JP3797637B2 - Composite - Google Patents

Composite Download PDF

Info

Publication number
JP3797637B2
JP3797637B2 JP07293697A JP7293697A JP3797637B2 JP 3797637 B2 JP3797637 B2 JP 3797637B2 JP 07293697 A JP07293697 A JP 07293697A JP 7293697 A JP7293697 A JP 7293697A JP 3797637 B2 JP3797637 B2 JP 3797637B2
Authority
JP
Japan
Prior art keywords
brazing
bonding
composite
plate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP07293697A
Other languages
Japanese (ja)
Other versions
JPH10263848A (en
Inventor
泰弘 氏本
展 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Chemicals Corp
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Priority to JP07293697A priority Critical patent/JP3797637B2/en
Publication of JPH10263848A publication Critical patent/JPH10263848A/en
Application granted granted Critical
Publication of JP3797637B2 publication Critical patent/JP3797637B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【0001】
【発明の属する技術分野】
本発明は、主として電子産業、半導体産業、金型関係、産業機械等に利用されるロウ付けによる複合材に関する。
【0002】
【従来の技術】
異なる金属をロウ付けにより強固に液相接合することは容易ならざる技術とされている。これは、液相接合過程における接合界面の溶融によって層状の脆弱な金属間化合物を生じるためであり、ロウ付けによく見られる現象である。従って、このような脆弱層を生じた複合材は、加工中や使用中に剥がれ、又は、分離を生じたり複合板として利用出来ない等の問題を生じることが多い。
【0003】
以上の問題を解決するため、コーティング方法を用いたロウ付け方法がある。例えば、特開平8−257743号報では、予め異種金属の接合面に窒化物又は炭化物をコーティングしておき、ロウ付けするものであるが、このコーティング方法でも、コーティング層の厚みに制約があり、例えば、薄いとポ−ラスな部分ができ、その部分から拡散が起こり脆弱な金属間化合物の生成を生じ、完全には避けることができない。又、例えば、特開昭60−133971号報では、鋼やステンレス鋼の接合面にAlやAl−Si、Ag、Snを5〜100μmコーティングした後にロウ付けを行っているが、ロウ付け時の熱影響による脆弱な金属間化合物の生成は避けられず、所望形状への加工中や使用中の剥がれ、 又は、分離等の問題が完全には解決されていなかった。
【0004】
【発明が解決しようとする課題】
本願発明者は、問題点を明確にするため、従来方式であるロウ付けによる複合材を、液相接合過程における反応部を詳細に観察し解析した結果、脆弱な層状の金属間化合物の生成の他、 ロウ材と被接合材の境界面に、約10〜20μmの隙間が点状及び連続に存在することを確認した。即ち、総じてロウ付けされた境界面は、ロウ材と被接合材のぬれ性の良否に起因する未反応による未接合が存在すること、これらは大きな場合接合面全体の約50%にも達することなど、反応部の脆弱層以外に生じる新たな問題を確認した。
【0005】
以上のように、異種金属を直接ロウ付けする方法、又は、予めコーティングする最新の方法にしても、接合界面に脆弱な金属間化合物の生成を完全には避けられず、又、100%接合させることは難しい。従って、接合後の複合板を所望の形状に加工中、又は、使用中に剥がれたり、分離をしたりするなど製造及び使用上の多くの問題があった。更に、 このような複合板においては期待する性能が確保出来ず、例えば、使用中の通電性の不安定や低下による生産効率の低下等の様々の問題を生じることから、複合板として十分に利用されていない用途もある。本発明の課題は、ロウ材と基材との未接合部を出来るだけ生じないようにしかつ脆弱な金属間化合物の生成を防止し、その結果所望形状への加工中や使用中に剥がれ、分離を生じない複合材を提供することを目的とする。
【0006】
【課題を解決するための手段】
すなわち本発明は、
[1]2枚の母材金属材料が接合補助材料とロウ材を介して接合された複合材であって、該母材金属材料の少なくとも一方が前記接合補助材料と爆発圧着により固相接合されていることを特徴とする複合材、
]接合補助材料の厚みが、0.5〜6mmの範囲からなることを特徴とする[1]記載の複合材に関する。
前記のとおり、本発明は、母材金属材料間に接合補助層とロウ材層を有し、該接合補助層と前記金属材料層が固相結合されていることを特徴とする複合材である。
本発明において母材金属材料とは、最終的に接合しようとする金属材料をいい、金属の板材、焼結材、圧搾材、鍛造材等が挙げられる。また、鋼、鉄や銅、アルミニウム、タングステン(W)、銀、ニッケル、チタン、モリブデン、ニオブ、タンタルおよびこれらの合金など通常用いられる金属のいずれの種類を用いることもできる。本発明では母材金属材料同士が異なる場合に大きな効果が得られるが、同種の金属を使用しても良い。金属粉末を焼結又は圧搾することにより得られた金属材料の場合や、爆発圧着が不可能な金属材料の場合や固相接合が難しい母材金属材料の組み合わせの場合に特に効果的である。
【0007】
本発明において、接合補助材料とは、母材金属材料とロウ材の接合を助ける金属であり、接合しようとする金属材料と固相接合しうる金属で、かつ、使用するロウ材とぬれ性の良い金属材料である。例えば、銅−タングステン合金と鋼を銀ロウ材で接合しようとする場合は、銅が好ましく、また、アルミニウム合金とステンレスをアルミニウム合金ロウ材で接合しようとする場合は、アルミニウム合金が好ましい。接合補助材層の厚みは、0.11〜10mmとすると好ましく、さらに好ましくは0.5〜6mmがよく、とくに好ましくは1〜3mmの範囲が良い。接合補助層は必要であれば両方の母材金属材料に固相接合しておいても良い。
【0008】
ここで「ぬれ性が良い」とは、液状のロウ材を金属表面に乗せた場合、両者のなじみが良く、ロウ材が金属表面全体に薄膜状に行き渡る状態をいう。ぬれ性のよい接合補助層とロウ材の組合せには、例えば、Cuと銀ロウ材や、Al合金とAl合金ロウ材が挙げられる。
固相接合とは、原子間の引力の作用する範囲まで近づけて接合したり、原子の拡散現象によって接合する方法をいい、固体の金属材料同士を室温、また加熱条件下で加圧する方法や爆発圧着する方法などが良い。
【0009】
接合補助材料は、ロウ材又は母材金属材料のどちらか一方の材料の主成分からなる。ここで主成分とは、複数以上成分の中で最も比率の大きい成分を示すものである。
次に複合材の例を挙げる。例えば、AとBをロウ材Cを用いてロウ付けする時、それぞれの異種金属とロウ材Cとのぬれ性がBと悪くAと良い場合は、Bに予めAを冶金的に固相接合しA+Bとしておき、ロウ材CによりA+C+A+Bとしたり、ロウ材Cとぬれ性の良い他金属材料D材を予めBに冶金的に接合しD+Bとしておきロウ材CによりA+C+D+Bとする。Aとぬれ性が悪くBとぬれ性が良い場合は、前記と同じ考え方でA+B+C+Bとしたり、A+D+C+Bとすることである。A及びBともぬれ性が悪い場合は、同じ考え方でAにぬれ性の良い金属材料FとBにぬれ性の良い金属材料Gを予め冶金的に接合しておき、ロウ材CでA+F+C+G+Bとすればよい。
