JP4236099B2 - Method for producing pattern forming body - Google Patents

Description

  The present invention relates to a method for producing a novel pattern forming body that can be used for various applications including printing.

  2. Description of the Related Art Conventionally, various methods for manufacturing a pattern forming body for forming various patterns such as designs, images, characters, and circuits on a substrate have been manufactured.

  For example, when printing is described as an example, a lithographic printing plate used for lithographic printing, which is a kind of printing method, is a lithographic plate having a pattern composed of an oleophilic part that accepts ink and a part that does not accept printing ink. The lithographic printing plate is used to form an ink image to be printed on the lipophilic portion, and the formed image is transferred to paper or the like for printing. In such printing, a printing plate as a pattern forming body is produced by forming patterns such as characters and figures on the printing plate precursor as described above, and is used by being mounted on a printing press. Many printing plate precursors for offset printing, which are typical planographic printing plates, have been proposed.

  A printing plate for offset printing is produced by a method of exposing and developing through a mask on which a pattern is drawn on the printing plate precursor, or a method of exposing directly by an electrophotographic method and making a plate directly on the printing plate precursor. can do. An electrophotographic offset printing plate precursor is provided with a photoconductive layer mainly composed of photoconductive particles such as zinc oxide and a binder resin on a conductive substrate, and this is exposed as a photoconductor by electrophotography. In this method, an offset original plate, that is, a pattern forming body is obtained by forming a highly lipophilic image on the surface of the photoreceptor and subsequently hydrophilizing the non-image portion by treatment with a desensitizing solution. The hydrophilic portion is immersed in water or the like to make it oleophobic, and the printing ink is received in the oleophilic image portion and transferred to paper or the like. However, in the pattern formation, various post-exposure treatments such as treatment with a desensitizing solution are required.

  There has also been proposed a method for producing a lithographic printing plate precursor using a heat mode recording material capable of forming a pattern composed of a portion having high receptivity to ink and a portion having ink repellency by laser irradiation. Yes. The heat mode recording material does not require a process such as development, and has a feature that a printing plate can be produced simply by forming an image with a laser beam. There were problems in the processing of residues such as solid substances and the printing durability.

  In addition, as a method for forming a high-definition pattern, a photoresist layer coated on a substrate is subjected to pattern exposure, and after the exposure, the photoresist is developed, further etched, or a substance having functionality in the photoresist. There is known a method of manufacturing a pattern forming body by photolithography, such as directly forming a target pattern by exposing a photoresist using a photoresist.

  The formation of high-definition patterns by photolithography is used for the formation of colored patterns for color filters used in liquid crystal display devices, the formation of microlenses, the manufacture of fine electrical circuit boards, the manufacture of chromium masks used for pattern exposure, etc. However, depending on these methods, it is necessary to use a photoresist and develop with a liquid developer after exposure or to perform etching. In addition, when a functional substance is used as a photoresist, there is a problem that it deteriorates due to an alkali solution or the like used during development.

  A high-definition pattern such as a color filter is also formed by printing or the like, but the pattern formed by printing has problems such as positional accuracy, and it is difficult to form a high-precision pattern. .

  On the other hand, in order to solve such problems, the present inventors have studied a method for producing a pattern forming body in which a pattern is formed using a substance whose wettability is changed by the action of a photocatalyst. However, the conventional method for producing a pattern forming body by the action of a photocatalyst has a configuration in which the photo-catalyst is included in the manufactured pattern forming body itself, and depending on the type of the pattern forming body, this photocatalyst may cause deterioration. In some cases, there was a problem of having the property.

  The present invention has been made in view of the above problems, and can produce a pattern with high accuracy in the production of a pattern-formed body, and does not require post-treatment after exposure, and can produce a patterned pattern. Since a photocatalyst is not contained in the body, the main object is to provide a method for producing a pattern forming body that does not have to worry about deterioration of the pattern forming body itself.

  In order to achieve the above object, the present invention provides a pattern according to claim 1, comprising a photocatalyst containing layer side substrate having at least a photocatalyst containing layer, and a characteristic changing layer whose characteristics change at least by the action of the photocatalyst in the photocatalyst containing layer. The formed body substrate is disposed so that the photocatalyst-containing layer and the property change layer are in contact with each other, and then exposed to change the properties of the exposed property change layer, and then the photocatalyst-containing layer side substrate is There is provided a method for producing a pattern forming body characterized in that a pattern forming body having a pattern with a changed characteristic on a characteristic changing layer is obtained by removing the pattern forming body.

  Thus, in the present invention, the photocatalyst-containing layer and the property change layer are arranged so as to be in contact with each other, and then exposed to change the property of the property change layer in the exposed portion to form a pattern. Therefore, a post-exposure post-treatment is not particularly necessary, and a pattern forming body having a high-definition pattern can be manufactured. Further, since the photocatalyst containing layer side substrate is removed from the pattern forming body after exposure, the pattern forming body itself does not include the photocatalyst containing layer, and therefore there is a concern about deterioration over time due to the action of the photocatalyst of the pattern forming body. Absent.

  In the present invention, as described in claim 2, the photocatalyst-containing layer side substrate may be formed of at least a transparent substrate and a photocatalyst-containing layer, and may be formed separately from the substrate for pattern formation. As described above, the photocatalyst-containing layer side substrate may be formed by coating the photocatalyst-containing layer on the characteristic change layer of the pattern forming substrate.

  When the photocatalyst-containing layer side substrate is formed separately from the pattern-forming body substrate and is composed of at least a photocatalyst-containing layer and a transparent substrate, this is formed on the characteristic-changing layer of the pattern-forming body substrate. After exposing the photocatalyst-containing layer side substrate to contact and forming a pattern on the characteristic change layer by the action of the photocatalyst, the photocatalyst-containing layer side substrate can be used again by removing the photocatalyst-containing layer side substrate. . That is, by configuring the photocatalyst-containing layer side substrate in this way, in principle, it is possible to produce a pattern forming body using the photocatalyst-containing layer side substrate as many times as possible. Therefore, there is an advantage when a large number of pattern forming bodies are manufactured at one time.

  On the other hand, when the photocatalyst-containing layer side substrate is formed by coating the photocatalyst-containing layer on the characteristic change layer of the pattern forming substrate, the photocatalyst-containing layer side can be easily coated by simply coating on the characteristic change layer. It is possible to form a substrate, which is advantageous when the number of pattern forming bodies is small. In addition, when the photocatalyst containing layer side substrate is formed by coating the photocatalyst containing layer on the characteristic change layer in this way, the photocatalyst containing layer after the exposure is removed by a method such as peeling using an adhesive tape or the like. Is called.

In the method for producing a pattern forming body of the present invention, as described in claim 4, the photocatalyst contained in the photocatalyst containing layer is titanium dioxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ). Strontium titanate (SrTiO ₃ ), tungsten oxide (WO ₃ ), bismuth oxide (Bi ₂ O ₃ ), and iron oxide (Fe ₂ O ₃ ) preferable. Of these, titanium dioxide (TiO ₂₎ is preferable as described in claim 5. This is because titanium dioxide has a high band gap energy and is effective as a photocatalyst, and is chemically stable, non-toxic and easily available.

  In the present invention, as described in claim 6, it is preferable that the substrate for a pattern forming body is formed of at least a substrate and the characteristic change layer provided on the substrate. This is because the normal characteristic change layer has various characteristics, and is preferably formed as a thin film on the substrate in terms of strength, cost, and function.

  Furthermore, as described in claim 7, the characteristic change layer in the present invention is preferably a wettability change layer in which the wettability of the surface is changed by the action of the photocatalyst in the photocatalyst-containing layer. There are various characteristics of the characteristic change layer, and among them, an important one is a change in wettability. By making the property change layer a wettability change layer in this way, it becomes possible to form a pattern whose wettability has changed by the action of the photocatalyst on the pattern forming body. This is because various functional elements such as a color filter and a microlens can be formed by attaching the composition for the sex part, as will be described later.

  In the present invention, as described in claim 8, it is preferable that the wettability changing layer is a wettability changing layer whose wettability changes so that a contact angle of water is reduced by exposure. In this way, if a wettability changing layer that changes wettability is formed so that the contact angle of water is reduced by exposure, the wettability of this layer can be easily changed by performing exposure or the like, and contact with water An ink-philic region having a small corner can be formed. For example, only a portion to which the functional part composition is attached can be easily formed as an ink-philic region. Therefore, a color filter, a microlens, etc. can be manufactured efficiently, which is advantageous in terms of cost.

  In the present invention, the contact angle with water on the wettability changing layer is preferably 90 ° or more in the unexposed portion and 30 ° or less in the exposed portion. Since the unexposed part is a part that requires ink repellency, when the contact angle of water is less than 90 degrees, the ink repellency is not sufficient, and the functional part composition such as ink is not available. Since it may remain, it is not preferable. In addition, the contact angle of water in the exposed portion is set to 30 degrees or less. If the contact angle exceeds 30 degrees, the spread of the composition for the functional part such as ink in this portion may be inferior. This is because inconveniences such as color loss may occur when the characteristic portion is a pixel portion of a color filter.

  In addition, as described in claim 10, it is preferable that the wettability changing layer is a layer containing an organopolysiloxane. In the present invention, the properties required for the wettability changing layer are ink repellency when light is not irradiated, and the parent ink by the action of the photocatalyst in the photocatalyst-containing layer that is contacted when light is irradiated. It is characteristic that it becomes sex. This is because organopolysiloxane is first mentioned as a material that imparts such characteristics to the wettability changing layer.

Among such organopolysiloxanes, as described in claim 11, Y _n SiX _(4-n) (where Y is an alkyl group, a fluoroalkyl group, a vinyl group, an amino group, a phenyl group or an epoxy group) X represents an alkoxyl group or halogen, and n is an integer of 0 to 3.) One or two or more hydrolyzed condensates or cohydrolyzed condensates of a silicon compound represented by Polysiloxane is preferred. This is because such an organopolysiloxane satisfies the above characteristics well.

  In the present invention, as described in claim 12, the property change layer may be a decomposition removal layer that is decomposed and removed by the action of the photocatalyst in the photocatalyst containing layer. Thus, by using the property changing layer as a decomposition removal layer that is decomposed and removed by the action of the photocatalyst in the photocatalyst containing layer, the exposed portion is decomposed and removed by the action of the photocatalyst. In this way, the portion exposed to light can be completely decomposed and removed without the need for post-treatment, for example, the decomposition removal layer is a photoresist, and the photocatalyst-containing layer side substrate is brought into contact therewith. This is because there are various uses such as that a pattern can be formed on a photoresist without the necessity of performing a conventional development process by exposure.

