JP4237030B2 - Bonded body of beryllium aluminum alloy and method for manufacturing the same - Google Patents

Description

  The present invention relates to a bonded body of beryllium aluminum alloy in which beryllium aluminum alloy materials are bonded to each other and a manufacturing method thereof.

  Beryllium aluminum alloy is attracting attention as a material that is lightweight, highly rigid, and has low expansion characteristics in applications such as satellite parts and aerospace parts. In the case of producing a member having a complicated shape having a flange or a rib using this material, conventionally, a cutting method or a joining method has been employed.

  However, in the case of cutting, there is a problem that the waste of material increases due to discharge of cutting waste, and the beryllium aluminum alloy is expensive, which inevitably increases the cost.

  Therefore, conventionally, a joining method in which a flange or a rib is formed as a part using a beryllium aluminum alloy and then these parts are joined to a main body made of beryllium aluminum alloy is often employed.

As a joining method at this time, for example, dip brazing or vacuum brazing is used (for example, see Patent Document 1). For applications that require tensile strength, an electron beam welding method is used.
US Pat. No. 6,543,678

  However, in the joining of beryllium aluminum alloy materials, among the conventional joining methods, dip brazing and vacuum brazing have a joining strength (tensile strength) of about 123 MPa, and the breaking strength of the beryllium aluminum alloy base material. (E.g., 300 MPa), it has a problem that it cannot be applied to a joined body that requires high reliability.

  In addition, although the electron beam welding method can provide a certain degree of bonding strength (for example, tensile strength: 285 MPa), it is difficult to perform large-area surface bonding, and cannot be applied to applications in which processing is performed across the bonded portion after bonding. In addition, there is a problem that the joining cost is high.

  Accordingly, as a result of intensive studies to solve the above-mentioned problems, the inventors have achieved extremely superior bonding strength and bonding reliability by diffusion bonding using an Al alloy containing Mg as a bonding material between beryllium aluminum alloy materials. The knowledge that it has sex was obtained.

  The present invention is based on the above knowledge, and can be bonded to each other between beryllium aluminum alloy materials, and the obtained bonded portion has a high strength and reliability and is advantageous in cost. And it aims at providing the manufacturing method.

  In order to achieve the above-described object, a bonded structure of beryllium aluminum alloy according to claim 1 is characterized in that one beryllium aluminum alloy material and another beryllium aluminum alloy material are Al—Si—Mg alloy, Al—Mg alloy. Alternatively, it is characterized by being joined by hot pressing or HIP treatment under the insertion of an insert material made of a clad material of these alloys with Al as a core material.

  In this configuration, when hot pressing or HIP processing is performed under the insertion of an insert material, the joint surface between one beryllium aluminum alloy material and another beryllium aluminum alloy material is generally covered with a strong oxide film, but Mg By using an insert material made of an Al alloy containing copper as a bonding promoter, the surface oxide layer is reduced to realize metal-metal bonding at the bonding interface, or a thin composite reaction layer is formed at the interface, etc. Due to the mechanism, the Be—Al and Al—Al layers are firmly surface-bonded.

  According to a second aspect of the present invention, there is provided a method for manufacturing a bonded body of beryllium aluminum alloy, wherein one beryllium aluminum alloy material and another beryllium aluminum alloy material are bonded by hot pressing or HIP treatment. Further, an insert material made of an Al—Si—Mg alloy, an Al—Mg alloy, or a clad material of these alloys having Al as a core material is interposed.

  In this configuration, when hot pressing or HIP processing is performed under the insertion of an insert material, the joint surface between one beryllium aluminum alloy material and another beryllium aluminum alloy material is generally covered with a strong oxide film. By using an insert material made of an Al alloy containing copper as a bonding promoter, the surface oxide layer is reduced to realize metal-metal bonding at the bonding interface, or a thin composite reaction layer is formed at the interface, etc. Due to the mechanism, diffusion bonding occurs between the Be—Al and Al—Al layers, and both beryllium aluminum alloy materials are firmly surface-bonded due to this diffusion bonding.

Moreover, the manufacturing method of the joined body of beryllium aluminum alloy of Claim 3 is a manufacturing method of the joined body of beryllium aluminum alloy of Claim 2,
The hot pressing or HIP treatment is performed in a solid phase bonding temperature range from 500 ° C. to the melting point of the insert material.

  In this configuration, since the hot pressing or HIP treatment is performed in a solid phase bonding temperature range from 500 ° C. to the melting point of the insert material, the insert material can be maintained in a solid state without melting. As a result, it is possible to accurately maintain the mutual position of both beryllium aluminum alloy materials at the time of joining in a state with little positional deviation as compared with the molten state.

