CN114874733B - High-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and preparation process thereof - Google Patents
High-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and preparation process thereof Download PDFInfo
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- CN114874733B CN114874733B CN202110696063.5A CN202110696063A CN114874733B CN 114874733 B CN114874733 B CN 114874733B CN 202110696063 A CN202110696063 A CN 202110696063A CN 114874733 B CN114874733 B CN 114874733B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09J157/02—Copolymers of mineral oil hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Abstract
The invention provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof, wherein the high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive comprises the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid, thermoplastic butylbenzene segmented copolymer and antioxidant. According to the invention, the thermoplastic resin and the diterpenoid compound with specific proportions are adopted, so that the prepared pressure-sensitive hot melt adhesive has excellent high temperature resistance, the high temperature resistance can reach 55 ℃, namely, the phenomena of wiredrawing and adhesive opening can not occur in a summer high temperature state, meanwhile, the Fischer-Tropsch wax and the polyethylene wax with specific proportions are added into the system, so that the pressure-sensitive hot melt adhesive has excellent high temperature resistance, and the low temperature resistance is greatly improved, so that the pressure-sensitive hot melt adhesive is suitable for most of air temperature environments.
Description
Technical Field
The invention relates to the field of adhesives, in particular to a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof.
Background
The paper and the general EVA hot melt adhesive of the film can not be adhered, but the general pressure sensitive hot melt adhesive has poor high temperature resistance, especially when the temperature is higher than 40 ℃, the phenomena of wiredrawing and adhesive opening can occur, and the pressure sensitive hot melt adhesive is dried to form films in summer at a slower speed, so that the adhesive opening problem is easily caused in the drying process, the packaging quality is influenced, and besides, the high temperature resistance and the low temperature resistance of many pressure sensitive hot melt adhesives on the market at present can not be balanced.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid, thermoplastic butylbenzene segmented copolymer and antioxidant.
As a preferable technical scheme, the pressure-sensitive hot melt adhesive comprises the following raw materials in parts by weight: 8-30 parts of mineral oil, 5-20 parts of wax, 10-35 parts of thermoplastic resin, 15-35 parts of diterpenoid compounds, 15-25 parts of SBS rubber and 0.1-0.5 part of antioxidants.
As a preferred embodiment, the wax comprises a fischer-tropsch wax and/or a polyethylene wax.
As a preferred technical scheme, the Fischer-Tropsch wax has a melting point of 92-110 ℃ and a penetration of 4-10mm.
As a preferred embodiment, the polyethylene wax has a softening point of 100-120 ℃ and a viscosity of 10-60cps at 140 ℃.
As a preferred embodiment, the thermoplastic resin has a number average molecular weight of 300 to 3000.
As a preferable technical scheme, the softening point of the thermoplastic resin is 95-115 ℃ and the melt viscosity at 200 ℃ is less than or equal to 290CP.
As a preferable technical scheme, the softening point of the diterpenoid compound is 90-110 ℃.
As a preferable technical scheme, the thermoplastic styrene-butadiene block copolymer is a styrene-butadiene-styrene triblock copolymer, and the styrene content in the styrene-butadiene-styrene triblock copolymer is 28-34wt%.
The invention also provides a preparation process of the high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following steps:
(1) Adding mineral oil into a reaction kettle, and opening a turntable of the reaction kettle when the temperature is raised to 80-110 ℃; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all raw materials are completely dissolved to obtain a mixture A;
(2) Adding thermoplastic resin, diterpenoid compound and wax into the mixture A, uniformly mixing at 130-160deg.C, maintaining the temperature for 30-50min, cooling to 125-150deg.C, and discharging.
The beneficial effects are that:
the thermoplastic resin and the diterpenoid compound are adopted in the system, particularly the hydrogenated C9 petroleum resin with the softening point of 100-110 ℃ and the melt viscosity of 200 ℃ being less than or equal to 280CP, and the diterpenoid compound is terpene resin with the softening point of 95-105 ℃, so that the prepared pressure-sensitive adhesive has excellent high temperature resistance, the high temperature resistance can reach 55 ℃, namely, the phenomena of wiredrawing and glue opening can not occur in a summer high temperature state, meanwhile, the Fischer-Tropsch wax and the polyethylene wax with the specific proportion are added in the system, particularly the melting point of 95-102 ℃ and the penetration degree of 5-8mm, and the softening point of the polyethylene wax is 105-115 ℃ and the viscosity of 140 ℃ is 20-40CPs, so that the pressure-sensitive hot-melt adhesive has excellent high temperature resistance, and the low temperature resistance is greatly improved, and is suitable for most of environments.
