JP4216080B2 - Antenna interface unit - Google Patents

Abstract

A ferro-electric tunable duplexer is provided, integrated with one or more of the following parts: a power amplifier, an isolator, a diplexer, a low noise amplifier and an antenna matching circuit. More specifically, in addition to adding F-E tunability, one or more of the above components is integrated with the duplexer on one substrate. The components are integrated on one substrate either by placing each component, with the appropriate matching circuit directly on the substrate, or by direct fabrication of the component and matching circuit into or onto the substrate.

Description

(Related application)
This application claims the benefit of US Provisional Application No. 60 / 283,093, filed Apr. 11, 2001, which is incorporated herein by reference. In addition, this application is a U.S. application Ser. No. 09 / 904,631, filed Jul. 13, 2001, 09/09, filed Jul. 24, 2001, which is incorporated herein by reference. No. 912,753, 09 / 927,732 filed on August 8, 2001, 09 / 927,136 filed on August 10, 2001, filed on January 11, 2002 Related to “Tunable Capacitor” and “Tunable Isolator” filed on Feb. 8, 2002.

(background)
Wireless communication devices, such as (but not limited to) wireless telephones, utilize a number of electrical components to send and receive signals over the air. A transceiver is one type of radiotelephone that actually transmits and receives signals. The front end of the transceiver is the portion of the transceiver closest to the air interface in the signal path. The front end includes the antenna and several components on the antenna side in the signal path. Some of the components required at the front end of the transceiver are a power amplifier (PA), an insulator, a low noise amplifier (LNA) and a multiplexer. Each of these components is typically manufactured as a packaged device. In the case of PA or LNA, this package typically includes the active device and internal input and output matching circuits to bring the input and output resistance to industry standard 50 ohms.

  In one common embodiment, the package PA includes a high performance FET (eg, GaAs) disposed on a ceramic or other substrate. For example, other active devices such as bipolar junction transistors (BJT) and high electron mobility transistors (HEMT) may be utilized. The matching circuit can be patterned on a ceramic substrate or manufactured using a group of surface mount technology (SMT) components. The FET is bonded to the package surface (possibly to a metal heat sink) and then typically connected to the input, output and bias pads using bond wires.

  Depending on requirements, multi-stage PA devices can be used as well. This means that one PA device can contain more than one amplifying transistor. This can require many reasons. One possible reason is to generate the required gain. In the case of a multi-stage PA device, an interstage impedance matching circuit can be used as well, to match between the output of one stage and the input of a subsequent stage.

  Input, output and bias lines to the FET are routed to the ceramic substrate. After passing through the matching circuit, the input and output lines are routed from the board through the connectors on the PA package and down to the printed wiring board (mostly made of FR-4). Additional wire bonding may be required to connect the package pads to the input, output and bias lines.

  The package further includes several types of package (typically polymer) encasing, in whole or in part, the FET and ceramic substrate hold the matching circuit. Input and output bias leads can be seen at the edge of the package.

  Insulators, duplexers, diplexers and low noise amplifiers (LNA) are operated in a sufficiently similar manner. As packaged devices, they have separate substrates with separate matching circuits, each bringing input and output impedances up to 50 ohms.

  Most RF test equipment only tests multiple parts with an impedance of about 50 ohms. Manufacturers and designers typically want to be able to test each part separately. Historically, the only way this can be accomplished is that each part has an input and output impedance of around 50 ohms. For this reason, multiple parts such as PA and LNA have typically been manufactured, for example, with an impedance equal to about 50 ohms. This has necessitated the use of multiple input and output matching circuits for many of these parts.

  The duplexer is one of the major components at the front end of the transceiver. The duplexer has three ports (one port is input or output). One port is connected to the antenna. The second port is connected to the transmit signal path of the transceiver. The duplexer connects the transmission path with the antenna, so that the transmission signal can be transmitted at the antenna.

  The third port is connected to the receive path of the transceiver. The antenna connects the antenna to the receive path so that the received signal can be received by the receive path of the transceiver.

  An important function of the duplexer is to separate the transmit signal from the receive path of the transceiver. The transmitted signal is typically much stronger than the received signal. Some of the transmitted signal essentially goes down to the receive path. However, the transmitted signal down to this receive path must be significantly reduced (or attenuated). Otherwise, the transmission signal that goes down to the reception path overwhelms or suppresses the reception signal. The radiotelephone cannot identify and decode the received signal for the user.

  The required attenuation of the transmitted signal down to the receive path is realized at some cost. The duplexer also attenuates the transmitted signal that travels to the transmitting antenna. This attenuation in the transmitted signal going to the antenna is known as loss. It is beneficial to reduce transmission signal loss in the duplexer.

