JP4198928B2 - LED lamp manufacturing method and LED lamp - Google Patents

LED lamp manufacturing method and LED lamp Download PDF

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JP4198928B2
JP4198928B2 JP2002086580A JP2002086580A JP4198928B2 JP 4198928 B2 JP4198928 B2 JP 4198928B2 JP 2002086580 A JP2002086580 A JP 2002086580A JP 2002086580 A JP2002086580 A JP 2002086580A JP 4198928 B2 JP4198928 B2 JP 4198928B2
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led lamp
silicone resin
substrate
manufacturing
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JP2003282952A (en
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重和 徳寺
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Seiwa Electric Mfg Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

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Description

【０００１】
【発明の属する技術分野】
本発明は、ＬＥＤランプ、特に白色光を発光する表面実装型ＬＥＤランプの製造方法、及び該製造方法によって製造されたＬＥＤランプに関する。
【０００２】
【従来の技術】
表面実装型ＬＥＤランプとは、電極を有する基板にＬＥＤ（発光ダイオード）を表面実装させたＬＥＤランプである。図５は従来の表面実装型ＬＥＤランプの例を示す斜視図である。図中２は平面視で矩形に生成された基板であり、基板２の表面には、両短辺から中央にかけて金属被膜による電極２１，２１が互いに離隔して形成されている。電極２１，２１の一方には、ＬＥＤ１が載設されており、ＬＥＤ１の一方の端子が電極２１，２１の一方に接続され、ＬＥＤ１の他方の端子が導電性のワイヤ１１を介して電極２１，２１の他方に接続されている。基板２の表面は、両短辺の付近に形成されている電極２１，２１を除き、光透過性樹脂にて形成された、ＬＥＤ１及びワイヤ１１が完全に隠れる大きさのモールド４によって覆われている。モールド４を形成する光透過性樹脂には、エポキシ樹脂が主に用いられている。このような表面実装型ＬＥＤランプは、電極２１，２１を他の回路に接続する陰極および陽極とし、表示器などに組み込まれるＬＥＤとして用いられる。また、基板２を用いず、電極を兼ねたリードフレーム上にＬＥＤ１が実装された表面実装型ＬＥＤランプも用いられている。
【０００３】
ＬＥＤ１として青色光を発光する青色ＬＥＤを用いた場合、エポキシ樹脂は青色光によって黄変する特性があるため、エポキシ樹脂を用いてモールド４を形成している表面実装型ＬＥＤランプは、長期間の使用により明るさが劣化する。このため、青色光による変色を起こさないシリコーン樹脂を用いてモールド４を形成した表面実装型ＬＥＤランプが使用されている。図６は、モールド４にシリコーン樹脂を用いた表面実装型ＬＥＤランプの例を示す断面図である。基板２には、升状に形成された樹脂ケース５が備えられており、樹脂ケース５の内側にＬＥＤ１が備えられ、ＬＥＤ１を覆うように樹脂ケース５の内側にモールド４が形成されている。シリコーン樹脂は、エポキシ樹脂よりも軟らかいために、モールド４を形成するためには、より硬い樹脂で形成された樹脂ケース５が必要となる。
【０００４】
また、シリコーン樹脂にてＬＥＤ１を覆い、更にシリコーン樹脂をエポキシ樹脂にて覆うことにより形成されたモールド４を備えた表面実装型ＬＥＤランプも使用されている。軟らかく耐久性に欠けるシリコーン樹脂を硬いエポキシ樹脂で覆うことで、表面実装型ＬＥＤランプの耐久性を向上させることができる。
【０００５】
