JP4231354B2 - Socket device - Google Patents

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Publication number
JP4231354B2
JP4231354B2 JP2003196663A JP2003196663A JP4231354B2 JP 4231354 B2 JP4231354 B2 JP 4231354B2 JP 2003196663 A JP2003196663 A JP 2003196663A JP 2003196663 A JP2003196663 A JP 2003196663A JP 4231354 B2 JP4231354 B2 JP 4231354B2
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Japan
Prior art keywords
housing
retaining member
socket device
electrical component
elastic arm
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Expired - Fee Related
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JP2003196663A
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JP2005032567A (en
Inventor
亙 小口
陽介 有森
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Priority to JP2003196663A priority Critical patent/JP4231354B2/en
Priority to KR1020040052699A priority patent/KR100589883B1/en
Priority to CNB2004100633797A priority patent/CN100367572C/en
Publication of JP2005032567A publication Critical patent/JP2005032567A/en
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Publication of JP4231354B2 publication Critical patent/JP4231354B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap

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  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、ＩＣチップ、ＩＣモジュール等との接続や保持に使用されるソケット装置の構造に関する。
【０００２】
【従来の技術】
従来のＩＣチップ等を保持するソケット装置としては、装着するＩＣを保持するために、ハウジングのコーナ部分に回動可能なラッチアーム部材を配設して、ハウジングにＩＣを装着した後に、このラッチアーム部材でＩＣを上方から抑えつけて保持するようにした構成のものが知られている（例えば、特許文献１参照）。
【０００３】
以下、従来のソケット装置の構造を図に基づいて説明する。図１１は従来のソケット装置の平面図、図１２はラッチアームによる保持状態を示す側面図である。
【０００４】
図において、基盤３１は合成樹脂製で略方形をしており、その略中央に開口するＩＣ収容部３２を有する。このＩＣ収容部３２は略方形をしており、このＩＣ収容部３２に略方形のＩＣ３３を収容する。このＩＣ収容部３２に対向する４辺には台座３４が設けられ、この台座３４にＩＣ３３のリードを支持するものとなっている。
【０００５】
前記基盤３１の各コーナ部にはラッチアーム３６を配し、このラッチアーム３６を貫通室３８内に収容し、軸部３５をもって回動可能に支持している。ラッチアーム３６はＩＣ収容部３２の対角線上に沿って斜めに延在しており、軸部３５を支点として対角線上に上下に回動する。そして、下方回動時には、ＩＣ収容部３２内に収容されたＩＣ３３の各コーナ部に係合し、上方回動時には、該係合を解除するように形成されている。また、ラッチアーム３６の内端である、先端には上記ＩＣ３３に係脱する係合爪３６ａが設けられている。
【０００６】
また、ラッチアーム３６の軸支部から後方へバネ片３６ｂを突設してあり、このバネ片３６ｂは上記対角線上に沿って延び、その自由端部３６ｄは貫通室３８の後部内壁に形成した傾斜面からなるバネ受部３９に当接されている。このバネ片３６ｂはラッチアーム３６が上方回動したときに、自由端部３６ｄがバネ受部３９に当接して回動を阻止されることにより反り曲がり弾力を蓄えるものとなる。
【０００７】
ラッチアーム３６の開閉手段としては、冶具により弧形曲部からなるの受圧部３６ｅを押圧することでラッチアーム３６を上下に回動して行うものとされ、受圧部３６ｅが押し上げられたときにラッチアーム３６が上方へ回動して解除状態を形成する。この状態でＩＣ３３のＩＣ収容部３２への装着及び取り出しが行われる。
【０００８】
次いで、受圧部３６ｅへの押圧力を取り除くと、ラッチアーム３６はバネ片３６ｂの復元力により自動的に下方へ回動しＩＣ３３のコーナ部上面に係合する。これによってＩＣ３３が基盤３１に保持されるものとなる。このとき、バネ片３６ｂの弾力により係止爪３６ａをＩＣ３３のコーナ部に軽く押し当て係合を確保している。
【０００９】
【特許文献１】
特開平５−６５１８６号公報
【００１０】
【発明が解決しようとする課題】
しかしながら、上記した従来のソケット装置の構成においては、ＩＣ３３を基盤３１のＩＣ収容部３２に保持させるのに、基盤３１に回動可能に軸支されたラッチアーム３６を使用する構成のため、基盤３１にはラッチアーム３６を収容するスペースが必要となり、ソケット装置の小型化、薄型化が要求される場合には、その対応が困難であるという問題があった。
【００１１】
従って、本発明では上述した問題点を解決し、薄型化、小型化が可能であり、しかも、装着した電気部品を確実に保持できるソケット装置を提供することを目的とする。
【００１２】
【課題を解決するための手段】