  Further, the duplexer must typically achieve sufficient attenuation of the receive path of the transmitted signal. Consumers are continually demanding increasingly smaller wireless telephones with additional features and better performance. Thus, while reducing the size of the duplexer, maintaining or improving the attenuation of the transmitted signal in the receive path, and at the same time maintaining or improving the loss of the transmitted signal to the antenna It is beneficial.

(Summary)
Transceivers account for an important part of the cost, size and power consumption of wireless communication devices. The front end, including antennas, duplexers, diplexers, insulators, PAs, LNAs and their other matching circuits, account for an important part of transceiver cost, size and power consumption. It would be beneficial to reduce the cost, size and power consumption of these parts individually and together.

  Briefly, the present invention provides a ferroelectric tunable duplexer that can integrate one or more other parts. This combination is referred to herein as an antenna interface unit. More specifically, in addition to adding FE tunability, the present invention integrates one or more of the above components on a single board. The components are integrated on a single substrate, either by placing each component directly on the substrate with an appropriate matching circuit, or by manufacturing the component and matching circuit directly in or on the substrate.

  For example, when integrating PAs, insulators, and duplexers, PA active devices (eg, GaAs FETs) are placed directly on a common substrate. As part of component integration, the matching circuit for that component can be patterned or placed on a common substrate. The PA matching circuit is patterned or placed on this substrate. If utilized, the insulator can be fabricated directly on this common substrate or mounted as a separate component.

  The matching circuit between the separation device and the duplexer is patterned or manufactured on a substrate. The insulator has a patterned joint on the substrate, along with a ferrite pack, magnet and shield disposed over the substrate.

  For integration, it may be preferred that the stripline duplexer utilize a common substrate such as each half resonator. Alternatively, this length is shorter than the corresponding real microstrip. Whatever type of duplexer is utilized, any coupling and tuning capacitors are patterned on a common substrate. It is understood that the same type of integration can be performed for LNA, diplexer and antenna matching circuit. If minimum loss is a key requirement for a later PA BPF, diplexer or multiplexer, a low loss substrate must be utilized as is well known to those skilled in the art.

  The matching circuit topology is a typical matching circuit topology with two key exceptions. (1) They are integrated with other parts and matching circuits on a common substrate. (2) These may include FE tunable components, but not all of them need to include FE tunable components. The PA and insulator matching circuit are typically pi matching circuits (shunt capacitors, series inductors, or microstrip lines, shunt capacitors). The insulator typically utilizes a series or shunt reactance circuit. Diplexers and duplexer matching circuits are typically simple series input and output capacitors. The antenna matching circuit is a pi or T circuit that generates a higher-order matching circuit having an LC transmission line. Preferably, the duplexer is as claimed in US patent application Ser. No. 09 / 912,753 filed Jul. 24, 2001.

Detailed Description of Preferred Embodiments
Referring now to FIG. 1, an integrated antenna interface unit (AIU) 12 is shown. A duplexer is shown, as is common to CDMA mobile phones, but multiplexers can be utilized as well. The following description refers to duplexers throughout, but it should be understood that a multiplexer or BPF can be substituted for a duplexer. The PA unit 20, insulator unit 24, and duplexer 28 are all attached to a common substrate 16, eliminating the need for a separate substrate for each of the three components.

  The substrate is preferably made from carefully selected materials. Typically, critical substrate parameters are dielectric constant, loss tangent, thermal properties, cost, and ease of processing. Typically, the dielectric constant should be less than about 40 and the loss tangent should be less than about 0.001 in the frequency range of interest. A low loss substrate may be more expensive than a higher loss substrate. Designers often have to balance cost issues with performance parameters such as losses. Furthermore, metal loss must also be minimized. A substrate that can accommodate the low loss metal must be selected.

  The advantages of integrating components with multiplexers are: (1) a reduction in total losses associated with the integrated device compared to losses resulting from the use of separate parts (which makes it easier to meet specifications); 2) Reduction of Tx chain footprint in subsystems, (3) As far as wireless communication devices are concerned, in particular, reduction of total parts, (4) reduction of costs due to reduced packaging and parts, (5) individual This includes the integration of fe tunable components with less added loss and a smaller footprint compared to when introduced as a lumped component.

  A PA-to-insulator matching circuit 41 disposed on the substrate 16 connects the PA unit to the insulator unit 24. An insulator-to-duplexer matching circuit 44 disposed on the substrate 16 connects the insulator to the duplexer.

