JP4247338B2 - Electrical contact material and manufacturing method thereof - Google Patents

Electrical contact material and manufacturing method thereof Download PDF

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JP4247338B2
JP4247338B2 JP2000093692A JP2000093692A JP4247338B2 JP 4247338 B2 JP4247338 B2 JP 4247338B2 JP 2000093692 A JP2000093692 A JP 2000093692A JP 2000093692 A JP2000093692 A JP 2000093692A JP 4247338 B2 JP4247338 B2 JP 4247338B2
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nickel plating
plating
matte
electrical contact
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JP2001279489A (en
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雅樹 伊藤
博文 野崎
幸雄 平岡
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Dowa Metaltech Co Ltd
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Dowa Metaltech Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

【0001】
【発明の属する技術分野】
本発明は電気接触材料、とくに、Fe系あるいはCu系の金属素材に電解によるNi(ニッケル)めっきを施してなる電気接触材料及びその製造方法に関し、たとえばボタン型やコイン型電池などの電池ケース(電池缶)に適用して有効なものに関する。
【0002】
【従来の技術】
たとえば、ボタン型やコイン型などの小型電池には外装ケースと電極端子を兼ねた電池ケース(あるいは電池缶)が使用される。この電池ケースには、薄板状の金属とくにFe系素材に電解Niめっきを施してなる電気接触材料をプレス絞り加工したものが良く使われる。
この場合、その電気接触材料には、電極端子としての電気特性すなわち表面での電気接触抵抗が低く安定していることが要求されるが、これ以外に、プレスあるいは絞り等の加工性にすぐれていること、さらに、外装ケースとしての外観性いわゆる光沢性も要求される。
【0003】
ここで、電解によるNiめっきには、光沢Niめっきと無光沢Niめっきがある。
光沢Niめっきは、表面が鏡面仕上げされたかのような奇麗な光沢を有していて、とくに外観性を重視する用途に適している。この光沢Niめっきは、結晶を微細化するような添加剤(光沢剤)をめっき浴に加えることで形成することができる。しかし、その添加剤の使用により、めっき層中の不純物とくにSおよびCの含有量が多くなり、これによって上記電気接触抵抗が高くなってしまうという問題が生じる。また、プレスや絞り加工等によってクラックが発生しやすく、加工性に劣るという問題も生じる。
他方、無光沢Niめっきは、上記添加剤を使用せずに形成されるので、めっき層中の不純物含有量が少なく、したがって上記電気接触抵抗を低くすることができる。また、プレスや絞り加工等によるクラックも発生しにくく、加工性にすぐれている。しかし、表面が無光沢で外観性(光沢性)に劣るという問題があった。
このように、従来の電解Niめっきされた電気接触材料では、たとえば上記電池ケースのように、外装ケースとしての外観性と、電極端子としての電気接触性およびプレス絞り等の加工性とが要求されるような用途において、一方の機能を得ようとすれば他方の機能が損なわれるというような背反する問題があった。
【0004】
【発明が解決しようとする課題】
本発明は以上のような課題に鑑みてなされたものであり、金属素材に電解Niめっきを施してなる電気接触材料にあって、外装ケース等への利用に適した外観性、電極端子等への利用に適した電気接触性およびプレスや絞り等の加工性の各機能にすぐれた電気接触材料及びその製造方法を提供することを目的とする。
【0005】
【課題を解決するための手段】
上述の課題を解決するための手段として、第1の手段は、
金属素材に電解によるニッケルめっき層が下層と中間層と上層の3層に形成されているとともに、前記下層は無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって形成された無光沢ニッケルめっき層であり、前記中間層は光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって形成された光沢ニッケルめっき層であり、前記上層は前記光沢ニッケルめっき層である中間層の上に無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理を施すことによって結晶状態が微細化されて光沢を呈するようになったニッケルめっき層であることを特徴とする電気接触材料である。
