JP4209823B2 - Method and apparatus for designing substrate support block - Google Patents

Description

  The present invention relates to a support block design method, a design apparatus, and a design program, and more particularly to a support block design method, a design apparatus, and a design program for receiving a substrate in an electronic component mounting process.

  In recent years, an electronic circuit formed by mounting a plurality of electronic components on a substrate has been required to be highly integrated along with downsizing of an electronic device incorporating the electronic circuit. Under such circumstances, in order to effectively use the surface area of the substrate, so-called double-sided mounting is performed in which electronic components are mounted on both sides of the substrate. In the above-mentioned double-sided mounting process, in order to mount an electronic component on the other side with the electronic component already mounted on one side of the board, the board is supported horizontally with the mounted surface as the lower side, and the position of the board is fixed. It is necessary to perform the mounting work. At this time, since it is necessary to support the board without damaging the mounted parts, conventionally, the board is supported by applying a support pin at a position avoiding the electronic parts on the mounted surface which is the lower surface, or the electronic parts The entire bottom surface of the substrate is supported by a flexible material that does not damage the substrate.

However, in the above method, the substrate is easily warped, and due to the warpage of the substrate, for example, in the solder printing process, there is a problem that a gap is generated between the substrate and the mask and the print quality is deteriorated. It was. As a method for solving this problem, there is a method of supporting the entire bottom surface of the substrate while avoiding the mounted electronic component by a block (hereinafter referred to as a support block) in which a recess is formed at a position corresponding to the position of the mounted electronic component. . By supporting the substrate with the support block, the mounting operation can be performed while supporting the substrate more stably, and the mounting quality can be improved. For example, in Patent Document 1, in order to design this support block, the position and size data of the component on the board is obtained from NC (Numerical Control) data for an electronic component mounting machine, and the concave shape is obtained by calculation. A method for creating data for processing support blocks is disclosed.
JP-A-9-285742

  However, as described above, in recent years, electronic components are often mounted at high density on a substrate. Therefore, the method for creating support block processing data disclosed in Patent Document 1 is simply integrated on the substrate. As a result of designing the position corresponding to the electronic component as a recess, data for processing a support block having a shape that supports almost only the outer peripheral edge of the substrate is created. FIG. 16 is a diagram showing an example of the shape of the support block that supports only the outer peripheral end portion described above. Whether or not the support block as described above (FIG. 16) actually has sufficient support force is not known until the support block is actually created based on the processing data and tested. It was. As a result, the support block was actually created, but when the support force is insufficient, for example, by an expert in the support block creation, the processing data is adjusted again depending on the experience, or the back of the electronic component is A support block having sufficient support force has been remade by adding a suction nozzle that directly adsorbs. For this reason, there have been problems such as waste of processing costs due to the creation of poor quality support blocks and an increase in design time due to rework of the design.

  Therefore, the object of the present invention is to support the support force after completion of the support block by introducing a support force simulation process in the support block design process, and by editing the design data based on the verification result, To provide a method, an apparatus, and a program for designing a high-quality support block capable of sufficiently obtaining a support force.

  In order to achieve the above object, according to the present invention, the electronic component mounted on the board is supported based on the shape data of the component-mounted board in a state where the electronic component is mounted on at least the first surface of the board. The shape data of the support block having the concave portion to be created is created as initial shape data, and the created initial shape data is edited in accordance with a user instruction. Subsequently, based on the edited shape data, which is the shape data of the support block obtained as a result of editing, the state where the substrate is supported by the support block is simulated, and the edited shape is confirmed to satisfy the desired condition by the simulation. Output data for support block design based on the data.

  According to the present invention, the support force can be verified in advance by designing the support block so that the suction support force of the completed support block can be simulated when the support block is designed. it can.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, this invention is not limited by this Example.