【発明が解決しようとする課題】
樹脂ケース５を用いて表面実装型ＬＥＤランプを作成した場合は、樹脂ケース５のために小型化が困難であり、製造の際には樹脂ケース５を基板２に備える行程のためにコストが上昇するという問題がある。
【０００６】
ＬＥＤ１をシリコーン樹脂で覆って更にエポキシ樹脂で覆ったモールドを備えた表面実装型ＬＥＤランプは、樹脂ケース５が不必要であるため、小型化が可能である。しかし、シリコーン樹脂はチクソ性が小さいため、製造の際に必要な部位から流出し、ＬＥＤを充分に覆うことができない、又は電極を覆って接続不良の原因となる等、樹脂ケース５なしで安定した形でモールドを形成することが困難であり、作成した表面実装型ＬＥＤランプが信頼性に欠けるという問題がある。
【０００７】
本発明は、以上の問題を解決するためになされたものであって、その目的とするところは、ＬＥＤランプを製造する際に、ＬＥＤを搭載した基板またはリードフレームを加熱しながらシリコーン樹脂を塗布することによって、ＬＥＤを覆うシリコーン樹脂を効果的に硬化させてＬＥＤランプの信頼性を向上させ、また、ＬＥＤランプを小型化することができるＬＥＤランプの製造方法、及び該製造方法によって製造されたＬＥＤランプを提供することにある。
【０００８】
【課題を解決するための手段】
第１発明に係るＬＥＤランプの製造方法は、配線基板上に表面実装されたＬＥＤの発光面にシリコーン樹脂を塗布し、シリコーン樹脂にてＬＥＤの発光面が覆われた表面実装型ＬＥＤランプを製造する方法において、ＬＥＤを表面実装した配線基板を加熱した状態でＬＥＤの表面にシリコーン樹脂を塗布することを特徴とする。
【０００９】
第２発明に係るＬＥＤランプの製造方法は、塗布されるシリコーン樹脂の温度を５０℃以上にすべく前記配線基板を加熱することを特徴とする。
【００１１】
第１発明及び第２発明においては、ＬＥＤを実装した基板を加熱しながら、ＬＥＤにシリコーン樹脂を塗布する。シリコーン樹脂の温度を５０℃以上にすべく加熱することにより、シリコーン樹脂は、塗布された位置で硬化するため、シリコーン樹脂が必要な部位から流出せず、信頼性が向上したＬＥＤランプを製造することができる。
【００１３】
【発明の実施の形態】
以下、本発明をその実施の形態を示す図面に基づき具体的に説明する。本実施の形態においては、本発明のＬＥＤランプの例として表面実装型ＬＥＤランプの形態を示す。
図１は、本発明に係る表面実装型ＬＥＤランプを示す平面図であり、図２は、本発明に係る表面実装型ＬＥＤランプを示す正面図である。図中２は、エポキシ等の絶縁材にて形成された基板であり、矩形に形成されている。基板２の表面には、両短辺から基板２の中央にかけて金属被膜による電極２１，２１が互いに離隔して形成されており、電極２１，２１の一方には、ＬＥＤ１が載設されている。ＬＥＤ１は、青色光を発光する青色ＬＥＤであり、発光面上に一対の接続端子を備えている。ＬＥＤ１の一対の接続端子の一方は、金線またはアルミニウム線などを用いたワイヤ１１にて、ＬＥＤ１が載設されている電極２１，２１の一方に接続されており、ＬＥＤ１の一対の接続端子の他方は、他のワイヤ１１にて電極２１，２１の他方に接続されている。ＬＥＤ１及びＬＥＤ１とワイヤ１１，１１との接続部分は、シリコーン樹脂にて形成されたシリコーン樹脂部３にて覆われている。シリコーン樹脂部３は、ＬＥＤ１を搭載した電極２１上で凸レンズの形状に形成されており、ＬＥＤ１全体を覆っている。また、シリコーン樹脂部３は、ＬＥＤ１からの青色光を吸収してより長波長の光を発光する蛍光体を含んでいる。基板２の表面は、電極２１，２１の基板２の両短辺付近に形成されている部分を除き、ＬＥＤ１、ワイヤ１１，１１及びシリコーン樹脂部３が完全に隠れる大きさの台状に形成されたモールド４によって覆われており、モールド４は光透過性のエポキシ樹脂にて形成されている。電極２１，２１間に外部から電力が供給されることにより、ＬＥＤ１に電流が流れてＬＥＤ１は青色光を発光し、シリコーン樹脂部３に含まれる蛍光体が青色光を吸収してより長波長の光を発光し、本発明のＬＥＤランプは、ＬＥＤ１からの光と蛍光体からの光が混合した白色光を発光する。
【００１４】
