DE60207546T2 - ANTENNA INTERFACE UNIT - Google Patents

Abstract

A ferro-electric tunable duplexer is provided, integrated with one or more of the following parts: a power amplifier, an isolator, a diplexer, a low noise amplifier and an antenna matching circuit. More specifically, in addition to adding F-E tunability, one or more of the above components is integrated with the duplexer on one substrate. The components are integrated on one substrate either by placing each component, with the appropriate matching circuit directly on the substrate, or by direct fabrication of the component and matching circuit into or onto the substrate.

Description

BACKGROUND

wireless Communication devices such as, but not limited to Wireless phones, many electronic components use Signals over to send and receive the air. A transceiver is the part a wireless phone that actually sends and receives signals. The The front of a transceiver is the part of a transceiver that the air interface is closest to the signal path. The front part has an antenna and various components near the antenna in the signal path. Various of those in the front of the transceiver Required components include power amplifiers (PAs), decouplers, low-noise amplifiers (LNAs) and multiplexers. All of these components are typically packaged building blocks produced. In the case of a PA or an LNA, this housing typically the active device and internal input and output matching circuits on to the input and output resistors to an industry standard To bring 50 ohms.

In a common one embodiment rejects the housed PA placed on a ceramic or other substrate High performance FET (eg GaAs). Other active components can used such as bipolar junction transistors (BJTs) and transistors with high electron mobility (HEMT). The matching circuits can be designed on the ceramic substrate, or they can under Use of concentrated surface mounting (SMT) devices be prepared. The FET is connected to the case substrate, possibly with connected to a metallic heat sink, and then typically with its input, output and bias pad using bonding wires connected.

Depending on the requirements can also Multi-stage PA devices are used. That means a PA module more as a reinforcing Transistor may have. This may be necessary for a number of reasons be. A possible The reason is to generate the required gain. In that case a multi-stage PA device may also include intermediate impedance matching circuits used to switch between the output of a stage and the input to adapt to the next level.

The Input, output and bias lines to the FET are to the ceramic substrate passed down. After passing through the matching circuits The input and output lines will be away from the substrate down to the underlying circuit board (in most cases from FR-4 manufactured) by connections on the PA housing directed. Further wire bonding may be required to complete the Housing pads with the input, Connecting output and bias line.

The casing also has some kind of packaging (typically polymer) all or part of the FET and the matching circuits wrapped ceramic substrate wrapped. The input, output and bias leads are found on the edge the packaging.

decoupler Duplexers, diplexers and low-noise amplifiers (LNA's) are in much the same way treated. As housed They all have their separate substrates with their separate building blocks Matching circuits that control their input and output impedances bring to 50 ohms.

Most of time For example, an RF meter may only have parts at an impedance of about Check 50 ohms. Manufacturers and developers want typically be able to test each part separately. Historic was it's the only way to do this if each part has an input and an output impedance of had about 50 ohms. Because of this, parts such as PA's and LNA's typically with Impedances equal to about 50 ohms produced. This required the use of expensive input and output matching circuits for many these parts.

One Duplexer is one of the basic components in a front end of the transceiver. The duplexer has three ports (one port is one Input or an output). A connector is coupled to an antenna. A second connection is with the transmit signal path of the transceiver coupled. The duplexer couples the transmission path with the antenna, so that the transmission signal over the antenna can be sent.

One third port is coupled to the receive path of the transceiver. The antenna couples the antenna to the receive path, allowing the received Signal can be received by the receive path of the transceiver.

It is an important function of the duplexer to decouple the transmit signal from the receive path of the transceiver. The transmit signal is typically much stronger than the receive signal. Some of the transmission signal inherently enters the reception path. But this transmission signal, which enters the reception path, must be very reduced (or attenuated). Otherwise, the transmission signal entering the reception path will displace or cover the reception signal. Then, the wireless telephone will not be able to identify and decode the received signal to the user ren.

An antenna interface is in US 5,973,568 (Motorola Inc.), October 26, 1999 (Oct. 26, 1999). The antenna interface comprises a multiplexer, a power amplifier, and a power amplifier matching circuit coupled between the multiplexer and the power amplifier.

Another antenna interface is in US 5,652,599 (Qualcomm, Incorporated), July 29, 1997 (29.07.1997). The antenna interface comprises a first multiplexer, a diplexer and a matching circuit coupled between the diplexer and the multiplexer.

Tunable filters with ferroelectric capacitors are in EP 843374A (Sharp Kabushii Kaisha), April 9, 2003 (Apr. 9, 2003) and WO 00/35042 (Paratek Microwave, Inc.), June 15, 2000 (Jun. 15, 2000).

The required damping of the transmission signal, which enters the reception path, is with some Effort reached. The duplexer attenuates also the transmission signal going to the antenna for transmission. These damping in the transmission signal going to the antenna is known as a loss. It would be advantageous to reduce the transmission path loss in the duplexer.