【0010】
さらに、得られた複合板で、ぬれ性の良い金属材料を予め固相接合した面及びロウ付け部での液相接合面で良好な接合がなされているかどうかの確認は、JIS G 0601の超音波探傷、JIS Z 2343浸透探傷試験及び顕微鏡によるミクロ観察により行うことができる。
本発明による複合材は、所要形状への加工中に剥がれ又は分離等の問題もなく、又、通電性が約50%向上し特に放電加工用電極部材に適している。
【0011】
【発明実施の形態】
以下、実施例により説明する。
【0012】
【実施例1】
ロウ付けしたい銅板に先立って、ぬれ性の良いそれと同材質の合わせ材銅板C1100Pの3mm厚さと、母材鋼板SS400の30mm厚さとを、幅x長さが1000x1500mmの寸法で、冶金接合である爆発圧着法にて製作した。そのクラッド板より50mm幅、100mm長さ、すなはち、(3+30)x50x100を切り出し、ぬれ性の良い合わせ材銅C1100P厚さ3mm側とロウ付けしたい銅板C1100P厚さ10mmを、JIS Z 3261BAg−1の銀ロウ材によりロウ付けを行い、銅板+銀ロウ+銅板+鋼板(10+銀ロウ+3+30)x50x100mm複合板を製造した。接合状況は、爆着クラッド後JIS G 0601の超音波探傷試験にて100%圧着していることを確認し、50x100mmに切断後は、接合端面はJIS Z2343の浸透探傷試験で無欠陥であることを確認し、更には、10%抜き取りで顕微鏡によるミクロ観察を行い、脆弱な金属間化合物、及び、ミクロ的隙間もなく、極めて良好であった。ロウ付けの接合面も、前記と同じ要領で確認し、両ロウ付け面とも極めて良好接合されていた。
【0013】
但し、極々微小であるが顕微鏡によるミクロ観察で、浸透探傷試験では検出できない約10μmの極めて小さい点状の隙間が、僅かに確認された。この状況は、ロウ付けの上下とも同じで、従来法のように連続している隙間は、全く見られなかった。50x100mmより、原厚x7x10mmの寸法に50個切り出し、切削加工を行ったが、剥がれ、分離は全く見られ無かった。更に、その50個を放電加工用電極として使用したが、使用中の剥がれ、分離も全く見らず、通電、放電が高い水準で安定していた。
【0014】
【実施例2】
ロウ付けしたいCu30%−W70%合金の金属材料に先立って、ぬれ性の良くない母材鋼板SS400の30mm厚さの表面に、予めぬれ性の良い銅板C1100Pの3mm厚さを合わせ材として、幅x長さが200x200mmの寸法で、冶金接合である爆発圧着法にて製作した。そのクラッド板より45mm幅、95mm長さ、すなはち、(3+30)x45x95を切り出し、ぬれ性の良い合わせ材銅C1100P厚さ3mm側とロウ付けしたいCu30%−W70%合金板厚さ10mmを、JIS Z 3261BAg−1の銀ロウ材によりロウ付けを行い、Cu30%−W70%合金板+銀ロウ+銅板+鋼板(10+銀ロウ+3+30)x45x95mm複合板を製造した。接合状況は、爆着クラッド後JIS G 0601の超音波探傷試験にて100%圧着していることを確認し、45x95mmに切断後は、接合端面はJIS Z2343の浸透探傷試験で無欠陥であることを確認し、更には、顕微鏡によるミクロ観察を行い、脆弱な金属間化合物、及び、ミクロ的隙間もなく、極めて良好であった。ロウ付けの接合面も、前記と同じ要領で確認し、Cu30%−W70%合金側も、銅側も極めて良好なロウ付けであった。
【0015】
尚、極々微小であるが、両側ロウ付け面とも顕微鏡によるミクロ観察で、浸透探傷試験では検出できない約10μmの極めて小さい点状の隙間が、僅かに確認されたが、従来法のように連続している隙間は、全く見られなかった。45x95mmより、原厚x7x10mmの寸法に40個切り出し、切削加工を行ったが、剥がれ、分離は全く見られ無かった。更に、その40個を放電加工用電極として使用したが、使用中の剥がれ、分離も全く見らず、通電、放電が高い水準で安定していた。
【0016】
【比較例1】
従来技術で比較するため、基本的に実施例1と同材料を用いることにした。すなはち、ぬれ性の悪い母材鋼板SS400の30mm厚さと向かい合わせに、ぬれ性の良い銅板のC1100P厚さ10mmを配置し、JIS Z 3261BAg−1の銀ロウ材によりロウ付けし複合板を製造した。寸法は、銅板、銀ロウ、鋼板(10+銀ロウ+30)の板厚で、幅x長さが、50x100mmとした。接合状況は、ロウ付け後JIS G0601の超音波探傷試験では、未接合と見られる欠陥らしきエコーはあるものの、明確に断定できず、接合端面をJISZ2343の浸透探傷試験を行なったところ、銀ロウと鋼板の間に点状、又は、連続状の欠陥が約25%見られた。
【0017】
更に、一部切り出し顕微鏡観察を行ったところ、脆弱な金属間化合物も、一部に見られ、隙間10〜15μmの未接合部が、点状、又は、連続状の欠陥として約45%も見られた。これらの未接合は、当然のごとく鋼とロウ付け部に見られ、一方銅部とロウ付けの間は、浸透探傷試験では検出できないが、顕微鏡によるミクロ観察で約10μmの極めて小さい点状隙間が、僅かに確認されたのみで、実施例1と同様であった。その複合板より、7x10mmの寸法に45個切り出し、切削加工を行ったところ、5個に接合部の開口、剥がれ、分離が見られた。残り40個を放電加工用電極として使用したが、使用中の6個も開口部が見られた。この開口や、剥がれ、分離は、全て鋼とロウ材の間であった。
【0018】
【発明の効果】
本発明により、これまでロウ付け部に見られた脆弱な金属間化合物は全く生じることなく、又、ミクロ観察で新たに確認された未接合部も生じないため、従来品の、接合強度が弱く種々問題を生じていたことを解決し、加えて、これまでロウ付け出来なかった組み合わせも可能とし、複合材として所要形状への切断、機械加工中、曲げ加工中等、又は、使用中の開口、剥がれ、分離もなく、結果的に著しい生産性の向上、又、不良材の発生もなく経済効果が期待出来ると共に、これまで利用出来なかった各技術分野への適用も可能となり、新たな産業への発展も期待される。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a composite material by brazing mainly used in the electronics industry, semiconductor industry, metal mold relations, industrial machinery and the like.
[0002]
[Prior art]
It is considered an easy technique to firmly bond different metals to each other by brazing. This is because a lamellar brittle intermetallic compound is generated by melting of the bonding interface in the liquid phase bonding process, and is a phenomenon often seen in brazing. Therefore, the composite material having such a weak layer often peels off during processing or use, or causes problems such as separation or inability to be used as a composite plate.
[0003]
