JP4231881B2 - Device apparatus and manufacturing method thereof - Google Patents

Description

The present invention Lud vice apparatus and a method for manufacturing the device chip having a functional surface area in need of space on the surface is mounted in a face-down

  For example, in a SAW (Surface Acoustic Wave) chip or the like, a sealing structure is used to protect an element from the influence of the outside world as in a normal semiconductor device. However, since the SAW chip or the like must hold the functional area above the element in a hollow state due to its characteristics, it is necessary to apply a sealing structure that can hold the hollow state. As such a sealing structure, a can-type package that has been conventionally used is known, but since it is unavoidable to increase the size of the package, it is difficult to meet the recent demand for downsizing. .

For such a point, a structure is known in which the periphery of the device chip is hollow-sealed with a photosensitive resin so that the functional area of the device chip is hollow (see, for example, Patent Document 1). . Further, a structure in which a functional surface region is sealed with a high-viscosity NCP (Non Conductive Polymer) resin or the like so as to be held in the hollow is known (for example, see Patent Document 2).
JP 2001-298102 A JP 2005-110017 A

  However, among the conventional sealing structures, in the structure in which the outer periphery of the device chip is hollow-sealed with a photosensitive resin, the photosensitive resin used has high fluidity, and the resin penetrates to the periphery of the functional surface area of the semiconductor chip during application. However, it has a drawback of easily degrading element characteristics. On the other hand, in a structure using a high-viscosity NCP resin or the like, since the resin when applied on the device chip has a high viscosity of 100 to 200 Pa · s, it takes time to apply and tends to deteriorate workability. It was in.

The present invention, such a problem in which has been made in order to cope, on having improved sealing reliability, easy and devices that enables manufacturing a device device sealed good yield hollow resin molding An object is to provide an apparatus and a method for manufacturing the same.

The device device according to the present invention includes a device chip in which a plurality of electrical connection portions are formed around a functional surface region that requires space on the surface, and the device chip includes the functional surface region and the electrical connection portion. there are disposed such that the wiring substrate side a wiring substrate convex a wiring pattern is formed to protrude from the surface, the wiring pattern, from the outside of the opposing region that faces the functional surface region, the electric Extending linearly toward the connection position with the electrical connection portion, and having a terminal portion between the connection position with the electrical connection portion and the opposing region , and the electrical ; and a wiring board stepped portion positioned on the lower side of the device chip by the end edge portion toward the functional surface area of the wiring pattern provided in correspondence with the connecting portion is formed, the device chip And before Sealed with resin so that a space is formed between the wiring board and the functional surface region, and the resin exists on the wiring pattern in a region facing at least the device chip. It is characterized by.

  In the device device having the above configuration, the convex wiring pattern protruding from the surface does not extend from the outside of the facing area facing the functional surface area to the facing area, and passes through the upper part of the wiring pattern. This prevents the resin from rapidly entering the functional surface area. At the same time, by forming the step portion by the end portion of the wiring pattern corresponding to the electrical connection portion of the device chip, the entry of the resin is temporarily delayed at this portion. As a result, it is possible to manufacture a device device in which the resin is sealed in the hollow easily and with high yield, while improving the sealing reliability.

  In the above-described device apparatus, the wiring pattern preferably has a height protruding from the surface by 10 μm or more. Thereby, it is possible to obtain a sufficient effect of delaying the entry of the resin. When the interval between adjacent wiring patterns becomes wide, it is preferable to form a convex dummy pattern protruding from the surface so as to be positioned between the wiring patterns along the periphery of the opposing region. Thereby, the approach state of the resin can be controlled more reliably. Such a dummy pattern preferably protrudes from the surface by 10 μm or more and has a height that does not directly contact the device chip. Moreover, in such a device apparatus, resin becomes a shape dented toward the outer side between adjacent wiring patterns or between adjacent wiring patterns and dummy patterns.