  In this case, it is preferable that the contact angle of water between the decomposition removal layer and the exposed member exposed when the decomposition removal layer is decomposed and removed is different.

  In this way, the contact angle of water between the decomposition / removal layer and the exposed member exposed when the decomposition / removal layer is decomposed / removed is different, so that the exposed portion is decomposed and removed by the action of the photocatalyst. As a result, the exposed member is exposed on the surface. On the other hand, the decomposition removal layer remains in the unexposed part. Here, when the contact angle of water is different between the decomposition removal layer and the exposed exposed member, for example, when the decomposition removal layer is formed of an ink repellent material and the exposure member is formed of an ink-philic material In such a case, it is possible to remove the decomposition removal layer of the part by previously irradiating light to the part where the functional part is previously formed to act on the photocatalyst, and the exposed part is a concave and ink-philic region, The unexposed part is a convex part and becomes an ink-repellent area. Accordingly, the functional part composition can be accurately and easily attached to the concave part in which the functional part is provided and the part of the ink-philic region. Therefore, the functional part can be formed more accurately than in the case where the characteristic change layer described above is a wettability change layer, and post-exposure post-processing such as a development step or a washing step is not required. For this reason, it is possible to easily simplify the process, and it is possible to obtain a functional element having an inexpensive and accurate functional part.

  Further, the contact angle of water on the decomposition / removal layer is preferably 60 degrees or more, and the contact angle of water on the exposed member surface exposed when the decomposition / removal layer is decomposed and removed is preferably 30 degrees or less (claims). Item 14).

  In the present invention, the decomposition removal layer remains in the portion that is not exposed. Here, since the unexposed part is a part that normally requires ink repellency, when the contact angle of water on the decomposition removal layer is less than 60 degrees, the ink repellency is not sufficient, and the functional part This is not preferable because the composition may remain.

  On the other hand, the exposed portion is decomposed and removed by the action of the photocatalyst in the photocatalyst-containing layer with which the decomposition and removal layer contacts. Therefore, the exposed part exposes the exposed member formed under the decomposition removal layer on the surface. Since this part is usually a part that requires ink affinity, when the contact angle of water on the exposed member exceeds 30 degrees, the spread of the functional part composition in this part may be inferior. This is because the functional part composition may be lost in the functional part.

  As described above, the decomposition / removal layer is preferably decomposed and removed by the photocatalyst in the photocatalyst-containing layer in contact with the ink and has ink repellency. It is preferably a fluorine-based or silicone-based nonionic surfactant.

  The pattern exposure method in the present invention may be a method using a photomask as described in claim 16 or by light drawing irradiation as described in claim 17, and is obtained. It is appropriately selected according to the nature and application of the pattern forming body. The exposure is preferably performed while heating the photocatalyst-containing layer as described in claim 18. This is because the photocatalyst in the photocatalyst containing layer with respect to the characteristic change layer acts with high sensitivity by exposing the photocatalyst containing layer while heating.

  In order to further solve the above-mentioned problem, the present invention provides a photocatalyst-containing layer side substrate comprising at least a transparent substrate and a photocatalyst-containing layer as described in claim 19, wherein the characteristics change on the surface by the action of the photocatalyst. A photocatalyst-containing layer-side substrate for producing a pattern-forming body, wherein the pattern-forming body is formed by contacting the photo-catalyst-containing layer with the characteristic-changing layer of the pattern-forming substrate having a characteristic-changing layer to be exposed. provide.

As described above, the photocatalyst-containing layer side substrate for producing the pattern forming body of the present invention is exposed to the photocatalyst-containing layer in contact with the characteristic change layer of the pattern forming body substrate, whereby a pattern is formed on the pattern forming body. Can be formed. Therefore, by removing from the post-exposure property changing layer, in principle, it can be used repeatedly as many times as possible. In this case, as described in claim 20, the photocatalyst contained in the photocatalyst-containing layer is preferably titanium dioxide.
This is because titanium dioxide has a high band gap energy and is effective as a photocatalyst, and is chemically stable, non-toxic and easily available.

  In order to solve the above problems, the present invention provides, as described in claim 21, at least a substrate and a property changing layer formed on the substrate and having a pattern whose properties are changed by the action of a photocatalyst. Provided is a pattern forming body characterized by having no photocatalyst-containing layer.

  Thus, the pattern forming body of the present invention has at least the substrate and the characteristic change layer having a pattern whose characteristic is changed by the action of the photocatalyst. Therefore, for example, when this change in characteristics is a change in wettability, this pattern forming body can be used as various printing original plates utilizing the difference in acceptability with ink. It is possible to obtain various low-cost printing original plates that do not need to be performed. Moreover, since this pattern formation body does not have a photocatalyst containing layer, it has the advantage that there is no possibility that a pattern formation body will deteriorate over time by the effect | action of a photocatalyst.

  In the present invention, it is preferable that the characteristic change layer is a wettability change layer in which the wettability changes so that the contact angle of water is reduced by exposure due to the action of the photocatalyst.

  In this way, the wettability change layer in which the wettability changes so that the contact angle of water decreases due to exposure due to the action of the photocatalyst at the time of exposure, so that the wettability easily changes by performing exposure. Thus, a pattern forming body having a pattern of the ink-philic region having a small water contact angle can be obtained. Therefore, by attaching the functional part composition to the pattern of the ink-philic region of such a pattern forming body, functional elements such as color filters and microlenses can be efficiently manufactured, which is advantageous in terms of cost. Because it becomes.

  Further, the present invention is the decomposition removal layer in which the characteristic change layer is decomposed and removed by the action of the photocatalyst, and is exposed when the decomposition removal layer and the decomposition removal layer are decomposed and removed. It is preferable that the contact angle of water with the exposed member is different.

  As described above, the characteristic change layer is the decomposition removal layer, and the pattern forming body has a different water contact angle with the exposed member exposed when the decomposition removal layer is decomposed and removed. In addition, it is possible to obtain a pattern forming body in which the wettability of the portion where the functional portion is previously provided is an ink-philic region having a small water contact angle and the other portion is an ink repellent region having a large water contact angle. By attaching the functional part composition to the ink-philic region pattern of such a pattern forming body, the functional part composition can be easily attached only to the ink-philic region having a small water contact angle. it can. Therefore, as in the case where the characteristic change layer is a wettability change layer, a functional element can be easily formed from the pattern forming body without performing post-treatment after exposure such as a development step or a washing step. For this reason, the process can be easily simplified, and a functional element having a functional part can be obtained at low cost.

  In this invention, as described in Claim 24, it can be set as a functional element by arrange | positioning a functional part on the site | part corresponding to the pattern formed in the pattern formation body mentioned above. Thus, a functional element can be easily obtained by using the pattern forming body of the present invention.

  In this case, as described in claim 25, the pattern is a pattern formed by parts having different water contact angles, and the functional part is formed on a part having a small water contact angle in this pattern. An element is preferred. As described above, this is because the functional element can be easily obtained by attaching the composition for a functional part to the ink-philic region having a small contact angle with water. This is because it is advantageous.

  The functional element of the present invention can be a color filter in which the functional portion is a pixel portion as described in claim 26, and the functional portion is a lens as described in claim 27. Thus, a microlens can be obtained. This is because the advantages of the present invention can be fully utilized by using color filters or microlenses.

  The present invention includes a photocatalyst-containing layer-side substrate having at least a photocatalyst-containing layer, and a pattern forming body substrate having at least a property-changing layer whose properties are changed by the action of a photocatalyst in the photocatalyst-containing layer. Arrangement so that the property change layer is in contact, and then by exposure, the property of the property change layer of the exposed portion is changed, and then the photocatalyst-containing layer side substrate is removed to change the property on the property change layer. It is a manufacturing method of the pattern formation body characterized by obtaining the pattern formation body which has the pattern formed.

  Thus, in the present invention, the photocatalyst-containing layer and the property change layer are arranged so as to be in contact with each other, and then exposed to change the property of the property change layer in the exposed portion to form a pattern. Therefore, a post-exposure post-treatment is not particularly necessary, and a pattern forming body having a high-definition pattern can be manufactured. Further, since the photocatalyst containing layer side substrate is removed from the pattern forming body after exposure, the pattern forming body itself does not include the photocatalyst containing layer, and therefore there is a concern about deterioration over time due to the action of the photocatalyst of the pattern forming body. There is no effect.

  Hereinafter, the manufacturing method of the pattern formation body of this invention is demonstrated in detail. The method for producing a pattern forming body of the present invention comprises: a photocatalyst containing layer side substrate having at least a photocatalyst containing layer; and a pattern forming body substrate having at least a characteristic changing layer whose characteristics are changed by the action of the photocatalyst in the photocatalyst containing layer. Is disposed so that the photocatalyst-containing layer and the property change layer are in contact with each other, and then exposed to change the property of the property change layer of the exposed portion, and then the photocatalyst-containing layer side substrate is removed, thereby providing the characteristics. It is characterized in that a pattern forming body in which a pattern with changed characteristics is formed on a change layer is obtained.

  As described above, in the method for producing a patterned product of the present invention, the photocatalyst-containing layer and the property change layer are arranged so as to be in contact with each other, and then exposed to thereby expose the portion exposed by the action of the photocatalyst in the photocatalyst-containing layer. The characteristic of the characteristic change layer changes, and a pattern is formed by the exposed part on the characteristic change layer, that is, the part with the changed characteristic. Accordingly, post-processing such as development / washing after exposure is not required for pattern formation, so that the pattern can be formed with fewer steps and at a lower cost. Therefore, a functional element such as a color filter can be easily and inexpensively formed by forming the functional portion along the pattern of the pattern forming body.

  Furthermore, in the present invention, after the characteristics on the characteristic change layer are changed by the action of the photocatalyst in the photocatalyst containing layer, the photocatalyst containing layer side substrate is removed and the pattern forming body side substrate is used as the pattern forming body. The resulting pattern forming body does not contain a photocatalyst-containing layer. Therefore, when a functional part is formed on the resulting pattern-formed body to obtain a functional element, the functional element does not include a photocatalyst containing layer, and therefore the functional element may be changed over time by the action of the photocatalyst. It is possible to eliminate the possibility of deterioration.