In order to solve the above problems, there is a brazing method using a coating method. For example, in Japanese Patent Laid-Open No. 8-257743, a nitride or carbide is previously coated on a joint surface of dissimilar metals and brazed, but even with this coating method, the thickness of the coating layer is limited, For example, if it is thin, a porous part is formed, and diffusion occurs from the part, resulting in formation of a brittle intermetallic compound, which cannot be completely avoided. Also, for example, in Japanese Patent Application Laid-Open No. 60-133971, brazing is performed after 5-100 μm of Al, Al—Si, Ag, Sn is coated on the joining surface of steel or stainless steel. Formation of fragile intermetallic compounds due to heat effects is unavoidable, and problems such as peeling during processing or use into a desired shape or separation have not been completely solved.
[0004]
[Problems to be solved by the invention]
In order to clarify the problem, the inventor of the present application observed the reaction part in the liquid phase joining process in detail and analyzed the composite material by brazing, which is a conventional method, and as a result, the formation of a fragile layered intermetallic compound In addition, it was confirmed that a gap of about 10 to 20 μm was present in a dotted and continuous manner at the interface between the brazing material and the material to be joined. That is, as a whole, the brazed boundary surface includes unreacted unreacted parts due to the wettability of the brazing material and the material to be joined, which can reach about 50% of the entire joining surface in a large case. Etc., and confirmed new problems that occurred outside the vulnerable part of the reaction part.
[0005]
As described above, the method of directly brazing dissimilar metals or the latest method of coating in advance cannot completely avoid the generation of fragile intermetallic compounds at the bonding interface, and 100% bonding is performed. It ’s difficult. Therefore, there have been many problems in manufacturing and use, such as peeling or separating the composite plate after joining into a desired shape or during use. Furthermore, the expected performance cannot be ensured in such a composite plate, and for example, various problems such as instability of conductivity during use and reduction in production efficiency due to deterioration occur. There are some uses that have not been done. The object of the present invention is to prevent the occurrence of unbonded portions between the brazing material and the base material as much as possible and prevent the formation of fragile intermetallic compounds. As a result, they are peeled off during processing into a desired shape and during use. It aims at providing the composite material which does not produce.
[0006]
[Means for Solving the Problems]
That is, the present invention
[1] A composite material in which two base metal materials are bonded to a joining auxiliary material via a brazing material, and at least one of the base metal materials is solid-phase bonded to the joining auxiliary material by explosive pressure bonding. A composite material characterized by
[ 2 ] The composite material according to [1], wherein the joining auxiliary material has a thickness of 0.5 to 6 mm.
As described above, the present invention is a composite material having a bonding auxiliary layer and a brazing material layer between base metal materials, and the bonding auxiliary layer and the metal material layer are solid-phase bonded. .
