CN117625098A - Thermosensitive hot-melt adhesive, preparation method and hot-melt adhesive tape - Google Patents
Thermosensitive hot-melt adhesive, preparation method and hot-melt adhesive tape Download PDFInfo
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- CN117625098A CN117625098A CN202311731177.4A CN202311731177A CN117625098A CN 117625098 A CN117625098 A CN 117625098A CN 202311731177 A CN202311731177 A CN 202311731177A CN 117625098 A CN117625098 A CN 117625098A
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 69
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 239000011347 resin Substances 0.000 claims abstract description 63
- 229920001971 elastomer Polymers 0.000 claims abstract description 26
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 22
- 239000000654 additive Substances 0.000 claims abstract description 20
- 230000000996 additive effect Effects 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000003921 oil Substances 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 5
- -1 glycerol ester Chemical class 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000012188 paraffin wax Substances 0.000 claims description 4
- 239000010692 aromatic oil Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 claims description 3
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 3
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 21
- 230000001070 adhesive effect Effects 0.000 abstract description 21
- 238000001816 cooling Methods 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- 238000004804 winding Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a thermosensitive hot-melt adhesive, a preparation method and a hot-melt adhesive tape. The thermosensitive hot-melt adhesive comprises: rubber softener: 5-30 parts by mass; EVA resin: 10-50 parts by mass; tackifying resin: 70-120 parts by mass; synthetic thermoplastic rubber: 10-50 parts by mass; additive: 2-5 parts by mass. The thermosensitive hot-melt adhesive of the invention has greatly improved thermosensitive property of the adhesive system after a certain amount of EVA resin is added into the formula. Further, the EVA resin enables the adhesive to generate better viscosity after being heated, simultaneously enables the opening time of the adhesive system to be shorter, and can generate higher fitting fastness at the moment of cooling. Secondly, the preparation process of the thermosensitive hot melt adhesive is simple and pollution-free. In addition, the hot melt adhesive tape prepared from the thermosensitive hot melt adhesive can generate better viscosity after being heated and has higher fitting fastness.
Description
Technical Field
The invention relates to the field of adhesives, in particular to a thermosensitive hot-melt adhesive, a preparation method and a hot-melt adhesive tape.
Background
With the development of the electronic industry, a large number of adhesive tapes are used in the industry, and more pressure-sensitive adhesive tapes and heat-sensitive adhesive tapes are currently used in the market. The pressure-sensitive adhesive tape often has the problem of environmental protection or poor adhesion fastness. The thermosensitive type glue adhesive tape has the advantages that the needed thermosensitive temperature is higher, the infirm adhesion is easy to occur in the industrial production process, and the water-based glue has the problems of higher cost and high production energy consumption.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a thermosensitive hot-melt adhesive, a preparation method and a hot-melt adhesive tape, which can improve the viscosity of the adhesive and have higher fitting fastness after heating.
To achieve the above object, an embodiment of the present invention provides a heat-sensitive hot melt adhesive comprising: rubber softener: 5-30 parts by mass; EVA resin: 10-50 parts by mass; tackifying resin: 70-120 parts by mass; synthetic thermoplastic rubber: 10-50 parts by mass; additive: 2-5 parts by mass.
In one or more embodiments of the invention, the weight ratio of vinyl acetate in the EVA resin is between 5% and 40%.
In one or more embodiments of the invention, the synthetic thermoplastic rubber is selected from one or more of SIS, SBS, SEBS and SEPS.
In one or more embodiments of the invention, the synthetic thermoplastic rubber is a SIS rubber having a styrene weight ratio of 20% to 50% and a diblock content of less than or equal to 1%.
In one or more embodiments of the present invention, the rubber softener is selected from one or more of paraffin, white oil, naphthenic oil, and aromatic oil.
In one or more embodiments of the present invention, the tackifying resin is selected from one or more of rosin, rosin glycerol esters, pentaerythritol ester resins, phenolic resins, terpene resins, petroleum resins, and modified resins.