上記課題を解決するために本発明では第１の解決手段として、電気部品が装着される凹状の収納部を有するハウジングと、このハウジングの収納部内に並設され、前記電気部品の外部接触片と接続される複数の端子部材と、前記電気部品を前記収納部に保持して抜け止めする抜け止め部材とを備え、前記抜け止め部材は、前記ハウジングの外側面に沿って配設された薄板状の基板部と、この基板部の一部に設けられたスリットにより横方向に長尺状に延在すると共に、前記ハウジングの外側面に対して外方向に弾性変形可能に形成された弾性アーム部とからなり、前記弾性アーム部の先端側に前記電気部品の上方に係合して抜け止めする係合部を形成し、前記電気部品が装着される際には、前記弾性アーム部が外方向へ弾性変形すると共に、前記電気部品が前記収納部に装着された時には、前記係合部が前記電気部品の上方に係合して抜け止めされる構成とした。
【００１３】
また、第２の解決手段として、前記ハウジングは、４辺を有する方形状に形成され、前記抜け止め部材は、前記ハウジングの対向する４辺の外側面の内、少なくとも対向する２面にそれぞれ配設されている構成とした。
また、第３の解決手段として、前記抜け止め部材を、導電性の金属板で形成し、この金属板を折り曲げることにより、前記ハウジングの外側面に沿って配設した構成とした。
【００１４】
また、第４の解決手段として、前記複数の端子部材は、前記凹状の収納部の周縁部に並設されており、前記抜け止め部材の基板部は、前記端子部材の近傍に配設されて、前記端子部材を外方から取り囲むように前記ハウジングの外周面に沿って配設されると共に、前記基板部をソケット装置が実装される回路基板のグランドに接地した構成とした。
また、第５の解決手段として、前記抜け止め部材の係合部には傾斜面が形成されており、前記電気部品が装着される際には、前記傾斜面に沿って前記電気部品が挿入されることにより、前記弾性アーム部が外方向へ弾性変形する構成とした。
【００１５】
【発明の実施の形態】
以下、本発明の実施形態を図１乃至図１０に示す。図１は本発明のソケット装置の平面図、図２はソケット装置の端子部材の一部を破断して示す正面図、図３はソケット装置の抜け止め部材の一部を破断して示す側面図、図４はＩＣモジュールを装着した状態を示す平面図、図５はＩＣモジュールを装着した状態で端子部材の一部を破断して示す正面図、図６はＩＣモジュールを装着した状態で抜け止め部材の一部を破断して示す側面図、図７は抜け止め部材が撓んだ状態を示す側面図、図８は抜け止め部材を示す斜視図、図９はＩＣモジュールを示す平面図、図１０はＩＣモジュールを示す正面図である。
尚、図４においては、一部、抜け止め部材が撓んだ状態も便宜的に示している。
【００１６】
図において、ハウジング１は、合成樹脂などの絶縁材からなり、上面が開口された凹状の収納部１ａを有する方形の箱型に形成されている。この凹状の収納部１ａの４辺周縁部には、複数の端子部材２がそれぞれ対向した状態で並設されて取り付けられている。
【００１７】
前記端子部材２は、導電性の金属板からなり、ハウジング１に保持される平板状の基部と、この基部の一端側にＵ字状に屈曲されて基部と平行に折り曲げられて形成された接点板２ａと、他端側に同じくＬ字状に屈曲されてその先端がハウジング１の底面外方へ延出された接続板２ｂとを有している。また、前記接点板２ａの先端側はさらに収納部１ａの内方へ屈曲されており、この屈曲片２ｃが後述するＩＣモジュール４の外部接触片４ｃと接触して導通されるものとなっている。
【００１８】
抜け止め部材３は、薄板状の導電性の金属板からなり、この抜け止め部材３には４枚連続して折り曲げることにより方形状に形成された基板部３ａが設けられている。この抜け止め部材３は、それぞれの基板部３ａが方形状のハウジング１の外方を囲むように、ハウジング１の４辺の外側面に沿って配設されている。
また、基板部３ａの上面側には、それぞれの基板部３ａを連結する桟部３ｂが形成されており、この桟部３ｂが、ハウジング１の収納部１ａの外側部上面に係合されて抜け止め部材３がハウジング１に取り付けられるものとなっている。
【００１９】
また、少なくとも対向する２つの基板部３ａの上面側には、Ｌ字状のスリット３ｃを介して弾性変形可能なように、横方向（後述するＩＣモジュール４の挿入方向とは直交する方向）に長尺状に延設された弾性アーム部３ｄが形成されている。この弾性アーム部３ｄは、基板部３ａの長手方向となる横方向に沿って長尺状となるように形成されており、ハウジング１の凹状の収納部１ａの形成方向（ＩＣモジュール４の挿入方向）に対して直交する方向に弾性変形し易く形成されている。尚、この弾性アーム部３ｄは、４つの基板部３ａの全てに形成するようにしてもよい、
【００２０】
このように、弾性アーム部３ｄを、ハウジング１の対向する４辺の外側面の内、少なくとも対向する２面にそれぞれ配設するようにすれば、互いに対向する方向に弾性アームの弾性力が作用するので、後述するＩモジュール４を抜け止め部材３に確実に保持することができる。
また、抜け止め部材３を、導電性の金属板で形成し、金属板を折り曲げることにより、ハウジング１の外側面に沿って配設するようにしたので、薄板状に形成しても弾性力が確実に得られると共に、加工が容易で安価対応が可能となっている。
【００２１】
また、この弾性アーム部３ｄの自由端側でハウジング１の上面側には、収納部１ａに挿入されるＩＣモジュール４の上方に係合して抜け止めする係合部３ｅが形成されている。この係合部３ｅは、弾性アーム部３ｄから折り曲げられて収納部１ａの底面側へ屈曲されて形成されており、この係合部３ｅは収納部１ａの底面中央に向かって傾斜する傾斜面３ｆを有するように形成されている。この傾斜面３ｆを設けることによりＩＣモジュール４が挿入された際、弾性アーム部３ｄが傾斜面３ｆに沿ってハウジングの外方へ弾性変形されて撓むものとなる。
傾斜面３ｆを設けることにより、簡単な構成で弾性アーム部３ｄを弾性変形させることができるので、ＩＣモジュール４と抜け止め部材３との確実な係合力が得られるものとなる。
【００２２】
また、抜け止め部材３の基板部３ａの下面側には、下方へ突出した接地片３ｇが設けられており、この接地片３ｇが、ソケット装置が実装される回路基板のグランドに接地されるものとなっている。
この場合、ハウジング１に並設された複数の端子部材２は、凹状の収納部１ａの周縁部に並設されており、抜け止め部材３の基板部３ａは、端子部材２の近傍に配設されて、端子部材２を外方から取り囲むようにハウジング１の外周面に沿って配設されるものとなっていることから、抜け止め部材３がシールド板として働くので、端子部材２に対するシールド効果を高めることができるものとなっている。
【００２３】
電気部品の一例としてのカメラモジュールであるＩＣモジュール４は、内部に半導体（ＩＣ）などの素子が集積された回路部品であり、方形状の基台部４ａと、この基台部４ａの上面側に突出された円形状のレンズ部４ｂとを有している。また、基台部４ａには、４つの側面の下端側から底面に連続した複数の外部接触片４ｃが設けられており、この外部接触片４ｃがハウジング１の収納部１ａの複数の端子部材２と接続されるものとなっている。
