JP4298350B2 - RECORDING HEAD SUBSTRATE, LIQUID DISCHARGE RECORDING HEAD HAVING THE SAME, RECORDING DEVICE, AND METHOD FOR PRODUCING RECORDING HEAD SUBSTRATE - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a recording head substrate that can reduce the thickness of the protective layer that protects the heat generation resistive layer, a liquid discharge recording head including the recording head, a recording apparatus,And manufacturing method of substrate for recording headAbout.
[0002]
[Prior art]
In general, as disclosed in Patent Document 1, an ink jet recording head that performs a recording operation by ejecting ink droplets onto a recording surface of a recording medium by a film boiling phenomenon caused by heating is widely used. An ink jet recording head includes, for example, a recording head substrate (hereinafter referred to as a substrate) on which a heating resistor layer for heating ink is formed on a substrate, a plurality of ink ejection ports provided on the substrate, and each ink ejection port. The ink channel includes a communicating ink channel, and an ink channel forming member that forms a common ink chamber where one end of the ink channel joins.
[0003]
For example, as shown in FIG. 21, the substrate is separated from the heating resistor layer 6 laminated on the insulating layer 4 formed on the base 2 and the heating resistor layer 6 with the heating portion 6 a interposed therebetween. Electrode layers 8A and 8B that lead the formed and supplied power to the heating resistor layer 6, electrode layers 8A and 8B, a protective layer 10 that covers the heating resistor layer 6, and protective layers 12 and 14 that further cover the protective layer 10 It is comprised including.
[0004]
Therefore, the protective layer 10 and the protective layers 12 and 14 form the bottom of each ink flow path 16 formed by the ink flow path forming member. Each ink channel 16 has, for example, an ink discharge port formed on one end side.
[0005]
The protective layer 10 and the protective layers 12 and 14 are formed so as to have a uniform film thickness over the entire surface in order to prevent ink from directly contacting the heating resistance layer 6 due to defects such as pinholes. It is hoped that
[0006]
However, as shown in FIG. 21, the protective layer 10 and the protective layers 12 and 14 are formed so as to cover the heat generating portion 6a of the heat generating resistive layer 6 formed between the lower surfaces of the electrode layers 8A and 8B. Therefore, the surface layer of the protective layer 12 has a concave portion or a step (step) corresponding to the heat generating portion 6a.
[0007]
Therefore, in order to form the protective layer 12 so that the film thickness of the peripheral portion of the concave portion of the protective layer 12 is uniform in the same manner as other portions in order to avoid the crack of the protective layer 12 due to thermal stress. It is necessary to form the protective layer 12 sufficiently thick.
[0008]
Thus, when the protective layer 12 is formed to be sufficiently thick, from the viewpoint of power saving, thermal responsiveness, and durability of the heating resistance layer, it is not a good idea, so the protective layer is made thinner, A method has been proposed in which no defect occurs in the peripheral edge portion of the concave portion of the protective layer 12.
[0009]
For example, in Patent Document 2, a method of bias sputtering of a protective film, in Patent Document 3, a method of changing the shape of a step in the protective film, in Patent Document 4, a reflow method of a protective film, and an HP journal, A method of changing the cross-sectional shape of the electrode to the cross-sectional shape of the tapered electrode has been proposed.
[0010]
[Patent Document 1]
Japanese Patent Laid-Open No. 52-118798
[0011]
[Patent Document 2]
JP-A-60-234850
[0012]
[Patent Document 3]
JP-A 62-45283
[0013]
[Patent Document 4]
JP-A 62-45286
[0014]
[Problems to be solved by the invention]
In the bias sputtering method for the protective film, it may be difficult to form a stable and uniform film pressure. In the method for changing the shape of the step in the protective film and the reflow method for the protective film, the number of manufacturing steps Disadvantageously increases.
[0015]
Further, in the method of changing the cross-sectional shape of the electrode to the cross-sectional shape of the tapered electrode, depending on the portion of the electrode where the taper-shaped gradient is relatively large, the film thickness of the protective layer is not sufficient, Depending on the portion of the electrode where the taper-shaped gradient is relatively small, the width and cross-sectional area of the wiring connected to the electrode may be small and the wiring resistance may be relatively large.
[0016]
  In view of the above problems, the present invention provides a recording head substrate that can reduce the thickness of the protective layer that protects the heat generation resistive layer, a recording head including the recording head, a recording apparatus,And manufacturing method of substrate for recording headA substrate for a recording head capable of eliminating a recess (step) in the protective layer facing the heat generating resistance layer that causes a defect in the protective layer, a liquid discharge recording head including the same, a recording apparatus,And manufacturing method of substrate for recording headThe purpose is to provide.
[0017]
[Means for Solving the Problems]
  In order to achieve the above object, a recording head substrate according to the present invention comprises:An individual conductor layer that is formed on the substrate and individually supplies a drive signal to the heat generating portion that generates energy for discharging the liquid, and one end is connected to the heat generating resistor layer that is disposed on the individual conductor layer and has the heat generating portion. And a common conductor layer that is disposed so as to be paired with the electrode portion and commonly connected to the plurality of heat generating portions, and the individual conductor layer, the electrode portion, and the common conductor layer include a base body A recording head substrate disposed in an insulating layer formed thereon and having a heating resistor layer formed on a common flat surface of the insulating layer, the electrode portion, and the common conductor layer. In the cross section including the surface perpendicular to the surface of the substrate, the cross-sectional shape of the electrode part is an inverted convex shape whose cross-sectional area changes in two steps from one end on the heating resistor layer side to the other end on the individual conductor layer side. The depth of the recess formed corresponding to the common conductor layer depends on the heating resistance of the electrode section. Deeper than the depth of the hole corresponding to the first stage of the body layer side, in the region under the heating resistor layer, the individual electrode layers is characterized in that it is not formed under the common conductor layer.
[0018]
A liquid discharge recording head according to the present invention includes the above-described recording head substrate, and a liquid flow path that is provided on the recording head substrate and guides the recording liquid to the liquid discharge port corresponding to the heating resistor layer. And a liquid flow path forming member to be formed.
[0019]
Further, a recording apparatus according to the present invention performs the above-described liquid discharge recording head, a moving unit that moves the liquid discharge recording head to face the recording surface of the recording medium, and an operation that moves the moving unit to move the liquid discharge recording head. A control unit that causes the discharge recording head to perform a recording operation is provided.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a recording apparatus including a liquid discharge recording head according to the present invention will be described with reference to the drawings.
[0021]
In the embodiment described below, a printer is taken as an example of a recording apparatus using an ink jet recording method.
[0022]
In this specification, “print” (sometimes referred to as “recording”) is not only for forming significant information such as characters and figures, but also for human beings visually perceived regardless of significance. Regardless of whether or not it has been manifested, it also refers to a case where an image, a pattern, a pattern, or the like is widely formed on a print medium or the medium is processed.
[0023]
Here, “print medium” refers not only to paper used in general printing apparatuses, but also to materials that can accept ink, such as cloth, plastic film, metal plate, glass, ceramics, wood, leather, etc. Shall also say.
[0024]
Further, “ink” (sometimes referred to as “liquid”) is to be interpreted widely as the definition of “print” above, and it is applied to a print medium so that an image, a pattern, a pattern, etc. It shall refer to a liquid that can be subjected to formation or processing of the print medium, or ink processing (eg, solidification or insolubilization of the colorant in the ink applied to the print medium).
[0025]
[Device main unit]
3 and 4 show a schematic configuration of a printer using the ink jet recording method. In FIG. 3, the printer apparatus main body M1000 in this embodiment includes an outer member including a lower case M1001, an upper case M1002, an access cover M1003, and a discharge tray M1004, and a chassis M3019 (see FIG. 4).
[0026]
The chassis M3019 is composed of a plurality of plate-shaped metal members having a predetermined rigidity, forms a skeleton of the recording apparatus, and holds each recording operation mechanism described later.
[0027]
The lower case M1001 forms a substantially lower half part of the exterior of the apparatus main body M1000, and the upper case M1002 forms a substantially upper half part of the exterior of the apparatus main body M1000. A hollow body structure having a storage space for storing the mechanism is formed. An opening is formed in each of the upper surface portion and the front surface portion of the apparatus main body M1000.
[0028]
Further, one end of the discharge tray M1004 is rotatably held by the lower case M1001, and the opening formed on the front surface of the lower case M1001 can be opened and closed by the rotation. For this reason, when executing the recording operation, the discharge tray M1004 is rotated to the front side to open the opening so that the recording sheets can be discharged and the discharged recording sheets P are sequentially stacked. It has come to be able to do. In addition, the discharge tray M1004 contains two auxiliary trays M1004a and M1004b. By pulling out each tray as needed, the sheet support area can be expanded or reduced in three stages. It has become.
[0029]
One end of the access cover M1003 is rotatably held by the upper case M1002, and can open and close an opening formed on the upper surface. By opening the access cover M1003, the access cover M1003 is housed inside the main body. It is possible to replace the print head cartridge H1000 or the ink tank H1900. Although not specifically shown here, when the access cover M1003 is opened and closed, the protrusion formed on the back surface rotates the cover opening and closing lever, and the rotation position of the lever is detected by a micro switch or the like. Thus, the open / closed state of the access cover can be detected.