In the present invention, the base metal material refers to a metal material to be finally joined, and examples thereof include a metal plate material, a sintered material, a pressed material, and a forged material. Moreover, any kind of normally used metals such as steel, iron, copper, aluminum, tungsten (W), silver, nickel, titanium, molybdenum, niobium, tantalum, and alloys thereof can be used. In the present invention, a great effect is obtained when the base metal materials are different from each other, but the same kind of metal may be used. This is particularly effective in the case of a metal material obtained by sintering or pressing metal powder, in the case of a metal material that cannot be subjected to explosive pressure bonding, or in the case of a combination of base metal materials that are difficult to be solid-phase bonded.
[0007]
In the present invention, the joining auxiliary material is a metal that assists the joining of the base metal material and the brazing material, is a metal that can be solid-phase joined to the metal material to be joined, and has a wettability with the brazing material to be used. Ru good metal material der. For example, copper - when a tungsten alloy and steel to be bonded with a silver brazing material, copper is preferable, also, to an aluminum alloy and stainless be joined with an aluminum alloy brazing material, aluminum alloy is preferable. The thickness of the joining auxiliary material layer is preferably 0.11 to 10 mm, more preferably 0.5 to 6 mm, and particularly preferably in the range of 1 to 3 mm. If necessary, the bonding auxiliary layer may be solid-phase bonded to both base metal materials.
[0008]
Here, “good wettability” refers to a state in which when a liquid brazing material is placed on the metal surface, the familiarity between the two is good and the brazing material spreads in a thin film on the entire metal surface. Examples of the combination of the joining auxiliary layer and the brazing material having good wettability include Cu and silver brazing material, and Al alloy and Al alloy brazing material.
Solid-phase bonding refers to a method of bonding close to the range where the attractive force between atoms is applied, or bonding by the diffusion phenomenon of atoms, a method in which solid metal materials are pressed together at room temperature or under heating conditions, or an explosion and a method of bonding is not good.
[0009]
The joining auxiliary material is composed of a main component of either the brazing material or the base metal material. Here, the main component indicates a component having the largest ratio among a plurality of components.
Next, examples of composite materials are given. For example, when A and B are brazed using a brazing material C, if the wettability of each dissimilar metal and brazing material C is bad and good with A, A is preliminarily metallurgically solid-phase bonded to B. and left as an a + B, or the a + C + a + B by brazing material C, shall be the a + C + D + B by metallurgically bonded to the brazing material C leave the D + B good other metallic materials D material wettability with the brazing material C in advance B. When the wettability is poor with A and the wettability with B is good, A + B + C + B or A + D + C + B is set in the same way as described above. If both A and B have poor wettability, a metal material F having good wettability with A and a metal material G with good wettability are preliminarily metallurgically bonded to A with the same concept, and the brazing material C is used as A + F + C + G + B. That's fine.
[0010]
Further, in the obtained composite plate, it is confirmed whether or not a good bonding is performed on the surface where the metal material having good wettability is solid-phase bonded in advance and the liquid-phase bonding surface at the brazing portion is in accordance with JIS G 0601. It can be performed by sonic flaw detection, JIS Z 2343 penetration flaw detection test, and micro observation with a microscope.