  The manufacturing method of such a pattern formation body of this invention is demonstrated using drawing. In addition, the pattern in this invention shows various patterns, such as a design, an image, a circuit, a character, and is not specifically limited.

  FIG. 1 shows an example of a method for producing a pattern forming body of the present invention. In this manufacturing method, first, a photocatalyst containing layer side substrate 3 composed of a transparent substrate 1 and a photocatalyst containing layer 2 formed on the transparent substrate 1, a substrate 4 and a characteristic change layer 5 provided on the substrate 4. 1 is prepared (see FIG. 1A).

  Next, the photocatalyst containing layer 2 of the photocatalyst containing layer side substrate 3 and the characteristic changing layer 5 of the pattern forming substrate 6 are brought into close contact with each other, and exposure is performed, for example, with UV light or the like through the photomask 7. . Thereby, the characteristic of the exposed part on the characteristic change layer 5 changes to become the characteristic change part 8 (see FIG. 1B).

  Next, by removing (separating) the photocatalyst-containing layer side substrate 3 from the substrate for the pattern forming body, a pattern forming body 9 in which the pattern of the characteristic changing portion 8 is drawn on the characteristic changing layer 5 is formed (FIG. 1C )reference).

  Moreover, the other example of the manufacturing method of the pattern formation body of this invention is shown in FIG. In this example, first, a pattern forming substrate 6 having a characteristic change layer 5 formed on a substrate 4 is prepared (see FIG. 2A). Next, the photocatalyst-containing layer 2 is formed on the characteristic change layer by coating or the like (see FIG. 2B). In this example, the photocatalyst containing layer 2 formed by coating or the like is the photocatalyst containing layer side substrate 3 referred to in the present invention. And the characteristic change site | part 8 is formed on the characteristic change layer 5 by exposing through the photomask 7 similarly to the said 1st example (refer FIG.2 (C)). Finally, by removing the photocatalyst-containing layer 2, a pattern forming body 9 in which the pattern of the characteristic change site 8 is formed on the characteristic change layer 5 is obtained (see FIG. 2D).

  Hereinafter, the pattern forming body manufacturing method of the present invention will be described in detail by taking the above-described two manufacturing methods as examples.

(Photocatalyst containing layer side substrate)
The photocatalyst containing layer side substrate in the present invention includes any substrate as long as it has at least a photocatalyst containing layer. For example, as shown in the example shown in FIG. 1, the transparent substrate 1 may be included in addition to the photocatalyst containing layer 2, or the photocatalyst containing layer 2 is formed alone as shown in the example of FIG. May be. Further, other layers may be formed as necessary.

  Moreover, this photocatalyst containing layer side substrate was obtained by forming the photocatalyst containing layer 2 on the transparent substrate 1, as shown in the example of FIG. 1, and was previously formed separately from the substrate for the pattern forming body. 2 and may be formed so as to be integrated with the pattern forming substrate, such as the one formed by coating on the pattern forming substrate 6 as in the example shown in FIG. May be.

  As shown in FIG. 1, when the photocatalyst-containing layer side substrate 3 is formed separately from the pattern forming body substrate 6, the characteristic changing layer of the pattern forming body substrate 6 is formed as shown in FIGS. 5, the photocatalyst-containing layer side substrate 3 is exposed to light, and a pattern is formed on the characteristic change layer 5 by the action of the photocatalyst. A substrate 3 can be used. That is, by configuring the photocatalyst-containing layer side substrate in this way, in principle, this photocatalyst-containing layer side substrate can be used any number of times, which is advantageous when a large number of pattern forming bodies are manufactured.

  When the photocatalyst-containing layer side substrate is formed separately from the pattern forming substrate, it is preferable to have at least a transparent substrate in addition to the photocatalyst-containing layer in view of strength, cost, and the like. That is, as shown in FIG. 1, the structure in which the photocatalyst-containing layer 2 is formed on the transparent substrate 1 can withstand the strength when repeatedly used, and is formed separately only by the photocatalyst-containing layer 2. This is advantageous in terms of cost.

  Such a photocatalyst-containing layer side substrate may have any configuration as long as it has at least a photocatalyst-containing layer and a transparent substrate and has a portion where the photocatalyst-containing layer is exposed on one side. For example, a photomask may be integrally formed, and a protective layer or the like may be formed around it. Further, in FIG. 1B, a contact inhibition layer is formed in a mask pattern on the photocatalyst-containing layer so that a characteristic change site can be formed in a pattern on the characteristic change layer even if the entire surface is exposed. The part which contacts may be restrict | limited to pattern shape, and the photocatalyst containing layer itself may be formed in pattern shape.

  On the other hand, when the photocatalyst-containing layer side substrate is integrally formed by applying the photocatalyst-containing layer on the pattern forming substrate 6 as shown in FIG. 2, the photocatalyst-containing layer side substrate needs to have strength. Therefore, a layer for maintaining strength is not necessary, which is advantageous in obtaining a small number of pattern-formed bodies.

  Also in this case, any other layer may be formed as long as at least the photocatalyst-containing layer is included. For example, in order to facilitate removal of the photocatalyst-containing layer side substrate, an adhesive layer or the like may be provided in advance. . Moreover, this photocatalyst containing layer may be formed in a pattern.

(Photocatalyst containing layer)
As described above, the photocatalyst containing layer side substrate 3 includes at least the photocatalyst containing layer 2.

  The photocatalyst-containing layer is not particularly limited as long as the photocatalyst-containing layer is configured to change the characteristics of the characteristic-changing layer in contact with the photocatalyst, and is composed of a photocatalyst and a binder. Alternatively, it may be a film formed of a single photocatalyst. Further, the wettability of the surface may be particularly ink-philic or ink-repellent.

  The action mechanism of a photocatalyst represented by titanium dioxide as described later in this photocatalyst-containing layer is not necessarily clear, but carriers generated by light irradiation react directly with nearby compounds, or oxygen It is believed that the active oxygen species generated in the presence of water change the chemical structure of organic matter. In the present invention, it is considered that this carrier acts on the compound in the property change layer that contacts the photocatalyst-containing layer.

Examples of the photocatalyst used in the present invention include titanium dioxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), strontium titanate (SrTiO ₃ ), tungsten oxide (WO ₃ ), which are known as photo semiconductors. Bismuth oxide (Bi ₂ O ₃ ) and iron oxide (Fe ₂ O ₃ ) can be mentioned, and one or a mixture of two or more selected from these can be used.

  In the present invention, titanium dioxide is particularly preferably used because it has a high band gap energy, is chemically stable, has no toxicity, and is easily available. Titanium dioxide includes an anatase type and a rutile type, and both can be used in the present invention, but anatase type titanium dioxide is preferred. Anatase type titanium dioxide has an excitation wavelength of 380 nm or less.

  Examples of such anatase type titanium dioxide include hydrochloric acid peptizer type anatase type titania sol (STS-02 manufactured by Ishihara Sangyo Co., Ltd. (average particle size 7 nm), ST-K01 manufactured by Ishihara Sangyo Co., Ltd.), nitric acid solution An anatase type titania sol (TA-15 manufactured by Nissan Chemical Co., Ltd. (average particle size 12 nm)) and the like can be mentioned.

  The smaller the particle size of the photocatalyst, the more effective the photocatalytic reaction occurs. The average particle size is preferably 50 nm or less, and it is particularly preferable to use a photocatalyst of 20 nm or less.

  The photocatalyst-containing layer in the present invention may be formed of a photocatalyst alone as described above, or may be formed by mixing with a binder.

  In the case of forming the photocatalyst alone, for example, in the case of titanium dioxide, there is a method of forming amorphous titania on a transparent substrate or a characteristic change layer and then changing the phase to crystalline titania by firing. As the amorphous titania used here, for example, hydrolysis, dehydration condensation, tetraethoxytitanium, tetraisopropoxytitanium, tetra-n-propoxytitanium, tetrabutoxytitanium, titanium inorganic salts such as titanium tetrachloride and titanium sulfate, An organic titanium compound such as tetramethoxytitanium can be obtained by hydrolysis and dehydration condensation in the presence of an acid. Next, it can be modified to anatase titania by baking at 400 ° C. to 500 ° C. and modified to rutile type titania by baking at 600 ° C. to 700 ° C.

  In the case of using a binder, it is preferable that the binder main skeleton has a high binding energy that is not decomposed by photoexcitation of the photocatalyst. For example, such a binder is described in the description of the wettability changing layer described later. Examples thereof include organopolysiloxanes described in detail.

  When organopolysiloxane is used as a binder in this way, the photocatalyst-containing layer is prepared by dispersing the photocatalyst and the binder organopolysiloxane in a solvent together with other additives as necessary, The coating liquid can be formed by coating on a transparent substrate or a characteristic change layer. As the solvent to be used, alcohol-based organic solvents such as ethanol and isopropanol are preferable. The coating can be performed by a known coating method such as spin coating, spray coating, dip coating, roll coating or bead coating. When an ultraviolet curable component is contained as the binder, the photocatalyst-containing layer can be formed by irradiating ultraviolet rays and performing a curing treatment.

Moreover, an amorphous silica precursor can be used as a binder. This amorphous silica precursor is represented by the general formula SiX ₄ , wherein X is a silicon compound such as halogen, methoxy group, ethoxy group, or acetyl group, a hydrolyzate thereof, silanol, or an average molecular weight of 3000 or less. Polysiloxane is preferred.

  Specific examples include tetraethoxysilane, tetraisopropoxysilane, tetra-n-propoxysilane, tetrabutoxysilane, and tetramethoxysilane. In this case, the amorphous silica precursor and the photocatalyst particles are uniformly dispersed in a non-aqueous solvent and hydrolyzed with moisture in the air on a transparent substrate to form silanol. A photocatalyst-containing layer can be formed by dehydration-condensation polymerization. If dehydration condensation polymerization of silanol is carried out at 100 ° C. or higher, the degree of polymerization of silanol increases and the strength of the film surface can be improved. Moreover, these binders can be used individually or in mixture of 2 or more types.

  The content of the photocatalyst in the photocatalyst containing layer can be set in the range of 5 to 60% by weight, preferably 20 to 40% by weight. The thickness of the photocatalyst containing layer is preferably in the range of 0.05 to 10 μm.

