JP4263663B2 - Ultrasonic vibrator and manufacturing method thereof - Google Patents

Description

  The present invention relates to an ultrasonic transducer and a manufacturing method thereof, and more particularly to an ultrasonic transducer having a backing in which a plurality of substrates are incorporated and a manufacturing method thereof.

  The 2D array transducer is composed of a plurality of vibration elements arranged two-dimensionally. A signal line is individually connected to each vibration element, and a common ground electrode is provided for all of the plurality of vibration elements. A backing is provided on the lower surface side of the 2D array transducer to absorb and scatter ultrasonic waves radiated backward. Since a 2D array transducer is generally composed of an extremely large number of vibrating elements, wiring for supplying a signal to each vibrating element becomes a problem. Conventionally, a technique of embedding a plurality of signal lines (signal lines, leads) in the backing is employed.

  Various methods have been proposed as a method for manufacturing a signal line array built-in backing as described above. The first conventional method is a method in which a plurality of film-like FPCs (flexible printed circuit boards) on which lead arrays are formed are aligned and a backing material is filled between the substrates to be cured. The second method is a method in which a spacer plate made of a backing material is interposed between substrates, and a plurality of substrates and a plurality of spacer plates are bonded together to form an aggregate (laminated body). Several other methods have been proposed.

  Each substrate used in the above has a signal line row composed of a plurality of signal lines on one surface thereof. In order to prevent crosstalk or shield processing, it is desirable to provide a ground plane (surface electrode) on the entire back surface of the substrate, and a pair of grounds on the left and right ends of the signal line array on the substrate surface. It is desirable that a line be formed. Here, the ground plane is for improving insulation (or preventing or reducing crosstalk) between the signal lines in the substrate arrangement direction.

  When using the above-mentioned substrate, it is necessary to electrically connect a pair of ground lines formed on the front surface and a ground surface formed on the back surface, particularly from a position close to the array transducer. It is desirable to perform the electrode connection at a plurality of locations on the connection side. In view of this, it is conceivable to form a plurality of through holes penetrating the pair of ground lines and the ground surface, and to fill each through hole with a conductive member by plating or the like. Incidentally, the ground electrode provided in the array transducer is composed of a main body portion provided on the upper surface side of the plurality of vibration elements and a pair of lead portions drawn from the left and right sides thereof. Conventionally, the pair of lead portions are drawn to the lower surface side of the backing unit, that is, the cable connection side, and at that position, the respective lead portions are electrically connected to the pair of ground lines and the ground surface on each substrate.

JP-A-7-131895

  However, according to the through-hole forming technique as described above, for example, since the entire substrate surface is subjected to a plating process, there is a problem that the substrate is inevitably thickened. For this reason, the flexibility and bending resistance of the substrate are lowered, and the handleability, that is, workability of the portion pulled out from the backing is lowered. Moreover, the problem that the heat resistance and moisture resistance of a board | substrate falls can also be pointed out. Further, even within the backing, the interval between the substrates becomes narrow, and the backing material cannot be sufficiently introduced, resulting in a problem of a reduction in the backing action. Furthermore, it becomes necessary to form the ground line thick to some extent in order to form the through hole. The above Patent Document 1 discloses a backing with a built-in FPC, but does not describe the ground plane.

  In the above description, the case where the ground surface is formed on the back surface of the substrate and the ground line is formed together with the signal line array on the surface of the substrate has been described. In general, the ground electrode formed on the substrate is simply and reliably vibrated. A method of connecting to the child ground electrode is desired.

  An object of the present invention is to enable a ground electrode formed on each substrate in a backing to be easily and reliably connected to a vibrator ground electrode.

  Another object of the present invention is to electrically connect the ground line and the ground surface formed on each substrate with respect to the ground electrode of the array transducer from a position close to the array transducer without performing a plating process for thickening each substrate. It is to be able to connect.

(1) The present invention provides an array transducer composed of a plurality of transducer elements, a transducer ground electrode provided on the upper surface side of the array transducer, and provided on the lower surface side of the array transducer and aligned in a backing material. A backing having a group of film-like substrates arranged, each substrate being a substrate layer and a signal line row formed on one surface of the substrate layer and electrically connected to the array transducer A substrate ground electrode portion formed on at least one of the one surface and the other surface of the substrate layer, and an end surface of each substrate is exposed on a ground connection side surface in the backing. The end surface includes the end surface of the substrate ground electrode portion, and ground connection means for electrically connecting the vibrator ground electrode and the end surface of the substrate ground electrode portion on each substrate is provided. The features.

