JP4179096B2 - Metallized film capacitors - Google Patents

Metallized film capacitors Download PDF

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JP4179096B2
JP4179096B2 JP2003288739A JP2003288739A JP4179096B2 JP 4179096 B2 JP4179096 B2 JP 4179096B2 JP 2003288739 A JP2003288739 A JP 2003288739A JP 2003288739 A JP2003288739 A JP 2003288739A JP 4179096 B2 JP4179096 B2 JP 4179096B2
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capacitor
metallized film
heat
outer case
film capacitor
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JP2005057175A (en
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誠 冨田
聡 細川
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

本発明は、コンデンサ素子を外装ケース内に備え、外装ケース内に樹脂充填されてなるケースモールド型で乾式の金属化フィルムコンデンサに関するものである。   The present invention relates to a case mold type dry metallized film capacitor provided with a capacitor element in an outer case and filled with resin in the outer case.

近年、ケースモールド型乾式フィルムコンデンサは、従来の家電分野だけではなく、車両分野をはじめとしてあらゆる分野に展開されている。特にエンジンとモータの両方で駆動させるハイブリッド車等において、モータを駆動するインバータ回路の平滑用等に用いられ、エンジンルーム等に設置される場合、高温にさらされるだけなく、軽量小型化高密度実装により発熱体の近傍に設置されるケースが多くなる。   In recent years, case mold type dry film capacitors have been developed not only in the conventional home appliance field but also in various fields including the vehicle field. Especially in hybrid vehicles driven by both engine and motor, it is used for smoothing the inverter circuit that drives the motor. This increases the number of cases installed near the heating element.

このような、外からコンデンサ内部へ受ける熱の影響や、逆に内部から外へ発する熱の影響を小さくするためには、コンデンサ内部における発熱体であり、かつ電荷蓄積のコンデンサとしての主機能を行なうコンデンサ素子の周辺部を大きくすればよい。しかしこれはコンデンサ全体が大きくなり、小型軽量化の要求に反する。すなわち、車両用に用いるケースモールド型のコンデンサには、高温に耐え得る性能を備え、しかも小型化の要求に対応させるという相反する性能を同時に満足する必要がある。   In order to reduce the influence of the heat received from the outside to the inside of the capacitor and the influence of the heat emitted from the inside to the outside, the main function of the capacitor as a heating element and a charge storage capacitor is What is necessary is just to enlarge the peripheral part of the capacitor | condenser element to perform. However, this increases the overall size of the capacitor, which is contrary to the demand for small size and light weight. That is, a case mold type capacitor used for a vehicle has to have a performance capable of withstanding a high temperature and satisfy simultaneously a contradictory performance of meeting a demand for miniaturization.

図４は従来の耐熱性を向上させたフィルムコンデンサ構造を示しており、１３はコンデンサ素子、１１は金属化フィルム、１２はコンデンサ素子最外層に配置して、外部からの熱影響を緩和する断熱材を示す（特許文献１参照）。   FIG. 4 shows a conventional film capacitor structure with improved heat resistance, wherein 13 is a capacitor element, 11 is a metallized film, and 12 is placed on the outermost layer of the capacitor element to reduce heat effects from the outside. The material is shown (see Patent Document 1).

通常、フィルムコンデンサにおいては、金属化フィルムを巻回したコンデンサ素子最外層には、素子本体を機械的応力に対して保護することを目的として厚手のフィルム等を配置しているが、図４で示された従来のフィルムコンデンサでは、コンデンサ素子最外層には、この厚手のフィルムの代わり、あるいはその上層部に断熱性の高い材質を用いた断熱材１２を配列したことにより外部からコンデンサ素子１３本体への熱影響を緩和している。
特開昭５９−１９７１２０号公報（第３図） Usually, in a film capacitor, a thick film or the like is disposed on the outermost layer of a capacitor element wound with a metallized film for the purpose of protecting the element body against mechanical stress. In the conventional film capacitor shown, the capacitor element 13 main body is externally provided by arranging a heat insulating material 12 using a highly heat-insulating material on the outermost layer of the capacitor element instead of the thick film or on the upper layer portion thereof. Mitigates the thermal effects on
JP 59-197120 (Fig. 3)

しかし、従来の耐熱性を向上させたフィルムコンデンサは、外部からの熱影響を緩和することは多少できるが、大きなリプル電流で使用されるフィルムコンデンサにおいてはコンデンサ素子自身の発熱が内部にこもり、結果的に温度上昇が大きくなるという課題を有していた。   However, conventional film capacitors with improved heat resistance can alleviate the effect of heat from the outside, but in film capacitors used with large ripple current, the heat generated by the capacitor element itself is trapped inside, resulting in In particular, there has been a problem that the temperature rise becomes large.