Another device device according to the present invention includes a device chip in which a plurality of electrical connection portions are formed around a functional surface region that requires space on the surface, and the functional surface region and the electrical connection portion are wiring boards. Wiring in which a step portion is formed at a portion located on the lower side of the device chip and outside the functional surface region so as to surround the periphery of the opposing region facing the functional surface region. A substrate is provided, and the space between the device chip and the wiring substrate is sealed with resin from the periphery of the device chip to the step portion so that a space is formed between the functional surface region, and is hollow. A device apparatus characterized by being confined .

  In the device device having the above-described configuration, the step of the resin is temporarily delayed at this portion by the step portion formed at the lower part of the device chip so as to surround the periphery of the facing region facing the functional surface region. be able to. As a result, it is possible to manufacture a device device in which the resin is sealed in the hollow easily and with high yield, while improving the sealing reliability. Such a stepped portion can be formed by a recess formed so as to be recessed in the surface.

The device device manufacturing method according to the present invention is a device device manufacturing method described above, wherein a resin is supplied along the periphery of the device chip, and the resin is interposed between the functional surface region and the wiring board. said supplying resin to the entire circumference around the device chip prior to entering, the entire periphery of the device chip such that a space is formed circumferentially between the between the wiring substrate and the device chip the functional surface area Is sealed with resin.

  In the manufacturing method of the device device having the above-described structure, the resin is supplied to the entire periphery of the device chip before the resin flows between the functional surface region and the wiring board, thereby allowing the resin to enter with the internal pressure of the gap portion. Can be stopped. As a result, it is possible to manufacture a device device in which the resin is sealed in the hollow easily and with high yield, while improving the sealing reliability. Such a resin is supplied by moving a dispenser for supplying the resin along the periphery of the device chip, or through a mask having an opening corresponding to the device chip. It can be performed by a method or the like.

According to the present invention, after improving the sealing reliability can be provided easily and the device and a manufacturing method thereof allowing manufacturing a device device sealed good yield hollow resin.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 schematically show the structure of a wiring board according to a first embodiment of the present invention. FIG. 1 is a longitudinal sectional view, and FIG. 2 is a perspective view showing a configuration viewed from above. is there. In these drawings, reference numeral 1 denotes a wiring board. The wiring substrate 1 may be made of any material such as a resin substrate, a ceramic substrate, or a Si substrate.

  A plurality of wiring patterns 2 are formed on the wiring substrate 1 so as to protrude from the surface thereof to a predetermined height (for example, about 10 μm to 20 μm). A device chip 3 is provided on the wiring board 1. The device chip 3 has a functional surface region 4 in the center, and an electrode pad (not shown) as an electrical connection portion and an Au bump connected to the electrode pad around the functional surface region 4. 5 is provided. The wiring pattern 2 and the electrode pads of the device chip 3 are electrically and mechanically connected via Au bumps 5. That is, the device chip 3 is mounted face down on the wiring board 1 such that the functional surface area 4, electrode pads, and Au bumps 5 face the wiring board 1 side.

  The functional surface area 4 of the device chip 3 requires a space on its surface. That is, the device chip 3 is composed of, for example, a SAW (Surface Acoustic Wave) device or an FBAR (Film Bulk Acoustic Resonator), and the functional surface area 4 is provided with comb-like electrodes (not shown). The surface requires a space. For this reason, a gap 6 is formed between the functional surface 4 and the wiring board 1.

  In order to form the gap 6, the wiring pattern 2 is formed so as not to extend from the outside of the facing area facing the functional surface area 4 to the facing area, and at least the Au of the device chip 3. It is formed at a position corresponding to the bump 5. In the present embodiment, as shown in FIGS. 1 and 2, the wiring pattern 2 is not formed in the facing region facing the functional surface region 4 of the wiring substrate 1. However, if the wiring pattern 2 does not extend from the outside of the opposing area but is simply arranged in the opposing area (is arranged in an island shape), the wiring pattern 2 is provided in the opposing area. There may be.