第2の手段は、
前記3層のニッケルめっきがなす皮膜の合計膜厚が0.5〜10μm、前記下層の膜厚が0.3μm以上、前記中間層の膜厚が0.1〜1.0μm、前記上層の膜厚が0.1〜1.0μmであることを特徴とする請求項1記載の電気接触材料である。
第3の手段は、
金属素材に電解によるニッケルめっき層を下層と中間層と上層の3層に形成するようにするとともに、前記下層の形成は無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって無光沢ニッケルめっき層を形成するものであり、前記中間層の形成は光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって光沢ニッケルめっき層形成するものであり、前記上層の形成は前記光沢ニッケルめっき層である中間層の上に無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理を施すことによって結晶状態が微細化されて光沢を呈するようになったニッケルめっき層を形成するものであることを特徴とする電気接触材料の製造方法である。
第4の手段は、
前記3層のニッケルめっきがなす皮膜の合計膜厚が0.5〜10μm、前記下層の膜厚が0.3μm以上、前記中間層の膜厚が0.1〜1.0μm、前記上層の膜厚が0.1〜1.0μmであることを特徴とする請求項3記載の電気接触材料の製造方法である。
上述の第1の手段によれば、めっき仕上げ面の光沢を確保しつつ、その表面での電気接触性を良好にし、さらにプレスや絞り等の加工によるクラックの発生を抑えられることが判明した。したがって、外装ケース等への利用に適した外観性、電極端子等への利用に適した電気接触性およびプレスや絞り等の加工性の各機能を併せ持つ電気接触材料を得ることができる。
また、第2の手段は、第1の手段において、3層のNiめっきがなす皮膜の合計膜厚が0.5〜10μm、下層の膜厚が0.3μm以上、中間層の膜厚が0.1〜1.0μm、上層の膜厚が0.1〜1.0μmであることを特徴とする電気接触材料である。これにより、めっき仕上げ面の光沢度と電気接触性および加工性を共に最適な状態にできることが判明した。したがって、外観性、電気接触性および加工性の各機能をさらに向上させた電気接触材料を得ることができる。
第3及び第4の手段によれば、第1及び第2の手段にかかる電気接触材料を得ることができる。
【0006】
【発明の実施の形態】
以下、本発明の好適な実施形態を図面を参照しながら説明する。
図1は本発明による電気接触材料の断面形態を模式的に示す。
同図に示す電気接触材料は、Fe系またはCu系の薄板状金属素材(被めっき素材)1上に、無光沢Niめっきによる下層21、光沢Niめっきによる中間層22、無光沢Niめっきによる上層(表層)23がそれぞれ、電解めっきにより順次積層形成されている。
下層21および上層23の無光沢Niめっき層はそれぞれ、SやCなどの不純物含有量が少なくなるようなめっき浴条件にて形成されている。また、中間層22の光沢Niめっき層は、めっき結晶を微細化するような添加剤をめっき浴に加えて形成されている。
【0007】
ここで、表面に現れる上層21は無光沢Niめっきにより形成されているが、この無光沢Niめっきを光沢Niめっきされた中間層22の上に形成したことで、その上層23の表面にも光沢面を得られることが判明した。これは、中間層22の微細化されためっき結晶の状態が、その上に形成される上層23のめっき結晶の状態にも引き継がれて、その上層23の結晶状態が、不純物を含有しない無光沢めっきでありながら微細化されて光沢を呈する、ということが考えられる。また、上述した3層の電解めっき構成では、素材1と接する下層21および表面に現れる上層をそれぞれ無光沢Niめっきで形成したことにより、プレスや絞り等の加工によるクラックが発生しにくくなることも判明した。これは、プレスや絞り等の加工によって生じる歪みが、下層21と上層23の無光沢Niめっき層にて吸収されるためと考えられる。
【0008】
以上のような3層の電解めっき構成により、外装ケース等への利用に適した外観性、電極端子等への利用に適した電気接触性およびプレスや絞り等の加工性の各機能にすぐれた電気接触材料を得ることができる。
さらに、本発明者は、上述した3層構成の最適条件範囲を検討したところ、3層のNiめっきがなす皮膜の合計膜厚が0.5〜10μm、下層の膜厚が0.3μm以上、中間層の膜厚が0.1〜1.0μm、上層の膜厚が0.1〜1.0μmであることが判明した。
上述した電気接触材料を用いて、図2に示すような断面形状の電池ケース3をプレス絞りにより形成したところ、その表面の光沢は光沢度1.0以上を得ることができた。また、同図のa,b部の接触抵抗は30mΩ以下にすることができた。さらに、同図のc部をSEMで観察(倍率500)したが、クラックの発生はなかった。
