JP4201776B2 - Ultrasonic bonding head and apparatus using the same - Google Patents

Description

  The present invention provides an ultrasonic bonding head used for ultrasonic bonding by applying ultrasonic vibration to a bonding portion while pressing, pressing and heating an electrode of a chip component such as an electronic component to an electrode of a workpiece such as a substrate. And an apparatus using the same.

When bonding an electrode of a chip component such as an electronic component to an electrode of a substrate, ultrasonic vibration is applied to the bonding portion while pressing the electrode of the chip component against the electrode of the substrate. The ultrasonic bonding head used for the ultrasonic bonding includes an ultrasonic generator that generates ultrasonic vibration, a horn that transmits the generated ultrasonic vibration, and a crimping member that is an adsorption member that adsorbs and holds a chip component at the tip. It consists of and. This crimper is detachably fastened to the horn by a screw that passes through a through hole that goes straight in the length direction of the horn at a position where the amplitude of the standing wave vibration of the horn is maximized (see, for example, Patent Document 1). ).
JP 2001-35888 A

  However, the conventional ultrasonic bonding head has the following problems.

  That is, when the crimper is directly fastened to the horn with a screw, there is a problem that ultrasonic vibration is not properly transmitted to the crimper through the horn due to the adjustment of torque applied when the screw is screwed into the through hole. . That is, if the applied torque is weak, the horn and the crimper are not in close contact with each other, so that ultrasonic vibration is not properly transmitted. Moreover, even if the applied torque is too strong, the vibration of the crimper is hindered.

  In addition, in the conventional device, the crimper is fastened to the horn with a screw at the position where the ultrasonic vibration is maximized. There is a problem such as.

  The present invention has been made in view of such circumstances, and it is possible to inexpensively configure a suction member that can be attached to and detached from a horn, and to apply ultrasonic vibration to a chip component stably and accurately. It is a main object of the present invention to provide an ultrasonic bonding head and an apparatus using the same.

  The present invention has the following configuration in order to achieve the above object.

The first invention is an ultrasonic bonding head for bonding by applying ultrasonic vibration to both electrodes while pressing the electrode of the chip component against the electrode of the workpiece,
Ultrasonic generation means for generating ultrasonic vibration;
A horn having a recess formed on the lower surface side at a position where the amplitude of the transmitted ultrasonic vibration is maximized, while transmitting the ultrasonic vibration generated from the ultrasonic generating means,
When housed in the concave portion of the horn, it is stretched forward and backward in the transmission direction of the ultrasonic vibration across the suction portion of the chip part, and is formed at a position on the deeper side of the horn recess than the tip of the suction portion. A suction member having a pair of side portions;
A holding member that acts on the side of the adsorption member and holds the adsorption member in close contact with the bottom surface of the recess;
A fastening member that passes through the holding member and reaches the bottom surface of the horn recess to fasten the adsorption member to the horn recess ;
Position to penetrate the fastening member to the holding member, characterized in that the vibration amplitude of the horn which vibrates by the ultrasonic vibration is the position becomes zero.

  (Operation and Effect) According to the first invention, the ultrasonic wave generating means generates ultrasonic vibration. The horn transmits the ultrasonic vibration generated from the ultrasonic wave generation means, and has a recess formed on the lower surface side at a position where the amplitude of the transmitted ultrasonic vibration becomes maximum. When the suction member is housed in the concave portion of the horn, the suction member is stretched forward and backward in the transmission direction of the ultrasonic vibration across the suction portion of the chip component, and at a position on the deeper side of the horn concave portion than the tip of the suction portion. It has a pair of formed sides. The holding member acts on the side portion of the adsorption member and holds the adsorption member in close contact with the bottom surface of the recess. The fastening member passes through the holding member and reaches the bottom surface of the horn recess, thereby fastening the adsorption member to the horn recess.