In addition, must the duplexer will typically be big, to receive path attenuation to reach the transmission signal. Consumers are always demanding smaller wireless phones with more and more features and one better performance. Thus would be It is beneficial to the size of the duplexer while reducing the transmission signal attenuation is maintained or improved in the receive path and while at the same time the transmission signal loss to the antenna is maintained or improved becomes.

Overview

One Significant part of the cost, size and energy consumption Wireless communication devices rely on transceivers. A significant part of the costs, the size and the energy consumption of the transceiver accounts for the front end including antennas, Duplexers, diplexers, decouplers, PAs, LNAs and their matching circuits. It would be beneficial the cost, the size and the To reduce energy consumption of these parts individually and collectively.

In See short the present invention provides a ferroelectric, tunable, integrated duplexer with one or more of the other parts. This combination is referred to herein as an antenna interface unit designated. In particular, in addition to add ferroelectric tunability, integrates the present Invention of one or more of the above components on a substrate. The devices are placed on a substrate either by placing each device with the appropriate matching circuit directly on the substrate or by direct fabrication of the device and the matching circuit integrated in or on the substrate.

To the Example is in the case of integrating the PA, the decoupler and the duplexer, the active PA device (i.e., GaAs FET) directly placed on the common substrate. As part of the integration of Components can the matching circuits for designed or placed the components on the common substrate become. The matching circuit for the PA would be designed on this substrate or placed. The decoupler, if used, could be direct fabricated on this common substrate or as a discrete device to be assembled.

The Matching circuit between the decoupler and the duplexer would open be designed or manufactured the substrate. The connection of the Decoupler would be designed on this substrate, with the iron puck, the magnet and the over he placed a shield.

For purposes For integration, a stripline duplexer may be preferred as it use the common substrate as one half of each resonator would. Furthermore is his length shorter as a corresponding microstrip implementation. Whatever kind used by duplexers, any coupling and tuning capacitors would go up be designed the common substrate. It is understood that the same kind of integration for the LNA, the diplexer and the the antenna matching circuit can be executed. If a minimum Loss a major requirement for is a BPF, duplexer or multiplexer arranged after the PA, then a low-loss substrate must be used, as is the Professional is well known.

The topology of the matching circuits would be typical matching circuit topologies with two main exceptions: (1) they would be integrated with other parts and matching circuits on the common substrate, and (2) they could have ferroelectric tunable devices, although they would not have to have all the ferroelectric tunable devices. The PA and decoupler matching circuits would typically be PI matching circuits (shunt capacitor, series inductor or microstrip line, Parallel capacitor). The decoupler typically uses reactive series or parallel circuits. The diplexer and duplexer matching circuits would typically be simply serial input and output capacitors. The antenna matching circuit would be a PI or T circuit with LC stages forming a higher order matching circuit. Preferably, the duplexer would be as claimed in US 2002/0163400 (Toncich), November 7, 2002 (07.11.2002).

Short description of drawings

1 Fig. 10 is a block diagram of a side view of an antenna interface unit.

2 is a schematic representation of a power amplifier matching circuit.

3 is a schematic representation of an extended power amplifier matching circuit.

4A is a schematic representation of a multi-band power amplifier matching circuit.

4B FIG. 12 is a schematic diagram of another multi-band power amplifier matching circuit. FIG.

5 is a schematic representation of a decoupler and its three matching circuits.

6A is a schematic representation of an LNA matching circuit.

6B is a graph of the frequency response of an LNA noise factor.

7 is a schematic representation of an antenna matching circuit.

8th Fig. 10 is a block diagram of an antenna interface unit.

9 Fig. 10 is a block diagram of an antenna interface unit.

10 Fig. 10 is a block diagram of an antenna interface unit.

11 Fig. 10 is a block diagram of an antenna interface unit.

12 Fig. 10 is a block diagram of an antenna interface unit.

13 Fig. 10 is a block diagram of an antenna interface unit.

Detailed description of the preferred embodiments

It is now referring to 1 an integrated antenna interface unit (AIU) 12 shown. Although a duplexer is shown, as is common in a CDMA mobile device, a multiplexer could also be used. Although the description that follows consistently describes a duplexer, it will be understood that the duplexer could be replaced by a multiplexer or a BPF. A PA unit 20 , a decoupler unit 24 and a duplexer 28 are all on a common substrate 16 attached, eliminating the need for individual substrates for each of these components.