図３は、本発明に係る表面実装型ＬＥＤランプの製造方法を説明するための側面図である。図中２０はエポキシ等の絶縁材にて形成された板状の原材であり、短辺が基板２の長辺と同じ長さの長尺の矩形に形成されており、図中に破線にて示した切断線にて切断されて複数の基板２，２，…が形成される。原材２０の表面には、銅またはアルミニウムなどの金属被膜により、電極２１，２１のパターンが形成され、図３（ａ）に示すごとく、電極２１，２１の一方にＬＥＤ１，１，…が載設され、ＬＥＤ１，１，…の一対の接続端子の夫々と電極２１，２１の一方または他方とがワイヤ１１，１１，…により接続される。次に、図３（ｂ）に示すごとく、基板２となる原材２０を５０℃以上に加熱し、加熱した状態のままで、ＬＥＤ１の表面に蛍光体を含ませたシリコーン樹脂を塗布する。シリコーン樹脂は、熱によって硬化し、ＬＥＤ１を覆ってシリコーン樹脂部３が形成される。シリコーン樹脂は、塗布された位置から流出せずに、塗布された位置で硬化する。シリコーン樹脂は５０℃以上で硬化し、基板２がエポキシ基板である場合には、切断されて基板２となる原材２０が１５０℃程度まで耐えられるため、塗布されるシリコーン樹脂の温度が５０℃以上となり、原材２０の温度が１５０℃以下となる条件で加熱が行われる。次に、全体を硬化炉にて１５０℃で１時間処理し、シリコーン樹脂を完全に硬化させる。
【００１５】
次に、トランスファー成形により、図３（ｃ）に示すごとく、電極２１，２１の端部を除いて原材２０の上面を覆うモールド４をエポキシ樹脂を用いて成形する。ＬＥＤ１及びシリコーン樹脂部３はモールド４に完全に覆われる。次に、モールド４ごと原材２０を切断線に沿って切断し、個々の表面実装型ＬＥＤランプを分離して完成させる。
【００１６】
本発明の製造方法は、加熱を行わずにシリコーン樹脂部３を形成する従来の方法に比べて、シリコーン樹脂が塗布した部位から流出して電極を覆って接続不良を起こすことがなく、また、ＬＥＤ１がシリコーン樹脂にて確実に覆われるため、表面実装型ＬＥＤランプの信頼性が向上する。また、表面実装型ＬＥＤランプの製造の歩留まりが向上する。更に、シリコーン樹脂部３に含まれる蛍光体がＬＥＤ１の近傍に集中し、特に発光面上に位置する蛍光体が多いため、ＬＥＤ１からの光を吸収して発光する蛍光体の割合が増大し、蛍光体の利用効率が向上する。
【００１７】
図４は、本発明に係る表面実装型ＬＥＤランプの他の例を示した正面図である。図に示した例では、ＬＥＤ１の発光面上にシリコーン樹脂部３が形成されており、平面視でのシリコーン樹脂部３の面積のうち少なくとも１／２以上が、ＬＥＤ１の発光面を覆っている面積となっている。本発明の製造方法を用いることにより、シリコーン樹脂が塗布された位置で硬化するため、ＬＥＤ１の発光面上でシリコーン樹脂を硬化させて、シリコーン樹脂のほぼ全てがＬＥＤ１の発光面上に集中したシリコーン樹脂部３を形成することが可能となる。ＬＥＤ１の発光面上にシリコーン樹脂部３が形成されているため、蛍光体の利用効率が更に増大され、蛍光体の量を節約することができ、表面実装型ＬＥＤランプの製造コストが抑制される。
【００１８】
以上詳述した如く、本発明においては、蛍光体を含んだシリコーン樹脂にてＬＥＤ１の発光面を覆った表面実装型ＬＥＤランプを安定して製造することができるため、樹脂ケースを用いた従来の表面実装型ＬＥＤランプに比べて、表面実装型ＬＥＤランプの小型化が可能であり、また、製造コストを抑制することができる。特に、白色光を発光する表面実装型ＬＥＤランプの小型化を促進することができる。
【００１９】
本実施の形態においては、ＬＥＤ１は青色ＬＥＤであり、シリコーン樹脂部３は蛍光体を含むこととしたが、これに限るものではなく、蛍光体を用いずにＬＥＤ１として青色以外の光を発光するＬＥＤを用いても良い。また、本実施の形態においては、本発明のＬＥＤランプとして、基板２上にＬＥＤ１が実装された表面実装型ＬＥＤランプを示したが、これに限るものではなく、基板２ではなく、金属製のリードフレームにＬＥＤ１を実装して製造したＬＥＤランプであってもよい。この場合は、リードフレームは基板２に比べてより高温に耐えられるため、リードフレームが１５０℃以上になる温度で処理を行うことができる。また、本発明のＬＥＤランプは、表面実装型ＬＥＤランプではなく、金属製の電極に接続されたＬＥＤ１を砲弾型のモールド４が覆っている砲弾型のＬＥＤランプであってもよい。この場合においても、電極となるリードフレームにＬＥＤ１を搭載して加熱することで、凸レンズ状のシリコーン樹脂部３を効果的に形成することができ、信頼性のあるＬＥＤランプを製造することができる。
【００２０】
【発明の効果】
第１発明及び第２発明においては、ＬＥＤを実装した基板を加熱しながら、ＬＥＤにシリコーン樹脂を塗布することにより、シリコーン樹脂は、塗布された位置で硬化するため、シリコーン樹脂が必要な部位から流出せず、信頼性が向上したＬＥＤランプを製造することができる。また、樹脂ケースを用いないために、製造コストが抑制され、更に、ＬＥＤランプの小型化を促進することができる。
