetic sensor module. Reference numeral 2 denotes a hall element as a magnetic sensor, and reference numerals 3a to 3d denote lead frames made of a conductive member. The Hall element 2 is mounted and fixed on the lead frame 3a. 4a to 4d are wires made of fine metal wires, and electrically connect the four electrodes (not shown) of the Hall element 2 and the lead frames 3a to 3d. Reference numeral 5 denotes a sealing member that seals part of the hall element 2, the wires 4a to 4d, and the lead frames 3a to 3d. Reference numeral 6 denotes a printed circuit board, and reference numeral 7 denotes a conductive pattern formed on the surface of the printed circuit board 6. Here, since the magnetic sensor module 1 can be surface-mounted on the printed circuit board 6 by the solder 8 using the lead frames 3a to 3d, a magnetic sensor module that is relatively small and easy to mount is realized.

Japanese Patent Laid-Open No. 11-121830 (Claims, FIGS. 1 and 2)

  However, if the magnetic sensor module 1 shown in FIGS. 10 and 11 is to be further reduced in size, the leading ends of the lead frames 3a to 3d exposed to be larger than the sealing member 5 become an obstacle, and further downsizing is achieved. It is difficult. The lead frames 3a to 3d are generally made of iron-nickel alloys. However, since these materials are ferromagnetic, they have a considerable adverse effect on the magnetic detection characteristics of the Hall element 2. Therefore, it is not a preferable configuration as a magnetic sensor module.

  Further, the magnetic sensing direction of the magnetic sensor module 1 is perpendicular to the printed circuit board 6 mounted as shown by the arrow A in FIG. However, when this magnetic sensor module is used for a spindle motor that has been reduced in thickness, the magnetic sensing direction may be horizontal with respect to the printed circuit board to be mounted, that is, the side direction in the magnetic sensor module. desirable.

  12 and 13 show an example of a magnetic sensor module having a magnetic sensing direction in a lateral direction using a conventional lead frame, and FIG. 12 is a plan perspective view of the magnetic sensor module having a magnetic sensing direction in a lateral direction. FIG. 13 is a side perspective view of the magnetic sensor module having the same magnetic sensing direction as the side direction. Here, the same number is attached | subjected to the same element as the magnetic sensor module 1 shown in FIG. 10 and FIG. 11, and the description which overlaps is partially omitted.

  12 and 13, reference numeral 10 denotes a magnetic sensor module having a magnetic sensing direction in the side surface direction. The lead frames 3a to 3d are exposed in a row from one side surface of the sealing resin 5, and the tips thereof are bent at a substantially right angle by forming. Reference numeral 6 denotes a printed circuit board, and reference numeral 7 denotes a conductive pattern formed on the surface of the printed circuit board 6. Here, if the tips of the lead frames 3 a to 3 d bent at substantially right angles are mounted on the conductive pattern 7 of the printed circuit board 6 by the solder 8, the magnetic sensor module 10 is mounted substantially perpendicular to the printed circuit board 6. As a result, the magnetic sensing direction of the magnetic sensor module 10 is the side surface direction as indicated by the arrow B, and a magnetic sensor module having the magnetic sensing direction of the side surface direction can be realized.

  However, the component height of the magnetic sensor module 10 increases as the lead frames 3a to 3d are formed, and a low-profile magnetic sensor module cannot be realized. Further, the bending angle of the lead frames 3a to 3d has a certain amount of error, and further, the bending angle of the lead frames 3a to 3d may change during the mounting work on the printed circuit board 6. The angle of the magnetic sensing direction indicated by the arrow B varies from one magnetic sensor module to another, and as a result, the magnetic detection sensitivity characteristic of the magnetic sensor module 10 may become unstable.

  An object of the present invention is to solve the above-described problems and provide a magnetic sensor module having a low profile and excellent mass productivity while the magnetic sensing direction is a side surface direction. Another object is to provide a magnetic sensor module that does not use a lead frame in order not to adversely affect the magnetic detection characteristics.

  In order to solve the above problems, the small magnetic sensor module of the present invention employs the following configuration.