  In addition to the photocatalyst and the binder, the photocatalyst containing layer can contain a surfactant. Specifically, hydrocarbons such as NIKKOL BL, BC, BO, BB series manufactured by Nikko Chemicals Co., Ltd., ZONYL FSN, FSO manufactured by DuPont, Surflon S-141, 145 manufactured by Asahi Glass Co., Ltd., Dainippon Megafac F-141, 144 manufactured by Ink Chemical Industry Co., Ltd., Footgent F-200, F251 manufactured by Neos Co., Ltd., Unidyne DS-401, 402 manufactured by Daikin Industries, Ltd., Fluorard FC-170 manufactured by 3M Co., Ltd. Fluorine-based or silicone-based nonionic surfactants such as 176 can be used, and cationic surfactants, anionic surfactants, and amphoteric surfactants can also be used.

  In addition to the above surfactants, the photocatalyst-containing layer includes polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate, Polyvinyl chloride, polyamide, polyimide, styrene butadiene rubber, chloroprene rubber, polypropylene, polybutylene, polystyrene, polyvinyl acetate, polyester, polybutadiene, polybenzimidazole, polyacrylonitrile, epichlorohydrin, polysulfide, polyisoprene, oligomers, polymers, etc. It can be included.

(Transparent substrate)
In the present invention, as shown in FIG. 1, the photocatalyst containing layer side substrate 3 is preferably composed of a transparent substrate 1 and a photocatalyst containing layer 2 formed on the transparent substrate 1.

  As shown in FIG. 1B, this transparent substrate transmits light such as UV light so that exposure can be performed from the side where the photocatalyst containing layer 2 of the photocatalyst containing layer side substrate is not formed. There is no particular limitation as long as it is a material to be used. Preferable materials include, for example, inflexible transparent rigid materials such as quartz glass, pyrex glass, and synthetic quartz plates, or flexible transparent flexible materials such as transparent resin films and optical resin plates. be able to.

(Pattern for pattern formation)
In the manufacturing method of the pattern formation body of this invention, as shown in FIG.1 and FIG.2, first, the photocatalyst containing layer side board | substrate 3 and the substrate 6 for pattern formation bodies which were mentioned above are prepared.

  The substrate for pattern forming body is not particularly limited as long as it has at least a characteristic change layer, but it is preferable that the characteristic change layer is formed on the substrate from the viewpoint of strength and the like. Further, if necessary, other protective layers and the like may be formed, but it is necessary that the characteristic change layer is exposed at least on the entire surface or partially.

  In the present invention, the pattern forming substrate refers to a substrate in which the pattern due to the characteristic changing portion has not yet been formed on the characteristic changing layer, and the pattern forming substrate is exposed to light on the characteristic changing layer. A pattern formed body is formed with a pattern of the characteristic change portion.

(Characteristic change layer)
In the present invention, the property change layer may be any layer as long as the property is changed by the action of the photocatalyst. For example, the photochromic material such as spiropyran or the organic dye decomposed by the action of the photocatalyst in the property change layer. Etc. may be mixed in the characteristic change layer, and the characteristic change layer may be a layer colored by the action of the photocatalyst.

  In addition, for example, by using a polymer material such as polyethylene such as polyethylene or polypropylene, a polar group is introduced into the exposed part due to the action of a photocatalyst, or the surface state becomes rough. A layer that is improved in adhesiveness may be used as a characteristic change layer. Thus, by making the characteristic change layer an adhesive change layer in which the adhesiveness changes, it becomes possible to form a pattern with good adhesiveness by pattern exposure. For example, a pattern forming body having such a pattern with a good adhesive property is formed by depositing a metal component on such a pattern forming body to form a metal thin film, and then utilizing the difference in adhesiveness to form a metal. By peeling the thin film with, for example, an adhesive or a drug, a metal thin film pattern can be formed. According to this method, it is possible to form a metal thin film pattern without forming a resist pattern, and it is possible to form a printed circuit board or an electronic circuit element having a finer pattern than that obtained by the printing method. it can.

  As described above, the characteristic change layer is not particularly limited as long as it has various characteristics that change due to the action of the photocatalyst. However, in the present invention, the characteristic change layer changes the wettability due to the action of the photocatalyst. Functions that can be obtained in particular are the wettability changing layer in which a pattern due to the property is formed and the decomposition changing layer in which the property changing layer is decomposed and removed by the action of the photocatalyst to form a pattern due to unevenness. This is preferable because the effectiveness of the present invention can be further extracted from the relationship of the active elements and the like.

(Wettability change layer)
The wettability changing layer in the present invention refers to a layer in which the wettability of the surface is changed by the action of the photocatalyst at the time of exposure, and a pattern can be formed by the site having changed wettability. The wettability changing layer is not particularly limited, but the wettability changing layer is preferably a wettability changing layer whose wettability changes so that the contact angle of water is reduced by exposure.

  In this way, by using a wettability changing layer in which the wettability changes so that the contact angle of water is reduced by exposure, the wettability is easily changed by performing pattern exposure or the like, and the contact angle of water is small. A pattern of ink-philic regions can be formed. Therefore, for example, by exposing only the part where the functional part on the wettability changing layer is formed, it becomes possible to easily form an ink-philic region, and by attaching the functional part composition to this part, A functional element can be easily formed. Therefore, a functional element can be manufactured efficiently, which is advantageous in terms of cost.

  Here, the ink-philic region is a region where the contact angle of water is small, and refers to a region having good wettability with respect to a functional part composition, such as a coloring ink or a microlens forming composition. And The ink repellent region is a region where the contact angle of water is large and refers to a region where the wettability with respect to the coloring ink, the microlens forming composition, etc. is poor.

  The wettability changing layer has a contact angle of water of 90 degrees or more, preferably 140 degrees or more in an unexposed portion. This is because the unexposed part is a part that requires ink repellency in the present invention. Therefore, when the contact angle of water is less than 90 degrees, the ink repellency is not sufficient, and coloring is not possible. This is because the functional part composition such as ink may remain, which is not preferable.

  The wettability changing layer is preferably a layer that, when exposed to light, has a contact angle of water that is reduced to 30 degrees or less, more preferably 20 degrees or less. The contact angle of water in the exposed part is set to 30 degrees or less. When the contact angle exceeds 30 degrees, there is a possibility that the spread of the composition for functional parts such as coloring ink in this part may be inferior. This is because a part may be chipped.

  In addition, the contact angle of water here means the value measured using a contact angle measuring device (Kyowa Interface Science Co., Ltd. CA-1Z type) 30 seconds after dropping a water drop from a microsyringe.

  As a material used for such a wettability changing layer, the characteristics of the wettability changing layer described above, that is, a material whose wettability is changed by the photocatalyst in the photocatalyst-containing layer that is contacted by exposure, and deteriorated by the action of the photocatalyst, There is no particular limitation as long as it has a main chain that is difficult to be decomposed. For example, (1) an organopolysiloxane that exhibits high strength by hydrolysis and polycondensation of chloro or alkoxysilane by sol-gel reaction or the like. Examples thereof include organosiloxanes such as siloxanes and (2) organopolysiloxanes crosslinked with reactive silicones having excellent water repellency and oil repellency.

In the case of (1) above, the general formula:
Y _n SiX _(4-n)
(Here, Y represents an alkyl group, a fluoroalkyl group, a vinyl group, an amino group, a phenyl group or an epoxy group, X represents an alkoxyl group, an acetyl group or a halogen. N is an integer from 0 to 3. )
It is preferable that it is the organopolysiloxane which is a 1 type, or 2 or more types of hydrolysis condensate or cohydrolysis condensate of the silicon compound shown by these. Here, the number of carbon atoms of the group represented by Y is preferably in the range of 1 to 20, and the alkoxy group represented by X is a methoxy group, an ethoxy group, a propoxy group, or a butoxy group. preferable.

  Specifically, methyltrichlorosilane, methyltribromosilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, methyltri-t-butoxysilane; ethyltrichlorosilane, ethyltribromosilane, ethyltrimethoxysilane, Ethyltriethoxysilane, ethyltriisopropoxysilane, ethyltri-t-butoxysilane; n-propyltrichlorosilane, n-propyltribromosilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, n-propyltriisopropoxy Silane, n-propyltri-t-butoxysilane; n-hexyltrichlorosilane, n-hexyltribromosilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, n-hexyl Lutriisopropoxysilane, n-hexyltri-t-butoxysilane; n-decyltrichlorosilane, n-decyltribromosilane, n-decyltrimethoxysilane, n-decyltriethoxysilane, n-decyltriisopropoxysilane, n -Decyltri-t-butoxysilane; n-octadecyltrichlorosilane, n-octadecyltribromosilane, n-octadecyltrimethoxysilane, n-octadecyltriethoxysilane, n-octadecyltriisopropoxysilane, n-octadecyltri-t-butoxysilane Phenyltrichlorosilane, phenyltribromosilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriisopropoxysilane, phenyltri-t-butoxysilane; tetrachlorosilane Tetrabromosilane, tetramethoxysilane, tetraethoxysilane, tetrabutoxysilane, dimethoxydiethoxysilane; dimethyldichlorosilane, dimethyldibromosilane, dimethyldimethoxysilane, dimethyldiethoxysilane; diphenyldichlorosilane, diphenyldibromosilane, Diphenyldimethoxysilane, diphenyldiethoxysilane; phenylmethyldichlorosilane, phenylmethyldibromosilane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane; trichlorohydrosilane, tribromohydrosilane, trimethoxyhydrosilane, triethoxyhydrosilane, triisopropoxy Hydrosilane, tri-t-butoxyhydrosilane; vinyltrichlorosilane, vinyltribromosilane, vinyltri Methoxysilane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltrit-butoxysilane; trifluoropropyltrichlorosilane, trifluoropropyltribromosilane, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, trifluoropropyl Triisopropoxysilane, trifluoropropyltri-t-butoxysilane; γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy Propyltriethoxysilane, γ-glycidoxypropyltriisopropoxysilane, γ-glycidoxypropyltri-t-butoxysilane; γ-methacryloxypropylmethyldimethyl Xysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-methacryloxypropyltriisopropoxysilane, γ-methacryloxypropyl Tri-t-butoxysilane; γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltriisopropoxysilane, γ- Aminopropyltri-t-butoxysilane; γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltrieth Xysilane, γ-mercaptopropyltriisopropoxysilane, γ-mercaptopropyltri-t-butoxysilane; β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane And partial hydrolysates thereof; and mixtures thereof can be used.

