JP4300783B2 - Processing position teaching method of semiconductor laser device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor laser device used as a heat source for, for example, welding of sheet metal.
[0002]
[Prior art]
The welding quality is improved in the welding of sheet metal, and one of them is automatic welding by a robot. By teaching the welding point of the object to the welding robot, the welding position can be stabilized, and variations in welding quality can be reduced.
[0003]
As one of the conventional teaching methods, there is a method in which a teaching portion is observed with a camera, a positional relationship between a laser beam guide spot position and a welding portion is obtained on an image, and position correction data to a robot is divided and taught. (For example, refer to Patent Document 1.)
FIG. 2 shows the conventional laser welding teaching method, wherein 12 is a laser welding torch, 13 is a television camera, 14 spot light source, 15 is a spot point, 16 is a monitor television, 17 is a control device, 18 and 19 are An article to be welded, 20 represents a welding butt.
[0004]
The operation of the laser welding teaching method configured as described above will be described. A spot point 15 from the spot light source 14 is irradiated in the vicinity of the weld butt 20 of the workpieces 18 and 19. The television camera 13 captures images of the welding butt 20 and the spot point 15 and displays them on the monitor television 16. The positional relationship between the welding butt 20 on the monitor television and the spot point 15 is obtained via the control device 17, the coordinate data is taken into the robot holding the laser welding torch 12, and the position of the butt 20 is taught.
[0005]
[Patent Document 1]
Japanese Patent No. 2669147 (page 2-4, Fig. 1)
[0006]
[Problems to be solved by the invention]
However, the conventional teaching method described above is position data based on video information on a monitor television, and is calculated using two-dimensional data. Therefore, there is a problem that distance data between the laser welding torch and the butt portion cannot be calculated.
[0007]
In laser welding, if the focal position of the focused beam is not exactly aligned with the abutting portion, the focused beam diameter is increased, the energy density is lowered, and the welding quality is degraded.
[0008]
An object of the present invention is to provide a configuration of a semiconductor laser device that solves the above problems.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, a semiconductor laser device processing position teaching method of the present invention includes a semiconductor laser means for outputting laser light when energy is supplied from a power supply unit, and a collector for condensing the laser light on a workpiece. A semiconductor laser welding torch having an optical means is held by a robot, and a contact displacement meter can be attached to the tip of the semiconductor laser welding torch as a processing position teaching means whose tip is adjusted to the length of the processing focal length. Using a semiconductor laser device in which a camera whose image focus is set to the tip of the contact-type displacement meter is attached to the semiconductor laser welding torch, and mounting the contact-type displacement meter on the semiconductor laser welding torch and not irradiating laser light Then, the semiconductor laser welding torch is moved to the vicinity of the welded portion of the workpiece by a robot, and the tip of the contact displacement meter is welded by the image of the camera. It is to determine the teaching data of the robot at the minute value to move the robot, by subtracting the displacement amount of contact to contact the. By this method, the actual teaching position can be taught without laser irradiation.
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment)
In FIG. 1, 1 is a semiconductor laser welding torch, 2 is a semiconductor laser module, 3 is a condenser lens, 4 is a contact displacement meter, 5 is a processing focal length, 6 is a control device, 7 is a camera, 8 is a monitor, 9 Reference numerals 10 and 10 denote workpieces to be welded, and 11 a weld butt.
[0012]
The operation of the semiconductor laser device configured as described above will be described.
[0013]
A semiconductor laser module 2, which is a semiconductor laser means for outputting laser light, is built in the semiconductor laser welding torch 1. Further, the semiconductor laser welding torch 1 has a condensing lens 3 that is a means for condensing the laser light emitted from the semiconductor laser module 2 onto a workpiece.
[0014]
The semiconductor laser welding torch 1 has a structure in which a processing position teaching means, for example, a contact-type displacement meter 4 adjusted to the length of the processing focal length 5 can be attached to the distal end portion.
[0015]
When teaching the welding position, the contact-type displacement meter 4 is attached to the tip of the semiconductor laser welding torch 1 so as to have a length equal to the processing focal length 5 in a state of zero displacement. A camera 7 is attached to the semiconductor laser welding torch 1 via a bracket, and the image focus of the camera 7 is adjusted so as to be the tip of the contact displacement meter 4.
[0016]
The semiconductor laser welding torch 1 in this state is held by the robot and brought near the welding butt 11 of the workpieces 9 and 10. When bringing it in the vicinity, the robot is slowly moved while checking the image of the camera 7 on the monitor 8.
[0017]
Then, while watching the image of the camera 7, the robot is moved to a position where the tip of the contact displacement meter 4 slightly contacts the butting portion 11.
[0018]
The amount of displacement contacted at this time is returned to the control device 6. The control device 6 determines the robot teaching data based on the value obtained by subtracting the displacement amount.
[0019]
By this calculation, the teaching position of the robot can always be accurately set to the processing focal length 5 regardless of the displacement amount of the contact displacement meter 4.
[0020]
For example, even if the workpieces 9 and 10 are warped and the welding butt portion 11 changes vertically depending on the position, the teaching position of the robot is always accurate according to the change in the displacement amount of the contact displacement meter 4. It is possible to set the processing focal length to 5.
[0021]
As an effect thereof, since the focal position of the focused beam is always accurately adjusted regardless of the position of the abutting portion, fluctuations in energy density can be suppressed and welding quality can be stabilized.
[0022]
Furthermore, since the machining position teaching means teaches the machining position of the semiconductor laser device without irradiating the laser beam, accurate teaching can be performed without losing the workpiece, and the teaching position can be easily changed, modified, or added. , It eliminates wasteful use of resources and enables teaching in consideration of the environment.
[0023]
【The invention's effect】
As described above, the present invention includes the mounting position teaching means that can be mounted corresponding to the focal length from the light collecting means, so that accurate teaching is possible, and when the laser is actually irradiated, the energy density of the laser beam is reduced. Stable and good welding quality can be obtained.
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration in an embodiment of the present invention. FIG. 2 is a diagram showing a teaching method in conventional laser welding.
DESCRIPTION OF SYMBOLS 1 Semiconductor laser welding torch 2 Semiconductor laser module 3 Condensing lens 4 Contact-type displacement meter 5 Processing focal distance 6 Control apparatus 7 Camera 8 Monitor 9, 10 To-be-welded object 11 Weld butt | matching part

Claims (1)

A semiconductor laser welding torch having a semiconductor laser means for outputting laser light when energy is supplied from a power supply unit and a condensing means for condensing the laser light on a workpiece is held by a robot, and the tip is a processing focal length. As a processing position teaching means adjusted to the length of the contact laser, a contact displacement meter can be attached to the tip of the semiconductor laser welding torch, and a camera with a video focus set to the tip of the contact displacement meter is attached to the semiconductor laser welding torch. Using the attached semiconductor laser device, the semiconductor laser welding torch is moved to the vicinity of the welded portion of the workpiece by a robot with the contact-type displacement meter attached to the semiconductor laser welding torch and without irradiating laser light. , b min value to move the robot, by subtracting the displacement amount of contact so that the tip of the contact type displacement meter by the image of the camera is brought into contact with the weld Processing position teaching method of a semiconductor laser device for determining the Tsu bets teaching data.

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