JP4230826B2 - Laser processing method - Google Patents

Laser processing method Download PDF

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Publication number
JP4230826B2
JP4230826B2 JP2003165209A JP2003165209A JP4230826B2 JP 4230826 B2 JP4230826 B2 JP 4230826B2 JP 2003165209 A JP2003165209 A JP 2003165209A JP 2003165209 A JP2003165209 A JP 2003165209A JP 4230826 B2 JP4230826 B2 JP 4230826B2
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Japan
Prior art keywords
processing method
laser
laser processing
region
modified region
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JP2003165209A
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Japanese (ja)
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JP2005001172A (en
Inventor
隆二 杉浦
文嗣 福世
憲一 村松
敏光 和久田
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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    • B23K26/244—Overlap seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent

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Description

【０００１】
【発明の属する技術分野】
本発明は、光透過性を有する部材同士を接合するためのレーザ加工方法に関する。
【０００２】
【従来の技術】
従来におけるこの種の技術は、例えば下記の特許文献１に開示されている。この特許文献１記載の接合方法は、光透過性部材と光吸収性部材とを重ね合わせ、光透過性部材側からレーザ光を照射して、このレーザ光を光吸収性部材に吸収させることで、両部材間の接触面近傍を溶融させて両部材を接合するものである。ところが、この接合方法では、光透過性を有する部材同士を接合することができない。
【０００３】
このような問題を解決し得る技術として、下記の特許文献２，３には次のような技術が開示されている。すなわち、特許文献２記載の接着方法は、光透過性を有する２つの部材間に、レーザ光の吸収により接着作用が生じる接着剤を介在させ、一方の部材側から接着剤にレーザ光を照射して吸収させることで、両部材を接着する方法である。
【０００４】
また、特許文献３記載の加工方法は、光透過性を有する２つの部材間に固形状無機物を介在させ、一方の部材側から固形状無機物にレーザ光を照射して吸収させることで、両部材間の接触面近傍を溶融させて両部材を溶着する方法である。
【０００５】
【特許文献１】
特公昭６２−４９８５０号公報
【特許文献２】
特公平５−４２３３６号公報
【特許文献３】
特開２００１−２３２６８７号公報
【０００６】
【発明が解決しようとする課題】
しかしながら、上述した特許文献２，３記載の技術にあっては、接合すべき２つの部材間に、更に光吸収性部材（接着剤や固形状無機物）を介在させる必要があり、手間が掛かるという問題がある。
【０００７】
そこで、本発明は、このような事情に鑑みてなされたものであり、光透過性を有する部材同士を効率良く接合することのできるレーザ加工方法を提供することを目的とする。
【０００８】
【課題を解決するための手段】
上記目的を達成するために、本発明に係るレーザ加工方法は、光透過性を有する第１の部材と第２の部材とを接合するレーザ加工方法であって、互いに接触する第１の部材及び第２の部材の内側部分内に集光点を合わせて第１のレーザ光を照射し、内側部分内において多光子吸収を発生させて内側部分に第１のレーザ光を吸収させて、第１の部材から第２の部材に渡る改質領域を内側部分内に形成することで、第１の部材と第２の部材とを接合することを特徴とする。
【０００９】
また、本発明に係るレーザ加工方法は、光透過性を有する第１の部材と第２の部材とを接合するレーザ加工方法であって、互いに接触する第１の部材及び第２の部材の内側部分内に集光点を合わせて第１のレーザ光を照射し、内側部分に第１のレーザ光を吸収させて、第１の部材から第２の部材に渡る改質領域を内側部分内に形成することで、第１の部材と第２の部材とを接合することを特徴とする。
【００１０】
これらのレーザ加工方法においては、互いに接触する第１の部材及び第２の部材の内側部分内に集光点を合わせて第１のレーザ光を照射する。このとき、第１のレーザ光の集光点における強度が所定の閾値を超えると、当該内側部分内において多光子吸収又はそれと同等の光吸収が発生する。このような光吸収を利用して、第１の部材から第２の部材に渡る改質領域を内側部分内に形成することで、第１の部材と第２の部材とを接合することができる。このレーザ加工方法によれば、従来のように接合すべき２つの部材間に光吸収性部材を介在させる必要がないため、光透過性を有する部材同士の効率良い接合が可能となる。
【００１１】
ここで、多光子吸収という現象について簡単に説明する。材料の吸収のバンドギャップＥGよりも光子のエネルギーｈνが小さいと光学的に透明となる。よって、材料に吸収が生じる条件はｈν＞ＥGである。しかし、光学的に透明であっても、レーザ光の強度を非常に大きくするとｎｈν＞ＥGの条件（ｎ＝２，３，４，・・・）で材料に吸収が生じる。この現象を多光子吸収という。従って、第１のレーザ光に対して光透過性を有する部材であっても、第１のレーザ光の集光点近傍で多光子吸収を発生させて改質領域を形成することができる。そして、このような第１のレーザ光の照射によって、第１の部材及び第２の部材の内側部分以外の部分が溶融等の損傷を受けることは殆どない。