  Preferably an insulator is used, but it is optional. It will be appreciated that if an insulator is not utilized, the insulator is removed and the PA-to-insulator matching circuit and the insulator-to-duplexer matching circuit are replaced by a PA-to-duplexer matching circuit. In a design as disclosed herein, there are two main reasons why a designer chooses to use an insulator. The reasons are: (1) providing a certain load impedance to the device preceding the insulator (in this case PA), (2) unwanted signals in the device preceding the insulator (in this case PA) To prevent it from being sent back. Undesirable signals sent back to the PA can cause unacceptable mixing and / or deformation that can provide an unacceptable overall design.

  In many cases, the insulator can be eliminated, as is well known in the art. This can be because (1) the PA can exhibit an acceptable load under operating conditions, or (2) an appropriate coupler that reduces the effects of reverse power propagation in the desired signal path; Or, if it can be replaced by a passive hybrid coupler. Passive couplers or passive hybrid couplers can be more easily implemented by manufacturing directly on the substrate, as outlined in this application.

  This particular configuration of AIU 12 is shown and described in detail for purposes of illustration and description only. The AIU 12 may not include the PA 20 and may not include the insulator 24. As generally described with reference to FIGS. 8-13, an AIU always has a tunable multiplexer and several other components on a common substrate. Otherwise, there are many possible components that can be integrated with a multiplexer to form an AIU. PA and insulator are just two examples.

  A PA may also include multiple active devices. This is called multistage PA. Although discussed in connection with one active device, those skilled in the art will appreciate that this discussion can be applied to multi-stage PAs.

Since the matching circuits and components are on a common substrate 16, the impedance matching need not be an industry standard 50 ohm. Alternatively, the impedance match can be from the inherent output impedance of one component, Z _o to the inherent input impedance Z _i of the next component.

  For example, referring again to FIG. 1, if the PA unit 20 has an output impedance of about 2.5 ohms and the insulator unit 24 has an input impedance of about 12.5 ohms, then PA to insulator matching The circuit 41 matches impedance from 2.5 homs in the PA unit 20 to 12.5 ohms in the insulator unit 24. This is the opposite of the prior art. In the prior art, the PA unit typically has a dedicated substrate, and the insulator unit typically has a dedicated substrate. The PA unit has a dedicated matching circuit that matches from the PA output (eg, 2.5 ohms) to 50 ohms. The insulator unit has a dedicated matching circuit that matches from 50 ohms to insulators (eg, 12.5 ohms). There is further loss of signal in this alignment, rising from 2.5 ohms to 50 ohms and back down from 50 ohms to 12.5 ohms.

  A further advantage of matching the input impedance of one specific device from the specific output impedance of one device is, for example, when Zo and Zi are closer to values than would be up to the industry standard 50 ohms. A simpler topology in a matching network can often be used. A simpler matching network results in fewer additional changes due to component changes compared to more complex networks. For example, in the restriction that Zo = Zi, no matching network is required between adjacent devices in the signal path. In the prior art, each device is typically matched to the industry standard 50 ohms.

  Referring again to FIG. 1, duplexer 28 is a low loss tunable duplexer as described in US patent application Ser. No. 09 / 912,753 filed Jul. 24, 2001. Ferroelectric components such as ferroelectric capacitors are used to tune the duplexer.

  An integrated antenna interface unit has much less loss in the transmission path than a non-integrated transmission chain. For example, an integrated component such as PA eliminates lossy mounting as described in US patent application Ser. No. 09 / 912,753 filed Jul. 24, 2001. Specifically, electrical connection between the PA substrate and the common substrate is eliminated. In the prior art, PAs are typically manufactured on a dedicated substrate. When a communication device is built incorporating a PA, an electrical connection must be made between the PA substrate and the common substrate. Whether this is achieved by surface mount technology (SMT), manual soldering, wire bonding or some other attachment method, attachment losses are added. By mounting the PA directly on a common substrate, these losses are avoided.

  Referring now to FIG. 2, a PA matching circuit 48 is shown. The PA 50 has an input 52 and an output 54. In the preferred embodiment, output 54 is connected to first capacitor 56. The first capacitor 56 is also grounded. Output 54 is also connected to inductive element 58. Inductive element 58 may be a lumped element inductor, microstrip line or any other inductive element known in the prior art. Inductive element 58 is also connected to second capacitor 60. The junction between the inductive element 58 and the second capacitor 60 forms the output 65 of the PA matching circuit 48. The output 54 of the PA 50 is also connected to a bias circuit. The bias circuit typically includes an inductor 68, a third capacitor 71 and a voltage source 74.

  Another example matching circuit topology is shown in FIG. Matching circuit 72 is similar to matching circuit 48 shown in FIG. 2 except that matching circuit 72 of FIG. 3 has a further dielectric element 74 and a further capacitor 76. The output 78 of the matching circuit 72 is at the junction between the dielectric element 74 and the capacitor 76. Any or all dielectric and capacitive components can be tunable.