  FIG. 1 is a diagram illustrating a hardware configuration of a support block design apparatus according to an embodiment of the present invention. The support block design apparatus can be typically realized by a combination of a general-purpose computer such as a personal computer as shown in FIG. 1 and software (support block design program). The support block design device 10 includes a CPU 1, a main storage unit 2, a secondary storage unit 3, a display unit 4, an operation unit 5, and an input / output unit 6, which are connected to each other via a bus 7. The main storage unit 2 is realized by a memory medium such as a ROM or a RAM. The main storage unit 2 is loaded with a support block design program to be executed by the CPU 1. The support block design program may be stored in the main storage unit 2 in a form stored in advance in the ROM, or may be read from the secondary storage unit 3 into the main storage unit 2, and is not illustrated. It may be supplied to the main storage unit 2 from the outside of the support block design apparatus 10 through a communication line or an external storage medium. The CPU 1 creates and edits support block design data by executing the support block design program. The secondary storage unit 3 is realized by a storage medium such as a hard disk. The secondary storage unit 3 stores the support block design program and various data. The display unit 4 is realized by a device such as a display. The operation unit 5 is realized by an operation device such as a keyboard or a mouse. The input / output unit 6 is realized by a disk drive, a LAN terminal, a USB terminal, or the like.

  FIG. 2 is a functional block diagram showing a functional configuration of the support block design apparatus according to the present embodiment realized on a personal computer. In FIG. 2, the support block design apparatus 10 includes a board design data input unit 11, an initial shape creation unit 12, a shape editing unit 13, a support force state analysis unit 14, and a design data output unit 15. Note that any or all of the board design data input unit 11, the initial shape creation unit 12, the shape editing unit 13, the support force state analysis unit 14, and the design data output unit 15 may be realized by dedicated hardware. Absent.

  The board design data input unit 11 acquires board design data 16 through the input / output unit 6. The board design data input unit 11 creates mounting board shape data based on the obtained board design data 16 and outputs the mounting board shape data to the initial shape creation unit 12. Here, the board design data 16 is data having the shape of the board and the electronic components and the arrangement information of the electronic parts on the board. The mounting board shape data is data indicating the shape of the board in a state where electronic components are mounted on the surface. In the present embodiment, the board design data input unit 11 generates the mounting board shape data from the given board design data 16. However, when the mounting board shape data is given to the board design data input unit 11, The given mounting board shape data may be output to the initial shape creation unit 12 as it is.

  Based on the mounting board shape data output from the board design data input unit 11, the initial shape creation unit 12 has the shape data of the support block having a shape in which the concave portions are arranged so as to support the board while avoiding the mounted electronic components. (Hereinafter referred to as initial shape data) is automatically created.

  The shape editing unit 13 enables the user to edit the initial shape data of the support block created by the initial shape creating unit 12. The shape editing unit 13 displays the initial shape data on the display unit 4 and accepts a user editing operation via the operation unit 5. The edited data is stored in the main storage unit 2 or the like as edited shape data.

  Based on the edited shape data edited by the shape editing unit 13, the support force state analysis unit 14 analyzes the support force and the suction force when the support block actually receives the substrate by simulation. Further, the result of the simulation process is displayed on the display unit 4.

  The design data output unit 15 outputs the edited shape data to an external storage medium such as a magnetic disk via the input / output unit 6.

  In the present invention, in the configuration as described above, the substrate design data 16 is read into the support block design apparatus 10, and once the initial shape data of the support block is automatically created, the user performs a simulation process on the data. The design data is edited to the optimum design data while confirming the attractive force using the, and finally the edited design data is output.

  The detailed operation of the support block design process performed by the support block design apparatus 10 according to the present invention will be described below with reference to FIGS. FIG. 3 is a schematic view of the substrate 20 to be received by the support block designed in this embodiment. In FIG. 3, a plurality of electronic components 21 having different dimensions are mounted on one side of a substrate 20. Hereinafter, the present embodiment will be described on the assumption that a support block for receiving the substrate 20 is designed in a solder printing process on the back surface (the surface on which the electronic component is not yet mounted) of the substrate 20.

  FIG. 4 is a flowchart showing a support block design process according to this embodiment. In FIG. 4, first, the board design data input unit 11 obtains the board design data 16 of the board 20 created by a CAD system and stored in an external storage medium, for example, via a disk drive (input / output unit 6). To do. Next, the board design data input unit 11 calculates a board shape on which electronic components have been mounted from the board design data 16, and creates mounted board shape data. Then, the board design data input unit 11 outputs the mounted board shape data to the initial shape creation unit 12 (step S1).

