JP4282720B2 - Laser processing apparatus and laser processing method - Google Patents

Description

  The present invention relates to a laser processing apparatus that performs two-dimensional scanning of a laser beam using a biaxial galvanometer and a laser processing method using the laser processing apparatus.

  In the laser processing apparatus including the two-axis galvanometer 13 (x-axis direction galvanometer 13 a and y-axis direction galvanometer 13 b) and the fθ lens 15 shown in FIG. 22, two-dimensional scanning of the laser beam 11 is possible on the workpiece 17. is there. A laser beam 11 oscillated from the laser oscillator 10 is processed through a reflection mirror 12, a galvanometer mirror 14 (the laser beam 11 is incident in the order of the x-axis galvanometer mirror 14a and the y-axis galvanometer mirror 14b), and an fθ lens 15. The object 17 is irradiated. A quadrangle on the workpiece 17 is a scannable area 16 limited by the galvanometer 13 and the fθ lens 15, and the laser beam 11 can be positioned at an arbitrary position in this area, and laser processing is performed.

  The entire area of the workpiece 17 is processed by moving the workpiece 17 placed on the table 18 by the table driving mechanism 19 within a two-dimensional plane (XY plane) and moving the scannable area 16. Is possible. The drive axes by the table drive mechanism 19 are assumed to be the X axis and the Y axis, respectively. When only one of the two-axis galvanometers 13 is scanned, the axes drawn on the workpiece 17 are the x-axis and the y-axis, respectively.

  In the laser processing apparatus including the biaxial galvanometer 13 and the fθ lens 15 shown in FIG. 22, both the x-axis galvanometer 13a and the y-axis galvanometer 13b are scanned as described in Patent Documents 1 to 3. When the angles are shaken by the same pitch and the same width, the originally expected square lattice pattern cannot be drawn on the workpiece 17 and becomes a distorted pattern. For this reason, in order to process a desired position, fitting with various correction formulas such as a polynomial is performed on a distorted pattern that is actually drawn to perform correction control of the scan angle.

The following problems 1 to 5 are cited as factors for positioning errors of the laser beam 11, that is, factors for distorting the square lattice pattern.
Problem 1: Pincushion distortion caused by the 2-axis galvanometer 13 scanning the x-axis and the y-axis separately.
Problem 2: Distortion aberration (linearity distortion) caused by the fθ characteristic of the fθ lens 15.
Problem 3: An orthogonal relationship shift (orthogonal shift) between the x-axis and the y-axis on the workpiece 17 by the galvanometer 13.
Problem 4: A parallel shift (rotational shift) between the xy axis on the workpiece 17 by the galvanometer 13 and the XY axis by the table drive mechanism 19.
Problem 5: Deviation (offset deviation) between the origin of the xy axis on the workpiece 17 by the galvanometer 13 and the intersection of the optical axis (center axis, center) of the fθ lens 15 and the workpiece 17.

The problems 1 and 2 are fundamental positioning errors caused by using the biaxial galvanometer 13 and the fθ lens 15, and the problems 3 to 5 are positioning errors caused by manufacturing errors. Note that the offset deviation of the problem 5 can be dealt with by offsetting the workpiece 17 and therefore does not usually cause a problem.
In order to correct the distortions of the problems 1 to 4 and improve the positioning accuracy of the laser beam 11, the scan angle correction control as described in Patent Documents 1 to 3 is performed, which is fitting. Therefore, even after correction, the positioning error cannot be made completely zero.
Incidentally, with the recent progress of precision and miniaturization of processing, higher laser beam positioning accuracy is required.
Japanese Patent No. 2616990 JP-A-7-164169 Japanese Patent Laid-Open No. 10-301052

  Although it is possible to correct the distortion of the problems 1 to 4 and improve the positioning accuracy of the laser beam 11 by the correction control of the scan angle of the galvanometer 13, the manufacturing error is large and the positioning of the problems 3 and 4 is large. When the error is large, the corrected positioning accuracy is worse than when the manufacturing error is small. That is, if the manufacturing error is large, the positioning error is large even after correction.

In order to perform positioning within a desired allowable error range in response to higher accuracy, a higher-order term is required, for example, in a correction equation composed of a polynomial expression. As a result, it is necessary to increase the number of grid points used for correction, and it takes time to measure positioning errors and calculate correction coefficients.
An object of the present invention is to provide a laser processing apparatus and a laser processing method that realize positioning within an allowable error range without increasing the number of grid points used for correction even when a manufacturing error is large.