【００２４】
また、基台部４ａの、対角線上に対向する上面側の２角部には係止溝部４ｄが設けられている。この係止溝部４ｄに、抜け止め部材３の弾性アーム部３ｄに形成された係合部３ｅが係合されて、ＩＣモジュール４がハウジング１の収納部１ａに保持されるものとなっている。
尚、レンズ部４ｂは、携帯電話機やデジタルカメラなどの撮影機能として用いられる場合のカメラレンズとして使用されるものである。
【００２５】
次に、上記構成のソケット装置にＩＣモジュール４を装着する場合の動作を図４ないし図７を用いて説明する。
まず、ハウジング１の収納部１ａの上方から、ＩＣモジュール４を基台部４ａの底面側を下にして挿入する。この時、ＩＣモジュール４の基台部４ａの底面及び側面が、抜け止め部材３の弾性アーム部３ｄの自由端側に形成された係合部３ｅの傾斜面３ｆに沿って下方へ移動し、この移動に伴って、図４、図７に部分的に示すように弾性アーム部３ｄが自身の持つばね性により外方へ弾性変形して撓むものとなる。
この時、弾性アーム部３ｄは、抜け止め部材３の基板部３ａの横方向に沿って長尺状に形成されているので、十分な弾性を有して撓むものとなる。
【００２６】
そして、ＩＣモジュール４の上面側に形成された係止溝部４ｄに、前記係合部３ｅの先端部が達すると、図４、図６に部分的に示すように前記係合部３ｅが係止溝部４ｄに落ち込むことにより係合されるものとなる。
この時、前記係合部３ｅは、弾性アーム部３ｄ自身の持つばね性によって内方、すなわち、ＩＣモジュール４の係止溝部４ｄ側に付勢されるものとなり、ばね性を持って弾圧され、ＩＣモジュール４は確実にハウジング１の収納部１ａに保持されるものとなる。
【００２７】
そして、ＩＣモジュール４が収納部１ａに保持されると、図５に示すように、ＩＣモジュール４の基台部４ａに設けられた複数の外部接触片４ｃが、収納部１ａの周縁部に配設された、複数の端子部材２の接点板２ａの先端に設けられた屈曲片２ｃと接触することにより、電気的に導通されるものとなる。
この時、端子部材２の接点板２ａは、Ｕ字状に折り曲げられて形成されており、自身の持つばね性で屈曲片２ｃを外部接触片４ｃに弾接するものとなり、確実に接触し、安定した接触が得られるものとなっている。
【００２８】
上記した本発明の実施例によれば、抜け止め部材３を、ハウジング１の外側面に沿って配設された薄板状の基板部３ａと、この基板部３ａに弾性変形可能に設けられた弾性アーム部３ｄとで形成して、この弾性アーム部３ｄを、基板部３ａの横方向（ＩＣモジュール４の挿入方向とは直交する方向）に長尺状に延設すると共に、弾性アーム部３ｄの先端側にＩＣモジュール４の係止溝部４ｄに係合して抜け止めする係合部３ｅを形成して、ＩＣモジュール４が装着される際には、弾性アーム部３ｄが外方向へ弾性変形すると共に、ＩＣモジュール４が収納部１ａに装着された時には、係合部３ｅがＩＣモジュール４の係止溝部４ｄに係合して抜け止めされることから、ＩＣモジュール４をソケット装置に装着して保持する際には、抜け止めを行う係合部３ｅを有する弾性アーム部３ｄを、ハウジング１の外側面に沿って横方向に、且つ、長尺状に伸ばして形成したので、弾性アーム部３ｄの長さを十分に確保し、係合部３ｅの弾性力を維持しながら寸法を小さくすることができるため、ソケット装置の小型化、薄型化が図れるものとなっている。
【００２９】
尚、上記の実施例においては、抜け止め部材３の基板部３ａの下面側に、接地片３ｇを形成し、この接地片３ｇを、ソケット装置が実装される回路基板のグランドに接地するようにしており、これに加えて、ＩＣモジュール４の係止溝部４ｄにも接地用の接触片（図示せず）を形成し、この接地用の接触片と抜け止め部材３の弾性アーム部３ｄの係合部３ｅとを接続して、ＩＣモジュール４を直接ソケット装置が実装される回路基板のグランドに接地するようにしてもよい。
【００３０】
【発明の効果】
以上説明したように、本発明のソケット装置は、電気部品が装着される凹状の収納部を有するハウジングと、ハウジングの収納部内に並設され、電気部品の外部接触片と接続される複数の端子部材と、電気部品を収納部に保持して抜け止めする抜け止め部材とを備え、抜け止め部材は、ハウジングの外側面に沿って配設された薄板状の基板部と、基板部に弾性変形可能に設けられた弾性アーム部とからなり、弾性アーム部を、基板部の横方向に長尺状に延設すると共に、弾性アーム部の先端側に電気部品の上方に係合して抜け止めする係合部を形成し、電気部品が装着される際には、弾性アーム部が外方向へ弾性変形すると共に、電気部品が収納部に装着された時には、係合部が電気部品の上方に係合して抜け止めされることから、電気部品をソケット装置に装着して保持する際に、抜け止めを行う係合部を有する弾性アーム部を、ハウジングの外側面に沿って横方向に、且つ、長尺状に伸ばして形成したので、弾性アーム部の長さを十分に確保し、係合部の弾性力を維持しながら寸法を小さくすることができるため、ソケット装置の小型化、薄型化が図れる。
【００３１】
また、ハウジングは、４辺を有する方形状に形成され、抜け止め部材は、ハウジングの対向する４辺の外側面の内、少なくとも対向する２面にそれぞれ配設されていることから、互いに対向する方向に弾性アームの弾性力が作用するので、電気部品を抜け止め部材に確実に保持することができる。
また、抜け止め部材を、導電性の金属板で形成し、金属板を折り曲げることにより、ハウジングの外側面に沿って配設したことから、薄板状に形成しても弾性力が確実に得られると共に、加工が容易で安価対応が可能となる。
【００３２】
また、複数の端子部材は、凹状の収納部の周縁部に並設されており、抜け止め部材の基板部は、端子部材の近傍に配設されて、端子部材を外方から取り囲むようにハウジングの外周面に沿って配設されると共に、基板部をソケット装置が実装される回路基板のグランドに接地したことから、抜け止め部材がシールド板として働くので、端子部材に対するシールド効果を高めることができる。
また、抜け止め部材の係合部には傾斜面が形成されており、電気部品が装着される際には、傾斜面に沿って電気部品が挿入されることにより、弾性アーム部が外方向へ弾性変形することから、簡単な構成で弾性アーム部を弾性変形させることができるので、電気部品と抜け止め部材との確実な係合力が得られる。
【図面の簡単な説明】
【図１】本発明の一実施例であるソケット装置を示す平面図である。
【図２】本発明のソケット装置の端子部材の一部を破断して示す正面図である。
【図３】本発明のソケット装置の抜け止め部材の一部を破断して示す側面図である。
