JP4224823B2 - Texture processing equipment - Google Patents

Description

  The present invention relates to a texture processing apparatus including a detection device that detects surface runout of a workpiece.

  In the manufacturing process of the magnetic recording medium, for example, the NiP layer formed on the surface of the disk-like substrate by the electroless plating method is polished to smooth and mirror, and then the magnetic recording characteristics A texture processing step for providing fine lines in the circumferential direction on the surface polished for the purpose of increasing the thickness.

  In the texture processing step, for example, a texture processing device as shown in Patent Document 1 or FIGS. 5 and 6 is used.

  5 and 6, the texture processing apparatus includes a chuck mechanism 4 that removably holds a substrate 2 having a hole in the center, and a rotation drive unit 6 that is connected to the chuck mechanism 4 and rotates the chuck mechanism 4 together with the substrate 2. Tape polishing mechanisms 8A and 8B for pressing and polishing a part of the polishing tape 14 against each work surface of the substrate 2, and tapes for making the tape polishing mechanisms 8A and 8B close to or away from each other along the central axis of the chuck mechanism 4 Polishing mechanism feeding devices 10A and 10B, an oscillation device 11 that simultaneously moves the tape polishing mechanisms 8A and 8B along the radial direction of the substrate 2, and a slurry liquid supply unit 12A that supplies the slurry liquid to the processing surface of the substrate 2 And 12B.

  The chuck mechanism 4 disposed on a common central axis with the hole of the substrate 2 holds the substrate 2 so that the flat surface of the substrate 2 substantially intersects the central axis. The rotation drive unit 6 is, for example, a drive motor, and rotates the substrate 2 and the chuck mechanism 4 in a range of about 50 to 500 rpm, for example.

  Since the tape polishing mechanisms 8A and 8B arranged opposite to each other with the substrate 2 interposed therebetween have the same structure, the tape polishing mechanism 8A will be described and the description of the tape polishing mechanism 8B will be omitted.

  The tape polishing mechanism 8A has a feeding roller 16c for feeding a polishing tape 14 to be described later, a take-up roller 16b for winding the polishing tape 14, and a part of the polishing tape 14 that is continuously fed to the processing surface of the substrate 2. The pressing roller 16a to be pressed, the portion of the polishing tape 14 that is wound between the pressing roller 16a and the feeding roller 16c, and the portion that is wound between the pressing roller 16a and the winding roller 16b. And a tensioner roller 16d for applying an initial tension.

  The winding roller 16b is connected to an output shaft of a driving motor (not shown). As a result, when the drive motor is activated, the polishing tape 14 delivered from the delivery roller 16c is moved in the direction indicated by the arrow shown in FIG. 5 and is moved by the winding roller 16b via the pressing roller 16a. The film is continuously wound at a predetermined speed. Therefore, a part of the polishing tape 14 wound around the outer peripheral surface of the pressing roller 16a that is continuously fed always comes into contact with the processed surface of the substrate 2. Furthermore, slurry liquid supply units 12A and 12B are provided in the tape polishing mechanisms 8A and 8B to supply the slurry liquid to the surface to be processed of the substrate 2.

  Slurry liquid supply units 12A and 12B are arranged in tape polishing mechanisms 8A and 8B so that the tips thereof face the processed surface of substrate 2, respectively. Therefore, the slurry liquid supply units 12A and 12B are arranged to face each other with the substrate 2 interposed therebetween as shown in an enlarged view in FIG. Slurry liquid supply units 12A and 12B are moved together with tape polishing mechanisms 8A and 8B, respectively.

  When each of the tape polishing mechanisms 8A and 8B performs texture processing, first, as shown by a two-dot chain line in FIG. 5, the polishing shown by a solid line in FIG. 5 from a standby position separated from the processing surface of the substrate 2 The tape polishing mechanism feed devices 10A and 10B are moved along the central axis direction of the substrate 2 to the execution position. Next, the tape polishing mechanisms 8A and 8B are rotated in a state where a part of the polishing tape 14 is supplied with the slurry liquid from the slurry liquid supply parts 12A and 12B, respectively, as shown in an enlarged view in FIG. As shown in FIG. 6, the substrate 2 is moved in the radial direction of the substrate 2 while being in sliding contact with the work surface of the substrate 2 to be squeezed.