【００１２】
なお、内側部分とは、第１の部材と第２の部材との接触面から第１の部材内部の所定深さまでの部分と、当該接触面から第２の部材内部の所定深さまでの部分とを合わせた部分を意味する。また、改質領域とは、多光子吸収又はそれと同等の光吸収によって第１及び第２の部材の何らかの性質が変化した領域を意味する。一例として、熱可塑性樹脂からなる部材の場合、改質領域として、一旦溶融して再固化した領域や、炭化した領域等が形成される。また、ガラスからなる部材の場合、改質領域として、微小クラックが集合した領域等が形成される。
【００１３】
また、第１の部材と第２の部材との接触面に集光点を合わせて第１のレーザ光を照射すれば、第１の部材から第２の部材に渡る改質領域を効率良く形成することができる。
【００１４】
また、内側部分内において第１の部材から第２の部材に集光点を移動させながら第１のレーザ光を照射すれば、第１の部材と第２の部材との接合をより強いものとすることができる。
【００１５】
また、接合の強度を向上させる観点から、第１の部材と第２の部材との接合予定ラインに沿って改質領域を連続させて形成してもよいし、或いは、接合の効率を向上させる観点から、第１の部材と第２の部材との接合予定ラインに沿って改質領域を断続的に複数形成してもよい。
【００１６】
また、改質領域を内側部分内に形成した後、改質領域に第２のレーザ光を照射して吸収させることが好ましい。これにより、第１の部材から第２の部材に渡る改質領域の範囲を拡大させて、第１の部材と第２の部材との接合の強度をより一層向上させることができる。
【００１７】
また、第２のレーザ光のエネルギー密度は、第１のレーザ光のエネルギー密度より低いことが好ましい。これにより、第２のレーザ光の照射において、第１の部材及び第２の部材の内側部分以外の部分が溶融等の損傷を受けるのを防止することができる。
【００１８】
なお、第１の部材及び第２の部材は、可視光線領域から赤外線領域までの波長の光に対して光透過性を有する材料からなる場合がある。
【００１９】
【発明の実施の形態】
以下、本発明に係るレーザ加工方法の好適な実施形態について、図面を参照して詳細に説明する。なお、図面の説明において同一又は相当部分には同一符号を付し、重複する説明を省略する。
【００２０】
［第１実施形態］
図１に示すように、レーザ加工装置１は、光透過性を有する第１の部材２と第２の部材３とを接合するための装置であり、３軸方向に移動可能なステージ４を有している。このステージ４上には、その上面と対面するように押圧板６がエアシリンダ７を介して取り付けられており、第１及び第２の部材２，３がサンプル台８上に載置された状態で設置される。なお、第１及び第２の部材２，３は、透明ＰＥＴ（ポリエチレンテレフタレート）からなる厚さ約５ｍｍのシート状部材である。また、押圧板６は、透明アクリルや透明ポリカーボネート等、光透過性を有する材料により形成されている。
【００２１】
この押圧板６の上方には、レーザ光源１１，１２を収容するヘッド１３が設置されている。レーザ光源１１は、ＱＳＷ−ＹＡＧ・ＤＰＳＳＬであり、周波数５００Ｈｚ，波長１０６４ｎｍでパルスレーザ光（第１のレーザ光）Ｌ１を出射する。このレーザ光源１１の前方には、レーザ光Ｌ１を下方に反射するミラー１４が設置されている。このミラー１４により下方に反射されたレーザ光Ｌ１は、その光路上に設置された集光レンズ１６によって集光され、押圧板６を透過してサンプル台８上の第１及び第２の部材２，３に照射される。これにより、レーザ光Ｌ１は、集光点Ｐ１においてビーム径２μｍ，エネルギー密度２３．９ＭＷ／ｃｍ2となる。
【００２２】
また、レーザ光源１２は、ＣＷ出力レーザダイオードであり、波長８０８ｎｍのＣＷレーザ光（第２のレーザ光）Ｌ２を出射する。このレーザ光源１２には、レーザ光Ｌ２を導光するのシングルファイバ（コア径６００μｍ）１７の一端側が接続されている。このシングルファイバ１７により導光されたレーザ光Ｌ２は、シングルファイバ１７の他端側に設置された集光レンズ１８によって集光され、押圧板６を透過してサンプル台８上の第１及び第２の部材２，３に照射される。これにより、レーザ光Ｌ２は、集光点Ｐ２においてビーム径２００μｍ，エネルギー密度５．３ｋＷ／ｃｍ2となる。
【００２３】
以上のように構成されたレーザ加工装置１を用いて、第１実施形態のレーザ加工方法では、次のようにして第１の部材２と第２の部材３とを接合する。なお、図２に示すように、第１の部材２と第２の部材３との接触面２１内に接合開始点２２及び接合終了点２３を設定し、接合開始点２２と接合終了点２３とを結ぶ直線を接合予定ライン２４とする。また、接触面２１と直交する方向をＺ軸方向、接合予定ライン２４に沿った方向をＹ軸方向、これらに直交する方向をＸ軸方向とする。
【００２４】
まず、第１の部材２上に第２の部材３を重ね合わせてサンプル台８上に載置し、このサンプル台８をステージ４上に設置する。続いて、エアシリンダ７により押圧板６を下降させ、押圧板６とサンプル台８とで第１及び第２の部材２，３を挟み込み、第１及び第２の部材２，３とを所定の圧力（例えば０．２Ｍｐａ）で圧接させる。
【００２５】
この状態で、パルスレーザ光Ｌ１の集光点Ｐ１を接合開始点２２に合わせる。そして、レーザ光源１１からレーザ光Ｌ１を出射させると共に、接合予定ライン２４に沿って接合終了点２３まで集光点Ｐ１を移動させる。この集光点Ｐ１の移動は、ヘッド１３に対してステージ４を１０ｍｍ／ｓの速度でＹ軸方向に移動させることで行われる。
【００２６】
このレーザ光Ｌ１の照射によって、図３に示すように、第１の部材２及び第２の部材３の内側部分２６内において多光子吸収が発生し、図４に示すように、第１の部材２から第２の部材３に渡る改質領域２７が、内側部分２６内において接合予定ライン２４に沿って連続した状態で形成される。このように、第１の部材２と第２の部材３との接触面２１に集光点Ｐ１を合わせてレーザ光Ｌ１を照射すると、第１の部材２から第２の部材３に渡る改質領域２７を一度のレーザ光Ｌ１の走査で効率良く形成することが可能となる。
【００２７】
この改質領域２７は、図３に示すように、第１の部材２から第２の部材３に渡って形成された溶融領域２７ａと、Ｚ軸方向に延びた断面形状で溶融領域２７ａの周囲に形成された変質領域２７ｂとを有している。ここで、溶融領域２７ａは、各部材２，３が一旦溶融して再固化した領域であり、変質領域２７ｂは、各部材２，３が炭化した領域であるものと考えられる。従って、第１の部材２と第２の部材３とは、主に、溶融領域２７ａによって融着された状態となり、互いに接合される。なお、改質領域２７のＺ軸方向における幅は約３ｍｍであり、Ｘ軸方向における幅は約１００μｍであった。