[0030]
On the upper surface of the rear part of the upper case M1002, a power key E0018 and a resume key E0019 are provided so that they can be pressed, and an LED E0020 is provided. When the power key E0018 is pressed, the LED E0020 lights up and recording is possible. This is to inform the operator. Further, the LED E0020 has various display functions such as blinking method and color change, and informing the operator of printer troubles. Further, the buzzer E0021 (FIG. 7) can be leveled. When the trouble is solved, the recording is resumed by pressing the resume key E0019.
[0031]
[Recording mechanism]
Next, the recording operation mechanism in the present embodiment that is housed and held in the printer apparatus main body M1000 will be described.
[0032]
As a recording operation mechanism in the present embodiment, an automatic feeding unit M3022 that automatically feeds the recording sheet P into the apparatus main body, and a recording sheet P that is sent one by one from the automatic feeding unit are recorded in a predetermined manner. A conveyance unit M3029 for guiding the recording sheet P from the recording position to the discharge unit M3030, a recording unit for performing desired recording on the recording sheet P conveyed to the recording position, and a recovery process for the recording unit And a recovery unit (M5000).
[0033]
(Recording part)
Here, the recording unit will be described. The recording unit includes a carriage M4001 that is movably supported by a carriage shaft M4021, and a recording head cartridge H1000 that is detachably mounted on the carriage M4001.
[0034]
Recording head cartridge
First, a recording head cartridge used in the recording unit will be described with reference to FIGS.
[0035]
As shown in FIG. 5, the recording head cartridge H1000 in this embodiment includes an ink tank H1900 that stores ink, and a recording head H1001 that discharges ink supplied from the ink tank H1900 from nozzles according to recording information. . The recording head H1001 adopts a so-called cartridge system that is detachably mounted on a carriage M4001 described later.
[0036]
The recording head cartridge H1000 shown here is provided with ink tanks H1900 that are independent of each color of black, light cyan, light magenta, cyan, magenta, and yellow, for example, in order to enable high-quality color recording with photographic tone. As shown in FIG. 6, each is detachable from the recording head H1001.
[0037]
As shown in the exploded perspective view of FIG. 7, the recording head H1001 includes a recording element substrate H1100, a first plate H1200, an electric wiring substrate H1300, a second plate H1400, a tank holder H1500, a flow path forming member H1600, It comprises a filter H1700 and a seal rubber H1800.
[0038]
As shown in FIG. 13, the recording element substrate H1100 includes a plurality of recording elements (electrothermal conversion elements) H1103 for ejecting ink on one side of the Si substrate, Al that supplies electric power to each recording element H1103, and the like. Are formed by a film forming technique, a plurality of ink flow paths corresponding to the recording element and a plurality of ejection openings H1100T are formed by a photolithography technique, and ink is supplied to the plurality of ink flow paths. An ink supply port H1102 is formed so as to open on the back surface.
[0039]
The recording element substrate H1100 includes, for example, an Si substrate H1101 having a thin film formed on the surface thereof, and an orifice plate H1112 formed on the substrate H1101.
[0040]
The substrate H1101 has a thickness of 0.5 to 1 (mm), for example, and six rows of ink supply ports H1102 each having a long groove-like through-hole are integrally formed in parallel with each other as six-color ink flow paths. The distance between adjacent ink supply ports H1102 is set to about 2.5 mm, for example. Since the mutual distance is relatively small as described above, the recording head can be reduced in size. On both sides of each ink supply port H1102, a plurality of electrothermal conversion elements H1103 as recording elements are arranged in a zigzag pattern, for example, about 1200 dpi for each ink color. Each electrothermal conversion element H1103 is covered with a protective layer to be described later.
[0041]
A plurality of electrothermal transducers H1103 formed on the substrate 1101 and electrical wiring such as Al for supplying electric power to each electrothermal transducer H1103 (not shown in FIG. 13) are formed by a film forming technique. Yes. Moreover, the electrode part for supplying electric power to the electric wiring is formed along the end part in the direction orthogonal to the arrangement direction of the electrothermal conversion elements H1103. The electrode portion is provided with a plurality of bumps such as gold corresponding to the electrode terminals H1302 of the electric wiring board H1300 described above.
[0042]
The ink supply port H1102 is formed, for example, by performing anisotropic etching using the crystal orientation of the Si substrate 1101.
[0043]
Further, as shown in FIG. 13, the orifice plate H1112 formed on the substrate H1101 has an ink flow path wall H1106 and an ejection port 1100T for forming an ink flow path corresponding to each electrothermal conversion element H1103. Are formed by photolithography. Accordingly, the adjacent ejection ports 1100T are partitioned from each other by the ink flow path wall H1106.
[0044]
Six rows of ejection ports H1100T corresponding to the six colors of ink supplied from the respective ink supply ports H1102 are integrally formed in one orifice plate H1112. Similar to the arrangement of the electrothermal conversion elements H1103, the discharge port H1100T array is formed in a staggered manner, for example, about 1200 dpi for each ink color. That is, the discharge port H1100T is provided to face the electrothermal conversion element H1103.
[0045]
The recording element substrate H1100 described above is a so-called side shooter type, but is not limited to such an example, and may be an edge shooter type recording element substrate, for example, as shown in FIG. .
[0046]
In FIG. 14, the recording element substrate includes a silicon substrate H1101 'and an orifice plate H1112' formed on the substrate H1101 '.
[0047]
On the substrate H1101 ', electrothermal conversion elements H1103 are formed through a protective layer, which will be described later, at predetermined intervals along a direction substantially orthogonal to the conveyance direction of the recording medium.
[0048]
The orifice plate H1112 ′ is formed adjacent to the electrothermal conversion elements H1103 ′ and the electrothermal conversion elements H1103 ′ at both ends where the ink flow path wall H1106 ′ is adjacent to the portion facing the substrate H1101 ′. Yes.
[0049]
By joining the ink flow path wall H1106 'of the orifice plate H1112' on the substrate H1101 ', ink flow paths corresponding to the electrothermal conversion elements H1103' are formed. An ink discharge port H1100T 'that discharges ink is formed at one end of each ink flow path. The other end of each ink flow path communicates with a common ink chamber H1104 'that stores a predetermined amount of ink. An ink supply port H1105 'for introducing ink into the common ink chamber H1104' is formed above the orifice plate H1112 '.
[0050]
The recording element substrate H1100 is bonded and fixed to the first plate H1200, and an ink supply port H1201 for supplying ink to the recording element substrate H1100 is formed therein. Further, a second plate H1400 having an opening is bonded and fixed to the first plate H1200, and the electric wiring substrate H1300 is electrically connected to the recording element substrate H1100 via the second plate H1400. Is held to be connected. The electrical wiring substrate H1300 applies an electrical signal for ejecting ink to the recording element substrate H1100. The electrical wiring substrate H1300 is located at an end portion of the electrical wiring and corresponds to the electrical wiring from the main body. An external signal input terminal H1301 for receiving a signal is provided, and the external signal input terminal H1301 is positioned and fixed on the back side of a tank holder H1500 described later.
[0051]
On the other hand, a flow path forming member H1600 is fixed to the tank holder H1500 that detachably holds the ink tank H1900 by, for example, ultrasonic welding to form an ink flow path H1501 extending from the ink tank H1900 to the first plate H1200. ing. In addition, a filter H1700 is provided at an end of the ink flow path H1501 that engages with the ink tank H1900 on the ink tank side so that entry of dust from the outside can be prevented. Further, a seal rubber H1800 is attached to the engaging portion with the ink tank H1900 so that ink can be prevented from evaporating from the engaging portion.
[0052]
Further, as described above, the tank holder portion composed of the tank holder H1500, the flow path forming member H1600, the filter H1700, and the seal rubber H1800, the recording element substrate H1100, the first plate H1200, the electric wiring substrate H1300, and the second A recording head H1001 is configured by bonding the recording element portion formed of the plate H1400 by bonding or the like.
[0053]
(carriage)
Next, the carriage M4001 on which the recording head cartridge H1000 is mounted will be described with reference to FIG.
[0054]
As shown in FIG. 4, the carriage M4001 is engaged with the carriage M4001 and engaged with the carriage cover M4002 for guiding the recording head H1001 to a predetermined mounting position on the carriage M4001, and the tank holder H1500 of the recording head H1001. And a head set lever M4007 that presses the recording head H1001 to set it at a predetermined mounting position.
That is, the head set lever M4007 is provided on the upper portion of the carriage M4001 so as to be rotatable with respect to the head set lever shaft, and a spring-set head set plate (not shown) is engaged with the recording head H1001. And is configured to be mounted on the carriage M4001 while pressing the recording head H1001 by this spring force.