図3は、本発明による電気接触材料を製造するための電解めっき処理手順の実施形態を示すフロー図である。この場合、同図のフローでは図示を省略したが、各工程の後には水洗工程が入る。また、最終の無光沢Niめっき工程の後には水洗と乾燥の工程が入る。
【0009】
【実施例】
(実施例1)
図3に示した電解めっき処理フローにしたがい、ステンレス鋼条(SUS430、0.2t×80w)に、無光沢Ni、光沢Ni、無光沢Niの電解めっき層を各0.7μmの厚さで順次形成し、全体として2.1μmの3層めっきを行った。
各層の電解Niめっきにて使用しためっきき浴の主組成を次の表1に示す。

Figure 0004247338
ただし、Aはスルファミン酸Ni(液体)、Bは塩化Ni(粉体)、Cはホウ酸、Dは1次光沢剤(株式会社ムラタ製)、Eは2次光沢剤(株式会社ムラタ製)である。
以上のようにして得た電気接触材料(電解Niめっきされたステンレス鋼条)に対し、光沢度、折り曲げによるクラックの発生具合、接触抵抗値ついての評価をそれぞれ行ったところ、次の表2に示すような結果を得た。
表2(実施例1の評価結果)
折り曲げ後の状態 クラックなし(良好)
光沢度 1.3(良好)
接触抵抗(製造直後) 1.2mΩ(良好)
接触抵抗(6ヶ月後) 5.5mΩ(良好)
なお、クラックの検査は倍率500のSEM観察で行った。接触抵抗は、被測定区間に一定電流を流しながら、その被測定区間に現れる電圧(IR電圧)を測定する方法、いわゆる4端子法により行った。
【0010】
(実施例2)
図3に示した電解めっき処理フローにしたがい、ステンレス鋼条(SUS430、0.2t×80w)に、無光沢Niめっき層1.0μm、光沢Niめっき層0.4μm、無光沢Niめっき層0.7μmを順次形成し、全体として2.1μmの3層めっきを行った。
このようにして得た電気接触材料に対し、実施例1の場合と同様、光沢度、折り曲げによるクラックの発生具合、接触抵抗値ついての評価をそれぞれ行ったところ、次の表3に示すような結果を得た。
表3(実施例2の評価結果)
折り曲げ後の状態 クラックなし(良好)
光沢度 1.2(良好)
接触抵抗(製造直後) 1.3mΩ(良好)
接触抵抗(6ヶ月後) 5.3mΩ(良好)
(実施例3)
図3に示した電解めっき処理フローにしたがい、ステンレス鋼条(SUS430、0.2t×80w)に、無光沢Niめっき層0.3μm、光沢Niめっき層1.0μm、無光沢Niめっき1.0μmを順次形成し、全体として2.3μmの3層めっきを行った。
このようにして得た電気接触材料に対し、実施例1,2の場合と同様に、光沢度、折り曲げによるクラックの発生具合、接触抵抗値ついての評価をそれぞれ行ったところ、次の表4に示すような結果を得た。
表4(実施例3の評価結果)
折り曲げ後の状態 クラックなし(良好)
光沢度 1.2(良好)
接触抵抗(製造直後) 1.3mΩ(良好)
接触抵抗(6ヶ月後) 5.1mΩ(良好)
以上のように、無光沢Niめっき、光沢Niめっき、無光沢Niめっきの3層構成を有する実施例1〜3の電気接触材料では、折り曲げによるクラックの発生状態、仕上げ面の光沢度、および接触抵抗のいずれについても良好な結果を得ることができた。
【0011】
(比較例1)
比較例1として、ステンレス鋼条(SUS430、0.2t×80w)に、電解めっきにより2μmの無光沢Niめっき層(単層)を形成し、実施例1,2と同じ条件にて、光沢度、折り曲げによるクラックの発生具合、接触抵抗値ついての評価をそれぞれ行ったところ、次の表5に示すような結果となった。
表5(比較例1の評価結果)
折り曲げ後の状態 クラックなし(良好)
光沢度 0.6(劣る)
接触抵抗(製造直後) 1.2mΩ(良好)
接触抵抗(6ヶ月後) 5.2mΩ(良好)
【0012】
(比較例2)
比較例2として、ステンレス鋼条(SUS430、0.2t×80w)に、電解めっきにより2μmの光沢沢Niめっき層(単層)を形成し、比較例1と同じ条件にて、光沢度、折り曲げによるクラックの発生具合、接触抵抗値ついての評価をそれぞれ行ったところ、次の表6に示すような結果となった。
表6(比較例2の評価結果)
折り曲げ後の状態 クラック大(不良)
光沢度 1.7(良好)
接触抵抗(製造直後) 40mΩ(劣る)
接触抵抗(6ヶ月後) 118mΩ(不良)
(比較例3)
比較例3として、ステンレス鋼条(SUS430、0.2t×80w)に、電解めっきにより光沢沢Niめっき層を1μm、無光沢めっき層を1μmの厚さで順次形成し、全体として2μmの2層めっきを行なった。
比較例1,2と同じ条件にて、光沢度、折り曲げによるクラックの発生具合、接触抵抗値ついての評価をそれぞれ行ったところ、次の表7に示すような結果となった。
表7(比較例3の評価結果)
折り曲げ後の状態 クラック大(不良)
光沢度 1.1(良好)
接触抵抗(製造直後) 1.3mΩ(良好)
接触抵抗(6ヶ月後) 5.3mΩ(良好)
この例では、光沢Niめっき層の下層に無光沢Niめっき層がないために、折り曲げ時に生じる歪みを吸収できず、クラックの発生が大きくなったためと考えられる。