The Substrate is preferably made of a carefully selected material. The substrate parameters, which are typically critical, are the dielectric constant, loss tangents, thermal properties, costs and the ease of processing. Typically, a dielectric constant should be less than about 40, and the loss tangent should be smaller be about 0.001 in the frequency range of interest. One low-loss substrate can be more expensive than a more lossy substrate be. A developer often has to answer the question of cost and performance parameters, such as the loss, weigh. In addition, the metal loss must also be minimized. It must be chosen a substrate that has a low loss Metal can absorb.

advantages integrating components with a multiplexer include: (1) Reduction of the associated with the integrated device Overall loss compared to the one resulting from the use discrete parts, which makes it easier to requirements to fulfill; (2) Reduction of the pad the Tx chain in the subsystem; (3) Reduction of the total number of parts, in particular as far as a manufacturer of a wireless communication device is concerned; (4) Reduction of costs due to a reduced Casing- and part number, (5) integration of ferroelectric adjustable Components with lower additional Losses and demands of less space than when, as a single, concentrated components would be introduced.

One on the substrate 16 arranged PA-to-decoupler matching circuit 41 couples the PA unit to the decoupler unit 24 , One on the substrate 16 arranged decoupler-to-duplexer matching circuit 44 couples the decoupler to the duplexer.

Preferably a decoupler is used, but it is optional. If no decoupler it is understood that the decoupler is removed and the PA-to-decoupler matching circuit and the decoupler-to-duplexer matching circuit through a PA-to-Duplexer matching circuit be replaced. There are two main reasons that there is a developer prefer a decoupler in an embodiment as disclosed herein, to use. The reasons are: (1) the device preceding the decoupler (in this Case of the PA) to provide a certain load impedance; and (2) too prevent unwanted Signals back in the device preceding the decoupler (in this case the PA). unwanted, back to the PA propagating signals can cause a unacceptable mixing or unacceptable distortion or both forms what can make the overall design unacceptable.

As Well known in the art, there are many cases in where the decoupler can be eliminated. That's what happens when: (1) the PA is offered an acceptable load under operating conditions can; or (2) the decoupler through a suitable coupler or a passive hybrid device can be substituted that has the effect a return performance propagation on the desired Signal path reduced. Passive couplers or passive hybrid couplers can more easily implemented by direct fabrication on the substrate as shown in this application.

This special configuration of the AIU 12 is shown and described in detail for the purposes of example and illustration only. The AIU 12 does not have a PA 20 or a decoupler 24 exhibit. As more general with respect to the 8th - 13 will be described, the AIU always has a tunable multiplexer and any other component on a common substrate. In addition, there are many possible components that can be integrated with the multiplexer to form the RIU. The PA and the decoupler are just two examples.

Of the PA can also have multiple active devices. That will be Called cascade PA. The discussion is re an active device is performed, but the person skilled in the art will understand that this discussion on cascade PA's could be applied.

Because the matching circuits and the components are on a common substrate 16 impedance matching does not have to be on the industry standard 50 ohms. Instead, the impedance matching may be made from the output self-impedance Z _{o of} one component to the input eigenimpedance Z _{i of} the next component.

For example, again with respect to 1 , the PA unit 20 an output impedance of about 2.5 ohms and the decoupler unit 24 has an input impedance of about 12.5 ohms, becomes the PA-to-decoupler matching circuit 41 the impedance of 2.5 ohms on the PA unit 20 to 12.5 ohms on the decoupler unit 24 to adjust. This is in contrast to the prior art. In the prior art, the PA unit would typically have its own substrate and the decoupler unit would typically have its own substrate. The PA unit would have its own matching circuit which would adjust from the output of the PA (for example, 2.5 ohms) high to 50 ohms. The decoupler unit would have its own matching circuit which would adapt from 50 ohms down to the decoupler (for example, 12.5 ohms). There would be an additional loss in the signal at this upward adjustment from 2.5 ohms to 50 ohms and from 50 ohms back down to 12.5 ohms.

Another advantage in matching the device's output impedance to the input self-impedance of another device is that often a simpler topology can be used in the matching network if Z _o and Z _i are closer in value than they are after, for example Industry standard 50 ohms do. A simpler matching network results in smaller additional variation due to component variation than does a more complex network. In the limiting case where, for example, Z _o = Z _i , no matching network between adjacent devices in the signal path is needed. In the prior art, each device is typically adapted to the industry standard 50 ohms.

Again referring to 1 is the duplexer 28 a low-loss tunable duplexer as described in US 2002/0163400 (Toncich), Nov. 7, 2002 (Nov. 7, 2002). Ferroelectric devices such as ferroelectric capacitors are used to tune the duplexer.

The integrated antenna interface unit has a significantly smaller loss in the transmission path than non-integrated transmission chains. Integrating components, such as the PA, eliminates lossy ancillary equipment described in US 2002/0175878 (Kyocera Wireless Corp.), November 28, 2002 (Nov. 28, 2002). In particular, an electrical connection between the PA substrate and the common substrate is eliminated. In the prior art, the PA is typically made on its own substrate. When building a communication device that incorporates the PA, an electrical connection must be made between the PA substrate and the common substrate. Whether this is achieved through SMD (SMT), hand soldering, wire bonding or any other attachment method, attachment losses are added. By attaching the PA directly to the common substrate, these losses are avoided.