【図面の簡単な説明】
【図１】本発明に係る表面実装型ＬＥＤランプを示す平面図である。
【図２】本発明に係る表面実装型ＬＥＤランプを示す正面図である。
【図３】本発明に係る表面実装型ＬＥＤランプの製造方法を説明するための側面図である。
【図４】本発明に係る表面実装型ＬＥＤランプの他の例を示した正面図である。
【図５】従来の表面実装型ＬＥＤランプの例を示す斜視図である。
【図６】モールドにシリコーン樹脂を用いた表面実装型ＬＥＤランプの例を示す断面図である。
【符号の説明】
１ ＬＥＤ
２ 基板
２０ 原材
３ シリコーン樹脂部
４ モールド[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an LED lamp, in particular, a method for manufacturing a surface-mounted LED lamp that emits white light, and an LED lamp manufactured by the manufacturing method.
[0002]
[Prior art]
The surface mount type LED lamp is an LED lamp in which an LED (light emitting diode) is surface mounted on a substrate having electrodes. FIG. 5 is a perspective view showing an example of a conventional surface mount LED lamp. In the figure, reference numeral 2 denotes a substrate formed in a rectangular shape in plan view. On the surface of the substrate 2, electrodes 21 and 21 made of metal films are formed apart from each other from both short sides to the center. The LED 1 is mounted on one of the electrodes 21, 21, and one terminal of the LED 1 is connected to one of the electrodes 21, 21, and the other terminal of the LED 1 is connected to the electrode 21, via the conductive wire 11. 21 is connected to the other side. The surface of the substrate 2 is covered with a mold 4 made of a light-transmitting resin and having a size that completely hides the LED 1 and the wire 11 except for the electrodes 21 and 21 formed near both short sides. Yes. Epoxy resin is mainly used as the light transmissive resin forming the mold 4. Such a surface mount type LED lamp is used as an LED incorporated in a display or the like using the electrodes 21 and 21 as cathodes and anodes connected to other circuits. Further, a surface mount type LED lamp in which the LED 1 is mounted on a lead frame that also serves as an electrode without using the substrate 2 is also used.