Detailed Description
The invention will be further described with reference to specific embodiments, and advantages and features of the invention will become apparent from the description. These examples are merely exemplary and do not limit the scope of the invention in any way. It will be understood by those skilled in the art that various changes and substitutions of details and forms of the technical solution of the present invention may be made without departing from the spirit and scope of the present invention, but these changes and substitutions fall within the scope of the present invention.
In order to achieve the above purpose, the invention provides a high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid, thermoplastic butylbenzene segmented copolymer and antioxidant.
In some preferred embodiments, the pressure sensitive hot melt adhesive comprises the following raw materials in parts by weight: 8-30 parts of mineral oil, 5-20 parts of wax, 10-35 parts of thermoplastic resin, 15-35 parts of diterpenoid compound, 15-25 parts of thermoplastic styrene-butadiene block copolymer and 0.1-0.5 part of antioxidant.
Preferably, the pressure-sensitive hot melt adhesive comprises the following raw materials in parts by weight: 10-23 parts of mineral oil, 10-16 parts of wax, 20-32 parts of thermoplastic resin, 20-30 parts of diterpenoid compound, 17-22 parts of thermoplastic styrene-butadiene block copolymer and 0.2-0.4 part of antioxidant.
In some preferred embodiments, the weight ratio of thermoplastic resin to diterpenoid is 1: (1-1.5).
Preferably, the weight ratio of the thermoplastic resin to the diterpenoid compound is 1.2:1.
in some preferred embodiments, the wax comprises a fischer-tropsch wax and/or a polyethylene wax.
Preferably, the wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio is 1: (1-2).
More preferably, the wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio is 1:1.75.
in some preferred embodiments, the Fischer-Tropsch wax has a melting point of 92-110℃and a penetration of 4-10mm.
Preferably, the Fischer-Tropsch wax has a melting point of 95-102 ℃ and a penetration of 5-8mm.
More preferably, the Fischer-Tropsch wax is available from Ningbo Meta Huntime wax Co., ltd, model number Sier YH-100.
In some preferred embodiments, the polyethylene wax has a softening point of 100 to 120 ℃ and a viscosity of 20 to 40cps at 140 ℃.
Preferably, the polyethylene wax has a softening point of 100-120 ℃ and a viscosity of 10-60cps at 140 ℃.
More preferably, the polyethylene wax has a softening point of 105 to 115℃and a viscosity of 20 to 40cps at 140 ℃.
Further preferably, the polyethylene wax is available from Ji Linshi, di Chemicals, inc. under the model 1022.
In some preferred embodiments, the thermoplastic resin has a number average molecular weight of 300 to 3000.
In some preferred embodiments, the thermoplastic resin has a softening point of 95-115℃and a melt viscosity of 290CP or less at 200 ℃.
Preferably, the thermoplastic resin has a softening point of 100-110 ℃ and a melt viscosity of 280CP or less at 200 ℃.
More preferably, the thermoplastic resin is hydrogenated C9 petroleum resin.
Further preferably, the hydrogenated C9 petroleum resin is selected from Puyang Hengfeng petrochemical Co., ltd, model number FST-F1110.
In some preferred embodiments, the diterpenoid compounds have a softening point of 90-110 ℃.
Preferably, the softening point of the diterpenoid compound is 95-105 ℃.
More preferably, the diterpenoid compound is a terpene resin.
Further preferably, the terpene resin is available from Henan Jiesman petrochemical industry under the model KD-1100T.
In some preferred embodiments, the thermoplastic styrene-butadiene block copolymer is a styrene-butadiene-styrene triblock copolymer having a styrene content of 28 to 34wt%.
Preferably, the styrene content of the styrene butadiene styrene triblock copolymer is 31wt%.
More preferably, the styrene butadiene styrene triblock copolymer is available under the brand name D1184 from Korea.