  According to this configuration, the suction member is also indirectly attached to the bottom surface of the concave portion of the horn by being housed in the concave portion of the horn with the side portion of the suction member being sandwiched between the holding members and fastening the holding member to the bottom surface of the horn. It is fastened in close contact. That is, since the suction member is not directly fastened to the horn by the fastening member, the ultrasonic vibration from the horn can be stably transmitted to the suction member without fine torque adjustment. Further, since the configuration is simple, it can be realized at a low cost.

Furthermore, since the fastening member is not positioned on the adsorption member having the maximum vibration amplitude, loosening of the fastening member due to the influence of ultrasonic vibration, metal fatigue, and the like are suppressed. That is, by fastening the holding member at a position where the vibration amplitude of the horn becomes zero, it is possible to suppress fastening loosening due to ultrasonic vibration, metal fatigue of the fastening member, etc. Can be attached and maintained.

  According to a second invention, in the first invention, the suction member has a convex portion in which the suction portion of the chip component protrudes from the horn, and tapers from the base portion of the convex portion toward the lower end portion of the side portion. It is preferable that it is formed in a shape.

  (Operation / Effect) According to the second invention, the area of the adsorbing member in close contact with the bottom surface of the concave portion of the horn and the area in which the side portion of the adsorbing member and the holding member are in close contact with each other are enlarged. That is, the adsorption member can be stably attached to the concave portion of the horn, and as a result, ultrasonic vibration from the horn can be efficiently transmitted to the adsorption member.

A third invention is the first or second invention, further comprising heating means for heating the horn,
The heating means is preferably at a position where the vibration amplitude of the horn that vibrates by ultrasonic vibration becomes zero.

(Operation / Effect) According to the third invention, by providing the horn itself with the heating means, the heat of the heating means can be efficiently transmitted to the horn simultaneously with the ultrasonic vibration. Further, by providing the heating means at a position where the vibration amplitude of the horn becomes zero, ultrasonic vibration is not applied to the heating means, and the heating means is not damaged. As a result, the ultrasonic bonding head can be stably maintained over a long period.

A fourth invention is an ultrasonic bonding apparatus that applies ultrasonic vibration to both electrodes while pressing the electrode of the chip component against the electrode of the workpiece,
Ultrasonic generation means for generating ultrasonic vibration;
A horn having a recess formed on the lower surface side at a position where the amplitude of the transmitted ultrasonic vibration is maximized, while transmitting the ultrasonic vibration generated from the ultrasonic generating means,
When housed in the concave portion of the horn, it is stretched forward and backward in the transmission direction of the ultrasonic vibration across the suction portion of the chip part, and is formed at a position on the deeper side of the horn recess than the tip of the suction portion. A suction member having a pair of side portions;
A holding member that acts on the side of the adsorption member and holds the adsorption member in close contact with the bottom surface of the recess;
A fastening member for fastening the suction member to the horn recess by penetrating the holding member at a position where the vibration amplitude of the horn that vibrates by ultrasonic vibration becomes zero and reaching the bottom surface of the horn recess. An ultrasonic bonding head;
Substrate holding means for holding the substrate;
An ultrasonic bonding apparatus comprising: an electrode of a chip component that is adsorbed and held by the ultrasonic bonding head; and a pressing unit that presses the electrode of the substrate held by the substrate holding unit.

(Operation / Effect) According to the fourth invention, the ultrasonic bonding head includes an ultrasonic wave generating means, a horn, a suction member, a holding member, and a fastening member. The ultrasonic wave generating means generates ultrasonic vibration. The horn transmits the ultrasonic vibration generated from the ultrasonic wave generation means, and has a recess formed on the lower surface side at a position where the amplitude of the transmitted ultrasonic vibration becomes maximum. When the suction member is housed in the concave portion of the horn, the suction member is stretched forward and backward in the transmission direction of the ultrasonic vibration across the suction portion of the chip component, and at a position on the deeper side of the horn concave portion than the tip of the suction portion. It has a pair of formed sides. The holding member acts on the side portion of the adsorption member and holds the adsorption member in close contact with the bottom surface of the recess. The fastening member passes through the holding member and reaches the bottom surface of the horn recess, thereby fastening the adsorption member to the horn recess. The substrate holding means holds the substrate. The pressing means presses the electrode of the chip component held by suction with the ultrasonic bonding head and the electrode of the substrate held by the substrate holding means.