  According to the above configuration, one or more specific side surfaces in the backing (or a laminate including the same) function as ground connection side surfaces, and the ground connection side surfaces are used to form transducer ground electrodes in the array transducer. Are electrically connected to the substrate ground electrode portion of each substrate. Since a plurality of substrate ground electrode portions can be collectively connected to the vibrator ground electrode, it is simple and reliable. Further, there is an advantage that it is easy to perform ground connection from a portion close to the array transducer.

  The array transducer is preferably a 2D array transducer, but the present invention can also be applied to other types of transducers. The vibrator ground electrode functions as a common ground, and is constituted by a member such as a copper foil. The vibrator ground electrode can be constituted only by a main body portion having the same size as the array vibrator, or may be provided with a lead-out portion drawn out from the main body portion to one side or both sides. . The configuration of the ground connection means is optimized according to the configuration of the vibrator ground electrode. The substrate is preferably an FPC on which a signal line row or the like is printed. In that case, it is desirable to provide a pair of ground lines on one surface of the substrate with the signal line row in between. However, even if it is not provided, the present invention is applicable when a ground plane is formed on at least the other surface. The ground connection means is means for electrically connecting the ground to the backing or the side surface of the laminated body. For the connection, side electrode formation by conductive adhesive, solder, vapor deposition, or the like can be used.

  Preferably, the substrate ground electrode portion includes at least one ground line formed on one surface of the substrate layer, and a ground surface formed entirely on the other surface of the substrate layer, The end surface of the ground electrode portion is composed of an end surface of the ground line and an end surface of the ground surface.

  According to the above configuration, it is possible to expect a shielding effect in the arrangement direction of the signal line row by the ground line, and a shielding effect between the substrates can be expected by the ground surface. In particular, if the electrical crosstalk is effectively suppressed, the image quality of the ultrasonic image can be improved. In order to properly expose the end surface of the ground line and the end surface of the ground surface, it is desirable to perform surface processing such as cutting and polishing on the backing side surface. Since these end faces are electrically connected to each other on the backing side surface by the ground connection means, it is not necessary to perform special processing such as through holes on each substrate. Therefore, problems such as a decrease in the flexibility of the substrate, a deterioration in moisture resistance, and an increase in the process, which are caused by the processing, can be solved. Moreover, since the thickness of the substrate does not increase unnecessarily, it is easy to reduce the pitch between the substrates.

  Desirably, the ground connection means is provided on each of a plurality of ground connection side surfaces in the backing. In general, the left side surface and the right side surface facing in the direction orthogonal to the substrate arrangement direction function as side surfaces for ground connection. If these side surfaces are covered and connected by a pair of lead portions drawn from the vibrator ground electrode, the shielding effect inside the backing can be remarkably enhanced.

(2) The present invention provides an array transducer composed of a plurality of transducer elements, a transducer ground electrode provided on the upper surface side of the array transducer, and provided on the lower surface side of the array transducer and aligned in a backing material. A backing having a film-like substrate group disposed, and the vibrator ground electrode includes a main body portion laminated on an upper surface side of the array vibrator, and a lead portion drawn from the main body portion. Each substrate is formed on one surface of the substrate layer, the signal line row electrically connected to the array transducer, and at least one formed on the one surface of the substrate layer. One ground line and a ground surface formed entirely on the other surface of the substrate layer, and an end surface of each substrate is exposed on a ground connection side surface in the backing, The end surface includes the end surface of the ground line and the end surface of the ground surface, and electrically connects the lead-out portion of the vibrator ground electrode to the end surface of the ground line and the end surface of the ground surface in each substrate. Ground connection means is provided.

  According to the above configuration, the lead portion of the vibrator ground electrode is drawn on the backing side surface (ground connection side surface), and electrical connection is performed on the side surface.

  Preferably, the lead-out portion is joined to the ground connection side surface in the backing. Preferably, a backing side surface electrode is formed on the ground connection side surface of the backing, and the lead portion is joined to the backing side surface electrode.

(3) The present invention provides an array transducer composed of a plurality of transducer elements, a transducer ground electrode provided on the upper surface side of the array transducer, and provided on the lower surface side of the array transducer and aligned in a backing material. A backing having a group of film-like substrates arranged, each substrate being a substrate layer and a signal line row formed on one surface of the substrate layer and electrically connected to the array transducer And having at least one ground line formed on one surface of the substrate layer and a ground surface formed entirely on the other surface of the substrate layer, and configured by the array transducer and the backing. An end face of the vibrator ground electrode and an end face of each substrate are exposed on the side surface for ground connection in the laminate, and the end face of the ground line and the ground face are exposed on the end face of each substrate. End surfaces of the vibrator ground electrode are formed on the side surface for ground connection in the multilayer body as a ground connection means. The end surface and the end surface of the ground surface are electrically connected.