  A laser processing apparatus according to the present invention includes an x-axis galvanometer, a y-axis galvanometer, and an fθ lens, and includes a two-dimensional scan system that performs two-dimensional scanning of a laser beam oscillated from a laser oscillator. In the two-dimensional scanning system, the x-axis galvanometer includes a rotation axis of the x-axis galvanometer and an incident optical axis of the laser beam incident on an x-axis galvanometer mirror constituting the x-axis galvanometer. An x-scanner position adjusting mechanism for adjusting the position in the plane formed, the y-axis galvanometer, the rotation axis of the y-axis galvanometer, and the optical axis of the reflected light in the y-axis galvanometer mirror constituting the y-axis galvanometer In the y-axis direction when the fθ lens passes through the center. A y-scanner position adjusting mechanism that adjusts the position in a plane formed by the incident optical axis of the laser beam incident on the laser beam.

  The laser processing apparatus according to the present invention includes a two-dimensional scan system that includes an x-axis direction galvanometer, a y-axis direction galvanometer, and an fθ lens, and performs a two-dimensional scan of a laser beam oscillated from a laser oscillator. In the two-dimensional scanning system, the y-axis galvanometer includes a rotation axis of the y-axis galvanometer and an optical axis of reflected light in a y-axis galvanometer mirror constituting the y-axis galvanometer. The position is adjusted within a plane formed by the incident optical axis of the laser beam incident on the y-axis galvanometer mirror when passing through the center of the y-axis galvanometer, and the y-axis galvanometer is a plane perpendicular to the incident optical axis. It is equipped with a y-scanner position adjustment mechanism that adjusts the position within.

  Furthermore, the laser processing method according to the present invention includes a step of laser processing a workpiece using the laser processing apparatus described above.

  According to the laser processing apparatus of the present invention, the tilt of the rotation axis of the x-axis galvanometer can be adjusted by the x scanner position adjustment mechanism, and the rotation axis of the y-axis galvanometer can be adjusted by the y scanner position adjustment mechanism. Since the tilt can be adjusted, the correction accuracy of the laser beam irradiation position can be improved.

  Also, according to the laser processing apparatus of the present invention, the y scanner position adjustment mechanism can rotate and adjust the tilt of the rotation axis of the y-axis galvanometer, so that the correction accuracy of the laser beam irradiation position can be improved. There is an effect of becoming.

  Furthermore, according to the laser processing method of the present invention, since the laser beam irradiation position is corrected using the above-described laser processing apparatus, there is an effect that highly accurate laser processing can be performed.

Embodiment 1 FIG.
Next, Embodiment 1 of the present invention will be described with reference to FIGS. Note that the structure of the laser processing apparatus shown in FIG. 22 is the same as the basic structure of the laser processing apparatus of the present invention. In FIGS. 1 to 18, the same reference numerals as those in FIG. The part is shown. In the two-dimensional scanning system including the two-axis galvanometer (scanner) 13 and the fθ lens 15 shown in FIG. 1, both the x-axis galvanometer (x scanner) 13a and the y-axis galvanometer (y scanner) 13b When (α and β in FIG. 1) are shaken by the same pitch and the same width, the arrival coordinates of the laser beam 11 on the workpiece 17 become a pattern shown by ● (black circle) in FIG. 2. Expected coordinates (hereinafter referred to as target coordinates) that are expected from the scan angle being swung at the same pitch and the same width are ◇ (white diamonds), and the pattern is an even pitch and square array. On the other hand, the pattern ● shows distortion and positioning error.

  Note that the angle α is an x value from a state where the x-axis galvanometer 13a is not scanning (when the neutral position and the y-axis galvanometer 13b are also neutral positions, the laser beam 11 passes through the center of the fθ lens 15). The scan angle in the X-axis direction of the laser beam 11 by the axial galvanometer 13a is shown. Similarly, the angle β is determined when the y-axis galvanometer 13b is not scanning (when the neutral position and the x-axis galvanometer 13a are also in the neutral position, the laser beam 11 passes through the center of the fθ lens 15). The scanning angle to the Y-axis direction of the laser beam 11 by the y-axis direction galvanometer 13b is shown.