以上のように、比較例1〜3では、折り曲げによるクラックの発生状態、仕上げ面の光沢度、および接触抵抗の3項目のいずれかに難点があって、そのすべてを満足させることはできなかった。つまり、電気接触材料として要求される諸機能が不十分であった。
【0013】
【発明の効果】
以上の説明で明らかなように、本発明は、金属素材に、無光沢Niめっき層、光沢Niめっき層、無光沢Niめっき層をそれぞれ、電解めっきにより順次形成した3層めっき構成とすることにより、めっき仕上げ面の光沢を確保しつつ、その表面での電気接触性を良好にし、さらにプレスや絞り等の加工によるクラックの発生を抑えることができ、これにより、外装ケース等への利用に適した外観性、電極端子等への利用に適した電気接触性およびプレスや絞り等の加工性にすぐれた電気接触材料を得ることができる。
【図面の簡単な説明】
【図1】本発明による電気接触材料の一実施形態を示す模式的な断面図である。
【図2】本発明の電気接触材料の適用例である電池ケースの概略断面図である。
【図3】本発明による電気接触材料を製造するための電解めっき処理手順を示すフロー図である。
【符号の説明】
1 金属素材
21 下層(無光沢Niめっき)
22 中間層(光沢Niめっき)
23 上層(無光沢Niめっき)
3 電池ケース[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical contact material, and more particularly to an electrical contact material obtained by subjecting an Fe-based or Cu-based metal material to electrolytic Ni (nickel) plating and a method for manufacturing the same, for example, a battery case such as a button-type or coin-type battery ( (Battery can).
[0002]
[Prior art]
For example, a battery case (or a battery can) that serves as an outer case and an electrode terminal is used for a small battery such as a button type or a coin type. For this battery case, a thin plate-like metal, in particular, an electric contact material obtained by applying electrolytic Ni plating to an Fe-based material is often used.
In this case, the electrical contact material is required to have a stable electrical property as an electrode terminal, that is, a low electrical contact resistance on the surface, but besides this, it is excellent in workability such as pressing or drawing. In addition, the appearance of the exterior case, so-called gloss, is also required.
[0003]
Here, Ni plating by electrolysis includes bright Ni plating and matte Ni plating.
The glossy Ni plating has a beautiful gloss as if the surface was mirror-finished, and is particularly suitable for applications in which appearance is important. This bright Ni plating can be formed by adding an additive (brightener) that refines the crystal to the plating bath. However, the use of the additive increases the content of impurities, particularly S and C, in the plating layer, resulting in a problem that the electrical contact resistance is increased. In addition, there is a problem that cracks are likely to occur due to pressing, drawing, or the like, resulting in poor workability.