【００２８】
続いて、ＣＷレーザ光Ｌ２の集光点Ｐ２を接合開始点２２に合わせる。そして、レーザ光源１２からレーザ光Ｌ２を出射させると共に、接合予定ライン２４に沿って接合終了点２３まで集光点Ｐ２を移動させる。この集光点Ｐ２の移動は、ヘッド１３に対してステージ４を０．５ｍｍ／ｓの速度でＹ軸方向に移動させることで行われる。なお、第１及び第２の部材２，３は、改質領域２７によって既に接合されているため、第１及び第２の部材２，３に対して押圧板６により圧力をかけなくてもよい。
【００２９】
このレーザ光Ｌ２の照射においては、図５に示すように、レーザ光Ｌ２が改質領域２７によって吸収され、改質領域２７が加熱されることになる。これにより、Ｘ軸方向における改質領域２７の両側には、第１の部材２から第２の部材３に渡る新たな改質領域２８が形成される。この改質領域２８は、主に、一旦溶融して再固化した領域（すなわち、溶融領域）である。従って、第１の部材２と第２の部材３とは、改質領域２７に加え改質領域２８によっても融着された状態となり、両部材２，３同士の接合はより一層強いものとなる。なお、改質領域２８のＸ軸方向における幅は２〜３ｍｍであった。
【００３０】
以上のように、第１実施形態のレーザ加工方法によれば、レーザ光Ｌ１，Ｌ２に対して光透過性を有する部材２，３同士の接合であっても、従来のように両部材２，３間に光吸収性部材を介在させる必要がないため、第１の部材２と第２の部材３とを効率良く接合することができる。しかも、第１の部材２及び第２の部材３の内側部分２６内に改質領域２７，２８を形成しているため、発塵やガスの発生等を抑制することができる。
【００３１】
また、ＣＷレーザ光Ｌ２のエネルギー密度は、パルスレーザ光Ｌ１のエネルギー密度より低くとも、改質領域２７近傍で第１及び第２の部材２，３が溶融する程度に改質領域２７を加熱させ得るエネルギー密度であればよい。そのため、各部材２，３の外側表面等、内側部分２６以外の部分がＣＷレーザ光Ｌ２の照射によって溶融等の損傷を受けるのを防止することができる。
【００３２】
なお、パルスレーザ光Ｌ１の照射により形成された改質領域２７だけでも、第１の部材２と第２の部材３とを接合することが可能であるため、その接合の強度で十分であれば、ＣＷレーザ光Ｌ２の照射による改質領域２８の形成を行わなくてもよい。つまり、接合の強度と接合の効率とを比較考量し、改質領域２７の補強となる改質領域２８の形成を行うか否かを適宜決定すればよい。
【００３３】
そして、ＣＷレーザ光Ｌ２の照射による改質領域２８の形成を行わない場合であっても、上述したように接合予定ライン２４に沿って改質領域２７を連続させて形成すれば、例えば、接合予定ライン２４に沿って改質領域２７を断続的に形成した場合に比べ、第１の部材２と第２の部材３との接合の強度を向上させることができる。
【００３４】
［第２実施形態］
第２実施形態のレーザ加工方法では、上述したレーザ加工装置１を用いて、次のようにして第１の部材２と第２の部材３とを接合する。なお、第２実施形態においても、図２に示すように、接触面２１内に接合開始点２２及び接合終了点２３を設定し、接合開始点２２と接合終了点２３とを結ぶ直線を接合予定ライン２４とする。また、接触面２１と直交する方向をＺ軸方向、接合予定ライン２４に沿った方向をＹ軸方向、これらに直交する方向をＸ軸方向とする。
【００３５】
まず、第１の部材２上に第２の部材３を重ね合わせてサンプル台８上に載置し、このサンプル台８をステージ４上に設置する。続いて、エアシリンダ７により押圧板６を下降させ、押圧板６とサンプル台８とで第１及び第２の部材２，３を挟み込み、第１及び第２の部材２，３とを所定の圧力（例えば０．２Ｍｐａ）で接触させる。
【００３６】
この状態で、図６に示すように、Ｚ軸方向に沿って接合開始点２２から第１の部材２内部に所定距離（例えば２．５ｍｍ）入った始点Ｓ１にパルスレーザ光Ｌ１の集光点Ｐ１を合わせる。そして、レーザ光源１１からレーザ光Ｌ１を出射させると共に、Ｚ軸方向に沿って接合開始点２２から第２の部材３内部に所定距離（例えば２．５ｍｍ）入った終点Ｆ１まで集光点Ｐ１を移動させ、集光点Ｐ１が終点Ｆ１に到達した時点でレーザ光Ｌ１の出射を停止させる。この集光点Ｐ１の移動は、ヘッド１３に対してステージ４を１ｍｍ／ｓの速度でＺ軸方向に移動させることで行われる。
【００３７】
このレーザ光Ｌ１の照射によって、第１及び第２の部材２，３の内側部分２６内において多光子吸収が発生し、第１の部材２から第２の部材３に渡ってＺ軸方向に延在する棒状の改質領域３１が内側部分２６内に形成される。
【００３８】
続いて、図７に示すように、Ｙ軸方向に沿って始点Ｓ１から接合終了点２３側に所定距離（例えば１ｍｍ）離れた始点Ｓ２に集光点Ｐ１を合わせる。そして、レーザ光源１１からレーザ光Ｌ１を出射させると共に、Ｙ軸方向に沿って終点Ｆ１から接合終了点２３側に所定距離（例えば１ｍｍ）離れた終点Ｆ２まで集光点Ｐ１を移動させ、集光点Ｐ１が終点Ｆ２に到達した時点でレーザ光Ｌ１の出射を停止させる。
【００３９】
以降、このようなレーザ光Ｌ１の照射をｎ回繰り返し、内側部分２６内において、接合予定ライン２４に沿ってｎ個の改質領域３１を断続的に形成する。これらの改質領域３１は、図６に示すように、第１の部材２から第２の部材３に渡って形成された溶融領域３１ａと、Ｚ軸方向に延びた断面形状で溶融領域３１ａの周囲に形成された変質領域３１ｂとを有している。ここで、溶融領域３１ａは、各部材２，３が一旦溶融して再固化した領域であり、変質領域３１ｂは、各部材２，３が炭化した領域であるものと考えられる。従って、第１の部材２と第２の部材３とは、主に、溶融領域３１ａによって断続的に融着された状態となり、互いに接合される。なお、改質領域３１のＺ軸方向における幅は約８ｍｍであり、Ｘ軸方向における幅は約１００μｍであった。
【００４０】
続いて、ＣＷレーザ光Ｌ２の集光点Ｐ２を接合開始点２２に合わせる。そして、レーザ光源１２からレーザ光Ｌ２を出射させると共に、接合予定ライン２４に沿って接合終了点２３まで集光点Ｐ２を移動させる。このとき、レーザ光Ｌ２の発振をＯＮ／ＯＦＦさせて、接合予定ライン２４に沿って並んだｎ個の改質領域３１に対して選択的にレーザ光Ｌ２を照射する。なお、第１及び第２の部材２，３は、改質領域３１によって既に接合されているため、第１及び第２の部材２，３に対して押圧板６により圧力をかけなくてもよい。