The common pressure-sensitive hot melt adhesive in the market has poor high temperature resistance, particularly when the temperature is higher than 40 ℃, wiredrawing and adhesive opening occur, and the pressure-sensitive hot melt adhesive is dried and formed into films at a relatively low speed in summer, so that the adhesive opening problem is easily caused in the drying process, the packaging quality is influenced, and besides, the high temperature resistance and the low temperature resistance of many pressure-sensitive hot melt adhesives in the market at present are not balanced. After a lot of researches, the applicant finds that when a thermoplastic resin and diterpenoid compounds are adopted in a system in a specific proportion, especially when the thermoplastic resin is hydrogenated C9 petroleum resin with a softening point of 100-110 ℃ and a melt viscosity of less than or equal to 280CP at 200 ℃, and the diterpenoid compounds are terpene resins with a softening point of 95-105 ℃, the prepared pressure-sensitive hot melt adhesive has excellent high temperature resistance, the high temperature resistance can reach 55 ℃, namely, the phenomena of wiredrawing and adhesive opening can not occur in a summer high temperature state, the applicant considers that possible reasons are that the adopted resin has more annular structures, so that the resin has higher softening point, the cohesive strength of the resin is higher, the prepared pressure-sensitive hot melt adhesive can also have a stable state in a high temperature environment, and meanwhile, the hydrogenated C9 petroleum resin has proper polarity, the adhesive has excellent compatibility with styrene butadiene styrene triblock copolymer, thus having excellent initial adhesive strength, further improving the problem of slower drying and film forming speed in summer, but the applicant finds that although the high temperature resistance of the pressure sensitive hot melt adhesive is obviously improved, the low temperature resistance of the adhesive is not satisfied, the brittleness of the adhesive layer is larger at the temperature lower than 0 ℃ and the adhesive is easy to be opened, the applicant surprisingly finds that when the Fischer-Tropsch wax and the polyethylene wax are added into the system in a specific proportion, particularly the Fischer-Tropsch wax has the melting point of 95-102 ℃ and the penetration degree of 5-8mm, the softening point of the polyethylene wax is 105-115 ℃ and the viscosity of the polyethylene wax is 20-40CPs at 140 ℃, the pressure sensitive hot melt adhesive has excellent high temperature resistance, the low temperature resistance is greatly improved, and the adhesive is satisfied for most air temperature environments, the applicant believes that the possible reasons are that the system has a suitable viscosity and good wettability due to the specific fischer-tropsch wax and polyethylene wax, and that the specific molecular structure imparts a higher low temperature flexibility to the pressure sensitive hot melt adhesive, thereby reducing brittleness at low temperatures and reducing cracking.
The invention is not particularly limited in the type of mineral oil available commercially, including but not limited to, from run chemical Co., ltd. In ataxia, model number 26#.
In some preferred embodiments, the antioxidants include antioxidant 168 and antioxidant 1076 in a weight ratio of 1: (0.7-1.2).
Preferably, the antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1:1.
the invention also provides a preparation process of the high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following steps:
(1) Adding mineral oil into a reaction kettle, and opening a turntable of the reaction kettle when the temperature is raised to 80-110 ℃; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all raw materials are completely dissolved to obtain a mixture A;
(2) Adding thermoplastic resin, diterpenoid compound and wax into the mixture A, uniformly mixing at 130-160deg.C, maintaining the temperature for 30-50min, cooling to 125-150deg.C, and discharging.
Example 1
On the one hand, the embodiment provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following raw materials in parts by weight: 16 parts of mineral oil, 14 parts of wax, 28.8 parts of thermoplastic resin, 24 parts of diterpenoid compound, 20 parts of styrene butadiene styrene triblock copolymer and 0.3 part of antioxidant.
The wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio is 1:1.75, wherein the Fischer-Tropsch wax is purchased from Ningbo Meta Huntime wax company, the model is Seer YH-100, the melting point of the Fischer-Tropsch wax is 95-102 ℃, the penetration is 5-8mm, the polyethylene wax is purchased from Ji Linshi Dragon light chemical company, the model is 1022, the softening point of the polyethylene wax is 105-115 ℃, and the viscosity at 140 ℃ is 20-40cps.
The thermoplastic resin is hydrogenated C9 petroleum resin, is purchased from Puyang Hengfeng petrochemical Co Ltd, and is of the model of FST-F1110, the softening point is 100-110 ℃, and the melt viscosity at 200 ℃ is less than or equal to 280CP.
The diterpenoid compound is terpene resin, is purchased from Henan Jiesman petrochemical industry, and has model KD-1100T and softening point of 95-105 ℃.
The styrene butadiene styrene triblock copolymer has the brand name of Koteng, model D1184 and the styrene content of 31 weight percent.
The mineral oil is purchased from Jinan Runchang chemical industry Co., ltd, model number 26#.
The antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1:1.
on the other hand, the embodiment provides a preparation process of the high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following steps:
(1) Adding mineral oil into a reaction kettle, and starting a turntable of the reaction kettle when the temperature is raised to 95 ℃; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all raw materials are completely dissolved to obtain a mixture A;
(2) Adding thermoplastic resin, diterpenoid compound and wax into the mixture A, uniformly mixing at 145 ℃, preserving heat for 45min at the temperature, and finally cooling to 138 ℃, and discharging to obtain the modified polyethylene.