  Subsequently, after the texture processing for the entire processing surface of the substrate 2 is finished, the supply of the slurry liquid from the slurry liquid supply units 12A and 12B is stopped.

  The tape polishing mechanisms 8A and 8B stop operating and are separated from the work surface of the substrate 2 by the tape polishing mechanism feeding devices 10A and 10B and returned to the standby position. The substrate 2 that has been textured is removed from the chuck mechanism 4.

  In such texture processing of the substrate 2, the surface to be processed of the rotating substrate 2 may shake with a predetermined amplitude, that is, so-called surface deflection may occur during processing. The main cause of this surface deflection is when the pressing force of the polishing tape 14 during processing is not balanced between the processed surfaces of the substrate 2 or when it is not uniform in the radial direction of the substrate 2. Alternatively, there is a case where the substrate 2 is attached to the chuck mechanism 4 with a so-called tilt angle due to insufficient adjustment of the attachment of the substrate 2 to the chuck mechanism 4.

  In order to suppress such surface wobbling in texture processing, as shown in Patent Document 2, the surface to be processed is provided opposite to the processed surface of the substrate to be processed, and the processed surface is in relation to the axis of the spindle shaft. A jig for correcting runout that corrects a substrate so as to be vertical has been proposed.

JP 2003-173517 A JP 2000-357322 A

  In the surface runout correction jig described above, after the surface runout amount of the substrate is measured by the dial gauge before the texturing is started, the mounting posture of the substrate is adjusted so as to correct the measured surface runout amount. It will be corrected.

  However, in the texturing, as described above, a predetermined pressure of the polishing tape is applied while the slurry liquid is supplied, so that the substrate surface shake is the same as in the texturing state and the texturing starts. It may be different from before being done.

  Therefore, since the abnormality of the surface runout of the substrate during the texture processing is not detected, there is a possibility that the surface runout cannot be strictly corrected.

  In view of the above problems, the present invention is a texture processing apparatus provided with a detection device that detects surface run-out of a workpiece, etc., not only before and after texture processing, but also of substrate run-out in a processing state. It is an object of the present invention to provide a texture processing apparatus that can detect abnormalities.

  In order to achieve the above-described object, a texture processing apparatus according to the present invention includes a substrate rotation driving mechanism that rotationally drives a substrate to be processed, and a contact surface between the processing surface of the substrate that is rotated at a predetermined number of revolutions and the polishing member. A liquid supply means for supplying a surface state detection liquid to a gap between the first and second portions, and a pressure detection for detecting a pressure in a direction perpendicular to the processing surface of the substrate of the surface state detection liquid in the vicinity of the gap and sending a detection output And a controller for controlling the operation of the liquid supply means according to the rotational speed control operation of the substrate rotation drive mechanism, and determining the surface state of the processing surface of the substrate based on the detection output from the pressure detector; It is configured with. Furthermore, it is preferable to provide a polishing member moving mechanism for moving the sliding contact portion of the polishing member along the radial direction of the substrate with a gap on the processing surface of the substrate.

  According to the texture processing apparatus according to the present invention, the surface state detection liquid is supplied by increasing the rotation of the substrate to a predetermined number of rotations, whereby the surface to be processed of the substrate and the sliding contact portion of the polishing member are provided. When the dynamic pressure effect is generated, the dynamic pressure depends on the gap between the processed surface of the substrate and the sliding contact portion of the polishing member. Therefore, the control unit determines the surface state of the processing surface of the substrate based on the detection output from the pressure detector that detects the pressure of the surface state detection liquid in the vicinity of the gap and sends the detection output. The state of the surface to be processed is determined in a state close to the processing state, and it is possible to detect not only before and after the texture processing, but also the abnormality of the surface deflection of the substrate in the processing state.