The composite material according to the present invention is free from problems such as peeling or separation during processing into a required shape, and is improved in electrical conductivity by about 50%, and is particularly suitable for an electrode member for electric discharge machining.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example explains.
[0012]
[Example 1]
Prior to the copper plate to be brazed, an explosion that is a metallurgical joint with a thickness of 3 mm of a laminated copper plate C1100P of the same material as that having good wettability and a thickness of 30 mm of a base steel plate SS400, with a width x length of 1000 x 1500 mm Produced by the crimping method. 50 mm wide and 100 mm long from the clad plate, that is, (3 + 30) × 50 × 100 is cut out, and a good wettability copper C1100P thickness 3 mm side and a copper plate C1100P thickness 10 mm to be brazed are JIS Z 3261BAg-1 Were brazed with a silver brazing material, and a copper plate + silver brazing + copper plate + steel plate (10 + silver brazing + 3 + 30) × 50 × 100 mm composite plate was produced. As for the joining condition, it was confirmed that 100% pressure bonding was performed by ultrasonic flaw detection test of JIS G 0601 after explosive cladding, and after cutting to 50x100 mm, the joint end surface is defect-free by penetration test of JIS Z2343. Further, microscopic observation with a microscope was carried out with 10% sampling, and there was no brittle intermetallic compound and no microscopic gap, and it was very good. The joining surface of the brazing was also confirmed in the same manner as described above, and both the brazing surfaces were extremely well joined.
[0013]
However, a very small spot-like gap of about 10 μm, which was extremely small but could not be detected by the penetrant flaw test, was slightly confirmed by microscopic observation with a microscope. This situation was the same for the upper and lower parts of brazing, and no continuous gap was found as in the conventional method. From 50 × 100 mm, 50 pieces were cut out to a size of the original thickness × 7 × 10 mm and cut, but peeling and separation were not seen at all. Further, 50 of them were used as electrodes for electric discharge machining, but they were not peeled off or separated at all during use, and conduction and discharge were stable at a high level.
[0014]
[Example 2]
Prior to the metal material of the Cu 30% -W 70% alloy to be brazed, a width of 3 mm of the copper plate C1100P with good wettability is previously combined with the 30 mm thick surface of the base steel plate SS400 with poor wettability. The x length was 200 × 200 mm, and it was manufactured by the explosive pressure bonding method, which is metallurgical bonding. Cut out from the clad plate 45mm width, 95mm length, that is, (3 + 30) x45x95, and weighed a good wettability copper C1100P thickness 3mm side and Cu30% -W70% alloy plate thickness 10mm to be brazed, Brazing was performed with a silver brazing material of JIS Z 3261BAg-1, and a Cu 30% -W 70% alloy plate + silver brazing + copper plate + steel plate (10 + silver brazing + 3 + 30) × 45 × 95 mm composite plate was produced. As for the joining situation, it was confirmed that 100% crimping was performed by ultrasonic flaw detection test after JIS G 0601 after explosive cladding, and after cutting to 45 x 95 mm, the joint end face was defect-free by penetration test of JIS Z2343. Further, microscopic observation with a microscope was conducted, and there was no fragile intermetallic compound and no microscopic gap, and the result was extremely good. The joint surface of the brazing was also confirmed in the same manner as described above, and the Cu 30% -W 70% alloy side and the copper side were very good brazing.