In FIG. 2, since manufacturing errors such as mounting errors of the galvanometer 13 are ignored, the distortion of the pattern ● is the fundamental distortion due to the problems 1 and 2 (using the biaxial galvanometer 13 and the fθ lens 15). This is a principle positioning error caused by the above. When this distortion is fitted to a correction formula as described in Patent Documents 1 to 3 and the scan angle is corrected so that the arrival coordinate ● matches the target coordinate 座標, the pattern shown in FIG. 3 is obtained.
FIG. 4 represents the degree of the remaining positioning error (correction error) by redrawing each of the target coordinates ◇ in FIG. 3 at the origin O while overlapping the arrival coordinates ● (residual positioning after correction in FIG. 3). FIG. The error is magnified.

In the present invention, the following three types of manufacturing errors are assumed.
Manufacturing error 1: Neutral position error of galvano scan angle, that is, angular deviation (εa, εb) in the scan direction (turning direction) that exists even when scanning is not performed (see FIG. 5). In FIG. 5, the solid line side showing the galvanometer mirror 14 is the position of the galvanometer mirror 14 fixed to the galvanometer 13 in a state where the galvanometer 13 is angularly shifted, and the broken line side is arranged without error with respect to the XYZ coordinate axes. The position of the galvanometer mirror 14 fixed to the galvanometer 13 is shown. Regarding the subsequent manufacturing errors 2 and 3, the solid line side indicates an arrangement in which an error has occurred, and the broken line side indicates an arrangement with no error.

Manufacturing error 2: A mounting angle error of the galvanometer mirror 14 with respect to the rotating shaft 20 of the galvanometer 13 (surface tilt error, δa, δb) (see FIG. 6).
Manufacturing error 3: mounting error of the galvanometer 13, tilting of the rotating shaft 20 of the galvanometer 13 with respect to the XYZ coordinate axes of the entire two-dimensional scanning system shown in FIG. 1 (see FIG. 7). In FIG. 7, ψa is an angle obtained by measuring the direction in which the galvanometer rotating shaft 20a is tilted in the XY plane from the positive X-axis direction, and ψb is the direction in which the galvanometer rotating shaft 20b is tilted in the YZ plane. The angles measured from the negative axis are shown. Further, ωa and ωb indicate angles formed by the rotation axis before the x scanner 13a and the y scanner 13b fall and the rotation axis after the fall. In the drawing, the incident optical axis is indicated by a broken line 21. An incident optical axis incident on the x-axis direction galvano mirror 14a is denoted by reference numeral 21a, and an incident optical axis incident on the y-axis direction galvano mirror 14b is denoted by reference numeral 21b.

  FIG. 8 shows a pattern of arrival coordinates of the laser beam 11 corresponding to FIG. 2 when the manufacturing error 1 occurs. FIG. 8A shows a case where an error of the neutral position occurs in the scan angle of the x scanner 13a, and FIG. 8B shows a scan angle of the y scanner 13b. The pattern distortion shown in FIG. 2 is almost unchanged, and drifts from the origin O of the scan area. That is, the offset deviation of the problem 5 occurs.

  When the manufacturing error 2 occurs, the pattern of the arrival coordinates of the laser beam 11 corresponding to FIG. 2 is shown in FIG. FIG. 9A shows a case where a surface tilt error occurs in the galvanometer mirror 14 of the x scanner 13a, and FIG. 9 (a) and 9 (b), the offset shift of the task 5 is dominant, but in FIG. 9 (a), a slight inclination of the x axis with respect to the X axis, that is, the orthogonal shift of the task 3 occurs. . On the other hand, in FIG. 9B, the pattern is slightly rotated, that is, the rotational deviation of the problem 4 occurs.

  FIG. 10 shows a pattern of arrival coordinates of the laser beam 11 corresponding to FIG. 2 when the manufacturing error 3 occurs. FIG. 10A shows a case in which the x scanner 13a has fallen, and FIG. 10B shows a case in which the rotation shaft 20 of the y scanner 13b has fallen. However, the angles ψa and ψb shown in FIG. 7 are set to 0 deg (that is, the galvanometer 13 falls down (rotates) in the plane formed by the rotation axis 20 and the incident optical axis 21). 10 (a) and 10 (b), the offset deviation of the problem 5 occurs. In FIG. 10 (a), the x axis is slightly inclined with respect to the X axis, that is, the orthogonal deviation of the problem 3 is present. It has occurred. In FIG. 10B, the pattern is slightly rotated, that is, the rotational deviation of the problem 4 occurs.