[0003]
When a blue LED that emits blue light is used as the LED 1, the epoxy resin has the property of being yellowed by blue light. Therefore, the surface mount type LED lamp that uses the epoxy resin to form the mold 4 is a long-term Brightness deteriorates with use. For this reason, a surface-mount type LED lamp in which the mold 4 is formed using a silicone resin that does not cause discoloration by blue light is used. FIG. 6 is a cross-sectional view showing an example of a surface mount type LED lamp using a silicone resin for the mold 4. The substrate 2 is provided with a resin case 5 formed in a bowl shape, the LED 1 is provided inside the resin case 5, and the mold 4 is formed inside the resin case 5 so as to cover the LED 1. Since the silicone resin is softer than the epoxy resin, in order to form the mold 4, the resin case 5 made of a harder resin is required.
[0004]
Further, a surface mount type LED lamp provided with a mold 4 formed by covering the LED 1 with a silicone resin and further covering the silicone resin with an epoxy resin is also used. Covering the soft and poorly durable silicone resin with a hard epoxy resin can improve the durability of the surface-mounted LED lamp.
[0005]
[Problems to be solved by the invention]
When a surface mount type LED lamp is made using the resin case 5, it is difficult to reduce the size because of the resin case 5, and the cost increases due to the process of mounting the resin case 5 on the substrate 2 during the production. There is a problem of doing.
[0006]
The surface mount type LED lamp having a mold in which the LED 1 is covered with a silicone resin and further covered with an epoxy resin can be downsized because the resin case 5 is unnecessary. However, since the silicone resin has low thixotropy, it flows out of the necessary part during production and cannot sufficiently cover the LED, or it may cause poor connection by covering the electrode. Therefore, it is difficult to form a mold in the shape, and there is a problem that the surface-mounted LED lamp thus created is not reliable.
[0007]
The present invention has been made to solve the above-described problems. The object of the present invention is to apply a silicone resin while heating an LED-mounted substrate or a lead frame when manufacturing an LED lamp. Thus, the silicone resin covering the LED is effectively cured to improve the reliability of the LED lamp, and the LED lamp can be reduced in size, and the LED lamp is manufactured by the manufacturing method. It is to provide an LED lamp.
[0008]
[Means for Solving the Problems]
Method for manufacturing an LED lamp according to the first invention, a silicone resin was coated on the light emitting surface of the surface-mounted an LED on the wiring board, the surface mount type LED lamp emitting surface of the LED in the silicone resin is covered a method of manufacturing, characterized by applying a silicone resin to the surface of the LED while heating the wiring board obtained by surface-mounted LED.
[0009]
Method for manufacturing an LED lamp according to the second invention is characterized by heating the wiring board so as to the temperature of the silicone resin applied over 50 ° C..
[0011]
In the first and second aspects of the present invention, while heating the base plate mounted with LED, applying a silicone resin the LED. By heating the silicone resin to a temperature of 50 ° C. or higher, the silicone resin is cured at the position where it is applied, so that the silicone resin does not flow out from the required site, and an LED lamp with improved reliability is manufactured. be able to.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be specifically described with reference to the drawings showing embodiments thereof. In this embodiment, a form of a surface mount type LED lamp is shown as an example of the LED lamp of the present invention.
FIG. 1 is a plan view showing a surface mount LED lamp according to the present invention, and FIG. 2 is a front view showing the surface mount LED lamp according to the present invention. In the figure, reference numeral 2 denotes a substrate formed of an insulating material such as epoxy, and is formed in a rectangular shape. On the surface of the substrate 2, electrodes 21 and 21 made of metal films are formed apart from each other from the short side to the center of the substrate 2, and the LED 1 is mounted on one of the electrodes 21 and 21. The LED 1 is a blue LED that emits blue light, and includes a pair of connection terminals on a light emitting surface. One of the pair of connection terminals of the LED 1 is connected to one of the electrodes 21 and 21 on which the LED 1 is mounted by a wire 11 using a gold wire or an aluminum wire. The other is connected to the other of the electrodes 21 and 21 by another wire 11. The connection part of LED1 and LED1 and the wires 11 and 11 is covered with the silicone resin part 3 formed with the silicone resin. The silicone resin portion 3 is formed in a convex lens shape on the electrode 21 on which the LED 1 is mounted, and covers the entire LED 1. The silicone resin portion 3 includes a phosphor that absorbs blue light from the LED 1 and emits light having a longer wavelength. The surface of the substrate 2 is formed in a trapezoidal size that completely hides the LED 1, the wires 11, 11 and the silicone resin portion 3 except for the portions formed near both short sides of the substrate 2 of the electrodes 21, 21. The mold 4 is formed of a light-transmitting epoxy resin. When electric power is supplied between the electrodes 21 and 21 from the outside, a current flows through the LED 1 and the LED 1 emits blue light, and the phosphor contained in the silicone resin portion 3 absorbs the blue light and has a longer wavelength. It emits light, and the LED lamp of the present invention emits white light in which light from the LED 1 and light from the phosphor are mixed.
