JP4191692B2 - SiC系膜の成膜方法及び半導体装置の製造方法 - Google Patents
SiC系膜の成膜方法及び半導体装置の製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 75
- 239000004065 semiconductor Substances 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000009832 plasma treatment Methods 0.000 claims description 71
- 239000007795 chemical reaction product Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 56
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 52
- 239000007789 gas Substances 0.000 claims description 49
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 33
- 229910052757 nitrogen Inorganic materials 0.000 claims description 25
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 claims description 24
- 238000005108 dry cleaning Methods 0.000 claims description 19
- 150000004767 nitrides Chemical class 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000010926 purge Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 84
- 239000010949 copper Substances 0.000 description 44
- 230000004888 barrier function Effects 0.000 description 38
- 239000002184 metal Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000011229 interlayer Substances 0.000 description 19
- 238000009826 distribution Methods 0.000 description 18
- 150000002500 ions Chemical class 0.000 description 15
- 238000012545 processing Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 13
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 12
- 238000004458 analytical method Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 8
- 239000002994 raw material Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- WMIYKQLTONQJES-UHFFFAOYSA-N hexafluoroethane Chemical compound FC(F)(F)C(F)(F)F WMIYKQLTONQJES-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229960001730 nitrous oxide Drugs 0.000 description 1
- 235000013842 nitrous oxide Nutrition 0.000 description 1
- QYSGYZVSCZSLHT-UHFFFAOYSA-N octafluoropropane Chemical compound FC(F)(F)C(F)(F)C(F)(F)F QYSGYZVSCZSLHT-UHFFFAOYSA-N 0.000 description 1
- 229960004065 perflutren Drugs 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
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- H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Description
本発明の第1実施形態によるSiC系膜の成膜方法について図1乃至図4を用いて説明する。図1は本実施形態によるSiC系膜の成膜方法に用いられる成膜装置の構造を示す概略図、図2は本実施形態によるSiC系膜の成膜方法を示す工程断面図、図3及び図4はSIMSによりSiC膜の深さ方向の組成を分析した結果を示すグラフである。
本発明の第2実施形態による半導体装置の製造方法について図5乃至図9を用いて説明する。図5乃至図9は本実施形態による半導体装置の製造方法を示す工程断面図である。なお、図1及び図2に示す第1実施形態によるSiC系膜の成膜方法と同様の構成要素については同一の符号を付し説明を省略し或いは簡略にする。
本発明は上記実施形態に限らず種々の変形が可能である。
チャンバー内において基板表面にNH3プラズマを発生させ、前記基板に対してNH3プラズマ処理を行う工程と、
前記チャンバー内に残留する窒素を含む反応生成物を除去する工程と、
前記チャンバー内において、前記基板上に、PECVD法によりSiC系膜を成膜する工程と
を有することを特徴とするSiC系膜の成膜方法。
付記1記載のSiC系膜の成膜方法において、
前記SiC系膜を成膜する工程では、メチルシランのガスを含んだ原料ガスを用いたPECVD法により、前記SiC系膜を成膜する
ことを特徴とするSiC系膜の成膜方法。
付記1記載のSiC系膜の成膜方法において、
前記SiC系膜を成膜する工程では、メチルシランとCO2との混合ガスを原料ガスとして用いたPECVD法により、前記SiC系膜を成膜する
ことを特徴とするSiC系膜の成膜方法。
付記2又は3記載のSiC系膜の成膜方法において、
前記メチルシランは、テトラメチルシランである
ことを特徴とするSiC系膜の成膜方法。
付記1乃至4のいずれかに記載のSiC系膜の成膜方法において、
前記反応生成物を除去する工程では、プラズマを用いたドライクリーニングにより前記反応生成物を除去する
ことを特徴とするSiC系膜の成膜方法。
付記1乃至4のいずれかに記載のSiC系膜の成膜方法において、
前記反応生成物を除去する工程では、前記チャンバー内の圧力を、前記基板に対してNH3プラズマ処理を行う工程後の圧力から更に減圧することにより前記反応生成物を除去する
ことを特徴とするSiC系膜の成膜方法。
付記1乃至4のいずれかに記載のSiC系膜の成膜方法において、
前記反応生成物を除去する工程では、前記チャンバー内を不活性ガスでパージすることにより前記反応生成物を除去する
ことを特徴とするSiC系膜の成膜方法。
付記1乃至7のいずれかに記載のSiC系膜の成膜方法において、
前記基板の表面には、配線層が形成されており、
前記基板に対してNH3プラズマ処理を行う工程では、NH3プラズマにより前記配線層の表面を還元する
ことを特徴とするSiC系膜の成膜方法。
付記8記載のSiC系膜の成膜方法において、