本発明は、コンデンサ素子自身の発熱を放熱させ、かつ、外部からの熱影響を緩和することにより、高耐熱フィルムコンデンサを提供することを目的とする。   An object of the present invention is to provide a high heat-resistant film capacitor by dissipating heat generated by the capacitor element itself and mitigating the influence of heat from the outside.

本発明の金属化フィルムコンデンサは、上記課題を解決するために、金属化フィルムを巻回または積層した１つまたは複数のコンデンサ素子と、前記コンデンサ素子を内蔵した略直方体形状の外装ケースとを備え、前記外装ケース内に樹脂充填した金属化フィルムコンデンサであって、前記外装ケースの外側面のうち少なくとも１つの面に金属板部とシリコン系発泡材よりなる樹脂製の断熱材の二層構造を有する放熱板を配したものである。 In order to solve the above problems, a metallized film capacitor of the present invention includes one or a plurality of capacitor elements wound or laminated with a metallized film, and a substantially rectangular parallelepiped outer case containing the capacitor element. A metallized film capacitor filled with resin in the outer case, wherein a two-layer structure of a resin heat insulating material made of a metal plate portion and a silicon-based foam material is provided on at least one of the outer surfaces of the outer case. The heat sink which has is arranged.

さらに、本発明の金属化フィルムコンデンサは、金属化フィルムを巻回または積層した１つまたは複数のコンデンサ素子と、前記コンデンサ素子を内蔵した略直方体形状の外装ケースとを備え、前記外装ケース内に樹脂充填した金属化フィルムコンデンサであって、前記外装ケースの外側面のうち少なくとも１つの面に放熱板を配し、この放熱板を配した面に、前記放熱板と所定の間隔をあけて電気素子が取り付けられたものである。   Furthermore, the metallized film capacitor of the present invention comprises one or a plurality of capacitor elements wound or laminated with a metallized film, and a substantially rectangular parallelepiped outer case containing the capacitor element, and the outer case includes A metallized film capacitor filled with a resin, wherein a heat radiating plate is disposed on at least one of the outer surfaces of the exterior case, and the heat radiating plate is disposed on the surface on which the heat radiating plate is disposed with a predetermined gap therebetween. The element is attached.

また放熱板は、金属板と断熱材の二層構造にしたものである。 Moreover, the heat sink has a two-layer structure of a metal plate and a heat insulating material.

以上のように、外装ケースに放熱板を備えることにより、内蔵するコンデンサ素子自身の発熱を放熱し、かつ、外部からの熱影響を緩和することにより、高耐熱フィルムコンデンサとすることができる。   As described above, by providing the heat sink in the outer case, the heat generated by the built-in capacitor element itself can be dissipated and the influence of heat from the outside can be reduced, whereby a high heat resistance film capacitor can be obtained.

また、外部からの熱影響を受けにくいことで、コンデンサ近傍に発熱体を設置することができ、ユニット全体の小型化に寄与する。   In addition, since it is not easily affected by heat from the outside, a heating element can be installed in the vicinity of the capacitor, contributing to downsizing of the entire unit.

以下、本発明の実施の形態について、図１から図３を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 3.

（実施の形態１）
図１において、１はコンデンサ素子、２は充填樹脂、３は外装ケース、４は放熱板、５は電極部、６はスイッチング素子モジュールを示す。 (Embodiment 1)
In FIG. 1, 1 is a capacitor element, 2 is a filling resin, 3 is an exterior case, 4 is a heat sink, 5 is an electrode portion, and 6 is a switching element module.

以上のように構成されたケースモールド型乾式コンデンサについて、その動作を説明する。   The operation of the case mold type dry capacitor configured as described above will be described.

コンデンサ素子１は金属化フィルムを巻回または積層し、その両端に金属溶射してなる電極部５を設けたものである。そしてこの電極部５に電圧を印加して電荷蓄積を行なう。このコンデンサ素子１を樹脂製の略直方体形状の外装ケース３に内蔵し、充填樹脂２を充填している。この充填樹脂２は、コンデンサ素子１における自己発熱を放熱させると同時に、塵埃や水分等からコンデンサ素子１を保護する。また、外装ケース３はコンデンサ素子１とモールド樹脂２を保持するものであり、外的な機械的衝撃からコンデンサ素子１を保護する。 The capacitor element 1 is obtained by winding or laminating a metallized film and providing electrode portions 5 formed by metal spraying at both ends thereof. And performing charge storage voltage to the electrode unit 5 by indicia pressure. The capacitor element 1 is built in a substantially rectangular parallelepiped outer case 3 made of resin and filled with a filling resin 2. The filling resin 2 radiates self-heating in the capacitor element 1 and at the same time protects the capacitor element 1 from dust and moisture. The outer case 3 holds the capacitor element 1 and the mold resin 2 and protects the capacitor element 1 from an external mechanical shock.