【００４１】
このレーザ光Ｌ２の照射においては、図８に示すように、レーザ光Ｌ２が改質領域３１によって吸収され、改質領域３１が加熱されることになる。これにより、棒状の各改質領域３１には、第１の部材２から第２の部材３に渡る鍔状の新たな改質領域３２が形成される。この改質領域３２は、主に、一旦溶融して再固化した領域（すなわち、溶融領域）である。従って、第１の部材２と第２の部材３とは、改質領域３１に加え改質領域３２によっても融着された状態となり、両部材２，３同士の接合はより一層強いものとなる。なお、改質領域３２のＸ軸方向における幅は約３ｍｍであった。また、図９に示すように、各改質領域３１に形成された改質領域３２は互いに接続され、改質領域３１，３２は、接合予定ライン２４に沿って連続した状態となった。
【００４２】
以上のように、第２実施形態のレーザ加工方法によれば、第１実施形態のレーザ加工方法と同様、レーザ光Ｌ１，Ｌ２に対して光透過性を有する第１の部材２と第２の部材３とを効率良く接合することができる。
【００４３】
また、各改質領域３１の形成に際しては、内側部分２６内において第１の部材２から第２の部材３に集光点Ｐ１を移動させながらパルスレーザ光Ｌ１を照射している。これにより、改質領域３１においては、変質領域３１ｂだけでなく溶融領域３１ａも集光点Ｐ１の移動方向に沿って延びた形状となる。従って、第１の部材２と第２の部材３との接合をより強いものとすることができる。
【００４４】
しかも、接合予定ライン２４に沿って各改質領域３１を互いに離間させて断続的に形成しているため、例えば、接合予定ライン２４に沿って各改質領域３１を隣接させて形成した場合に比べ、第１の部材２と第２の部材３との接合の効率を向上させることができる。
【００４５】
なお、パルスレーザ光Ｌ１の照射により形成された改質領域３１だけでも、第１の部材２と第２の部材３とを接合することが可能であるため、その接合の強度で十部であれば、ＣＷレーザ光Ｌ２の照射による改質領域３２の形成を行わなくてもよい。つまり、第１実施形態のレーザ加工方法と同様に、接合の強度と接合の効率とを比較考量し、改質領域３１の補強となる改質領域３２の形成を行うか否かを適宜決定すればよい。
【００４６】
本発明は、上述した第１及び第２実施形態に限定されるものではない。例えば、上記各実施形態は、ＰＥＴからなる部材同士を接合する場合であったが、本発明はこれに限定されず、アクリル、ポリカーボネート、塩化ビニル等の熱可塑性樹脂やガラス等、可視光線領域から赤外線領域までの波長の光に対して光透過性を有する他の材料からなる部材同士の接合にも適用可能である。しかも、本発明は、互いに異種材料からなる部材同士の接合にも適用可能である。
【００４７】
なお、本発明における第１のレーザ光の照射条件は、多光子吸収又はそれと同等の光吸収を発生させるものであればよいが、改質領域を形成するための第１のレーザ光の集光点におけるエネルギー密度は次の通りである。すなわち、第１及び第２の部材がアクリルの場合は１５２ｋＷ／ｃｍ2、ポリカーボネートの場合は４６ｋＷ／ｃｍ2、塩化ビニルの場合は１５ｋＷ／ｃｍ2、ＰＥＴの場合は２５ｋＷ／ｃｍ2で改質領域が形成される。このとき、第１のレーザ光の他の条件については、レーザ光源：ＱＳＷ−ＹＡＧ・ＤＰＳＳＬ（２倍波），波長：５３２ｎｍ，パルス幅：４ｎｓ，集光点におけるビーム径：１５μｍ，１点に対する照射時間：１０ｓであった。
【００４８】
また、第１実施形態は、第１の部材２と第２の部材３との接触面２１にパルスレーザ光Ｌ１の集光点Ｐ１を合わせる場合であったが、第１の部材２から第２の部材３に渡る改質領域２７を形成することができれば、集光点Ｐ１が接触面２１から外れても構わない。更に、上記各実施形態は、接合予定ライン２４が直線の場合であったが、接合予定ライン２４は曲線であってもよいし、また、例えば格子状に設定するというように複数本設定してもよい。
【００４９】
そして、本発明は、次のような種々の用途に適用可能である。例えば、マイクロ液体チップにおいて、重ね合わされた２枚のアクリル板のうち、一方のアクリル板の接触面側に溝が形成されている場合に、当該溝の縁に沿って微小な幅（例えば１００μｍ）で改質領域を形成し、２枚のアクリル板を接合することができる。さらに、化粧品等の梱包用パッケージに使用される透明ＰＥＴフィルム同士を接着材を用いずに接合することができる。
【００５０】
【発明の効果】
以上説明したように、本発明に係るレーザ加工方法によれば、光透過性を有する部材同士を効率良く接合することができる。
【図面の簡単な説明】
【図１】本発明に係るレーザ加工方法を実施するためのレーザ加工装置の一例を示す図である。
【図２】本発明に係るレーザ加工方法における第１及び第２の部材の一例を示す図である。
【図３】図２に示す第１及び第２の部材のＡ−Ａ線に沿った部分断面図であって、第１実施形態におけるパルスレーザ光照射中の様子を示す図である。
【図４】図２に示す第１及び第２の部材のＢ−Ｂ線に沿った断面図であって、第１実施形態におけるパルスレーザ光照射後の様子を示す図である。
【図５】図２に示す第１及び第２の部材のＡ−Ａ線に沿った部分断面図であって、第１実施形態におけるＣＷレーザ光照射中の様子を示す図である。
【図６】図２に示す第１及び第２の部材のＡ−Ａ線に沿った部分断面図であって、第２実施形態におけるパルスレーザ光照射中の様子を示す図である。
【図７】図２に示す第１及び第２の部材のＢ−Ｂ線に沿った断面図であって、第２実施形態におけるパルスレーザ光照射後の様子を示す図である。
【図８】図２に示す第１及び第２の部材のＡ−Ａ線に沿った部分断面図であって、第２実施形態におけるＣＷレーザ光照射中の様子を示す図である。
【図９】図２に示す第１及び第２の部材のＢ−Ｂ線に沿った断面図であって、第２実施形態におけるＣＷレーザ光照射後の様子を示す図である。
【符号の説明】
２…第１の部材、３…第２の部材、２１…接触面、２４…接合予定ライン、２６…内側部分、２７，２８，３１，３２…改質領域、２７ａ，３１ａ…溶融領域（改質領域）、２７ｂ，３１ｂ…変質領域（改質領域）、Ｌ１…パルスレーザ光（第１のレーザ光）、Ｌ２…ＣＷレーザ光（第２のレーザ光）、Ｐ１，Ｐ２…集光点。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing method for joining members having optical transparency.