  On the other hand, when the angles ψa and ψb shown in FIG. 7 are 90 degrees (that is, when the galvanometer 13 falls (rotates) in a plane perpendicular to the incident optical axis 21), the laser corresponding to FIG. The arrival coordinate pattern of the beam 11 is shown in FIG. FIG. 11A shows a case in which the x scanner 13a has fallen, and FIG. 11B shows a case in which the rotation shaft 20 of the y scanner 13b has fallen. In FIG. 11A, only the offset deviation of the problem 5 occurs, whereas in FIG. 11B, the slight inclination of the x axis with respect to the X axis, that is, the orthogonal deviation of the problem 3 occurs. .

  As described above, when the errors shown in the manufacturing errors 1 to 3 are combined with an arbitrary value, the pattern of the arrival coordinates of the laser beam 11 corresponding to FIG. 2 is as shown in FIG. However, since the offset deviation of the problem 5 can be dealt with by offsetting the workpiece 17, the origin O of the XY coordinate system is readjusted at the center point of the pattern of 9 points × 9 points of the arrival coordinates ●. Further, when the scan angle is corrected so that the arrival coordinate ● matches the target coordinate ◇ by the same correction formula as that used to derive FIG. 3 for the distortion of the pattern shown in FIG. FIG. 13 shows the degree of the remaining positioning error after correction corresponding to.

  Comparing FIG. 4 and FIG. 13, the degree of positioning error remaining after correction is larger in FIG. That is, when a manufacturing error such as the manufacturing errors 1 to 3 exists, there is no manufacturing error, and the remaining positioning after correction is compared with the case of only the fundamental distortion due to the problems 1 and 2. The error also increases. This is because FIG. 12, which is the pattern before correction, is flattened in a parallelogram shape (or rhombus shape) with respect to FIG. 2, and high-order components that cannot be expressed by the correction equation used are generated. is there.

  Therefore, in the first embodiment, a laser processing apparatus capable of correcting the irradiation position of the laser beam for correcting the flat shape of the parallelogram (or rhombus) as shown in FIG. 12 will be described. The flattened shape of the parallelogram (or rhombus) is a state in which the orthogonal deviation of the problem 3 and the rotational deviation of the problem 4 are combined. To correct this, that is, the x axis is parallel to the X axis. In addition, it is sufficient if the y axis can be made parallel to the Y axis.

  As shown in FIGS. 8 to 11, among the manufacturing errors 1 to 3, these orthogonal deviations and rotational deviations can occur because of the surface tilt error due to the manufacturing error 2 and the rotation axis of the galvanometer 13 due to the manufacturing error 3. 20 falls. Among them, the correction adjustment is relatively easy because the rotation shaft 20 of the galvanometer 13 is tilted due to the manufacturing error 3. It is desirable that the correction adjustment for making the x axis parallel to the X axis and the correction adjustment for making the y axis parallel to the Y axis can be performed separately (independently). The inclination of the y axis with respect to the Y axis can be corrected and adjusted only by inclining the rotation axis 20b of the y scanner 13b in the direction in which the angle ψb shown in FIG. 7 is 0 deg. However, this causes a rotational deviation as shown in FIG. 10B, and therefore involves an inclination of the x axis with respect to the X axis. The correction adjustment of the inclination of the x axis with respect to the X axis is performed by inclining the rotation axis 20a of the x scanner 13a in the direction in which the angle ψa shown in FIG. 7 is 0 deg.

  That is, a mechanism for adjusting the rotation of the x scanner 13a in the direction of the arrow (shown by the circled numbers 1 and 2) in the plane formed by the rotation axis 20a and the incident optical axis 21a (x scanner position adjustment). Similarly, the y scanner 13b is also provided with a mechanism (y scanner position adjusting mechanism) for adjusting the rotation in the plane formed by the rotation axis 20b and the incident optical axis 21b. First, the rotation axis 20b of the y scanner 13b on the side close to the fθ lens 15 is tilted and adjusted so that the y axis and the Y axis are parallel (adjustment in the direction indicated by the circled numeral 1), and then x The rotation axis 20a of the x scanner 13a is also tilted and adjusted so that the axis and the X axis are parallel (adjustment in the direction indicated by the circled numeral 2). By performing correction adjustment according to this procedure, iterative and repeated repeated adjustment can be avoided.