  Also, in the solid phase bonding temperature range, when the hot press or HIP treatment is performed under the insertion of the insert material, the bonding material does not melt, so the bonding material does not change greatly, and the coarse crystal when the molten bonding material cools and solidifies. There is no danger of cracks or porosity in the bonding layer during solidification or solidification, and the bonding state is stabilized.

  As described above, according to the invention of claim 1, beryllium aluminum alloy materials are made of an Al—Si—Mg alloy, an Al—Mg alloy, or a clad material of these alloys having Al as a core material. Because it is joined by hot pressing or HIP treatment under the insertion of the insert material, the joining part becomes a surface joining with high joining strength, the joining part is highly reliable, and no waste of material occurs, so the cost In addition, it is possible to provide a bonded body of beryllium aluminum alloy that is also advantageous.

  According to the invention of claim 2, beryllium aluminum alloy materials are interleaved with an insert material comprising an Al—Si—Mg alloy, an Al—Mg alloy, or a clad of these alloys having Al as a core material. Since it is joined by hot pressing or HIP processing under insertion, the joining part becomes a surface joining with high joining strength, the joining part is highly reliable, and no waste of material occurs, which is advantageous in terms of cost. It is possible to provide a method for manufacturing a bonded body of a beryllium aluminum alloy.

  In addition, according to the invention of claim 3, since the hot pressing or HIP treatment is performed in a solid phase bonding temperature range from 500 ° C. to the melting point of the insert material, in addition to the effect of the invention of claim 2, Combined with the fact that the mutual position of both beryllium aluminum alloy materials can be maintained without misalignment, and the efficient progress of diffusion bonding can be obtained, so that a desired joined body can be produced efficiently. Can do.

  Hereinafter, the present invention will be specifically described based on embodiments.

  FIG. 1 shows a bonded body 1 of beryllium aluminum alloy. This bonded body 1 is composed of one beryllium aluminum alloy material 2 and another beryllium aluminum alloy material 3 made of an Al—Si—Mg alloy, an Al—Mg alloy, or a clad of these alloys having Al as a core material. Joined by hot pressing or HIP processing under the insertion of the insert material 4 made of

  The one alloy material 2 has a circular recess 2a formed at the center, a joint hole 2c is formed in the thickness direction at the bottom 2b of the recess 2a, and an annular step along the inner peripheral wall of the recess 2a. It is configured as a thick flange part having a quadrangular outer peripheral shape in which the portion 2d is formed.

  Further, the other alloy material 3 has a through-hole 3a drilled in the central portion along the length direction, and has a circumference with an outer diameter somewhat smaller than the diameter of the joint hole 2c of one alloy material 2. It is configured as a pipe part having a shape.

  The alloy composition of one alloy material 2 and the other alloy material 3 is preferably one containing 15 to 90 wt% Be. Incidentally, among the beryllium aluminum alloys, those whose Be is less than 15 wt% have little difference in characteristics from general aluminum alloys in terms of elastic modulus and lightness, and there is no point in adding expensive beryllium, while 90 wt% If it exceeds 1, the properties are equivalent to those of metal beryllium, and the manufacturing properties are the same as those of metal beryllium. As a result, the superiority of beryllium aluminum alloys with improved toughness and manufacturability by adding aluminum is lost.

  The insert material 4 is preferably an Al—Si—Mg based alloy or an Al—Mg based alloy as described below, and particularly preferably contains 3 wt% or less of Mg. Incidentally, if Mg contains more than 3 wt%, the bondability deteriorates.

  The Al-Si-Mg alloy is determined by JIS such as BA4003, BA4004, BA4005, BA4N04 and other JIS aluminum alloy brazing materials, BA3PC, BA4PC, BA7PC, BA8PC, BA9PC, BA10PC, BA17PC, BA18PC, etc. A brazing sheet or a clad material obtained by replacing the core material of these brazing sheets with pure Al such as JIS 1050 or 1100 is preferable.

  Moreover, JIS5005,5052 etc. are suitable as an Al-Mg type alloy.

  Further, the insert material 4 does not necessarily need to be a solid material of Al—Si—Mg type or Al—Mg type alloy, and may be a clad material of these alloys having Al as a core material. The reason why the core material is Al in such a clad material is that this Al functions effectively as a stress relaxation layer.

  Further, the thickness of the insert material 4 is preferably about 0.01 to 5.0 mm. Incidentally, if the thickness of the insert material 4 is less than 0.01 mm, the volume as the bonding material is insufficient, and due to this, sufficient bonding reliability cannot be obtained, while the thickness exceeds 5.0 mm. As the effect reaches saturation, the proportion of the joint portion in the base material increases, and the difference in characteristics between the base material and the joint material cannot be ignored, resulting in complicated component design.