[0002]
[Prior art]
This type of conventional technique is disclosed in, for example, Patent Document 1 below. In the bonding method described in Patent Document 1, a light transmissive member and a light absorptive member are overlapped, and laser light is irradiated from the light transmissive member side so that the light absorptive member absorbs the laser light. In addition, the vicinity of the contact surface between both members is melted to join both members. However, in this joining method, members having optical transparency cannot be joined together.
[0003]
As technologies that can solve such problems, the following technologies are disclosed in Patent Documents 2 and 3 below. That is, in the bonding method described in Patent Document 2, an adhesive that generates an adhesive action by absorption of laser light is interposed between two members having optical transparency, and the adhesive is irradiated with laser light from one member side. This is a method of adhering both members by absorbing them.
[0004]
In addition, the processing method described in Patent Document 3 includes both members by interposing a solid inorganic substance between two members having optical transparency and irradiating the solid inorganic substance with laser light from one member side for absorption. In this method, the vicinity of the contact surface is melted to weld both members.
[0005]
[Patent Document 1]
Japanese Patent Publication No. 62-49850 [Patent Document 2]
Japanese Patent Publication No. 5-42336 [Patent Document 3]
Japanese Patent Application Laid-Open No. 2001-232687
[Problems to be solved by the invention]
However, in the techniques described in Patent Documents 2 and 3, the light absorbing member (adhesive or solid inorganic material) needs to be further interposed between the two members to be joined, which takes time. There's a problem.
[0007]
Then, this invention is made | formed in view of such a situation, and it aims at providing the laser processing method which can join the member which has a light transmittance efficiently.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a laser processing method according to the present invention is a laser processing method for joining a first member having light transparency and a second member, wherein the first member is in contact with each other, and The first member is irradiated with the first laser beam with the focusing point in the inner portion of the second member, multiphoton absorption is generated in the inner portion, and the first laser beam is absorbed in the inner portion . A modified region extending from the member to the second member is formed in the inner portion, whereby the first member and the second member are joined.
[0009]
Further, the laser processing method according to the present invention is a laser processing method for joining the first member and the second member having optical transparency, and is inside the first member and the second member that are in contact with each other. The first laser beam is irradiated with the focusing point in the part, the first laser beam is absorbed in the inner part, and the modified region extending from the first member to the second member is in the inner part. By forming, the first member and the second member are joined.
[0010]
In these laser processing methods, the first laser beam is irradiated with the focusing point in the inner part of the first member and the second member that are in contact with each other. At this time, if the intensity of the first laser beam at the condensing point exceeds a predetermined threshold value, multiphoton absorption or equivalent light absorption occurs in the inner portion. Using such light absorption, the first member and the second member can be joined by forming a modified region in the inner portion from the first member to the second member. . According to this laser processing method, since there is no need to interpose a light absorbing member between two members to be joined as in the conventional case, it is possible to efficiently join members having optical transparency.
[0011]
Here, the phenomenon of multiphoton absorption will be briefly described. If the photon energy hν is smaller than the absorption band gap E G of the material, the material becomes optically transparent. Therefore, a condition under which absorption occurs in the material is hv> E G. However, it is optically transparent, increasing the intensity of the laser beam very Nhnyu> of E G condition (n = 2,3,4, ···) the intensity of laser light becomes very high. This phenomenon is called multiphoton absorption. Therefore, even if the member has optical transparency with respect to the first laser beam, the modified region can be formed by generating multiphoton absorption near the condensing point of the first laser beam. Then, the irradiation of the first laser light hardly damages the parts other than the inner parts of the first member and the second member such as melting.
[0012]
The inner portion is a portion from the contact surface between the first member and the second member to a predetermined depth inside the first member, and a portion from the contact surface to a predetermined depth inside the second member. Means the combined part. Further, the modified region means a region where some property of the first and second members is changed by multiphoton absorption or light absorption equivalent thereto. As an example, in the case of a member made of a thermoplastic resin, a region once melted and re-solidified, a carbonized region, or the like is formed as the modified region. In the case of a member made of glass, a region where microcracks are gathered is formed as a modified region.
[0013]
In addition, if the first laser beam is irradiated with the focal point aligned with the contact surface between the first member and the second member, a modified region extending from the first member to the second member is efficiently formed. can do.
[0014]
Further, if the first laser beam is irradiated while moving the condensing point from the first member to the second member in the inner part, the bonding between the first member and the second member is stronger. can do.
[0015]
Further, from the viewpoint of improving the bonding strength, the modified region may be formed continuously along the planned bonding line between the first member and the second member, or the bonding efficiency is improved. From the viewpoint, a plurality of modified regions may be intermittently formed along a planned joining line between the first member and the second member.
[0016]
In addition, it is preferable that after the modified region is formed in the inner portion, the modified region is irradiated with the second laser beam to be absorbed. Thereby, the range of the modification | reformation area | region ranging from a 1st member to a 2nd member can be expanded, and the intensity | strength of joining of a 1st member and a 2nd member can be improved further.
[0017]
The energy density of the second laser light is preferably lower than the energy density of the first laser light. Thereby, in the irradiation of the second laser beam, it is possible to prevent the first member and the portion other than the inner portion of the second member from being damaged such as melting.
[0018]
Note that the first member and the second member may be made of a material having light transmittance with respect to light having a wavelength from the visible light region to the infrared region.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of a laser processing method according to the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.
[0020]
[First Embodiment]
As shown in FIG. 1, a laser processing apparatus 1 is an apparatus for joining a first member 2 and a second member 3 having optical transparency, and has a stage 4 movable in three axial directions. is doing. On this stage 4, a pressing plate 6 is attached via an air cylinder 7 so as to face the upper surface thereof, and the first and second members 2, 3 are placed on the sample table 8. Installed at. The first and second members 2 and 3 are sheet-like members having a thickness of about 5 mm made of transparent PET (polyethylene terephthalate). The pressing plate 6 is made of a light transmissive material such as transparent acrylic or transparent polycarbonate.
[0021]
A head 13 that houses the laser light sources 11 and 12 is disposed above the pressing plate 6. The laser light source 11 is QSW-YAG · DPSSL, and emits a pulsed laser beam (first laser beam) L1 at a frequency of 500 Hz and a wavelength of 1064 nm. In front of the laser light source 11, a mirror 14 for reflecting the laser light L1 downward is installed. The laser beam L1 reflected downward by the mirror 14 is condensed by the condenser lens 16 installed on the optical path, passes through the pressing plate 6 and the first and second members 2 on the sample table 8. , 3 is irradiated. As a result, the laser beam L1 has a beam diameter of 2 μm and an energy density of 23.9 MW / cm 2 at the condensing point P1.