  In this way, when the irradiation position of the laser beam 11 is corrected with respect to the pattern of FIG. 12, the pattern of the arrival coordinates of the laser beam 11 corresponding to FIG. 2 is as shown in FIG. Further, when the scan angle is corrected for the distortion of the pattern shown in FIG. 15, the degree of the remaining positioning error after the correction corresponding to FIG. 4 becomes FIG. The remaining positioning error after correction shown in FIG. 16 is improved as compared with FIG. 13, and the positioning accuracy is improved to a state close to FIG.

  That is, the laser processing apparatus according to the first embodiment of the present invention includes a x-scanner 13a, a y-scanner 13b, and an fθ lens 15, and performs a two-dimensional scan of the laser beam 11 oscillated from the laser oscillator 10. The two-dimensional scanning system includes an x scanner 13a, a rotating shaft 20a of the x scanner 13a, and incident light of a laser beam 11 incident on an x-axis galvanometer mirror 14a constituting the x scanner 13a. X scanner position adjusting mechanism for adjusting the position in a plane formed by the shaft 21a, the y scanner 13b, the rotating shaft 20b of the y scanner 13b, and the optical axis of the reflected light at the y-axis direction galvanometer mirror 14b constituting the y scanner 13b. Enters the y-axis galvanometer mirror 14b when passing through the center of the fθ lens 15. A y-scanner position adjustment mechanism for adjusting the position in a plane formed by the incident optical axis 21b of the laser beam 11 to be emitted is provided. The incident optical axis 21 (21a, 21b) referred to here is a state in which each galvanometer 13 (13a, 13b) is not scanning (neutral position, fθ lens 15) in an ideal two-dimensional scanner having no manufacturing error. The optical path of the laser beam 11 at the center).

Further, as an example, the x scanner position adjusting mechanism rotates and adjusts the rotation axis 20a of the x scanner 13a with the center of the x axis direction galvano mirror 14a or one point on the rotation axis 20a of the x scanner 13a as the rotation center. It is characterized by having adjusting means.
Further, as an example, the y scanner position adjusting mechanism rotates and adjusts the rotation axis 20b of the y scanner 13b with the center of the y axis direction galvano mirror 14b or one point on the rotation axis 20b of the y scanner 13b as the rotation center. It is characterized by having adjusting means.

  As shown in FIGS. 17 and 18, the x scanner position adjusting mechanism or the y scanner position adjusting mechanism is configured with the scanner 13 (13 a, 13 b) attached to the θ-axis stage 30, and the structure shown in FIG. As shown in the side view of FIG. 17B, the center of rotation is set to one point on the rotation axis 20 of the galvanometer mirror 14 (arrangement point of the pin 36), or FIG. As shown in FIG. 18B and a side view thereof in FIG. 18B, it is possible to select and use the rotation center as the center of the galvanometer mirror 14. Note that it is needless to say that other configurations are possible in addition to the examples shown in FIGS. 17 and 18 as long as the scanner position adjusting mechanism functions to adjust the rotation by tilting the rotation shaft 20 of the scanner 13. Yes.

  As shown in FIGS. 17 and 18, the scanner 13 is held by a galvanometer fixing member 31, and a lock screw 35 is fitted into a long hole 34 (39) opened in the galvanometer fixing member 31. It is held on the axis stage 30. By rotating and adjusting the galvanometer fixing member 31 around the pin 36 (the center of the galvanometer mirror 14 in FIG. 18) within the range of the long hole 34 (39) by the spring 32 and the micrometer 33, the rotating shaft 20 of the scanner 13 is adjusted. It is possible to adjust by tilting. In the scanner position adjusting mechanism shown in FIG. 18, a long hole 37 along the rotation direction is provided at the bottom of the galvanometer fixing member 31, and a pin 38 is fitted into the long hole 37 so as to adjust the rotation. Is set.