  In particular, a polysiloxane containing a fluoroalkyl group can be preferably used. Specific examples include one or two or more hydrolytic condensates and cohydrolytic condensates of the following fluoroalkylsilanes: In general, those known as fluorine-based silane coupling agents can be used.

_{CF 3 (CF 2) 3 CH} 2 CH 2 Si (OCH 3) 3;
_{CF 3 (CF 2) 5 CH} 2 CH 2 Si (OCH 3) 3;
_{CF 3 (CF 2) 7 CH} 2 CH 2 Si (OCH 3) 3;
_{CF 3 (CF 2) 9 CH} 2 CH 2 Si (OCH 3) 3;
(CF ₃ ) ₂ CF (CF ₂ ) ₄ CH ₂ CH ₂ Si (OCH ₃ ) ₃ ;
_{(CF 3) 2 CF (CF} 2) 6 CH 2 CH 2 Si (OCH 3) 3;
_{(CF 3) 2 CF (CF} 2) 8 CH 2 CH 2 Si (OCH 3) 3;
_{CF 3 (C 6 H 4)} C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 3 (} C 6 H 4) C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 5 (} C 6 H 4) C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 7 (} C 6 H 4) C 2 H 4 Si (OCH 3) 3;
_{CF 3 (CF 2) 3 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 5 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 7 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 9 CH} 2 CH 2 SiCH 3 (OCH 3) 2;
_{(CF 3) 2 CF (CF} 2) 4 CH 2 CH 2 SiCH 3 (OCH 3) 2;
_{(CF 3) 2 CF (CF} 2) 6 CH 2 CH 2 Si CH 3 (OCH 3) 2;
_{(CF 3) 2 CF (CF} 2) 8 CH 2 CH 2 Si CH 3 (OCH 3) 2;
_{CF 3 (C 6 H 4)} C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 3 (} C 6 H 4) C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 5 (} C 6 H 4) C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 7 (} C 6 H 4) C 2 H 4 SiCH 3 (OCH 3) 2;
_{CF 3 (CF 2) 3 CH} 2 CH 2 Si (OCH 2 CH 3) 3;
_{CF 3 (CF 2) 5 CH} 2 CH 2 Si (OCH 2 CH 3) 3;
_{CF 3 (CF 2) 7 CH} 2 CH 2 Si (OCH 2 CH 3) 3;
_{CF 3 (CF 2) 9 CH} 2 CH 2 Si (OCH 2 CH 3) 3; and _{CF 3 (CF 2) 7 SO} 2 N (C 2 H 5) C 2 H 4 CH 2 Si (OCH 3) 3.

  By using a polysiloxane containing a fluoroalkyl group as described above as a binder, the ink repellency of the non-exposed part of the wettability changing layer is greatly improved, and the adhesion of the composition for functional parts such as coloring ink is attached. Expresses the function of preventing

  Examples of the reactive silicone (2) include compounds having a skeleton represented by the following general formula.

However, n is an integer of 2 or more, R ^1, R ² are each a substituted or unsubstituted alkyl having 1 to 10 carbon atoms, alkenyl, aryl or cyanoalkyl group, the total molar ratio of 40% or less Vinyl, phenyl and phenyl halide. In addition, it is preferable that R ¹ and R ² are methyl groups because the surface energy is the smallest, and it is preferable that the methyl groups are 60% or more by molar ratio. In addition, the chain end or side chain has at least one reactive group such as a hydroxyl group in the molecular chain.

  Moreover, you may mix the stable organosilicone compound which does not carry out a crosslinking reaction like dimethylpolysiloxane with said organopolysiloxane.

  The wettability changing layer in the present invention may further contain a surfactant. Specifically, hydrocarbons such as NIKKOL BL, BC, BO, BB series manufactured by Nikko Chemicals Co., Ltd., ZONYL FSN, FSO manufactured by DuPont, Surflon S-141, 145 manufactured by Asahi Glass Co., Ltd., Dainippon Megafac F-141, 144 manufactured by Ink Chemical Industry Co., Ltd., Footgent F-200, F251 manufactured by Neos Co., Ltd., Unidyne DS-401, 402 manufactured by Daikin Industries, Ltd., Fluorard FC-170 manufactured by 3M Co., Ltd. Fluorine-based or silicone-based nonionic surfactants such as 176 can be used, and cationic surfactants, anionic surfactants, and amphoteric surfactants can also be used.

  In addition to the above surfactants, the wettability changing layer includes polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate. , Polyvinyl chloride, Polyamide, Polyimide, Styrene butadiene rubber, Chloroprene rubber, Polypropylene, Polybutylene, Polystyrene, Polyvinyl acetate, Polyester, Polybutadiene, Polybenzimidazole, Polyacrylonitrile, Epichlorohydrin, Polysulfide, Polyisoprene, etc. Can be contained.

  Such a wettability changing layer can be formed by preparing a coating solution by dispersing the above-described components in a solvent together with other additives as necessary, and coating the coating solution on a substrate. . As the solvent to be used, alcohol-based organic solvents such as ethanol and isopropanol are preferable. The coating can be performed by a known coating method such as spin coating, spray coating, dip coating, roll coating or bead coating. In addition, in the case where an ultraviolet curable component is contained, the wettability changing layer can be formed by irradiating with ultraviolet rays and performing a curing treatment.

  In the present invention, the thickness of the wettability changing layer is preferably 0.001 μm to 1 μm, particularly preferably in the range of 0.01 to 0.1 μm, from the relationship of the wettability change rate by the photocatalyst. is there.

  By using the wettability changing layer of the above-described component in the present invention, by the action of the photocatalyst in the photocatalyst-containing layer in contact, the action of oxidation, decomposition or the like of the organic group or additive which is a part of the above component is used. It is possible to change the wettability of the exposed portion to make the ink affinity, thereby making a great difference in wettability with the non-exposed portion. Therefore, a color filter that has good quality and is advantageous in terms of cost by enhancing the acceptability (ink affinity) and the repellent property (ink repellency) of the functional part composition, for example, the coloring ink. Etc. can be obtained.

(Decomposition removal layer)
Next, the decomposition removal layer will be described. This decomposition removal layer is a layer in which the exposed portion of the decomposition removal layer is decomposed and removed by the action of the photocatalyst in the photocatalyst-containing layer when exposed. For example, in FIG. 1, when the characteristic change layer 5 is a decomposition removal layer, the characteristic change part in FIG. 1C is decomposed and removed by the action of the photocatalyst, as shown in FIG. Then, the pattern forming body in which the pattern of the decomposition / removal layer 10, in other words, the decomposition / removal layer 10 is removed, and the concavo-convex pattern with the underlying substrate 4 exposed is formed. Similarly, in FIG. 2, a pattern forming body can be obtained in which the decomposition / removal layer 10 is removed on the substrate 4 to form an uneven pattern in which the substrate 4 is exposed (see FIG. 2D ′).

  As described above, the decomposed and removed layer is decomposed and removed by the action of the photocatalyst, so that the pattern including the portion with and without the decomposed / removed layer without performing the development process and the cleaning process, that is, the pattern having unevenness. Can be formed. Therefore, members that require uneven patterns such as various printing plate precursors can be easily formed by this method. In addition, by applying this decomposition / removal layer on the screen and bringing it into contact with the photocatalyst-containing layer side substrate for pattern exposure, the exposed portion of the decomposition / removal layer is decomposed and removed. -It can be formed without a cleaning step. Further, when this decomposition / removal layer is formed of a material having resist characteristics, a resist pattern can be easily formed by exposing the pattern to contact with the photocatalyst-containing layer side substrate. Therefore, it can be used in a semiconductor manufacturing process or the like as a photoresist without a development / cleaning process.

  This decomposition / removal layer is oxidatively decomposed and vaporized by the action of the photocatalyst by exposure, and is therefore removed without any special post-treatment such as development / washing process. Depending on the case, a cleaning step or the like may be performed.

  In addition, when this decomposition / removal layer is used, it is possible not only to form irregularities, but also to form a pattern based on the difference in characteristics between the exposed member that is decomposed and removed and the decomposition / removal layer. Examples of such properties include various properties such as adhesiveness and color developability, but in the present invention, wettability can be mentioned, and a pattern is formed by the difference in wettability. Therefore, it is preferable in terms of effectiveness when an element is formed.

  That is, in the present invention, it is preferable that the contact angle of water between the decomposition / removal layer and the exposed member exposed by decomposition / removal of the decomposition / removal layer is different. The contact angle of water on the decomposition / removal layer is preferably large, and particularly preferably, the contact angle of the decomposition / removal layer with water is 60 ° or more.

  This is because, in the present invention, the portion that is not exposed becomes a portion where the decomposition removal layer remains, that is, a convex portion, so that the decomposition removal layer is removed and the exposed member is exposed rather than attaching the functional part composition to the convex portion. It is preferable to adhere the composition for functional parts to the recessed part. For this reason, it is preferable that the decomposition / removal layer exhibits ink repellency so that the functional part composition is less likely to adhere, and the contact angle of water on the decomposition / removal layer is preferably larger than that of the exposed member. It becomes. When the contact angle of water on the decomposition / removal layer is less than 60 degrees, the ink repellency is not sufficient, and there is a possibility that the functional part composition such as a coloring ink may remain, which is not preferable.

  The material used for such a decomposition / removal layer is the above-described characteristics of the decomposition / removal layer, that is, a material that is decomposed and removed by the action of the photocatalyst in the photocatalyst-containing layer that is contacted by exposure, and preferably has a contact angle with water. Is a material with an angle of 60 degrees or more.

  Examples of such materials include hydrocarbon-based, fluorine-based, and silicone-based nonionic surfactants. Specific examples of such compounds include polyoxyethylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, perfluoroalkyl ethylene oxide adducts, and perfluoroalkyl amine oxides.