[0055]
Further, a contact flexible printed cable (see FIG. 9, hereinafter referred to as a contact FPC) E0011 is provided at another engagement portion of the carriage M4001 with the recording head H1001, and the contact portion on the contact FPC E0011 and the recording head H1001 are provided. The provided contact portion (external signal input terminal) H1301 is in electrical contact so that various information for recording can be exchanged and power can be supplied to the recording head H1001.
[0056]
Here, an elastic member such as rubber (not shown) is provided between the contact portion of the contact FPC E0011 and the carriage M4001, and the contact portion and the carriage M4001 are connected by the elastic force of the elastic member and the pressing force by the headset lever spring. It is designed to enable reliable contact. Further, the contact FPC E0011 is connected to a carriage substrate E0013 mounted on the back surface of the carriage M4001 (see FIG. 9).
[0057]
[Scanner]
The printer in this embodiment can also be used as a reading device by mounting a scanner on the carriage M4001 instead of the recording head cartridge H1000 described above.
[0058]
This scanner moves in the main scanning direction together with the carriage M4001 on the printer side, and reads the original image fed instead of the recording medium in the course of movement in the main scanning direction. By alternately performing the reading operation and the document feeding operation in the sub-scanning direction, it is possible to read one document image information.
[0059]
FIGS. 8A and 8B are diagrams showing the scanner M6000 upside down in order to explain the schematic configuration of the scanner M6000.
[0060]
As shown in the figure, the scanner holder M6001 has a substantially box shape, and an optical system and a processing circuit necessary for reading are accommodated therein. Further, when the scanner M6000 is mounted on the carriage M4001, a reading unit lens M6006 is provided at a portion facing the document surface, and reflected light from the document surface is converged on the internal reading unit by the lens M6006. Therefore, the original image is read. On the other hand, the illumination unit lens M6005 has a light source (not shown) inside, and light emitted from the light source is irradiated onto the document through the lens M6005.
[0061]
A scanner cover M6003 fixed to the bottom of the scanner holder M6001 is fitted so as to shield the inside of the scanner holder M6001, and a louver-shaped grip portion provided on the side surface improves the detachable operability to the carriage M4001. Yes. The outer shape of the scanner holder M6001 is substantially the same as that of the recording head H1001, and it can be attached to and detached from the carriage M4001 by the same operation as that of the recording head cartridge H1000.
[0062]
The scanner holder M6001 accommodates a substrate having a reading processing circuit, and a scanner contact PCB connected to the substrate is exposed to the outside. When the scanner M6000 is mounted on the carriage M4001, The scanner contact PCB M6004 contacts the contact FPC E0011 on the carriage M4001 side, and the substrate is electrically connected to the control system on the main body side via the carriage M4001.
[0063]
[Configuration of printer electrical circuit]
Next, an electrical circuit configuration in the embodiment of the present invention will be described.
FIG. 9 is a diagram schematically showing an example of the overall configuration of the electrical circuit in this embodiment.
[0064]
The electrical circuit in this embodiment is mainly configured by a carriage substrate (CRPCB) E0013, a main PCB (Printed Circuit Board) E0014, a power supply unit E0015, and the like.
Here, the power supply unit E0015 is connected to the main PCB E0014 and supplies various driving powers.
[0065]
The carriage substrate E0013 is a printed circuit board unit mounted on the carriage M4001 (FIG. 2). The carriage substrate E0013 functions as an interface for transmitting and receiving signals to and from the recording head through the contact FPC E0011, and an encoder according to the movement of the carriage M4001. Based on the pulse signal output from the sensor E0004, a change in the positional relationship between the encoder scale E0005 and the encoder sensor E0004 is detected, and the output signal is output to the main PCB E0014 through a flexible flat cable (CRFFC) E0012.
[0066]
Further, the main PCBE0014 is a printed circuit board unit that controls driving of each part of the ink jet recording apparatus in this embodiment, and includes a paper edge detection sensor (PE sensor) E0007, an ASF (automatic paper feeder) sensor E0009, a cover sensor E0022, a parallel sensor. The board has I / O ports for an interface (parallel I / F) E0016, a serial interface (serial I / F) E0017, a resume key E0019, an LED E0020, a power key E0018, a buzzer E0021, and the like. Still further, a motor (CR motor) E0001 that serves as a drive source for main-scanning the carriage M1400, a motor (LF motor) E0002 that serves as a drive source for transporting the recording medium, the rotation operation of the recording head, and the recording medium In addition to being connected to a motor (PG motor) E0003 that is also used for paper feeding operation to control these driving, it has a connection interface with ink empty sensor E0006, GAP sensor E0008, PG sensor E0010, CRFFC E0012, and power supply unit E0015. .
[0067]
FIG. 10 is a block diagram showing an internal configuration of the main PCB E0014. In the figure, E1001 is a CPU, and this CPU E1001 has a clock generator (PCG) E1002 connected to an oscillation circuit E1005, and generates a system clock based on its output signal E1019. Further, it is connected to a ROM E1004 and an ASIC (Application Specific Integrated Circuit) E1006 through a control bus E1014, and controls the ASIC E1006, an input signal E1017 from the power key, and an input signal E1016 from the resume key according to a program stored in the ROM. Ink empty detection signal connected to the built-in A / D converter E1003 by detecting the state of the cover detection signal E1042 and the head detection signal (HSENS) E1013 and further driving the buzzer E0021 by the buzzer signal (BUZ) E1018. While detecting the state of the temperature detection signal (TH) E1012 by the (INKS) E1011 and the thermistor, it performs various other logical operations and condition determinations and controls the drive of the ink jet recording apparatus.
[0068]
Here, the head detection signal E1013 is a head mounting detection signal input from the recording head cartridge H1000 via the flexible flat cable E0012, the carriage substrate E0013, and the contact flexible print cable E0011, and the ink empty detection signal E1011 is an ink empty sensor. An analog signal output from E0006 and a temperature detection signal E1012 are analog signals from a thermistor (not shown) provided on the carriage substrate E0013.
[0069]
E1008 is a CR motor driver, which uses a motor power source (VM) E1040 as a drive source, generates a CR motor drive signal E1037 in accordance with a CR motor control signal E1036 from the ASIC E1006, and drives the CR motor E0001. E1009 is an LF / PG motor driver, which uses a motor power source E1040 as a drive source, generates an LF motor drive signal E1035 according to a pulse motor control signal (PM control signal) E1033 from the ASIC E1006, and drives the LF motor thereby At the same time, a PG motor drive signal E1034 is generated to drive the PG motor.
[0070]
E1010 is a power supply control circuit that controls power supply to each sensor having a light emitting element in accordance with a power supply control signal E1024 from the ASIC E1006. The parallel I / F E0016 transmits the parallel I / F signal E1030 from the ASIC E1006 to the parallel I / F cable E1031 connected to the outside, and transmits the signal of the parallel I / F cable E1031 to the ASIC E1006. The serial I / F E0017 transmits the serial I / F signal E1028 from the ASIC E1006 to the serial I / F cable E1029 connected to the outside, and transmits the signal from the cable E1029 to the ASIC E1006.
[0071]
On the other hand, a head power supply (VH) E1039, a motor power supply (VM) E1040, and a logic power supply (VDD) E1041 are supplied from the power supply unit E0015. Also, a head power ON signal (VHON) E1022 and a motor power ON signal (VMOM) E1023 from the ASIC E1006 are input to the power supply unit E0015, and control ON / OFF of the head power E1039 and the motor power E1040, respectively. The logic power supply (VDD) E1041 supplied from the power supply unit E0015 is voltage-converted as necessary, and then supplied to each part inside and outside the main PCB E0014.
[0072]
The head power signal E1039 is smoothed on the main PCB E0014 and then sent to the flexible flat cable E0011 to be used for driving the recording head cartridge H1000.
[0073]
E1007 is a reset circuit that detects a decrease in the logic power supply voltage E1041, supplies a reset signal (RESET) E1015 to the CPU E1001 and the ASIC E1006, and performs initialization.
[0074]
The ASIC E1006 is a one-chip semiconductor integrated circuit and is controlled by the CPU E1001 through the control bus E1014. The above-described CR motor control signal E1036, PM control signal E1033, power supply control signal E1024, head power supply ON signal E1022, and motor power supply The ON signal E1023 and the like are output to exchange signals with the parallel I / F E0016 and the serial I / F E0017, as well as the PE detection signal (PES) E1025 from the PE sensor E0007, and the ASF detection signal from the ASF sensor E0009 ( ASFS) E1026, GAP detection signal (GAPS) E1027 from sensor (GAP) sensor E0008 for detecting the gap between the recording head and the recording medium, PG detection signal (PGS) E10 from PG sensor E0010 Detects the second state, and transmitted to the CPU E1001 through the control bus E1014 data representing the state, CPU E1001 based on the input data performs a flashing LEDE0020 controls the driving of an LED drive signal E1038.
[0075]
Further, the state of the encoder signal (ENC) E1020 is detected to generate a timing signal, and the head control signal E1021 is used to interface with the printhead cartridge H1000 to control the printing operation. Here, the encoder signal (ENC) E1020 is an output signal of the CR encoder sensor E0004 inputted through the flexible flat cable E0012. The head control signal E1021 is supplied to the recording head H1000 via the flexible flat cable E0012, the carriage substrate E0013, and the contact FPC E0011.