Another embodiment of the present invention provides a method for preparing a thermosensitive hot-melt adhesive, comprising: preheating a reaction kettle to 150-200 ℃, adding a rubber softener, tackifying resin and an additive into the reaction kettle, and melting and stirring; after the rubber softener, the tackifying resin and the additive are completely melted, adding the synthetic thermoplastic rubber and stirring; adding EVA resin into the reaction kettle, and continuously stirring to obtain the thermosensitive hot melt adhesive; wherein, the rubber softener: 5-30 parts by mass; EVA resin: 10-50 parts by mass; tackifying resin: 70-120 parts by mass; synthetic thermoplastic rubber: 10-50 parts by mass; additive: 2-5 parts by mass.
In one or more embodiments of the invention, the stirring rate is between 350r/min and 450r/min and the stirring time is between 20min and 30min.
Another embodiment of the present invention provides a hot melt adhesive tape, comprising: the paper comprises a textured paper substrate layer, a release layer and an adhesive layer. The textured paper substrate layer comprises a first surface and a second surface which are oppositely arranged; the release layer is arranged on the first surface of the textured paper base material layer; the adhesive layer is coated on the second surface of the textured paper substrate layer, and the adhesive layer is the thermosensitive hot-melt adhesive.
In one or more embodiments of the invention, the heat sensitive hot melt adhesive coating amount is between 30g and 40 g; and/or the thickness of the textured paper substrate layer is between 145 and 150 μm.
Compared with the prior art, the thermosensitive hot-melt adhesive according to the embodiment of the invention has the advantage that the thermosensitive property of an adhesive system is greatly improved after a certain amount of EVA resin is added into the formula. Further, the EVA resin enables the adhesive to generate better viscosity after being heated, simultaneously enables the opening time of the adhesive system to be shorter, and can generate higher fitting fastness at the moment of cooling. Secondly, the preparation process of the thermosensitive hot melt adhesive is simple and pollution-free. In addition, the hot melt adhesive tape prepared from the thermosensitive hot melt adhesive can generate better viscosity after being heated and has higher fitting fastness.
Detailed Description
The following detailed description of specific embodiments of the invention is, but it should be understood that the invention is not limited to specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.
A heat-sensitive hot melt adhesive according to a preferred embodiment of the present invention includes: rubber softener: 5-30 parts by mass; EVA resin: 10-50 parts by mass; tackifying resin: 70-120 parts by mass; synthetic thermoplastic rubber: 10-50 parts by mass; additive: 2-5 parts by mass.
In the above embodiment, the thermosensitive hot-melt adhesive is prepared by adjusting the components and introducing the EVA resin. EVA resins have better heat sensitive properties, so that the heat sensitive hot melt adhesive can produce higher tack after heating. In addition, the thermosensitive hot-melt adhesive is simple to prepare, is easier to obtain and is lower in production cost.
In one embodiment, the weight ratio of vinyl acetate in the EVA resin is between 5% and 40%. The synthetic thermoplastic rubber is selected from one or more of SIS, SBS, SEBS and SEPS. Preferably, the synthetic thermoplastic rubber may be selected from SIS rubber having a styrene weight ratio of 20% to 50% and a diblock content of less than or equal to 1%. The synthetic thermoplastic rubber plays roles of acting as a framework and increasing elasticity in the whole system, ensures that the whole system is not brittle and has higher cohesive strength.
Further, the rubber softener is selected from one or more of paraffin, white oil, naphthenic oil and aromatic oil. Among them, paraffin wax or white oil is preferable, which has good compatibility with the whole adhesive system and good fluxing action. The tackifying resin is selected from one or more of rosin, rosin glycerol ester, pentaerythritol ester resin, phenolic resin, terpene resin, petroleum resin, and modified resin.
In summary, after a certain amount of EVA resin is added into the formula of the thermosensitive hot-melt adhesive, the thermosensitive sensitivity of the adhesive system is greatly improved. Further, the EVA resin has a certain content of vinyl acetate, which makes the adhesive produce better adhesion after reheating, and the EVA has a certain content of ethylene, which determines that the adhesive system has a shorter open time and can produce higher adhesion at the instant of cooling.
Another embodiment of the present invention provides a method for preparing a thermosensitive hot-melt adhesive, which includes steps 1 to 3.