  According to this configuration, the ultrasonic bonding head, the substrate holding means, and the press which can transmit ultrasonic vibration efficiently in a stable state from the horn to the suction member and are inexpensive to attach and detach the suction member By providing the means, it is possible to realize an ultrasonic bonding apparatus that is easy to maintain the ultrasonic bonding head and has a low-cost configuration.

According to a fifth invention, in the fourth invention, further, the position of the chip component sucked by the suction member of the ultrasonic bonding head, recognizing means for recognizing the position of a substrate held by the substrate holding means,
Based on the recognition result of the recognition means, a calculation means for obtaining a displacement of the bonding position of the chip component and the substrate;
A bonding position control means for moving at least one of the ultrasonic bonding head and the substrate holding means so as to match the bonding position of the chip component and the substrate based on the result of the calculation means;
It is provided with.

(Operation / Effect) According to the fifth invention, the recognition means recognizes the position of the chip component adsorbed by the adsorption member of the ultrasonic bonding head and the position of the substrate held by the substrate holding means. The calculation means corrects the position where the chip component and the substrate are joined based on the recognition result of the recognition means. The bonding position control means moves at least one of the ultrasonic bonding head and the substrate holding means so as to match the bonding position of the chip component and the substrate based on the result of the calculation means.

  According to this configuration, the positional displacement amount of both members is calculated by calculation using the positional information of the chip component and the substrate recognized by the recognition means, and the position of the joining position of both members is adjusted by the joining position control means. . Therefore, both the chip component and the substrate electrodes can be ultrasonically joined with high accuracy.

A sixth invention is, it was the fourth or Aspect 5, further comprising a heating means for heating the horn contained in the ultra-sound bonding head.
It is characterized by that.

(Operation / Effect) According to the sixth invention, the heating means heats the horn included in the ultrasonic bonding head. Therefore, the deformation of the electrode at the bonding site can be promoted, and the ultrasonic bonding can be completed in a short time.

  According to the ultrasonic bonding head according to the present invention, the suction member is accommodated in the concave portion of the horn with the side portion of the suction member sandwiched between the holding members, and the suction member is also fastened to the bottom surface of the horn. It is fastened indirectly to the bottom surface of the recess. That is, since the suction member is not directly fastened to the horn by the fastening member, the ultrasonic vibration from the horn can be stably transmitted to the suction member without fine torque adjustment. Further, since the configuration is simple, it can be realized at a low cost.

  In addition, since the fastening member is not located on the adsorption member having the maximum vibration amplitude, loosening of the fastening member due to the influence of ultrasonic vibration, metal fatigue, and the like are suppressed.

  Furthermore, by providing the above-described ultrasonic bonding head, the substrate holding means, and the pressing means, it is possible to realize an ultrasonic bonding apparatus having a structure that facilitates maintenance of the suction member that sucks the chip components and is inexpensive.

  Embodiments of an ultrasonic bonding apparatus including the ultrasonic bonding head of the present invention will be described below with reference to the drawings. In this embodiment, a case where an electronic component with a bump is mounted on a substrate as a chip component will be described as an example. In addition, as the chip component, for example, all forms on the side to be bonded to the substrate are shown regardless of the type and size of an IC chip, a semiconductor chip, an optical element, a surface mount component, a wafer, and the like.

  Moreover, as a board | substrate, all the forms of the side joined to chip components, such as a resin substrate, a glass substrate, a film substrate, are shown, for example.

  FIG. 1 is a front view of the ultrasonic bonding apparatus according to the present embodiment.