【図４】本発明のソケット装置にＩＣモジュールを装着した状態を示す平面図である。
【図５】本発明のソケット装置にＩＣモジュールを装着した状態で端子部材の一部を破断して示す正面図である。
【図６】本発明のソケット装置にＩＣモジュールを装着した状態で抜け止め部材の一部を破断して示す側面図である。
【図７】本発明のソケット装置の抜け止め部材が撓んだ状態を示す側面図である。
【図８】本発明のソケット装置の抜け止め部材を示す斜視図である。
【図９】本発明のＩＣモジュールを示す平面図である。
【図１０】本発明のＩＣモジュールを示す正面図である。
【図１１】従来のソケット装置を示す平面図である。
【図１２】従来のソケット装置のラッチアームによる保持状態を示す側面図である。
【符号の説明】
１ ハウジング
１ａ 収納部
２ 端子部材
２ａ 接点板
２ｂ 接続板
２ｃ 屈曲片
３ 抜け止め部材
３ａ 基板部
３ｂ 桟部
３ｃ スリット
３ｄ 弾性アーム部
３ｅ 係合部
３ｆ 傾斜面
３ｇ 接地片
４ ＩＣモジュール
４ａ 基台部
４ｂ レンズ部
４ｃ 外部接触片
４ｄ 係止溝部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure of a socket device used for connection or holding with an IC chip, an IC module, or the like.
[0002]
[Prior art]
As a conventional socket device for holding an IC chip or the like, in order to hold an IC to be mounted, a rotatable latch arm member is disposed at a corner portion of the housing, and this latch is mounted after the IC is mounted on the housing. There is known a configuration in which an IC is held from above by an arm member (see, for example, Patent Document 1).
[0003]
Hereinafter, the structure of a conventional socket device will be described with reference to the drawings. FIG. 11 is a plan view of a conventional socket device, and FIG. 12 is a side view showing a holding state by a latch arm.
[0004]
In the figure, a base 31 is made of a synthetic resin and has a substantially square shape, and has an IC accommodating portion 32 that opens at a substantially center thereof. The IC housing portion 32 has a substantially square shape, and a substantially square IC 33 is housed in the IC housing portion 32. A pedestal 34 is provided on the four sides facing the IC housing portion 32, and the pedestal 34 supports the leads of the IC 33.
[0005]
A latch arm 36 is disposed at each corner portion of the base 31, and the latch arm 36 is accommodated in a through chamber 38 and is rotatably supported by a shaft portion 35. The latch arm 36 extends obliquely along the diagonal line of the IC housing portion 32 and pivots up and down on the diagonal line with the shaft portion 35 as a fulcrum. And, it is formed so as to engage with each corner portion of the IC 33 accommodated in the IC accommodating portion 32 when rotating downward, and to release the engagement when rotating upward. Further, an engaging claw 36 a that engages with and disengages from the IC 33 is provided at the tip, which is the inner end of the latch arm 36.
[0006]
Further, a spring piece 36b protrudes rearward from the shaft support portion of the latch arm 36, the spring piece 36b extends along the diagonal line, and a free end portion 36d thereof is an inclination formed on the rear inner wall of the through chamber 38. It is in contact with a spring receiving portion 39 consisting of a surface. When the latch arm 36 is rotated upward, the spring piece 36b is warped and stored by the free end portion 36d coming into contact with the spring receiving portion 39 to prevent the rotation.