In step 1: preheating the reaction kettle to 150-200 ℃, adding the rubber softener, the tackifying resin and the additive into the reaction kettle, melting and stirring.
Specifically, in step 1, the reaction vessel is preheated to 150-200 ℃, 5-30 parts by mass of a rubber softener, 70-120 parts by mass of a tackifying resin and 2-5 parts by mass of an additive are added into the reaction vessel and melted, and then stirred at a speed of 350-450 r/min for 20-30min.
In step 2: after the rubber softener, tackifying resin and additives are completely melted, the synthetic thermoplastic rubber is added and stirred.
Specifically, in step 2, after the rubber softener, tackifying resin and additives are completely melted, 10 to 50 parts by mass of synthetic thermoplastic rubber is added and purged with nitrogen for protection, and then stirred at a speed of 350 to 450r/min for 20 to 30min.
In step 3: and adding EVA resin into the reaction kettle, and continuously stirring to obtain the thermosensitive hot-melt adhesive.
Specifically, in step 3, 10 to 50 parts by mass of EVA resin is added to the reaction vessel, and stirring is continued at 400r/min for about 20 to 30 minutes, to obtain a thermosensitive hot-melt adhesive.
The preparation method of the thermosensitive hot-melt adhesive is simple, and the prepared thermosensitive hot-melt adhesive has high viscosity and environmental protection and no pollution.
Another embodiment of the present invention also provides a hot melt adhesive tape, which includes: the paper comprises a textured paper substrate layer, a release layer and an adhesive layer. The textured paper substrate layer comprises a first surface and a second surface which are oppositely arranged; the release layer is arranged on the first surface of the textured paper base material layer; the adhesive layer is coated on the second surface of the textured paper substrate layer, and the adhesive layer adopts the thermosensitive hot melt adhesive.
Wherein the coating weight of the thermosensitive hot-melt adhesive is between 30g and 40g, and the thickness of the textured paper base material layer is between 145 mu m and 150 mu m.
In summary, the hot melt adhesive tape is prepared by the thermosensitive hot melt adhesive, and can generate better viscosity after being heated and has higher fitting fastness.
The following is a further description of specific examples and comparative examples.
Example 1
Preheating a reaction kettle to 170 ℃, and sequentially adding a rubber softener: 20 parts by mass of HS-180L; tackifying resin: 30 parts by mass of SA-140, 20 parts by mass of SA-120, 30 parts by mass of P-140, 10 parts by mass of C100W and input additives: 1 part by mass of an antioxidant 1010,1 part by mass of an antioxidant 168 and stirring at 400r/min for 20min.
Adding synthetic thermoplastic rubber: 10 parts by mass of SIS-4111N,40 parts by mass of SIS-4215, and nitrogen gas was introduced into the reaction vessel and stirred at 400r/min for 30 minutes.
And (3) adding EVA resin: 30 parts by mass of EVA-28025 and 15 parts by mass of 803L, continuously stirring at 400r/min for 20min to obtain a thermosensitive hot-melt adhesive, then coating 30g of the obtained adhesive on a textured paper substrate layer, and winding to obtain the hot-melt adhesive tape.
Example 2
Preheating a reaction kettle to 170 ℃, and sequentially adding a rubber softener: 20 parts by mass of wax 100H; tackifying resin: 30 parts by mass of SA-140, 20 parts by mass of SA-120, 30 parts by mass of P-140, 10 parts by mass of C100W and input additives: 1 part by mass of an antioxidant 1010,1 part by mass of an antioxidant 168 and stirring at 400r/min for 20min.
Adding synthetic thermoplastic rubber: 10 parts by mass of SIS-4111N,40 parts by mass of SIS-4215, and nitrogen gas was introduced into the reaction vessel and stirred at 400r/min for 30 minutes.
And (3) adding EVA resin: 30 parts by mass of EVA-28025 and 15 parts by mass of 803L, continuously stirring at 400r/min for 20min to obtain a thermosensitive hot-melt adhesive, then coating 30g of the obtained adhesive on a textured paper substrate layer, and winding to obtain the hot-melt adhesive tape.