  As shown in FIG. 1, the ultrasonic bonding apparatus according to the present embodiment includes a movable table 3 having a substrate holder 2 that holds the substrate 1 by suction, and a vertical frame 5 that is erected at the rear portion of the base 4. 6, a crimping mechanism 9 having an ultrasonic bonding head 8 that is mounted (bonded) to the substrate 1 by sucking and holding the chip component 7 at the tip, and the substrate 1 held by the substrate holder 2 and the ultrasonic wave A camera 10 that recognizes the position of the chip component 7 that is sucked and held by the bonding head 8, the movable table 3, the ultrasonic bonding head 8, the crimping mechanism 9, the main control unit 11 that controls driving of the camera 10, and the like. Is provided. The substrate holder 2 corresponds to the substrate holding means of the present invention, the crimping mechanism 9 corresponds to the pressure means, the camera 10 corresponds to the recognition means, and the main control unit 11 corresponds to the calculation means and the joining position control means.

  The movable table 3 is configured to be movable in two horizontal (X, Y) directions in the left and right and front and rear directions in the figure. Further, the substrate holder 2 provided in the movable table 3 has a suction hole (not shown) formed in the surface portion on which the substrate is placed, and the suction hole is connected in communication with a vacuum pump (not shown) via a pipe. ing. In this embodiment, the holding of the substrate 1 in the substrate holder 2 is an adsorption type. However, the holding type is not limited to the adsorption type, and mechanical holding using a movable claw, electrostatic adsorption using static electricity, and a magnet are used. Any holding structure such as magnetic adsorption can be used.

  The crimping mechanism 9 includes a cylinder 12 fixed to the support frame 6, a main body 14 connected to a rod 13 directed vertically downward of the cylinder 12, and an ultrasonic bonding head 8 provided at a lower end of the main body 14. It is composed of That is, the ultrasonic bonding head 8 is configured to move up and down in conjunction with the expansion and contraction operation of the cylinder 12.

  In addition, as shown in FIG. 2, the ultrasonic bonding head 8 has a frame 15 having a substantially U-shape inverted upside down and a bottom surface coupled to the lower portion of the main body, and through holes formed on both side surfaces of the frame 15. A pair of boosters 16 penetrating from both sides, and a horn 17 detachably held in a state of being sandwiched by the pair of boosters 16 inside the frame 15 are configured.

  The booster 16 has a cylindrical shape with a thick central portion, and has a tapered shape in which both ends thereof taper toward the tip. In addition, the booster 15 on the left side in the figure includes an ultrasonic generator 18 including a piezoelectric element for transmitting and imparting ultrasonic vibration to the booster 16. The ultrasonic generator 18 and the booster 16, the holding portion of the booster 16 by the frame 15, and the nodes of the booster 16 and the horn 17 vibrate when they resonate due to the ultrasonic vibration applied from the ultrasonic generator 18. It is set to a nodal point where the amplitude is zero. The ultrasonic generator 18 corresponds to the ultrasonic generator of the present invention.

  The horn 17 is a thick plate-like object, and through holes are formed so as to form a lattice shape in front and rear when viewed from the front. Further, when viewed from the front, a recess 26 is formed extending from the lower center to the front and rear in the transmission direction of the ultrasonic vibration (longitudinal direction in the drawing), and the suction member 19 is accommodated in the center of the recess 26. The adsorbing member 19 and a holding member 28 that is assembled and fixed in the space of the recess 26 are configured.

  A through hole 20 is formed in the bottom surface of the concave portion of the horn 17 as shown by a chain line in FIG. 2, and is connected to a through hole 27 formed in the adsorption member 19 described later. The through hole 20 is connected in communication with a vacuum pump (not shown). Moreover, a hole is formed in the lattice portion in the middle of the height direction, and the heater 22 is inserted into the hole. The attachment portion of the heater 22 is also set to a nodal point. The heater 22 corresponds to the heating means of the present invention.