  According to the above configuration, the electrode (laminated body side electrode) is formed on the side surface of the multilayer body, whereby the vibrator ground electrode and the ground line and the ground surface of each substrate are electrically connected.

(4) The present invention also includes a step of forming a backing having a group of film-like substrates arranged and arranged at a predetermined interval in the backing material, and a side surface for ground connection in the backing, whereby the ground connection Exposing the end face of the substrate ground electrode portion formed on each of the substrates on the side surface, providing the array transducer on the backing, providing the transducer ground electrode on the array transducer, Electrically connecting the vibrator ground electrode and the end face of the substrate ground electrode portion of each substrate.

(5) The present invention also includes a step of forming a backing having a group of film-like substrates arranged and arranged at a predetermined interval in the backing material, and a side surface for ground connection in the backing, whereby the ground connection Exposing an end face of a ground line formed on one side of each substrate on the side surface for use and an end face of a ground surface formed on the other side of each substrate; and providing an array transducer on the backing; Providing a transducer ground electrode on the array transducer, and electrically connecting the transducer ground electrode to an end face of the ground line of each substrate and an end face of the ground plane. It is characterized by that.

  As described above, according to the present invention, the ground electrode formed on each substrate in the backing can be easily and reliably connected to the vibrator ground electrode. According to the present invention, the ground line and the ground surface formed on each substrate can be moved from the position close to the array transducer to the transducer ground electrode without performing a special process of thickening each substrate for ground connection. In contrast, it can be electrically connected.

  12 to 14 show comparative examples to be compared with the present embodiment. In FIG. 12, the ultrasonic probe (probe) has a probe head and a probe cable 12. The configuration of the probe head will be described. In the probe case 10, a transducer unit 14, an electronic circuit unit 16, and the like are accommodated. The transducer unit 14 includes an array transducer 18, a matching layer 20, and a backing 22. The array vibrator 18 is formed by two-dimensionally arranging a plurality of vibration elements. That is, the array transducer 18 is a 2D array transducer, and an ultrasonic beam is two-dimensionally scanned using the array transducer 18. The matching layer 20 includes a plurality of matching elements provided corresponding to the plurality of vibration elements.

  In the example shown in FIG. 12, the backing 22 is formed by partially inserting a plurality of FPCs 26 into the backing material 25, and a so-called lead array built-in type backing is configured. Specifically, the backing material 25 has a cubic shape as a whole, and a plurality of FPCs 26 are partially inserted into the backing material 25 at regular intervals. Each FPC 26 includes an insertion portion 26A and a drawing portion 26B drawn from the insertion portion 26A to the outside. As is well known, the backing 22 has a function of absorbing and scattering ultrasonic waves emitted backward from the array transducer 18. In each FPC 26, a signal line array (not shown) is formed by printing or the like, and the signal line array includes a plurality of signal lines. Each signal line is electrically connected to the corresponding vibration element.

  A ground electrode 24 is provided between the array transducer 18 and the matching layer 20. The ground electrode 24 is composed of, for example, a copper foil, and the ground electrode 24 is composed of a main body portion stacked on the array transducer 18 and a lead portion 24B drawn from the main body portion. The ground electrode 24 functions as a common electrode for a plurality of vibration elements.

  The electronic circuit unit 16 is composed of a plurality of electronic circuit boards 28 as shown. An FPC 26 is connected to each electronic circuit board 28. A ground electrode 24 is connected to the ground terminal of each electronic circuit board 28, and a ground line and a ground surface described later formed on each FPC 26 are connected. A plurality of signal lines 30 are accommodated in the probe cable 12, and each signal line is connected to an electronic circuit board 28 associated therewith. Incidentally, the electronic circuit unit 16 performs generation of a transmission signal, processing of a reception signal, and the like, and in particular, may perform a phasing addition process in a probe.

  FIG. 13 shows the FPC 26 shown in FIG. (A) has shown the surface of FPC26, (B) has shown the back surface of FPC26, (C) has shown the A-A 'cross section shown to (A). When the surface of the substrate layer 27 shown in FIG. 5A is viewed, the signal line row 32 is patterned as shown in the figure, and the signal line row 32 is constituted by a plurality of signal lines 32A aligned at a constant pitch. The As described above, the signal line 32A is electrically connected to the corresponding vibration element. A pair of ground lines 34A and 34B are formed on both sides of the signal line row 32 (both ends of the substrate layer 27). Note that gap regions 36A and 36B are set on the upper ends of the ground lines 34A and 34B.

  As shown in (B), a ground surface 42 is formed on the entire back surface of the substrate layer 27. The ground surface 42 is a surface electrode or a solid electrode. A gap region is set in the upper end portion and the lower end portion of the ground surface 42 in the substrate layer 27.