  The wiring pattern 2 preferably protrudes from the surface of the wiring board 1 by 10 μm or more. This is because the flow of the sealing resin 7 is controlled by the surface of the wiring substrate 1 and the stepped portion of the wiring pattern 2. The height of the wiring pattern 2 is preferably about 10 μm to 20 μm, for example. In this case, the distance between the upper surface of the wiring pattern 2 and the device chip 3 is about 10 μm to 20 μm, and the distance between the upper surface of the wiring substrate 1 other than the wiring pattern 2 and the device chip 3 is about 20 μm to 40 μm.

  The wiring patterns 2 are preferably arranged at appropriate intervals along the periphery of the device chip 3, and when the intervals between the adjacent wiring patterns 2 are wide, these wiring patterns are arranged as shown in FIG. It is preferable to provide a dummy pattern 8 between the patterns 2 so that the interval between adjacent patterns is not more than a certain value. Such a dummy pattern 8 may be formed of any material such as a metal conductor such as copper, aluminum, or gold, or an insulating material such as an insulating resin or glass, like the wiring pattern 2. Further, in the case where the wiring pattern 2 having a structure protruding from the wiring substrate 1 is not provided, the wiring pattern 2 can be entirely constituted by the dummy pattern 8. Thus, when the dummy pattern 8 is used, it is preferable that the dummy pattern 8 and the device chip 3 do not contact directly, and the height of the dummy pattern 8 is about 10 μm to 20 μm as in the case of the wiring pattern 2. It is preferable.

  In the wiring substrate 1 having the above configuration, after the device chip 3 is mounted, the periphery of the device chip 3 is sealed with the resin 7. At this time, the resin 7 is supplied along the periphery of the device chip 3. That is, for example, as shown in FIGS. 4 and 5, the resin 7 is supplied while moving the dispenser 20 for supplying the resin 7 along the periphery of the device chip 3. The viscosity of the resin 7 is preferably high to some extent, for example, 20 Pa · s or more is preferable.

  At this time, as shown in FIGS. 6A and 6B, generally, the narrower the distance d between the device chip 3 and the wiring board 1 (wiring pattern 2) (in the case of FIG. 6B), the capillary tube. Due to the phenomenon, the speed of entering the inside of the resin 7 is fast. This approach speed increases in inverse proportion to the distance d between the device chip 3 and the wiring board 1 (wiring pattern 2). For this reason, on the wiring board 1, the entry speed of the resin 7 is faster on the wiring pattern 2 than on the portion without the wiring pattern 2. For example, the protruding height of the wiring pattern 2 from the surface of the wiring substrate 1 is 10 μm, the distance between the upper surface of the wiring pattern 2 and the device chip 3 is 10 μm, and the distance between the portion without the wiring pattern 2 on the wiring substrate 1 and the device chip 3 In this case, the resin 7 enters the wiring pattern 2 twice as fast. For this reason, in the present embodiment, the wiring pattern 2 does not extend from the outside of the facing area facing the functional surface area 4 to the facing area.

As shown in FIG. 7, when the resin 7 reaches the end portion (step portion) of the wiring pattern 2, the entry speed of the resin 7 becomes slow. Here, the force (A) in the outer peripheral direction of the device chip 3 acting on the resin 7 excluding gravity (indicated by a black arrow in FIG. 7) is:
(1) Resin self-cohesive force (2) Surface tension (maintenance of resin itself)
(3) Internal pressure due to the hollow space. Moreover, the force (B) (indicated by a white arrow in FIG. 7) acting in the direction of entering the inside is
(4) Interfacial tension (wetting) between resin and each material
(5) Capillary phenomenon.

  Immediately after the resin 7 is applied, the total force in (B) above is greater than the total force in (A), so that the resin 7 gradually enters the inside of the device chip 3. Then, as the amount of the resin 7 in the gap between the device chip 3 and the wiring substrate 1 increases, the self-cohesion force of (1) increases and the entry speed of the resin 7 gradually decreases. When the resin 7 reaches the stepped portion at the tip of the wiring pattern 2, the contact angle θ between the resin 7 and the wiring pattern 2 shown in FIGS. 8 and 9 changes, so that the state shown in FIG. The approach position of the resin 7 is held until the contact angle changes so that the state shown in FIG. During this time, if the periphery of the device chip 3 is covered with the resin 7 and confined in the hollow, the ingress of the resin 7 is stopped by the internal pressure of (3). On the other hand, if the confinement is not performed in the hollow space, the resin 7 on the wiring pattern 2 reaches the surface of the wiring board 1, and thereafter, the distance between the device chip 3 and the wiring board 1 and the resin 7 entering there. Resin 7 gradually enters the inside according to the amount.