[0076]
FIG. 11 is a block diagram illustrating an internal configuration example of the ASIC E1006.
[0077]
In the figure, the connection between each block shows only the flow of data related to the control of the head and each mechanism component, such as recording data and motor control data. Such control signals, clocks, and control signals related to DMA control are omitted in order to avoid complications described in the drawings.
[0078]
In FIG. 9, reference numeral E2002 denotes a PLL controller. As shown in FIG. 9, a clock (CLK) E2031 and a PLL control signal (PLLON) E2033 output from the CPU E1001 are supplied to most of the ASIC E1006. (Not shown).
[0079]
Reference numeral E2001 denotes a CPU interface (CPU I / F). The reset signal E1015, a soft reset signal (PDWN) E2032 output from the CPU E1001, a clock signal (CLK) E2031, and a control signal from the control bus E1014 Controls register read / write for each block as described, supplies clocks to some blocks, accepts interrupt signals (not shown), and outputs an interrupt signal (INT) E2034 to the CPU E1001 Then, the occurrence of an interrupt in the ASIC E1006 is notified.
[0080]
Reference numeral E2005 denotes a DRAM having areas such as a reception buffer E2010, a work buffer E2011, a print buffer E2014, and a development data buffer E2016 as recording data buffers, and a motor control buffer E2023 for motor control. Furthermore, the buffer used in the scanner operation mode has areas such as a scanner take-in buffer E2024, a scanner data buffer E2026, and a send buffer E2028 that are used in place of the recording data buffers.
[0081]
The DRAM E2005 is also used as a work area necessary for the operation of the CPU E1001. That is, E2004 is a DRAM control unit, which switches between access from the CPU E1001 to the DRAM E2005 by the control bus and access from the DMA control unit E2003 to the DRAM E2005, which will be described later, and performs a read / write operation to the DRAM E2005.
[0082]
The DMA control unit E2003 receives a request (not shown) from each block, and in the case of a write operation, an address signal or a control signal (not shown), and write data E2038, E2041, E2044, E2053, E2055, E2057. Etc. are output to the DRAM controller E2004 to access the DRAM. In the case of reading, read data E2040, E2043, E2045, E2051, E2054, E2056, E2058, and E2059 from the DRAM control unit E2004 are transferred to the request source block.
[0083]
E2006 is an IEEE 1284 I / F. Under the control of the CPU E1001 via the CPU I / F E2001, a parallel communication interface with an external host device (not shown) is performed through the parallel I / F E0016, and parallel is also used during recording. Data received from the I / F E0016 (PIF reception data E2036) is transferred to the reception control unit E2008 by DMA processing, and data stored in the transmission buffer E2028 in the DRAM E2005 when reading the scanner (1284 transmission data (RDPIF) E2059) Is transmitted to the parallel I / F by DMA processing.
[0084]
E2007 is a universal serial bus (USB) I / F, and performs a bidirectional communication interface with an external host device (not shown) through the serial I / F E0017 under the control of the CPU E1001 via the CPU I / F E2001. The received data (USB received data E2037) from the serial I / F E0017 is transferred to the reception control unit E2008 by DMA processing at the time of printing, and the data (USB transmitted data (RDUSB) stored in the transmission buffer E2028 in the DRAM E2005 is read by the scanner. E2058) is transmitted to the serial I / F E0017 by DMA processing. The reception control unit E2008 writes the reception data (WDIF) E2038) from the I / F selected from the 1284 I / F E2006 or USB I / F E2007 to the reception buffer write address managed by the reception buffer control unit E2039. Include.
[0085]
E2009 is a compression / decompression DMA controller, which receives received data (raster data) stored in the receiving buffer E2010 under the control of the CPU E1001 via the CPU I / F E2001, and receives the read buffer address managed by the receive buffer control unit E2039. The data (RDWK) E2040 is compressed / expanded in accordance with the designated mode, and written in the work buffer area as a recording code string (WDWK) E2041.
[0086]
E2013 is a recording buffer transfer DMA controller, which reads the recording code (RDWP) E2043 on the work buffer E2011 under the control of the CPU E1007 via the CPU I / F E2001, and sets each recording code in the order of data transfer to the recording head cartridge H1000. The data are rearranged to an appropriate address on the print buffer E2014 and transferred (WDWP E2044). Reference numeral E2012 denotes a work clear DMA controller, which designates work fill data (WDWF) for an area on the work buffer that has been transferred by the recording buffer transfer DMA controller E2013 under the control of the CPU E1001 via the CPU I / F E2001. E2042 is repeatedly written.
[0087]
E2015 is a recording data expansion DMA controller, which is recorded and written on the print buffer by using the data expansion timing signal E2050 from the head controller E2018 as a trigger under the control of the CPU E1001 via the CPU I / F E2001. The code and the development data written on the development data buffer E2016 are read out, and the development record data (RDHDG) E2045 is written into the column buffer E2017 as column buffer write data (WDHDG) E2047. Here, the column buffer E2017 is an SRAM that temporarily stores transfer data (development recording data) to the recording head cartridge H1000, and a handshake signal (not shown) between the recording data expansion DMA controller E2015 and the head control unit E2018. ) Is shared and managed by both blocks.
[0088]
E2018 is a head control unit that controls the CPU E1001 via the CPU I / F E2001 to interface with the printhead cartridge H1000 or the scanner via a head control signal, and also a head drive timing signal from the encoder signal processing unit E2019. Based on E2049, a data expansion timing signal E2050 is output to the recording data expansion DMA controller.
[0089]
At the time of printing, in accordance with the head drive timing signal E2049, the developed recording data (RDHD) E2048 is read from the column buffer, and the data is output to the recording head cartridge H1000 as the head control signal E1021.
[0090]
In the scanner reading mode, the take-in data (WDHD) E2053 input as the head control signal E1021 is DMA-transferred to the scanner take-in buffer E2024 on the DRAM E2005. Reference numeral E2025 denotes a scanner data processing DMA controller. Under the control of the CPU E1001 via the CPU I / F E2001, the acquisition buffer read data (RDAV) E2054 stored in the scanner acquisition buffer E2024 is read and subjected to processing such as averaging. The processed data (WDAV) E2055 is written into the scanner data buffer E2026 on the DRAM E2005.
[0091]
E2027 is a scanner data compression DMA controller. Under the control of the CPU E1001 via the CPU I / F E2001, the processed data (RDYC) E2056 on the scanner data buffer E2026 is read and compressed, and compressed data (WDYC) E2057 is read. Write and transfer to the send buffer E2028.
[0092]
An encoder signal processing unit E2019 receives an encoder signal (ENC) and outputs a head drive timing signal E2049 according to a mode determined by the control of the CPU E1001, and also the position and speed of the carriage M4001 obtained from the encoder signal E1020. Is stored in a register and provided to the CPU E1001. Based on this information, the CPU E1001 determines various parameters in the control of the CR motor E0001. Reference numeral E2020 denotes a CR motor control unit which outputs a CR motor control signal E1036 under the control of the CPU E1001 via the CPU I / F E2001.
[0093]
E2022 is a sensor signal processing unit that receives detection signals E1033, E1025, E1026, and E1027 output from the PG sensor E0010, PE sensor E0007, ASF sensor E0009, and GAP sensor E0008, and is determined by the control of the CPU E1001. In addition to transmitting the sensor information to the CPU E1001 according to the selected mode, it outputs a sensor detection signal E2052 to the DMA controller E2021 for controlling the LF / PG motor.
[0094]
The LF / PG motor control DMA controller E2021 reads out a pulse motor drive table (RDPM) E2051 from the motor control buffer E2023 on the DRAM E2005 and outputs a pulse motor control signal E1033 under the control of the CPU E1001 via the CPU I / F E2001. In addition to outputting, depending on the operation mode, a pulse motor control signal E1033 is output using the sensor detection signal as a control trigger.
[0095]
E2030 is an LED control unit that outputs an LED drive signal E1038 under the control of the CPU E1001 via the CPU I / F E2001. Further, E2029 is a port control unit that outputs a head power ON signal E1022, a motor power ON signal E1023, and a power control signal E1024 under the control of the CPU E1001 via the CPU I / F E2001.
[0096]
[Printer operation]
Next, the operation of the ink jet recording apparatus according to the embodiment of the present invention configured as described above will be described with reference to the flowchart of FIG.
[0097]
When the apparatus main body 1000 is connected to the AC power source, first, in step S1, a first initialization process of the apparatus is performed. In this initialization process, an electrical circuit system check such as a ROM and RAM check of the apparatus is performed to confirm whether or not the apparatus can operate normally.
[0098]
Next, in step S2, it is determined whether or not the power key E0018 provided in the upper case M1002 of the apparatus main body M1000 is turned on. If the power key E0018 is pressed, the process proceeds to the next step S3. Here, a second initialization process is performed.