  In order to electrically connect a pair of ground lines 34A and 34B formed on the front surface and the ground surface 42 formed on the back surface, a plurality of through holes 40 are formed between the two. As shown in (C), the through hole 40 is configured as a member that penetrates the ground lines 34A, 34B and the ground surface 42, and the through hole 40 is configured by a conductive member that is filled in a cylindrical shape or a cylindrical shape. The Incidentally, the pair of ground lines 34A and 34B and the ground surface 42 exhibit a shielding effect, respectively, and the pair of ground lines 34A and 34B exhibit a shielding effect in the surface direction of the substrate layer 27. A shielding effect between the substrates is exhibited when a plurality of FPCs 26 are aligned and arranged at a constant interval. This has the advantage that electrical crosstalk can be effectively suppressed.

  FIG. 14 shows a cross section of a laminated body including the array transducer 18, the matching layer 20, and a backing as a comparative example. Here, if the Y direction is defined as an alignment direction (substrate alignment direction) of a plurality of FPCs, the X direction is defined as a horizontal direction orthogonal to the substrate alignment direction, and the Z direction is defined as a vertical direction, Shows the XZ section of the laminate, and (B) shows the YZ section.

  As shown in FIG. 14, the array transducer 18 includes a plurality of vibration elements 18A, and the matching layer 20 includes a plurality of matching elements 20A. The array transducer 18 is formed with a plurality of grooves 50A and 50B in a lattice shape, and thus the plurality of vibration elements 18A are configured as described above. Similarly, a plurality of grooves 52A and 52B are also formed in a lattice shape in the matching layer 20, thereby forming a plurality of matching elements 20A.

  Each vibration element 18A has electrode layers 44 and 46 formed on the upper and lower surfaces thereof, and a signal electrode layer is formed on the upper surface of the backing. The signal electrode layers are formed in the grooves 50A and 50A described above. 50B is divided into a plurality of parts, and an individual electrode layer 48 is formed. The signal lines 32A are individually connected to the electrode layers 48.

  A ground electrode 24 is provided between the array transducer 18 and the matching layer 20. Specifically, the ground electrode 24 includes a main body portion 24A stacked on the array transducer 18 and a pair of lead portions 24B drawn from the main body portion 24A. Although a pair of drawer | drawing-out part 24B is pulled out by both the one side and other side of a backing, in FIG. 14, only one drawer | drawing-out part 24B pulled out by one direction is shown. Incidentally, FIG. 14 is a partial sectional view showing only the end portion of the laminated body.

  Considering the backing, a plurality of FPCs 26 are aligned in the Y direction in the backing material 54 (see (B)). In the FPC 26, the ground line 34A (34B) formed on one surface (front surface) and the ground surface 42 formed on the other surface (back surface) are electrically connected by the through hole 40 described above. A plurality of through holes are formed at regular intervals from above to below at the left and right ends of the FPC 26. Reference numeral 56 represents a backing material existing between the substrates.

  As already described, the pair of ground lines and ground planes formed in each FPC 26 are electrically connected to the ground electrode below the backing. Therefore, according to this comparative example, it can be pointed out that the connection point between the ground electrode 24 and the ground electrode portion in each FPC 26 is largely separated from the array transducer 18. In addition, when forming a through hole in each FPC, after making a hole penetrating the front and back of the FPC 26, for example, plating is performed to connect the ground line and the ground surface. As a result, the conductive layers of the ground line and the ground electrode become thick, and as a result, there is a problem that the thickness of the FPC increases and its flexibility is lowered. It can also be pointed out that a special process must be carried out for the formation of the through hole. Therefore, a plurality of ground electrodes formed on each FPC can be reliably and easily connected to each other without using through holes, and the ground electrodes formed on each FPC can be connected as close to the array resonator as possible. It is desirable to connect to the ground electrode.

  Next, a first embodiment of an ultrasonic probe according to the present invention will be described with reference to FIGS. This first embodiment and other embodiments described later meet the above-mentioned demand, and can be evaluated as extremely practical. The configuration will be described in detail below. In addition, the same code | symbol shall be attached | subjected to the structure similar to the structure shown to FIGS. 12-14 also in this embodiment, and the description is abbreviate | omitted.

  FIG. 1 shows the FPC 58 in the first embodiment. Similar to the comparative example described above, a signal line row 32 is formed on the surface of the substrate layer 27, and a pair of ground lines 34 </ b> A and 34 </ b> B are formed on both sides of the signal line row 32. A ground surface 42 is formed on the entire back surface of the substrate layer 27. However, unlike the comparative example, the FPC 58 shown in FIG. 1 is not provided with a through hole. In this embodiment, the pair of ground lines 34A, 34B and the ground surface 42 are interconnected using the side surface (ground connection side surface) in the backing, and are constituted by these ground electrodes. Connection between the ground electrode portion and the ground electrode in the transducer array is achieved. FIG. 2 shows the backing 60 before the end face forming process. The backing 60 can be formed by arranging a plurality of FPCs 58 at predetermined intervals along a predetermined direction and pouring the backing material 56 in that state. Of course, the backing 60 can also be configured by interposing and arranging a backing plate as a spacer between the FPCs 58.