  Upon receiving the mounting board shape data, the initial shape creating unit 12 creates an initial shape of the support block based on the mounting board shape data (step S2). FIG. 5 is a diagram illustrating an example of the shape of the support block 30 created by the initial shape creation unit 12 in step S2. The process of step S2 will be described more specifically with reference to FIGS. 3 and 5. First, the initial shape creation unit 12 first determines the shape of the substrate 20 itself in the mounting substrate shape data of the substrate 20, the substrate 20 and the like. The shape of each electronic component 21 to be mounted on and the arrangement position thereof are analyzed. Next, the initial shape creation unit 12 calculates the position and size of the recess 31 based on the position and shape of each electronic component 21. At this time, the dimension of each recess 31 in FIG. 5 is set somewhat larger than the outer dimension of the electronic component 21 with a certain margin in consideration of the positioning accuracy of the entire substrate 20. In the present embodiment, it is assumed that the dimensions of the recess 31 are calculated with a margin of 0.5 mm for every electronic component 21. When the calculation of the position and dimensions of the recess 31 is completed as described above, the initial shape creation unit 12 creates shape data (see FIG. 5) of the support block 30 in which the recess 31 is formed. Then, the initial shape creation unit 12 outputs the shape data to the shape editing unit 13 as initial shape data. Thus, the initial shape data creation process of the support block in step S2 is completed.

  As for the margin described above, a different margin may be automatically set according to the type of the electronic component 21 in consideration of variations such as positional deviation for each electronic component 21. For example, an aluminum electrolytic capacitor 211 as shown in FIG. 6 generally has a larger variation in width and height due to tilt than an IC chip having a planar shape. Therefore, it is necessary to provide a larger margin 23 for the recess 31 corresponding to such an aluminum electrolytic capacitor 211 than for the recess 31 corresponding to another type of electronic component. Thus, by automatically setting different margins according to the type of the electronic component 21, the size of the recess 31 can be set optimally.

  Next, the shape editing unit 13 that has received the initial shape data from the initial shape creating unit 12 performs an initial shape data editing process based on an editing operation of the initial shape data by the user (step S3). The contents of the editing may be (A) creation of a substrate suction hole, (B) creation of a suction nozzle, (C) creation of piping, and the like. Here, the hole for substrate adsorption | suction is a hole formed in the support surface of a support block. In this method, the substrate is sucked through the suction hole to more securely fix the substrate to the support block. The suction nozzle is a nozzle that directly sucks a part of the surface of the electronic component mounted on the substrate surface as an auxiliary to the suction force of the substrate surface. The pipe is a pipe provided in the support block in order to ensure the substrate suction hole and the air flow path of the suction nozzle. This is for increasing the suction force by, for example, transmitting a vacuum pressure by communicating the base suction hole and the suction nozzle. Hereinafter, an example of the editing work by the user according to the above (A) to (C) will be described.

  First, the shape editing unit 13 displays a completed image (see FIG. 5) of the support block based on the initial shape data on the display unit 4 such as a display, for example. Then, an editing operation from the user is accepted. The user performs various editing operations as described below on the displayed completed image using the operation unit 5 such as a mouse or a keyboard.

If the completed image is displayed on the display unit 4, the user creates a substrate suction hole (edited content (A) above). FIG. 7 is a diagram illustrating an example of a support block after the user has created the substrate suction hole 32 as a result of this work. At this time, the user creates the substrate suction hole 32 from the restrictions such as the strength and suction force of each part of the generated support block, taking into account the following constraint conditions, for example.
(Restriction C1) The substrate support block 30 is separated from the inner wall of each recess 31 by a certain distance or more.
(Constraint C2) Each of the substrate suction holes 32 is separated by a certain distance or more.
(Restriction condition C3) The area of the substrate suction hole 32 is a certain amount or more.
For example, if the hole is too small for substrate suction, the above constraints are difficult to process, so the effect cannot be expected for the processing cost to increase, so it should not be created from the viewpoint of cost reduction. It is based on. That is, by creating the substrate suction holes 32 based on the above-described constraint conditions, it is possible to suppress the creation of substrate suction holes with poor cost performance, and to reduce the cost for the support block.

