JP4254258B2 - REFLECTIVE SUBSTRATE, ELECTRO-OPTICAL DEVICE EQUIPPED WITH THE SAME, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF REFLECTIVE SUBSTRATE - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a reflective substrate, an electro-optical device including the reflective substrate, an electronic apparatus, and a method for manufacturing the reflective substrate.
[0002]
[Prior art]
Currently, in a transflective liquid crystal display device, which is a type of electro-optical device, in order to reduce the power consumption of the built-in backlight, a reflective substrate whose resin surface is covered with aluminum or the like is provided, and the viewing area side is provided. Reflected light generated by reflecting incident external light (hereinafter referred to as incident light) is used (for example, Patent Document 1). In this type of liquid crystal display device, the irradiation light of the built-in backlight is guided to the viewing area side through a transmission portion provided in a part of the reflective substrate. In fact, in such a liquid crystal display device, the reflective surface of the reflective substrate is provided with irregularities to improve the viewing angle, and the incident light is appropriately scattered, such as illusion caused by the incident light and reflection of the background. The occurrence of problems is reduced.
[0003]
In this conventional liquid crystal display device, for example, a reflective substrate 500 having a pattern as shown in FIG. 12 is provided. FIG. 12 shows a plan pattern diagram of the reflection surface of the reflection substrate 500 at one dot (red, green, and blue dots in color display). Here, reference numerals 102a, 102b, 104a, and 104b clearly indicate end portions (boundary lines) that are separated and distinguished from other adjacent dots by a light shielding film (not shown in particular). is there.
The reflective substrate 500 is provided with a transmissive part 110 that transmits the irradiation light emitted from the backlight and a reflective part in which a plurality of recesses 120 for scattering incident light are formed. In the recess 120, a gently continuous uneven resin acts as a reflection film. This gently uneven reflective film has, for example, a hexagonal opening having a diameter of 10 μm between diagonals (a hole diameter of a portion recessed with respect to a convex portion) with respect to a positive photosensitive resin material. It is formed by exposure and development using a photomask. At this time, the center (or center of gravity) interval between adjacent recesses is set to a value of 13 to 18 μm, for example, with an average value of 14 μm. In this reflective substrate 500, for example, the width D2 from the boundary line 104a to the frame line 112 of the transmission part 110 is sufficiently larger than the width D1 from the boundary line 102a to the frame line (end part) 112 of the transmission part 110. It has a short configuration.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 2002-98955
[Problems to be solved by the invention]
Here, in such a reflective substrate 500, the region B having the width D2 may have a minimum length of one side slightly exceeding the diameter 10 μm of the recess 120. In the process of forming the recess 120 in the reflective substrate 500, the formation location of the recess 120 is usually determined at random, and the total opening area of the opening of the recess 120 with respect to the area forming the dots (that is, the density of the recess openings). Is determined to satisfy a predetermined density.
[0006]
However, in the region where the length of one side is extremely short like the region B, there is only room for forming one concave portion 120 having a diameter of 10 μm, and the region B may not satisfy the predetermined density in some cases. Could occur. In this case, the flat reflection surface increases in this region B. Even if the recesses 120 are formed so as to satisfy the above-mentioned predetermined density in the region B, the recesses 120 are formed unevenly in this way only in the region B. In addition, the reflection substrate 500 cannot sufficiently scatter incident light to the region B, and problems such as illusion and background reflection due to the incident light cannot be sufficiently suppressed.
On the other hand, even if it is decided to form the concave portion 120 at a predetermined location in the region B and correct the unevenly formed pattern, in an extreme case, the concave portion 120 having a diameter of 10 μm is vertically aligned. The opening area density of the recess 120 in the region B may be extremely higher than the opening area density of the recess 120 in the region A other than the region B on the reflection surface. .
[0007]
The present invention has been made in view of the above-described problems, and an object thereof is to provide a reflective substrate for efficiently scattering incident external light, an electro-optical device including the reflective substrate, an electronic apparatus, and a method for manufacturing the reflective substrate. There is.
[0008]
[Means for Solving the Problems]
To solve the above problems, the reflective substrate of the present invention, the irradiation light irradiated from the side opposite to the reflecting portion for reflecting in a concavo-convex surface of the light incident on the dot from the field of view side, and the field of view side In the region A in which the width from the end of the dot to the end of the transmissive portion is equal to or greater than a predetermined value in the reflective portion , the diameter of the opening is d1. In the region B where the width is less than the predetermined value, a plurality of second recesses whose opening diameter is d2 smaller than the d1 are formed, and the predetermined value is (2 Xd1) .
