CN114874733A - High-low temperature resistant film-coated sealing pressure-sensitive hot melt adhesive and preparation process thereof - Google Patents

High-low temperature resistant film-coated sealing pressure-sensitive hot melt adhesive and preparation process thereof Download PDF

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Publication number
CN114874733A
CN114874733A CN202110696063.5A CN202110696063A CN114874733A CN 114874733 A CN114874733 A CN 114874733A CN 202110696063 A CN202110696063 A CN 202110696063A CN 114874733 A CN114874733 A CN 114874733A
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Prior art keywords
hot melt
melt adhesive
sensitive hot
pressure
low temperature
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CN202110696063.5A
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CN114874733B (en
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凌万青
胡小飞
肖建伟
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Shanghai Lujia Adhesive Co ltd
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Shanghai Lujia Adhesive Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

Abstract

The invention provides a high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof, wherein the preparation process comprises the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid compound, thermoplastic butylbenzene segmented copolymer and antioxidant. According to the invention, the thermoplastic resin and the diterpenoid compound in a specific ratio are adopted, so that the prepared pressure-sensitive hot melt adhesive has excellent high temperature resistance, the high temperature resistance can reach 55 ℃, namely, the phenomena of wire drawing and glue opening can not occur in a high-temperature state in summer, and simultaneously, the Fischer-Tropsch wax and the polyethylene wax in a specific ratio are added into the system, so that the pressure-sensitive hot melt adhesive not only has excellent high temperature resistance, but also greatly improves the low temperature resistance, and the pressure-sensitive hot melt adhesive can be used in most air temperature environments.

Description

High-low temperature resistant film-coated sealing pressure-sensitive hot melt adhesive and preparation process thereof
Technical Field
The invention relates to the field of adhesives, in particular to a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof.
Background
The laminated paper box or paper box in the paper package is sealed or sealed, because the paper can not be adhered with the general EVA hot melt adhesive of the film, the pressure-sensitive hot melt adhesive is needed, but the general pressure-sensitive hot melt adhesive has poor high temperature resistance, especially when the temperature is higher than 40 ℃, the phenomena of wire drawing and glue opening can occur, and the speed of drying and film forming of the pressure-sensitive hot melt adhesive in summer is slower, so the problem of glue opening is easily caused in the drying process, the packaging quality is influenced, in addition, the high temperature resistance and the low temperature resistance of many pressure-sensitive hot melt adhesives on the market at present can not be balanced.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid compound, thermoplastic butylbenzene segmented copolymer and antioxidant.
As a preferable technical scheme, the pressure-sensitive hot melt adhesive comprises the following raw materials in parts by weight: 8-30 parts of mineral oil, 5-20 parts of wax, 10-35 parts of thermoplastic resin, 15-35 parts of diterpenoid compound, 15-25 parts of SBS rubber and 0.1-0.5 part of antioxidant.
As a preferred solution, the wax comprises a fischer-tropsch wax and/or a polyethylene wax.
As a preferable technical scheme, the melting point of the Fischer-Tropsch wax is 92-110 ℃, and the penetration degree is 4-10 mm.
As a preferable technical scheme, the softening point of the polyethylene wax is 100-120 ℃, and the viscosity at 140 ℃ is 10-60 cps.
As a preferable technical scheme, the number average molecular weight of the thermoplastic resin is 300-3000.
As a preferable technical proposal, the softening point of the thermoplastic resin is 95-115 ℃, and the melt viscosity at 200 ℃ is less than or equal to 290 CP.
As a preferred technical scheme, the softening point of the diterpenoid compound is 90-110 ℃.
As a preferred technical scheme, the thermoplastic styrene-butadiene block copolymer is a styrene-butadiene-styrene triblock copolymer, and the styrene content of the styrene-butadiene-styrene triblock copolymer is 28-34 wt%.
The invention also provides a preparation process of the high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following steps:
(1) adding mineral oil into a reaction kettle, heating to 80-110 ℃, and starting a reaction kettle turntable; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all the raw materials are completely dissolved to obtain a mixture A;
(2) adding thermoplastic resin, diterpenoid compounds and wax into the mixture A, uniformly mixing at the temperature of 130-160 ℃, preserving the heat for 30-50min under the condition, and finally discharging when the temperature is reduced to 125-150 ℃ to obtain the material.