  As shown in FIG. 3 in which the portion of the horn 17 in FIG. 2 is turned upside down, the suction member 19 has a convex portion 32 that sucks the chip component 7 in the center, and the ultrasonic vibration of the horn 17 from the base portion of the convex portion 32. And a tapered side portion having a slope extending toward the lower end portion which is the transmission direction (longitudinal direction in the drawing). The tapered side portion has a height that fits into the concave portion 26 of the horn 17. That is, the lower part from the base part of the adsorbing member 19 constitutes the side part of the present invention housed in the recessed part 26. A through hole 27 is formed at the center of the convex portion 32 from the front surface to the back surface. That is, the through hole 20 formed in the concave portion 26 of the horn 17 and the through hole 27 are connected to each other when the suction member 19 is attached to the concave portion 26. The surface of the adsorption member 19 is coated with fluorine in order to suppress friction with the surface of the chip component 7 when ultrasonic vibration is applied and the chip component 7 is bonded to the substrate 1. In addition, it exists in the position where the vibration amplitude transmitted from the supersonic generator 18 via the booster 16 becomes the maximum.

  The holding member 28 has a trapezoidal shape, and is in close contact with the slope of the side portion of the suction member 19 accommodated in the recess 26 and the bottom and side surfaces of the recess 26. Further, the surface thereof is configured to be flush with the front end surface of the horn 17. Further, a screw hole 33 and a screw hole 34 are formed from the surface of the holding member 28 to the bottom surface of the recess 26 of the horn 17 that is in close contact with the back surface of the holding member 28. The holding member 28 is fastened to the horn 17 by inserting a screw 35 as a fastening member from the through hole 33 to the screw hole 34. At this time, the pair of left and right side portions of the suction member 19 are sandwiched between the holding member 28 and the bottom surface of the concave portion 26 of the horn 19 in accordance with the fastening operation by the screw 35, and are indirectly fastened and fixed.

  Returning to FIG. 1, the camera 10 is movable in two horizontal axes (X, Y) and up and down (Z). In addition, a lens barrel 23 that advances and retracts toward the ultrasonic bonding head side is provided. Further, the camera 10 is moved forward in the X-axis direction and is positioned between the chip component 7 and the substrate 1 that are sucked and held by the sucking member 19 of the horn 17. In this state, the positions of the chip component 7 and the substrate 1 are recognized and observed, and the observation result is transmitted to the main control unit 11. As a means for recognizing and observing the positions of both members, all forms other than the camera that can recognize the positions of the substrate 1 and the chip component 7 are applicable regardless of the types of infrared cameras, sensors, and the like.

  The main control unit 11 selects a bonding condition according to the types of the substrate 1 and the chip component 7 to be bonded set and input from the operation unit 24 from a pattern table (not shown), and transmits the selected pattern to the resonance amplitude control unit. . The main control unit 11 also comprehensively controls driving of the movable table 3, the cylinder 11, the camera 10, and the like based on information set and input from the operation unit 24.

  Next, the operation of bonding the chip component 7 to the substrate 1 using the above-described embodiment apparatus will be described based on the flowchart shown in FIG.

  First, the types of the substrate 1 and the chip component 7 to be joined are selected and input from the operation unit 24, and various initial conditions such as the joining time are set (step S1).

  When the initial setting is completed, the substrate 1 is placed and held on the substrate holder 2, and the chip component 7 is sucked and held by the suction member 19 at the tip of the horn 17, and the joining process is started (step S2).

  When the joining process starts, the camera 10 operates under the control of the main control unit 11. The camera 10 advances the lens barrel 23 to acquire image data of the substrate 1 and the chip component 7 and transmits the data to the main control unit 11. Based on the received image data, the main control unit 11 obtains a relative positional deviation between the substrate 1 and the chip component 7 by calculation, and moves the movable table 3 in the X and Y directions based on the obtained detection result. The misalignment is corrected (step S3).