On the other hand, since the matte Ni plating is formed without using the above-mentioned additive, the content of impurities in the plating layer is small, and thus the electrical contact resistance can be lowered. In addition, cracks due to pressing, drawing, etc. hardly occur, and the processability is excellent. However, there is a problem that the surface is matte and the appearance (glossiness) is poor.
Thus, the conventional electrolytic Ni-plated electric contact material requires, for example, the appearance as an outer case, the electric contact as an electrode terminal, and the workability such as press drawing, as in the case of the battery. In such applications, there is a contradictory problem that if one function is obtained, the other function is impaired.
[0004]
[Problems to be solved by the invention]
The present invention has been made in view of the problems as described above, and is an electrical contact material obtained by subjecting a metal material to electrolytic Ni plating, and has an appearance suitable for use in an exterior case, an electrode terminal, and the like. It is an object of the present invention to provide an electrical contact material suitable for the use of the material and an electrical contact material excellent in each function of workability such as press and drawing, and a manufacturing method thereof.
[0005]
[Means for Solving the Problems]
As means for solving the above-mentioned problem, the first means is:
A nickel plating layer by electrolysis is formed on a metal material in three layers, a lower layer, an intermediate layer, and an upper layer, and the lower layer is a matte nickel plating layer formed by electrolytic nickel plating using a matte nickel plating bath. The intermediate layer is a bright nickel plating layer formed by electrolytic nickel plating using a bright nickel plating bath, and the upper layer uses a matte nickel plating bath on the intermediate layer which is the bright nickel plating layer. It is an electric contact material characterized by being a nickel plating layer whose crystallized state has been refined by applying electrolytic nickel plating treatment, and has become glossy .
The second means is
Total thickness 0.5~10μm coating formed by nickel plating of the three layers, the lower layer of thickness 0.3μm or more, the film thickness of the intermediate layer is 0.1 to 1.0 [mu] m, the upper layer of the film The electric contact material according to claim 1, wherein the thickness is 0.1 to 1.0 μm.
The third means is
A nickel plating layer by electrolysis is formed on a metal material as a lower layer, an intermediate layer, and an upper layer. The lower layer is formed by electrolytic nickel plating treatment using a matte nickel plating bath. The intermediate layer is formed by forming a bright nickel plated layer by electrolytic nickel plating using a bright nickel plating bath, and the upper layer is formed on the intermediate layer which is the bright nickel plated layer. Manufacturing of an electrical contact material characterized by forming a nickel plating layer whose crystallized state is made fine by performing electrolytic nickel plating treatment using a matte nickel plating bath Is the method.
The fourth means is
Total thickness 0.5~10μm coating formed by nickel plating of the three layers, the lower layer of thickness 0.3μm or more, the film thickness of the intermediate layer is 0.1 to 1.0 [mu] m, the upper layer of the film 4. The method for producing an electrical contact material according to claim 3, wherein the thickness is 0.1 to 1.0 [mu] m.
According to the first means described above, it has been found that while the gloss of the plated finish surface is ensured, the electrical contact property on the surface can be improved, and the occurrence of cracks due to processing such as pressing and drawing can be suppressed. Therefore, it is possible to obtain an electrical contact material having both functions of appearance suitable for use in an exterior case and the like, electrical contactability suitable for use in an electrode terminal and the like, and workability such as pressing and drawing.
The second means is the first means in which the total film thickness of the three layers of Ni plating is 0.5 to 10 μm, the lower film thickness is 0.3 μm or more, and the intermediate film thickness is 0. 0.1 to 1.0 μm, and the thickness of the upper layer is 0.1 to 1.0 μm. As a result, it has been found that both the glossiness of the plated surface and the electrical contact and workability can be optimized. Therefore, it is possible to obtain an electrical contact material with further improved functions of appearance, electrical contact and workability.
According to the 3rd and 4th means, the electric contact material concerning the 1st and 2nd means can be obtained.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 schematically shows a cross-sectional form of an electrical contact material according to the present invention.
The electrical contact material shown in the figure is a Fe-based or Cu-based sheet metal material (material to be plated) 1, a lower layer 21 by matte Ni plating, an intermediate layer 22 by glossy Ni plating, and an upper layer by matte Ni plating. Each (surface layer) 23 is sequentially laminated by electrolytic plating.