Now, with respect to 2 a PA matching circuit 48 shown. A PA 50 has an entrance 52 and an exit 54 , In a preferred embodiment, the output is 54 to a first capacitor 56 coupled. The first capacitor 56 is also coupled to ground. The exit 54 is also an inductive element 58 coupled. The inductive element 58 may be a concentrated inductance element, a microstrip line, or any other inductive element known in the art. The inductive element 58 is also connected to a second capacitor 60 coupled. The connection between the inductive element 58 and the second capacitor 60 makes the exit 65 the PA matching circuit 48 , The exit 54 of the PA 50 is also coupled to a bias circuit. The bias circuit typically has an inductance 68 , a third capacitor 71 and a voltage source 74 on.

Another exemplary matching circuit topology is in 3 shown. The matching circuit 72 is the same in 2 shown matching circuit 48 except that the matching circuit 72 in 3 an additional inductive element 75 and an additional capacitor 76 having.

Also is the exit 78 this matching circuit 72 at the connection of the inductive element 75 and the capacitor 76 , Any or all of the inductive and capacitive components may be tunable.

It will be understood by those skilled in the art that different matching circuit topologies can be used to implement the PA matching circuit. In general a more complex matching circuit will have greater control in the adaptation at the expense of an increased insertion loss (I.L.) due to the finite component Q and higher costs and one increased Allow board space.

Again with respect to 1 the PA is directly on the substrate 16 placed, and with respect to 2 described matching circuit is directly on the substrate 16 produced. The capacitors can be directly on the substrate 16 as interdigitated capacitors, split capacitors, or overlay capacitors, as is well known in the art. By making the PA unit 20 , the PA-to-decoupler matching circuit 41 and the decoupler unit 24 directly on the same substrate 16 In addition to the previously described losses resulting from matching the impedances up and down 50 ohms, mounting losses are avoided. In the prior art, the separate substrates for the PA unit and the decoupler unit must be electrically and mechanically attached to a common substrate or board. There are losses associated with the attachment of these additional substrates. Finally, there is an additional loss in the electrical line connecting the separate substrates on the common substrate or common board. By combining the PA and the decoupler on a common substrate, these losses are eliminated or significantly reduced.

Again with respect to 2 can the capacitors 56 and 60 be tunable using low loss tunable ferroelectric materials and methods as described in US 2002/0163400 (Tonich), Nov. 7, 2002 (Nov. 7, 2002), and US 2002/0175878 (Kyocera Wireless Corp.), Nov. 28, 2002 (Nov. 28, 2002) ). This would even further reduce the loss by providing optimal impedance matching. The in the 2 and 3 Matching circuits shown are used to tune a single band, such as the PCS band, or the cellular band. At present, these matching circuits can achieve a tunability of at least 15%.

This allows one vote even over several international PCS tapes, like the India PCS band to the U.S. PCS. To over a larger frequency for example, from the U.S. PCS band at about 1900 MHz The U.S. Cellular Band at about 800 MHz requires the PA-to-decoupler matching circuit a greater tunability exhibit.

To the Tuning a PA over more than a PCS band needed also the input matching circuit a vote. Whether a vote of Input matching circuit is necessary or not, can open be determined on a case by case basis. In this Case, the same technique is used as for the output matching circuit is used.

Increased tunability is achieved by adding microelectromechanical switches (MEMS) to the matching circuit. Now, with respect to 4A a multiband PA matching circuit 31 shown. The matching circuit 31 is equal to that of 2 except that various additional components with the ability to connect these devices with MEMS the circuit 31 to switch on and off of the circuit have been added. The exit 35 a PA 33 is how in 2 to a first capacitor 37 and to a first inductive element 39 coupled. The first inductive element 39 is to a second capacitor 43 coupled. Here is the exit 35 of the PA 33 also to a first MEMS 45 for selectively coupling to a third capacitor 47 coupled. The first inductive element 39 and the second capacitor 43 are also connected to a second MEMS 80 for selectively coupling to a fourth capacitor 83 coupled. These switches 45 and 80 and the capacitors 47 and 83 change the capacity of the matching circuit 31 ,

In addition, the first inductive element 39 at one end to MEMS 86 and 89 for selectively coupling to a second inductive element 92 coupled. These switches 86 and 89 and the inductive element 92 change the inductance of the matching circuit 31 , In this way, the matching circuit 31 used to the PA 33 for use in either the cellular or PCS band. It should be understood that the methods and apparatus described herein could be used to adapt in bands other than the cellular and PCS bands. The cellular band and the PCS band are selected as examples. It is also understood that other matching circuit topologies can be chosen.

Again with respect to 4A is a multi-band PA matching circuit 31 shown similar with respect to 2 described single band PA matching circuit. As shown, the multiband PA matching circuit has 93 an advantage in that they are due to the addition of MEMS switches 86 . 89 . 45 and 80 and the adjoining components are tunable over a wider range of frequencies. The tunable capacitors 37 and 43 and the tunable reactive element 39 can be used to fine-tune over a particular frequency band. The particular band is through the MEMS switch 86 . 89 . 45 and 80 selected.