  In this embodiment, the user creates the substrate suction hole 32 while taking the above-described constraint conditions into consideration. However, the shape editing unit 13 determines the constraint condition and automatically sets the substrate suction hole 32. You may create it. The initial shape creation unit 12 may automatically create the substrate suction hole 32 in step S2 so as to be included in the initial shape data.

  When the creation of the substrate suction hole 32 is completed, the user then creates a suction nozzle (edited content in (B) above). FIG. 8 is a diagram illustrating an example of a suction nozzle 33 that sucks the back surface of a QFP (Quad Flat Package) 212 as an auxiliary to the suction force of the substrate surface. The determination of the position of the suction nozzle 33 may be determined by the user's judgment, or may be automatically determined by the shape editing unit 13 (or the initial shape creation unit 12). For example, when it is determined that a sufficient suction force cannot be obtained from the portion other than the recess 31 of the support block 30 and the position and area of the substrate suction hole 32 in FIG. 7, the shape is determined based on the shape data of the electronic component. It is also conceivable that the editing unit 13 automatically determines the position of the suction nozzle 33.

  When the creation of the suction nozzle described above is completed, the user then creates a pipe (edited content (C) above). FIG. 9 is a diagram illustrating an example of the support block 30 to which a pipe 34 for securing a substrate suction hole 32 and an air flow path in the suction nozzle is added. The user creates a pipe 34 below the support block 30 so that the substrate suction holes 32 communicate with each other. It is also conceivable that the shape editing unit 13 (or the initial shape creation unit 12) automatically creates the piping 34 based on the positions of the substrate suction holes 32 and the suction nozzles. Thus, the editing work related to the editing contents (A) to (C) is completed.

  In addition to the above-described editing work, the user may further perform other editing work in consideration of the convenience of the subsequent support block processing work. For example, in the initial shape data, when a plurality of recesses are adjacent to each other, editing contents such as combining the portions into one recess can be considered. 10 and 11 are diagrams showing examples of the editing contents. FIG. 10 is a diagram illustrating a state in which the concave portions 31 of the support block are adjacent to each other. In FIG. 10, the concave portions 31 are adjacent to each other, and the area of the portion 37 in contact with the substrate between them is extremely small. In such a case, if an attempt is made to process the support block in accordance with the shape of each recess, the processing work is troublesome and cost is also required. Therefore, as shown in FIG. 11, an editing operation of deleting the portion 37 between the recesses 31 of the support block adjacent in FIG. For the same reason, editing work such as forming concave portions in the portions of the support block 30 corresponding to the substrate region where chip parts and the like are densely packed can be considered. In addition, it is possible to make the shape edit part 13 (or initial shape creation part 12) perform automatically also about the said other edit work. For example, it can be considered that the shape editing unit 13 determines whether or not to leave the portion 37 by determining whether or not the area of the portion 37 between the concave portions 31 exceeds a predetermined value.

  Then, when the various editing operations as described above by the user (or the shape editing unit 13) are finished, the editing process in step S3 is finished.

  When the editing process is completed, the supporting force state analysis unit 14 then simulates the state in which the substrate 20 is supported by the support block 30 based on the edited shape data edited by the shape editing unit 13, The adsorption supporting force distribution and the strain amount distribution are analyzed (step S4). As an analysis method for each of the above distributions, when the surface of the substrate 20 on which the electronic component is not yet mounted is subjected to an arbitrary pressure, the stress caused by the portion other than the recess 31 that supports the substrate surface, and the substrate Considering the downward suction force due to adsorption and the strain stress of the substrate itself, it can be obtained by the finite element method.