[0007]
As a means for opening and closing the latch arm 36, the latch arm 36 is rotated up and down by pressing the pressure receiving portion 36e made of an arcuate curved portion with a jig, and when the pressure receiving portion 36e is pushed up. The latch arm 36 pivots upward to form a release state. In this state, the IC 33 is attached to and removed from the IC housing portion 32.
[0008]
Next, when the pressing force to the pressure receiving portion 36e is removed, the latch arm 36 automatically rotates downward by the restoring force of the spring piece 36b and engages with the upper surface of the corner portion of the IC 33. As a result, the IC 33 is held on the base 31. At this time, the engaging claw 36a is lightly pressed against the corner portion of the IC 33 by the elasticity of the spring piece 36b to ensure engagement.
[0009]
[Patent Document 1]
Japanese Patent Laid-Open No. 5-65186
[Problems to be solved by the invention]
However, in the configuration of the conventional socket device described above, since the IC 33 is held in the IC housing portion 32 of the base 31, the latch arm 36 pivotally supported by the base 31 is used. No. 31 requires a space for accommodating the latch arm 36, and there is a problem that it is difficult to cope with the reduction in size and thickness of the socket device.
[0011]
Accordingly, it is an object of the present invention to provide a socket device that solves the above-described problems, can be reduced in thickness and size, and can securely hold the mounted electrical component.
[0012]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention provides a first solution to a housing having a concave storage portion to which an electrical component is mounted, and an external contact piece of the electrical component provided in parallel in the storage portion of the housing. A plurality of terminal members to be connected; and a retaining member that retains the electrical component in the housing portion and prevents the electrical component from being detached, and the retaining member is a thin plate disposed along the outer surface of the housing And an elastic arm portion that is elongated in the lateral direction by a slit provided in a part of the substrate portion and is elastically deformable outward with respect to the outer surface of the housing. consists of a previous SL forms an engagement portion for retaining engages above the electrical components on the distal end side of the resilient arm portion, when the electrical component is mounted, the elastic arm portion is an outer Elastically deformed in the direction, When serial electrical component is attached to the housing part has a configuration in which the engagement portion is retained in engagement with the upper side of the electrical component.
[0013]
Further, as a second solution, the housing is formed in a square shape having four sides, and the retaining member is arranged on at least two opposing surfaces of the opposing four sides of the housing. It was set as the installed structure.
As a third solution, the retaining member is formed of a conductive metal plate, and the metal plate is bent to be disposed along the outer surface of the housing.
[0014]
Further, as a fourth solving means, the plurality of terminal members are juxtaposed on the peripheral edge portion of the concave storage portion, and the substrate portion of the retaining member is disposed in the vicinity of the terminal member. The terminal member is disposed along the outer peripheral surface of the housing so as to surround the terminal member from the outside, and the board portion is grounded to the ground of the circuit board on which the socket device is mounted.
As a fifth solution, an inclined surface is formed in the engaging portion of the retaining member, and when the electric component is mounted, the electric component is inserted along the inclined surface. Thus, the elastic arm portion is elastically deformed outward.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention are shown in FIGS. 1 is a plan view of a socket device according to the present invention, FIG. 2 is a front view showing a part of a terminal member of the socket device in a cutaway state, and FIG. 3 is a side view showing a part of a retaining member of the socket device in a cutaway state. 4 is a plan view showing a state in which the IC module is mounted, FIG. 5 is a front view in which a part of the terminal member is broken with the IC module mounted, and FIG. 6 is a retainer in the state in which the IC module is mounted. FIG. 7 is a side view showing a state where the retaining member is bent, FIG. 8 is a perspective view showing the retaining member, and FIG. 9 is a plan view showing the IC module. 10 is a front view showing the IC module.
In FIG. 4, the state where the retaining member is partially bent is also shown for convenience.
[0016]
In the figure, the housing 1 is made of an insulating material such as synthetic resin, and is formed in a rectangular box shape having a concave storage portion 1a having an upper surface opened. A plurality of terminal members 2 are arranged side by side and attached to the peripheral edges of the four sides of the concave storage portion 1a.
[0017]
The terminal member 2 is made of a conductive metal plate, and has a flat base portion held by the housing 1 and a contact formed by being bent in a U shape on one end side of the base portion and bent in parallel with the base portion. It has a plate 2a and a connecting plate 2b which is bent in the same L shape on the other end side and whose tip is extended outward from the bottom surface of the housing 1. Further, the tip end side of the contact plate 2a is further bent inward of the storage portion 1a, and the bent piece 2c comes into contact with an external contact piece 4c of the IC module 4 to be described later. .
[0018]
The retaining member 3 is made of a thin plate-like conductive metal plate, and the retaining member 3 is provided with a substrate portion 3a formed into a rectangular shape by being bent continuously four times. The retaining members 3 are arranged along the outer surfaces of the four sides of the housing 1 so that the respective substrate portions 3a surround the outside of the rectangular housing 1.
Further, on the upper surface side of the substrate portion 3a, there are formed crosspieces 3b for connecting the respective substrate portions 3a. The crosspieces 3b are engaged with the upper surface of the outer portion of the storage portion 1a of the housing 1 and are removed. A stop member 3 is attached to the housing 1.
[0019]
Further, at least on the upper surface side of the two substrate portions 3a facing each other, in a lateral direction (a direction orthogonal to an insertion direction of an IC module 4 described later) so as to be elastically deformable via an L-shaped slit 3c. An elastic arm portion 3d extending in a long shape is formed. The elastic arm portion 3d is formed to be elongated along the lateral direction that is the longitudinal direction of the substrate portion 3a, and the direction in which the concave storage portion 1a of the housing 1 is formed (the insertion direction of the IC module 4). ) To be elastically deformed in a direction orthogonal to the above. The elastic arm portion 3d may be formed on all the four substrate portions 3a.
