JP4284487B2 - Hot melt adhesive - Google Patents
Hot melt adhesive Download PDFInfo
- Publication number
- JP4284487B2 JP4284487B2 JP2000176236A JP2000176236A JP4284487B2 JP 4284487 B2 JP4284487 B2 JP 4284487B2 JP 2000176236 A JP2000176236 A JP 2000176236A JP 2000176236 A JP2000176236 A JP 2000176236A JP 4284487 B2 JP4284487 B2 JP 4284487B2
- Authority
- JP
- Japan
- Prior art keywords
- melt adhesive
- hot melt
- weight
- vinyl acetate
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、低温での塗布・接着が可能であり、かつ、固化スピードの早いホットメルト接着剤に関するものであり、特には、カレンダー等の製造に適したホットメルト接着剤に関するものである。
【0002】
【従来の技術及び発明が解決しようとする課題】
従来、カレンダー等の製本において、複数枚のコート紙からなるカレンダー本体の上端に綴じ金具を巻き付ける金具方式の製本が適用されてきたが、近年、環境問題の点から綴じ合わせ部を覆う紙製の背カバーをホットメルト接着剤でカレンダー本体に接着するようになってきた。この紙製の背カバーを用いるカレンダーの製造では、背カバーを接着すべきカレンダー本体縁部に複数の貫通孔を一列に開け、各貫通孔内に溶融状態のホットメルト接着剤を充填し、この縁部に2つ折りにした背カバーを当てがって押さえつけて貼り合わせる。
【0003】
しかし、この方法では、カレンダー製造ライン上で重ね合わせた紙片に穿孔した貫通孔にホットメルト接着剤を充填するため、表面積の増大はなく、また冷やされもしないため、容易に固まらず凝集破壊し、さらには、背カバーが開こうとする力による浮き剥がれが生ずるという欠点があった。
【0004】
本発明は、上記事情を改善するためになされたもので、低溶融粘度のため低温での塗布・接着が可能であり、かつ、固化スピードが早いため、例えば製本時のセット時間が短縮され、接着不良が発生しないカレンダーの製本に好適なホットメルト接着剤を提供することを目的とする。
【0005】
【課題を解決するための手段及び発明の実施の形態】
本発明者らは、前記の課題を解決するため鋭意検討を行った結果、ホットメルト接着剤の1つの成分であるワックスに、示差走査熱量測定における融解開始温度と終了温度が65〜85℃という特定範囲の石油ワックスを使用し、しかも50℃に於ける針入度が10〜20という特定範囲になるように各成分を配合したホットメルト接着剤を用いることにより、低温での塗布・接着が可能であり、固化スピードが早いために接着不良の発生が少なく、上述した従来の問題点を解消し得ることを知見し、本発明をなすに至った。
【0006】
従って、本発明は、紙製の背カバーを接着すべきカレンダー本体縁部に複数の貫通孔を一列に開け、各貫通孔内に溶融状態のホットメルト接着剤を充填し、この縁部に2つ折りにした紙製の背カバーを当てがって押さえつけて貼り合わせるカレンダー製造において用いるホットメルト接着剤であって、
(A)メルトインデックスが1000〜2000g/10分のエチレン系共重合体25〜50重量%、
(B)軟化点が100〜125℃の粘着付与樹脂30〜60重量%、
(C)示差走査熱量測定における融解開始温度と終了温度範囲が65〜85℃の石油ワックス15〜40重量%
を含有し、ホットメルト接着剤の50℃における針入度が10〜20であり、120℃における溶融粘度が2000cps未満であることを特徴とするカレンダー製造用ホットメルト接着剤を提供する。
この場合、(A)成分が、酢酸ビニル含量が20〜28重量%のエチレン酢酸ビニル共重合体であることが好ましい。
【0007】
以下に、本発明につき更に詳しく説明する。
本発明のホットメルト接着剤は、エチレン系共重合体(A成分)、粘着付与樹脂(B成分)、ワックス(C成分)を、それぞれ所定の割合で含有し、50℃に於る針入度が10〜20の範囲となる物性を示すものである。