  Next, the support force state analysis unit 14 determines whether or not the support force is sufficiently obtained as a result of the analysis (step S5). This determination is made based on, for example, whether or not there is a portion of the suction support force distribution on the entire surface of the substrate where the suction support force is a predetermined value or less, or whether the strain amount of the substrate does not exceed an allowable value. If the result of determination in step S <b> 5 is that the support force is sufficient (YES in step S <b> 5), the support force state analysis unit 14 displays that fact on the display unit 4 and simultaneously notifies the shape editing unit 13. Then, the shape editing unit 13 outputs the edited shape data as the editing result to the design data output unit 15. On the other hand, as a result of the determination in step S5, for example, when there is a portion where a sufficient support force is not obtained (NO in step S5), the support force state analysis unit 14 uses insufficient support force. The display unit 4 displays a notification for prompting the user to edit and an analysis result. FIG. 12 is a diagram illustrating an example of an analysis result displayed on the display unit 4. The analysis result in FIG. 12 shows the suction support force distribution on the entire surface of the substrate obtained by the finite element method. FIG. 12 shows that the adsorption support force of the substrate is small (that is, a portion where sufficient support force is not obtained) in the portion 29 on the substrate 20. And a user confirms the analysis result (refer FIG. 12) displayed on the display part 4, and performs the edit operation | work in step S3 again. For example, in the case of the analysis result as shown in FIG. 12 described above, a result that the adsorption support force of the substrate 20 is small in the portion 29 on the substrate 20 is obtained. Therefore, the user returns to the editing operation in step S3 and performs an editing operation such as adding a substrate suction hole 35 to the substrate support block 30. FIG. 13 is a diagram illustrating the support block 30 after the user has added the substrate suction hole 35 based on the analysis result. Then, the support force state analysis unit 14 analyzes the substrate support force and the like again based on the edited shape data after reediting (see FIG. 13) (step S4), and determines the result (step S5). And the support block design apparatus 10 repeats the process from step S3 to step S5 until the support block which has sufficient support force can be designed.

  If a support block having sufficient support force can be designed as a result of the editing operation and the analysis process, the design data output unit 15 performs a design data output process (step S6). In this process, for example, the design data output unit 15 may output the edited shape data after the editing work to an external storage medium such as a magnetic disk. At this time, the design data output unit 15 outputs the format of the output data in the format of the design drawing or the data 17 corresponding to the design drawing or the NC data 18 for processing according to the selection of the user. Thus, the design data output process according to step S6 ends. And the support block design process which concerns on this embodiment is complete | finished.

  As described above, in the present embodiment, in the process of designing the support block, by simulating the suction support force after the completion of the support block based on the design data edited by the user, the user depends on the editing contents performed by the user. Pre-verification such as adsorption power can be performed. If the user is not satisfied with the verification result, the user can design the optimum support block by editing the design data again and repeating the simulation. As a result, a high-quality support block having a sufficient support force can be created. In addition, after the user edits the design data, the analysis results such as support force by simulation based on the edited data can be confirmed, thus preventing variation in the quality of the support block due to the ability difference between designers be able to.

  In addition, as a method of acquiring the board design data 16 in the above-described step S1, for example, an electronic component is mounted on a board such as an IDF (Intermediate Data Format) format output from a CAD system for board design. It is conceivable to obtain it as three-dimensional shape data. In addition, data indicating the mounting position of the electronic component 21 on the surface of the board 20 and the shape of the main body of the board 20 is acquired as CAD data for board design, and the component shape of each electronic component 21 is a field mounted CAM (Computer Aided Manufacturing). It is also conceivable to acquire the data separately as component data. In this case, the board design data input unit 11 creates mounting board shape data by combining the CAD data and the component data.

  Further, the board design data input unit 11 acquires board design data 16 that combines a plurality of board types, and creates mounting board shape data assuming a virtual board that is a combination of these. Good. FIG. 14 is a diagram illustrating an image of a combination in the case where a plurality of substrates are combined to form a virtually single substrate. In FIG. 14, when it is assumed that the mounting position of the electronic component 41 is different from the substrate 20 for the substrate 40 similar to the substrate 20, it is assumed that all the components of both the substrate 20 and 40 are mounted on one substrate. The result is a virtual substrate 50. In this case, the board design data input unit 11 may read the board design data 16 of the boards 20 and 40 and output the mounting board shape data of the virtual board 50, which is a combination of both, to the initial shape creation unit 12. Thereby, the processing data of the support block that can be commonly used for both the substrate 20 and the substrate 40 can be created and edited. As a result, it is possible to suppress the processing cost of the support block because it is essentially only necessary to create one support block instead of creating two support blocks. It is also conceivable that the mounting board shape data of the virtual board 50 as described above is prepared in advance, and the board design data input unit 11 acquires the mounting board shape data of the virtual board 50. In this case, the acquired mounting board shape data of the virtual board 50 may be output to the initial shape creating unit 12 as it is.