In addition to the MEMS switches 86 . 89 . 45 and 80 indicates the multiband PA matching circuit 93 additional capacitors 47 and 83 and an additional reactive element 92 on. The capacitor 83 is in series with the capacitor 43 and in series with the MEMS switch 80 connected. When it is desired to switch to another band, such as another PCS band, the MEMS switch becomes 80 operated, the capacitor 83 to the capacitor 43 and the reactive element 39 for changing the impedance of the voting circuit 93 coupled. In the same way, the MEMS switch 45 be pressed to the capacitor 47 to the capacitor 37 and the reactive element 39 for changing the impedance of the matching circuit 93 to pair. Furthermore, the MEMS switches can likewise be used 86 and 89 be pressed to the reactive element 92 parallel to the reactive element 39 for changing the impedance of the matching circuit 93 to pair.

An alternative configuration of reactive components 92 and 39 and MEMS switches 86 and 89 is in 4B shown. In 4B are the MEMS switches 86 and 89 so to the reactive elements 92 and 39 coupled that only one of the reactive elements 92 and 39 to the capacitors 37 and 43 is coupled. The reactive element 39 can be disconnected from the circuit so that it is separated at both ends, whereas in 4A the reactive element 39 always on the capacitors 37 and 43 is coupled to the circuit. Only the reactive element 92 is connected to the circuit and disconnected from the circuit. It should be noted that both in 4A as well as in 4B each of the elements 92 . 39 . 47 . 37 . 83 and 43 can be tunable, but only one or all of them can be tuned.

For applications on mobile devices The MEMS switches described here should be the lowest practical Loss, for example, a DC resistance less than about 0.01 Ohm have. The switching speed is not critical as long as they are less than about 1.0 ms. Obviously you can other applications have other critical specifications on the MEMS switches require.

Now, with respect to 5 a decoupler matching circuit is described. An input connection 97 is connected to a PA (not shown), to a first impedance element 99 and to a second impedance element 101 coupled. The first impedance element 99 and the second impedance element 101 form an input matching circuit for the decoupler 95 , The second impedance element 101 is coupled to ground, and the first impedance element 99 is at the decoupler 95 for transmitting a signal from a PA (not shown) to the decoupler 95 coupled. Both the first and second impedance elements may be ferroelectric adjustable devices as described in US 2002/0175878 (Kyocera Wireless Corp.), November 28, 2002 (Nov. 28, 2002).

An output of the decoupler 95 is connected to a third impedance element 103 coupled to a fourth impedance element 105 is coupled. The third impedance element 103 and the fourth Impedan zelement 105 together form an output matching circuit and an output terminal 107 for the decoupler 95 , The output terminal 107 is coupled to a duplexer (not shown). Both the third and fourth impedance elements may be ferroelectric adjustable devices as described in US 2002/0175878 (Kyocera Wireless Corp.), November 28, 2002 (Nov. 28, 2002).

A decoupler connection 104 is to an impedance element 109 coupled. The impedance element 109 is to another impedance element 115 and a resistance 118 coupled. The impedance elements 109 and 115 and the resistance 118 together comprise a decoupler matching circuit.

It will be understood by those skilled in the art that with reference to 5 described input, output and decoupler matching circuit using "L" adjustment sections are only illustrative. Other topologies could be used for these matching circuits, such as parallel LC circuits, "T" or PI networks, as described in US 2002/0175878 (Kyocera Wireless Corp.), November 28, 2002 (Nov. 28, 2002) ,

Advantageously, each of the impedance elements 99 . 101 . 103 . 105 . 109 and 115 directly on the common, with respect to 1 formed substrate. This reduces the losses associated with attaching separate units to the substrate, reduces cost, and eliminates the need to match components to the 50 ohm industry standard.

Regarding of the PA its characteristic output impedance for CDMA mobile devices typically about 2-4 Ohm near the required maximum output power level. The characteristic impedance of the decoupler is typically about 8-12 ohms. It can Filters are designed with input and output impedances that can assume a wide range of values. Because duplexer and diplexer mainly can consist of filters they are designed to cover a wide range of input and take into account output impedances. Consequently can they are designed to fit any impedance, which is suitable based on the rest of the circuit.

Now, with respect to 6A a preferred LNA matching circuit 117 described. An input connection 118 is at a first inductance 121 and to a capacitor 124 coupled. The capacitor is connected to a second inductance 127 coupled. The second inductance 127 is to a third inductance 130 and to an LNA 133 coupled.