[0015]
Although it was extremely small, a very small spot-like gap of about 10 μm that could not be detected by the penetrant flaw test was confirmed by microscopic observation on both brazed surfaces, but it was continuous as in the conventional method. No gaps were seen. Forty pieces were cut out from 45 × 95 mm to a thickness of the original thickness × 7 × 10 mm and cut, but peeling and separation were not observed at all. Further, 40 of them were used as electric discharge machining electrodes, but they were not peeled off or separated at all during use, and conduction and discharge were stable at a high level.
[0016]
[Comparative Example 1]
Basically, the same material as in Example 1 was used for comparison with the prior art. In other words, a C1100P thickness of 10 mm, a copper plate with good wettability, is placed opposite to the 30 mm thickness of the base steel plate SS400 with poor wettability, and the composite plate is brazed with a silver brazing material of JIS Z 3261BAg-1. Manufactured. The dimensions were the thickness of a copper plate, silver brazing, and steel plate (10 + silver brazing + 30), and the width x length was 50 × 100 mm. As for the bonding state, in the ultrasonic flaw detection test of JIS G0601 after brazing, although there seems to be a defect that seems to be unbonded, it could not be clearly determined. About 25% of point-like or continuous defects were observed between the steel plates.
[0017]
Furthermore, when partially cut out and observed with a microscope, some fragile intermetallic compounds are also found, and unbonded portions with a gap of 10 to 15 μm are seen as about 45% as point-like or continuous defects. It was. These unbonded parts are naturally found in the steel and the brazed part, while the copper part and the brazed part cannot be detected by a penetrant flaw detection test, but a very small spot-like gap of about 10 μm is observed by microscopic observation with a microscope. This was the same as in Example 1 with only slight confirmation. When 45 pieces were cut out from the composite plate to a size of 7 × 10 mm and cut, a joint opening, peeling, and separation were found in five pieces. The remaining 40 were used as electric discharge machining electrodes, but 6 openings in use were seen. This opening, peeling, and separation were all between steel and brazing material.
[0018]
【The invention's effect】
According to the present invention, the brittle intermetallic compound that has been seen in the brazed portion until now does not occur at all, and the unbonded portion newly confirmed by micro observation does not occur, so the bonding strength of the conventional product is weak. In addition to solving various problems, in addition, combinations that could not be brazed until now are possible, and cutting into a required shape as a composite material, during machining, bending, etc., or opening in use, There is no peeling, no separation, resulting in significant productivity improvement, no generation of defective materials, and economic effects can be expected, and it can be applied to various technical fields that could not be used so far. Development is also expected.