[0022]
The laser light source 12 is a CW output laser diode, and emits CW laser light (second laser light) L2 having a wavelength of 808 nm. The laser light source 12 is connected to one end side of a single fiber (core diameter 600 μm) 17 for guiding the laser light L2. The laser light L2 guided by the single fiber 17 is condensed by a condensing lens 18 installed on the other end side of the single fiber 17, passes through the pressing plate 6, and the first and the first on the sample table 8. The second member 2 and 3 are irradiated. Thereby, the laser beam L2 has a beam diameter of 200 μm and an energy density of 5.3 kW / cm 2 at the condensing point P2.
[0023]
Using the laser processing apparatus 1 configured as described above, in the laser processing method according to the first embodiment, the first member 2 and the second member 3 are joined as follows. In addition, as shown in FIG. 2, the joining start point 22 and the joining end point 23 are set in the contact surface 21 between the first member 2 and the second member 3, and the joining start point 22 and the joining end point 23 A straight line connecting the two lines is defined as a planned joining line 24. The direction orthogonal to the contact surface 21 is defined as the Z-axis direction, the direction along the planned joining line 24 is defined as the Y-axis direction, and the direction orthogonal thereto is defined as the X-axis direction.
[0024]
First, the second member 3 is superposed on the first member 2 and placed on the sample stage 8, and the sample stage 8 is placed on the stage 4. Subsequently, the pressure plate 6 is lowered by the air cylinder 7, the first and second members 2, 3 are sandwiched between the pressure plate 6 and the sample base 8, and the first and second members 2, 3 are set in a predetermined manner. The contact is made with pressure (for example, 0.2 MPa).
[0025]
In this state, the condensing point P1 of the pulse laser beam L1 is aligned with the joining start point 22. Then, the laser beam L 1 is emitted from the laser light source 11, and the condensing point P 1 is moved along the planned joining line 24 to the joining end point 23. This movement of the condensing point P1 is performed by moving the stage 4 with respect to the head 13 in the Y-axis direction at a speed of 10 mm / s.
[0026]
The irradiation with the laser light L1 causes multiphoton absorption in the first member 2 and the inner portion 26 of the second member 3 as shown in FIG. 3, and the first member as shown in FIG. A modified region 27 extending from 2 to the second member 3 is formed in a continuous state along the planned joining line 24 in the inner portion 26. As described above, when the laser beam L1 is irradiated on the contact surface 21 of the first member 2 and the second member 3 with the light condensing point P1 being aligned, the modification over the first member 2 to the second member 3 is performed. The region 27 can be efficiently formed by scanning with the laser beam L1 once.
[0027]
As shown in FIG. 3, the modified region 27 includes a molten region 27a formed from the first member 2 to the second member 3 and a cross-sectional shape extending in the Z-axis direction around the molten region 27a. And an altered region 27b formed on the substrate. Here, it is considered that the melted region 27a is a region where the members 2 and 3 are once melted and re-solidified, and the altered region 27b is a region where the members 2 and 3 are carbonized. Therefore, the 1st member 2 and the 2nd member 3 will be in the state fuse | fused mainly by the fusion | melting area | region 27a, and will be joined mutually. The width of the modified region 27 in the Z-axis direction was about 3 mm, and the width in the X-axis direction was about 100 μm.
[0028]
Subsequently, the condensing point P <b> 2 of the CW laser beam L <b> 2 is aligned with the joining start point 22. Then, the laser light L2 is emitted from the laser light source 12, and the condensing point P2 is moved to the joining end point 23 along the planned joining line 24. The condensing point P2 is moved by moving the stage 4 in the Y-axis direction with respect to the head 13 at a speed of 0.5 mm / s. In addition, since the 1st and 2nd members 2 and 3 are already joined by the modification | reformation area | region 27, it is not necessary to apply a pressure with respect to the 1st and 2nd members 2 and 3 with the press plate 6. FIG. .
[0029]
In the irradiation with the laser beam L2, as shown in FIG. 5, the laser beam L2 is absorbed by the modified region 27 and the modified region 27 is heated. As a result, new modified regions 28 extending from the first member 2 to the second member 3 are formed on both sides of the modified region 27 in the X-axis direction. The modified region 28 is mainly a region once melted and re-solidified (that is, a melted region). Accordingly, the first member 2 and the second member 3 are fused by the modified region 28 in addition to the modified region 27, and the joining between the members 2 and 3 becomes even stronger. . The width of the modified region 28 in the X-axis direction was 2 to 3 mm.
[0030]
As described above, according to the laser processing method of the first embodiment, even if the members 2 and 3 having optical transparency with respect to the laser beams L1 and L2 are joined together, Since there is no need to interpose a light absorbing member between the three members, the first member 2 and the second member 3 can be efficiently joined. Moreover, since the reformed regions 27 and 28 are formed in the inner portions 26 of the first member 2 and the second member 3, dust generation, gas generation, and the like can be suppressed.
[0031]
Further, even if the energy density of the CW laser beam L2 is lower than the energy density of the pulse laser beam L1, the modified region 27 is heated to such an extent that the first and second members 2 and 3 are melted in the vicinity of the modified region 27. Any energy density can be obtained. Therefore, it is possible to prevent parts such as the outer surfaces of the members 2 and 3 other than the inner part 26 from being damaged by melting or the like due to the irradiation with the CW laser light L2.
[0032]
Note that the first member 2 and the second member 3 can be joined only by the modified region 27 formed by the irradiation of the pulsed laser beam L1, so that the joining strength is sufficient. The modified region 28 may not be formed by irradiation with the CW laser beam L2. That is, the strength of bonding and the efficiency of bonding may be compared and weighed, and it may be determined as appropriate whether or not the modified region 28 for reinforcing the modified region 27 is formed.
[0033]
Even if the modified region 28 is not formed by irradiation with the CW laser light L2, if the modified region 27 is formed continuously along the planned joining line 24 as described above, for example, bonding Compared with the case where the modified region 27 is intermittently formed along the planned line 24, the bonding strength between the first member 2 and the second member 3 can be improved.
[0034]
[Second Embodiment]
In the laser processing method of the second embodiment, the first member 2 and the second member 3 are joined as follows using the laser processing apparatus 1 described above. Also in the second embodiment, as shown in FIG. 2, a joining start point 22 and a joining end point 23 are set in the contact surface 21, and a straight line connecting the joining start point 22 and the joining end point 23 is scheduled to be joined. Line 24. The direction orthogonal to the contact surface 21 is defined as the Z-axis direction, the direction along the planned joining line 24 is defined as the Y-axis direction, and the direction orthogonal thereto is defined as the X-axis direction.