The matte Ni plating layers of the lower layer 21 and the upper layer 23 are each formed under plating bath conditions that reduce the content of impurities such as S and C. Further, the bright Ni plating layer of the intermediate layer 22 is formed by adding an additive that refines the plating crystal to the plating bath.
[0007]
Here, the upper layer 21 that appears on the surface is formed by matte Ni plating, but this matte Ni plating is formed on the intermediate layer 22 plated with glossy Ni, so that the surface of the upper layer 23 is also glossy. It turns out that the surface can be obtained. This is because the refined plating crystal state of the intermediate layer 22 is inherited by the plating crystal state of the upper layer 23 formed thereon, and the upper layer 23 has a matte state that does not contain impurities. Although it is plating, it is thought that it refines | miniaturizes and exhibits gloss. Further, in the above-described three-layer electrolytic plating configuration, the lower layer 21 in contact with the material 1 and the upper layer appearing on the surface are formed by matte Ni plating, respectively, so that cracks due to processing such as pressing and drawing are less likely to occur. found. This is presumably because distortion caused by processing such as pressing or drawing is absorbed by the matte Ni plating layers of the lower layer 21 and the upper layer 23.
[0008]
The above three-layer electroplating configuration has excellent functions such as appearance suitable for use in exterior cases, electrical contact suitable for use in electrode terminals, and workability such as pressing and drawing. An electrical contact material can be obtained.
Furthermore, when this inventor examined the optimal condition range of the 3 layer structure mentioned above, the total film thickness of the film | membrane which 3 layer Ni plating makes is 0.5-10 micrometers, and the film thickness of a lower layer is 0.3 micrometer or more, It was found that the thickness of the intermediate layer was 0.1 to 1.0 μm and the thickness of the upper layer was 0.1 to 1.0 μm.
When the battery case 3 having a cross-sectional shape as shown in FIG. 2 was formed by press drawing using the above-described electrical contact material, the gloss of the surface was able to obtain a glossiness of 1.0 or more. In addition, the contact resistance at the a and b parts in the figure could be 30 mΩ or less. Furthermore, although c part of the same figure was observed by SEM (magnification 500), the crack did not generate | occur | produce.
FIG. 3 is a flow diagram illustrating an embodiment of an electroplating process procedure for producing an electrical contact material according to the present invention. In this case, although not shown in the flow of the figure, a water washing step is inserted after each step. In addition, after the final matte Ni plating step, washing and drying steps are performed.
[0009]
【Example】
Example 1
In accordance with the electrolytic plating process flow shown in FIG. 3, a stainless steel strip (SUS430, 0.2 t × 80 w) and an electroplating layer of matte Ni, luster Ni, and matte Ni are sequentially formed at a thickness of 0.7 μm. As a whole, three-layer plating of 2.1 μm was performed.
The main composition of the plating bath used in the electrolytic Ni plating of each layer is shown in Table 1 below.
Figure 0004247338
However, A is Ni sulfamic acid (liquid), B is Ni chloride (powder), C is boric acid, D is a primary brightener (Murata Co., Ltd.), E is a secondary brightener (Murata Co., Ltd.) It is.
The electrical contact material (electrolytic Ni-plated stainless steel strip) obtained as described above was evaluated for glossiness, cracking caused by bending, and contact resistance value. Results as shown were obtained.
Table 2 (Evaluation results of Example 1)
State after bending No crack (good)
Glossiness 1.3 (good)
Contact resistance (immediately after production) 1.2 mΩ (good)
Contact resistance (after 6 months) 5.5mΩ (good)
The crack was inspected by SEM observation at a magnification of 500. The contact resistance was measured by a method of measuring a voltage (IR voltage) appearing in the measured section while passing a constant current through the measured section, so-called four-terminal method.
[0010]
(Example 2)
In accordance with the electrolytic plating treatment flow shown in FIG. 3, a stainless steel strip (SUS430, 0.2 t × 80 w) is coated with a matte Ni plating layer of 1.0 μm, a bright Ni plating layer of 0.4 μm, and a matte Ni plating layer of 0.1 μm. 7 μm was sequentially formed, and a total of 2.1 μm of three-layer plating was performed.
The electrical contact material thus obtained was evaluated for the glossiness, the degree of occurrence of cracks caused by bending, and the contact resistance value, as in Example 1, as shown in Table 3 below. The result was obtained.