  That is, since the laser processing apparatus shown in the first embodiment is provided with the above-described x scanner position adjusting mechanism and y scanner position adjusting mechanism, even if a manufacturing error exists (large), high-order correction is performed. Positioning accuracy can be improved without using an equation. It goes without saying that by using this laser processing apparatus, laser processing with higher accuracy becomes possible.

Embodiment 2.
As described in the first embodiment, the inclination of the y-axis with respect to the Y-axis can be corrected and adjusted only by inclining the rotation axis 20b of the y-scanner 13b so that the angle ψb shown in FIG. . However, the correction adjustment of the inclination of the x-axis with respect to the X-axis not only inclines the rotation axis 20a of the x scanner 13a but also by inclining the rotation axis 20b of the y scanner 13b in the direction where the angle ψb shown in FIG. Can also be done.

  That is, the y scanner 13b is rotated and adjusted in the direction of the arrow (shown by the circled numeral 1 and the circled numeral 2) in FIG. 19 within the plane formed by the rotation axis 20b and the incident optical axis 21b. A mechanism (y scanner position adjusting mechanism) for adjusting the rotation in a plane perpendicular to the incident optical axis 21b is provided. First, the rotation axis 20b of the y scanner 13b is tilted and adjusted in the plane formed by the rotation axis 20b and the incident optical axis 21b so that the y-axis and the Y-axis are parallel to each other (the direction indicated by the circled numeral 1). Next, the rotation axis 20b of the y scanner 13b is tilted and adjusted in a plane perpendicular to the incident optical axis 21b so that the x-axis and the X-axis are parallel to each other (in the direction indicated by the circled numeral 2). Adjustment of). By performing correction adjustment according to this procedure, iterative and repeated repeated adjustment can be avoided.

  In this way, when the irradiation position of the laser beam 11 is corrected with respect to the pattern of FIG. 12, the pattern of the arrival coordinates of the laser beam 11 corresponding to FIG. 2 is shown in FIG. Further, when the scan angle is corrected for the distortion of the pattern shown in FIG. 20, the degree of the remaining positioning error after the correction corresponding to FIG. 4 becomes FIG. The remaining positioning error after correction shown in FIG. 21 is improved as compared with FIG. 13 and improved to a state close to FIG.

  That is, the laser processing apparatus according to the second embodiment of the present invention includes a two-dimensional scan system that includes the x scanner 13a, the y scanner 13b, and the fθ lens 15, and performs a two-dimensional scan of the laser beam 11 oscillated from the laser oscillator 10. In the laser processing apparatus provided, the two-dimensional scanning system includes the y scanner 13b, the rotation axis 20b of the y scanner 13b, and the optical axis of the reflected light at the y-axis direction galvanometer mirror 14b constituting the y scanner 13b. In the plane formed by the incident optical axis 21b of the laser beam 11 incident on the y-axis direction galvanometer mirror 14b, and the y scanner 13b is positioned in a plane perpendicular to the incident optical axis 21b. It is characterized in that a y-scanner position adjusting mechanism for adjusting the position is provided.

  That is, in the laser processing apparatus shown in the second embodiment of the present invention, as in the first embodiment, even if a manufacturing error exists (large), positioning accuracy is not used without using a higher-order correction equation. Can be improved. Needless to say, by using the laser processing apparatus shown in the second embodiment, laser processing with higher accuracy becomes possible.

1 is a configuration diagram of a two-dimensional scan system including a biaxial galvanometer and an fθ lens according to Embodiment 1 of the present invention. FIG. It is a figure showing the fundamental positioning error resulting from using a biaxial galvanometer and ftheta lens. FIG. 3 is a diagram in which scan angle correction control is performed with respect to FIG. It is a figure showing the positioning error which remains after correction | amendment in FIG. It is a figure for demonstrating the error of the neutral position of a galvano scan angle. It is a figure for demonstrating the attachment angle error (surface fall error) of a galvanometer mirror. It is a figure for demonstrating the attachment error (tilt of a rotating shaft) of a galvanometer. It is a figure showing the positioning error when the error of the neutral position of a galvano scan angle exists.

It is a figure showing the positioning error in case the attachment angle error (surface tilt error) of a galvanometer mirror exists. It is a figure showing the positioning error when the attachment error (tilt of a rotating shaft) of a galvanometer exists (in FIG. 7, (psi) = 0deg). It is a figure showing the positioning error in case the attachment error (tilt of a rotating shaft) of a galvanometer exists (in FIG. 7, (psi) = 90deg). It is a figure showing the positioning error when three types of manufacturing errors are compounded. It is a figure showing the positioning error which remains after performing correction control of a scan angle with respect to FIG. 6 is a diagram for explaining a laser beam irradiation position correction method (procedure) according to Embodiment 1. FIG.