1 and 2 schematically show a main part of an example of a texture processing apparatus according to the present invention.
1 and 2, the texture processing apparatus includes a chuck mechanism 24 that detachably holds a disk-shaped substrate 22 having a hole in the center, and a rotational drive that is connected to the chuck mechanism 24 and rotates the chuck mechanism 24 together with the substrate 22. The part 26, the tape polishing mechanisms 28A and 28B for pressing and polishing the polishing tape 34 against each work surface of the substrate 22, and the tape polishing mechanisms 28A and 28B are close to or separated from each other along the central axis of the chuck mechanism 24. The tape polishing mechanism feeding devices 30A and 30B, the oscillation device 32 for moving the tape polishing mechanisms 28A and 28B along the radial direction of the substrate 22, and the tape polishing mechanisms 28A and 28B, respectively, are supplied with slurry liquid. As a slurry liquid supply unit to be supplied on the processing surface The nozzle portions 44A and 42B, and the nozzle portion 44A as a water supply portion that is arranged adjacent to the nozzle portions 42A and 42B and supplies a surface shake detection liquid described later, for example, water, onto the processing surface of the substrate 22. 44B.

  The chuck mechanism 24 disposed on the common central axis with the hole of the substrate 22 holds the substrate 22 in a detachable manner so that the surface to be processed of the substrate 22 is substantially perpendicular to the central axis. .

  The rotation drive unit 26 is, for example, a drive motor, and is controlled by a control unit described later. The substrate 22 and the chuck mechanism 24 are rotationally controlled, for example, in the range of about 50 to 500 rpm during texture processing, and are rotationally controlled in the range of 1000 to 2000 rpm when determining surface runout.

  Since the tape polishing mechanisms 28A and 28B arranged opposite to each other across the substrate 22 have the same structure, the tape polishing mechanism 28A will be described, and the description of the tape polishing mechanism 28B will be omitted.

  The tape polishing mechanism 28A has a feeding roller 40c for feeding a polishing tape 34 to be described later, a take-up roller 40b for winding the polishing tape 34, and a part of the polishing tape 34 that is continuously fed to the processing surface of the substrate 22. The pressing roller 40a to be pressed, the portion of the polishing tape 34 that is wound between the pressing roller 40a and the feeding roller 40c, and the portion that is wound between the pressing roller 40a and the winding roller 40b. And a tensioner roller 40d for applying an initial tension.

  The winding roller 40b is connected to an output shaft of a driving motor (not shown). Thereby, when the driving motor is activated, the polishing tape 34 delivered from the delivery roller 40c is moved in the direction indicated by the arrow shown in FIG. 1, and is moved by the winding roller 40b via the pressing roller 40a. The film is continuously wound at a predetermined speed.

  Therefore, a part of the polishing tape 34 that is continuously fed while being wound around the outer peripheral surface of the pressing roller 40a always comes into contact with the processing surface of the substrate 22.

  The nozzle portions 42A and 42B for supplying the slurry liquid are arranged in the tape polishing mechanisms 28A and 28B so that the tips thereof face the processed surface of the substrate 22 held by the chuck mechanism 24, respectively. Accordingly, the nozzle portions 42A and 42B are arranged to face each other with the substrate 22 interposed therebetween, as shown in an enlarged view in FIG. The other ends of the nozzle portions 42A and 42B are connected via a supply pump to a slurry liquid tank in which slurry liquid (not shown) is stored. The nozzle portions 42A and 42B are moved together with the tape polishing mechanisms 28A and 28B by the polishing mechanism feeding devices 30A and 30B, respectively.

  The nozzle portions 44A and 44B for supplying water to the processing surface of the substrate 22 are arranged at positions below the nozzle portions 42A and 42B, respectively, and the tips of the nozzle portions 44A and 44B are respectively attached to the processing surfaces of the substrate 22 held by the chuck mechanism 24. It arrange | positions in the tape grinding | polishing mechanism 28A and 28B so that it may face. Accordingly, the nozzle portions 44A and 44B are arranged to face each other with the substrate 22 interposed therebetween as shown in an enlarged view in FIG. Further, the other end portions of the nozzle portions 44A and 44B are connected to a tank for storing water (not shown) via a supply pump.

  The nozzle portions 44A and 44B are moved together with the tape polishing mechanisms 28A and 28B by the polishing mechanism feeding devices 30A and 30B, respectively.