  In step S5 described above, the design data output unit 15 divides the shape data of the support block 30 into a countersink portion 301 in which the concave portion 31 is formed and a base portion 302 including piping, and outputs the data. May be. FIG. 15 is a view of the support block 30 in which a recessed portion 301 that avoids a mounted electronic component that supports the board surface and a base portion 302 that includes piping for securing an air flow path are divided. In this way, by dividing the shape data of the support block 30 into the shape data of the countersink part 301 and the shape data of the base part 302 and outputting them, the countersink part 301 and the base part 302 are processed in parallel. Can do. As a result, the support block 30 can be manufactured in a short time.

  The substrate support block design method, design apparatus, and design program according to the present invention can be used for the purpose of designing a support block having a stable quality and a sufficient support adsorbing force, which can be verified in advance when designing a substrate support block. Useful.

The figure which shows the hardware constitutions of the design apparatus which concerns on embodiment of this invention Functional block diagram showing the functional configuration of the support block design apparatus according to the present embodiment realized on a personal computer Schematic diagram of substrate to be processed in this example The flowchart which shows the support block design process which concerns on this embodiment The figure which shows an example of the shape of the support block which an initial shape creation part produces The figure which showed an example of the crevice of the support block which provided the margin in consideration of the variation in the width and the height direction by the inclination at the time of electronic parts loading The figure which shows an example of the support block which created the hole for substrate adsorption by the user's editing work The figure which showed the suction nozzle which sucks the back of an electronic component as assistance of the suction power of a substrate side The figure which shows an example of the support block which added piping for securing the substrate suction hole and the suction nozzle flow path The figure which shows a mode that the recessed part of a support block adjoins The figure which shows that the part between the recessed parts of the support block which was adjacent was deleted, and it was set as the recessed part collectively. The figure which shows an example of the analysis result by the supporting force state analysis part displayed on a display part The figure which shows the support block which added the hole for substrate adsorption by the re-editing work after the analysis The figure which shows the image of the combination in the case of combining several board | substrates and making it virtually one board | substrate. The figure which divided | segmented the base part containing piping for securing the recessed part of the recessed part which avoids the mounted electronic component which supports a board surface among the support blocks, and the air flow path. The figure which shows an example of the shape of the support block created with the conventional support block design method

Explanation of symbols

1 CPU
2 main storage unit 3 secondary storage unit 4 display unit 5 operation unit 6 input / output unit 7 bus 10 support block design device 11 substrate design data input unit 12 initial shape creation unit 13 shape editing unit 14 support force state analysis unit 15 design data Output unit 16 Substrate design data 17 Design drawing or similar data 18 Processing NC data 20, 40 Substrate 21, 41 Electronic component 23 Margin 29 Part with small substrate adsorption force 30 Support block 31 Recess 32 Substrate adsorption hole 33 Adsorption nozzle 34 Piping 35 Substrate suction hole 37 Portion between recesses 50 Virtual substrate 211 Capacitor 212 QFP
301 Counterbore part 302 Base part

Claims (8)