[0014]
FIG. 3 is a side view for explaining the method of manufacturing the surface-mounted LED lamp according to the present invention. In the figure, reference numeral 20 denotes a plate-shaped raw material formed of an insulating material such as epoxy, and the short side is formed into a long rectangle having the same length as the long side of the substrate 2. A plurality of substrates 2, 2,... Are formed by cutting along the cutting lines shown. A pattern of electrodes 21 and 21 is formed on the surface of the raw material 20 by a metal coating such as copper or aluminum, and the LEDs 1, 1,... Are mounted on one of the electrodes 21, 21, as shown in FIG. Are connected to one or the other of the electrodes 21, 21 by wires 11, 11,. Next, as shown in FIG. 3B, the raw material 20 to be the substrate 2 is heated to 50 ° C. or higher, and a silicone resin containing a phosphor is applied to the surface of the LED 1 in the heated state. The silicone resin is cured by heat and covers the LED 1 to form the silicone resin portion 3. The silicone resin cures at the applied position without flowing out of the applied position. When the silicone resin is cured at 50 ° C. or higher and the substrate 2 is an epoxy substrate, the raw material 20 that is cut and becomes the substrate 2 can withstand up to about 150 ° C., so the temperature of the applied silicone resin is 50 ° C. Thus, heating is performed under the condition that the temperature of the raw material 20 is 150 ° C. or less. Next, the whole is treated in a curing furnace at 150 ° C. for 1 hour to completely cure the silicone resin.
[0015]
Next, as shown in FIG. 3C, the mold 4 that covers the upper surface of the raw material 20 except for the ends of the electrodes 21 and 21 is formed by transfer molding using an epoxy resin. The LED 1 and the silicone resin part 3 are completely covered with the mold 4. Next, the raw material 20 together with the mold 4 is cut along a cutting line, and individual surface mount type LED lamps are separated and completed.
[0016]
Compared to the conventional method of forming the silicone resin portion 3 without heating, the manufacturing method of the present invention does not flow out of the portion where the silicone resin is applied and covers the electrode, causing poor connection. Since the LED 1 is reliably covered with the silicone resin, the reliability of the surface mount LED lamp is improved. In addition, the production yield of the surface mount type LED lamp is improved. Furthermore, the phosphor contained in the silicone resin portion 3 is concentrated in the vicinity of the LED 1, and in particular, there are many phosphors located on the light emitting surface, so the proportion of the phosphor that absorbs light from the LED 1 and emits light increases. The utilization efficiency of the phosphor is improved.
[0017]
FIG. 4 is a front view showing another example of the surface-mounted LED lamp according to the present invention. In the example shown in the figure, the silicone resin portion 3 is formed on the light emitting surface of the LED 1, and at least 1/2 or more of the area of the silicone resin portion 3 in plan view covers the light emitting surface of the LED 1. It is an area. By using the manufacturing method of the present invention, the silicone resin is cured at the position where the silicone resin is applied. Therefore, the silicone resin is cured on the light emitting surface of the LED 1, and silicone in which almost all of the silicone resin is concentrated on the light emitting surface of the LED 1. The resin part 3 can be formed. Since the silicone resin portion 3 is formed on the light emitting surface of the LED 1, the utilization efficiency of the phosphor can be further increased, the amount of the phosphor can be saved, and the manufacturing cost of the surface mount LED lamp can be suppressed. .