さらに、図１で示すように、略直方体形状の外装ケース３の外側上面に放熱板４を配している。この放熱板４はアルミ製であり、外装ケースに接着剤によって取り付けている。   Further, as shown in FIG. 1, a heat radiating plate 4 is disposed on the outer upper surface of the substantially rectangular parallelepiped outer case 3. The heat sink 4 is made of aluminum and is attached to the exterior case with an adhesive.

なお、本実施の形態においては、コンデンサを設置する実施例として、ハイブリッド車のインバータ回路に用いる場合を示しており、インバータ回路を構成する、スイッチング素子モジュール６の近辺にコンデンサを設置させている。そして、本実施の形態におけるコンデンサの外装ケース３の外側面のうち、スイッチング素子モジュール６に最も近い面に放熱板４を配している。   In the present embodiment, as an example of installing a capacitor, a case where the capacitor is used in an inverter circuit of a hybrid vehicle is shown, and the capacitor is installed in the vicinity of the switching element module 6 constituting the inverter circuit. And the heat sink 4 is distribute | arranged to the surface nearest to the switching element module 6 among the outer surfaces of the exterior case 3 of the capacitor | condenser in this Embodiment.

以上のように、本実施の形態によればコンデンサ素子１に電極部５を通して電流が流れると、コンデンサ素子１の損失分による熱が発生するが、コンデンサ素子１周囲に設置された充填樹脂２と外装ケース３を通じて外部に放熱される。   As described above, according to the present embodiment, when a current flows through the electrode portion 5 through the capacitor element 1, heat is generated due to the loss of the capacitor element 1, but the filling resin 2 installed around the capacitor element 1 and Heat is radiated to the outside through the outer case 3.

一方、本実施の形態におけるケースモールド型で乾式のコンデンサ外部に設置されているスイッチング素子モジュール６の発熱は外装ケース３に設置された放熱板４により反射されて、外装ケース３、モールド樹脂２及びコンデンサ素子１に対する影響が緩和し、耐熱性が向上する。すなわち、この放熱板４は、本実施の形態でのコンデンサを設置した時に、発熱体に最も近い外装ケースの外側面に取り付け、発熱体からの熱を反射させ、コンデンサ素子１に対する外部からの熱影響を緩和させている。   On the other hand, the heat generated by the switching element module 6 installed outside the dry mold capacitor in the case mold type according to the present embodiment is reflected by the heat radiating plate 4 installed in the outer case 3, and the outer case 3, the mold resin 2, and The influence on the capacitor element 1 is alleviated and the heat resistance is improved. In other words, when the capacitor according to the present embodiment is installed, the heat radiating plate 4 is attached to the outer surface of the outer case closest to the heating element, reflects heat from the heating element, and heat from the outside to the capacitor element 1 Mitigating the impact.

なお、本実施の形態においては、コンデンサを近傍に設置する発熱体の例として、スイッチング素子モジュール６を示したが、もちろんこれにこだわるわけではなく、その他の発熱体素子であってもよい。   In the present embodiment, the switching element module 6 is shown as an example of a heating element in which a capacitor is installed in the vicinity. However, of course, the present invention is not limited to this, and other heating element elements may be used.

そして、本実施の形態で示したように、コンデンサ近傍に発熱体を設置することができることから、本実施の形態のケースモールド型で乾式のコンデンサを使用した装置全体を小型化することができる。   As shown in the present embodiment, since the heating element can be installed in the vicinity of the capacitor, the entire apparatus using the dry-type capacitor in the case mold type of the present embodiment can be miniaturized.

なお、本実施の形態では、放熱板４をアルミ製としたが、アルミの他、銅、銀など、熱の反射性、放熱性がよいものが適しているので、材料コストととから適宜材料選定を行なえばよい。   In the present embodiment, the heat radiating plate 4 is made of aluminum. However, since aluminum, copper, silver or the like having good heat reflectivity and heat radiating properties are suitable, the material is appropriately selected from the material cost. You only have to make a selection.

さらに、本実施の形態では、放熱板４を、接着剤を用いて外装ケース３に取り付ける例を示したが、取り付ける方法は、この他両面テープなどでもよい。ただし、接着剤であっても、両面テープであっても、外装ケース３内のコンデンサ素子１からの熱伝導を妨げないようできるだけ層を薄くすることが必要である。   Furthermore, in this Embodiment, although the example which attaches the heat sink 4 to the exterior case 3 using the adhesive agent was shown, the method of attaching may be a double-sided tape etc. in addition to this. However, even if it is an adhesive or a double-sided tape, it is necessary to make the layer as thin as possible so as not to prevent heat conduction from the capacitor element 1 in the outer case 3.