Has the advantages that:
the system of the invention adopts the thermoplastic resin and the diterpenoid compound with specific proportion, in particular to hydrogenated C9 petroleum resin with the softening point of 100-110 ℃ and the melting viscosity of 200 ℃ of less than or equal to 280CP, when the diterpenoid compound is terpene resin with the softening point of 95-105 ℃, the pressure-sensitive adhesive prepared has excellent high temperature resistance, the high temperature resistance temperature can reach 55 ℃, namely, the phenomena of wire drawing and glue opening can not occur in the high temperature state in summer, simultaneously, Fischer-Tropsch wax and polyethylene wax with specific proportion are added into the system, in particular the melting point of the Fischer-Tropsch wax is 95-102 ℃, the needle penetration degree is 5-8mm, the softening point of the polyethylene wax is 105-115 ℃, when the viscosity of 140 ℃ is 20-40CPs, the pressure-sensitive hot melt adhesive has the excellent high temperature resistance, and the low temperature resistance is greatly improved, so that the material can be used in most of temperature environments.
Detailed Description
The invention will be further described with reference to specific embodiments, and the advantages and features of the invention will become apparent as the description proceeds. These examples are illustrative only and do not limit the scope of the present invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications may be made without departing from the spirit and scope of the invention.
In order to achieve the purpose, the invention provides a high-low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive which comprises the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid compound, thermoplastic butylbenzene segmented copolymer and antioxidant.
In some preferred embodiments, the pressure-sensitive hot melt adhesive comprises the following raw materials in parts by weight: 8-30 parts of mineral oil, 5-20 parts of wax, 10-35 parts of thermoplastic resin, 15-35 parts of diterpenoid compound, 15-25 parts of thermoplastic butylbenzene segmented copolymer and 0.1-0.5 part of antioxidant.
Preferably, the pressure-sensitive hot melt adhesive comprises the following raw materials in parts by weight: 10-23 parts of mineral oil, 10-16 parts of wax, 20-32 parts of thermoplastic resin, 20-30 parts of diterpenoid compound, 17-22 parts of thermoplastic butylbenzene segmented copolymer and 0.2-0.4 part of antioxidant.
In some preferred embodiments, the weight ratio of the thermoplastic resin to the diterpenoid compound is 1: (1-1.5).
Preferably, the weight ratio of the thermoplastic resin to the diterpenoid compound is 1.2: 1.
in some preferred embodiments, the wax comprises a fischer-tropsch wax and/or a polyethylene wax.
Preferably, the wax comprises fischer-tropsch wax and polyethylene wax, and the weight ratio is 1: (1-2).
More preferably, the wax comprises fischer-tropsch wax and polyethylene wax, and the weight ratio is 1: 1.75.
in some preferred embodiments, the Fischer-Tropsch wax has a melting point of 92 to 110 ℃ and a penetration of 4 to 10 mm.
Preferably, the melting point of the Fischer-Tropsch wax is 95-102 ℃ and the penetration degree is 5-8 mm.
More preferably, the Fischer-Tropsch wax is available from Ningbo Henry wax, Inc. under the model Seal YH-100.
In some preferred embodiments, the polyethylene wax has a softening point of 100-120 ℃ and a viscosity of 20-40cps at 140 ℃.
Preferably, the polyethylene wax has a softening point of 100-120 ℃ and a viscosity of 10-60cps at 140 ℃.
More preferably, the polyethylene wax has a softening point of 105-115 ℃ and a viscosity of 20-40cps at 140 ℃.
More preferably, the polyethylene wax is purchased from Jilin, Longh chemical Co., Ltd, and the model is 1022.
In some preferred embodiments, the number average molecular weight of the thermoplastic resin is 300-3000.
In some preferred embodiments, the thermoplastic resin has a softening point of 95 to 115 ℃ and a melt viscosity of 290CP or less at 200 ℃.
Preferably, the thermoplastic resin has a softening point of 100-110 ℃ and a melt viscosity of 280CP or less at 200 ℃.