[0020]
As described above, if the elastic arm portions 3d are arranged on at least two opposing surfaces of the opposing four sides of the housing 1, the elastic force of the elastic arms acts in the opposing direction. Therefore, the I module 4 described later can be securely held by the retaining member 3.
Further, since the retaining member 3 is formed of a conductive metal plate and is bent along the outer surface of the housing 1 by bending the metal plate, even if it is formed in a thin plate shape, it has elastic force. It can be obtained reliably and can be processed easily and at low cost.
[0021]
An engaging portion 3e is formed on the free end side of the elastic arm portion 3d on the upper surface side of the housing 1 so as to engage and prevent the IC module 4 inserted into the housing portion 1a from coming off. The engagement portion 3e is formed by being bent from the elastic arm portion 3d and bent toward the bottom surface side of the storage portion 1a. The engagement portion 3e is an inclined surface 3f inclined toward the center of the bottom surface of the storage portion 1a. It is formed to have. By providing the inclined surface 3f, when the IC module 4 is inserted, the elastic arm portion 3d is elastically deformed outward along the inclined surface 3f and bent.
By providing the inclined surface 3f, the elastic arm portion 3d can be elastically deformed with a simple configuration, so that a reliable engagement force between the IC module 4 and the retaining member 3 can be obtained.
[0022]
Further, a grounding piece 3g projecting downward is provided on the lower surface side of the board portion 3a of the retaining member 3, and this grounding piece 3g is grounded to the ground of the circuit board on which the socket device is mounted. It has become.
In this case, the plurality of terminal members 2 arranged side by side in the housing 1 are arranged in parallel at the peripheral edge portion of the concave storage portion 1 a, and the substrate portion 3 a of the retaining member 3 is disposed in the vicinity of the terminal member 2. Since the terminal member 2 is disposed along the outer peripheral surface of the housing 1 so as to surround the terminal member 2 from the outside, the retaining member 3 serves as a shield plate, so that the shielding effect on the terminal member 2 is achieved. Can be increased.
[0023]
An IC module 4, which is a camera module as an example of an electrical component, is a circuit component in which elements such as a semiconductor (IC) are integrated, and includes a rectangular base portion 4a and an upper surface side of the base portion 4a. And a circular lens portion 4b protruding in the shape. Further, the base portion 4 a is provided with a plurality of external contact pieces 4 c that are continuous from the lower end side to the bottom surface of the four side surfaces, and the external contact pieces 4 c are a plurality of terminal members 2 of the housing portion 1 a of the housing 1. It is to be connected with.
[0024]
In addition, locking grooves 4d are provided at the two corners on the upper surface side of the base portion 4a that face diagonally. An engaging portion 3e formed on the elastic arm portion 3d of the retaining member 3 is engaged with the locking groove portion 4d so that the IC module 4 is held in the housing portion 1a of the housing 1.
The lens unit 4b is used as a camera lens when used as a photographing function of a mobile phone or a digital camera.
[0025]
Next, the operation when the IC module 4 is mounted on the socket device having the above configuration will be described with reference to FIGS.
First, the IC module 4 is inserted from above the housing part 1a of the housing 1 with the bottom side of the base part 4a facing down. At this time, the bottom surface and the side surface of the base portion 4a of the IC module 4 move downward along the inclined surface 3f of the engaging portion 3e formed on the free end side of the elastic arm portion 3d of the retaining member 3, Along with this movement, the elastic arm portion 3d is elastically deformed outward and bent due to its own springiness as partially shown in FIGS.
At this time, since the elastic arm portion 3d is formed in an elongated shape along the lateral direction of the substrate portion 3a of the retaining member 3, the elastic arm portion 3d is bent with sufficient elasticity.
[0026]
Then, when the tip of the engaging portion 3e reaches the locking groove 4d formed on the upper surface side of the IC module 4, the engaging portion 3e is locked as shown partially in FIGS. It is engaged by dropping into the groove 4d.
At this time, the engaging portion 3e is urged inward by the spring property of the elastic arm portion 3d itself, that is, urged toward the locking groove portion 4d side of the IC module 4, and is elastically pressed with spring property. The IC module 4 is securely held in the storage portion 1a of the housing 1.
[0027]
When the IC module 4 is held in the storage portion 1a, as shown in FIG. 5, a plurality of external contact pieces 4c provided on the base portion 4a of the IC module 4 are arranged on the peripheral portion of the storage portion 1a. By making contact with the bent piece 2 c provided at the tip of the contact plate 2 a of the plurality of terminal members 2, the electrical connection is established.
At this time, the contact plate 2a of the terminal member 2 is formed by being bent in a U-shape, and the bent piece 2c is elastically contacted with the external contact piece 4c by its own spring property, so that the contact is surely made and stable Contact is obtained.
[0028]
According to the above-described embodiment of the present invention, the retaining member 3 includes the thin plate-like substrate portion 3a disposed along the outer surface of the housing 1, and the elastically provided on the substrate portion 3a so as to be elastically deformable. The elastic arm portion 3d is formed in an elongated shape in the lateral direction of the substrate portion 3a (a direction perpendicular to the insertion direction of the IC module 4). An engaging portion 3e that engages with the locking groove portion 4d of the IC module 4 to prevent it from coming off is formed on the distal end side, and when the IC module 4 is mounted, the elastic arm portion 3d is elastically deformed outward. At the same time, when the IC module 4 is mounted in the storage portion 1a, the engaging portion 3e engages with the locking groove portion 4d of the IC module 4 and is prevented from coming off, so that the IC module 4 is mounted on the socket device. When you hold it, Since the elastic arm portion 3d having the engagement portion 3e is formed by extending along the outer surface of the housing 1 in the lateral direction and in a long shape, the length of the elastic arm portion 3d is sufficiently secured, Since the size can be reduced while maintaining the elastic force of the engaging portion 3e, the socket device can be reduced in size and thickness.