  Therefore, as shown in FIGS. 4 and 5, when the resin is supplied while moving the dispenser 20 that supplies the resin 7 along the periphery of the device chip 3, the resin 7 stops at the end of the wiring pattern 2. In the meantime, the resin 7 is supplied over the entire circumference of the device chip 3 and confined in the hollow. The time from the start to the end of the supply of the resin 7 is preferably about 1 second or less in the case of a 1 mm square SAW chip, for example. As a result, as shown in FIGS. 2 and 3, resin sealing can be reliably performed in a state where the resin 7 does not enter the functional surface region 4. The method for supplying the resin 7 is not limited to the method using the dispenser 20 as described above. For example, as shown in FIG. 10, an opening (not shown) having a shape corresponding to the device chip 3 is provided. A method using a printing process using the mask 30 and the squeegee 31 may be used. According to such a method, the resin 7 can be supplied over the entire circumference of the device chip 3 in a shorter time, and the resin 7 can be supplied to a plurality of device devices at a time. Time can be shortened. Furthermore, the entire device chip can be sealed, the reliability is increased, and the surface of the sealing resin after formation is flattened so that handling is easy.

  After the resin 7 is supplied to the periphery of the device chip 3 as described above, the entire wiring board 1 is put in, for example, an oven, and heated at a predetermined temperature for a predetermined time (for example, about 150 ° C. for 30 minutes). Heat cure. The resin 7 has a low viscosity and easily fluidizes during the period from the heating until the thermosetting reaction occurs at 100 ° C., but the internal pressure of the sealing space increases, so there is no risk of flowing into the periphery of the functional surface region 4. A hot stage may be used instead of the oven. By placing the wiring board 1 on which the device chip 3 is mounted on the hot stage, heat can be supplied directly to the wiring board 1 side, so that when it is heated to 150 ° C., it can be thermally cured in about 5 minutes.

  As described above, according to the present embodiment, it is possible to manufacture a device device that is easily and efficiently sealed with a resin while improving the sealing reliability. Actually, in the case of a 1 mm square SAW chip, when the width of the resin 7 entering from the periphery under the SAW chip was measured, it was 300 μm or more in the related art, but according to the above embodiment, 150 μm or less. And was able to. In the case of a device device that has been resin-sealed as described above, as shown in FIGS. 2 and 3, the resin 7 is between the adjacent wiring patterns 2 or between the adjacent wiring patterns 2 and the adjacent dummy pattern 8. In FIG. 2, the shape is recessed in the outer direction.

  Next, a second embodiment will be described with reference to FIG. As shown in FIG. 11, the wiring substrate 1 a according to the second embodiment is disposed at a portion located below the device chip 3 so as to surround the periphery of the facing region facing the functional surface region 4 of the device chip 3. A step portion 9a is formed. That is, a rectangular recess 9 having a larger area than the rectangular functional surface region 4 is formed in the wiring board 1 a, and a step portion 9 a is formed by an edge of the recess 9. In the second embodiment configured as described above, since the step of the resin 7 is suppressed by the step portion 9a as in the case of the end portion of the wiring pattern 2 described above, the same effect as the above-described embodiment can be obtained. Obtainable.

In order to form the stepped portion 9a, it is not limited to the concave portion 9 having a concave shape as a whole as described above. For example, a square-shaped concave portion having a concave shape only around the periphery may be used. If it is made, you may form a convex part. Further, as in the reference example shown in FIG. 12, the wiring substrate 1 b is not provided with a step portion, but the device chip 3 side is recessed to form the recess 10, and the electrode portion on the device chip 3 side and the functional surface region 4 are formed. You may provide the step part 10a in between.