[0099]
In this second initialization process, various drive mechanisms and recording heads of this apparatus are checked. That is, when initializing various motors and reading head information, it is confirmed whether the apparatus can operate normally.
[0100]
In step S4, an event is waited for. That is, the apparatus monitors a command event from the external I / F, a panel key event by a user operation, an internal control event, and the like, and executes processing corresponding to the event when these events occur.
[0101]
For example, if a print command event is received from the external I / F in step S4, the process proceeds to step S5. If a power key event is generated by a user operation in the same step, the process proceeds to step S10. If another event occurs in the same step, the process proceeds to step S11.
[0102]
Here, in step S5, the print command from the external I / F is analyzed, the designated paper type, paper size, print quality, paper feed method, etc. are judged, and data representing the judgment result is stored in the apparatus. Store in RAM E2005 and proceed to step S6.
[0103]
Next, in step S6, paper feeding is started by the paper feeding method specified in step S5, the paper is sent to the recording start position, and the process proceeds to step S7.
[0104]
In step S7, a recording operation is performed. In this recording operation, the recording data sent from the external I / F is temporarily stored in the recording buffer, and then the CR motor E0001 is driven to start the movement of the carriage M4001 in the main scanning direction, and the print buffer E2014. Is supplied to the recording head H1001 to record one line, and when the recording operation for one line of recording data is completed, the LF motor E0002 is driven and the LF roller M3001 is rotated to make a sheet. Are sent in the sub-scanning direction. Thereafter, the above operation is repeatedly executed, and when the recording of one page of recording data from the external I / F is completed, the process proceeds to step 8.
[0105]
In step S8, the LF motor E0002 is driven, the paper discharge roller M2003 is driven, and paper feeding is repeated until it is determined that the paper has been completely sent out from the apparatus. When the paper is finished, the paper is placed on the paper discharge tray M1004a. The paper is completely discharged.
[0106]
Next, in step S9, it is determined whether or not the recording operation for all the pages to be recorded has been completed. If pages to be recorded remain, the process returns to step S5. The above operations are repeated, and when the recording operation for all the pages to be recorded is completed, the recording operation ends, and then the process proceeds to step S4 to wait for the next event.
[0107]
On the other hand, in step S10, printer termination processing is performed to stop the operation of the apparatus. In other words, in order to turn off the power of various motors and heads, after shifting to a state where the power can be turned off, the power is turned off and the process proceeds to step S4 to wait for the next event.
[0108]
In step S11, event processing other than the above is performed. For example, processing corresponding to a recovery command from various panel keys of this apparatus, an external I / F, or a recovery event that occurs internally is performed. After the process is completed, the process proceeds to step S4 and waits for the next event.
[0109]
In addition, one form in which the present invention is effectively used is a form in which bubbles are formed by causing film boiling in a liquid using thermal energy generated by an electrothermal transducer.
[0110]
Furthermore, in the first embodiment of the recording head substrate according to the present invention, the above-described substrate H1101 is configured as shown in FIGS.
[0111]
In the example shown in FIGS. 1A and 1B and other examples described later, a part corresponding to one ink channel among the plurality of ink channels formed on the substrate H1101. The structure of is enlarged and shown.
[0112]
In FIGS. 1A and 1B, a substrate H1101 includes, for example, a base H1120 made of silicon in a thin plate shape, and an oxide film (heat storage layer) formed of, for example, silicon dioxide on one flat surface of the base H1120. ) H1122, the common conductor layer H1124A and the individual conductor layer H1124B formed on the same surface of the oxide film H1122, the common conductor layer H1124A, the individual conductor layer H1124B, and the insulating layer H1126 stacked on the oxide film H1122. A heating resistance layer H1134 formed above the common conductor layer H1124A and the individual conductor layer H1124B and electrically connected to the common conductor layer H1124A and the individual conductor layer H1124B via the pair of electrode portions H1132A and 1132B; , Protective layer H covering heating resistance layer H1134 and insulating layer H1126 128, and is configured to include a protective layer H1130.
[0113]
The common conductor layer H1124A and the individual conductor layers H1124B are formed to have a predetermined thickness using, for example, aluminum, an alloy material of aluminum and copper, or an alloy material of aluminum and silicon. The common conductor layer H1124A is coupled with the common conductor layers corresponding to the other ink flow paths. Further, one end of each of the common conductor layer H1124A and the individual conductor layer H1124B is connected to a drive signal input unit (not shown).
[0114]
The insulating layer H1126 is made of, for example, silicon phosphate 1 × 10^-6It is uniformly formed with the film pressure of (m). Through holes H1126a and H1126b are respectively formed corresponding to the other ends of the common conductor layer H1124A and the individual conductor layers H1124B in the insulating layer H1126. In the through holes H1126a and H1126b, for example, embedded electrodes H1132A and H1132B made of a copper alloy material are provided via a seed layer SS, respectively. The embedded electrode H1132A connects the common conductor layer H1124A and a heating resistance layer H1134 described later, and the embedded electrode H1132B connects the common conductor layer H1124B and a heating resistance layer H1134 described later. The embedded electrodes H1132A and H1132B may be made of aluminum or an alloy material of aluminum and silicon. For example, the seed layer SS may be formed of any material of tantalum, tantalum nitride, and silicon tantalum nitride. By the seed layer SS, the adhesion of the buried electrodes H1132A and H1132B is improved and the oxidation resistance is improved.
[0115]
The insulating layer H1126 has a smooth flat surface FS on the upper surface that is the same plane as one end face of the embedded electrodes H1132A and H1132B. On the flat surface FS, a heating resistance layer H1134 is formed on the insulating layer H1126 across the embedded electrodes H1132A and H1132B. The heating resistance layer H1134 may be formed of any material of tantalum nitride, silicon tantalum nitride, and hafnium boride, for example. The heating resistance layer H1134 is, for example, 1 to 3 × 10.^-8It has a relatively thin film thickness of about (m).
[0116]
The heating resistance layer H1134 and the protective layer H1128 that directly covers the insulating layer H1126 over the whole are formed to have a predetermined film thickness from silicon oxide or silicon nitride. In addition, the protective layer H1130 that covers a portion of the protective layer H1128 that faces the heating resistance layer H1134 is a so-called cavitation-resistant layer, and is formed of tantalum along the protective layer H1128 with a predetermined film thickness.
[0117]
Accordingly, the outer surface portion of the protective layer H1130 is not formed with a recess or a step that causes a defect of the protective layer, so that the durability is improved.
[0118]
In manufacturing such a substrate H1101, first, as shown in FIG. 2A, after an oxide film H1122 is formed on the flat surface of the substrate H1120 by thermal oxidation, predetermined patterning and etching are performed. By the processing, the common conductor layer H1124A and the individual conductor layer H1124B are formed.
[0119]
Next, as shown in FIG. 2B, an insulating layer H1126 'is formed by CVD, for example, so as to cover the oxide film H1122, the common conductor layer H1124A, and the individual conductor layer H1124B.
[0120]
Subsequently, through holes H1126ta 'and H1126tb' reaching the common conductor layer H1124A and the individual conductor layer H1124B are formed by performing a predetermined patterning and etching process on the insulating layer H1126 '.
[0121]
At this time, the through holes H1126ta 'and H1126tb' have their inner surfaces formed with a gradient so that a coating layer can be satisfactorily formed in preparation for sputtering described later. The seed layer SS is formed on the inner surface where the through holes H1126ta 'and H1126tb' are formed by sputtering.
[0122]
Subsequently, in order to form a buried electrode, the conductor layer H1132 is formed by, for example, electrolytic plating so as to fill the outer surface of the insulating layer H1126 'and the inside of the through holes H1126ta' and H1126tb '. At this time, the film thickness of the conductor layer H1132 is set to be equal to or greater than the depth of the through holes H1126ta 'and H1126tb'.
[0123]
Subsequently, as shown in FIG. 2C, the conductor layer H1132 on the insulating layer H1126 'is removed, and a predetermined amount is polished so that the insulating layer H1126' becomes a flat surface. The polishing is, for example, an abrasive containing an etching solution, and mechanical polishing is performed using the polishing apparatus G. Thereby, the buried electrodes H1132A and H1132B exposed on the flat surface FS are formed.
[0124]
Subsequently, after the heat generating resistive layer is formed over the entire flat surface FS, the heat generating resistive layer is subjected to predetermined patterning and etching by a dry etching method. The etching processing time is set to a predetermined time which is a relatively short period of time compared to the prior art and is minimized. As a result, the heating resistance layer H1134 is formed on the insulating layer H1126 so as to straddle the embedded electrodes H1132A and H1132B.
[0125]
Subsequently, after the protective layer H1128 is formed so as to cover the entire heating resistance layer H1134 and the insulating layer H1126, a protective layer as an anti-cavitation layer is formed so as to cover the protective layer H1128.
[0126]
Then, a predetermined patterning and etching process is performed on the protective layer covering the protective layer H1128, whereby the protective layer H1130 is formed. Note that the protective layer H1128 in a portion to be an electrode pad forming a part of the drive signal input portion described above is removed.