[0009]
Also, in the reflective substrate of the present invention, the second recess of the region B is characterized by being densely formed than the first recess of the area A.
[0011]
Also, in the reflective substrate of the present invention, in the said reflection portion, the region A of the total of the first area S1 of the area, the region second area S2 of the total area of B, the first in the region A When the total opening area of the recesses is the first opening area T1, and the total opening area of the second recesses in the region B is the second opening area T2, (T2 / S2) / (T1 / S1) is 1. It is characterized by satisfying 2 or more and 1.7 or less.
Thus, paying attention to the ratio of the opening area density between the regions A and B, it is possible to suppress the problem that it becomes difficult to obtain a sufficient reflectivity because the opening area ratio of both is excessively peeled.
[0012]
Also, it can be used as an electro-optical device includes an upper Symbol reflective substrate.
[0013]
Also, it can be used as an electronic apparatus including the above SL electro-optical device.
[0014]
Also, the present invention is transparent to transmit irradiation light irradiated from the opposite side to the field of view side a reflecting portion which reflects in a concavo-convex surface of the light incident on the dot from the field of view side, and the field of view side In the method of manufacturing a reflective substrate having a portion, in the reflective portion , a width from an end portion of the dot to an end portion of the transmissive portion is a region A having a predetermined value or more, and a diameter of the opening portion is d1. Forming a plurality of second recesses, and forming a plurality of second recesses having a diameter d2 smaller than the d1 in the region B having the width less than the predetermined value, 2 × d1) .
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0017]
<About the reflective substrate>
The configuration of the reflective substrate 100 according to the present invention will be described with reference to FIG.
FIG. 1 is a diagram showing a pattern on the surface of the reflective substrate 100 according to the first embodiment. The description of the same reference numerals as those of the reflective substrate 500 of FIG. 12 described above will be omitted.
In this reflective substrate 100, a region from the frame line 112 of the rectangular transmissive part 110 to any one of the boundary lines 102a, 102b, 104a, 104b of the dots is less than (2 × recess opening diameter 10 μm), That is, in this case, in the regions B1 and B2, a recess opening diameter having a recess opening diameter of 9 μm smaller than the recess opening diameter of 10 μm and a shape similar to the recess 120 is formed. In this case, for example, the opening area of the hexagonal recess 120 was 64 μm ² , and the opening area of the recess 122 was 56 μm ² .
[0018]
Thus, since the area | region is narrow when forming the recessed part, the reflective substrate 100 of this form can suppress the problem that opening area density of the opening part in that area | region cannot fully be ensured.
Further, in the reflective substrate 100 of the present embodiment, the width from the boundary line of the dot to the transmission part is extremely limited in view of the fact that it is impossible to form a maximum of two recesses 120 in parallel in the X direction. It came to determine area | region B1, B2. In this way, the formation positions of the recesses 122 can be appropriately scattered while satisfying a predetermined opening area density in the narrow regions B1 and B2, and the incident light to the regions B1 and B2 can be sufficiently scattered, Problems such as illusion caused by incident light and background reflection can be sufficiently suppressed.
[0019]
In the reflective substrate 100 in this embodiment, the opening diameter (hereinafter referred to as opening diameter d2) of the recess 122 in the areas B1 and B2 with respect to the opening diameter of the recess 120 (hereinafter referred to as opening diameter d1) in the areas A1 and A2. It is preferable to change the diameter slightly, for example, by setting the opening diameter of the recess 122 in the regions B1 and B2 to 9 μm with respect to the opening diameter of 10 μm in the recess 120 in the regions A1 and A2. This will be described below with reference to FIGS.
[0020]
Here, FIG. 2 shows the opening diameter (μm) of the recesses and the recesses scattered in the corners of 207 μm × 69 μm when each of the line segments A01 to A04 and B01 to B04 shown in FIGS. 3 and 4 is measured. Number (piece), opening area of the recess (μm ² / piece), and opening area density (%) of the recess. In addition, since each of these set values in the concave portion actually corresponds to the hole of the mask pattern when the concave and convex portions are exposed and formed on the reflecting surface, it is estimated from the hole pattern formed in the mask. Shown as a value.