  In the above-described embodiment, the SAW device is described as an example of the resin-encapsulated device. However, the present invention is not limited to this, and an FBAR that requires a sealed space above the functional surface of the element, Even a MEMS device, an optical device, or the like can be applied.

1 is a schematic longitudinal sectional view of a device device according to a first embodiment of the present invention. FIG. 2 is a schematic plan view showing the device device of FIG. 1 in perspective. The typical top view which shows through the structure of the modification of the device apparatus of FIG. The figure which shows typically the manufacturing method which concerns on embodiment of this invention. The figure which shows typically the longitudinal cross-section structure of FIG. The figure for demonstrating the relationship between the space | interval of a wiring board and a device chip, and the approach state of resin. The figure for demonstrating the approach state of resin. The figure for demonstrating the contact angle of resin. The figure for demonstrating the relationship between the contact angle of resin, and the approach state of resin. The figure for demonstrating the other example of the supply method of resin. The typical longitudinal section of the device device concerning a 2nd embodiment of the present invention. The typical longitudinal section of the device concerning the reference example of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board, 2 ... Wiring pattern, 3 ... Device chip, 4 ... Functional surface area, 5 ... Au bump, 6 ... Air gap, 7 ... Resin, 8 ... Dummy pattern, 9, 10 ... recesses, 9a, 10a ... steps.

Claims (10)

A device chip in which a plurality of electrical connection portions are formed around a functional surface area that requires space on the surface;
The device chip is a wiring board in which the functional surface area and the electrical connection portion are arranged to face the wiring board side, and a convex wiring pattern protruding from the surface is formed. It extends linearly from the outside of the facing area facing the functional surface area toward the connection position with the electrical connection section, and between the connection position with the electrical connection section and the facing area. to be formed with a terminal end, and a stepped portion positioned on the lower side of the device chip by the end edge portion toward the functional surface area of the wiring pattern provided corresponding to the electrical connection section A wiring board on which is formed,
The space between the device chip and the wiring board is sealed with a resin so that a space is formed between the functional surface region, and the resin is placed on the wiring pattern in a region facing at least the device chip. A device device that exists. The wiring pattern, the device according to claim 1, wherein a is provided so as to protrude from the surface 10μm or more. Along the periphery of the opposite region so as to be positioned between the wiring patterns, claim convex dummy pattern projecting from the surface, characterized in that it is formed independently of the wiring pattern 1 Or the device apparatus of 2 . 4. The device apparatus according to claim 3 , wherein the dummy pattern protrudes from the surface by 10 [mu] m or more and has a height that does not directly contact the device chip. The resin is the wiring pattern between the adjacent, or characterized in that said wiring patterns adjacent said there is a recessed outward direction between the dummy patterns claims 1 to 4 any one The device apparatus as described. A device chip in which a plurality of electrical connection portions are formed around a functional surface area that requires space on the surface;
The functional surface area and the electrical connection portion are arranged so as to face the wiring substrate side, and are outside the functional surface area below the device chip so as to surround a periphery of the facing area facing the functional surface area. A wiring board having a step portion formed in a portion located at
The space between the device chip and the wiring board is sealed with resin from the periphery of the device chip to the step portion so that a space is formed between the functional surface region and confined in a hollow space. A device device. The device according to claim 6 , wherein the step portion is formed by a recess formed so as to be recessed in the surface, and the resin does not enter the recess. A device manufacturing method according to any one of claims 1 to 7 ,
Resin is supplied along the periphery of the device chip, and the resin is supplied to the entire periphery of the device chip before the resin flows between the functional surface region and the wiring board. A device device manufacturing method, wherein the entire periphery of the device chip is sealed with a resin so that a space is formed between the wiring substrate and the functional surface region. 9. The method of manufacturing a device apparatus according to claim 8, wherein the resin is supplied while moving a dispenser for supplying the resin along the periphery of the device chip. 9. The method of manufacturing a device apparatus according to claim 8, wherein the resin is supplied through a mask having an opening corresponding to the device chip.

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