The Matching circuits are used to control the impedance between to adapt to the different parts to a loss of performance in the Signal to avoid or reduce that from one part to the other other is running. For LNA applications there it's another purpose. For LNA applications impedance transforming networks or circuits are primarily used for optimal noise impedance matching between the input signal source and the for elected the LNA Upkeep facility. In firmly tuned circuits the optimum noise impedance matching is achieved at one frequency and is both temperature and component variations dependent. In the approach of a tunable circuit described here can the optimal noise impedance matching can be made adjustable, around many bands or to cover a wider frequency range than it is fixed in the coordinated case possible is. An additional one Advantage of using tunable components is the ability to Compensate for temperature fluctuations.

The introduction of ferroelectric or other tunable devices allows a increased flexibility in the design of LNA's. In the conventional Design using solid components, one usually needed an optimal one Balance noise factor and maximum gain against each other. With tunable devices can be considered cases in which the input matching circuit from the minimum noise factor and the maximum gain like required may differ.

A tunable optimal noise factor will now be discussed with reference to FIG 6B described. 6B is a graph showing the noise factor 120 depending on the frequency 122 shows. Typically, such as in a CDMA wireless communication device, there is a maximum noise factor specified for a given design of LNA 126 , The specified maximum noise figure is as a horizontal dash line 126 shown. A curve that has a typical frequency response 128 of the noise factor is shown as the solid curve. Typically, the LNA and its matching circuits are designed so that the frequency response 128 the noise factor below the maximum noise factor 126 at an operating frequency f ₀ 130 lies. A tunable LNA matching circuit allows the frequency response 128 of the LNA noise factor is tuned over the frequency. The tuned frequency response 132 and 134 The noise factor is represented by two dashed curves of a shape equal to that of the typical frequency response 128 of Noise factor is. By tuning the frequency response of the noise factor at 132 and 134 can be realized that the frequency response of the noise factor below the maximum noise factor 126 at alternative operating frequencies f ₁ 138 and f ₂ 140 lies. It is understood that f ₁ 138 and f ₂ 140 are chosen only as representative frequencies. The frequency response of the noise factor can be tuned over a wide range of frequencies. In addition, it will be understood by those skilled in the art that MEMS switches may be added to the LNA matching circuit to further increase the range of tunability of the frequency response of the noise factor.

Now, referring to 7 describes a preferred antenna matching circuit based on a CDMA mobile device. An antenna 136 is at a first inductance 139 and to a second inductance 142 coupled. The first inductance 139 preferably has an inductance equal to about 8.2 nH. The second inductance 142 preferably has an inductance equal to about 3.9 nH.

The second inductance 142 is to a first capacitor 145 and a second capacitor 148 coupled. The first capacitor 145 preferably has a capacity equal to about 0.5 pF. The second capacitor 148 preferably has a capacity equal to about 2.7 pF. It is understood that other device values and matching circuit topologies may be used.

One side of the second capacitor forms an input and output terminal 149 for the antenna matching circuit for coupling to a duplexer (not shown), a diplexer (not shown), a multiplexer (not shown), or another type of filter (not shown).

The Antenna matching circuitry typically becomes a PI or T circuit with an L-C level, which gives it a higher order adjustment allows. This allows more tolerance for one Impedance variation. Typically, the antenna is in a system be adapted to 50 ohms. However, it may be an ideal impedance for a given one Antenna that deviates from 50 ohms, although 50 ohms is common for test equipment.

To the Example may be one usually used antenna for wireless communication devices have an input impedance of Have 30 ohms. Like already mentioned before, For example, the PA can have an output impedance of about 2 ohms. The decoupler can have an output impedance of about 12.5 ohms. The diplexer and The duplexer filter can be easily attached to a wide range of Adjust impedances.

So is the PA to decoupler adjustment of about 2 ohms at the PA to about 12.5 ohms at the decoupler. The decoupler-to-duplexer adaptation is of about 12.5 ohms to about 12.5 ohms. The duplexer is about 12.5 ohms. So is the duplexer-to-diplexer adaptation is about 12.5 ohms to about 12.5 ohms. The inputs and outputs of the diplexer and the duplexer are at about the same impedance, for example, about 12.5 ohms. The diplexer-to-antenna matching circuit may be an adjustment of about 12.5 ohms on the diplexer to about 30 Ohm to be at the antenna. Each of these matching circuits plus the Diplexers and the duplexer can be ferroelectrically tunable.