  Those skilled in the art will appreciate that different matching circuit topologies can be utilized to implement a PA matching circuit. In general, more complex matching circuits provide greater matching control at the expense of additional insertion loss (IL) due to finite component Q, as well as increased cost and board cost. Space increases.

  Referring again to FIG. 1, PA is placed directly on substrate 16 and the matching circuit described with reference to FIG. 2 is fabricated directly on substrate 16. The capacitor can be fabricated directly on the substrate 16 as an interdigital capacitor, gap capacitor or overlay capacitor, as is well known in the prior art. By manufacturing the PA unit 20, PA to insulator matching circuit 41 and insulator unit 24 directly on the same substrate 16, in addition to the aforementioned losses resulting from the matching impedance going up and down to 50 ohms, the mounting loss Is avoided. In the prior art, separate substrates for the PA unit and insulator unit must be electrically and mechanically attached to a common substrate or board. There are losses associated with mounting these additional substrates. Ultimately, there is additional loss in the electrical lines connecting the common substrate or separate substrates on the board. By combining the PA and insulator on a common substrate, these losses are eliminated or significantly reduced.

  Referring back to FIG. 2, US patent application Ser. No. 09 / 912,753 filed Jul. 24, 2001, filed Aug. 10, 2001, which is incorporated herein by reference. Capacitors 56 and 60 can be tunable utilizing low loss tunable follower electronic materials and methods such as described in 09 / 927,136. This reduces further losses by providing optimal impedance matching. The matching circuit shown in FIGS. 2 and 3 is utilized to match a single band, such as a PCS band or a cellular band. Preferably, these matching circuits can achieve a variability of at least 15%.

  This allows tuning through some international PCS bands, such as the Indian PCS band to the US PCS band. In order to tune over a wider frequency range (eg, from the US PCS band of about 1900 MHz to the US cellular band of about 800 MHz), the PA-to-insulator matching circuit must be more variable.

  For PA tuning over more than one PCS band, the input matching circuit may require tuning as well. Whether the input matching circuit needs to be tuned can be determined depending on the situation. The same technique used for the output matching circuit is used in this case.

  Increased variability is achieved by adding micro electromechanical switches (MEMS) to the matching circuit. Referring now to FIG. 4A, a multiband PA matching circuit 31 is shown. Matching circuit 31 is similar to the matching circuit of FIG. 2 except that the ability to switch these components from circuit 31 with MEMS and from these circuits 31 with MEMS is added to some additional components. is there. The output 35 of the PA 33 is connected to the first capacitor 37 and the first dielectric element 39 as shown in FIG. The first dielectric element 39 is connected to the second capacitor 43. Here, however, the output 35 of the PA 33 is also connected to the first MEMS 45 for selective connection to the third capacitor 47. The first dielectric element 39 and the second capacitor 43 are also connected to the second MEMS 80 for selective connection with the fourth capacitor 83. These switches 45 and 80 and capacitors 47 and 83 change the capacitance of matching circuit 31.

  In addition, the first dielectric element 39 is connected to MEMS 86 and 89 at either end for selective connection to the second dielectric element 92. These switches 86 and 89 and the conductive element 92 change the inductance of the matching circuit 31. Thus, the matching circuit 31 can be utilized to match the PA 33 for use in either the cellular or PCS band. It will be appreciated that the techniques and devices described herein may be utilized to match in bands other than the cellular and PCS bands. Cellular and PCS bands are selected as examples. It is also understood that other matching circuit topologies can be selected.

  Referring again to FIG. 4A, a multiband PA matching circuit 31 similar to the single band PA matching circuit described with reference to FIG. 2 is shown. As stated, the multi-band PA matching circuit 93 has the advantage of being tunable over a wider range of frequencies with the addition of MEMS switches 86, 89, 45 and 80 and accompanying components. The tunable capacitors 37 and 43 and the tunable reactance element 39 can be used to perform excellent tuning through a specific frequency band. The particular band is selected by MEMS switches 86, 89, 45 and 80.

  In addition to the MEMS switches 86, 89, 45 and 80, the multiband PA matching circuit 93 has additional capacitors 47 and 83 and an additional reactance element 92. The capacitor 83 is connected in series with the capacitor 43 and in series with the MEMS switch 80. When it is desired to switch to another band (eg, another PCS band, etc.), the MEMS switch 80 is activated to change the impedance of the matching circuit 93, and the capacitor 83 is connected to the capacitor 43 and the reactance element. 39 is connected. Similarly, in order to change the impedance of the matching circuit 93, the MEMS switch 45 can be activated to connect the capacitor 47 to the capacitor 37 and the reactance element 39. Similarly, in order to change the impedance of the matching circuit 93, the MEMS switches 86 and 89 can be activated to connect the reactance element 92 in parallel with the reactance component 39.

