JP4214817B2 - Speaker module and electronic device using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a speaker module used for various acoustic devices and information communication devices, and an electronic device using the same.
[0002]
[Prior art]
A conventional speaker and an electronic device equipped with the speaker will be described with reference to FIGS.
[0003]
FIG. 7 shows a cross-sectional view of a conventional speaker, and FIG. 8 shows a cross-sectional view of a mobile phone which is an electronic device equipped with the conventional speaker.
[0004]
In the speaker of FIG. 7, a magnetized magnet 1 is sandwiched between an upper plate 2 and a yoke 3 to constitute a magnetic circuit 4. A frame 6 is coupled to the yoke 3 of the magnetic circuit 4, and a diaphragm 7 is coupled to the inner peripheral edge of the frame 6.
[0005]
A voice coil 8 is coupled to the diaphragm 7, and the voice coil 8 is inserted into the magnetic gap 5 of the magnetic circuit 4.
[0006]
A lead wire 9 drawn out from the voice coil 8 is connected to a terminal 10 connected to the frame 6 to constitute a speaker 40.
[0007]
FIG. 8 shows a partial cross-sectional view of a mobile phone 64 on which the speaker 40 is mounted. The mobile phone 64 is configured by mounting the speaker 40 on the exterior case 63 together with the display module 62 and the circuit board 31. .
[0008]
Further, the terminal 10 of the speaker 40 and the circuit board 31 are wired.
[0009]
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
[0010]
[Patent Document 1]
JP 2001-176586 A
[Problems to be solved by the invention]
As the production process of the mobile phone 64 described above, the speaker 40 and the circuit board 31 are separately produced separately, and each of these components is transported to the factory where the mobile phone 64 is assembled, and the finished product is assembled. ing. As described above, in the conventional case, a great amount of cost is required in terms of physical distribution, quality control, and production process. The present invention solves the above-described problems, and is intended to reduce the cost.
[0012]
[Means for Solving the Problems]
In order to solve the above problems, the present invention has the following configuration.
[0013]
According to a first aspect of the present invention, there is provided a frame, a diaphragm coupled to the outer peripheral portion of the frame, a vibration component coupled to the diaphragm, and a lead wire drawn from the vibration component. A part of the frame of the speaker is inserted between the layers of the circuit board and integrated with the circuit board to constitute a speaker module.
[0014]
Thus, by integrally configuring the circuit board and the speaker, the distribution process, quality control process, and assembly process of these components can be reduced, and the cost can be reduced.
[0015]
According to a second aspect of the present invention, the end portion of the lead wire is directly connected to the conductive portion of the circuit board.
[0016]
According to this configuration, since the connection between the circuit board and the speaker is performed first, it is possible to reduce the steps for assembling an electronic device such as a mobile phone.
[0017]
According to a third aspect of the present invention, a speaker module is configured by mounting a speaker driving electronic component on a circuit board. With this configuration, the circuit board mounted with the electronic component and the speaker are combined. A speaker module with completed wiring can be obtained.
[0018]
According to a fourth aspect of the present invention, an electronic device is configured by mounting the speaker module according to the third aspect . With this configuration, the assembly process of the electronic device can be reduced.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, about description of each embodiment, the description of the same thing as Embodiment 1 is abbreviate | omitted.
[0020]
(Embodiment 1)
Hereinafter, the first aspect of the present invention will be described with reference to the first embodiment.
[0021]
FIG. 1 is a cross-sectional view of a speaker according to an embodiment of the present invention.
[0022]
The speaker shown in FIG. 1 constitutes a magnetic circuit 24 by sandwiching a magnet 21 between an upper plate 22 and a yoke 23. The yoke 23 of the magnetic circuit 24 is coupled to a ring-shaped frame 26, and the outer periphery of a disk-shaped diaphragm 27 is coupled to the inner peripheral edge of the frame 26. The upper end of the cylindrical voice coil 28 is coupled to the lower surface of the diaphragm 27, and the lower portion of the voice coil 28 is inserted into the magnetic gap 25 of the magnetic circuit 24.
[0023]
A lead wire 29 drawn out from the voice coil 28 is connected to a terminal 30 connected to the frame 26 to constitute a speaker 60.
[0024]
Here, the frame 26 of the speaker 60 is formed integrally with a circuit board 31 disposed inside a mobile phone as an electronic device.
[0025]
Although there are various methods of integration, in this case, a part of the frame 26 is inserted and bonded between the layers of the bakelite which is the circuit board 31.
[0026]
The speaker 60 of this time has been described as an electrodynamic speaker, but is not limited to this embodiment, and may be configured using a speaker of another driving system such as a piezoelectric type.
[0027]
With the configuration shown in FIG. 1, the circuit board 31 and the speaker 60 are integrated in advance, and the distribution process, quality control process, and assembly process after these components are reduced compared to those before integration. And cost reduction can be achieved.