[0029]
In the above embodiment, the grounding piece 3g is formed on the lower surface side of the board portion 3a of the retaining member 3, and this grounding piece 3g is grounded to the ground of the circuit board on which the socket device is mounted. In addition to this, a contact piece (not shown) for grounding is also formed in the locking groove 4d of the IC module 4, and the contact piece for grounding and the elastic arm portion 3d of the retaining member 3 are engaged. The IC module 4 may be directly grounded to the ground of the circuit board on which the socket device is mounted by connecting the joint portion 3e.
[0030]
【The invention's effect】
As described above, the socket device according to the present invention includes a housing having a concave storage portion on which an electrical component is mounted, and a plurality of terminals that are arranged in parallel in the housing storage portion and connected to an external contact piece of the electrical component. And a retaining member for retaining the electrical component in the housing portion to prevent the retaining member, the retaining member is a thin plate-like substrate portion disposed along the outer surface of the housing, and elastically deformed to the substrate portion. The elastic arm portion is formed in an elongated shape in the lateral direction of the substrate portion, and is engaged with the top of the elastic arm portion above the electrical component to prevent the elastic arm portion from coming off. When the electrical component is mounted, the elastic arm portion is elastically deformed outward, and when the electrical component is mounted on the storage portion, the engagement portion is located above the electrical component. Because it is engaged and prevented from coming off, electrical parts Since the elastic arm portion having the engaging portion for preventing the removal when attached to the socket device is extended laterally and along the outer side surface of the housing, the elastic arm portion is formed. Since the length of the portion can be sufficiently secured and the size can be reduced while maintaining the elastic force of the engaging portion, the socket device can be reduced in size and thickness.
[0031]
Further, the housing is formed in a square shape having four sides, and the retaining members are arranged on at least two opposing surfaces of the outer surfaces of the opposing four sides of the housing, and thus face each other. Since the elastic force of the elastic arm acts in the direction, the electric component can be securely held by the retaining member.
Further, since the retaining member is formed of a conductive metal plate and is bent along the outer surface of the housing by bending the metal plate, an elastic force can be obtained with certainty even if it is formed in a thin plate shape. At the same time, it is easy to process and inexpensive.
[0032]
The plurality of terminal members are arranged in parallel at the peripheral edge of the concave storage portion, and the substrate portion of the retaining member is disposed in the vicinity of the terminal member so as to surround the terminal member from the outside. Since the board member is grounded to the ground of the circuit board on which the socket device is mounted, the retaining member serves as a shield plate, so that the shielding effect on the terminal member can be enhanced. it can.
In addition, the engaging portion of the retaining member is formed with an inclined surface, and when the electric component is mounted, the elastic arm portion moves outward by inserting the electric component along the inclined surface. Since the elastic arm portion is elastically deformed, the elastic arm portion can be elastically deformed with a simple configuration, so that a reliable engagement force between the electric component and the retaining member can be obtained.
[Brief description of the drawings]
FIG. 1 is a plan view showing a socket device according to an embodiment of the present invention.
FIG. 2 is a front view showing a part of the terminal member of the socket device of the present invention in a cutaway manner.
FIG. 3 is a side view showing a part of the retaining member of the socket device according to the present invention in a broken state.
FIG. 4 is a plan view showing a state where an IC module is mounted on the socket device of the present invention.
FIG. 5 is a front view showing a part of the terminal member with the IC module mounted on the socket device of the present invention.
FIG. 6 is a side view showing a part of the retaining member in a state where the IC module is mounted on the socket device of the present invention.
FIG. 7 is a side view showing a state in which the retaining member of the socket device of the present invention is bent.
FIG. 8 is a perspective view showing a retaining member of the socket device of the present invention.
FIG. 9 is a plan view showing an IC module of the present invention.
FIG. 10 is a front view showing an IC module of the present invention.
FIG. 11 is a plan view showing a conventional socket device.