The small magnetic sensor module of the present invention has a substantially rectangular parallelepiped insulating substrate on which a plurality of conductive members are arranged, and a magnetic sensor as a magnetoelectric conversion means is fixed to the insulating substrate. And the plurality of conductive members are arranged in a line in the longitudinal direction of the insulating substrate, and the plurality of conductive members are arranged on both sides of the insulating substrate. The plurality of conductive members forming a pair are electrically connected and integrated by a plurality of connection conductive members, and the plurality of conductive members on one side of the plurality of integrated conductive members are The plurality of conductive members and the plurality of connection conductive members on the other side of the plurality of integrated conductive members connected to the magnetic sensor by the electrical connection member are two outer peripheral surfaces of the insulating substrate. Almost exposed It is disposed in a corner, further characterized by being configured the magnetic sensor so as to seal with the sealing member.

According to the small magnetic sensor module of the present invention, a magnetic sensor is directly mounted on an insulating substrate and sealed with a sealing member. Therefore, it is possible to provide a small, low-profile magnetic sensor module with excellent mass productivity. I can do it. In addition, the plurality of conductive members that serve as the electrodes of the magnetic sensor are arranged in a line in the longitudinal direction of the insulating substrate and are arranged in pairs on both sides of the insulating substrate so that the electrode structure is simple and mass production is possible. A small magnetic sensor module with excellent performance can be realized.

  In addition, the plurality of conductive members and the plurality of connection conductive members on the other one side exposed on the two outer peripheral surfaces of the insulating substrate and disposed substantially at right angles are mounted on an external substrate member. By selecting any one of the electromechanical connection surfaces that function as an electromechanical connection surface and arranged at substantially right angles and mounting the selected surface on the external substrate member, The mounting direction can be selected from either a top-facing mounting or a side-facing mounting.

  As a result, the small magnetic sensor module of the present invention can be selected from the top-side mounting and the side-side mounting with respect to the external substrate member, so that the magnetic sensing direction of the magnetic sensor can be arbitrarily selected from two directions, the top surface direction or the side surface direction. I can do it.

  Further, the plurality of conductive members and the plurality of connection conductive members disposed on the insulating substrate are fixed to the external substrate member by surface mounting.

  As a result, the small magnetic sensor module of the present invention can be fixed to the external substrate member by surface mounting, so that the mounting area can be reduced and the mounting cost can be reduced.

  The insulating substrate is made of a glass epoxy base material or a BT resin base material.

  Thereby, the small magnetic sensor module which is excellent in strength and heat resistance and can reduce the cost can be provided.

  The magnetic sensor may be directly fixed to the surface substrate of the insulating substrate with a non-conductive adhesive.

  Thereby, since there is no conductive member or magnetic body around the magnetic sensor, it is possible to provide a small magnetic sensor module that does not adversely affect the magnetic detection characteristics.

  The magnetic sensor may be a hall element.

  Thereby, a small and low-profile high-performance magnetic sensor module can be provided.

  In addition, a plurality of the insulating substrates are formed on a thin plate-like aggregate substrate, and are separated and united by dicing along the connecting conductive member.

  As a result, it is possible to mount Hall elements on a collective substrate on which a large number of insulating substrates are formed, and then separate the insulating substrate by dicing along the connecting conductive member, so that mass production is possible. A small magnetic sensor module with excellent quality and stability can be provided.

  As described above, according to the present invention, the Hall element which is a magnetic sensor is directly mounted on the surface substrate of the insulating substrate, and the plurality of conductive members disposed on the insulating substrate are electrically connected to the Hall element. Since it is configured to be directly mounted on an external substrate member, it is possible to provide a small magnetic sensor module having a low profile and a magnetic sensing direction being a side surface direction.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a rear perspective view of a small magnetic sensor module according to an embodiment of the present invention, and FIG. 2 is a front perspective view of the small magnetic sensor module according to an embodiment of the present invention. FIG. 3 is a front perspective view of the small magnetic sensor module 20 seen through the sealing member 25 from the arrow C in FIG.

  1 and 2, reference numeral 20 denotes a small magnetic sensor module of the present invention. Reference numeral 21 denotes a substrate as an insulating substrate made of glass epoxy or BT resin having a substantially rectangular parallelepiped shape. Reference numerals 22 a to 22 d denote electrodes as conductive members made of a substantially square copper foil or the like, and are fixedly arranged in a line on one side of the substrate 21 in the longitudinal direction.