Table 3 (Evaluation results of Example 2)
State after bending No crack (good)
Gloss level 1.2 (good)
Contact resistance (immediately after production) 1.3 mΩ (good)
Contact resistance (after 6 months) 5.3mΩ (good)
(Example 3)
In accordance with the electrolytic plating process flow shown in FIG. 3, a stainless steel strip (SUS430, 0.2 t × 80 w), a matte Ni plating layer 0.3 μm, a bright Ni plating layer 1.0 μm, and a matte Ni plating 1.0 μm Were sequentially formed, and a total of 2.3 μm of three-layer plating was performed.
The electrical contact material thus obtained was evaluated for the glossiness, the degree of occurrence of cracks caused by bending, and the contact resistance value in the same manner as in Examples 1 and 2, respectively. Results as shown were obtained.
Table 4 (Evaluation results of Example 3)
State after bending No crack (good)
Gloss level 1.2 (good)
Contact resistance (immediately after production) 1.3 mΩ (good)
Contact resistance (after 6 months) 5.1mΩ (good)
As described above, in the electrical contact materials of Examples 1 to 3 having the three-layer structure of matte Ni plating, glossy Ni plating, and matte Ni plating, the occurrence of cracks due to bending, the glossiness of the finished surface, and the contact Good results were obtained for any of the resistors.
[0011]
(Comparative Example 1)
As Comparative Example 1, a 2 μm matte Ni plating layer (single layer) was formed on a stainless steel strip (SUS430, 0.2 t × 80 w) by electrolytic plating, and the glossiness was the same as in Examples 1 and 2. When the evaluation was made on the degree of occurrence of cracks caused by bending and the contact resistance value, the results shown in the following Table 5 were obtained.
Table 5 (Evaluation results of Comparative Example 1)
State after bending No crack (good)
Glossiness 0.6 (Inferior)
Contact resistance (immediately after production) 1.2 mΩ (good)
Contact resistance (after 6 months) 5.2mΩ (good)
[0012]
(Comparative Example 2)
As Comparative Example 2, a 2 μm gloss Ni plating layer (single layer) was formed by electrolytic plating on a stainless steel strip (SUS430, 0.2 t × 80 w), and glossiness and bending were performed under the same conditions as Comparative Example 1. When the evaluation of the cracking condition and the contact resistance value was performed, the results shown in the following Table 6 were obtained.
Table 6 (Evaluation results of Comparative Example 2)
State after bending Large crack (defect)
Glossiness 1.7 (good)
Contact resistance (immediately after manufacture) 40 mΩ (inferior)
Contact resistance (after 6 months) 118mΩ (defect)
(Comparative Example 3)
As Comparative Example 3, a stainless steel strip (SUS430, 0.2 t × 80 w) was formed by electrolytic plating sequentially with a thickness of 1 μm for a glossy Ni plating layer and a thickness of 1 μm for two layers of 2 μm as a whole. Plating was performed.
Under the same conditions as in Comparative Examples 1 and 2, the glossiness, the degree of occurrence of cracks due to bending, and the contact resistance value were evaluated, and the results shown in Table 7 were obtained.
Table 7 (Evaluation results of Comparative Example 3)
State after bending Large crack (defect)
Gloss level 1.1 (good)
Contact resistance (immediately after production) 1.3 mΩ (good)
Contact resistance (after 6 months) 5.3mΩ (good)
In this example, since there is no matte Ni plating layer below the glossy Ni plating layer, it is considered that the strain generated at the time of bending cannot be absorbed and the generation of cracks is increased.
As described above, in Comparative Examples 1 to 3, there were difficulties in any of the three items of the state of occurrence of cracks due to bending, the glossiness of the finished surface, and the contact resistance, and all of them could not be satisfied. . That is, various functions required as an electrical contact material were insufficient.
[0013]
【The invention's effect】
As is apparent from the above description, the present invention has a three-layer plating structure in which a matte Ni plating layer, a bright Ni plating layer, and a matte Ni plating layer are sequentially formed on a metal material by electrolytic plating. , While ensuring the gloss of the plating finish surface, it can improve the electrical contact on the surface, and also suppress the generation of cracks due to processing such as pressing and drawing, making it suitable for use in exterior cases, etc. In addition, it is possible to obtain an electrical contact material excellent in appearance, electrical contact suitable for application to electrode terminals, and excellent workability such as pressing and drawing.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an embodiment of an electrical contact material according to the present invention.