Example 2
On the one hand, the embodiment provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following raw materials in parts by weight: 8 parts of mineral oil, 5 parts of wax, 10 parts of thermoplastic resin, 15 parts of diterpenoid compound, 15 parts of styrene butadiene styrene triblock copolymer and 0.1 part of antioxidant.
The wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio is 1:1, wherein the Fischer-Tropsch wax is purchased from Ningbo Yuan Henry wax industry Co., ltd, the model is Seer YH-100, the melting point of the Fischer-Tropsch wax is 95-102 ℃, the penetration is 5-8mm, the polyethylene wax is purchased from Ji Linshi Dragon light chemical Co., ltd, the model is 1022, the softening point of the polyethylene wax is 105-115 ℃, and the viscosity at 140 ℃ is 20-40cps.
The thermoplastic resin is hydrogenated C9 petroleum resin, is purchased from Puyang Hengfeng petrochemical Co Ltd, and is of the model of FST-F1110, the softening point is 100-110 ℃, and the melt viscosity at 200 ℃ is less than or equal to 280CP.
The diterpenoid compound is terpene resin, is purchased from Henan Jiesman petrochemical industry, and has model KD-1100T and softening point of 95-105 ℃.
The styrene butadiene styrene triblock copolymer has the brand name of Koteng, model D1184 and the styrene content of 31 weight percent.
The mineral oil is purchased from Jinan Runchang chemical industry Co., ltd, model number 26#.
The antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1:0.7.
on the other hand, the embodiment provides a preparation process of the high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following steps:
(1) Adding mineral oil into a reaction kettle, and starting a turntable of the reaction kettle when the temperature is raised to 95 ℃; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all raw materials are completely dissolved to obtain a mixture A;
(2) Adding thermoplastic resin, diterpenoid compound and wax into the mixture A, uniformly mixing at 145 ℃, preserving heat for 45min at the temperature, and finally cooling to 138 ℃, and discharging to obtain the modified polyethylene.
Example 3
On the one hand, the embodiment provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following raw materials in parts by weight: 30 parts of mineral oil, 20 parts of wax, 35 parts of thermoplastic resin, 35 parts of diterpenoid compound, 25 parts of styrene butadiene styrene triblock copolymer and 0.5 part of antioxidant.
The wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio is 1:2, the Fischer-Tropsch wax is purchased from Ningbo Yuan Henry wax industry Co., ltd, the model is Seer YH-100, the melting point of the Fischer-Tropsch wax is 95-102 ℃, the penetration is 5-8mm, the polyethylene wax is purchased from Ji Linshi Dragon light chemical Co., ltd, the model is 1022, the softening point of the polyethylene wax is 105-115 ℃, and the viscosity at 140 ℃ is 20-40cps.
The thermoplastic resin is hydrogenated C9 petroleum resin, is purchased from Puyang Hengfeng petrochemical Co Ltd, and is of the model of FST-F1110, the softening point is 100-110 ℃, and the melt viscosity at 200 ℃ is less than or equal to 280CP.
The diterpenoid compound is terpene resin, is purchased from Henan Jiesman petrochemical industry, and has model KD-1100T and softening point of 95-105 ℃.
The styrene butadiene styrene triblock copolymer has the brand name of Koteng, model D1184 and the styrene content of 31 weight percent.
The mineral oil is purchased from Jinan Runchang chemical industry Co., ltd, model number 26#.
The antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1:1.2.
on the other hand, the embodiment provides a preparation process of the high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following steps:
(1) Adding mineral oil into a reaction kettle, and starting a turntable of the reaction kettle when the temperature is raised to 95 ℃; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all raw materials are completely dissolved to obtain a mixture A;
(2) Adding thermoplastic resin, diterpenoid compound and wax into the mixture A, uniformly mixing at 145 ℃, preserving heat for 45min at the temperature, and finally cooling to 138 ℃, and discharging to obtain the modified polyethylene.
Example 4
The embodiment provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof, and the specific implementation mode is the same as the embodiment 1, wherein the wax does not comprise Fischer-Tropsch wax.
Example 5
The embodiment provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof, and the specific implementation mode is the same as the embodiment 1, wherein the weight ratio of Fischer-Tropsch wax to polyethylene wax is 1:2.5.
example 6
The embodiment is the same as the embodiment 1 in that the diterpenoid compound is terpene resin, is purchased from Henan Jiesman petrochemical industry, is model KD-1315T and has a softening point of 115-125 ℃.