  An alternative configuration of reactance components 92 and 39 and MEMS switches 86 and 89 is shown in FIG. 4B. In FIG. 4B, MEMS switches 86 and 89 are connected to reactance elements 92 and 39, so that only one of reactance elements 92 and 39 is connected to capacitors 37 and 43. The reactance element 39 can be switched from the circuit so that it is disconnected at both ends. On the other hand, in FIG. 4A, the reactance element 39 is always connected to the circuit in the capacitors 37 and 43. Only the reactance element 92 is switched into and out of the circuit. Note that in both FIGS. 4A and 4B, any of the elements 92, 39, 47, 37, 83 and 43 can be tunable. At least one is tunable, but only one or all of them can be tunable.

  For mobile phone applications, the MEMS switches described herein should have the lowest actual loss, eg, a DC resistance of less than about 0.01 ohms. Switching speed is not critical as long as it is less than about 1.0 ms. Obviously, other applications may require other critical specifications in the MEMS switch.

  With reference now to FIG. 5, an insulator matching circuit is described. Input port 97 is connected to PA (not shown), first impedance element 99 and second impedance element 101. First and second impedance elements 99 and 101 form an input matching circuit for insulator 95. The second impedance element 101 is grounded, and the first impedance element 99 is connected to the insulator 95 for transmitting signals from PA (not shown) to the insulator 95. Both the first and second impedance elements can be ferroelectric tunable components as described in US patent application Ser. No. 09 / 927,136 filed Aug. 10, 2001.

  The output of the insulator 95 is connected to the third impedance element 103 which is connected to the fourth impedance element 105. The third and fourth impedance elements 103 and 105 together form an output port 107 for the output matching circuit and insulator 95. Output port 107 is connected to a duplexer (not shown). Both the third and fourth impedance elements can be ferroelectric tunable components as described in US patent application Ser. No. 09 / 927,136 filed Aug. 10, 2001.

  The insulation port 104 is connected to the impedance element 109. The impedance element 109 is connected to another impedance element 115 and a resistor 118. Impedance elements 109 and 115 and resistor 118 both include an insulation matching circuit.

  It will be appreciated by those skilled in the art that the input, output, and isolation matching circuit described with reference to FIG. 5 utilizing the “L” matching site is merely illustrative. Others for these matching circuits such as parallel LC circuits, “T” or Pi networks, as described, for example, in US patent application Ser. No. 09 / 927,136 filed Aug. 10, 2001. A topology can be utilized.

  Advantageously, each of the impedance elements 99, 101, 103, 105, 109 and 115 is preferably formed directly on a common substrate described with reference to FIG. This reduces losses associated with mounting separate units to the board, reduces costs, and eliminates the need to match components up to 50 ohm industry standards.

  For PA, its characteristic output impedance for CDMA cell phones is typically about 2-4 ohms, which is close to the maximum output power level required for it. Typically, the insulator characteristic impedance is about 8-12 ohms. The filter can be designed with input and output impedances that can take a wide range of values. Because duplexers and diplexers are primarily made from filters, they can be designed to allow a wide range of input and output impedances. Thus, the duplexer and diplexer can be designed to match this impedance no matter what is convenient based on the rest of the circuit.

  Referring now to FIG. 6A, a preferred LNA matching circuit 117 will now be described. Input port 118 is connected to first inductor 121 and capacitor 124. The capacitor is connected to the second inductor 127. The second inductor 127 is connected to the third inductor 130 and the LNA 133.

  Matching circuits are used to match the impedance between the various parts, avoiding or reducing power loss in signals moving from one part to the other. There are other purposes for LNA applications. For LNA applications, the impedance that transforms the network or circuit is first utilized to maintain an optimal noise impedance match between the input signal source and the active device selected for the LNA. In a fixed tuning circuit, optimal noise impedance matching is obtained at a certain frequency and depends on both temperature and component changes. In the tunable circuit approach described above, optimal noise impedance matching can be made adjustable to cover multiple bands or a wider frequency range than is possible in the case of fixed tuning. An added benefit when utilizing tunable components is the ability to compensate for temperature changes.

  The introduction of fe or other tunable components increases the flexibility in LNA design. In conventional designs utilizing fixed elements, it is usually necessary to trade off the optimal noise figure and maximum gain. The tunable component may allow the case where the input matching circuit can vary from a minimum noise figure and maximum gain.