As above with respect to 1 It should be understood that a common substrate may have many different combinations of the above-mentioned parts. In a like in 8th embodiment shown has a common substrate 152 a duplexer 154 , a decoupler 156 , a PA 157 and the necessary matching circuits (not shown). In another, like in 9 embodiment shown has a common substrate 160 an antenna matching circuit 163 , a diplexer 166 and a duplexer 169 on. In yet another, as in 10 embodiment shown has a common substrate 172 an antenna matching circuit 175 , a diplexer 178 and two duplexers 181 and 184 on. In yet another, as in 11 embodiment shown has a common substrate 186 an antenna matching circuit 188 , a diplexer 190 , two duplexers 192 and 194 , two decouplers 194 and 196 , two PA's 198 and 200 and two LNA's 202 and 204 on. In another, as in 12 embodiment shown has a common substrate 206 everything above with regard to 11 mentioned, except the antenna matching circuit 188 , In another, as in 13 In the embodiment shown, a common substrate has all of the above with reference to FIG 10 mentioned, except the antenna matching circuit 175 ,

The Integration of a PA module, a decoupler and a duplexer for one CDMA Tx chain eliminates the requirement that any self-contained device adjusted to 50 ohms at the input and output. By enabling a more gradual impedance matching (from about 2 ohms to about 30 ohms in the given example) can be adaptation-induced Reduce losses. Furthermore are the ferroelectric tunable components for a given Power is exposed to a lower RF voltage.

The high frequency voltage reduced for a given power reduces nonlinear distortion, because ferroelectric layers typi sometimes nonlinear. are. Alternatively, a ferroelectric device may be subjected to increased power while maintaining an acceptable level of nonlinear distortion. Thus, designing integrated components that operate at lower input and output impedances allows ferromagnetic devices to be included in applications where higher power levels are required than is possible with ferroelectric devices that are matched to the industry standard 50 ohms.

The Producing a common substrate also reduces losses, that naturally occur if the components involved are housed and customized on one PCB (PCB) are mounted.

By Reducing the losses of the Tx chain can meet the requirements of Tx chain easier fulfilled become. This means that the request for one or more of the involved Parts can be relaxed. For example, the requirements of the PA or another high quality part. A high quality Part is a part with one or more of the following properties: high cost, high performance, high level of difficulty in sticking of characteristics such as gain, output power, stability, ACPR, overtemperature and repeatability from unit to unit.

There For example, the requirements of the PA can be relaxed there are many possible Advantages. For example, the PA may be able to meet the requirements to fulfill, while he consumes less power. This leads to longer talk times or longer Standby times or both. In another example, since the Losses of the Tx chain are reduced, a manufacturer wireless mobile devices to be able to meet the requirements with a PA, the has less stringent tolerances or requirements. The manufacturer of the mobile device may be able to choose a cheaper PA, which means the costs of wireless mobile devices are reduced. These Advantages of reduced Tx chain losses are just an example specified. It will be understood by those skilled in the art reduced losses of the Tx chain give other benefits. It goes without saying Furthermore, these advantages can be used to wireless communication devices to improve other ways than mentioned here.

Claims (16)