  Reference numerals 23a to 23d denote electrodes as conductive members made of copper foil or the like, which are fixed in a row on the other side of the substrate 21 in the longitudinal direction and arranged on both surfaces of the substrate 21 in pairs with the electrodes 22a to 22d. Established. The shapes of the electrodes 23a to 23d will be described later with reference to FIG. Reference numerals 24a to 24d denote through-hole electrodes as connection conductive members that cover the inner surface of the arc portion of the substrate 21, and electrically connect the electrodes 22a to 22d and the electrodes 23a to 23d arranged in pairs on both surfaces of the substrate 21. To do.

  As a result, the electrode 22a, the electrode 23a, the through-hole electrode 24a, the electrode 22b, the electrode 23b, the through-hole electrode 24b, the electrode 22c, the electrode 23c, the through-hole electrode 24c, and the electrode 22d, the electrode 23d, and the through-hole electrode 24d sandwich the substrate 21. The electrodes are electrically connected and integrated. Reference numeral 25 denotes a sealing member made of an insulating resin, which covers one side of the substrate 21 and seals a magnetic sensor (not shown) which will be described later. Further, the electrodes 22a to 22d and the through-hole electrodes 24a to 24d exposed on the surface of the substrate 21 are disposed substantially at right angles to the two outer peripheral surfaces of the substrate 21. It functions as an electromechanical connection surface for connection.

  Next, in FIG. 3, reference numeral 26 denotes a Hall element as a substantially cubic magnetic sensor, which is directly fixed to the surface substrate of the substrate 21 by a non-conductive paste 27 as a non-conductive adhesive. The electrodes 23a to 23d are a plurality of electrodes disposed on one side of the substrate 21 as described in FIGS. 1 and 2, and the tips of the electrodes 23a to 23d are close to the Hall element 26 as shown. 28a to 28d are wires made of fine metal wires as electrical connection members, and electrically connect the tips of the electrodes 23a to 23d and the four terminal electrodes (not shown) of the hall element 26.

  Next, the operation of the small magnetic sensor module 20 according to the embodiment of the present invention will be described. In FIG. 3, when the Hall element 26 applies a voltage between two input terminals by the Hall effect and causes a current to flow, the other two outputs are proportional to the strength of the magnetic field acting perpendicularly to the Hall element 26. Hall voltage Vh is generated between the terminals. For example, in the electrodes 23a to 23d of the substrate 21 connected to the four terminal electrodes (not shown) of the Hall element 26, the electrodes 23b and 23d are the Hall element 26 input terminals, and the electrodes 23a and 23c are Assume that this is the output terminal of the Hall element 26.

  Here, when a voltage is applied between the electrodes 23b and 23d of the substrate 21 serving as the input terminal and a current flows, the electrode 23a serving as the output terminal is proportional to the strength of the magnetic field acting perpendicularly to the Hall element 26. And the electrode 23c generate a Hall voltage Vh. As a result, by knowing the value of the Hall voltage Vh, it is possible to detect the strength of the magnetic field and the presence or absence of the magnetic field.

  Next, based on FIG. 4 and FIG. 5, two mounting methods of the small magnetic sensor module which is the embodiment of the present invention will be described. FIG. 4 is a side perspective view in which the small magnetic sensor module 20 according to the embodiment of the present invention is mounted facing the side. In FIG. 4, 30 is a printed board as an external board member, and 31 is a conductive pattern disposed on the surface of the printed board 30.

  The small magnetic sensor module 20 is disposed so that the built-in Hall element 26 is perpendicular to the printed circuit board 30, and the through-hole electrodes 24 a to 24 d that are connection conductive members function as electromechanical connection surfaces, The conductive pattern 31 is electrically and mechanically coupled. The Hall element 26 is sealed and mechanically protected by the sealing member 25 as described above.