[0028]
(Embodiment 2)
The second aspect of the present invention will be described below with reference to the second embodiment.
[0029]
FIG. 2 shows a cross-sectional view of the speaker according to Embodiment 2 of the present invention.
[0030]
The difference from the first embodiment is that in claim 2, the terminal of the speaker 60 is eliminated, and the lead wire 29 drawn from the voice coil 28 is connected to the pattern portion electrode of the circuit board 31 integrated with the frame 26. This is the point.
[0031]
With this configuration, the number of parts of the terminal can be reduced, and since the wiring between the speaker 60 and the circuit board 31 is performed in advance, the wiring process at the time of assembling the electronic device can be reduced, and further cost reduction can be achieved. .
[0032]
(Embodiment 3)
Hereinafter, other aspects of the present invention will be described using the third embodiment.
[0033]
FIG. 3 shows a cross-sectional view of the speaker according to Embodiment 3 of the present invention.
[0034]
The difference from the first embodiment is that the material of the circuit board 31 and the material of the speaker frame 26 in FIGS. 1 and 2 are made of the same material. With this configuration, the speaker frame 26 is part of the circuit board 31. And a part of the frame 26 is reduced.
[0035]
Specifically, a hole 31a is provided in the circuit board 31, a frame is inserted into the opening edge of the hole 31a, and the outer periphery of the diaphragm 27 is fixed.
[0036]
Also, with respect to the wiring, the terminal of the speaker 60 is eliminated, and the lead wire 29 of the voice coil 28 is directly connected to the electrode portion of the circuit board 31 to greatly reduce the production process.
[0037]
(Embodiment 4)
Hereinafter, with reference to the fourth embodiment will be described the invention described in particular claim 3 of the present invention.
[0038]
4 and 5 show sectional views of Embodiment 4 of the present invention. The circuit board 31 of the speaker module 61 shown in FIG. 4 is connected to an antenna or a microphone of a mobile phone, and drives a receiving unit, a transmitting unit, a detecting unit, a demodulating unit, a modulating unit, and a speaker 60 for processing electrical signals. A signal processing circuit 32 made up of various electronic components such as amplification means is mounted.
[0039]
Further, the circuit board 31 includes a signal processing circuit for driving signal processing means and video signal processing means for a liquid crystal panel in the case of a mobile phone having a display module such as liquid crystal or a camera function. The speaker module 61 is mounted on an outer case 63 together with a display module 62 such as a liquid crystal as shown in FIG.
[0040]
(Embodiment 5)
Hereinafter, the invention according to the fourth aspect of the present invention will be described with reference to the fifth embodiment.
[0041]
FIG. 6 shows a cross-sectional view of an automobile according to an embodiment of the present invention.
[0042]
FIG. 6 shows an automobile 47 on which the speaker module 61 shown in FIG. 5 is mounted.
[0043]
This speaker module 61 is used for a navigation system 65 mounted on an automobile 47, and a circuit board 31 including a circuit 32 for implementing video signal processing means for displaying a map of navigation is provided to a driver. An audio signal processing circuit 32A for carrying out an announcement by voice and an amplifier circuit 32B for driving a speaker are formed.
[0044]
By incorporating the speaker module 61 into a part of the automobile 47, the navigation system 65 can be configured together with the navigation map display means, the position detection means, etc. Can be reduced.
[0045]
【The invention's effect】
As described above, according to the present invention, a speaker module is configured by inserting a part of a speaker frame and integrating it with a circuit board.
[0046]
With this configuration, it is possible to reduce the logistics process, quality control process, and assembly process of the component parts, thereby reducing costs.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a speaker module according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view of a speaker module according to Embodiment 2 of the present invention. FIG. 4 is a cross-sectional view of a speaker module according to Embodiment 4 of the present invention. FIG. 5 is a cross-sectional view of electronic equipment according to Embodiment 4 of the present invention. Fig. 7 Cross-sectional view of a conventional speaker [Fig. 8] Cross-sectional view of a conventional electronic device [Explanation of symbols]
21 Magnet 22 Upper plate 23 Yoke 24 Magnetic circuit 25 Magnetic gap 26 Frame 27 Diaphragm 28 Voice coil 29 Lead wire 30 Terminal 31 Circuit board 32 Electronic component 60 Speaker

Claims (4)

  A speaker, a circuit board integrated with the speaker, a frame, a diaphragm coupled to the frame, a vibration component coupled to the diaphragm, and a lead wire drawn from the vibration component A speaker module in which a part of the frame of the speaker is inserted between the layers of the circuit board and integrated with the circuit board.   2. The speaker module according to claim 1, wherein an end portion of the lead wire is directly connected to a conductive portion of the circuit board. Speaker module according to claim 1 or claim 2 equipped with a loudspeaker drive electronic components on the circuit board. The electronic device carrying the speaker module as described in any one of Claims 1-3 .

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