【0008】
上記A成分であるエチレン系共重合体は、ホットメルト接着剤のベースポリマーとなるものであり、この分野で使用されるものであれば、特に制限されるものではない。例えば、エチレン酢酸ビニル共重合体(EVA)、エチレンエチルアクリレート共重合体(EEA)、エチレンメチルメタクリレート共重合体(EMMA)等が挙げられる。このエチレン系共重合体の配合割合は、通常25〜50重量%であり、好ましくは30〜40重量%である。すなわち、25重量%未満であると低温可撓性が損なわれ、50重量%を超えるとホットメルト接着剤の粘度が高くなり、塗布装置による貫通孔への充填が困難になる。
【0009】
上記B成分である粘着付与樹脂は、例えば、天然ロジン、変性ロジン、水添ロジン、天然ロジンまたは変性ロジンのグリセリンエステル、天然ロジンまたは変性ロジンのペンタエリスリトールエステル、天然テルペンのコポリマーまたは天然テルペンの三次元ポリマーの水素化誘導体、ポリテルペン樹脂、フェノール系変性テルペン樹脂およびその水素化誘導体、脂肪族石油炭化水素樹脂およびその水素化誘導体、芳香族石油炭化水素樹脂およびその水素化誘導体、環状脂肪族石油炭化水素樹脂およびその水素化誘導体が挙げられる。これらは、単独又は2種類以上併用して用いることができ、この粘着付与樹脂の配合割合は、通常30〜60重量%であり、好ましくは35〜45重量%である。すなわち、30重量%未満であると接着性が低下し、60重量%を超えると低温可撓性が損なわれる。
【0010】
上記C成分であるワックスとしては、示差走査熱量測定における融解開始温度と終了温度範囲が65〜85℃の石油ワックスを使用する。なお、示差走査熱量測定は、JISK7121(プラスチックの転移温度測定方法)に基づき熱流束型示差走査熱量計(セイコーインスツルメンツ社製DSC200)を用いて測定した値である。ワックスの融解開始温度が65℃未満であると固化スピードが遅くなり、一方、ワックスの融解終了温度が85℃を超えると低温接着性が発現しなくなる。この石油ワックスには、パラフィンワックス、マイクロクリスタリンワックスなどが挙げられ、単独又は2種類以上を組み合わせて用いることも出来る。この場合、2種類以上のワックス成分の混合物は、その混合物が上記融解特性を示せばよく、この際、個々のワックス成分自体が上記融解特性を逸脱していても差し支えない。
【0011】
C成分の配合割合は、通常15〜40重量%であり、好ましくは20〜30重量%である。すなわち、15重量%未満であると固化スピードが遅くなり、40重量%を超えると低温可撓性の維持が困難となり接着性が低下しやすくなる。
【0012】
本発明のホットメルト接着剤は、例えば、上記各成分を溶融攪拌混合釜に入れて加熱混合するなどによって得られる。
【0013】
ここで、得られたホットメルト接着剤は、50℃に於ける針入度が10〜20の範囲に入ることが必要である。なお、50℃の針入度は、JISK2235(石油ワックス)に基づき、恒温水浴を50℃に調整した状態で針入度試験器(マルイ社製)を用いて測定した値である。ホットメルト接着剤の50℃に於ける針入度が10未満であると、固化スピードが速すぎて低温接着性が発現ないし、20を超えると固化スピードが遅すぎて使用目的に適合しない。
【0014】
本発明によるホットメルト接着剤を用いて、複数枚のコート紙からなるカレンダー本体の上端に紙製の背カバーを接着させるには、例えば、カレンダー本体の接着すべき縁部に複数の貫通孔を一列に開け、各貫通孔に溶融状態のホットメルト接着剤を充填し、この縁部に2つ折りにした背カバーを当てがい押さえつけて貼り合わせる。
【0015】
このホットメルト接着剤が適用される製本機は、特に制限されるものではなく、穿孔した貫通孔にホットメルト接着剤を充填して製本するものであればよい。このような製本機としては、例えば、エコエース(新陽エンジニアリング社製)、タンザック(採光社製)が挙げられる。
【0016】
【実施例】
以下、実施例及び比較例を示し、本発明を具体的に説明するが、本発明は下記の実施例に制限されるものではない。なお、例中の部及び%はそれぞれ重量部と重量%を示す。
【0017】
〔実施例1〕