Tunable antenna interface unit comprising: a multiplexer ( 154 ) with a ferroelectric tunable device having a capacitor; a substrate mechanically coupled to the capacitor; a control line operably coupled to the ferroelectric tunable device; a control source electrically coupled to the control line, the control source configured to send a control signal to the control line; wherein the ferroelectric tunable device adjusts a resonant frequency of the multiplexer in response to the control signal; a power amplifier ( 157 ); a power amplifier output matching circuit connected between the multiplexer ( 154 ) and the power amplifier ( 157 ) and has a ferroelectric tunable device; the multiplexer ( 154 ), the power amplifier ( 157 ) and the power amplifier output matching circuit are integrated on the substrate; and wherein the power amplifier output matching circuit receives the output self-impedance of the power amplifier ( 157 ) to the input intrinsic impedance of the multiplexer ( 154 ), thereby reducing nonlinear distortion of the ferroelectric device of the matching circuit and enabling operation at higher power levels. Tunable antenna interface unit according to claim 1, wherein the power amplifier output matching circuit for a Signal at about 1900 MHz from an impedance of about 2.5 ohms an impedance of about 10 ohms adapts. Tunable antenna interface unit according to claim 1, further comprising: a decoupler ( 156 ) connected between the power amplifier output matching circuit and the multiplexer ( 154 ) is coupled; a decoupler-to-multiplexer matching circuit connected between the decoupler ( 156 ) and the multiplexer ( 154 ) and has a ferroelectric device; the decoupler ( 156 ) and the decoupler-to-multiplexer matching circuit are integrated on the one substrate; and wherein the decoupler-to-multiplexer matching circuit determines the output self-impedance of the decoupler ( 156 ) to the input intrinsic impedance of the multiplexer ( 154 ), thereby reducing non-linear distortion of the ferroelectric device of the decoupler-to-multiplexer matching circuit and enabling operation at higher power levels. Tunable antenna interface unit according to claim 3, wherein the decoupler-to-multiplexer matching circuit for a signal at about 1900 MHz from an impedance of about 10 ohms at the decoupler output to an impedance of about 10 ohms at the multiplexer input. Tunable antenna interface unit comprising: a first multiplexer ( 192 ) with a ferroelectric tunable device having a capacitor; a substrate mechanically coupled to the capacitor; a control line operably coupled to the ferroelectric tunable device; a control source electrically coupled to the control line, the control source configured to send a control signal to the control line; wherein the ferroelectric tunable device adjusts a resonant frequency of the multiplexer in response to the control signal; a diplexer ( 190 ); a diplexer-to-first multiplexer matching circuit connected between the diplexer ( 190 ) and the first multiplexer ( 192 ) and has a ferroelectric tunable device; the first multiplexer ( 192 ), the diplexer ( 190 ) and the diplexer to first multiplexer matching circuit are integrated on the substrate; and wherein the diplexer-to-first multiplexer matching circuit determines the intrinsic impedance of the diplexer ( 190 ) to the self-impedance of the first multiplexer ( 192 ), thereby reducing non-linear distortion of the ferroelectric device of the diplexer-to-first multiplexer matching circuit and enabling operation at higher power levels. Tunable antenna interface unit according to claim 5, wherein the diplexer ( 190 ) has a tunable ferroelectric device. Tunable antenna interface unit according to claim 6, further comprising a second multiplexer ( 194 ), which is integrated on the one substrate. Tunable antenna interface unit according to claim 7, wherein the first multiplexer ( 192 ) is configured to transmit and receive signals in a PCS band in a duplex mode, and wherein the second multiplexer ( 194 ) is configured to send and receive signals in a cellular band in duplex mode. Tunable antenna interface unit according to claim 7, further comprising: a first power amplifier ( 198 ); a first decoupler ( 194 ); a first power amplifier to first decoupler matching circuit connected between the first power amplifier ( 198 ) and the first decoupler ( 194 ) and has a ferroelectric tunable device; a first decoupler to first multiplexer matching circuit connected between the first decoupler ( 194 ) and the first multiplexer ( 192 ) and has a ferroelectric tunable device; the first power amplifier ( 198 ), the first decoupler ( 194 ), the first power amplifier to first decoupler matching circuit and the first decoupler to first multiplexer matching circuit are integrated on the one substrate; wherein the first power amplifier to first decoupler matching circuit determines the self impedance of the first power amplifier ( 198 ) to the self-impedance of the first decoupler ( 194 ), which reduces nonlinear distortion of the ferroelectric device of the first power amplifier to first decoupler matching circuit and enables operation at higher power levels; and wherein the first decoupler-to-first multiplexer matching circuit determines the self-impedance of the first decoupler ( 194 ) to the self-impedance of the first multiplexer ( 192 ), which reduces non-linear distortion of the ferroelectric device of the first decoupler-to-first multiplexer matching circuit and enables operation at higher power levels. Tunable antenna interface unit according to claim 9, further comprising: a second power amplifier ( 200 ); a second decoupler ( 196 ); a second power amplifier to second decoupler matching circuit connected between the second power amplifier ( 200 ) and the second decoupler ( 196 ) and has a ferroelectric tunable device; a second decoupler-to-second multiplexer matching circuit connected between the second decoupler ( 196 ) and the second multiplexer ( 194 ) and has a ferroelectric tunable device; wherein the second power amplifier ( 200 ), the second decoupler ( 196 ), the second power amplifier-to-second decoupler matching circuit, and the second decoupler-to-second multiplexer matching circuit are integrated on the one substrate; wherein the second power amplifier-to-second decoupler matching circuit determines the self-impedance of the second power amplifier ( 200 ) to the self-impedance of the second decoupler ( 196 ), which reduces nonlinear distortion of the ferroelectric device of the second power amplifier to second decoupler matching circuit and enables operation at higher power levels; and the second decoupler-to-second multiplexer matching circuit determining the self-impedance of the second decoupler ( 196 ) to the self-impedance of the second multiplexer ( 194 ), which reduces non-linear distortion of the ferroelectric device of the second decoupler-to-second multiplexer matching circuit and enables operation at higher power levels. Tunable antenna interface unit according to claim 5, further comprising: an antenna matching circuit ( 175 ) connected to the diplexer ( 178 ) and configured to be coupled to an antenna; wherein the antenna matching circuit ( 175 ) is integrated on the substrate. Tunable antenna interface unit according to claim 11, wherein the diplexer ( 178 ) has a tunable ferroelectric device. Tunable antenna interface unit according to claim 11, wherein the antenna matching circuit comprises a ferroelectric device, and wherein the antenna matching circuit, the self-impedance of the diplexer ( 178 ) adapts to the self-impedance of the antenna, thereby reducing nonlinear distortion of the ferroelectric device of the antenna matching circuit and enabling operation at higher power levels. Tunable antenna interface unit according to claim 13, wherein the antenna matching circuit of an impedance of about 10 ohms at the diplexer to an impedance of about 30 ohms the antenna adapts. Tunable antenna interface unit according to claim 11, further comprising a second multiplexer ( 184 ), which is integrated on the one substrate. Tunable antenna interface unit according to claim 15, wherein the first multiplexer ( 181 ) is configured to send and receive signals in a PCS band in duplex mode, and wherein the second multiplexer ( 184 ) is configured to send and receive signals in a cellular band in duplex mode.