  If such a material is a hydrocarbon-based nonionic surfactant, NIKKOL BL, BC, BO, BB series (trade name, manufactured by Nippon Surfactant Co., Ltd.), fluorine-based or silicon-based nonionic Surfactants such as ZONYL FSN, FSO (trade name, manufactured by DuPont), Surflon S-141, 145 (trade name, manufactured by Asahi Glass Co., Ltd.), MegaFuck F-141, 144 (trade name, Dainippon Ink) ), Aftergent F200, F251 (trade name, manufactured by Neos), Unidyne DS-401, 402 (trade name, manufactured by Daikin Industries), Florad FC-170, 176 (trade name, manufactured by 3M) can do.

  As the material for the decomposition removal layer, other cationic, anionic and amphoteric surfactants can be used. Specifically, sodium alkylbenzenesulfonate, alkyltrimethylammonium salt, perfluoroalkylcarboxylate And perfluoroalkylbetaine.

  Furthermore, as a material for the decomposition removal layer, various polymers or oligomers can be used in addition to the surfactant. Examples of such polymers or oligomers include polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate, polyvinyl chloride, polyamide, polyimide Styrene butadiene rubber, chloroprene rubber, polypropylene, polybutylene, polystyrene, polyvinyl acetate, nylon, polyester, polybutadiene, polybenzimidazole, polyacrylonitrile, epichlorohydrin, polysulfide, polyisoprene, and the like. In the present invention, it is preferable to use an ink-repellent polymer having a high contact angle with water, such as polyethylene, polypropylene, polystyrene, and polyvinyl chloride.

  Such a decomposition / removal layer is prepared by dispersing the above-described components in a solvent together with other additives as necessary to prepare a coating solution, and applying this coating solution to a substrate or an exposed member (a substrate and an exposed member are in common). It can also be formed by coating on top. The coating can be performed by a known coating method such as spin coating, spray coating, dip coating, roll coating or bead coating.

  In the present invention, the thickness of the decomposition removal layer is preferably from 0.001 μm to 1 μm, particularly preferably from 0.01 to 0.1 μm, in view of the decomposition rate by the photocatalyst.

(substrate)
In the method for producing a pattern formed body of the present invention, the characteristic change layer is preferably formed on the substrate 4 as shown in FIGS. 1 and 2 from the relationship with the strength and the relationship with the final functional element. . Examples of such a substrate include metals such as glass, aluminum, and alloys thereof, plastics, woven fabrics, nonwoven fabrics, and the like, depending on the use of the pattern forming body or the functional element formed by the pattern forming body.

  Further, as described above, when the characteristic change layer is the decomposition removal layer, an exposed member may be provided between the substrate and the decomposition removal layer. As described above, the exposed member is a member that is exposed when the decomposition / removal layer is decomposed and removed by the action of the photocatalyst by exposure, and is preferably formed of a material having characteristics different from those of the decomposition / removal layer. In particular, as described above, when the characteristic is wettability, the contact angle with water is preferably 30 degrees or less. Examples of such materials include inorganic materials such as glass ceramics, and polymer materials whose surfaces are hydrophilized with plasma or a coupling agent.

  In the present invention, when the substrate has a function as the exposed member, it is not necessary to provide an exposed member separately.

(Contact between photocatalyst-containing layer and property changing layer)
In the present invention, as shown in FIGS. 1 (B) and 2 (C), the photocatalyst containing layer 2 of the photocatalyst containing layer side substrate 3 and the characteristic changing layer 5 of the pattern forming substrate 6 are in contact with each other during exposure. Need to be arranged.

  Here, the contact referred to in the present invention means a state where the action of the photocatalyst substantially extends to the characteristic change layer, and is on the characteristic change layer as shown in FIG. Including the state of being applied and formed in close contact, and the state of being in physical contact as shown in FIG. 1 (B), for example, even when there is no physical contact, water or air is interposed between them Thus, the case where the photocatalyst in the photocatalyst-containing layer is disposed so that the action of the photocatalyst reaches the characteristic change layer is included. In the present invention, such a contact state need only be maintained at least during exposure.

(exposure)
In this invention, after arrange | positioning so that the photocatalyst containing layer 2 of the photocatalyst containing layer side board | substrate 3 and the characteristic change layer 5 of the board | substrate 6 for pattern formations may contact, FIG.1 (B) and FIG.2 (C) Exposure is performed as shown in FIG.

  The pattern formation by exposure in the present invention is by light drawing irradiation using a laser beam or the like, even if it is by exposure through a photomask 7 as shown in FIG. 1 (B) and FIG. 2 (C). It may be.

  When the photomask is used, a fine pattern can be formed by using a reduction projection exposure method that reduces an image of a mask pattern using a reduction optical system. As such a photomask, it is possible to use a film formed on a metal plate like a mask for vapor deposition, a glass plate formed with metal chrome, and a plate making film for printing applications.

  On the other hand, in the case of light drawing irradiation using a laser beam or the like, a predetermined pattern can be directly drawn using a predetermined drawing irradiation system without using a photomask.

  Usually, the wavelength of light used for such exposure is set in a range of 400 nm or less, preferably in a range of 380 nm or less, but is not limited to this. For example, doping of metal ions such as chromium, platinum, and palladium It is also possible to have sensitivity to visible and other wavelengths by adding a fluorescent substance, adding a photosensitive dye, or the like. Examples of such dyes include cyanine dyes such as cyanine dyes, carbocyanine dyes, dicarbocyanine dyes, and hemicyanine dyes. Other useful dyes include triphenylmethane such as crystal violet and basic fuchsin. Examples thereof include diphenylmethane dyes such as dyes, xanthene dyes such as rhodamine B, Victoria blue, brilliant green, malachite green, methylene blue, pyrylium salt, benzopyrylium salt, trimethine benzopyrylium salt, triallyl carbonium salt and the like.

  Examples of light sources that can be used for such exposure include mercury lamps, metal halide lamps, xenon lamps, excimer lamps, excimer lasers, YAG lasers, and various other light sources.

  In addition, the light irradiation amount at the time of exposure is set to an irradiation amount necessary for the characteristic change layer to change the characteristic by the action of the photocatalyst. In this case, the sensitivity can be increased by exposing the photocatalyst-containing layer while heating. This is particularly important when using light drawing irradiation.

  1B and FIG. 2C, it can be said that exposure is performed from the photocatalyst containing layer side substrate 3 side, but in the present invention, the direction of exposure is not limited to this, and the substrate 4 and characteristics are If the change layer 5 transmits light, the pattern forming body substrate 4 may be exposed from the side.

  By performing the exposure in this way, the exposed characteristic change layer 5 becomes a characteristic change part 8 in a pattern as shown in FIGS. 1 (B) and 2 (C). For example, if the property change layer is a wettability change layer whose wettability changes due to exposure, the property change site becomes a wettability change site. If it is a decomposition removal layer which becomes a part and is further decomposed and removed, it becomes a part where a recess is formed.

(Removal of photocatalyst containing layer side substrate)
In the present invention, as shown in FIGS. 1 (C) and 2 (D), after exposure is performed, the photocatalyst-containing layer side substrate 3 is removed, whereby the characteristic change site 8 is formed on the characteristic change layer 5. A pattern forming body 9 on which a pattern is formed is obtained.

  The removal of the photocatalyst containing layer side substrate in the present invention is performed by simply removing the photocatalyst containing layer side substrate 3 from the pattern forming body 9 if the photocatalyst containing layer side substrate is simply in contact as shown in FIG. For example, as shown in FIG. 2, when the photocatalyst-containing layer side substrate 3 is in close contact with the pattern forming body, it is necessary to peel it off using, for example, an adhesive tape or the like. .

(Pattern formation)
The pattern forming body obtained in this way is obtained by forming a pattern of a characteristic change site on a characteristic change layer. Therefore, when the property of the property change layer is wettability, the portion where the wettability has changed can be used as a printing plate because the acceptability of the printing ink has changed. When the pattern forming body of the present invention is used as a printing plate precursor, there is no need for wet development or the like, and there is an effect that the preparation of the printing plate is completed simultaneously with exposure.

  Moreover, when the characteristic change layer is a decomposition removal layer, the exposed portion is decomposed and removed by the action of the photocatalyst, so that the pattern forming body has a pattern having irregularities. Therefore, the pattern forming body having the unevenness can be used as various printing plate precursors. In addition, when the substrate is a screen and a decomposition / removal layer is formed on the screen as a characteristic change layer, the exposed portion is removed by being decomposed and removed, so that the screen is clogged with the clogged portion. A pattern-formed body comprising portions can be obtained, and can be used as an original for screen printing.

(Functional elements)
Furthermore, various functional elements can be obtained by disposing a functional part on a portion corresponding to the pattern on which the pattern forming body is formed.

  Here, the term “functionality” means optical (light selective absorption, reflectivity, polarization, light selective transmission, nonlinear optical property, luminescence such as fluorescence or phosphorescence, photochromic property, etc.), magnetic (hard magnetism, soft magnetism, etc.). , Non-magnetic, magnetically permeable, etc.), electrical / electronic (conductive, insulating, piezoelectric, pyroelectric, dielectric, etc.), chemical (adsorptive, desorbable, catalytic, water-absorbing, ionic conductivity) , Redox, electrochemical properties, electrochromic, etc.), mechanical (wear resistance, etc.), thermal (heat transfer, heat insulation, infrared radiation, etc.), biofunctional (biocompatibility, antithrombotic, etc.) ) Means various functions.

  There are various methods for disposing the functional part on the part corresponding to the pattern of the pattern forming body depending on the characteristics of the characteristic change layer. For example, if the characteristic change layer is an adhesive change layer that changes the adhesiveness, a pattern with a changed adhesiveness is formed on the pattern forming body, so that the function of metal or the like is entirely formed on the characteristic change layer. The composition for the functional part is vapor-deposited and then peeled off with a pressure-sensitive adhesive or the like, whereby a metal pattern as a functional part is formed only on the part having good adhesion. Thereby, a circuit etc. can be formed easily.

  In addition, when the characteristic change layer is a decomposition removal layer, a pattern with unevenness is changed. Therefore, the functional part can be easily arranged at a site corresponding to the pattern by inserting and adhering the functional part composition into the concave part. In this case, when there is a difference in wettability between the concave portion and the convex portion, the concave portion is an ink-philic region having good wettability, and the convex portion is an ink repellent region having poor wettability. Furthermore, the functional part composition can be easily inserted and adhered.