Example 3
Preheating a reaction kettle to 170 ℃, and sequentially adding a rubber softener: 20 parts by mass of HS-180L; tackifying resin: 30 parts by mass of SA-140, 20 parts by mass of SA-120, 30 parts by mass of P-140, 10 parts by mass of C100W and input additives: 1 part by mass of an antioxidant 1010,1 part by mass of an antioxidant 168 and stirring at 400r/min for 20min.
Adding synthetic thermoplastic rubber: 10 parts by mass of SIS-4111N,40 parts by mass of SIS-4215, and nitrogen gas was introduced into the reaction vessel and stirred at 400r/min for 30 minutes.
And (3) adding EVA resin: 30 parts by mass of EVA-19053 and 15 parts by mass of 803L, continuously stirring at 400r/min for 20min to obtain a thermosensitive hot-melt adhesive, then coating 40g of the obtained adhesive on a textured paper substrate layer, and winding to obtain the hot-melt adhesive tape.
Example 4
Preheating a reaction kettle to 150 ℃, and sequentially adding a rubber softener: 20 parts by mass of HS-180L; tackifying resin: 90 parts by mass of C100W and adding additives: 1 part by mass of an antioxidant 1010,1 part by mass of an antioxidant 168 and stirring at 400r/min for 20min.
Adding synthetic thermoplastic rubber: 10 parts by mass of SIS-4111N,40 parts by mass of SIS-4215, and nitrogen gas was introduced into the reaction vessel and stirred at 400r/min for 30 minutes.
And (3) adding EVA resin: 30 parts by mass of EVA-19053 and 15 parts by mass of 803L, continuously stirring at 400r/min for 20min to obtain a thermosensitive hot-melt adhesive, then coating 30g of the obtained adhesive on a textured paper substrate layer, and winding to obtain the hot-melt adhesive tape.
Comparative example 1
Preheating a reaction kettle to 170 ℃, and sequentially adding a rubber softener: 20 parts by mass of HS-180L; tackifying resin: 30 parts by mass of SA-140, 20 parts by mass of SA-120, 30 parts by mass of P-140, 10 parts by mass of C100W and input additives: 1 part by mass of an antioxidant 1010,1 parts by mass of an antioxidant 168 and charging nitrogen into the reaction kettle, and stirring for 20min at 400 r/min.
And (3) adding EVA resin: 30 parts by mass of EVA-28025 and 15 parts by mass of 803L, continuously stirring at 400r/min for 20min to obtain a thermosensitive hot-melt adhesive, then coating 40g of the obtained adhesive on a textured paper substrate layer, and winding to obtain the hot-melt adhesive tape.
Comparative example 2
Preheating a reaction kettle to 170 ℃, and sequentially adding a rubber softener: 20 parts by mass of HS-180L; tackifying resin: 30 parts by mass of SA-140, 20 parts by mass of SA-120, 30 parts by mass of P-140, 10 parts by mass of C100W and input additives: 1 part by mass of an antioxidant 1010,1 part by mass of an antioxidant 168 and stirring at 400r/min for 20min.
Adding synthetic thermoplastic rubber: 10 parts by mass of SIS-4111N,40 parts by mass of SIS-4215, filling nitrogen into a reaction kettle, stirring for 30min at 400r/min to obtain a thermosensitive hot melt adhesive, coating 40g of the obtained adhesive on a textured paper substrate layer, and winding to obtain the hot melt adhesive tape.
The hot melt adhesive tapes prepared in examples 1 to 4 and comparative examples 1 to 2 were cut into tape samples 1CM wide, and a braid sample to which resistance was added was manufactured using a braiding machine, and then subjected to a load hanging test and an aging bending test. And if no resistance drops, the test is qualified.
Load hanging test: the sample is cut off and fixed on a cuboid wood strip or an iron strip, and knotted after passing through a resistor by a string, and is respectively placed in an environment of normal temperature (23 ℃/50-60 RH)/50 ℃, and hung at the knotted position by using a 500g weight, and the load hanging time is respectively tested. The test effect is better when the normal temperature load time is more than or equal to 10 min. The test effect is better when the load time at 50 ℃ is more than or equal to 2 minutes.
Aging bending test: placing the sample in an environment of 85 ℃/85RH for 72H, taking out the sample, placing at normal temperature, bending the braid, and if no resistance drops off, loosening or braid scattering, the test effect is better. The specific test results are shown in table 1 below.