  As a result, the magnetic sensing direction of the small magnetic sensor module 20 is the horizontal direction with respect to the printed circuit board 30 as shown by the arrow D, that is, the small size, because the Hall elements 26 are arranged perpendicular to the printed circuit board 30. The magnetic sensing direction of the magnetic sensor module 20 is the side surface direction. Further, the component height of the small magnetic sensor module 20 could be about 0.6 mm from the conductive pattern 31 of the printed circuit board 30 as shown in the figure. This is because surface mounting can be performed on the conductive pattern 31 of the printed circuit board 30 using the through-hole electrodes 24 a to 24 d disposed on the substrate 21.

  As described above, according to the mounting method in the embodiment of the present invention, the small magnetic sensor module 20 can be surface-mounted so that the Hall element 26 is perpendicular to the printed circuit board 30. The magnetic field in the horizontal direction with respect to the printed circuit board 30 can be detected efficiently. Further, without using the lead frame as in the conventional example shown in FIG. 12, the through-hole electrodes 24a to 24d disposed on the substrate 21 can be directly mounted on the printed circuit board 30 as electromechanical connection surfaces. A small-sized magnetic sensor module can be realized.

  FIG. 5 is a side perspective view of the small magnetic sensor module 20 according to the embodiment of the present invention mounted on the top surface. The same elements as those in FIG. 4 are denoted by the same reference numerals, and redundant description is omitted. In FIG. 5, the small magnetic sensor module 20 is arranged such that the Hall element 26 is horizontal with respect to the printed circuit board 30, the electrodes 22 a to 22 d function as an electromechanical connection surface, and the conductive pattern 31 by the solder 32. And electrically and mechanically coupled.

  As a result, the magnetic sensing direction of the small magnetic sensor module 20 is perpendicular to the printed circuit board 30 as shown by an arrow E, that is, small in size, because the Hall element 26 is disposed horizontally with respect to the printed circuit board 30. The magnetic sensing direction of the magnetic sensor module 20 is the upper surface direction. Further, the component height of the small magnetic sensor module 20 could be about 0.65 mm from the printed board 30 as shown in the figure. This is because the electrodes 22 a to 22 d provided on the substrate 21 can be surface-mounted on the conductive pattern 31 of the printed circuit board 30.

  As described above, according to the mounting method in the embodiment of the present invention, the small magnetic sensor module 20 can be surface-mounted so that the Hall element 26 is horizontal with respect to the printed circuit board 30. Thus, a magnetic field perpendicular to the printed circuit board 30 can be efficiently detected. Further, since the electrodes 22a to 22d disposed on the substrate 21 can be directly mounted on the printed circuit board 30 as an electromechanical connection surface, a low profile type small magnetic sensor module can be realized.

  Next, FIG. 6 shows an application example when the small magnetic sensor module according to the embodiment of the present invention is mounted sideways. Reference numeral 40 denotes a rotary shaft that is not shown, but is directly connected to the rotary mechanism, and 41 is a rotary encoder that is directly connected to the rotary shaft 40, and a large number of N poles 42 and S poles 43 are alternately arranged along the circumference. . The small magnetic sensor module 20 is mounted on the side surface of the printed circuit board 45 and is disposed close to the N pole 42 and the S pole 43 on the circumference of the rotary encoder 41.

  Here, magnetic lines of force (not shown) from the N pole 42 to the S pole 43 of the rotary encoder 41 are emitted horizontally to the printed circuit board 45, that is, in the lateral direction with respect to the small magnetic sensor module 20. Since the small magnetic sensor module 20 is mounted sideways, the magnetic sensing direction is the side surface direction. As a result, the small magnetic sensor module 20 can efficiently detect a change in the magnetic field from the rotary encoder 41.

  That is, when the rotary encoder 41 rotates in the direction of the arrow F, a magnetic force line (not shown) from the N pole 42 to the S pole 43 alternately passes through the Hall element 26 of the small magnetic sensor module 20. The Hall voltage Vh is output in a pulse form from the Hall element 26 according to the change. By counting the period of the pulsed Hall voltage Vh, the rotational speed of the rotating shaft 40 can be measured with high accuracy.

  Further, as described above, since the small magnetic sensor module 20 has a low component height even when mounted on the side surface, if the rotary encoder 41 is thin, the entire encoder can be easily thinned. In this application example, the rotary encoder has been described. However, the present invention is not limited to this. For example, the small magnetic sensor module of the present invention is mounted side-by-side for detecting the rotational position in the vicinity of a thin spindle motor. This makes it possible to provide an extremely thin motor system.