[0035]
First, the second member 3 is superposed on the first member 2 and placed on the sample stage 8, and the sample stage 8 is placed on the stage 4. Subsequently, the pressure plate 6 is lowered by the air cylinder 7, the first and second members 2, 3 are sandwiched between the pressure plate 6 and the sample base 8, and the first and second members 2, 3 are set in a predetermined manner. Contact with pressure (for example, 0.2 MPa).
[0036]
In this state, as shown in FIG. 6, the condensing point of the pulsed laser light L1 from the joining start point 22 to the start point S1 entering the first member 2 within the first member 2 along the Z-axis direction (for example, 2.5 mm). Match P1. Then, the laser light L1 is emitted from the laser light source 11, and the condensing point P1 is set from the joining start point 22 to the end point F1 that enters a predetermined distance (for example, 2.5 mm) inside the second member 3 along the Z-axis direction. The laser beam L1 is stopped from being emitted when the condensing point P1 reaches the end point F1. The movement of the condensing point P1 is performed by moving the stage 4 with respect to the head 13 in the Z-axis direction at a speed of 1 mm / s.
[0037]
The irradiation with the laser light L1 causes multiphoton absorption in the inner portions 26 of the first and second members 2 and 3, and extends from the first member 2 to the second member 3 in the Z-axis direction. An existing rod-shaped modified region 31 is formed in the inner portion 26.
[0038]
Subsequently, as shown in FIG. 7, the condensing point P1 is aligned with the start point S2 that is a predetermined distance (for example, 1 mm) away from the start point S1 toward the joining end point 23 along the Y-axis direction. Then, the laser beam L1 is emitted from the laser light source 11, and the condensing point P1 is moved along the Y-axis direction from the end point F1 to the end point F2 that is a predetermined distance (for example, 1 mm) away from the end point 23. When the point P1 reaches the end point F2, the emission of the laser light L1 is stopped.
[0039]
Thereafter, such irradiation with the laser beam L1 is repeated n times, and n modified regions 31 are intermittently formed along the planned joining line 24 in the inner portion 26. As shown in FIG. 6, these modified regions 31 include a melted region 31a formed from the first member 2 to the second member 3 and a cross-sectional shape extending in the Z-axis direction. And an altered region 31b formed in the periphery. Here, the melting region 31a is a region where the members 2 and 3 are once melted and re-solidified, and the altered region 31b is considered to be a region where the members 2 and 3 are carbonized. Therefore, the 1st member 2 and the 2nd member 3 will be in the state fuse | fused intermittently mainly by the fusion | melting area | region 31a, and will be joined mutually. The width of the modified region 31 in the Z-axis direction was about 8 mm, and the width in the X-axis direction was about 100 μm.
[0040]
Subsequently, the condensing point P <b> 2 of the CW laser beam L <b> 2 is aligned with the joining start point 22. Then, the laser light L2 is emitted from the laser light source 12, and the condensing point P2 is moved to the joining end point 23 along the planned joining line 24. At this time, the oscillation of the laser beam L2 is turned ON / OFF, and the laser beam L2 is selectively irradiated to the n modified regions 31 arranged along the planned joining line 24. In addition, since the 1st and 2nd members 2 and 3 are already joined by the modification | reformation area | region 31, it is not necessary to apply a pressure with the press board 6 with respect to the 1st and 2nd members 2 and 3. .
[0041]
In the irradiation with the laser beam L2, as shown in FIG. 8, the laser beam L2 is absorbed by the modified region 31, and the modified region 31 is heated. As a result, a new bowl-shaped modified region 32 extending from the first member 2 to the second member 3 is formed in each rod-shaped modified region 31. The modified region 32 is mainly a region once melted and re-solidified (that is, a melted region). Accordingly, the first member 2 and the second member 3 are fused by the modified region 32 in addition to the modified region 31, and the bonding between the members 2 and 3 becomes even stronger. . Note that the width of the modified region 32 in the X-axis direction was about 3 mm. Further, as shown in FIG. 9, the modified regions 32 formed in the modified regions 31 are connected to each other, and the modified regions 31 and 32 are in a continuous state along the planned joining line 24.
[0042]
As described above, according to the laser processing method of the second embodiment, similarly to the laser processing method of the first embodiment, the first member 2 and the second member having light transmittance with respect to the laser beams L1 and L2 are used. The member 3 can be efficiently joined.
[0043]
Further, when each modified region 31 is formed, the pulse laser beam L1 is irradiated while moving the condensing point P1 from the first member 2 to the second member 3 in the inner portion 26. Thereby, in the modified region 31, not only the altered region 31b but also the molten region 31a has a shape extending along the moving direction of the condensing point P1. Therefore, the first member 2 and the second member 3 can be more strongly joined.
[0044]
In addition, since the modified regions 31 are intermittently formed along the planned joining line 24 so as to be separated from each other, for example, when the modified regions 31 are formed adjacent to each other along the planned joining line 24. In comparison, the joining efficiency between the first member 2 and the second member 3 can be improved.
[0045]
Note that the first member 2 and the second member 3 can be joined only by the modified region 31 formed by the irradiation of the pulsed laser beam L1, so that the joining strength should be 10 parts. For example, the modified region 32 may not be formed by irradiation with the CW laser beam L2. That is, similar to the laser processing method of the first embodiment, the bonding strength and the bonding efficiency are weighed comparatively, and it is determined as appropriate whether or not to form the modified region 32 to reinforce the modified region 31. That's fine.
[0046]
The present invention is not limited to the first and second embodiments described above. For example, although each said embodiment was a case where the members which consist of PET were joined, this invention is not limited to this, From visible light regions, such as thermoplastic resins, such as an acryl, polycarbonate, vinyl chloride, glass, etc. The present invention can also be applied to the joining of members made of other materials having optical transparency to light having a wavelength up to the infrared region. Moreover, the present invention can also be applied to joining members made of different materials.
[0047]
Note that the irradiation condition of the first laser beam in the present invention is not limited as long as it generates multi-photon absorption or equivalent light absorption, but the first laser beam is focused to form the modified region. The energy density at the points is as follows. That, 152kW / cm 2 when the first and second members of the acrylic, 46kW / cm 2 in the case of polycarbonate, modified region at 25 kW / cm 2 in the case of 15 kW / cm 2, PET in the case of vinyl chloride Is formed. At this time, the other conditions of the first laser beam are as follows: laser light source: QSW-YAG · DPSSL (double wave), wavelength: 532 nm, pulse width: 4 ns, beam diameter at the focal point: 15 μm, for one point Irradiation time: 10 s.