  In addition, when the property change layer is a wettability change layer, a pattern with changed wettability is formed, so that the wettability is improved by applying the functional part composition onto the pattern forming body. Thus, the functional part composition adheres only to the ink-philic region, and the functional part can be easily disposed at a site corresponding to the pattern of the pattern forming body. In this case, it is desirable that the unexposed portion of the pattern forming body has a critical surface tension of 50 mN / m or less, preferably 30 mN / m or less.

  As described above, the functional part composition used in the present invention varies greatly depending on the function of the functional element, the method of forming the functional element, and the like. For example, a metal pattern is formed due to a difference in adhesiveness. In such a case, the functional part composition becomes a metal, and when a pattern formed body having different wettability or a pattern formed body having different unevenness is used, it is diluted with a solvent typified by an ultraviolet curable monomer. An untreated composition, a liquid composition diluted with a solvent, or the like can be used. In the case of a liquid composition diluted with a solvent, the solvent preferably exhibits a high surface tension such as water or ethylene glycol. Moreover, since a pattern can be formed in a short time as a viscosity is low as a composition for functional parts, it is especially preferable when a characteristic change layer is a wettability change layer. However, in the case of a liquid composition diluted with a solvent, it is desirable that the solvent has low volatility because an increase in viscosity and a change in surface tension occur due to volatilization of the solvent during pattern formation.

  As the functional part composition used in the present invention, it may be a functional part by being attached to the pattern forming body or the like, and after being placed on the pattern forming body, It may be a functional part after being treated with a drug or treated with ultraviolet rays, heat or the like. In this case, when the component for the functional part composition contains a component that is effective with ultraviolet rays, heat, electron beam, etc., it is preferable because the functional part can be formed quickly by performing a curing treatment. .

  The method for forming such a functional element will be specifically described. For example, when the characteristic change layer is a wettability change layer, the functional part composition is applied by dip coating, roll coating, blade coating, spin coating, or the like. The functional part is formed on the pattern of the ink-philic region formed on the pattern forming body using a means such as a nozzle discharge means including an ink jet. For example, as shown in FIG. 3, a characteristic change layer 5 is provided on the substrate 4, and the characteristic change layer 5 is formed by contacting the photocatalyst-containing layer with pattern exposure to form a characteristic change portion (ink affinity). The method of applying the functional part composition 11 using the blade coater 10 on the pattern forming body 9 in which the region 8 is formed, or the functional part on the similar pattern forming body 9 as shown in FIG. Examples thereof include a method in which the composition 11 is dropped and applied with a spin coater 12. By applying the functional part composition 11 in this manner, the functional part composition is formed only on the characteristic change portion 8 which has changed into wet ink property as shown in FIG. Adhere to. A functional element can be formed by curing the functional part composition to form the functional part 13.

  Furthermore, the functional element which has a pattern of a metal film as a functional part can be obtained by using the pattern formation body of this invention for the metal film formation method by electroless plating. This is also an effective method when the characteristic change layer is a wettability change layer, and the treatment is performed only by the chemical plating pretreatment liquid on the ink-philic region of the pattern forming body having a pattern with changed wettability. Subsequently, the functional element which has a desired metal pattern on a characteristic change layer can be obtained by immersing the processed pattern formation body in a chemical plating solution. According to this method, since a metal pattern can be formed without forming a resist pattern, a printed circuit board or an electronic circuit element can be manufactured as a functional element.

  In addition, after the functional part composition is disposed on the entire surface as described above, the unnecessary part is removed by utilizing the difference in characteristics between the exposed part and the unexposed part, thereby forming the functional part along the pattern. You may make it form. This is a particularly effective method when the characteristic change layer is an adhesive change layer. For example, post-treatment such as peeling by peeling off the adhesive tape after adhering the adhesive tape, air blowing, solvent treatment, etc. Thus, an unnecessary portion can be removed to obtain a pattern of the functional portion. Examples of a method for disposing the functional part on the entire surface include vacuum film forming means such as PVD and CVD. That is, the pattern forming body in which the characteristic changing layer 5 having the pattern of the characteristic changing portion 8 is provided on the substrate 4 by using the film forming means 14 using a vacuum such as CVD as shown in FIG. 9, the functional part composition 11 is formed over the entire surface. As a method for removing the unnecessary portion of the functional part composition 11 formed on the entire surface in this way, as shown in FIG. 6B, the adhesive surface of the adhesive tape 15 is brought into close contact and then peeled off. By removing the functional part composition 11 on the exposed part and forming the functional part 13, or by jetting air from the air jet nozzle 16 as shown in FIG. The method etc. which remove the functional part composition 11 and form the functional part 13 can be mentioned.

  Further, FIG. 7 shows a method of forming a functional element particularly effective when the characteristic change layer is an adhesive change layer or a wettability change layer. First, as shown in FIG. A thermal transfer body 19 in which a heat-meltable composition layer 18 is laminated on one side of a sheet 17 on a pattern forming body 9 provided with a characteristic-changing layer 5 having a pattern on a substrate 4, and a heat-meltable composition layer 18. Is in close contact with the characteristic change layer 5. Next, as shown in FIG. 7B, the heating plate 20 is pressed from the sheet 17 side of the thermal transfer body 19 and heated. Then, as shown in FIG. 7C, the functional portion 13 is formed so as to follow the pattern of the characteristic change portion 8 formed on the characteristic change layer 5 by peeling off the thermal transfer body 19 after cooling. Can be obtained (FIG. 7D).

  Specific examples of the functional element thus obtained include a color filter and a microlens.

  The color filter is used in a liquid crystal display device or the like, and has a plurality of pixel portions such as red, green, and blue formed on a glass substrate or the like in a high-definition pattern. By using the pattern formed body of the present invention for the production of this color filter, it is possible to obtain a high-definition color filter at low cost. That is, for example, the characteristic change layer is used as a wettability change layer, and the wettability change layer is subjected to pattern exposure to obtain a pattern-formed body on which a pattern having changed wettability is formed. Next, the pixel portion (the functional portion composition) is easily adhered to the portion having changed wettability (the portion that has become an ink-philic region by exposure) by, for example, an ink jet apparatus or the like. (Functional part) can be formed, whereby a high-definition color filter can be obtained with a small number of steps.

  When the functional element is a microlens, a pattern forming body having a circular pattern with wettability changed on the wettability changing layer is manufactured. Next, when the lens-forming composition (functional part composition) is dropped on the part where the wettability has changed, it spreads only to the ink-philic region where the wettability has changed, and the contact angle of the liquid droplets by dropping further. Can be changed. By curing this lens forming composition, it is possible to obtain various shapes or focal lengths, and high-definition microlenses can be obtained. A manufacturing method of such a microlens will be described with reference to FIG. 8. A pattern forming body in which a circular pattern of a characteristic change portion (ink-philic region) 8 is formed on a characteristic change layer (wetting change layer) 5. 9 is prepared, and then the functional part composition (ultraviolet curable resin composition) is discharged by the discharge device 21 toward the pattern of the circular characteristic change portion (ink-philic region) 8 (FIG. 8 ( A)). This functional part composition (ultraviolet curable resin composition) 11 swells due to the difference in wettability between the ink-repellent area which is the characteristic change site 8 and the ink-repellent area of the unexposed area (FIG. 8). (B)). A microlens 23 is formed by curing the resin using ultraviolet rays 22 for resin curing (FIG. 8C).

  Hereinafter, the present invention will be described in more detail through examples.

[Example 1]
1. Formation of Photocatalyst Containing Layer Side Substrate 0.4 g of MF-160E (trade name, manufactured by Tochem Products Co., Ltd.) mainly composed of 30 g of isopropyl alcohol and fluoroalkylsilane, and trimethoxymethylsilane (manufactured by Toshiba Silicone Co., Ltd.) 3 g of trade name: TSL8113) and 20 g of ST-K01 (trade name; manufactured by Ishihara Sangyo Co., Ltd.) which is a titanium dioxide aqueous dispersion as a photocatalyst were mixed and stirred at 100 ° C. for 20 minutes. This was diluted 3 times with isopropyl alcohol to obtain a composition for a photocatalyst-containing layer.

  The above composition is applied onto a soda glass transparent substrate by a spin coater and dried at 150 ° C. for 30 minutes to form a transparent photocatalyst-containing layer (thickness 0.2 μm) to form a photocatalyst-containing layer side substrate. Formed.

2. Formation of substrate for pattern forming body First, a composition for a wettability changing layer having the following composition was prepared.

(Composition of composition for wettability changing layer)
・ Silicone coating agent (manufactured by Toshiba Silicone Co., Ltd., trade name: YSR3022, composition: 30% by weight of polyalkylsiloxane and polyalkylhydrogensiloxane, 10% by weight of methyl ethyl ketone, 60% by weight of toluene) ... 100 parts by weight Product name: YC6831, composition: organotin compound 40% by weight, toluene 60% by weight) 4 parts by weight, toluene 400 parts by weight

  This composition for wettability changing layer was applied onto a soda glass substrate by a spin coater, and heated at 100 ° C. for 10 minutes to form a wettability changing layer having a thickness of 3 μm to obtain a substrate for a pattern forming body.

3. Exposure The photocatalyst containing layer side substrate is placed on the wettability changing layer of the pattern forming substrate so that the photocatalyst containing layer of the photocatalyst containing layer side substrate contacts the wettability changing layer, and from the photocatalyst containing layer side Exposure was performed at an illuminance of 70 mW / cm ^{2 with} a mercury lamp (wavelength 365 nm) for 60 seconds to form a characteristic change portion (ink-philic region). As a result of measuring the contact angle with water before and after exposure of the wettability changing layer using a contact angle measuring device (CA-Z type manufactured by Kyowa Interface Science Co., Ltd.) The contact angle of water before exposure is 110 degrees, whereas the contact angle of water after exposure is 7 degrees, and the exposed characteristic change portion becomes an ink-philic region, and the exposed portion and the non-exposed portion It was confirmed that it was possible to form a pattern due to the difference in wettability.

4). Formation of Pattern In the same manner as in the above exposure, exposure was performed through a 100 μm line & space photomask to obtain a pattern formed body. When a red colorant having the following composition was applied onto the pattern formed body by a dip coater and UV-cured, a 100 μm line & space red pattern was created.