For example, in the case of the line segment B04, 118 recesses having an opening diameter of 10 μm and an opening area of 64 (μm ² / piece) are formed in a 207 μm × 69 μm square, and the ratio of the opening area per unit area (1 μm ² ), That is, the opening area density is 53%. For example, in the case of the line segment B03, 135 concave portions having an opening diameter of 9 μm and a concave opening area of 56 (μm ² / piece) are formed in a 207 μm × 69 μm square within the same size dot, and the ratio of the opening area That is, the opening area density is 53%.
[0021]
FIG. 3 shows a specular reflectivity (40 ° on the reflecting surface of the concavo-convex resin alone when the opening diameter of the concave portion is changed while the opening area density of the concave portion satisfies about 31%. Is a result of measuring (amount of emitted light / incident amount of light of 40 °). In this case, the coating film thickness of the resin layer of the reflective substrate is changed to 1.8 μm and 2.1 μm, respectively, and the specular reflectance of the resin is measured and connected with line segments, and the specular reflectance value between them is estimated. is doing.
Similarly, FIG. 4 shows a specular reflectivity on the reflection surface of the concavo-convex resin alone in the case where the opening diameter of the recesses was changed while the density of the opening area of the recesses actually satisfied approximately 53%. It is the result of having measured. In this case, the coating film thickness of the resin layer of the reflective substrate is changed to 1.8 μm and 2.1 μm, respectively, and the specular reflectance of the resin is measured and connected with line segments, and the specular reflectance value between them is estimated. is doing.
[0022]
When FIG. 3 and FIG. 4 are compared with each other, for example, when the coating thickness of the resin layer is 1.8 μm, the specular reflectance of the resin in the concave portion having an opening diameter of 10 μm in FIG. 4) is a recess having a diameter of 9 μm (a line segment B03 indicating a specular reflectance of resin of 1.4%) in FIG. In another example, when the coating thickness of the resin layer is 1.8 μm, the mirror reflectance of 2.4% (line segment A03) of the resin in the recess having an opening diameter of 9 μm in FIG. 3 is realized. In FIG. 4, the recesses having an opening diameter of 7.5 μm (the line segment B02 indicating the mirror reflectivity of the resin 1.9%) and the recesses having an opening diameter of 6 μm (the specular reflectivity of the resin 3.0) are shown. It can be inferred that it is intermediate to the line segment B01) indicating%.
On the contrary, in such cases as in FIGS. 3 and 4, for example, in the case where the coating film thickness of the resin layer is 1.8 μm, the specular reflectance of the resin in the concave portion having an opening diameter of 10 μm in FIG. 3 is 1.4%. On the other hand, when the concave portion having an opening diameter of 6 μm (resin specular reflectance of 3.0%) in FIG. 4 is set, the difference in the specular reflectance is increased. As a result, regions with different amounts of light reflected in the same dot are generated.
[0023]
Thus, it is desirable to slightly change the opening diameter d2 of the recess 122 in the regions B1 and B2 with respect to the opening diameter d1 of the recess 120 in the regions A1 and A2.
At this time, during the measurement, the total area of the regions A1 and A2 is the first area S1, the total area of the regions B1 and B2 is the second area S2, and the opening area of the recess 120 in the regions A1 and A2 is When the total is the first opening area T1, and the total opening area of the recesses 122 in the regions B1 and B2 is the second opening area T2, in the reflective substrate 100, the ratio (T2 / S2) / (T1 / S1) is set to ((0.53) / (0.31)) = 1.7. This is an example of a desirable value as the upper limit, and the ratio of the opening area density (T2 / S2) / (T1 / S1) = 1.2 is desirable as the lower limit. This is because if the ratio of the opening area density is too high, the resin is easily peeled off due to overexposure, particularly when the extremely small recesses 122 are formed in the regions B1 and B2. Conversely, if the ratio of the opening area density is too low (that is, too close to 1), the opening area density of the recesses in the regions B1 and B2 acts to be small, and the reflection is sufficient compared to the regions A1 and A2. The problem is that it is difficult to obtain the rate.
[0024]
(Other form of reflective substrate 1)
In the reflective substrate 100 described above, the opening shape of the concave portion is formed in a hexagonal shape, but this is an example, and may be a circular shape, an elliptical shape, or a trapezoidal shape. In this case, when the shape is an ellipse, the width from the end where the dots are formed to the end of the transmissive portion 110 according to the length of the long axis in designating the regions corresponding to the regions B1 and B2. However, it is desirable to form a recess having a major axis length smaller than the major axis length and an opening area smaller than the opening area in the original elliptical shape in a region less than twice the major axis. This is because at least two concave portions can be arranged in parallel in the X direction in the regions B1 and B2.