[0127]
FIGS. 15A and 15B show a second embodiment of the recording head substrate according to the present invention. In the present embodiment and other embodiments described later, the same components in the example shown in FIG. 1 are denoted by the same reference numerals, and redundant description thereof is omitted.
[0128]
15A and 15B, a substrate H1101 has a base H1120 made in a thin plate shape, an oxide film H1122 formed on one flat surface of the base H1120, and the same surface of the oxide film H1122. The common conductor layer H1124A and the individual conductor layer H1124B to be formed, the common conductor layer H1124A, the individual conductor layer H1124B, and the insulating layer H1136 laminated on the oxide film H1122, the common conductor layer H1124A, and the individual conductor layer H1124B A heating resistor layer H1134 formed above and electrically connected to the common conductor layer H1124A and the individual conductor layer H1124B via the pair of electrode portions H1138A and 1138B, an insulating layer H1140 covering the insulating layer H1136, and heat generation Protective layer H1 covering resistance layer H1134 and insulating layer H1140 28, and is configured to include a protective layer H1130.
[0129]
The insulating layer H1136 is uniformly formed with a predetermined relatively thin film thickness of, for example, silicon phosphate, similarly to the insulating layer H1126 described above. Through holes H1136a and H1136b are formed corresponding to the other ends of the common conductor layer H1124A and the individual conductor layers H1124B in the insulating layer H1136, respectively. In the through holes H1136a and H1136b, for example, embedded electrodes H1138A and H1138B made of a copper alloy material are provided via the seed layer SS. The embedded electrode H1138A connects the common conductor layer H1124A and a heating resistance layer H1134 described later, and the embedded electrode H1138B connects the common conductor layer H1124B and a heating resistance layer H1134 described later. The embedded electrodes H1138A and H1138B may be made of aluminum or an alloy material of aluminum and silicon.
[0130]
The insulating layer H1140 has a smooth flat surface FS on the upper surface that is the same plane as one end face of the embedded electrodes H1138A and H1138B. On the flat surface FS, a heating resistance layer H1134 is formed across the embedded electrodes H1138A and H1138B.
[0131]
Therefore, also in this example, the outer surface portion of the protective layer H1130 is not formed with a recess or a step that causes a defect of the protective layer, so that the durability is improved.
[0132]
In manufacturing such a substrate H1101, first, as shown in FIG. 16A, after an oxide film H1122 is formed on the flat surface of the base H1120 by thermal oxidation, predetermined patterning and etching are performed. By the processing, the common conductor layer H1124A and the individual conductor layer H1124B are formed.
[0133]
Next, as shown in FIG. 16B, the insulating layer H1136 is formed by, for example, a CVD method so as to cover the oxide film H1122, the common conductor layer H1124A, and the individual conductor layer H1124B.
[0134]
Subsequently, by performing predetermined patterning and etching processes on the insulating layer H1136, through holes H1136a and H1136b reaching the common conductor layer H1124A and the individual conductor layer H1124B are formed, respectively.
[0135]
Subsequently, as shown by a two-dot chain line in FIG. 16B, an insulating layer H1140 'is formed so as to cover the entire insulating layer H1136 by, for example, a CVD method.
[0136]
Subsequently, by performing a predetermined patterning and etching process on the insulating layer H1136, through holes H1140a ′ and H1140b ′ reaching the common conductor layer H1124A and the individual conductor layer H1124B through the through holes H1136a and H1136b, respectively. It is formed.
[0137]
At this time, the above-described seed layer SS is formed on the inner surface for forming the through holes H1136a and H1136b and the through holes H1140a 'and H1140b' by sputtering.
[0138]
Subsequently, as shown by a two-dot chain line in FIG. 16C, in order to form a buried electrode, the conductor layer H1138 is formed on the outer surface of the insulating layer H1140 ′ and through through, for example, by electrolytic plating. Holes H1140a ′ and H1140b ′ and through holes H1136a and H1136b are formed so as to be filled. At this time, the film thickness of the conductor layer H1138 is set to be equal to or greater than the sum of the depths of the through holes H1140a 'and H1140b' and the depths of the through holes H1136a and H1136b.
[0139]
Subsequently, as shown in FIG. 16C, the conductor layer H1132 on the insulating layer H1140 ′ is removed, and a predetermined amount is polished so that the upper surface of the insulating layer H1140 ′ becomes a flat surface. . The polishing is, for example, an abrasive containing an etching solution, and mechanical polishing is performed using the polishing apparatus G. Thereby, embedded electrodes H1138A and H1138B exposed on the flat surface FS are formed.
[0140]
Subsequently, after the heat generating resistive layer is formed over the entire flat surface FS, the heat generating resistive layer is subjected to predetermined patterning and etching by a dry etching method. The etching processing time is set to a predetermined time which is a relatively short period of time compared to the prior art and is minimized. As a result, the heating resistance layer H1134 is formed on the insulating layer H1140 so as to straddle the embedded electrodes H1138A and H1138B.
[0141]
Subsequently, after the protective layer H1128 is formed so as to cover the entire heating resistance layer H1134 and the insulating layer H1140, a protective layer as an anti-cavitation layer is formed so as to cover the protective layer H1128.
[0142]
Then, a predetermined patterning and etching process is performed on the protective layer covering the protective layer H1128, whereby the protective layer H1130 is formed. Note that the protective layer H1128 in a portion to be an electrode pad forming a part of the drive signal input portion described above is removed.
[0143]
17A and 17B show a third embodiment of a recording head substrate according to the present invention.
[0144]
17A and 17B, a substrate H1101 is formed on a base H1120 formed in a thin plate shape, an oxide film H1122 formed on one flat surface of the base H1120, and an upper surface of the oxide film H1122. The individual conductor layer H1150, the individual conductor layer H1150, the insulating layer H1152 stacked on the oxide film H1122, and the individual conductor layer H1150 are formed directly above the individual conductor layer H1150 and electrically connected via the electrode portion H1158. The heating resistor layer H1134 connected to the H1150, the insulating layer H1154 that covers the insulating layer H1152, the protective layer H1128 that covers the heating resistor layer H1134 and the insulating layer H1154, and the protective layer H1130 are included.
[0145]
The insulating layer H1152 is uniformly formed with a predetermined relatively thin film thickness of, for example, silicon phosphate, similarly to the insulating layer H1126 described above. Through holes H1152a are formed corresponding to the other ends of the individual conductor layers H1150 in the insulating layer H1152. In the through hole H1152a, for example, a buried electrode H1158 made of a copper alloy material is provided via a seed layer SS. The embedded electrode H1158 connects the individual conductor layer H1150 and one end of the lower surface of the heating resistance layer H1134. The other end of the lower surface of the heating resistor layer H1134 is also electrically connected to a buried electrode H1156 as a common electrode layer. The embedded electrode H1156 is provided in a recess H1154a provided to face the embedded electrode H1158 in the insulating layer H1154 via a seed layer SS. Note that the embedded electrode H1158 and the embedded electrode H1156 may be made of aluminum or an alloy material of aluminum and silicon.
[0146]
The insulating layer H1154 has a smooth flat surface FS on the upper surface that is the same plane as one end face of the embedded electrodes H1156 and H1158. On the flat surface FS, a heating resistance layer H1134 is formed across the embedded electrodes H1156 and H1158.
[0147]
Therefore, also in this example, the outer surface portion of the protective layer H1130 is not formed with a recess or a step that causes a defect of the protective layer, so that the durability is improved.
[0148]
In manufacturing such a substrate H1101, first, as shown in FIG. 18A, after an oxide film H1122 is formed on the flat surface of the base H1120 by thermal oxidation, predetermined patterning and etching are performed. The individual conductor layer H1150 is formed by the processing.
[0149]
Next, as shown in FIG. 18B, an insulating layer H1152 is formed by CVD, for example, so as to cover the oxide film H1122 and the individual conductor layer H1150.
[0150]
Subsequently, through holes H1152a reaching the individual conductor layers H1150 are formed by performing predetermined patterning and etching processes on the insulating layer H1152.
[0151]
Subsequently, as indicated by a two-dot chain line in FIG. 18B, an insulating layer H1154 'is formed by CVD, for example, so as to cover the entire insulating layer H1152.
[0152]
Subsequently, a predetermined patterning and etching process is performed on the insulating layer H1154 ′, so that a through hole is obtained.H1152aThrough holes H1154b ′ and recesses H1154a ′ reaching the common conductor layer H1150 are formed. The maximum depth of the recess H1154a ′ is set to be larger than the depth of the through hole H1154b ′.
[0153]
At that time, the above-described seed layer SS is formed on the inner surface for forming the through hole H1152a, the recess H1154a 'and the through hole H1154b' by sputtering.
[0154]
Subsequently, as shown by a two-dot chain line in FIG. 18C, the conductor layer H1157 covers the outer surface of the insulating layer H1154 ′ by, for example, electrolytic plating to form a buried electrode, The holes H1152a and H1154b ′ and the recess H1154a ′ are formed so as to be filled. At that time, the film thickness of the conductor layer H1157 is set to be equal to or greater than the sum of the depth of the through hole H1154b 'and the depth of the through hole H1152a.