TABLE 1 results of examples 1-4 and comparative examples 1-2 load hanging test and aged bending test
In summary, the heat sensitivity of the adhesive system is greatly improved after a certain amount of EVA resin is added into the formula of the heat-sensitive hot melt adhesive. Further, the EVA resin has a certain content of vinyl acetate, which makes the adhesive produce better adhesion after reheating, and the EVA has a certain content of ethylene, which determines that the adhesive system has a shorter open time and can produce higher adhesion at the instant of cooling. And secondly, the hot melt adhesive tape prepared from the thermosensitive hot melt adhesive can generate better viscosity after being heated and has higher fitting fastness.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (10)
1. A heat-sensitive hot melt adhesive comprising:
rubber softener: 5-30 parts by mass;
EVA resin: 10-50 parts by mass;
tackifying resin: 70-120 parts by mass;
synthetic thermoplastic rubber: 10-50 parts by mass; and
additive: 2-5 parts by mass.
2. A heat sensitive hot melt adhesive according to claim 1, wherein the weight ratio of vinyl acetate in the EVA resin is between 5% and 40%.
3. A heat sensitive hot melt adhesive according to claim 1, wherein said synthetic thermoplastic rubber is selected from one or more of SIS, SBS, SEBS and SEPS.
4. A heat sensitive hot melt adhesive according to claim 3 wherein the synthetic thermoplastic rubber is a SIS rubber having a styrene weight ratio of 20% to 50% and a diblock content of less than or equal to 1%.
5. The heat-sensitive hot melt adhesive of claim 1, wherein the rubber softener is selected from one or more of paraffin, white oil, naphthenic oil, and aromatic oil.
6. The heat-sensitive hot melt adhesive of claim 1, wherein the tackifying resin is selected from one or more of rosin, rosin glycerol ester, pentaerythritol ester resins, phenolic resins, terpene resins, petroleum resins, and modified resins.
7. A method of preparing a heat-sensitive hot melt adhesive according to any one of claims 1 to 6, comprising:
preheating a reaction kettle to 150-200 ℃, adding a rubber softener, tackifying resin and an additive into the reaction kettle, and melting and stirring;
after the rubber softener, the tackifying resin and the additive are completely melted, adding the synthetic thermoplastic rubber and stirring;
adding EVA resin into the reaction kettle, and continuously stirring to obtain the thermosensitive hot melt adhesive; wherein, the rubber softener: 5-30 parts by mass; EVA resin: 10-50 parts by mass; tackifying resin: 70-120 parts by mass; synthetic thermoplastic rubber: 10-50 parts by mass; additive: 2-5 parts by mass.
8. The method of preparing a heat-sensitive hot melt adhesive as claimed in claim 7, wherein the stirring rate is between 350r/min and 450r/min and the stirring time is between 20min and 30min.
9. A hot melt adhesive tape, comprising:
the masking paper base material layer comprises a first surface and a second surface which are oppositely arranged;
the release layer is arranged on the first surface of the textured paper base material layer;
an adhesive layer coated on the second surface of the textured paper substrate layer, wherein the adhesive layer adopts the thermosensitive hot melt adhesive as set forth in any one of claims 1 to 6.
10. The hot melt adhesive tape of claim 9, wherein said heat sensitive hot melt adhesive is applied in an amount of between 30g and 40 g; and/or the thickness of the textured paper substrate layer is between 145 and 150 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311731177.4A CN117625098A (en) | 2023-12-15 | 2023-12-15 | Thermosensitive hot-melt adhesive, preparation method and hot-melt adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311731177.4A CN117625098A (en) | 2023-12-15 | 2023-12-15 | Thermosensitive hot-melt adhesive, preparation method and hot-melt adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117625098A true CN117625098A (en) | 2024-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311731177.4A Pending CN117625098A (en) | 2023-12-15 | 2023-12-15 | Thermosensitive hot-melt adhesive, preparation method and hot-melt adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117625098A (en) |
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2023
- 2023-12-15 CN CN202311731177.4A patent/CN117625098A/en active Pending
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