In this case as well, the total area of the regions A1 and A2 is the first area S1, the total area of the regions B1 and B2 is the second area S2, and the total opening area of the recesses 120 in the regions A1 and A2 is the first opening. When the total opening area of the recesses 122 in the area T1 and the regions B1 and B2 is the second opening area T2, the ratio (T2 / S2) / (T1 / S1) of the opening area density is 1. 7 is set as the upper limit, and the lower limit is preferably set as the ratio of the opening area density (T2 / S2) / (T1 / S1) = 1.2.
[0025]
(Other form 2 of reflective substrate)
In the reflective substrate 100 shown in FIG. 1 described above, the structure in which the incident light is reflected by the resin member has been particularly described. However, it is desirable that the surface of the reflective layer is covered with a highly light reflective material such as aluminum. In this case, the specular reflectance at the reflecting surface is approximately 8 times the specular reflectance of the resin alone, and incident light can be used more efficiently.
[0026]
(Other form 3 of reflective substrate)
In the reflective substrate 100 shown in FIG. 1 described above, the substrate in which the resin in the portion corresponding to the transmissive portion 110 has been removed has been shown, but in addition, the transmissive portion 110 is provided with resin. May be.
[0027]
<About the manufacturing method of the reflective substrate>
Next, a manufacturing method for the reflective substrate 100 shown in FIG. 1 will be described with reference to FIGS.
[0028]
First, as shown in FIG. 5A, a positive photosensitive resin 202 based on an acrylic resin is applied on the surface of a substrate 200 made of a transparent material such as glass (step A1). .
[0029]
Next, as shown in FIG. 5B, using a mask 210 with a batch exposure machine, for example, an exposure gap G of about 180 μm and an exposure amount of 80 mJ / cm ² along the surface of the photosensitive resin 202. The exposure is performed so that the distribution of the exposure intensity smoothly increases and decreases (step A2).
Here, the mask 210 is provided with a light-shielding thin film member 214 such as Cr on the surface of a transparent substrate 212 such as glass. As shown in FIG. 9, the mask 210 has a plurality of hexagonal transmission holes 210A having a hole diameter d01 and a plurality of hexagonal shapes having a hole diameter d02 within a region corresponding to one dot. Each of the through holes 210B is formed (hole diameter d01> hole diameter d02). The hole diameter d01 is a diameter corresponding to the opening diameter d1 of the recess 120 of the reflective substrate 100, and the hole diameter d02 is a diameter corresponding to the opening diameter d2 of the recess 122 of the reflective substrate 100. The transmission hole 210 </ b> A corresponds to one dot from the end r <b> 1 of the region R where a transmission portion that transmits irradiation light irradiated from the opposite side of the viewing area when viewed from the substrate 200 is formed. Is formed in a region a corresponding to (2 × d1) or more. The transmission hole 210B is formed in a region b excluding the region a in the region of the substrate 200, that is, a region b corresponding to a width of less than (2 × d1) until reaching a boundary line constituting a region corresponding to one dot. Has been.
[0030]
Next, the photosensitive resin 202 on the substrate 200 is developed and baked (step A3). Thereby, the exposed portion is removed in an amount according to the intensity of the exposure, and a concavo-convex pattern as shown in FIG.
[0031]
Next, as shown in FIG. 6A, a photosensitive resin 220 is further applied to the baked resin 202 formed in step A3 of FIG. 5C, and the transmissive portion is formed by exposure. The photosensitive resin in the portion R corresponding to the region to be formed is removed (step A4).
[0032]
Next, as shown in FIG. 6B, the resin in this portion R is removed from the photosensitive resin 202 by etching (step A5).
[0033]
Next, as shown in FIG. 6C, the photosensitive resin 220 formed in the step A4 is removed (step A6).
Thereby, the reflective substrate 100 shown in FIG. 1 from which the resin in the transmission part has been removed can be obtained.
[0034]
(Other manufacturing method 1 of reflective substrate)
When the surface of the resin 202 is covered with a highly light reflective member such as aluminum in order to increase the reflection efficiency with respect to incident light, as shown in FIG. 7A, the reflective substrate 100 manufactured in step A6 of FIG. 6C. On the other hand, aluminum 206 is formed by sputtering (step A7).