[0155]
Subsequently, as shown in FIG. 18C, the conductor layer H1157 on the insulating layer H1154 ′ is removed, and a predetermined amount is polished so that the upper surface of the insulating layer H1154 ′ becomes a flat surface. . The polishing is, for example, an abrasive containing an etching solution, and mechanical polishing is performed using the polishing apparatus G. Thereby, buried electrodes H1156 and H1158 exposed on the flat surface FS are formed.
[0156]
Subsequently, after the heat generating resistive layer is formed over the entire flat surface FS, the heat generating resistive layer is subjected to predetermined patterning and etching by a dry etching method. The etching processing time is set to a predetermined time which is a relatively short period of time compared to the prior art and is minimized. As a result, the heating resistance layer H1134 is formed on the insulating layer H1154 so as to straddle the embedded electrodes H1156 and H1158.
[0157]
Subsequently, after the protective layer H1128 is formed so as to cover the entire heating resistance layer H1134 and the insulating layer H1154, a protective layer as an anti-cavitation layer is formed so as to cover the protective layer H1128.
[0158]
Then, a predetermined patterning and etching process is performed on the protective layer covering the protective layer H1128, whereby the protective layer H1130 is formed. Note that the protective layer H1128 in a portion to be an electrode pad forming a part of the drive signal input portion described above is removed.
[0159]
FIGS. 19A and 19B show a fourth embodiment of a recording head substrate according to the present invention.
[0160]
19A and 19B, a substrate H1101 is formed on a base plate H1120 made in a thin plate shape, an oxide film H1122 formed on one flat surface of the base plate H1120, and an upper surface of the oxide film H1122. The individual conductor layer H1174, the individual conductor layer H1174, the insulating layer H1170 laminated on the oxide film H1122, and the individual conductor layer H1174 are formed directly above the individual conductor layer H1174 and electrically connected via the electrode portion H1176. The heat generation resistance layer H1172 connected to H1174, the heat generation resistance layer H1134, the protective layer H1128 covering the insulating layer H1170, and the protection layer H1130 are configured.
[0161]
The insulating layer H1170 is uniformly formed with a predetermined thickness of about several μm, for example, with silicon phosphate, like the insulating layer H1126 described above. A through hole H1170A is formed corresponding to one end of the individual conductor layer H1174 in the insulating layer H1170. The through hole H1170A includes a small opening H1170b that opens to the individual conductor layer H1174, and a large opening 1170a that communicates with the small opening H1170b and opens to the heating resistor layer H1172.
In addition, a recess H1170B is formed in a portion facing the through hole H1170A in the insulating layer H1170. In the through hole H1170A, for example, a buried electrode H1176 made of a copper alloy material is provided via a seed layer SS. The embedded electrode H1176 connects the individual conductor layer H1174 and one end of the lower surface of the heating resistance layer H1172. The other end of the lower surface of the heating resistance layer H1172 is also electrically connected to a buried electrode H1178 as a common electrode layer provided in the recess H1170B via the seed layer SS.
[0162]
Note that the embedded electrode H1176 and the embedded electrode H1178 may be made of aluminum or an alloy material of aluminum and silicon.
[0163]
The insulating layer H1170 has a smooth flat surface FS on the upper surface that is the same plane as one end face of the embedded electrodes H1176 and H1178. On the flat surface FS, a heating resistance layer H1172 is formed across the embedded electrodes H1176 and H1178.
[0164]
Therefore, also in this example, the outer surface portion of the protective layer H1130 is not formed with a recess or a step that causes a defect of the protective layer, so that the durability is improved.
[0165]
In manufacturing such a substrate H1101, first, as shown in FIG. 20A, after an oxide film H1122 is formed on the flat surface of the substrate H1120 by thermal oxidation, predetermined patterning and etching are performed. By the processing, the individual conductor layer H1174 is formed of the same material as in the above example.
[0166]
Next, as shown in FIG. 20B, an insulating layer H1170 'is formed by CVD, for example, so as to cover the oxide film H1122 and the individual conductor layer H1174.
[0167]
Subsequently, the insulating layer H1170 ′ is subjected to predetermined patterning and a first etching process, whereby a recess H1170A ′ corresponding to the large opening H1170a in the through hole H1170A and a recess H1170B corresponding to the recess H1170B. 'Is formed. The maximum depth of the recess H1170B ′ is the recessH1170AIt is set larger than the depth of '.
[0168]
Subsequently, while the masking process is performed on the recess H1170B ', predetermined patterning and a second etching process are performed to form a portion H1170b' corresponding to the small opening H1170b. As a result, a portion corresponding to the through hole reaching the individual conductor layer H1174 is formed.
[0169]
At that time, the seed layer SS is formed on the inner surface of the through hole H1170A 'and the recess H1170B' by sputtering.
[0170]
Subsequently, as shown by a two-dot chain line in FIG. 20C, a conductor layer H1177 covers the outer surface of the insulating layer H1170 ′ by, for example, electrolytic plating to form a buried electrode. The hole H1170A ′ and the recess H1170B ′ are formed so as to be filled. At this time, the film thickness of the conductor layer H1157 is set to be equal to or greater than the depth of the through hole H1170A '.
[0171]
Subsequently, as shown in FIG. 20C, the conductor layer H1177 on the insulating layer H1170 ′ is removed, and a predetermined amount is polished so that the upper surface of the insulating layer H1170 ′ becomes a flat surface. . The polishing is, for example, an abrasive containing an etching solution, and mechanical polishing is performed using the polishing apparatus G. Thereby, buried electrodes H1176 and H1178 exposed on the flat surface FS are formed.
[0172]
Subsequently, after the heating resistance layer is formed over the entire flat surface FS by the sputtering method, the heating resistance layer is subjected to a predetermined patterning and an etching process by a dry etching method. As a result, the heating resistance layer H1172 is formed on the insulating layer H1170 so as to straddle the embedded electrodes H1176 and H1178.
[0173]
Subsequently, after the protective layer H1128 is formed so as to cover the entire heating resistance layer H1172 and the insulating layer H1170, a protective layer as an anti-cavitation layer is formed so as to cover the protective layer H1128.
[0174]
Then, a predetermined patterning and etching process is performed on the protective layer covering the protective layer H1128, whereby the protective layer H1130 is formed. Note that the protective layer H1128 in a portion to be an electrode pad forming a part of the drive signal input portion described above is removed.
[0175]
Accordingly, in this example, as shown in FIG. 20B, the insulating layer H1152 required in the third embodiment is obtained by performing the etching process twice on the insulating layer H1170 ′. As a result, the productivity is improved and the manufacturing cost is reduced.
[0176]
【The invention's effect】
As is apparent from the above description, according to the recording head substrate, the liquid discharge recording head and the recording apparatus including the recording head substrate, the heating resistor layer is formed on the common flat surface of the insulating layer and the electrode portion. It is formed facing the conductor layer and electrically connected to the electrode part, and the protective layer is laminated on the heating resistor layer and the insulating layer so as to cover the heating resistor layer and the insulating layer. Thus, the concave portion (step) of the protective layer facing the heat generating resistance layer can be eliminated.
[Brief description of the drawings]
FIG. 1A is a plan view partially showing a main part of a first embodiment of a recording head substrate according to the present invention, and FIG. 1B is a part in the example shown in FIG. It is sectional drawing.
2 (a), (b), and (c) are partial cross-sectional views used for explaining a manufacturing process in the example shown in FIG.
FIG. 3 is a perspective view showing an external configuration of an ink jet printer according to an embodiment of the present invention.
4 is a perspective view showing a state where an exterior member of the printer shown in FIG. 3 is removed. FIG.
FIG. 5 is a perspective view showing a state in which a recording head cartridge used in a printer according to an embodiment of the invention is assembled.
6 is an exploded perspective view showing the recording head cartridge shown in FIG. 5. FIG.
7 is an exploded perspective view of the recording head shown in FIG. 6 as viewed obliquely from below.
FIGS. 8A and 8B are diagrams showing a scanner cartridge that can be mounted on a printer according to an embodiment of the present invention in place of the recording head cartridge shown in FIG. 5, respectively. It is a perspective view shown upside down.
FIG. 9 is a block diagram schematically showing an overall configuration of an electrical circuit in a printer according to an embodiment of the present invention.
10 is a block diagram illustrating an internal configuration example of a main PCB in the electric circuit illustrated in FIG. 9;
11 is a block diagram showing an internal configuration example of an ASIC in the main PCB shown in FIG.
FIG. 12 is a flowchart illustrating an operation example of a printer according to an embodiment of the present invention.
FIG. 13 is a perspective view showing a partial cross section of a main part of an example of a liquid discharge recording head according to the present invention.
FIG. 14 is a perspective view showing a partial cross section of a main part of another example of the liquid discharge recording head according to the invention.