  When the side surfaces 60A, 60B and the upper surface 60C of the backing 60 are subjected to processing such as cutting and grinding, and polishing is performed, a backing 62 as shown in FIG. 3 can be manufactured. In the backing 62, the side surfaces 62A and 62B are processed to be end faces, and the end faces 64 of the respective FPCs 58 are exposed. The same applies to the upper surface 62C, and the end surface 66 of each FPC 58 is exposed. In the present embodiment, the above-described end face projection processing is performed on the two side faces 62A and 62B to expose the side edges, that is, the end faces 64 of the respective FPCs 58, thereby achieving ground connection as will be described later.

  FIG. 4 is a conceptual diagram showing a part of the backing 62 shown in FIG. In FIG. 4, the side surface 62A and the upper surface 62C are particularly shown. On the upper surface 62C, the end surface 90 of the substrate layer 27 in the FPC 58 is exposed, and the end surface 92 of each signal line 32A is exposed. These end surfaces 90 and 92 constitute an end surface 66 of the FPC 58 on the upper surface. On the other hand, the end face 64 of the FPC 58 is exposed on the side face 62A. Specifically, the end surface 64 is constituted by the end surface 82 of the substrate layer 27, the end surface 86 of the ground line 34 </ b> A (34 </ b> B), and the end surface 84 of the ground surface 42.

  Therefore, for example, if the lead portion of the ground electrode is surface-bonded to the side surface 62A or a side electrode is formed, the ground electrode formed on the surface of each FPC 58 and the ground electrode formed on the back surface thereof. Can be electrically connected to each other. Specifically, the ground surface 42 and the ground line 34A can be electrically connected using the side surface 62A, and furthermore, they can be electrically connected to the lead portion 24B. Therefore, when cutting and polishing the side surface 62A, it is desirable to perform processing so as to make the electrical connection as good as possible.

  FIG. 5 shows a cross section of the laminate according to the first embodiment. (A) shows the XZ cross section, and (B) shows the YZ cross section. Here, paying attention to the XZ cross section shown in (A), as described above, the lead portion 24B is bonded to the side surface 62A of the backing using the conductive adhesive 70. With such a ground connection structure, The ground plane and the ground line in the FPC 58 can be interconnected, and at the same time, they can be connected to the lead-out portion 24B. As shown in FIG. 5, since the ground electrodes are connected to each other with a large connection path area, the electrical connection relationship can be improved, and the lead-out portion in the vicinity of the array transducer 18 can be obtained. Since 24B and the ground electrode part of each FPC 58 can be connected, there is an advantage that electrical crosstalk can be prevented better. In addition, since it is not necessary to form a through hole as shown in the comparative example, problems such as an increase in substrate thickness, a decrease in flexibility, and an increase in work processes caused by the hole can be solved. For example, as shown in FIG. 12, a part of a plurality of FPCs is pulled out to the rear side of the backing. In this case, if the flexibility of each FPC is lowered, it is connected to the subsequent electronic circuit unit or cable. The workability at that time is significantly reduced. On the other hand, according to the present embodiment, since the flexibility of the FPC can be maintained, there is an advantage that workability in the assembly process can be extremely improved. In particular, miniaturization of the structure of the ultrasonic probe is progressing. Even in such a case, according to the above-described embodiment, the size of the transducer is small enough to cope with such miniaturization, and the pitch is small. There is an advantage that a narrow ultrasonic probe can be constructed. In addition, since it is not necessary to perform special processing such as through-holes on each FPC, there is an advantage that the number of manufacturing steps and cost of the FPC can be reduced.

  Next, the manufacturing method of the ultrasonic probe according to the first embodiment will be described with reference to FIG.

  First, in S101, a plurality of FPCs as shown in FIG. 1 are created. In S102, a plurality of FPCs are aligned at regular intervals, the aligned body is accommodated in, for example, a frame body, and a backing material is poured into the frame body. As the backing material, an epoxy resin or the like can be used as a base material, and a filler can be mixed therewith.

  By filling the backing material and then curing it, it is possible to configure the backing before the end face forming process as shown in FIG. Incidentally, in the step of S102, the backing before the end face projection processing as shown in FIG. 2 can be formed by alternately laminating and bonding a plurality of spacers made of a plurality of FPCs and a backing material.