エチレン系共重合体としてエチレン酢酸ビニル共重合体(東ソー社製、商品名:ウルトラセン684、酢酸ビニル含量20%、MI=2000g/10分)25部とエチレン酢酸ビニル共重合体(東ソー社製、商品名:ウルトラセン735、酢酸ビニル含量28%、MI=1000g/10分)10部、粘着付与樹脂としてロジンエステル(荒川化学社製、商品名:ベンセルAD、軟化点100℃)40部、ワックスとしてパラフィンワックス(日本精蝋社製、商品名:HNP−9)25部を180℃で溶融混合し、ホットメルト接着剤を調製した。
【0018】
〔実施例2〜5、比較例1〜4〕
実施例1と同様にして、表1に示される原料種類と仕込量の配合組成に基づいて各成分を180℃で溶融混合し、ホットメルト接着剤を調製した。
【0019】
【表1】
【0020】
ウルトラセン684:エチレン酢酸ビニル共重合体、東ソー社製、酢酸ビニル含量20%、MI=2000g/10分
ウルトラセン727:エチレン酢酸ビニル共重合体、東ソー社製、酢酸ビニル含量28%、MI=2200g/10分
ウルトラセン735:エチレン酢酸ビニル共重合体、東ソー社製、酢酸ビニル含量28%、MI=1000g/10分
ペンセルAD:ロジンエステル、荒川化学社製、軟化点100℃
スーパーエステルA125:ロジンエステル、荒川化学社製、軟化点125℃
HNP−9:パラフィンワックス、日本精蝋社製、融解開始温度68℃、終了温度79℃
ポリレッツMPS−75:パラフィン、マイクロクリスタリン混合ワックス、中国精油社製、融解開始温度68℃、終了温度80℃
140°Fパラフィン:パラフィンワックス、日本精蝋社製、融解開始温度41℃、終了温度66℃
ポリレッツ200:ポリエチレンワックス、中国精油社製、融解開始温度47℃、終了温度106℃
パラフィントH−1:フィッシャートロプシュワックス、サゾール社製、融解開始温度62℃、終了温度113℃
【0021】
実施例1〜5、比較例1〜4で得られたホットメルト接着剤について、溶融粘度、50℃に於ける針入度、接着性、固化スピードについて性能試験を行い、その結果を表2に示した。なお、試験方法はつぎの通りである。
1.溶融粘度
日本接着剤工業会規格JAI7(ホットメルト接着剤試験方法)に準じて各ホットメルト接着剤の溶融粘度をB法、測定温度120℃で測定した。溶融粘度が2000cps以上になると塗布時、糸引き等が発生しやすくなるので、塗布性の評価を次の如く行った。
○:溶融粘度(at120℃)2000cps未満
×:溶融粘度(at120℃)2000cps以上
2.針入度
JISK2235(石油ワックス)に準じて恒温水浴を50℃に調整した状態で針入度試験器(マルイ社製)を用いて測定した。
3.接着性
接着力測定器ASM−15(日本たばこ産業社製)を用いて、各ホットメルト接着剤を塗布温度120℃、塗布量3g/m2、塗工速度30m/minで白表紙(サイズ50mm×100mm)に塗布し、同材質、同サイズの白表紙にオープンタイム1秒、セットタイム2秒、プレス荷重2kgで貼り合わせた。上記方法により得られた試験片を23℃の雰囲気下で16時間以上放置後、その温度下で手で剥がし、白表紙表面の剥離状況を観察し、接着性の評価を次の如く行った。
○:材料破壊、 ×:界面破壊
4.固化スピード
接着力測定機ASM−15(日本たばこ産業社製)を用いて、各ホットメルト接着剤を塗布温度120℃、塗布量3g/m2、塗工速度30m/minでKライナー段ボール(サイズ50mm×100mm)に塗布し、同材質、同サイズの段ボールにオープンタイム1秒、プレス荷重2kgで貼り合わせ、所定の時間(セットタイム)経過後、強制的に剥がし、段ボールの材料破壊率を測定し、材料破壊率80%以上を示す最短のセットタイムを求め、固化スピードとした。なお、実用的カレンダー等の製本機では、2秒以内であることが必要である。
【0022】
【表2】
【0023】
【発明の効果】
本発明のホットメルト接着剤は、低温での塗布・接着が可能であり、かつ使用時の固化スピードの早いことを特徴とするため、製本、特にカレンダー本体に背カバーを接着するのに最適なホットメルト接着剤を提供することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a hot melt adhesive that can be applied and bonded at a low temperature and has a fast solidification speed, and particularly relates to a hot melt adhesive suitable for manufacturing a calendar or the like.