  When the positional deviation correction is completed, the cylinder 12 is operated based on the control of the main control unit 11, and the ultrasonic bonding head 8 is lowered to a predetermined position to press the chip component 7 against the substrate 1. At the same time, the horn 16 is heated to a predetermined temperature by the heater 22, and the ultrasonic generator 18 is driven to start applying ultrasonic vibration to the horn 17 via the booster 16 (step S4). The ultrasonic vibration transmitted to the horn 17 is further transmitted to the suction member 19 fastened in the center, and the entire horn 17 vibrates to the left and right in the figure to rub the electrode 31 of the chip component 7 against the electrode 30 of the substrate 1. Put on.

  Further, the main control unit 11 counts the joining time by an internal timer, and when a predetermined time set in advance is reached (step S5), application of ultrasonic vibration from the ultrasonic generator 18 to the horn 17 is performed. Is stopped, the ultrasonic bonding head 8 is raised, the substrate 1 is taken out, and the main bonding process is completed.

  As described above, the adsorbing member 19 is housed in the center of the recess 26 formed at the tip of the horn 17, and the holding member 28 is incorporated in the side and space of the holding member 28 and the bottom surface of the recess 26 of the horn 17. By sandwiching between the two, the adsorbing member 19 can be fastened and fixed to the horn 17 in a stable state. That is, by providing the tapered side portion so as to have a slope extending from the base portion of the convex portion 32 of the suction member 19 toward the concave portion 26, the contact area of the bottom surface of the suction member 19 with respect to the concave portion 26 is widened and stabilized. Further, since the adsorbing member 19 is sandwiched between the horn 17 and the holding member 28 and is indirectly fastened and fixed, it is difficult to be affected by torque during screw tightening. That is, the ultrasonic vibration from the horn 17 is efficiently and properly transmitted to the adsorption member 19.

  Further, since the position where the holding member 28 is fastened to the horn 17 by the screw 35 is set at a nodal point where the vibration amplitude becomes zero, transmission of ultrasonic vibration to the screw 35 is avoided, and ultrasonic vibration is used. Screw loosening and metal fatigue that tend to occur are avoided. That is, the ultrasonic bonding head 8 can be used for a long time, and the working efficiency can be improved.

  Furthermore, since the suction member 19 that is a consumable part of the ultrasonic bonding head 8 can be replaced with a simple configuration, the maintenance efficiency can be improved.

  The present invention can also be implemented in the following forms.

  (1) Although the convex part 32 which has the adsorption | suction area | region of the adsorption | suction member 19 was a rectangle in the said Example, a design change is possible for this shape suitably. In other words, a plurality of types of suction members 19 each having a convex portion 32 having a suction area corresponding to the shape and size of the chip component 7 are prepared without being affected by the width and length of the horn 17 and are exchanged in a timely manner. Can be used. By configuring in this way, the same effects as in the above embodiment can be obtained.

  (2) In the above embodiment, the horn 17 is provided with the heater 22 as a heating means. However, it may be provided on the substrate holder 3 side, or both electrodes of the substrate 1 and the chip component 7 may be provided by an air nozzle. The structure which sprays warm air on the connection part of 30 and 31 may be sufficient.

  (3) In the above embodiment, the ultrasonic bonding head 8 is lowered to the substrate side, but the movable table 3 is moved up and down to press the electrode 30 of the substrate 1 against the electrode 31 of the chip component 7. May be.

  (4) In the above-described embodiment, the side portion of the adsorption member 19 has a tapered shape that spreads toward the concave portion 26. However, the taper shape may be tapered, or the side portion may be rectangular and the adsorption member may be an alphabet. It may be “T” shaped. When the adsorbing member 19 has the above-described shape, the holding member 28 comes into close contact with each side surface and is incorporated into the recess 26.