[0035]
Next, as shown in FIG. 7B, the aluminum 206 in the portion R corresponding to the transmission portion is removed by etching (step A8).
Thereby, a reflective substrate having a highly reflective recess can be obtained.
[0036]
(Other manufacturing method 2 of reflective substrate)
In addition, in FIGS. 5-7 mentioned above, although the manufacturing method of the reflective substrate which has the process of removing the resin of the part R corresponding to a transmission part was demonstrated, it differs from this, for example, the above-mentioned FIG.5 (b) If the mask pattern 210 of FIG. 9 used in step A2 is provided with a window pattern hole in the transmission region R in advance, the resin in the portion R corresponding to the transmission region is removed simultaneously with the formation of the uneven surface in step A2. Can do. In this case, the minimum exposure amount for extracting the resin 202 film thickness is set.
Thereby, the reflective substrate from which the resin in the transmission part is removed can be obtained with a small number of steps.
[0037]
(Other manufacturing method 3 of reflective substrate)
In addition, in FIGS. 5 to 7 described above and other manufacturing method 2 described above, the manufacturing method of the reflective substrate from which the resin in the transmissive portion is removed has been described, but in addition, the resin in the transmissive portion is left. It can also be used as a reflective substrate.
In this case, as shown in FIG. 8A, in the reflective substrate manufactured in step A3 of FIG. 5C, the reflective film 204 having high light reflectivity such as aluminum is sputtered on the resin 202 after baking. Is formed (step B1).
[0038]
Next, as shown in FIG. 8B, a photosensitive resin 205 is applied on the reflective film 204 and exposed and developed to remove a portion R corresponding to the transmissive portion of the photosensitive resin 205. (Step B2).
[0039]
Next, as shown in FIG. 8C, the reflective film 204 in the portion R is removed by etching, and the photosensitive resin 205 is further removed (step B3).
Thereby, the reflective substrate in which the resin is formed in the transmission part can be obtained.
[0040]
(Other manufacturing method 4 of reflective substrate)
In the reflective substrate 100 described above, the opening shape of the concave portion is formed in a hexagonal shape, but this is an example, and may be a circular shape, an elliptical shape, or a trapezoidal shape. In this case, when the shape is elliptical, the area corresponding to the areas B1 and B2 is designated on the mask 210 in FIG. A hole having a major axis length smaller than the major axis length in a region where the width to the end is less than twice the major axis width and smaller than the hole opening area in the original elliptical shape A hole having an opening area is formed. In this case, the total area of the regions A1 and A2 of the reflecting substrate to be manufactured is the first area S1, the total area of the regions B1 and B2 is the second area S2, and the total opening area of the recess 120 in the regions A1 and A2 Is the first opening area T1, and the total opening area of the recesses 122 in the regions B1 and B2 is the second opening area T2, respectively, the opening area density ratio (T2 / S2) / (T1 / S1) = 1.7. It is desirable that the upper limit value is set, and the lower limit is set such that the opening area density ratio (T2 / S2) / (T1 / S1) = 1.2.
[0041]
<Various forms to which the present invention is applied>
The reflective substrate described in the above embodiment is an example, and the present invention can take various forms without departing from the gist thereof.
For example, in the reflective substrate 100 in FIG. 1, the regions A1, A2, B1, and B2 are divided into the respective regions 1201 and 122 having large and small opening areas. Since a recess having a small opening area is formed in order to increase the opening area of the recess in the narrow reflective portion that is difficult to form, the portion that covers one reflective portion less than (2 × d1) is relatively small. If a recess having an opening area is formed, the recess and a recess having a large opening area may be mixed.
[0042]
<Electro-optical device and electronic device>
Next, an electro-optical device including the reflective substrate in the above-described embodiment and various application forms thereof, and an electronic apparatus to which the electro-optical device is applied as a display unit will be described.
[0043]
FIG. 10 is a cross-sectional view of the electro-optical device including the reflective substrate 100A manufactured on the surface of FIG. 8 and provided with the aluminum film 204 on the surface, for example. As shown in this figure, the electro-optical device 300 includes a reflective substrate 100A, a color filter layer 342, an overcoat layer 344, a counter electrode 346, an alignment film 348, a liquid crystal layer 330, an alignment film 324, a pixel electrode 322, and a glass substrate. 320 are stacked. Irradiation light emitted from the backlight mechanism 310 that emits light toward the viewing area side is supplied to the viewing area side via the transmission unit 110 of the reflective substrate 100. Further, when a voltage is applied between the pixel electrode 322 and the counter electrode 346, the arrangement of the liquid crystal molecules of the liquid crystal layer 330 in the dots partitioned by the light shielding film 340 is changed. Thereby, the irradiation light from the backlight mechanism 310 via the color filter 342 and the incident light (external light) reflected by the reflective film 202 change to a desired color and are emitted to the viewing area side.