  The tunable optimal noise figure is now described with reference to FIG. 6B. FIG. 6B is a graph showing the noise figure 120 plotted against the frequency 122. Typically, for example, in a CDMA wireless communication device, there is a maximum noise figure 126 that is fixed for a given LNA design. The determined maximum noise figure is indicated by a horizontal dashed line 126. A curve 128 showing a typical noise figure response is shown as a solid line.

Typically, LNA and its matching circuit, the noise figure response 128 is designed to be less than the maximum noise figure 126 at the operating frequency _f o 130. The tunable LNA matching circuit causes the LNA noise figure response 128 to be tuned over frequency. The tuned noise figure responses 132 and 134 are indicated by two dashed lines that are similar in shape to the typical noise figure response 128. By tuning the noise figure responses of 132 and 134, the noise figure response can be brought below the maximum noise figure 126 at alternative operating frequencies f ₁ 138 and f ₂ 140. It will be appreciated that f ₁ 138 and f ₂ 140 are selected only as representative frequencies. The noise figure response can be tuned over a wide range of frequencies. Further, it will be appreciated by those skilled in the art that MEMS switches can be added to the LNA matching circuit to further extend the range of noise figure response variability.

  Referring now to FIG. 7, a preferred antenna matching circuit will be described based on a CDMA mobile phone. The antenna 136 is connected to the first inductor 139 and the second inductor 142. The first inductor 139 preferably has an inductance equal to about 8.2 nH. The second inductor 142 preferably has an inductance equal to about 3.9 nH.

  The second inductor 142 is connected to the first capacitor 145 and the second capacitor 148. The first capacitor 145 preferably has a capacitance equal to about 0.5 pF. The second capacitor 148 preferably has a capacitance equal to about 2.7 pF. It is understood that other component values and matching circuit topologies can be utilized.

  One side of the second capacitor has input and output ports 149 for an antenna matching circuit that connects to a duplexer (not shown), a diplexer (not shown), a multiplexer (not shown) or other type of filter (not shown). Form.

  The antenna matching circuit is typically a pi or T circuit with L-C lines that make the antenna matching circuit a higher order match. This provides additional durability against impedance changes. Typically, the antennas in the system are matched to 50 ohms. However, for a given antenna other than 50 ohms, there is an ideal impedance, but 50 ohms is common to test devices.

  For example, commonly used antennas for wireless communication devices may have an input impedance of 30 ohms. As previously mentioned, the PA may have an output impedance of about 2 ohms. The insulator may have an output impedance of about 12.5 ohms. Diplexers and duplexer filters easily accommodate a wide range of impedances.

  Thus, PA to insulator matching is from about 2 ohms at PA to about 12.5 ohms at insulator. The insulator-to-duplexer alignment is from about 12.5 ohms to about 12.5 ohms. The duplexer is about 12.5 ohms. Thus, duplexer to diplexer alignment is about 12.5 to about 12.5 ohms. The diplexer and duplexer inputs and outputs are approximately the same impedance, eg, 12.5 ohms. The diplexer-to-antenna matching circuit may be matched from about 12.5 ohms at the diplexer to about 30 ohms at the antenna. Each of these matching circuits, adding a diplexer and duplexer, can be fe tunable.

  As described above with reference to FIG. 1, it is understood that a common substrate may include many different combinations of the above-described portions. In one embodiment, as shown in FIG. 8, the common substrate 152 includes a duplexer 154, an insulator 156, a PA 157, and an essential matching circuit (not shown). In another embodiment, as shown in FIG. 9, the common substrate 160 includes an antenna matching circuit 163, a diplexer 166, and a duplexer 169. In yet another embodiment, as shown in FIG. 10, the common substrate 172 includes an antenna matching circuit 175, a diplexer 178, and two duplexers 181 and 184. In yet another embodiment, as shown in FIG. 11, the common substrate 186 includes an antenna matching circuit 188, a diplexer 190, two duplexers 192 and 194, two insulators 194 and 196, two PAs 198 and 200, and Two LNAs 202 and 204 are included. In another embodiment, as shown in FIG. 12, the common substrate 206 includes everything described above with reference to FIG. 11 except for the antenna matching circuit 188. In another embodiment, as shown in FIG. 13, the common substrate includes everything described above with reference to FIG. 10 except for the antenna matching circuit 175.

  The integration of PA modules, insulators and duplexers for the CDMA TX chain eliminates the requirement that each standalone device be matched at 50 ohms at the input and output. By allowing more gradual impedance matching (in the given example from about 2 ohms to about 30 ohms), matching inductive losses may be reduced. Furthermore, the fe tunable component is exposed to a lower rf voltage for a given power.