Performance testing
1. High temperature resistance
The pressure-sensitive hot melt adhesives prepared in examples 1 to 6 were used for film-coating sealing and case-sealing, respectively, and then left in an environment at 55℃for 7 days, and the results were recorded in Table 1, as to whether or not the phenomena of stringing and adhesive opening were observed.
2. Low temperature resistance
The pressure-sensitive hot melt adhesives prepared in examples 1 to 6 were used for film sealing and case sealing, respectively, and then left in an environment at-15℃for 7 days, and the occurrence of cracking was observed, and the results are recorded in Table 1.
TABLE 1
| Examples numbering | High temperature resistance | Low temperature resistance |
| Example 1 | No wiredrawing and adhesive spreading | No cracking |
| Example 2 | No wiredrawing and adhesive spreading | No cracking |
| Example 3 | No wiredrawing and adhesive spreading | No cracking |
| Example 4 | No wiredrawing and adhesive spreading | Has obvious cracking |
| Example 5 | No wiredrawing and adhesive spreading | Has slight cracking |
| Example 6 | Has obvious wiredrawing and adhesive spreading | No cracking |
The technical means disclosed by the scheme of the invention is not limited to the technical means disclosed by the technical means, and also comprises the technical scheme formed by any combination of the technical features. While the foregoing is directed to embodiments of the present invention, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the invention, and such changes and modifications are intended to be included within the scope of the invention.
Claims (4)
1. The high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive is characterized by comprising the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid compound, thermoplastic styrene-butadiene block copolymer and antioxidant; the adhesive comprises the following raw materials in parts by weight: 8-30 parts of mineral oil, 5-20 parts of wax, 10-35 parts of thermoplastic resin, 15-35 parts of diterpenoid compound, 15-25 parts of SBS rubber and 0.1-0.5 part of antioxidant; the thermoplastic resin is hydrogenated C9 petroleum resin with a softening point of 100-110 ℃ and a melt viscosity of less than or equal to 280CP at 200 ℃, and the diterpenoid compound is terpene resin with a softening point of 95-105 ℃; the wax comprises Fischer-Tropsch wax and polyethylene wax; the Fischer-Tropsch wax has a melting point of 95-102 ℃, a penetration of 5-8mm, a softening point of 105-115 ℃ and a viscosity of 20-40cps at 140 ℃.
2. The high and low temperature resistant film seal pressure sensitive hot melt adhesive of claim 1 wherein said thermoplastic resin has a number average molecular weight of 300 to 3000.
3. The high and low temperature resistant film seal pressure sensitive hot melt adhesive of claim 1, wherein the thermoplastic styrene-butadiene block copolymer is a styrene butadiene styrene triblock copolymer having a styrene content of 28-34wt%.
4. A process for preparing the high and low temperature resistant film seal pressure sensitive hot melt adhesive according to any one of claims 1 to 3, comprising the steps of:
(1) Adding mineral oil into a reaction kettle, and opening a turntable of the reaction kettle when the temperature is raised to 80-110 ℃; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all raw materials are completely dissolved to obtain a mixture A;
(2) Adding thermoplastic resin, diterpenoid compound and wax into the mixture A, uniformly mixing at 130-160deg.C, maintaining the temperature for 30-50min, cooling to 125-150deg.C, and discharging.
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| CN111944463A (en) * | 2020-09-04 | 2020-11-17 | 上海路嘉胶粘剂有限公司 | Pressure-sensitive hot melt adhesive for sealing high-low temperature resistant PE express bag and preparation method thereof |
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| CN102020948A (en) * | 2009-09-15 | 2011-04-20 | 上海永冠胶粘制品有限公司 | High-temperature resistance hot melt glue |
| WO2014050490A1 (en) * | 2012-09-28 | 2014-04-03 | 日東電工株式会社 | Surface protective sheet |
| JP2014070105A (en) * | 2012-09-28 | 2014-04-21 | Nitto Denko Corp | Surface protection sheet |
| CN103540281B (en) * | 2013-10-21 | 2016-08-24 | 广东东方树脂有限公司 | A kind of quick-setting rubber-type PUR |
| JP6404563B2 (en) * | 2013-12-24 | 2018-10-10 | 積水フーラー株式会社 | Hot melt adhesive |
| CN106062117B (en) * | 2014-02-21 | 2018-01-05 | 株式会社Moresco | Hotmelt |
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