[0002]
[Prior art and problems to be solved by the invention]
Conventionally, in bookbinding for calendars, etc., a metal-binding bookbinding method in which a binding metal fitting is wound around the upper end of a calendar body composed of a plurality of coated papers has been applied. The back cover has been adhered to the calendar body with a hot melt adhesive. In the manufacture of a calendar using this paper back cover, a plurality of through holes are formed in a row at the edge of the calendar body to which the back cover is to be bonded, and each through hole is filled with a molten hot melt adhesive. Put the back cover folded in half on the edge and hold it together.
[0003]
However, with this method, the hot melt adhesive is filled into the through-holes perforated on the piece of paper stacked on the calendar production line, so there is no increase in surface area and it is not cooled, so it does not harden easily and causes cohesive failure. In addition, there is a drawback that the peeling off occurs due to the force with which the back cover opens.
[0004]
The present invention was made to improve the above circumstances, and can be applied and bonded at a low temperature because of its low melt viscosity, and since the solidification speed is fast, for example, the set time at the time of bookbinding is shortened, and to provide a suitable hot melt adhesive bookbinding of calendar that adhesion failure does not occur.
[0005]
Means for Solving the Problem and Embodiment of the Invention
As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the wax, which is one component of the hot melt adhesive, has a melting start temperature and an end temperature of 65 to 85 ° C. in differential scanning calorimetry. By using a hot-melt adhesive that uses a specific range of petroleum wax and blends each component so that the penetration at 50 ° C. is in the specific range of 10-20, application and adhesion at low temperatures can be achieved. It was possible, and since the solidification speed was high, the occurrence of poor adhesion was small, and it was found that the conventional problems described above could be solved, and the present invention was made.
[0006]
Therefore, according to the present invention , a plurality of through-holes are formed in a row at the edge of the calendar body to which the paper back cover is to be bonded, and each through-hole is filled with a molten hot-melt adhesive. A hot-melt adhesive used in calendar manufacturing in which a folded paper back cover is applied and pressed and bonded.
(A) 25 to 50% by weight of an ethylene copolymer having a melt index of 1000 to 2000 g / 10 min,
(B) 30-60% by weight of a tackifying resin having a softening point of 100-125 ° C,
(C) 15 to 40% by weight of petroleum wax having a melting start temperature and an end temperature range of 65 to 85 ° C. in differential scanning calorimetry
The hot melt adhesive for calendar production is characterized in that the hot melt adhesive has a penetration of 10 to 20 at 50 ° C. and a melt viscosity at 120 ° C. of less than 2000 cps .
In this case, the component (A) is preferably an ethylene vinyl acetate copolymer having a vinyl acetate content of 20 to 28% by weight.
[0007]
Hereinafter, the present invention will be described in more detail.
The hot melt adhesive of the present invention contains an ethylene copolymer (component A), a tackifier resin (component B), and a wax (component C) in a predetermined ratio, and the penetration at 50 ° C. The physical property which becomes the range of 10-20.
[0008]
The ethylene copolymer as the component A is a base polymer for the hot melt adhesive, and is not particularly limited as long as it is used in this field. For example, an ethylene vinyl acetate copolymer (EVA), an ethylene ethyl acrylate copolymer (EEA), an ethylene methyl methacrylate copolymer (EMMA), etc. are mentioned. The blending ratio of the ethylene copolymer is usually 25 to 50% by weight, preferably 30 to 40% by weight. That is, if it is less than 25% by weight, the low-temperature flexibility is impaired, and if it exceeds 50% by weight, the viscosity of the hot melt adhesive becomes high, and it becomes difficult to fill the through-holes by the coating apparatus.
[0009]
The B-component tackifying resin is, for example, natural rosin, modified rosin, hydrogenated rosin, natural rosin or modified rosin glycerin ester, natural rosin or modified rosin pentaerythritol ester, natural terpene copolymer or natural terpene tertiary. Hydrogenated derivatives of original polymers, polyterpene resins, phenolic modified terpene resins and their hydrogenated derivatives, aliphatic petroleum hydrocarbon resins and their hydrogenated derivatives, aromatic petroleum hydrocarbon resins and their hydrogenated derivatives, cyclic aliphatic petroleum carbonized Examples include hydrogen resins and hydrogenated derivatives thereof. These can be used alone or in combination of two or more, and the blending ratio of the tackifying resin is usually 30 to 60% by weight, preferably 35 to 45% by weight. That is, if it is less than 30% by weight, the adhesiveness is lowered, and if it exceeds 60% by weight, the low-temperature flexibility is impaired.