Further, in addition to an active electro-optical device such as the electro-optical device 300, it can also be used as a reflective substrate for a passive electro-optical device.
[0044]
Next, FIG. 11 is an external view of a mobile phone 400 on which the electro-optical device 300 is mounted. In this figure, a cellular phone 400 includes an electro-optical device 300 as a display unit for displaying various information such as a telephone number, in addition to a plurality of operation buttons 410, as well as an earpiece 420 and a mouthpiece 430.
In addition to the cellular phone 400, the electro-optical device 300 including the reflective substrate of the present invention includes a computer, a projector, a digital camera, a movie camera, a PDA (Personal Digital Assistants), an in-vehicle device, a copying machine, an audio device, and the like. It can be used as a display unit of various electronic devices.
[Brief description of the drawings]
FIG. 1 is a plan view of a reflective substrate of the present invention.
FIG. 2 shows each set value when the specular reflectance of the resin of the reflective substrate is measured.
FIG. 3 is a diagram showing a specular reflectance of a resin of a reflective substrate (part 1).
FIG. 4 is a view showing the specular reflectivity of the resin of the reflective substrate (part 2).
FIG. 5 is a diagram showing a method for producing the reflective substrate (No. 1).
6 is a view showing a method for producing the reflective substrate (part 2). FIG.
FIG. 7 is a diagram showing a method for manufacturing another reflective substrate (part 1);
FIG. 8 is a drawing showing another method for producing a reflective substrate (No. 2).
9 is a plan view of a pattern of a mask used for manufacturing the reflective substrate of FIG. 5. FIG.
10 is a cross-sectional view of an electro-optical device including the reflective substrate manufactured in FIG.
FIG. 11 is a perspective view of an electronic apparatus including the electro-optical device.
FIG. 12 is a plan view of a conventional reflective substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 100,500 ... Reflection board | substrate, 110 ... Transmission part, 120,122 ... Recessed part, 200 ... Board | substrate, 202,205,220 ... Photosensitive resin, 204,206 ... Reflective member, 210 ... Mask.

Claims (6)

A reflection part that reflects the incident light incident on the dots from the field of view side on the uneven surface;
The said field of view side and a transmitting portion for transmitting the illumination light irradiated from the opposite side to the field of view side,
Among the reflective portions, a plurality of first recesses having a diameter of the opening portion d1 are formed in the region A in which the width from the end portion of the dot to the end portion of the transmissive portion is a predetermined value or more ,
In the region B where the width is less than the predetermined value, a plurality of second concave portions having a diameter d2 smaller than the diameter d1 are formed,
The reflective substrate, wherein the predetermined value is (2 × d1) . The reflective substrate according to claim 1,
The reflective substrate , wherein the second concave portion of the region B is formed more densely than the first concave portion of the region A. The reflective substrate according to claim 1 ,
In the said reflection portion, the region A of the total area first area S1, the region second area S2 of the total area of B, the first opening the total opening area of the first recess in the area A When the total of the area T1 and the opening area of the second recess in the region B is the second opening area T2, respectively,
(T2 / S2) / (T1 / S1) satisfies 1.2 or more and 1.7 or less. Electro-optical device characterized by comprising a reflective substrate according to any one of claims 1 to 3. An electronic apparatus comprising the electro-optical device according to claim 4 . A reflection part that reflects the incident light incident on the dots from the field of view side on the uneven surface ;
In the manufacturing method of the reflective substrate having a transmission part that transmits the irradiation light irradiated from the opposite side to the viewing field side to the viewing field side ,
Among the reflective portions, a plurality of first concave portions having a diameter d1 of an opening portion are formed in a region A in which the width from the end portion of the dot to the end portion of the transmissive portion is a predetermined value or more, and the width is In the region B less than the predetermined value, there is a step of forming a plurality of second recesses whose diameter of the opening is d2 smaller than the d1,
The method for manufacturing a reflective substrate, wherein the predetermined value is (2 × d1) .

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