More preferably, the thermoplastic resin is hydrogenated C9 petroleum resin.
Further preferably, the hydrogenated C9 petroleum resin is selected from Puyang Hengfeng petrochemical company, model number FST-F1110.
In some preferred embodiments, the diterpenoid has a softening point of 90-110 ℃.
Preferably, the diterpenoid compound has a softening point of 95-105 ℃.
More preferably, the diterpenoid compound is a terpene resin.
Further preferably, the terpene resin is purchased from the Henan Jieshman petrochemical industry and has the model of KD-1100T.
In some preferred embodiments, the thermoplastic styrene-butadiene block copolymer is a styrene butadiene styrene triblock copolymer having a styrene content of 28 to 34 wt%.
Preferably, the styrene content of the styrene butadiene styrene triblock copolymer is 31 wt%.
More preferably, the styrene butadiene styrene triblock copolymer is the american kraton brand with model D1184.
The general pressure-sensitive hot melt adhesive on the market has poor high temperature resistance, particularly, when the temperature is higher than 40 ℃, the phenomena of wire drawing and adhesive failure can occur, and the speed of drying and film forming of the pressure-sensitive hot melt adhesive in summer is slow, so that the problem of adhesive failure is easily caused in the drying process, the packaging quality is influenced, and in addition, the high temperature resistance and the low temperature resistance of many pressure-sensitive hot melt adhesives on the market at present can not be balanced. After a great deal of research, the applicant finds that when a thermoplastic resin and a diterpenoid compound in a specific proportion are adopted in a system, particularly when the thermoplastic resin is hydrogenated C9 petroleum resin with the softening point of 100-110 ℃ and the melt viscosity of 200 ℃ of less than or equal to 280CP, and the diterpenoid compound is terpene resin with the softening point of 95-105 ℃, the prepared pressure-sensitive hot melt adhesive has excellent high-temperature resistance, so that the high-temperature resistance temperature of the pressure-sensitive hot melt adhesive can reach 55 ℃, namely, the phenomena of wire drawing and glue opening can not occur in the high-temperature state in summer, the applicant considers that the possible reason is that the adopted resin has more annular structures, so that the adopted resin has higher softening point, the cohesive strength of the resin is higher, the prepared pressure-sensitive hot melt adhesive can also have a stable state in the high-temperature environment, and meanwhile, the hydrogenated C9 petroleum resin has proper polarity, the heat-resistant adhesive can generate excellent compatibility with a styrene butadiene styrene triblock copolymer, so that the heat-resistant adhesive has excellent initial adhesion strength, and further solves the problem of slow film forming speed in summer, but the applicant finds that although the high temperature resistance of the pressure-sensitive hot melt adhesive is obviously improved, the low temperature resistance of the pressure-sensitive hot melt adhesive cannot be met, the adhesive layer has high brittleness at the temperature lower than 0 ℃ and is easy to crack, and the applicant surprisingly finds that when Fischer-Tropsch wax and polyethylene wax are added into the system in a specific ratio, particularly the melting point of the Fischer-Tropsch wax is 95-102 ℃, the penetration degree is 5-8mm, the softening point of the polyethylene wax is 105-115 ℃, and when the viscosity at 140 ℃ is 20-40cps, the pressure-sensitive hot melt adhesive not only has excellent high temperature resistance, but also greatly improves the low temperature resistance, so that the pressure-sensitive hot melt adhesive can be used in most air temperature environments, the applicant believes that the possible reasons are that the system has a suitable viscosity and good wettability due to the specific fischer-tropsch wax and polyethylene wax, and that the specific molecular structure gives the pressure-sensitive hot melt adhesive a higher low temperature flexibility, thereby reducing brittleness at low temperatures and reducing cracking.
The type of mineral oil is not particularly limited, and the mineral oil is commercially available, including but not limited to, 26# available from Jinnanchang chemical Co., Ltd.
In some preferred embodiments, the antioxidant comprises antioxidant 168 and antioxidant 1076 in a weight ratio of 1: (0.7-1.2).