FIG. 2 is a schematic cross-sectional view of a battery case which is an application example of the electrical contact material of the present invention.
FIG. 3 is a flow chart showing an electrolytic plating treatment procedure for producing an electrical contact material according to the present invention.
[Explanation of symbols]
1 Metal material 21 Lower layer (matte Ni plating)
22 Intermediate layer (bright Ni plating)
23 Upper layer (matte Ni plating)
3 Battery case

Claims (4)

金属素材に電解によるニッケルめっき層が下層と中間層と上層の3層に形成されているとともに、前記下層は無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって形成された無光沢ニッケルめっき層であり、前記中間層は光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって形成された光沢ニッケルめっき層であり、前記上層は前記光沢ニッケルめっき層である中間層の上に無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理を施すことによって結晶状態が微細化されて光沢を呈するようになったニッケルめっき層であることを特徴とする電気接触材料。A nickel plating layer by electrolysis is formed on a metal material in three layers, a lower layer, an intermediate layer, and an upper layer, and the lower layer is a matte nickel plating layer formed by electrolytic nickel plating using a matte nickel plating bath. The intermediate layer is a bright nickel plating layer formed by electrolytic nickel plating using a bright nickel plating bath, and the upper layer uses a matte nickel plating bath on the intermediate layer which is the bright nickel plating layer. An electrical contact material, characterized by being a nickel plating layer that has been refined in crystallinity by performing electrolytic nickel plating treatment, and has become glossy . 前記3層のニッケルめっきがなす皮膜の合計膜厚が0.5〜10μm、前記下層の膜厚が0.3μm以上、前記中間層の膜厚が0.1〜1.0μm、前記上層の膜厚が0.1〜1.0μmであることを特徴とする請求項1記載の電気接触材料。Total thickness 0.5~10μm coating formed by nickel plating of the three layers, the lower layer of thickness 0.3μm or more, the film thickness of the intermediate layer is 0.1 to 1.0 [mu] m, the upper layer of the film The electric contact material according to claim 1, wherein the thickness is 0.1 to 1.0 μm. 金属素材に電解によるニッケルめっき層を下層と中間層と上層の3層に形成するようにするとともに、前記下層の形成は無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって無光沢ニッケルめっき層を形成するものであり、前記中間層の形成は光沢ニッケルめっき浴を用いた電解ニッケルめっき処理によって光沢ニッケルめっき層形成するものであり、前記上層の形成は前記光沢ニッケルめっき層である中間層の上に無光沢ニッケルめっき浴を用いた電解ニッケルめっき処理を施すことによって結晶状態が微細化されて光沢を呈するようになったニッケルめっき層を形成するものであることを特徴とする電気接触材料の製造方法。A nickel plating layer by electrolysis is formed on a metal material as a lower layer, an intermediate layer, and an upper layer. The lower layer is formed by electrolytic nickel plating treatment using a matte nickel plating bath. The intermediate layer is formed by forming a bright nickel plated layer by electrolytic nickel plating using a bright nickel plating bath, and the upper layer is formed on the intermediate layer which is the bright nickel plated layer. Manufacturing of an electrical contact material characterized by forming a nickel plating layer whose crystallized state is made fine by performing electrolytic nickel plating treatment using a matte nickel plating bath Method. 前記3層のニッケルめっきがなす皮膜の合計膜厚が0.5〜10μm、前記下層の膜厚が0.3μm以上、前記中間層の膜厚が0.1〜1.0μm、前記上層の膜厚が0.1〜1.0μmであることを特徴とする請求項3記載の電気接触材料の製造方法。Total thickness 0.5~10μm coating formed by nickel plating of the three layers, the lower layer of thickness 0.3μm or more, the film thickness of the intermediate layer is 0.1 to 1.0 [mu] m, the upper layer of the film 4. The method for producing an electrical contact material according to claim 3, wherein the thickness is 0.1 to 1.0 [mu] m.
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JP3834260B2 (en) * 2002-01-18 2006-10-18 新日本製鐵株式会社 Ni-plated steel sheet for battery cans
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