  In S103, the end surface is processed on the upper surface and two side surfaces (two ground connection side surfaces) of the backing formed in S102. Specifically, a processing process such as cutting and polishing is applied, and the target surface is processed. As a result, as shown in FIG. 3, the end face of each FPC is exposed on each side surface. The end face of each FPC includes the end face of the ground plane and the end face of the ground line as shown in FIG.

  In S104, an electrode thin film is formed on the upper surface of the backing using plating, vapor deposition, sputtering, or the like. In S105, the piezoelectric plate is bonded to the upper surface of the backing using a conductive adhesive or the like. Electrode layers are previously formed on the upper and lower surfaces of the piezoelectric plate. In S106, a plurality of grooves are formed along the X direction and the Y direction with respect to the piezoelectric plate. Specifically, a cutting process is performed using a dicing saw or the like. As a result, a plurality of vibration elements arranged in a matrix are formed.

  In S107, a copper foil as a common ground electrode is bonded to the upper surface of the array transducer formed by the above processing. In this case, a conductive adhesive or the like is used. The common ground electrode is constituted by a main body portion and a pair of lead portions led out therefrom in the first embodiment. In S108, the pair of lead portions are bonded to each other on the pair of side surfaces of the backing, that is, the pair of ground connection side surfaces, using a conductive adhesive or the like. As a result, as shown in FIG. 5A, the ground plane and the ground line in each FPC are electrically connected to the lead-out portion.

  In S109, a matching plate is bonded to the upper surface side of the array transducer, and a plurality of matching elements are configured by performing two-dimensional cutting on the matching plate. That is, a matching layer is formed. In S110, an electrical connection process is performed for each FPC drawn from the backing. For example, as shown in FIG. 12, an electronic circuit board is connected to each FPC. Of course, each FPC may be directly connected to a plurality of signal lines. In S111, the unit manufactured as described above is accommodated in the probe case, and necessary operations are performed to complete the ultrasonic probe.

  Next, a second embodiment will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the structure similar to the structure shown by each embodiment demonstrated above, and the description is abbreviate | omitted. The same applies to other embodiments described below.

  In the first embodiment, as shown in FIG. 5A, the drawer portion is directly connected to the backing side surface 62A. However, in the second embodiment, the backing side 62A is connected to the backing side surface 62A. On the other hand, a vertical side electrode 72 is provided using a conductive adhesive, solder, or the like, and then the lead portion 24B is connected to the side electrode 72 using a conductive adhesive 76 or the like. The side electrode 72 is made of, for example, copper foil.

  FIG. 8 shows a manufacturing method according to the second embodiment as a flowchart. In S201, the above steps S101 to S103 are executed, and in S202, side electrodes (side surface ground electrodes) are formed on the side surfaces of the backing using the conductive adhesive or the like as described above. In S203, the above steps S104 to S107 are executed, and in S204, the lead-out portion of the ground electrode of the array transducer is bonded to the side electrode using a conductive adhesive or the like. This constitutes a ground connection structure on the side surface of the backing. In S205, the above steps S109 to S111 are executed.

  According to said 2nd Embodiment, since the side surface electrode was comprised with respect to the side surface of a backing and the drawer | drawing-out part was connected on it, there exists an advantage that a more electrical connection can be performed favorably.

  Next, a third embodiment will be described with reference to FIGS. 9 and 10.

  FIG. 9 shows a cross section of the laminate, which corresponds to the cross section of FIG. 5A in the first embodiment. In the third embodiment, the ground electrode 78 provided on the upper surface side of the array transducer 18 does not have a lead portion, and its end surface is exposed on the side surface of the multilayer body. Here, the laminated body includes a backing and an array transducer. The side surface of the laminate is subjected to end face processing, and a side electrode layer 80 is formed on the side surface. For example, the side electrode layer is formed as a conductive thin film using plating, vapor deposition, sputtering, or the like. The side electrode layer is formed from the ground electrode 78 to the entire side surface of the backing, and the side electrode layer 80 can electrically connect the ground electrode 78 to the ground surface and the ground line of each FPC. It becomes possible. Incidentally, the vibration elements in the end area of the array transducer 18 exist as so-called dummy vibration elements, that is, the signal line 32A is not connected to them. Therefore, even if the side electrode layer 80 is electrically connected to the electrode layer of such a dummy vibration element, there is no problem in the operation of the array vibrator.

  FIG. 10 shows a flowchart of the manufacturing method of the third embodiment. In S301, the above steps S101 and S102 are executed. In S <b> 302, the upper end surface is processed for the backing. In step S303, the above steps S104 to S106 are executed.

  In S304, a ground electrode is provided on the array transducer. The ground electrode does not have a lead-out portion as described above. In S305, the end face processing is performed on the side surface (side surface for ground connection) of the laminated body.