[0010]
As the wax as component C, petroleum wax having a melting start temperature and an end temperature range of 65 to 85 ° C. in differential scanning calorimetry is used. The differential scanning calorimetry is a value measured using a heat flux type differential scanning calorimeter (DSC200 manufactured by Seiko Instruments Inc.) based on JISK7121 (plastic transition temperature measuring method). When the melting start temperature of the wax is less than 65 ° C., the solidification speed is slowed. On the other hand, when the melting end temperature of the wax exceeds 85 ° C., the low temperature adhesiveness is not exhibited. Examples of the petroleum wax include paraffin wax and microcrystalline wax, and these can be used alone or in combination of two or more. In this case, the mixture of two or more kinds of wax components may be any mixture as long as the mixture exhibits the above melting characteristics. In this case, the individual wax components themselves may deviate from the melting characteristics.
[0011]
The blending ratio of component C is usually 15 to 40% by weight, preferably 20 to 30% by weight. That is, if it is less than 15% by weight, the solidification speed becomes slow, and if it exceeds 40% by weight, it is difficult to maintain low-temperature flexibility and the adhesiveness tends to be lowered.
[0012]
The hot melt adhesive of the present invention can be obtained, for example, by putting each of the above components into a melt stirring and mixing pot and mixing them by heating.
[0013]
Here, it is necessary for the obtained hot melt adhesive to have a penetration of 10 to 20 at 50 ° C. The penetration at 50 ° C. is a value measured using a penetration penetration tester (manufactured by Marui) with a constant temperature water bath adjusted to 50 ° C. based on JISK2235 (petroleum wax). If the penetration of the hot melt adhesive at 50 ° C. is less than 10, the solidification speed is too fast and low temperature adhesiveness is not exhibited, and if it exceeds 20, the solidification speed is too slow to suit the intended use.
[0014]
In order to bond a paper back cover to the upper end of a calendar body made of a plurality of coated papers using the hot melt adhesive according to the present invention, for example, a plurality of through holes are formed at the edge of the calendar body to be bonded. Open in a line, fill each through-hole with a hot-melt adhesive in a molten state, and apply a back cover folded in half to the edge to hold it together.
[0015]
The bookbinding machine to which the hot melt adhesive is applied is not particularly limited as long as the hot melt adhesive is filled into the perforated through hole and bound. Examples of such a bookbinding machine include Eco Ace (manufactured by Shinyo Engineering Co., Ltd.) and Tanzac (manufactured by Daylighting Co., Ltd.).
[0016]
【Example】
EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example. In addition, the part and% in an example show a weight part and weight%, respectively.
[0017]
[Example 1]
Ethylene vinyl acetate copolymer (trade name: Ultrasen 684, vinyl acetate content 20%, MI = 2000 g / 10 min) and ethylene vinyl acetate copolymer (manufactured by Tosoh Corporation) as an ethylene copolymer , Trade name: Ultracene 735, vinyl acetate content 28%, MI = 1000 g / 10 min) 10 parts, rosin ester (made by Arakawa Chemical Co., trade name: Bencel AD, softening point 100 ° C.) 40 parts as tackifier resin, As a wax, 25 parts of paraffin wax (trade name: HNP-9, manufactured by Nippon Seiwa Co., Ltd.) was melted and mixed at 180 ° C. to prepare a hot melt adhesive.
[0018]
[Examples 2 to 5, Comparative Examples 1 to 4]
In the same manner as in Example 1, each component was melted and mixed at 180 ° C. based on the composition of raw material types and preparation amounts shown in Table 1 to prepare a hot melt adhesive.
[0019]
[Table 1]
[0020]
Ultrasen 684: ethylene vinyl acetate copolymer, manufactured by Tosoh Corporation, vinyl acetate content 20%, MI = 2000 g / 10 min Ultrasen 727: ethylene vinyl acetate copolymer, manufactured by Tosoh Corporation, vinyl acetate content 28%, MI = 2200 g / 10 min Ultracene 735: ethylene vinyl acetate copolymer, manufactured by Tosoh Corporation, vinyl acetate content 28%, MI = 1000 g / 10 min Pencel AD: rosin ester, manufactured by Arakawa Chemical Industries, softening point 100 ° C.