It is a figure showing the positioning error at the time of performing the laser beam irradiation position correction by Embodiment 1 of this invention with respect to the pattern of FIG. It is a figure showing the positioning error which remains after performing correction control of a scan angle with respect to FIG. It is the upper side figure and side view which show an example of the scanner position adjustment mechanism for rotationally adjusting the galvanometer which comprises the laser processing apparatus by Embodiment 1 of this invention. It is the upper side figure and side view which show another example of the scanner position adjustment mechanism for rotationally adjusting the galvanometer which comprises the laser processing apparatus by Embodiment 1 of this invention. It is a figure for demonstrating the laser beam irradiation position correction method (procedure) by Embodiment 2 of this invention. It is a figure showing the positioning error at the time of performing the laser beam irradiation position correction by Embodiment 2 with respect to the pattern of FIG. FIG. 21 is a diagram illustrating a remaining positioning error after performing the scan angle correction control with respect to FIG. 20. It is a block diagram for demonstrating the laser processing apparatus provided with the biaxial galvanometer and the f (theta) lens.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Laser oscillator 11 Laser beam 12 Reflection mirror 13 Galvanometer 13a X-axis direction galvanometer (x scanner)
13b Y-axis galvanometer (y scanner)
14 Galvano mirror 14a X-axis galvanometer mirror 14b Y-axis galvanometer mirror 15 fθ lens 16 Scannable area 17 Work piece 18 Table 19 Table drive mechanism 20, 20a, 20b Rotating axis 21, 21a, 21b Incident optical axis 30 θ Axis stage 31 Galvanometer fixing member 32 Spring 33 Micrometer 34, 37, 39 Long hole 35 Lock screw 36, 38 Pin.

Claims (5)

  A laser processing apparatus having a two-dimensional scan system having an x-axis direction galvanometer, a y-axis direction galvanometer, and an fθ lens, and performing two-dimensional scan of a laser beam oscillated from a laser oscillator. x-scanner for adjusting the position of the x-axis galvanometer in a plane formed by the rotation axis of the x-axis galvanometer and the incident optical axis of the laser beam incident on the x-axis galvanometer mirror constituting the x-axis galvanometer The position adjusting mechanism, the y-axis galvanometer, the rotation axis of the y-axis galvanometer, and the optical axis of the reflected light in the y-axis galvanometer mirror constituting the y-axis galvanometer pass through the center of the fθ lens. Of the laser beam incident on the y-axis galvanometer mirror A laser processing apparatus comprising a y-scanner position adjusting mechanism for adjusting a position within a plane formed by an emission axis.   The x scanner position adjusting mechanism includes an adjusting means for rotating and adjusting the rotation axis of the x-axis galvanometer with the center of the x-axis galvanometer mirror or one point on the rotation axis of the x-axis galvanometer as a rotation center. The laser processing apparatus according to claim 1, further comprising:   A laser processing apparatus including a two-dimensional scan system that includes a x-axis direction galvanometer, a y-axis direction galvanometer, and an fθ lens, and that performs two-dimensional scanning of a laser beam oscillated from a laser oscillator. The y-axis direction when the axis of rotation of the y-axis galvanometer and the optical axis of the reflected light at the y-axis galvanometer mirror constituting the y-axis galvanometer pass through the center of the fθ lens. A y scanner position adjusting mechanism for adjusting a position in a plane formed by an incident optical axis of the laser beam incident on the galvanometer mirror and adjusting a position of the y-axis galvanometer in a plane perpendicular to the incident optical axis; A laser processing apparatus comprising:   The y scanner position adjusting mechanism includes an adjusting means for rotating and adjusting the rotation axis of the y-axis galvanometer with the center of the y-axis galvanometer mirror or one point on the rotation axis of the y-axis galvanometer as a rotation center. The laser processing apparatus according to claim 1, further comprising a laser processing apparatus.   A laser processing method comprising a step of laser processing a workpiece using the laser processing apparatus according to any one of claims 1 to 4.

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