  Between the tip of the nozzle portion 44A and the pressing roller 40a, or between the tip of the nozzle portion 44B and the pressing roller 40a, the surface to be processed of the substrate 22 and the outer peripheral surface of the pressing roller 40a (polishing tape 34), respectively. Pressure sensors 46A and 46B are provided for detecting the pressure in the vertical direction on the processing surface of the substrate 22 of water supplied between them and sending a detection output signal. The pressure sensors 46A and 46B send detection output signals SP1 and SP2 representing the pressure of water, respectively.

  The polishing mechanism feeding devices 30A and 30B are, for example, pneumatically driven or hydraulically driven, and are individually provided in the tape polishing mechanisms 28A and 28B.

  The oscillation device 32 is, for example, electrically driven, and the polishing mechanism feeding devices 30A and 30B are connected to the substrate 22 in the radial direction with the tape polishing mechanisms 28A and 28B via a cam mechanism (not shown). It is supposed that it has a structure which moves along a predetermined speed.

  In addition to such a configuration, an example of the texture processing apparatus according to the present invention includes a control unit 50 (FIG. 4) that performs operation control of each of the above-described supply pumps, rotation control of the substrate 22 and the chuck mechanism 24, and the like. I have.

  As shown in FIG. 4, the control unit 50 includes data DP1 and DP2 representing the pressure of water from the signal processing unit 52, a rotation start command signal Ss of the substrate 22 from the production management host computer (not shown), A rotation stop command signal Se is supplied.

  The signal processing unit 52 is supplied with detection output signals SP1 and SP2 from the pressure sensors 46A and 46B described above. The signal processing unit 52 performs predetermined digital conversion processing based on the detection output signals SP1 and SP2, respectively, forms data DP1 and DP2, and supplies them to the control unit 50.

  The control unit 50 stores a storage unit 50M that stores determination reference data representing a relationship between a water pressure distribution and a substrate surface shake distribution, which will be described later, program data for operation control of the rotation drive unit 26 and each supply pump, and the like. It has.

  The determination reference data is obtained when the polishing tape 34 is moved at a predetermined speed in the radial direction while supplying a predetermined amount of water to the processing surface of the substrate 22 rotated at a predetermined speed. A map obtained by previously verifying the relationship between the average water pressure distribution along the radial direction between 34 and the surface to be processed of the substrate 22 and the average value of the surface runout of the substrate 22 was mapped. Is.

  As shown by a solid line in FIG. 1, after the substrate 22 to be textured is attached to the chuck mechanism 24, the control unit 50 moves the chuck mechanism 24 and the substrate 22 to the arrow in FIG. 2 based on the rotation start command signal Ss. The control signal Cd is generated and supplied to the rotation speed control unit 56 so as to rotate at a predetermined rotation speed in the range of 50 to 500 rpm. Accordingly, the rotation speed control unit 56 supplies a drive signal to the rotation drive unit 26 based on the control signal Cd. Next, the polishing tape 34 wound around the outer peripheral surface of the pressing roller 40a is pressed by the polishing mechanism feeding devices 30A and 30B to the outermost peripheral position on the processing surface of the substrate 22 to be rotated.

  Subsequently, when the polishing tape 34 is moved in the radial direction by the oscillation device 32 as shown by a two-dot chain line in FIG. 2, the control unit 50 causes the slurry liquid to pass through the nozzle portions 42A and 42B at a predetermined timing. A control signal Cs is generated and supplied to the pump control unit 54 so as to be dropped on the processing surface of the substrate 22. The pump control unit 54 forms a drive signal based on the control signal Cs and supplies it to the slurry liquid supply pump. As a result, texture processing is started.

  At the end of texture processing, the control unit 50 stops the supply of the control signal Cd and the control signal Cs in order to stop the supply of the slurry liquid based on the rotation stop command signal Se. Thereafter, the control unit 50 instead forms a control signal Cw and pumps it in order to drop water onto the surface to be processed of the substrate 22 through the nozzle portions 44A and 44B in order to detect surface runout in the state as it is. It supplies to the control part 54. The pump control unit 54 forms a drive signal based on the control signal Cw and supplies it to the water supply pump.