  Thus, when joining one alloy material 2 and the other alloy material 3 by hot press or HIP processing, the insert material 4 is inserted between the alloy materials 2 and 3.

  At this time, preferably, the hot pressing or the HIP treatment is performed in a solid-phase bonding temperature range from 500 ° C. to the melting point of the insert material 4. Specifically, hot pressing or HIP treatment is performed by setting the bonding temperature to 500 to 640 ° C. and the pressure to 5 to 300 MPa.

  Incidentally, when the bonding temperature is set to less than 500 ° C., the bonding is poor. On the other hand, when the bonding temperature is set to exceed 640 ° C., the melting points (for example, 644 ° C.) of one and the other alloy materials 2 and 3 which are the base materials are obtained. As a result, there is a risk of deformation or melting due to softening of the base material. Furthermore, when the pressure is set to less than 5 MPa, poor bonding occurs. On the other hand, when the pressure is set to exceed 300 MPa, the bondability reaches saturation and the equipment is expensive, which is not economical.

  As described above, according to the method for manufacturing the bonded body 1 of beryllium aluminum alloy, the hot pressing or the HIP treatment is performed in the solid phase bonding temperature range from 500 ° C. to the melting point of the insert material 4. The solid state can be maintained without melting, and thereby, the mutual position of the two beryllium aluminum alloy materials 2 and 3 at the time of joining can be accurately maintained in a state where there is no misalignment or at the time of joining. Can do.

  Incidentally, it is possible to obtain a strong bonding strength even in the bonding in the temperature range below the melting point of the base material at the temperature at which the insert material 4 is melted to become a liquid phase. In this case, the liquid layer is always bonded at the time of bonding. It is necessary to consider a joining method that can remain at the interface and / or realize a uniform load, which makes difficult joining difficult.

  In the solid-phase bonding temperature range, when hot pressing or HIP treatment is performed with the insert material 4 interposed, the bonding surface between one beryllium aluminum alloy material 2 and another beryllium aluminum alloy material 3 becomes a surface oxide layer. Is reduced to realize metal-metal bonding on the bonding surface, or a mechanism such as the formation of a thin composite reaction layer at the interface, and diffusion bonding between the Be-Al and Al-Al layers proceeds efficiently. As a result, both beryllium aluminum alloy materials 2 and 3 are firmly surface-bonded.

Furthermore, the heating atmosphere during hot pressing may be air, but an inert gas atmosphere such as nitrogen or argon is desirable, and a vacuum atmosphere is most suitable.
In particular, when the degree of vacuum is preferably 1 Pa or less, more preferably 6 × 10 ⁻¹ Pa or less, the base material and the bonding material are prevented from being oxidized, and the bonding property and bonding stability are improved.

  Further, the bonded body 1 can be easily processed by preventing the bonded portion A from being peeled off even when the bonded portion A is further processed after the bonding. That is, in the joined body 1, it is necessary to perform cutting work so that the bottom 2 b of the alloy material 2 and the end surface 3 b of the alloy material 3 are flush with each other across the joint A after joining. A can be prevented from peeling off.

  EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these Examples.

  As a sample, a beryllium aluminum alloy having dimensions of L50 mm × W50 mm × t50 mm was used.

  In the hot press method, after a sample was washed with acetone, an insert material was inserted between the samples, and then a predetermined temperature and pressure were applied to the insert material-inserted sample to perform hot press. Heating was performed under vacuum.

  In the case of the HIP processing method, after the sample is washed with acetone, an insert material is inserted between the samples, and then the insert material-inserted sample is placed in a 1.5 mm thick mild steel casing and deaerated under vacuum. And after performing the welding sealing process, the HIP process was performed at a predetermined temperature and pressure.

  Thereafter, a tensile test piece of JIS Z2201 14A was cut out from each joined body obtained from each treatment method, and the tensile strength was measured. The obtained results are shown in Table 1.

Example 1
Beryllium aluminum alloy: Be-38% Al
Insert material: BA4004 with a thickness of 0.12 mm
Treatment method: Hot press Joining temperature: 550 ° C
Example 2
Beryllium aluminum alloy: Be-38% Al
Insert material: BA4004 with a thickness of 0.12 mm
Treatment method: Hot press Joining temperature: 580 ° C
Example 3
Beryllium aluminum alloy: Be-38% Al
Insert material: BA4004 with a thickness of 0.12 mm
Treatment method: HIP treatment
Example 4
Beryllium aluminum alloy: Be-38% Al
Insert material: 0.12 mm thick BA4004 skin / 1.5 mm thick clad material Processing method: Hot press
Example 5
Beryllium aluminum alloy: Be-60% Al
Insert material: BA4004 with a thickness of 0.12 mm
Processing method: Hot press
Example 6
Beryllium aluminum alloy: Be-80% Al
Insert material: BA4004 with a thickness of 0.12 mm
Processing method: Hot press
Comparative Example 1
Joining temperature: 450 ° C
Other bonding conditions were the same as in Examples 1 and 2 except that the bonding temperature was different.