Superester A125: Rosin ester, Arakawa Chemical Co., Ltd., softening point 125 ° C
HNP-9: Paraffin wax, manufactured by Nippon Seiwa Co., Ltd., melting start temperature 68 ° C., end temperature 79 ° C.
Polyrets MPS-75: Paraffin, microcrystalline mixed wax, manufactured by China Essential Oil Co., Ltd., melting start temperature 68 ° C., end temperature 80 ° C.
140 ° F paraffin: Paraffin wax, manufactured by Nippon Seiwa Co., Ltd., melting start temperature 41 ° C, end temperature 66 ° C
Polyretz 200: polyethylene wax, manufactured by China Essential Oil Co., Ltd., melting start temperature 47 ° C., end temperature 106 ° C.
Paraffin H-1: Fischer-Tropsch wax, manufactured by Sasol, melting start temperature 62 ° C., end temperature 113 ° C.
[0021]
The hot melt adhesives obtained in Examples 1 to 5 and Comparative Examples 1 to 4 were subjected to performance tests on melt viscosity, penetration at 50 ° C., adhesiveness and solidification speed, and the results are shown in Table 2. Indicated. The test method is as follows.
1. Melt Viscosity The melt viscosity of each hot melt adhesive was measured at Method B at a measurement temperature of 120 ° C. in accordance with Japan Adhesive Industry Association Standard JAI7 (Test Method for Hot Melt Adhesive). When the melt viscosity is 2000 cps or more, stringing or the like is likely to occur at the time of coating. Thus, the coating property was evaluated as follows.
○: Melt viscosity (at 120 ° C.) less than 2000 cps ×: Melt viscosity (at 120 ° C.) 2000 cps or more The penetration was measured using a penetration tester (manufactured by Marui) with the constant temperature water bath adjusted to 50 ° C. according to JISK2235 (petroleum wax).
3. Using an adhesive adhesion measuring device ASM-15 (manufactured by Japan Tobacco Inc.), each hot melt adhesive was coated with a white cover (size 50 mm) at an application temperature of 120 ° C., an application amount of 3 g / m 2 , and an application speed of 30 m / min. × 100 mm) and pasted on the same material and the same size white cover with an open time of 1 second, a set time of 2 seconds, and a press load of 2 kg. The test piece obtained by the above method was allowed to stand for 16 hours or more in an atmosphere at 23 ° C., and then peeled off by hand at that temperature, and the peeling state of the surface of the white cover was observed, and the adhesion was evaluated as follows.
○: Material destruction, ×: Interface destruction Using a solidification speed adhesive force measuring machine ASM-15 (manufactured by Japan Tobacco Inc.), each hot melt adhesive was coated at a coating temperature of 120 ° C., a coating amount of 3 g / m 2 and a coating speed of 30 m / min. 50mm x 100mm), and bonded to the same material and the same size corrugated cardboard with an open time of 1 second and a press load of 2kg. After a predetermined time (set time) has passed, it is forcibly removed and the corrugated cardboard material destruction rate is measured. Then, the shortest set time showing a material destruction rate of 80% or more was obtained and set as the solidification speed. Note that a bookbinding machine such as a practical calendar needs to be within 2 seconds.
[0022]
[Table 2]
[0023]
【The invention's effect】
The hot melt adhesive of the present invention can be applied and bonded at a low temperature and has a fast solidification speed during use. Therefore, the hot melt adhesive of the present invention is most suitable for binding a back cover to bookbinding, particularly a calendar body. Hot melt adhesives can be provided.
Claims (2)
(A)メルトインデックスが1000〜2000g/10分のエチレン系共重合体25〜50重量%、
(B)軟化点が100〜125℃の粘着付与樹脂30〜60重量%、
(C)示差走査熱量測定における融解開始温度と終了温度範囲が65〜85℃の石油ワックス15〜40重量%
を含有し、ホットメルト接着剤の50℃における針入度が10〜20であり、120℃における溶融粘度が2000cps未満であることを特徴とするカレンダー製造用ホットメルト接着剤。A plurality of through holes are formed in a row at the edge of the calendar body to which the paper back cover is to be bonded, and each through hole is filled with a hot-melt adhesive in a molten state. A hot melt adhesive used in calendar manufacturing where a back cover is applied and pressed and bonded.