In the process of mounting electronic components on both surfaces of a planar substrate, for the substrate adsorption support in mounting the electronic component on the second surface opposite to the already first surface on which an electronic component is mounted A method of designing a support block, comprising:
A substrate shape acquisition step of acquiring shape data of a component-mounted substrate in a state where an electronic component is mounted on at least a first surface of the substrate;
An initial shape creation step of creating, as initial shape data, shape data of a support block having a recess corresponding to an electronic component mounted on the board, based on the shape data of the component-mounted board acquired in the board shape acquisition step When,
A shape editing step of editing the initial shape data created in the initial shape creation step according to a user instruction;
Based on the edited shape data, which is the shape data of the support block obtained as a result of editing in the shape editing step, the suction support force distribution and the strain distribution on the entire surface of the substrate under the support block are simulated. Analysis process,
Whether the suction supporting force of the suction supporting force of the entire substrate surface that is analyzed by the analysis step is present portion is less than a predetermined value, and determines whether the distortion quantity of the substrate is not an allowable value exceeded, As a result of the determination, if the suction support force is equal to or less than a predetermined value, or if the amount of distortion exceeds an allowable value, a notification that the user is prompted to edit again and the analysis of the suction support force distribution on the entire substrate surface or A determination step of displaying the amount of distortion of the substrate as a determination result;
As a result of the determination in the determination step, when the suction support force is less than the predetermined value or the distortion amount exceeds the allowable value, the user edits the edited shape data again based on the analysis result, and is obtained. The editing step, the analysis step, and the determination step are repeated until the result of determination by the simulation of the analysis step based on the re-edited shape data indicates that the suction support force is equal to or greater than a predetermined value and the distortion amount exceeds an allowable value. Process,
As a result of the determination in the determination step, an output step for outputting data for designing the support block based on the edit shape data in which the suction support force is equal to or greater than a predetermined value and the distortion amount is confirmed to exceed the allowable value. And a substrate support block design method.   In the initial shape creation step, after determining the shape of the recess, a substrate suction hole for sucking the substrate is created according to the shape of the portion other than the determined recess. 2. The substrate support block design method according to 1.   In the initial shape creating step, after determining the shape of the concave portion, the shape of an arbitrary portion other than the concave portion is defined as a concave portion according to the area of an arbitrary portion other than the determined concave portion. Item 2. A substrate support block design method according to Item 1.   In the initial shape creation step, the position of the suction nozzle for sucking the back surface of the electronic component is determined based on the portion other than the recess and the position and area of the substrate suction hole. Item 2. A substrate support block design method according to Item 1.   In the initial shape creation step, a pipe for securing a substrate suction hole for sucking the substrate or a suction nozzle air flow path for sucking the back surface of the electronic component is created in the support block. The method for designing a substrate support block according to claim 1, wherein:   In the output step, the edited shape data edited in the shape editing step, the data of the countersink portion having the concave portion, and the substrate suction hole for sucking the substrate or the back surface of the electronic component are sucked 2. The substrate support block designing method according to claim 1, wherein the substrate support block design method outputs the data separately to the data of the base portion having a pipe for securing the air flow path of the suction nozzle.   2. The substrate according to claim 1, wherein in the substrate shape acquisition step, shape data of one virtual substrate on which all the electronic components are mounted is acquired for a plurality of substrates having different arrangements of electronic components. Support block design method. In the process of mounting electronic components on both surfaces of a planar substrate, for the substrate adsorption support in mounting the electronic component on the second surface opposite to the already first surface on which an electronic component is mounted An apparatus for designing a support block,
A board shape acquisition unit that acquires shape data of a component-mounted board in a state where an electronic component is mounted on at least a first surface of the board;
An initial shape creation unit that creates shape data of a support block having a recess corresponding to an electronic component mounted on the board as initial shape data based on the shape data of the component-mounted board acquired by the board shape acquisition unit. When,
A shape editing unit for editing the initial shape data created by the initial shape creating unit according to a user instruction;
Based on the edited shape data, which is the shape data of the support block obtained as a result of editing by the shape editing unit, the adsorption support force distribution and strain amount distribution on the entire surface of the substrate in the state where the substrate is supported by the support block are simulated. whether the suction supporting force of the suction supporting force of the simulated entire substrate exists portion is less than a predetermined value, and determines whether the distortion quantity of the substrate is not an allowable value have exceeded, this decision As a result, if the suction support force is less than the predetermined value or if the amount of distortion exceeds the allowable value, a notification that prompts the user to edit again and the analysis of the suction support force distribution on the entire surface of the substrate or analysis of the substrate An analysis unit that displays the amount of distortion as a determination result;
As a result of determination by the analysis unit, an output unit that outputs support block design data based on edit shape data in which the suction support force is greater than or equal to a predetermined value and the distortion amount is confirmed to exceed an allowable value; With
As a result of the determination by the analysis unit, the user edits the edited shape data again when the suction support force is less than a predetermined value or the distortion amount exceeds the allowable value, and the determination by the analysis unit is performed. As a result, the substrate support block design apparatus repeats editing, analysis, and determination until the suction support force is equal to or greater than a predetermined value and the distortion amount exceeds an allowable value.

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