  At that time, the control unit 50 increases the number of rotations of the substrate 22 to a predetermined value in the range of 1000 to 2000 rpm, for example, about 1000 rpm, and creates a gap between the processing surface of the substrate 22 and the polishing tape 34 by the dynamic pressure effect. The control signal Cd is formed and supplied to the rotation speed control unit 56. Thereby, as shown in FIG. 3B, the water Wa is drawn between the processing surface of the substrate 22 and the polishing tape 34.

  Accordingly, a pressure is generated between the surface to be processed of the substrate 22 and the polishing tape 34, and this pressure is detected by the pressure sensors 46A and 46B, and the surface runout is determined from the fluctuation. Further, since the surface to be processed of the substrate 22 and the polishing tape 34 are separated from each other via water, no extra scratches or the like are formed during high-speed rotation. In addition, when there exists an undesired damage | wound etc. on the to-be-processed surface of the board | substrate 22, it will detect as a fluctuation | variation of the detected pressure mentioned later.

  Subsequently, when the polishing tape 34 is again moved in the radial direction by the oscillation device 32, the control unit 50 refers to the determination reference data based on the sequentially supplied data DP1 and DP2, and the surface of the substrate 22 to be processed. It is determined whether the pressure between the polishing tape 34 and the polishing tape 34 is equal to or higher than a predetermined pressure. When the pressure is lower than the predetermined pressure, it indicates that the surface runout in the radial direction of the substrate 22 is equal to or higher than the predetermined value. Therefore, a display signal DS indicating a defect is formed and supplied to the display unit 58. As a result, a display indicating a defect is displayed on the display unit 58.

  On the other hand, the control unit 50 refers to the determination standard data based on the sequentially supplied data DP1 and DP2, and when the pressure between the processing surface of the substrate 22 and the polishing tape 34 is equal to or higher than a predetermined pressure, the substrate Since 22 indicates that the surface runout in the radial direction is equal to or less than a predetermined value, the display signal DS indicating failure is not formed.

Then, the textured substrate 22 is removed from the chuck mechanism 24.
In the above-described example, the quality of the surface runout in the radial direction of the substrate 22 is determined in a state close to the processed state after texturing, but the present invention is not limited to such an example. Alternatively, the quality of surface runout in the radial direction of the substrate 22 may be determined in a state where the processing is interrupted intermittently during the texture processing.

It is a block diagram which shows roughly the structure of the principal part of an example of the texture processing apparatus which concerns on this invention. It is a side view in the example shown by FIG. (A) And (B) is a figure with which it uses for operation | movement description in the example shown by FIG. 1, respectively. It is a block diagram which shows the structure of the control unit with which an example of the texture processing apparatus which concerns on this invention is equipped. It is a block diagram which shows schematically the principal part of a structure of a conventional apparatus. It is a side view in the example shown by FIG. FIG. 6 is a diagram for explaining an operation of the apparatus shown in FIG. 5.

Explanation of symbols

22 Substrate 24 Chuck mechanism 26 Rotation drive unit 28A, 28B Tape polishing mechanism 30A, 30B Polishing mechanism feeding device 32 Oscillation device 34 Polishing tape 44A, 44B Nozzle unit 46A, 46B Pressure sensor 50 Control unit 52 Signal processing unit 54 Pump control unit 56 Rotational Speed Control Unit 58 Display Unit

Claims (3)

A substrate rotation drive mechanism for rotating the substrate to be processed;
Liquid supply means for supplying a surface state detection liquid to a gap between the processed surface of the substrate and a sliding contact portion of the polishing member, which is rotated at a predetermined number of revolutions;
A pressure detector that detects a pressure in a direction perpendicular to the surface of the substrate to be processed of the surface state detection liquid in the vicinity of the gap and sends a detection output;
A control unit that performs operation control of the liquid supply unit according to a rotation speed control operation of the substrate rotation driving mechanism, and that determines a surface state of the processing surface of the substrate based on a detection output from the pressure detector; ,
A texture processing apparatus comprising: A polishing member moving mechanism for moving the sliding contact portion of the polishing member on the processed surface of the substrate with the gap along the radial direction of the substrate;
2. The control unit performs operation control of the polishing member moving mechanism and determines a surface runout distribution of a surface to be processed of the substrate based on a detection output from the pressure detector. Texture processing equipment. The texture processing apparatus according to claim 2, wherein the pressure detector is movably disposed in relation to the polishing member.

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