  In S306, a side electrode layer (side ground electrode layer) is formed on the side surface of the laminate using the above-described sputtering process or the like. As a result, a ground connection structure is realized. In S307, the above steps S109 to S111 are executed.

  Therefore, according to the third embodiment, the necessary grounding is performed only by forming the electrode layer on the side surface of the multilayer body without performing the process of bonding the lead portion to the backing side surface using a conductive adhesive or the like. There is the advantage that electrode interconnections can be achieved.

  In the first to third embodiments described above, a pair of ground lines are formed on the surface of each FPC. However, in some cases, the FPC may be provided without providing such a pair of ground lines. You may make it form. Such a modification is shown in FIG. In FIG. 11, when attention is paid to the surface of the FPC 100, the signal line array 32 is formed on the substrate layer 27, but the ground lines are not formed on both sides thereof. Incidentally, the ground surface 42 is formed on the back surface in the same manner as in the above embodiments. Even if such an FPC 100 is used, the above-described embodiments can be executed as they are. In particular, in each of the above-described embodiments, the two side surfaces of the backing are encased or covered by the lead-out portion or the side electrode layer, so that a good shielding effect can be exhibited without necessarily providing a ground line for each FPC. Can do. Of course, in order to effectively prevent crosstalk, it is desirable to provide the required number of ground lines for each FPC, as in the above embodiments.

  As described above, according to each of the above-described embodiments, the necessary ground electrodes can be interconnected using the side surface of the backing without using the through-hole as described in the comparative example. There is an advantage that various problems caused by the formation of holes can be solved. In particular, since the ground connection can be performed in the vicinity of the array transducer, there is an advantage that electrical crosstalk can be reduced more favorably.

It is a figure which shows FPC in 1st Embodiment. It is a figure which shows the backing before an end surface projection process in 1st Embodiment. It is a figure which shows the backing after the end surface projection process in 1st Embodiment. It is a figure which shows the exposed end surface about each FPC. It is a figure which shows the cross section of the laminated body in 1st Embodiment. It is a flowchart explaining the manufacturing method of 1st Embodiment. It is a figure which shows the cross section of the laminated body in 1st Embodiment. It is a flowchart explaining the manufacturing method of 2nd Embodiment. It is a figure which shows the cross section of the laminated body in 3rd Embodiment. It is a flowchart explaining the manufacturing method of 2nd Embodiment. It is a figure which shows the modification of FPC. It is a figure for demonstrating the probe in a comparative example. It is a figure which shows FPC in a comparative example. It is a figure which shows the cross section of the laminated body in a comparative example.

Explanation of symbols

  18 array transducer, 20 matching layer, 24 ground electrode, 27 substrate layer, 32 signal line row, 32A signal line, 34A, 34B ground line, 42 ground surface, 58 FPC, 60 backing before end surface processing, 62 end surface Backing after processing, end face of 64 FPC.

Claims (9)