  A reduced rf voltage for a given power reduces nonlinear deformation. This is because fe films are typically non-linear. Alternatively, the fe component can be exposed to increased power while maintaining an acceptable level of non-linear deformation. Thus, by designing integrated components that operate at lower input and output impedances, in applications where higher power levels are required than are possible with fe components matching industry standard 50 ohms, f- An e component may be incorporated.

  Manufacturing on a common substrate further reduces the losses that naturally occur when the components involved are individually packaged and mounted on a printed wire board (pwb).

  By reducing Tx chain loss, the Tx chain specification can be more easily satisfied. This means that the specification for one or more of the included parts can be relaxed. For example, the specification of PA or other high value parts can be relaxed. A high value portion is a portion having one or more of the following characteristics. High levels of difficulty in matching specifications such as high cost, high performance, gain, power out, stability, ACPR, excess temperature, and unit to unit repetition rate.

  For example, there are many possible advantages because the specifications in PA can be relaxed. For example, the PA may be able to match usage while consuming less power. This results in longer talk time and / or standby time. In another example, Tx chain loss may be reduced so that wireless cell phone manufacturers may be able to match specifications with PAs that have less stringent durability or requirements. Mobile phone manufacturers may be able to select a cheaper PA, reducing the cost of wireless mobile phones. These advantages of reduced Tx chain loss are given as examples only. It will be appreciated by those skilled in the art that other benefits arise from reduced Tx chain loss. It can further be appreciated by those skilled in the art that these advantages can be exploited to improve a wireless communication device in ways other than those described herein.

FIG. 1 is a side block diagram of the antenna interface unit. FIG. 2 is a schematic diagram of a power amplifier matching circuit. FIG. 3 is a schematic diagram of an extended power amplifier matching circuit. FIG. 4A is a schematic diagram of a multiband power amplifier matching circuit. FIG. 4B is a schematic diagram of another multi-band power amplifier matching circuit. FIG. 5 is a schematic diagram of an insulator and three matching circuits. FIG. 6A is a schematic diagram of an LNA matching circuit. FIG. 6B is a graph of LNA noise figure response. FIG. 7 is a schematic diagram of an antenna matching circuit. FIG. 8 is a block diagram of the antenna interface unit. FIG. 9 is a block diagram of the antenna interface unit. FIG. 10 is a block diagram of the antenna interface unit. FIG. 11 is a block diagram of the antenna interface unit. FIG. 12 is a block diagram of the antenna interface unit. FIG. 13 is a block diagram of the antenna interface unit.

Claims (16)