前記基板に対してNH3プラズマ処理を行う工程では、NH3プラズマにより前記配線層の表面に窒化物層を形成する
ことを特徴とするSiC系膜の成膜方法。
比誘電率が4.0よりも小さく、膜中の窒素濃度が、SIMSにより分析した際の二次イオン強度で表して103カウント/秒以下となっているSiC系膜を有する
ことを特徴とする半導体装置。
素子が形成された半導体基板上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜に、前記第1の開口部を形成する工程と、
前記第1の開口部内に埋め込まれた第1の配線層を形成する工程と、
チャンバー内において前記第1の配線層表面にNH3プラズマを発生させ、前記第1の配線層に対してNH3プラズマ処理を行う工程と、
前記チャンバー内に残留する窒素を含む反応生成物を除去する工程と、
前記チャンバー内において、前記第1の絶縁膜上及び前記第1の配線層上に、PECVD法によりSiC系膜を成膜する工程と、
前記SiC系膜上に、第2の絶縁膜を形成する工程と、
前記第2の絶縁膜及び前記SiC系膜に、前記第1の配線層に達する第2の開口部を形成する工程と
を有することを特徴とする半導体装置の製造方法。
付記11記載の半導体装置の製造方法において、
前記第2の開口部を形成する工程の後に、前記第2の開口部内に埋め込まれた第2の配線層を形成する工程を更に有する
ことを特徴とする半導体装置の製造方法。
12…ゲートバルブ
14…スピンドル
16…NH3プラズマ処理用ヘッド
18…成膜用ヘッド
20…基板
21…層間絶縁膜
22…層間絶縁膜
22a…SiOC膜
22b…シリコン酸化膜
24…配線溝
26…配線層
28…バリアメタル層
30…Cu膜
32…Cuの窒化物層
34…SiC膜
36…SiOC膜
38…SiC膜
40…SiOC膜
42…シリコン酸化膜
44…ビアホール
46…配線溝
48…バリアメタル層
50…Cu膜
52…配線層
Claims (9)
- チャンバー内において基板表面にNH3プラズマを発生させ、前記基板に対してNH3プラズマ処理を行う工程と、
前記チャンバー内に残留する窒素を含む反応生成物を除去する工程と、
前記チャンバー内において、前記基板上に、PECVD法によりSiC系膜を成膜する工程と
を有することを特徴とするSiC系膜の成膜方法。 - 請求項1記載のSiC系膜の成膜方法において、
前記SiC系膜を成膜する工程では、メチルシランのガスを含んだ原料ガスを用いたPECVD法により、前記SiC系膜を成膜する
ことを特徴とするSiC系膜の成膜方法。 - 請求項1記載のSiC系膜の成膜方法において、
前記SiC系膜を成膜する工程では、メチルシランとCO2との混合ガスを原料ガスとして用いたPECVD法により、前記SiC系膜を成膜する
ことを特徴とするSiC系膜の成膜方法。 - 請求項1乃至3のいずれか1項に記載のSiC系膜の成膜方法において、
前記反応生成物を除去する工程では、プラズマを用いたドライクリーニングにより前記反応生成物を除去する
ことを特徴とするSiC系膜の成膜方法。 - 請求項1乃至3のいずれか1項に記載のSiC系膜の成膜方法において、
前記反応生成物を除去する工程では、前記チャンバー内の圧力を、前記基板に対してNH3プラズマ処理を行う工程後の圧力から更に減圧することにより前記反応生成物を除去する
ことを特徴とするSiC系膜の成膜方法。 - 請求項1乃至3のいずれか1項に記載のSiC系膜の成膜方法において、
前記反応生成物を除去する工程では、前記チャンバー内を不活性ガスでパージすることにより前記反応生成物を除去する
ことを特徴とするSiC系膜の成膜方法。 - 請求項1乃至6のいずれか1項に記載のSiC系膜の成膜方法において、
前記基板の表面には、配線層が形成されており、
前記基板に対してNH3プラズマ処理を行う工程では、NH3プラズマにより前記配線層の表面を還元する
ことを特徴とするSiC系膜の成膜方法。 - 請求項7記載のSiC系膜の成膜方法において、
前記基板に対してNH3プラズマ処理を行う工程では、NH3プラズマにより前記配線層の表面に窒化物層を形成する
ことを特徴とするSiC系膜の成膜方法。 - 素子が形成された半導体基板上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜に、前記第1の開口部を形成する工程と、
前記第1の開口部内に埋め込まれた第1の配線層を形成する工程と、
チャンバー内において前記第1の配線層表面にNH3プラズマを発生させ、前記第1の配線層に対してNH3プラズマ処理を行う工程と、
前記チャンバー内に残留する窒素を含む反応生成物を除去する工程と、
前記チャンバー内において、前記第1の絶縁膜上及び前記第1の配線層上に、PECVD法によりSiC系膜を成膜する工程と、
前記SiC系膜上に、第2の絶縁膜を形成する工程と、
前記第2の絶縁膜及び前記SiC系膜に、前記第1の配線層に達する第2の開口部を形成する工程と
を有することを特徴とする半導体装置の製造方法。
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US11/220,591 US20060205193A1 (en) | 2005-03-09 | 2005-09-08 | Method for forming SiC-based film and method for fabricating semiconductor device |
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US20100025852A1 (en) * | 2006-12-22 | 2010-02-04 | Makoto Ueki | Semiconductor device and method for manufacturing the same |
US7745282B2 (en) * | 2007-02-16 | 2010-06-29 | International Business Machines Corporation | Interconnect structure with bi-layer metal cap |
JP5015705B2 (ja) | 2007-09-18 | 2012-08-29 | ルネサスエレクトロニクス株式会社 | 層間絶縁膜形成方法、層間絶縁膜、半導体デバイス、および半導体製造装置 |
US8372489B2 (en) * | 2007-09-28 | 2013-02-12 | Tel Epion Inc. | Method for directional deposition using a gas cluster ion beam |
US20090200668A1 (en) * | 2008-02-07 | 2009-08-13 | International Business Machines Corporation | Interconnect structure with high leakage resistance |
US20090233004A1 (en) * | 2008-03-17 | 2009-09-17 | Tel Epion Inc. | Method and system for depositing silicon carbide film using a gas cluster ion beam |
US8202435B2 (en) * | 2008-08-01 | 2012-06-19 | Tel Epion Inc. | Method for selectively etching areas of a substrate using a gas cluster ion beam |
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