(Red colorant composition)
UV curing resin (ester acrylate resin: Arakawa Chemical Industries, trade name: AQ-11) 10 parts by weight Curing initiator (1-hydroxycyclohexyl phenyl ketone, Ciba Specialty Chemicals, trade name: Irgacure 184 ) ... 0.5 parts by weight · Red dye (Tokyo Kasei Co., Ltd., trade name: Rose Bengal) ... 0.5 parts by weight

5. Production of Color Filter A wettability changing layer was formed on a transparent substrate made of alkali-free glass in the same manner as described above to obtain a substrate for a pattern forming body. Next, exposure was carried out in the same manner as the exposure described above through a negative photomask in which lines of openings 280 μm were arranged at a pitch of 300 μm to obtain a pattern formed body.

  The composition for each color pixel portion having the following composition is discharged to the exposed portion (characteristic change portion, ink-philic region) of this pattern forming body with a liquid precision discharge device (EED dispenser, trade name: 1500XL-15). A pixel portion composed of a red pattern, a blue pattern, and a green pattern was formed by heat treatment at 100 ° C. for 45 minutes. As a protective layer, a two-component mixed thermosetting agent (manufactured by JSR Co., Ltd., trade name: SS7265) is applied onto the pixel portion with a spin coater, and subjected to a curing treatment at 200 ° C. for 30 minutes to form a protective layer. A color filter was obtained.

(Composition of the composition for the pixel portion)
Pigment (Pigment Red 168, Pigment Green 36, or Pigment Blue 60) 3 parts by weight Nonionic surfactant (Nikko Chemicals, trade name: NIKKOL BO-10TX) 0.05 parts by weight Polyvinyl Alcohol (made by Shin-Etsu Chemical Co., Ltd., trade name: Shin-Etsu Poval AT)… 0.6 parts by weight, water… 97 parts by weight

[Example 2]
1. Preparation of Photocatalyst Containing Layer Side Substrate and Pattern Forming Body Substrate In the same manner as in Example 1, after preparing a pattern forming body substrate, on the wettability changing layer of this pattern forming body substrate, the same as in Example 1 The photocatalyst-containing layer composition was applied by a spin coater and heated at 150 ° C. for 30 minutes to form a photocatalyst-containing layer having a thickness of 0.2 μm, which was used as a photocatalyst-containing layer side substrate.

2. Exposure It exposed similarly to Example 1 from the photocatalyst containing layer side. Then, after pressure-sensitive adhesive tape (manufactured by Sumitomo 3M, trade name: Scotch tape) was pressure-bonded to the photocatalyst-containing layer, 1 mm / sec. The photocatalyst-containing layer was peeled off at a speed of. And the contact angle of water was measured on the wettability change layer before and behind exposure like Example 1. The contact angle of water before exposure is 95 degrees, whereas the contact angle of water after exposure is 7 degrees, and the exposed characteristic change portion becomes an ink-philic region, and the exposed portion and the non-exposed portion It was confirmed that it was possible to form a pattern due to the difference in wettability.

[Example 3]
1. Formation of Photocatalyst-Containing Layer Side Substrate 15 g of ethanol, 15 g of isopropyl alcohol, and 30 g of ST-K03 (trade name, manufactured by Ishihara Sangyo Co., Ltd.), which is an aqueous dispersion of titanium dioxide as a photocatalyst, are mixed at 20 ° C. The mixture was stirred for a minute to obtain a photocatalyst-containing layer composition. This composition is coated on a transparent substrate made of soda lime glass by a dip coater and subjected to a heat treatment at 150 ° C. for 10 minutes to form a transparent photocatalyst-containing film (thickness 0.2 μm) to form a photocatalyst-containing layer. A side substrate was formed.

2. Formation of substrate for pattern forming body 2% by weight of ZONYL FSN (trade name, manufactured by DuPont), which is a fluorine-based nonionic surfactant, was mixed with isopropanol to obtain a composition for a decomposition removal layer. This composition for decomposition / removal layer was applied onto a transparent substrate made of soda lime glass by a spin coater, and heated at 50 ° C. for 10 minutes to form a decomposition / removal layer having a thickness of 0.1 μm to obtain a substrate for a pattern forming body. .

3. Exposure The photocatalyst-containing layer side substrate is placed on the decomposition / removal layer of the pattern forming substrate so that the photocatalyst-containing layer of the photocatalyst-containing layer side substrate contacts the decomposition / removal layer. (Wavelength 365 nm) was exposed at an illuminance of 70 mW / cm ² for 2 minutes, the decomposition removal layer was decomposed and removed, and the glass of the substrate was exposed. Before and after the exposure, that is, the contact angle of the surface of the decomposition / removal layer and the glass surface exposed after exposure to water was measured in the same manner as in Example 1. As a result, the surface of the decomposition / removal layer was 71 degrees, whereas the glass exposed after the exposure The surface was 9 degrees, and it was confirmed that a pattern due to the difference in wettability between the exposed portion and the non-exposed portion can be formed.

4). Formation of microlenses A negative photomask having a plurality of 200 μm circular openings arranged at intervals of 100 μm was exposed in the same manner as the exposure described above to obtain a pattern formed body. The microlens composition having the following composition was applied to the exposed portion of the pattern formed body by a 0.0001 ml discharge method with a liquid precision discharge device (EED dispenser, trade name: 1500XL-15), and UV cured. As a result, a microlens array having a diameter of 200 μm and a focal length of 500 μm was obtained.

(Composition of the composition for microlenses)
UV curing resin (ester acrylate resin, Arakawa Chemical Industries, trade name; AQ-11) 10 parts by weight Curing initiator (1-hydroxycyclohexyl phenyl ketone, Ciba Specialty Chemicals, trade name: Irgacure 184 ) 0.5 parts by weight

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  For example, in the above description, the functional elements are all described using an example provided on the pattern forming body, but the present invention is not limited to this. That is, for example, as shown in FIG. 9, first, the characteristic change layer 5 is formed on the substrate 4 by the same method as described above, and the functional portion 13 is formed along the pattern of the characteristic change portion of the characteristic change layer 5. (FIG. 9A). Next, the element forming substrate 24 is brought into close contact with the functional part 13 (FIG. 9B). Then, the functional part 13 is transferred to the element forming substrate 24 to form a functional element. Thus, the functional element is not limited to being formed on the pattern forming body.

(A)-(C) and (C ') are schematic sectional drawings which show an example of the manufacturing method of the pattern formation body of this invention. (A)-(D) and (D ') are schematic sectional drawings which show the other example of the manufacturing method of the pattern formation body of this invention. It is a schematic sectional drawing for demonstrating the manufacturing method of the functional element in this invention. It is a schematic sectional drawing for demonstrating the manufacturing method of the functional element in this invention. It is a schematic sectional drawing for demonstrating the manufacturing method of the functional element in this invention. (A)-(C) are schematic sectional drawings for demonstrating the manufacturing method of the functional element of this invention. (A)-(D) are schematic sectional drawings for demonstrating the manufacturing method of the functional element of this invention. (A)-(C) are schematic sectional drawings which show an example of the manufacturing method of the micro lens by this invention. (A) to (C) are schematic cross-sectional views for explaining a method for producing a functional element included in the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Transparent substrate, 2 ... Photocatalyst containing layer, 3 ... Photocatalyst containing layer side board | substrate,
4 ... substrate, 5 ... characteristic change layer, 6 ... substrate for pattern forming body,
7 ... Photomask, 8 ... Characteristic change part, 9 ... Pattern formation body,
DESCRIPTION OF SYMBOLS 10 ... Blade coater, 11 ... Composition for functional part, 12 ... Spin coater,
13 ... Functional part, 14 ... Film forming means, 15 ... Adhesive tape,
16 ... Air injection nozzle, 17 ... Sheet, 18 ... Hot-melt composition layer,
19 ... thermal transfer member, 20 ... heating plate, 21 ... discharge device,
22 ... UV for resin curing, 23 ... Microlens, 24 ... Substrate for element formation.

Claims (22)

It has a pattern characteristic is changed by the action of the photocatalyst, characterized by comprising the property changing layer one layer containing no photocatalyst, the patterning device.   The pattern forming body according to claim 1, wherein the characteristic change layer is made of polyolefin.   3. The pattern forming body according to claim 1, wherein the property change layer is a wettability change layer in which wettability is changed so that a contact angle of water is reduced by exposure by the action of a photocatalyst. .   The pattern forming body according to claim 3, wherein the wettability changing layer is a layer containing an organopolysiloxane.   The pattern forming body according to claim 4, wherein the organopolysiloxane is a polysiloxane containing a fluoroalkyl group.   The pattern forming body according to claim 1, wherein the pattern is a pattern by unevenness.   The characteristic change layer is a decomposition removal layer that is decomposed and removed by the action of a photocatalyst, and has an unevenness on the pattern forming body by an exposed member that is exposed when the decomposition removal layer and the decomposition removal layer are decomposed and removed. The pattern forming body according to claim 6.   The characteristic change layer is a decomposition removal layer that is decomposed and removed by the action of a photocatalyst, and a contact angle of water between the decomposition removal layer and an exposed member that is exposed when the decomposition removal layer is decomposed and removed is different. The pattern forming body according to claim 1, wherein the pattern forming body is characterized by the following.   The pattern forming body according to claim 1, wherein the characteristic change layer is an adhesive change layer whose adhesiveness is changed by the action of a photocatalyst.   A printing plate, wherein the pattern forming body according to claim 3, 6 or 7 is a printing original plate.   A functional element, wherein a functional part is disposed on a portion corresponding to a pattern formed on the pattern forming body according to any one of claims 1 to 9.   The functional element according to claim 11, wherein the functional part is a metal.   The functional element according to claim 12, wherein the functional part made of metal is formed by electroless plating.   13. The functional element according to claim 12, wherein the functional part made of metal is formed by a vapor deposition method.   The functionality according to claim 11, wherein the pattern is a pattern formed by parts having different water contact angles, and a functional part is formed on a portion of the pattern having a small water contact angle. element.   The functional element according to claim 15, wherein the functional part is formed by a nozzle discharge method.   The functional element according to claim 16, wherein the nozzle discharge method is an ink jet method.   The color filter, wherein the functional part of the functional element according to claim 11 is a pixel part.   The color filter according to claim 18, wherein the pixel portion is formed by an inkjet method.   A microlens, wherein the functional part of the functional element according to claim 11 is a lens. The printed circuit board, wherein the functional part of the functional element according to claim 11 is a metal wiring.   The functional part of the functional element according to claim 11 is an electronic circuit.

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