A multiplexer (154) having a ferroelectric tunable component including a capacitor ;
A substrate mechanically coupled to the capacitor;
A control line operably coupled to the ferroelectric tunable component;
A control source electrically coupled to the control line, wherein the control source is configured to transmit a control signal on the control line, the ferroelectric tunable component comprising: A control source that adjusts the resonant frequency of the multiplexer in response to
A power amplifier (157);
A power amplifier output matching circuit coupled between the multiplexer (154) and a power amplifier (157) and having a ferroelectric tunable component, comprising:
And the said multiplexer (154) said power amplifier and (157) the power amplifier output matching circuit are integrated on said substrate,
Power amplifier output matching circuit, the Rukoto distinct output impedance of the power amplifier (157) aligned with the intrinsic input impedance of the multiplexer (154), reducing the distortion of the nonlinear該整case circuit ferroelectric component It is allowed, and to permit operation at higher power levels, the tunable antenna interface unit. The tunable antenna interface unit according to claim 1, wherein the power amplifier output matching circuit matches an impedance of about 2.5 ohms to about 10 ohms for a signal of about 1900 MHz . Tei Ru insulator coupled between the power amplifier output matching circuit and the multiplexer (154) and (156),
Coupled between said insulator body (156) and said multiplexer (154), and further comprising an insulator-to-multiplexer matching circuit having ferroelectricity component,
The insulator (156) and the insulator-to-multiplexer matching circuit is integrated on the substrate,
Insulator-to multiplexer matching circuit, the intrinsic output impedance of the insulator (156) by Rukoto aligned with the intrinsic input impedance of the multiplexer (154), the insulator-to-multiplexer matching circuit ferroelectric component The tunable antenna interface unit according to claim 1, which reduces non-linear distortion and allows operation at higher power levels. 4. The tunable of claim 3, wherein the insulator-to-multiplexer matching circuit matches a signal at about 1900 MHz from about 10 ohm impedance at the insulator output to about 10 ohm impedance at the multiplexer input. Antenna interface unit. A first multiplexer ( 192 ) having a ferroelectric tunable component including a capacitor ;
A substrate mechanically coupled to the capacitor;
A control line operably coupled to the ferroelectric tunable component;
A control source electrically coupled to the control line, wherein the control source is configured to transmit a control signal on the control line, the ferroelectric tunable component comprising: A control source that adjusts the resonant frequency of the multiplexer in response to
A diplexer ( 190 ),
A tunable antenna interface unit coupled between the diplexer ( 190 ) and the first multiplexer ( 192 ) and including a diplexer having a ferroelectric tunable component and a first multiplexer matching circuit, ,
The with the diplexer-to-first multiplexer matching circuits said first multiplexer (192) and the diplexer (190) are integrated on said substrate,
The diplexer-to-first multiplexer matching circuit, intrinsic impedance by Rukoto aligned, the first multiplexer matching circuit Strong said diplexer pair of intrinsic impedance first multiplexer (192) of the diplexer (190) reduce the distortion of the nonlinear dielectric component, and permitting operation at higher power levels, the tunable antenna interface unit. The tunable antenna interface unit according to claim 5, wherein the diplexer ( 190 ) includes a tunable ferroelectric component. The tunable antenna interface unit according to claim 6, further comprising a second multiplexer (194) integrated on the substrate. The first multiplexer (192) is configured to transmit and receive signals in duplex in the PCS band, and the second multiplexer (194) is configured to transmit and receive signals in duplex in the cellular band. The tunable antenna interface unit according to claim 7, which is configured as follows. A first power amplifier (198);
A first insulator (194);
A first power amplifier pair coupled to the first insulator matching circuit coupled between the first power amplifier (198) and the first insulator (194) and having a ferroelectric tunable component; ,
A first insulator-to-first multiplexer matching circuit coupled between the first insulator (194) and the first multiplexer (192) and having a ferroelectric tunable component;
Further including
The first power amplifier (198), the first insulator (194), the first power amplifier pair first insulator matching circuit, and the first insulator pair first multiplexer matching circuit Integrated on the substrate,
The first power amplifier to first insulator matching circuit matches the intrinsic impedance of the first power amplifier (198) with the intrinsic impedance of the first insulator (194), thereby Reducing non-linear distortion of the first power amplifier vs. first insulator matching circuit ferroelectric component and allowing operation at higher power levels;
The first insulator-to-first multiplexer matching circuit matches the inherent impedance of the first insulator (194) with the inherent impedance of the first multiplexer (192). 8. The tunable antenna interface unit of claim 7 that reduces non-linear distortion of the first to second multiplexer matching circuit ferroelectric components and allows operation at higher power levels. A second power amplifier (200);
A second insulator (196);
A second power amplifier pair coupled to the second insulator matching circuit coupled between the second power amplifier (200) and the second insulator (196) and having a ferroelectric tunable component; ,
A second insulator-to-second multiplexer matching circuit coupled between the second insulator (196) and the second multiplexer (194) and having a ferroelectric tunable component;
Further including
The second power amplifier (200), the second insulator (196), the second power amplifier pair second insulator matching circuit, and the second insulator pair second multiplexer matching circuit Integrated on the substrate,
The second power amplifier to second insulator matching circuit matches the intrinsic impedance of the second power amplifier (200) with the intrinsic impedance of the second insulator (196), thereby Nonlinear of second power amplifier vs. second insulator matching circuit ferroelectric component Reduce distortion and allow operation at higher power levels,
The second insulator-to-second multiplexer matching circuit matches the intrinsic impedance of the second insulator (196) with the intrinsic impedance of the second multiplexer (194), thereby providing the second insulator (196). 10. The tunable antenna interface unit according to claim 9, which reduces non-linear distortion of the first to second multiplexer matching circuit ferroelectric components and allows operation at higher power levels. An antenna matching circuit (175) coupled to the duplexer (178) and configured to be coupled to the antenna
Further including
The tunable antenna interface unit according to claim 5, wherein the antenna matching circuit (175) is integrated on the substrate. The tunable antenna interface unit of claim 11, wherein the diplexer (178) comprises a tunable ferroelectric component. The antenna matching circuit includes a ferroelectric component, and the antenna matching circuit matches the intrinsic impedance of the duplexer (178) with the intrinsic impedance of the antenna, thereby providing the antenna matching circuit with a ferroelectric component. The tunable antenna interface unit according to claim 11, which reduces non-linear distortion and allows operation at higher power levels. 14. The tunable antenna interface unit of claim 13, wherein the antenna matching circuit matches from about 10 ohm impedance at the diplexer to about 30 ohm impedance at the antenna. The tunable antenna interface unit according to claim 11, further comprising a second multiplexer (184) integrated on the substrate. The first multiplexer (181) is configured to transmit and receive signals in duplex in the PCS band, and the second multiplexer (184) is configured to transmit and receive signals in duplex in the cellular band. The tunable antenna interface unit according to claim 15, which is configured as follows.

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