  The module structure of the present invention is not limited to a Hall element, and can be widely applied as other types of magnetic sensors and general semiconductor module structures. In the embodiment of the present invention, the number of Hall elements as a magnetic sensor has been described as one. However, the number of Hall elements is not limited to one, and a magnetic sensor module in which a plurality of Hall elements are arranged. Also good.

  As described above, according to the embodiment of the present invention, the small magnetic sensor module does not use a lead frame, and the Hall element is directly mounted on the surface substrate of the substrate, and the electrode disposed on the substrate and the through-hole electrode are provided. Since the structure is such that these electrodes are directly mounted on an external printed circuit board as an electromechanical connection surface, and exposed to the two surfaces of the outer periphery of the substrate. It is possible to select a side-oriented mounting, and as a result, the magnetic sensing direction of the small magnetic sensor module can be arbitrarily selected from either the top surface direction or the side surface direction.

  In addition, it has a structure that does not use a lead frame and is surface-mounted on an external printed circuit board as an electromechanical connection surface using electrodes arranged on the board. A magnetic sensor module can be realized. In addition, since the Hall element, which is a magnetic sensor, is directly mounted on the surface substrate of the insulating substrate with a non-conductive paste, there is a conductive material such as a ferromagnetic material that adversely affects the magnetic detection characteristics in the vicinity of the Hall element. Since it does not exist, excellent magnetic detection characteristics can be realized. Furthermore, since it is a board-based module that is easy to manufacture, it is possible to provide a small-sized magnetic sensor module that is excellent in mass productivity and low in cost.

  Next, the outline of the manufacturing method of the small magnetic sensor module of this invention is demonstrated based on FIGS. In FIG. 7, reference numeral 50 denotes a thin plate-shaped aggregate substrate made of glass epoxy or BT resin. A plurality of through holes 51 as connection conductive members are formed at regular intervals in the longitudinal direction of the collective substrate 50. 52a to 52g are electrodes made of copper foil or the like formed on the surface of the collective substrate 50, and the plurality of through holes 51 are arranged in the vicinity of the approximate center of each of the electrodes 52a to 52g. These electrodes 52a to 52g correspond to the electrodes 23a to 23d of the small magnetic sensor module 20 of the present invention shown in FIG. Although not shown, electrodes corresponding to the electrodes 22a to 22d of the small magnetic sensor module 20 shown in FIG.

  Next, in FIG. 8, Hall elements 53a to 53d are mounted on the collective substrate 50 with a non-conductive paste (not shown). That is, the Hall elements 53a and 53b are mounted in areas where the electrodes 52a to 52d face each other, and are electrically connected to the electrodes 52a to 52d by the wire 54. The hose elements 53c and 53d are mounted in areas where the electrodes 52d to 52g face each other, and are electrically connected to the electrodes 52d to 52g by the wire 54.

  Next, when the mounting of the Hall elements 53a to 53d is completed, dicing is performed. That is, as shown in FIG. 8, the dicing line 55a is a longitudinal line along the approximate center of the plurality of through-holes 51 formed in a row, and dicing is performed along the through-holes 51 using the dicing lines 55a as a reference. Is done. The dicing lines 55b to 55d are lines that are substantially perpendicular to the dicing line 55a and are short along the center of the through hole 51. The dicing lines 55b to 55d are diced in the short direction with reference to the dicing lines 55b to 55d. Processing is performed.

  Next, FIG. 9 shows the collective substrate 50 after dicing, and as shown in the drawing, the substrate 21 on which the Hall elements 53a to 53d are mounted one by one is completed. Here, although not shown on the upper surface of the substrate 21, if the sealing member 25 (see FIGS. 1 and 2) is filled and sealed, the small magnetic sensor module 20 of the present invention is completed. The sealing member 25 may be filled before dicing. The aggregate substrate 50 is sized to form four substrates 21, but is not limited to this form, and a large-sized aggregate substrate may be used to form a larger number of substrates 21. As described above, a large number of substrates can be completed by forming through holes in a collective substrate and dicing along the through holes, thereby providing a small magnetic sensor module that is excellent in mass productivity and stable in quality. I can do it.