[0018]
As described above in detail, in the present invention, since a surface-mount type LED lamp in which the light emitting surface of the LED 1 is covered with a silicone resin containing a phosphor can be stably manufactured, a conventional case using a resin case is used. Compared with the surface-mounted LED lamp, the surface-mounted LED lamp can be reduced in size, and the manufacturing cost can be reduced. In particular, downsizing of a surface-mounted LED lamp that emits white light can be promoted.
[0019]
In the present embodiment, the LED 1 is a blue LED and the silicone resin portion 3 includes a phosphor. However, the present invention is not limited to this, and the LED 1 emits light other than blue without using the phosphor. You may use LED. Moreover, in this Embodiment, although the surface mount type LED lamp with which LED1 was mounted on the board | substrate 2 was shown as an LED lamp of this invention, it is not restricted to this, It is not the board | substrate 2 but metal. It may be an LED lamp manufactured by mounting the LED 1 on a lead frame. In this case, since the lead frame can withstand a higher temperature than the substrate 2, the processing can be performed at a temperature at which the lead frame is 150 ° C. or higher. Further, the LED lamp of the present invention may be a bullet-type LED lamp in which a bullet-shaped mold 4 covers the LED 1 connected to a metal electrode, instead of the surface-mounted LED lamp. Even in this case, by mounting the LED 1 on the lead frame serving as an electrode and heating, the convex lens-shaped silicone resin portion 3 can be effectively formed, and a reliable LED lamp can be manufactured. .
[0020]
【The invention's effect】
In the first and second aspects of the present invention, while heating the base plate mounted with LED, by applying a silicone resin to LED, silicone resin, to cure a coating position, the silicone resin is required site Thus, an LED lamp with improved reliability can be manufactured. Moreover, since the resin case is not used, the manufacturing cost is suppressed, and further, the downsizing of the LED lamp can be promoted.
[Brief description of the drawings]
FIG. 1 is a plan view showing a surface-mounted LED lamp according to the present invention.
FIG. 2 is a front view showing a surface-mounted LED lamp according to the present invention.
FIG. 3 is a side view for explaining a method for manufacturing a surface-mounted LED lamp according to the present invention.
FIG. 4 is a front view showing another example of a surface-mounted LED lamp according to the present invention.
FIG. 5 is a perspective view showing an example of a conventional surface-mounted LED lamp.
FIG. 6 is a cross-sectional view showing an example of a surface mount LED lamp using a silicone resin as a mold.
[Explanation of symbols]
1 LED
2 Substrate 20 Raw material 3 Silicone resin part 4 Mold

Claims (2)

配線基板上に表面実装されたＬＥＤの発光面にシリコーン樹脂を塗布し、シリコーン樹脂にてＬＥＤの発光面が覆われた表面実装型ＬＥＤランプを製造する方法において、
ＬＥＤを表面実装した配線基板を加熱した状態でＬＥＤの表面にシリコーン樹脂を塗布することを特徴とするＬＥＤランプの製造方法。The silicone resin is applied to the light emitting surface of the surface-mounted an LED on a wiring board, a process for the preparation of a surface-mounted LED lamp emitting surface of the LED in the silicone resin is covered,
LED lamp manufacturing method, characterized by applying a silicone resin to the surface of the LED to LED while heating the wiring base plate having surface mounting. 塗布されるシリコーン樹脂の温度を５０℃以上にすべく前記配線基板を加熱することを特徴とする請求項１に記載のＬＥＤランプの製造方法。LED lamp manufacturing method according to claim 1, characterized in that heating the order to the temperature of the silicone resin applied over 50 ° C. the wiring board.
JP2002086580A 2002-03-26 2002-03-26 LED lamp manufacturing method and LED lamp Expired - Fee Related JP4198928B2 (en)

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US8940561B2 (en) * 2008-01-15 2015-01-27 Cree, Inc. Systems and methods for application of optical materials to optical elements
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JP2014082284A (en) * 2012-10-15 2014-05-08 Dow Corning Toray Co Ltd Method for manufacturing integrated product including convex cured product and base material
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