FIG. 15A is a plan view partially showing a main part of a second embodiment of the recording head substrate according to the present invention, and FIG. 15B is a part in the example shown in FIG. 15A; It is sectional drawing.
16 (a), (b), and (c) are partial cross-sectional views used for explaining a manufacturing process in the example shown in FIG.
FIG. 17A is a plan view partially showing a main part of a third embodiment of the recording head substrate according to the present invention, and FIG. 17B is a part in the example shown in FIG. It is sectional drawing.
18 (a), (b), and (c) are partial cross-sectional views used for explaining a manufacturing process in the example shown in FIG.
FIG. 19 (a) is a plan view partially showing an essential part of a fourth embodiment of a recording head substrate according to the present invention, and FIG. 19 (b) is a part in the example shown in FIG. It is sectional drawing.
20 (a), (b), (c), and (d) are partial cross-sectional views for explaining the manufacturing process in the example shown in FIG.
FIG. 21 is a partial cross-sectional view showing a configuration of a conventional recording head substrate.
[Explanation of symbols]
M1000 main unit
M1001 Lower case
M1002 Upper case
M1003 Access cover
M1004 discharge tray
M2015 Paper gap adjustment lever
M2003 Paper discharge roller
M3001 LF roller
M3019 chassis
M3022 Automatic feeding section
M3029 transport section
M3030 discharge section
M4000 recording unit
M4001 Carriage
M4002 Carriage cover
M4007 Headset lever
M4021 Carriage shaft
M5000 recovery unit
M6000 scanner
M6001 Scanner holder
M6003 Scanner cover
M6004 Scanner contact PCB
M6005 Scanner illumination lens
M6006 Scanner reading lens 1
M6100 storage box
M6101 storage box base
M6102 Storage box cover
M6103 Storage box cap
M6104 Storage box spring
E0001 Carriage motor
E0002 LF motor
E0003 PG motor
E0004 Encoder sensor
E0005 Encoder Scale
E0006 Ink end sensor
E0007 PE sensor
E0008 GAP sensor (Paper gap sensor)
E0009 ASF sensor
E0010 PG sensor
E0011 Contact FPC (Flexible Print Cable)
E0012 CRFFC (flexible flat cable)
E0013 Carriage board
E0014 main board
E0015 Power supply unit
E0016 Parallel I / F
E0017 Serial I / F
E0018 Power key
E0019 Resume key
E0020 LED
E0021 Buzzer
E0022 Cover sensor
E1001 CPU
E1002 OSC (CPU built-in oscillator)
E1003 A / D (A / D converter with built-in CPU)
E1004 ROM
E1005 Oscillator circuit
E1006 ASIC
E1007 Reset circuit
E1008 CR motor driver
E1009 LF / PG motor driver
E1010 Power supply control circuit
E1011 INKS (ink end detection signal)
E1012 TH (Thermistor temperature detection signal)
E1013 HSENS (Head detection signal)
E1014 Control bus
E1015 RESET (Reset signal)
E1016 RESUME (resume key input)
E1017 POWER (Power key input)
E1018 BUZ (Buzzer signal)
E1019 Oscillator circuit output signal
E1020 ENC (encoder signal)
E1021 Head control signal
E1022 VHON (Head power ON signal)
E1023 VMON (motor power ON signal)
E1024 Power control signal
E1025 PES (PE detection signal)
E1026 ASFS (ASF detection signal)
E1027 GAPS (GAP detection signal)
E0028 Serial I / F signal
E1029 Serial I / F cable
E1030 Parallel I / F signal
E1031 Parallel I / F cable
E1032 PGS (PG detection signal)
E1033 PM control signal (pulse motor control signal)
E1034 PG motor drive signal
E1035 LF motor drive signal
E1036 CR motor control signal
E1037 CR motor drive signal
E0038 LED drive signal
E1039 VH (head power supply)
E1040 VM (motor power supply)
E1041 VDD (logic power supply)
E1042 COVS (Cover detection signal)
E2001 CPU I / F
E2002 PLL
E2003 DMA controller
E2004 DRAM controller
E2005 DRAM
E2006 1284 I / F
E2007 USB I / F
E2008 Reception control unit
E2009 Compression / decompression DMA
E2010 Receive buffer
E2011 Work buffer
E2012 Work area DMA
E2013 Recording buffer transfer DMA
E2014 Print buffer
E2015 Recording data expansion DMA
E2016 Data buffer for decompression
E2017 Column buffer
E2018 Head control unit
E2019 Encoder signal processor
E2020 CR motor controller
E2021 LF / PG motor controller
E2022 Sensor signal processor
E2023 Motor control buffer
E2024 Scanner capture buffer
E2025 Scanner data processing DMA
E2026 Scanner data buffer
E2027 Scanner data compression DMA
E2028 Sending buffer
E2029 Port control unit
E2030 LED controller
E2031 CLK (clock signal)
E2032 PDWM (software control signal)
E2033 PLLON (PLL control signal)
E2034 INT (interrupt signal)
E2036 PIF received data
E2037 USB reception data
E2038 WDIF (received data / raster data)
E2039 Reception buffer control unit
E2040 RDWK (Reception buffer read data / raster data)
E2041 WDWK (work buffer write data / record code)
E2042 WDWF (Workfill data)
E2043 RDWP (work buffer read data / record code)
E2044 WDWP (Sort recording code)
E2045 RDHDG (data for recording development)
E2047 WDHDG (column buffer write data / development record data)
E2048 RDHD (column buffer read data / development record data)
E2049 Head drive timing signal
E2050 Data development timing signal
E2051 RDPM (pulse motor drive table read data)
E2052 Sensor detection signal
E2053 WDHD (captured data)
E2054 RDAV (acquisition buffer read data)
E2055 WDAV (data buffer write data / processed data)
E2056 RDYC (data buffer read data / processed data)
E2057 WDYC (send buffer write data / compressed data)
E2058 RDUSB (USB transmission data / compressed data)
E2059 RDPIF (1284 transmission data)
H1000 recording head cartridge
H1001 Recording head
H1100 recording element substrate
H1100T Discharge port
H1126, H1140, H1154, H1170 Insulating layer
H1124AB Individual conductor layer
H1124A Common conductor layer
H1130 protective layer
H1132A, 1132B Electrode section
H1134 Heat generation resistance layer
H1200 first plate
H1201 Ink supply port
H1300 Electric wiring board
H1301 External signal input terminal
H1400 second plate
H1500 tank holder
H1501 ink flow path
H1600 flow path forming member
H1700 filter
H1800 seal rubber
H1900 ink tank
H1600d communication path
FS flat surface
SS seed layer

Claims (7)

An individual conductor layer that is formed on the substrate and that individually supplies a drive signal to a heat generating portion that generates energy for discharging liquid; and one end of the heating resistor layer that is disposed on the individual conductor layer and includes the heat generating portion An electrode part to be connected, and a common conductor layer that is arranged to be paired with the electrode part and connected in common to the plurality of heat generating parts, the individual conductor layer, the electrode part, and the The common conductor layer is disposed in an insulating layer formed on the base, and the heating resistor layer is formed on a common flat surface of the insulating layer, the electrode portion, and the common conductor layer. A recording head substrate,
In the cross section including a plane perpendicular to the surface of the base in the insulating layer, the cross-sectional shape of the electrode portion is cut in two steps from one end on the heating resistor layer side to the other end on the individual conductor layer side. It is a reverse convex shape that changes area,
The depth of the recess formed corresponding to the common conductor layer is deeper than the depth of the hole corresponding to the first step of the electrode portion on the heating resistor layer side,
In the region under the heating resistor layer, the individual electrode layer is not formed under the common conductor layer . The seed layer is formed of the same material as that of the heating resistor layer between an inner wall surface forming a through hole in the insulating layer for embedding the electrode portion and the electrode portion. Item 8. A recording head substrate according to Item 1. The electrode portion is aluminum, the substrate for recording head according to claim 1 or claim 2, characterized in that it is formed either aluminum alloy or copper. The insulating layer has a first insulating layer and a second insulating layer formed on the first insulating layer and thicker than the first insulating layer,
In the first insulating layer, a second stage on the individual electrode side of the electrode portion is formed ,
4. The recording head according to claim 1, wherein the second insulating layer is formed with a first stage of the electrode portion on the heating resistor layer side and the common conductor layer. 5. Substrate. A recording head substrate according to any one of claims 1 to 4,
A liquid flow path forming member which is provided on the recording head substrate and forms a liquid flow path for guiding a recording liquid to a liquid discharge port corresponding to the heating resistor layer;
A liquid discharge recording head comprising: A liquid discharge recording head according to claim 5;
Moving means for moving the liquid discharge recording head to face the recording surface of the recording medium;
A control unit for causing the liquid ejection recording head to perform a recording operation, while causing the moving unit to perform the movement operation;
A recording apparatus comprising: A method for manufacturing a recording head substrate according to any one of claims 1 to 4,
A method of manufacturing a recording head substrate, wherein a common flat surface of the insulating layer, the electrode portion, and the common conductor layer is formed by polishing using an etchant .

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