Preferably, the antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1: 1.
the invention also provides a preparation process of the high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which comprises the following steps:
(1) adding mineral oil into a reaction kettle, heating to 80-110 ℃, and starting a reaction kettle turntable; adding an antioxidant and a styrene-butadiene-styrene triblock copolymer, and stirring until all the raw materials are completely dissolved to obtain a mixture A;
(2) adding thermoplastic resin, diterpenoid compounds and wax into the mixture A, uniformly mixing at the temperature of 130-160 ℃, preserving the heat for 30-50min under the condition, and finally discharging when the temperature is reduced to 125-150 ℃ to obtain the material.
Example 1
This embodiment provides a high low temperature resistant tectorial membrane on the one hand and seals pressure-sensitive hot melt adhesive, according to parts by weight, the raw materials ratio is specifically as follows: 16 parts of mineral oil, 14 parts of wax, 28.8 parts of thermoplastic resin, 24 parts of diterpenoid compound, 20 parts of styrene-butadiene-styrene triblock copolymer and 0.3 part of antioxidant.
The wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio of the Fischer-Tropsch wax to the polyethylene wax is 1: 1.75, the Fischer-Tropsch wax is purchased from Ningbo Henry wax Co., Ltd, the model is Seal YH-100, the melting point of the Fischer-Tropsch wax is 95-102 ℃, the needle penetration is 5-8mm, the polyethylene wax is purchased from Longchen chemical Co., Ltd, the model is 1022, the softening point of the polyethylene wax is 105-115 ℃, and the viscosity at 140 ℃ is 20-40 cps.
The thermoplastic resin is hydrogenated C9 petroleum resin which is purchased from Puyang Hengfeng petrochemical company Limited, and has the model of FST-F1110, the softening point of 100-.
The diterpenoid is terpene resin, which is purchased from Henan Jieshiman petrochemical engineering, and has the model of KD-1100T and the softening point of 95-105 ℃.
The styrene butadiene styrene triblock copolymer was a American Keteng brand, model number D1184, and had a styrene content of 31 wt%.
The mineral oil is purchased from Jinnan Runchang chemical Co., Ltd, and has a model number of 26.
The antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1: 1.
another aspect of this embodiment provides a preparation process of a high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which includes the following steps:
(1) adding mineral oil into a reaction kettle, heating to 95 ℃, and starting a reaction kettle turntable; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all the raw materials are completely dissolved to obtain a mixture A;
(2) adding thermoplastic resin, diterpenoid compounds and wax into the mixture A, uniformly mixing at 145 ℃, keeping the temperature for 45min, and finally cooling to 138 ℃, and discharging to obtain the product.
Example 2
This embodiment provides a high low temperature resistant tectorial membrane on the one hand and seals pressure-sensitive hot melt adhesive, according to parts by weight, the raw materials ratio is specifically as follows: 8 parts of mineral oil, 5 parts of wax, 10 parts of thermoplastic resin, 15 parts of diterpenoid compound, 15 parts of styrene butadiene styrene triblock copolymer and 0.1 part of antioxidant.
The wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio of the Fischer-Tropsch wax to the polyethylene wax is 1: 1, the Fischer-Tropsch wax is purchased from Ningbo Henry wax Co., Ltd, the model is Seal YH-100, the melting point of the Fischer-Tropsch wax is 95-102 ℃, the needle penetration is 5-8mm, the polyethylene wax is purchased from Longchen chemical engineering Co., Ltd, the model is 1022, the softening point of the polyethylene wax is 105-115 ℃, and the viscosity at 140 ℃ is 20-40 cps.
The thermoplastic resin is hydrogenated C9 petroleum resin which is purchased from Puyang Hengfeng petrochemical company Limited, and has the model of FST-F1110, the softening point of 100-.
The diterpenoid is terpene resin, which is purchased from Henan Jieshiman petrochemical engineering, and has the model of KD-1100T and the softening point of 95-105 ℃.
The styrene butadiene styrene triblock copolymer was a American Keteng brand, model number D1184, and had a styrene content of 31 wt%.
The mineral oil is purchased from Jinnan Runchang chemical Co., Ltd, and has a model number of 26.
The antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1: 0.7.
another aspect of this embodiment provides a preparation process of a high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which includes the following steps:
(1) adding mineral oil into a reaction kettle, heating to 95 ℃, and starting a reaction kettle turntable; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all the raw materials are completely dissolved to obtain a mixture A;
(2) adding thermoplastic resin, diterpenoid compounds and wax into the mixture A, uniformly mixing at 145 ℃, keeping the temperature for 45min, and finally cooling to 138 ℃, and discharging to obtain the product.
Example 3
This embodiment provides a high low temperature resistant tectorial membrane on the one hand and seals pressure-sensitive hot melt adhesive, according to parts by weight, the raw materials ratio is specifically as follows: 30 parts of mineral oil, 20 parts of wax, 35 parts of thermoplastic resin, 35 parts of diterpenoid compound, 25 parts of styrene butadiene styrene triblock copolymer and 0.5 part of antioxidant.
The wax comprises Fischer-Tropsch wax and polyethylene wax, and the weight ratio of the Fischer-Tropsch wax to the polyethylene wax is 1: 2, the Fischer-Tropsch wax is purchased from Ningbo Henghao wax industry Co., Ltd, the model is Seal YH-100, the melting point of the Fischer-Tropsch wax is 95-102 ℃, the needle penetration is 5-8mm, the polyethylene wax is purchased from Runella chemical Co., Ltd, the model is 1022, the softening point of the polyethylene wax is 105-115 ℃, and the viscosity at 140 ℃ is 20-40 cps.
The thermoplastic resin is hydrogenated C9 petroleum resin which is purchased from Puyang Hengfeng petrochemical company Limited, and has the model of FST-F1110, the softening point of 100-.
The diterpenoid is terpene resin, which is purchased from Henan Jieshiman petrochemical engineering, and has the model of KD-1100T and the softening point of 95-105 ℃.
The styrene butadiene styrene triblock copolymer was a American Keteng brand, model number D1184, and had a styrene content of 31 wt%.
The mineral oil is purchased from Jinnan Runchang chemical Co., Ltd, and has a model number of 26.
The antioxidant comprises an antioxidant 168 and an antioxidant 1076, and the weight ratio is 1: 1.2.
another aspect of this embodiment provides a preparation process of a high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive, which includes the following steps:
(1) adding mineral oil into a reaction kettle, heating to 95 ℃, and starting a reaction kettle turntable; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all the raw materials are completely dissolved to obtain a mixture A;
(2) adding thermoplastic resin, diterpenoid compounds and wax into the mixture A, mixing uniformly at 145 deg.C, maintaining the temperature for 45min, cooling to 138 deg.C, and discharging.
Example 4
The embodiment provides a high-temperature and low-temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof, and the specific implementation manner is the same as that of embodiment 1, except that the wax does not contain Fischer-Tropsch wax.
Example 5
The embodiment provides a high-low temperature resistant laminating sealing pressure-sensitive hot melt adhesive and a preparation process thereof, and the specific implementation manner is the same as that of embodiment 1, and the difference is that the weight ratio of the Fischer-Tropsch wax to the polyethylene wax is 1: 2.5.
example 6
The embodiment provides a high-temperature and low-temperature resistant film-covered sealing pressure-sensitive hot melt adhesive and a preparation process thereof, and the specific implementation manner is the same as that of embodiment 1, and the difference is that the diterpenoid compound is terpene resin, is purchased from Henan Jieshiman petrochemical, and has the model number of KD-1315T and the softening point of 115-125 ℃.
Performance testing
1. High temperature resistance
The pressure-sensitive hot melt adhesives prepared in examples 1 to 6 were used for film-covering, sealing and case-sealing, and then left to stand in an environment at a temperature of 55 ℃ for 7 days, and whether or not there were stringiness and adhesive failure was observed, and the results are recorded in table 1.
2. Low temperature resistance
The pressure-sensitive hot melt adhesives prepared in examples 1 to 6 were used for film-covering, sealing and case-sealing, and then left to stand at-15 ℃ for 7 days, and whether or not there was a cracking phenomenon was observed, and the results are recorded in table 1.