Claims (2)

2枚の母材金属材料が接合補助材料とロウ材を介して接合された複合材であって、該母材金属材料の少なくとも一方が前記接合補助材料と爆発圧着により固相接合されていることを特徴とする複合材。A composite material in which two base metal materials are joined to a joining auxiliary material via a brazing material, and at least one of the base metal materials is solid-phase joined to the joining auxiliary material by explosive pressure bonding . A composite material characterized by 接合補助材料の厚みが、0.5〜6mmの範囲からなることを特徴とする請求項1記載の複合材。The composite material according to claim 1, wherein the joining auxiliary material has a thickness in a range of 0.5 to 6 mm.
JP07293697A 1997-03-26 1997-03-26 Composite Expired - Lifetime JP3797637B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP07293697A JP3797637B2 (en) 1997-03-26 1997-03-26 Composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07293697A JP3797637B2 (en) 1997-03-26 1997-03-26 Composite

Publications (2)

Publication Number Publication Date
JPH10263848A JPH10263848A (en) 1998-10-06
JP3797637B2 true JP3797637B2 (en) 2006-07-19

Family

ID=13503762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07293697A Expired - Lifetime JP3797637B2 (en) 1997-03-26 1997-03-26 Composite

Country Status (1)

Country Link
JP (1) JP3797637B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102151977A (en) * 2011-02-14 2011-08-17 南京润邦金属复合材料有限公司 Big-board TU1/Q235B explosive welding high-strength conductive composite plate
CN106077945A (en) * 2016-07-04 2016-11-09 南昌航空大学 A kind of method improving titanium alloy/aluminium alloy dissimilar metal friction stir spot welding strength of joint

Also Published As

Publication number Publication date
JPH10263848A (en) 1998-10-06

Similar Documents

Publication Publication Date Title
EP0238433B1 (en) Titanium-copper-nickel braze filler metal
JP4257728B2 (en) Formation method of spatter target assembly
US4988035A (en) Method of liquid phase diffusion bonding of metal bodies
EP0001173A1 (en) A process for the diffusion welding of copper and stainless steel
EP0135937A2 (en) Method of bonding alumina to metal
US5322740A (en) Solid state joint between aluminum alloys and/or magnesium alloys, and a method of making same
KR100734794B1 (en) Method for making a joint between copper and stainless steel
WO2013129281A1 (en) Method for joining metal materials
US20190296316A1 (en) Battery tab having a localized welded joint and method of making the same
JP2006198679A (en) Different kind of metal joining method
US6450396B1 (en) Method for making weldless magnesium/aluminum bonded components
JP2004519330A (en) Method for producing clad material having steel base material and corrosion resistant metal coating
WO1992001528A1 (en) Hot diffusion welding
US6984358B2 (en) Diffusion bonding process of two-phase metal alloys
JP5071752B2 (en) Dissimilar metal joining method by resistance seam welding
JPH06108246A (en) Diffusion-bond sputtering target assembly and its production
JP3554835B2 (en) Backing plate manufacturing method
JP3797637B2 (en) Composite
US4706872A (en) Method of bonding columbium to nickel and nickel based alloys using low bonding pressures and temperatures
JP3629578B2 (en) Ti-based material and Cu-based bonding method
JPH04325470A (en) Metallic foil clad ceramics product and its manufacture
JPH1177365A (en) Insert material for joining ti-al series intermetallic compound and ti base alloy and joining method therefor and joined body
JP2002292474A (en) Method for bonding titanium material or titanium alloy material
JPH06172993A (en) Diffusion bonded sputtering target assembled body and its production
TW201943679A (en) Composite body and process for producing a composite body

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050905

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050920

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051114

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20051114

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060329

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060414

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060417

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090428

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090428

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090428

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100428

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110428

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110428

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120428

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120428

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130428

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130428

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140428

Year of fee payment: 8

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term