[0048]
Moreover, although 1st Embodiment was a case where the condensing point P1 of pulsed laser beam L1 was match | combined with the contact surface 21 of the 1st member 2 and the 2nd member 3, it is 2nd from the 1st member 2. As long as the modified region 27 extending over the member 3 can be formed, the condensing point P <b> 1 may be off the contact surface 21. Further, in each of the above embodiments, the planned joining line 24 is a straight line. However, the planned joining line 24 may be a curve, or a plurality of lines may be set, for example, set in a lattice shape. Also good.
[0049]
And this invention is applicable to the following various uses. For example, in the micro liquid chip, when a groove is formed on the contact surface side of one of the two acrylic plates overlaid, a small width (for example, 100 μm) along the edge of the groove Thus, the modified region can be formed and two acrylic plates can be joined. Furthermore, transparent PET films used for packaging packages such as cosmetics can be joined without using an adhesive.
[0050]
【The invention's effect】
As described above, according to the laser processing method according to the present invention, members having optical transparency can be efficiently joined.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of a laser processing apparatus for carrying out a laser processing method according to the present invention.
FIG. 2 is a diagram showing an example of first and second members in a laser processing method according to the present invention.
FIG. 3 is a partial cross-sectional view taken along line AA of the first and second members shown in FIG. 2, and shows a state during pulse laser light irradiation in the first embodiment.
4 is a cross-sectional view taken along the line BB of the first and second members shown in FIG. 2, and shows a state after the pulse laser light irradiation in the first embodiment. FIG.
5 is a partial cross-sectional view taken along line AA of the first and second members shown in FIG. 2, and shows a state during CW laser light irradiation in the first embodiment. FIG.
6 is a partial cross-sectional view taken along line AA of the first and second members shown in FIG. 2, and shows a state during pulse laser light irradiation in the second embodiment. FIG.
7 is a cross-sectional view taken along line BB of the first and second members shown in FIG. 2, and shows a state after pulse laser light irradiation in the second embodiment. FIG.
FIG. 8 is a partial cross-sectional view taken along line AA of the first and second members shown in FIG. 2, and shows a state during CW laser light irradiation in the second embodiment.
9 is a cross-sectional view taken along the line BB of the first and second members shown in FIG. 2 and shows a state after CW laser light irradiation in the second embodiment. FIG.
[Explanation of symbols]
2 ... 1st member, 3 ... 2nd member, 21 ... Contact surface, 24 ... Joining line, 26 ... Inner part, 27, 28, 31, 32 ... Modified region, 27a, 31a ... Melting region Quality region), 27b, 31b ... altered region (modified region), L1 ... pulse laser beam (first laser beam), L2 ... CW laser beam (second laser beam), P1, P2 ... condensing point.

Claims (9)

光透過性を有する第１の部材と第２の部材とを接合するレーザ加工方法であって、
互いに接触する前記第１の部材及び前記第２の部材の内側部分内に集光点を合わせて第１のレーザ光を照射し、前記内側部分内において多光子吸収を発生させて前記内側部分に前記第１のレーザ光を吸収させて、前記第１の部材から前記第２の部材に渡る改質領域を前記内側部分内に形成することで、前記第１の部材と前記第２の部材とを接合することを特徴とするレーザ加工方法。A laser processing method for joining a first member having light transmittance and a second member,
The first member and the second member that are in contact with each other are irradiated with the first laser light with the focusing point aligned in the inner part of the second member, and multiphoton absorption is generated in the inner part to cause the inner part to By absorbing the first laser beam and forming a modified region in the inner part from the first member to the second member, the first member and the second member The laser processing method characterized by joining. 光透過性を有する第１の部材と第２の部材とを接合するレーザ加工方法であって、
互いに接触する前記第１の部材及び前記第２の部材の内側部分内に集光点を合わせて第１のレーザ光を照射し、前記内側部分に前記第１のレーザ光を吸収させて、前記第１の部材から前記第２の部材に渡る改質領域を前記内側部分内に形成することで、前記第１の部材と前記第２の部材とを接合することを特徴とするレーザ加工方法。A laser processing method for joining a first member having light transmittance and a second member,
The first member and the second member that are in contact with each other are irradiated with the first laser light with the focusing point in the inner part of the second member, the inner part is absorbed with the first laser light, A laser processing method comprising joining the first member and the second member by forming a modified region extending from the first member to the second member in the inner portion. 前記第１の部材と前記第２の部材との接触面に集光点を合わせて前記第１のレーザ光を照射することを特徴とする請求項１又は２記載のレーザ加工方法。  3. The laser processing method according to claim 1, wherein the first laser beam is irradiated with a condensing point aligned with a contact surface between the first member and the second member. 前記内側部分内において前記第１の部材から前記第２の部材に集光点を移動させながら前記第１のレーザ光を照射することを特徴とする請求項１又は２記載のレーザ加工方法。  3. The laser processing method according to claim 1, wherein the first laser beam is irradiated while moving a condensing point from the first member to the second member in the inner portion. 4. 前記第１の部材と前記第２の部材との接合予定ラインに沿って前記改質領域を連続させて形成することを特徴とする請求項１〜４のいずれか一項記載のレーザ加工方法。  5. The laser processing method according to claim 1, wherein the modified region is formed continuously along a planned joining line between the first member and the second member. 前記第１の部材と前記第２の部材との接合予定ラインに沿って前記改質領域を断続的に複数形成することを特徴とする請求項１〜４のいずれか一項記載のレーザ加工方法。  5. The laser processing method according to claim 1, wherein a plurality of the modified regions are intermittently formed along a planned joining line between the first member and the second member. . 前記改質領域を前記内側部分内に形成した後、前記改質領域に第２のレーザ光を照射して吸収させることを特徴とする請求項１〜６のいずれか一項記載のレーザ加工方法。  The laser processing method according to claim 1, wherein after the modified region is formed in the inner portion, the modified region is irradiated with a second laser beam to be absorbed. . 前記第２のレーザ光のエネルギー密度は、前記第１のレーザ光のエネルギー密度より低いことを特徴とする請求項７記載のレーザ加工方法。  The laser processing method according to claim 7, wherein an energy density of the second laser light is lower than an energy density of the first laser light. 前記第１の部材及び前記第２の部材は、可視光線領域から赤外線領域までの波長の光に対して光透過性を有する材料からなることを特徴とする請求項１〜８のいずれか一項記載のレーザ加工方法。  The said 1st member and the said 2nd member consist of a material which has a light transmittance with respect to the light of the wavelength from a visible light region to an infrared region, The any one of Claims 1-8 characterized by the above-mentioned. The laser processing method as described.
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