It is a front view which shows the whole ultrasonic bonding apparatus which concerns on an Example. It is a front view which shows the principal part structure of a horn. It is a disassembled perspective view which shows the principal part structure of a horn. It is a flowchart explaining operation | movement of an Example apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Substrate holder 7 ... Chip component 8 ... Ultrasonic bonding head 11 ... Main control part 17 ... Horn 18 ... Ultrasonic generator 19 ... Adsorption member 28 ... Holding member 30 ... Electrode (substrate)
31 ... Electrode (chip component)
32 ... Convex part 35 ... Screw

Claims (6)

An ultrasonic bonding head that applies ultrasonic vibration to both electrodes while pressing the electrode of the chip component against the electrode of the workpiece,
Ultrasonic generation means for generating ultrasonic vibration;
A horn having a recess formed on the lower surface side at a position where the amplitude of the transmitted ultrasonic vibration is maximized, while transmitting the ultrasonic vibration generated from the ultrasonic generating means,
When housed in the concave portion of the horn, it is stretched forward and backward in the transmission direction of the ultrasonic vibration across the suction portion of the chip part, and is formed at a position on the deeper side of the horn recess than the tip of the suction portion. A suction member having a pair of side portions;
A holding member that acts on the side of the adsorption member and holds the adsorption member in close contact with the bottom surface of the recess;
A fastening member that passes through the holding member and reaches the bottom surface of the horn recess to fasten the adsorption member to the horn recess ;
The position where the fastening member penetrates the holding member is a position where the vibration amplitude of the horn that vibrates by ultrasonic vibration becomes zero . The ultrasonic bonding head according to claim 1,
The suction member has a convex part protruding from the horn of the suction part of the chip part, and is formed in a tapered shape that spreads from the base part of the convex part toward the lower end of the side part. Sonic bonding head. In the ultrasonic bonding head according to claim 1 or 2 ,
Furthermore, a heating means for heating the horn is provided,
The ultrasonic joining head, wherein the heating means is a position where the vibration amplitude of the horn that vibrates by ultrasonic vibration becomes zero. An ultrasonic bonding apparatus that applies ultrasonic vibration to both electrodes while bonding the electrode of the chip component to the electrode of the workpiece,
Ultrasonic generation means for generating ultrasonic vibration;
A horn having a recess formed on the lower surface side at a position where the amplitude of the transmitted ultrasonic vibration is maximized, while transmitting the ultrasonic vibration generated from the ultrasonic generating means,
When housed in the concave portion of the horn, it is stretched forward and backward in the transmission direction of the ultrasonic vibration across the suction portion of the chip part, and is formed at a position on the deeper side of the horn recess than the tip of the suction portion. A suction member having a pair of side portions;
A holding member that acts on the side of the adsorption member and holds the adsorption member in close contact with the bottom surface of the recess;
A fastening member for fastening the suction member to the horn recess by penetrating the holding member at a position where the vibration amplitude of the horn that vibrates by ultrasonic vibration becomes zero and reaching the bottom surface of the horn recess. An ultrasonic bonding head;
Substrate holding means for holding the substrate;
An ultrasonic bonding apparatus comprising: an electrode of a chip component that is adsorbed and held by the ultrasonic bonding head; and a pressing unit that presses the electrode of the substrate held by the substrate holding unit. The ultrasonic bonding apparatus according to claim 4 ,
Furthermore, a recognition means for recognizing the position of the chip component sucked by the suction member of the ultrasonic bonding head and the position of the substrate held by the substrate holding means;
Based on the recognition result of the recognition means, a calculation means for obtaining a displacement of the bonding position of the chip component and the substrate;
A bonding position control means for moving at least one of the ultrasonic bonding head and the substrate holding means so as to match the bonding position of the chip component and the substrate based on the result of the calculation means;
An ultrasonic bonding apparatus comprising: Or claim 4 in the ultrasonic bonding apparatus according to claim 5,
Furthermore, the ultrasonic joining apparatus characterized by including the heating means which heats the said horn contained in the said ultrasonic joining head.

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