FIG. 12 is a side view showing a holding state by a latch arm of a conventional socket device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Housing 1a Storage part 2 Terminal member 2a Contact board 2b Connection board 2c Bending piece 3 Retaining member 3a Substrate part 3b Crosspiece part 3c Slit 3d Elastic arm part 3e Engagement part 3f Inclined surface 3g Grounding piece 4 IC module 4a Base part 4b Lens portion 4c External contact piece 4d Locking groove

Claims (5)

電気部品が装着される凹状の収納部を有するハウジングと、このハウジングの収納部内に並設され、前記電気部品の外部接触片と接続される複数の端子部材と、前記電気部品を前記収納部に保持して抜け止めする抜け止め部材とを備え、前記抜け止め部材は、前記ハウジングの外側面に沿って配設された薄板状の基板部と、この基板部の一部に設けられたスリットにより横方向に長尺状に延在すると共に、前記ハウジングの外側面に対して外方向に弾性変形可能に形成された弾性アーム部とからなり、前記弾性アーム部の先端側に前記電気部品の上方に係合して抜け止めする係合部を形成し、前記電気部品が装着される際には、前記弾性アーム部が外方向へ弾性変形すると共に、前記電気部品が前記収納部に装着された時には、前記係合部が前記電気部品の上方に係合して抜け止めされることを特徴とするソケット装置。A housing having a concave storage portion on which an electrical component is mounted, a plurality of terminal members arranged in parallel in the storage portion of the housing and connected to an external contact piece of the electrical component, and the electrical component in the storage portion A retaining member for retaining and retaining, and the retaining member includes a thin plate-like substrate portion disposed along the outer surface of the housing and a slit provided in a part of the substrate portion. laterally while extending elongated, composed of a elastically deformable-formed resilient arm portion outwardly with respect to the outer surface of said housing, said electrical components on the distal end side of the front Symbol resilient arm portion An engaging portion is formed to engage upward to prevent detachment, and when the electrical component is mounted, the elastic arm portion is elastically deformed outward, and the electrical component is mounted in the storage portion. When the engagement portion is Socket apparatus characterized by being retained in engagement with the upper side of the serial electrical components. 前記ハウジングは、４辺を有する方形状に形成され、前記抜け止め部材は、前記ハウジングの対向する４辺の外側面の内、少なくとも対向する２面にそれぞれ配設されていることを特徴とする請求項１記載のソケット装置。The housing is formed in a square shape having four sides, and the retaining member is disposed on at least two opposing surfaces of the outer surfaces of the opposing four sides of the housing. The socket device according to claim 1. 前記抜け止め部材を、導電性の金属板で形成し、この金属板を折り曲げることにより、前記ハウジングの外側面に沿って配設したことを特徴とする請求項２記載のソケット装置。3. The socket device according to claim 2, wherein the retaining member is formed of a conductive metal plate and is disposed along the outer surface of the housing by bending the metal plate. 前記複数の端子部材は、前記凹状の収納部の周縁部に並設されており、前記抜け止め部材の基板部は、前記端子部材の近傍に配設されて、前記端子部材を外方から取り囲むように前記ハウジングの外周面に沿って配設されると共に、前記基板部をソケット装置が実装される回路基板のグランドに接地したことを特徴とする請求項３記載のソケット装置。The plurality of terminal members are juxtaposed on the peripheral edge of the concave storage portion, and the board portion of the retaining member is disposed in the vicinity of the terminal member and surrounds the terminal member from the outside. along said outer peripheral surface of the housing while being arranged, socket device according to claim 3, characterized in that grounding the substrate portion on the circuit board of the ground socket device is mounted so. 前記抜け止め部材の係合部には傾斜面が形成されており、前記電気部品が装着される際には、前記傾斜面に沿って前記電気部品が挿入されることにより、前記弾性アーム部が外方向へ弾性変形することを特徴とする請求項１乃至４の何れかに記載のソケット装置。The engaging portion of the retaining member is formed with an inclined surface, and when the electric component is mounted, the elastic arm portion is inserted by inserting the electric component along the inclined surface. 5. The socket device according to claim 1, wherein the socket device is elastically deformed outward.
JP2003196663A 2003-07-14 2003-07-14 Socket device Expired - Fee Related JP4231354B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003196663A JP4231354B2 (en) 2003-07-14 2003-07-14 Socket device
KR1020040052699A KR100589883B1 (en) 2003-07-14 2004-07-07 A socket device
CNB2004100633797A CN100367572C (en) 2003-07-14 2004-07-08 Socket device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003196663A JP4231354B2 (en) 2003-07-14 2003-07-14 Socket device

Publications (2)

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JP2005032567A JP2005032567A (en) 2005-02-03
JP4231354B2 true JP4231354B2 (en) 2009-02-25

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KR (1) KR100589883B1 (en)
CN (1) CN100367572C (en)

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* Cited by examiner, † Cited by third party
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JP4161346B2 (en) 2003-11-20 2008-10-08 Ｓｍｋ株式会社 Socket for electronic parts
JP2006236936A (en) * 2005-02-28 2006-09-07 Mitsumi Electric Co Ltd Connector lock device for module
JP4636412B2 (en) * 2005-10-20 2011-02-23 Ｓｍｋ株式会社 Socket for electronic parts
JP2007123214A (en) * 2005-10-31 2007-05-17 Mitsumi Electric Co Ltd Mounting structure of camera module
JP2007228774A (en) 2006-02-27 2007-09-06 Citizen Holdings Co Ltd Speed regulation device of printer and dc motor
JP2008159340A (en) * 2006-12-22 2008-07-10 Smk Corp Socket for attaching electronic component
JP2008311077A (en) * 2007-06-14 2008-12-25 Alps Electric Co Ltd Face-to-face type connector
JP5597030B2 (en) * 2010-05-28 2014-10-01 タイコエレクトロニクスジャパン合同会社 Electrical connector assembly
JP5814198B2 (en) * 2012-08-31 2015-11-17 株式会社マックエイト Chip type electronic component inspection socket

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JP2637647B2 (en) * 1991-08-30 1997-08-06 山一電機 株式会社 IC carrier or IC socket
US5226824A (en) * 1992-05-13 1993-07-13 Foxconn International, Inc. IC socket and contact therein
JP2909372B2 (en) * 1993-12-22 1999-06-23 株式会社ピーエフユー Sub printed board retaining structure
JP3480837B2 (en) * 1998-07-16 2003-12-22 昭英電機株式会社 IC socket
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US6475017B1 (en) * 2001-11-30 2002-11-05 Hon Hai Precision Ind. Co., Ltd. Electrical connector with latch

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Publication number Publication date
CN100367572C (en) 2008-02-06
CN1578006A (en) 2005-02-09
KR100589883B1 (en) 2006-06-19
JP2005032567A (en) 2005-02-03
KR20050009144A (en) 2005-01-24

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