Comparative Example 2
Beryllium aluminum alloy base material of Examples 1 and 2
Comparative Example 3
Insert material: Non-use Only the point which does not use an insert material is different, and other joining conditions were made to be the same as that of Example 3.

Comparative Example 4
Insert material: Not used Treatment method: Brazing The beryllium aluminum alloy materials of Examples 1, 2, and 3 were brazed using a special brazing material.

Comparative Example 5
Beryllium aluminum alloy base material of Example 5
Comparative Example 6
Example 6 Beryllium aluminum alloy base material

  As is apparent from Table 1, the bonded bodies of Examples 1 to 6 have a tensile strength (MPa) that is 90% or more of the base material strength, whereas Comparative Example 3 In the other bonded examples 1 and 4, the tensile strength (MPa) is less than 50% of the base material strength. Thereby, according to this invention, it can be understood that a bonded body of beryllium aluminum alloy having high bonding strength (tensile strength) and excellent bonding reliability can be manufactured.

  In the joined bodies manufactured by hot pressing (Examples 1 and 2), when the joining temperature exceeds 550 ° C., the joining strength reaches saturation near the base material strength, but the joining temperature is less than 500 ° C. (Comparative Examples 1, 450). C.), the tensile strength is extremely reduced (Comparative Example 1, 50 MPa). The tensile strengths of Examples 1 and 2 indicate 90% or more of 295 MPa and 297 MPa of the tensile strength (300 MPa) of the base material (Comparative Example 2).

  The joined body (Example 3) manufactured by the HIP process has a tensile strength (298 MPa) substantially equal to the joined body (Examples 1 and 2) obtained by hot pressing. Thereby, the difference in tensile strength by the difference in a processing method is not recognized by hot press and HIP processing.

  In the HIP treatment, a difference in bonding strength due to the presence or absence of the insert material is recognized, and the bonded body obtained without the insert material (Comparative Example 3) is more than the bonded body obtained under the insertion of the insert material (Example 3). A low tensile strength (252 MPa) is exhibited.

  Moreover, the joined body (Comparative Example 4) obtained by brazing has a tensile strength (120 MPa) that is 50% or less of the base material (Comparative Example 2), and is a joined body that is HIP treated without an insert material (Comparative). The bonding strength is lower than in Example 3).

  In addition, the joined body (Example 4) obtained by using the clad material as the insert material has a tensile strength (288 MPa) substantially equal to that of the other Examples 1 and 2, and the joint strength due to the difference in the insert material. There was no difference.

  Furthermore, Examples 5 and 6 are joined bodies obtained using the alloy base materials of Comparative Examples 5 and 6, respectively. Comparative Example 5 is a beryllium aluminum alloy base material having an aluminum content of 60 wt%, Comparative Example 6 is a beryllium aluminum alloy base material having an aluminum content of 80 wt%, and the tensile strength is 200 MPa and 150 MPa, respectively. A decrease in tensile strength is observed as the aluminum content increases. Even in this case, Examples 5 and 6 each show a high tensile strength of 90% or more of the strength of each base material.

FIG. 2 shows a bonded body of beryllium aluminum alloy as one embodiment of the present invention, in which (a) is a front view of the main part, and (b) is a partial cross-sectional view taken along line Ib-Ib of (a).

Explanation of symbols

1 Bonded body (Beryllium aluminum alloy bonded body)
2 One alloy material (One beryllium aluminum alloy material)
3 Other alloy materials (other beryllium aluminum alloy materials)
4 Insert material A Joint

Claims (3)

One beryllium aluminum alloy material and another beryllium aluminum alloy material are inserted into an Al-Si-Mg alloy, an Al-Mg alloy, or an insert material made of a cladding material of these alloys having Al as a core material. A bonded body of beryllium aluminum alloy, which is bonded by hot pressing or HIP processing. When one beryllium aluminum alloy material and another beryllium aluminum alloy material are joined by hot pressing or HIP treatment, an Al-Si-Mg alloy, an Al-Mg alloy, or Al is used between the two beryllium aluminum alloy materials. A method for producing a bonded body of beryllium aluminum alloy, wherein an insert material made of a clad material of these alloys with a core material is inserted. A method for producing a bonded body of beryllium aluminum alloy according to claim 2,
The method for producing a bonded body of beryllium aluminum alloy, wherein the hot pressing or HIP treatment is performed in a solid phase bonding temperature range from 500 ° C. to a melting point of the insert material or less.

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