TABLE 1
Example numbering High temperature resistance Low temperature resistance
Example 1 No wire drawing and no glue cracking Without cracking
Example 2 No wire drawing and no glue cracking Without cracking
Example 3 No wire drawing and no glue cracking Without cracking
Example 4 No wire drawing and no glue cracking With obvious cracking
Example 5 No wire drawing and no glue cracking Has slight crack
Example 6 Has obvious wiredrawing and glue-stripping Without cracking
The technical means disclosed by the scheme of the invention are not limited to the technical means disclosed by the technical means, and the technical scheme also comprises the technical scheme formed by any combination of the technical characteristics. While the foregoing is directed to embodiments of the present invention, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the principles of the invention, and it is intended that all such changes and modifications be considered as within the scope of the invention.

Claims (10)

1. The high-low temperature resistant laminating sealing pressure-sensitive hot melt adhesive is characterized by comprising the following raw materials: mineral oil, wax, thermoplastic resin, diterpenoid compound, thermoplastic butylbenzene segmented copolymer and antioxidant.
2. The high and low temperature resistant film-covered sealing pressure-sensitive hot melt adhesive according to claim 1, which is characterized by comprising the following raw materials in parts by weight: 8-30 parts of mineral oil, 5-20 parts of wax, 10-35 parts of thermoplastic resin, 15-35 parts of diterpenoid compound, 15-25 parts of SBS rubber and 0.1-0.5 part of antioxidant.
3. The pressure-sensitive hot melt adhesive for high and low temperature resistant film seals according to claim 2, wherein the wax comprises Fischer-Tropsch wax and/or polyethylene wax.
4. The pressure-sensitive hot melt adhesive for high and low temperature resistant film-covered seals according to claim 3, wherein the melting point of the Fischer-Tropsch wax is 92-110 ℃, and the penetration degree is 4-10 mm.
5. The pressure-sensitive hot melt adhesive for high and low temperature resistant film covered seals according to claim 3, wherein the softening point of the polyethylene wax is 100-120 ℃, and the viscosity at 140 ℃ is 10-60 cps.
6. The pressure-sensitive hot melt adhesive for high and low temperature resistant film-covered seals according to any one of claims 1 to 5, wherein the number average molecular weight of the thermoplastic resin is 300-3000.
7. The pressure-sensitive hot melt adhesive for high and low temperature resistant film-covered seals according to claim 6, characterized in that the softening point of the thermoplastic resin is 95-115 ℃, and the melt viscosity at 200 ℃ is not more than 290 CP.
8. The pressure-sensitive hot melt adhesive for high and low temperature resistant film seals according to claim 6, wherein the diterpenoid compound has a softening point of 90-110 ℃.
9. The pressure-sensitive hot melt adhesive for high and low temperature resistant film seals according to claim 1, wherein the thermoplastic styrene-butadiene block copolymer is styrene-butadiene-styrene triblock copolymer, and the styrene content in the styrene-butadiene-styrene triblock copolymer is 28-34 wt%.
10. The preparation process of the high and low temperature resistant film-coated modified pressure-sensitive hot melt adhesive according to any one of claims 1 to 9, characterized by comprising the following steps:
(1) adding mineral oil into a reaction kettle, heating to 80-110 ℃, and starting a reaction kettle turntable; adding an antioxidant and a styrene butadiene styrene triblock copolymer, and stirring until all the raw materials are completely dissolved to obtain a mixture A;
(2) adding thermoplastic resin, diterpenoid compounds and wax into the mixture A, uniformly mixing at the temperature of 130-160 ℃, preserving the heat for 30-50min under the condition, and finally discharging when the temperature is reduced to 125-150 ℃ to obtain the material.
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Citations (7)

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CN102020948A (en) * 2009-09-15 2011-04-20 上海永冠胶粘制品有限公司 High-temperature resistance hot melt glue
WO2014050490A1 (en) * 2012-09-28 2014-04-03 日東電工株式会社 Surface protective sheet
JP2014070105A (en) * 2012-09-28 2014-04-21 Nitto Denko Corp Surface protection sheet
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JP2015120825A (en) * 2013-12-24 2015-07-02 積水フーラー株式会社 Hot melt adhesive
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