It is a back perspective view of the small magnetic sensor module which is an embodiment of the present invention. It is a front perspective view of the small magnetic sensor module which is an embodiment of the present invention. It is a front perspective view of the small magnetic sensor module which is an embodiment of the present invention. 1 is a side perspective view of a small magnetic sensor module according to an embodiment of the present invention mounted sideways. It is a side perspective view which mounted the small magnetic sensor module which is an embodiment of the present invention toward the upper surface. It is a perspective view which shows the application example which mounted the small magnetic sensor module which is embodiment of this invention facing the side. It is a perspective view of the aggregate substrate which forms many small magnetic sensor modules of the present invention. It is a perspective view which shows the mounting process and dicing line of the assembly board which forms many small magnetic sensor modules of this invention. It is a perspective view which shows the dicing process of the collective substrate which forms many small magnetic sensor modules of this invention. It is a plane perspective view of the conventional magnetic sensor module. It is a side perspective view of the conventional magnetic sensor module. It is a plane perspective view of a conventional magnetic sensor module having a magnetic sensing direction in a lateral direction. FIG. 6 is a side perspective view of a magnetic sensor module having a conventional magnetic sensing direction.

Explanation of symbols

1, 10 Magnetic sensor module 2, 26, 53a to 53d Hall element 3a to 3d Lead frame 4a to 4d, 28a to 28d, 54 Wire 5, 25 Sealing member 6, 30, 45 Printed circuit board 7, 31 Conductive pattern 8, 32 Solder 20 Small magnetic sensor module 21 Substrate 22a-22d, 23a-23d, 52a-52g Electrode 24a-24d Through-hole electrode 27 Non-conductive paste 40 Rotary shaft 41 Rotary encoder 42 N-pole 43 S-pole 50 Collective board 51 Through-hole 55a-55d Dicing line

Claims (7)

A substantially rectangular parallelepiped insulating substrate having a plurality of conductive members disposed thereon, a magnetic sensor serving as a magnetoelectric conversion means fixed to the insulating substrate, and the magnetic sensor and the plurality of conductive members being connected by an electrical connection member Connect and
The plurality of conductive members are arranged in a line in the longitudinal direction of the insulating substrate, and the plurality of conductive members are arranged as a pair on both surfaces of the insulating substrate. The plurality of conductive members are electrically connected and integrated by a plurality of connection conductive members, and the plurality of conductive members on one side of the integrated plurality of conductive members are connected by the magnetic sensor and the electrical connection member, The plurality of conductive members on the other side of the plurality of integrated conductive members and the plurality of connection conductive members are exposed on two surfaces of the outer periphery of the insulating substrate and arranged substantially at right angles, A small magnetic sensor module, wherein the magnetic sensor is sealed with a sealing member. The plurality of conductive members and the plurality of connection conductive members on the other side exposed on the two outer peripheral surfaces of the insulating substrate and arranged substantially at right angles are electrically mounted on an external substrate member. By selecting any one of the electromechanical connection surfaces arranged as substantially right angles and functioning as a mechanical connection surface and mounting it on the external substrate member, the upper surface with respect to the external substrate member 2. The small magnetic sensor module according to claim 1, wherein either one of the orientation mounting and the side orientation mounting can be selected. Wherein said plurality of conductive members and said plurality of connection conductive member disposed on the insulating substrate, according to claim 1 or 2, characterized in that it is fixed by surface mounting to the external of the substrate member Small magnetic sensor module. The insulating substrate is a glass epoxy substrate, or a small magnetic sensor module according to any of claims 1 to 3, characterized by comprising the BT resin substrate. The magnetic sensor is small magnetic sensor module according to any of claims 1 to 4, characterized in that it is secured directly by the non-conductive adhesive on the surface matrix of the insulating substrate. The magnetic sensor is small magnetic sensor module according to any of claims 1 to 5, characterized by comprising the Hall element. The insulating substrate is a large number formed on the aggregate substrate of the thin plate, according to any one of claims 1 to 6, characterized in that it is singulated to separate by dicing along the connecting conductive members Small magnetic sensor module.

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