An array vibrator comprising a plurality of vibration elements;
A vibrator ground electrode provided on the upper surface side of the array vibrator;
A backing having a film-like substrate group provided on the lower surface side of the array transducer and aligned in the backing material;
Including
Each of the substrates is
A substrate layer;
A signal line row formed on one surface of the substrate layer and electrically connected to the array transducer;
A substrate ground electrode portion formed on at least one of the one surface and the other surface of the substrate layer and exhibiting at least one of a substrate surface direction shielding effect and an inter-substrate shielding effect on the signal line row ;
Have
The end face of each substrate is exposed on the side surface for ground connection in the backing,
The end surface of each substrate includes the end surface of the substrate ground electrode portion,
Ground connection means provided we are to electrically connect the edge of the substrate ground electrode portion in the respective substrate and the vibrator ground electrode,
The ground connection means electrically connects a lead portion that is a part of the transducer ground electrode in the array transducer and covers the ground connection side surface in the backing to the end surface of the substrate ground electrode portion of each substrate. A member, or an electrode formed on a side surface for ground connection in the backing, which is a side electrode connecting the vibrator ground electrode and an end surface of a substrate ground electrode portion of each substrate;
An ultrasonic probe characterized by that. The ultrasonic probe according to claim 1,
The substrate ground electrode portion is formed on one surface of the substrate layer and has at least one ground line that exhibits the shielding effect in the substrate surface direction , and is formed entirely on the other surface of the substrate layer and has the inter-substrate shielding effect. A ground plane to exert ,
The ultrasonic probe according to claim 1, wherein an end surface of the substrate ground electrode portion includes an end surface of the ground line and an end surface of the ground surface. The ultrasonic probe according to claim 1 or 2,
An ultrasonic probe characterized in that the ground connection means is provided on each of a plurality of ground connection side surfaces in the backing. An array vibrator comprising a plurality of vibration elements;
A vibrator ground electrode provided on the upper surface side of the array vibrator;
A backing having a film-like substrate group provided on the lower surface side of the array transducer and aligned in the backing material;
Including
The vibrator ground electrode is
A main body portion laminated on the upper surface side of the array transducer;
A drawn-out portion drawn from the main body portion;
Consists of
Each of the substrates is
A substrate layer;
A signal line row formed on one surface of the substrate layer and electrically connected to the array transducer;
At least one ground line formed on one surface of the substrate layer and exhibiting a substrate surface direction shielding effect on the signal line row ;
A ground surface that is formed entirely on the other surface of the substrate layer and that exhibits an inter-substrate shielding effect ;
Have
The end face of each substrate is exposed on the side surface for ground connection in the backing,
The end surface of each substrate includes an end surface of the ground line and an end surface of the ground surface,
Provided is a ground connection means for electrically connecting a lead portion of the vibrator ground electrode as a portion covering the ground connection side surface in the backing, and an end surface of the ground line and an end surface of the ground surface in each substrate. An ultrasonic probe characterized by The ultrasonic probe according to claim 4,
The lead-out portion is surface bonded to the ground connection side surface in the backing ,
The ultrasonic probe, wherein the ground connection means is a member for the surface bonding . The ultrasonic probe according to claim 4,
A backing side surface electrode is formed on the ground connection side surface in the backing,
The extraction portion is surface bonded to the backing side electrode ,
The ground connecting means is a member for the backing side surface electrode and the surface bonding,
An ultrasonic probe characterized by that. An array vibrator comprising a plurality of vibration elements;
A vibrator ground electrode provided on the upper surface side of the array vibrator;
A backing having a film-like substrate group provided on the lower surface side of the array transducer and aligned in the backing material;
Including
Each of the substrates is
A substrate layer;
A signal line row formed on one surface of the substrate layer and electrically connected to the array transducer;
At least one ground line formed on one surface of the substrate layer and exhibiting a substrate surface direction shielding effect on the signal line row ;
A ground surface that is formed entirely on the other surface of the substrate layer and that exhibits an inter-substrate shielding effect ;
Have
On the side surface for ground connection in the laminate composed of the array transducer and the backing, the end surface of the transducer ground electrode and the end surface of each substrate are exposed,
The end surface of each substrate includes an end surface of the ground line and an end surface of the ground surface,
A laminated body side electrode as a ground connecting means is formed on the side surface for ground connection in the laminated body,
An ultrasonic probe characterized in that an end face of the transducer ground electrode is electrically connected to an end face of the ground line and an end face of the ground plane in each substrate by the laminate side electrode. . Forming a backing having a group of film-like substrates aligned in the backing material at predetermined intervals;
Processing the ground connection side in the backing, thereby, the ground connection on the side, each substrate A formed electrode portion between the substrate surface direction shielding effect and the substrate for the signal line sequence on the substrate Exposing the end face of the substrate ground electrode portion that exhibits at least one of the shielding effects ;
Providing an array transducer on the backing;
Providing a vibrator ground electrode on the array vibrator;
A step of electrically connecting the vibrator ground electrode and an end face of the substrate ground electrode portion of each substrate, wherein the lead part is a part of the vibrator ground electrode and covers a ground connection side surface in the backing Is electrically connected to the end face of the substrate ground electrode portion of each substrate by a connecting member, or on the side surface for ground connection in the backing, the vibrator ground electrode and the end face of the substrate ground electrode portion of each substrate Forming a side electrode to connect ,
The manufacturing method of the ultrasonic transducer | vibrator characterized by the above-mentioned. Forming a backing having a group of film-like substrates aligned in the backing material at predetermined intervals;
Processing the ground connection side in the backing, thereby, on the ground connection side, the other end face and the respective substrate of the ground line to exert the substrate surface direction shielding effect which is formed on one surface of each substrate A step of exposing an end face of a ground plane that exhibits a shielding effect between substrates formed in the direction;
Providing an array transducer on the backing;
Providing a vibrator ground electrode on the array vibrator;
A step of electrically connecting the vibrator ground electrode and a substrate ground electrode portion including an end face of the ground line of each substrate and an end face of the ground face, and is a part of the vibrator ground electrode. The lead portion covering the side surface for ground connection in the backing is electrically connected to the end surface of the substrate ground electrode portion of each substrate by a connecting member, or the vibrator ground electrode is connected to the side surface for ground connection in the backing. And a step of forming a side electrode connecting the end surface of the substrate ground electrode portion of each substrate ,
The manufacturing method of the ultrasonic transducer | vibrator characterized by the above-mentioned.

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