(A) 25 to 50% by weight of an ethylene copolymer having a melt index of 1000 to 2000 g / 10 min,
(B) 30-60% by weight of a tackifying resin having a softening point of 100-125 ° C,
(C) 15 to 40% by weight of petroleum wax having a melting start temperature and an end temperature range of 65 to 85 ° C. in differential scanning calorimetry
A hot melt adhesive for calendering, wherein the hot melt adhesive has a penetration of 10 to 20 at 50 ° C. and a melt viscosity at 120 ° C. of less than 2000 cps.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000176236A JP4284487B2 (en) | 2000-06-13 | 2000-06-13 | Hot melt adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000176236A JP4284487B2 (en) | 2000-06-13 | 2000-06-13 | Hot melt adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001354940A JP2001354940A (en) | 2001-12-25 |
JP4284487B2 true JP4284487B2 (en) | 2009-06-24 |
Family
ID=18677976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000176236A Expired - Fee Related JP4284487B2 (en) | 2000-06-13 | 2000-06-13 | Hot melt adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4284487B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6846876B1 (en) * | 2003-07-16 | 2005-01-25 | Adherent Laboratories, Inc. | Low odor, light color, disposable article construction adhesive |
JP4635854B2 (en) * | 2005-12-12 | 2011-02-23 | 株式会社デンソー | Processed product manufacturing method |
JP5751581B2 (en) * | 2011-05-26 | 2015-07-22 | ヤスハラケミカル株式会社 | Hot melt adhesive composition |
JP6028998B2 (en) * | 2012-09-10 | 2016-11-24 | 日立化成株式会社 | Corrugated hot melt resin composition |
CN110776851A (en) * | 2019-10-11 | 2020-02-11 | 东莞市成铭胶粘剂有限公司 | Hot melt adhesive for bonding EPE pearl cotton |
-
2000
- 2000-06-13 JP JP2000176236A patent/JP4284487B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2001354940A (en) | 2001-12-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5236950B2 (en) | Hot melt adhesive composition | |
CA1332649C (en) | Recyclable hot melt adhesive compositions | |
JP4865716B2 (en) | Adhesive composition | |
CN107532053A (en) | Hot melt adhesive and use its disposable products | |
JPS5827764A (en) | Improved adhesive for full bookbinding and method therewith | |
AU739282B2 (en) | Low application temperature hot melt adhesive | |
JPH05239285A (en) | Hot-melt composition that has good open time and forms creep-resistant bond when applied in thin layer | |
US4960295A (en) | Two-shot hot-melt bookbinding | |
JPH07242865A (en) | Hot-melt adhesive for bookbinding | |
JP4284487B2 (en) | Hot melt adhesive | |
CN112592683A (en) | Low-temperature-resistant hot-melt pressure-sensitive adhesive, adhesive tape and preparation process thereof | |
JP7034463B2 (en) | Hot melt adhesive | |
JPH0275680A (en) | Toughened rubber base hot-melt adhesive composition for bookbinding application | |
JP2005104996A (en) | Hot-melt adhesive | |
JP3912508B2 (en) | Hot melt adhesive for bookbinding | |
JP7195257B2 (en) | Use of specific ethylene-butyl acrylate copolymers in hot-melt adhesive compositions that are transparent in the molten state | |
CN114381226B (en) | Hot melt adhesive for decoration adhesion and preparation method thereof | |
JPH10102019A (en) | Hot-melt adhesive composition and bonding of polyolefin material | |
JP3625514B2 (en) | Hot melt bookbinding adhesive | |
JP2001172590A (en) | Hot melt adhesive | |
WO2024203717A1 (en) | Double-sided adhesive tape, and method for producing double-sided adhesive tape | |
JPH09286962A (en) | Hot-melt adhesive composition | |
JP2000204336A (en) | Hot-melt adhesive | |
JP2019034999A (en) | Hot melt adhesive | |
CN117625098A (en) | Thermosensitive hot-melt adhesive, preparation method and hot-melt adhesive tape |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20060516 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081106 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081112 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090109 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090225 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090310 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120403 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120403 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150403 Year of fee payment: 6 |
|
LAPS | Cancellation because of no payment of annual fees |