（実施の形態２）
図２は、本実施の形態における金属化フィルムコンデンサを示し、７は放電抵抗器であり、本実施の形態において実施の形態１と同様の箇所については同一の符号を付して詳細な説明を省略する。そして、本実施の形態で、実施の形態１と異なるのは、放電抵抗器７を金属化フィルムコンデンサと一体化した点である。 (Embodiment 2)
FIG. 2 shows a metallized film capacitor according to the present embodiment. Reference numeral 7 denotes a discharge resistor. In the present embodiment, the same parts as those of the first embodiment are denoted by the same reference numerals and detailed description thereof is made. Omitted. In the present embodiment, the difference from the first embodiment is that the discharge resistor 7 is integrated with a metallized film capacitor.

以下、本実施の形態における金属化フィルムコンデンサについて、図２および図３を用いてその動作を説明する。なお図３は、本実施の形態における金属化フィルムコンデンサをハイブリッド車用インバータ回路に用いた電気回路の概略を示した図である。   Hereinafter, the operation of the metalized film capacitor according to the present embodiment will be described with reference to FIGS. FIG. 3 is a diagram showing an outline of an electric circuit using the metallized film capacitor in the present embodiment for an inverter circuit for a hybrid vehicle.

図２および図３において、放電抵抗器７はコンデンサ素子１に蓄積した電荷を放電する作用を有し、メンテナンス時等で、コンデンサ素子１に蓄積した電荷をできるだけ早く放電させ、安全に作業できるようにするために設けることを必要とされているものである。   2 and 3, the discharge resistor 7 has a function of discharging the electric charge accumulated in the capacitor element 1, so that the electric charge accumulated in the capacitor element 1 can be discharged as soon as possible during maintenance, etc. It is necessary to provide it to make it.

そして放電抵抗器７は、本実施の形態のコンデンサと並列に接続され、回路がオフになってから回路電圧を規定時間内に規定電圧以下にするため設置されている。このため、本実施の形態のコンデンサの静電容量が大きく、回路電圧が高い場合、抵抗値を下げる必要があり、その結果、回路動作中の発熱量は極めて高くなる。 The discharge resistor 7 is connected in parallel with the capacitor of this embodiment, the circuit is provided to the specified voltage within the specified time the circuit voltage from turned to off. For this reason, when the capacitance of the capacitor of the present embodiment is large and the circuit voltage is high, it is necessary to lower the resistance value. As a result, the amount of heat generated during circuit operation becomes extremely high.

ここで、図２で示すように、放電抵抗器７と向かい合う外装ケース３の外側面に金属板４を設けることにより、放電抵抗器７の発生する熱を反射し、コンデンサ素子１の温度上昇値は低くすることができる。その結果、本実施の形態における金属化フィルムコンデンサと放電抵抗器７を一体化することができる。なお、本実施の形態における放電抵抗器７は、抵抗素子群を基板上に配したもので、図２で示すように、外装ケース３の外側面に取付用ボスを４本立て、該外側面と距離をおいて取り付けるようにしている。また基板はこの取付用ボスにねじ止めしてもよいし、ボス先端に加工された部分を有し、はめ込み式で固定させてもよい。また、取付用ボスは、外装ケースを成形品とし、予め設けておくようにすれば、部品点数が削減できる。   Here, as shown in FIG. 2, by providing the metal plate 4 on the outer surface of the outer case 3 facing the discharge resistor 7, the heat generated by the discharge resistor 7 is reflected, and the temperature rise value of the capacitor element 1. Can be lowered. As a result, the metallized film capacitor and the discharge resistor 7 in the present embodiment can be integrated. The discharge resistor 7 in the present embodiment is a resistor element group arranged on a substrate. As shown in FIG. 2, four mounting bosses are set up on the outer surface of the outer case 3, and the outer surface and They are installed at a distance. Further, the substrate may be screwed to the mounting boss, or may have a portion processed at the tip of the boss, and may be fixed by fitting. Further, the mounting boss can be reduced in the number of parts if the outer case is formed as a molded product and is provided in advance.

なお、本実施の形態では、抵抗値２５ｋΩ、回路電圧ＤＣ７５０Ｖ、消費電力が２２．５Ｗである。表１に放熱板４を設けた場合と設けない場合のコンデンサ素子１の温度上昇値結果を示す。表１に示すように、放熱板４を設けることにより、設けない場合に比べ、７Ｋも温度上昇を抑えることができた。   In this embodiment, the resistance value is 25 kΩ, the circuit voltage is DC 750 V, and the power consumption is 22.5 W. Table 1 shows the temperature rise value results of the capacitor element 1 with and without the heat sink 4. As shown in Table 1, by providing the heat radiating plate 4, a temperature increase of 7K could be suppressed as compared with the case where it was not provided.

Figure 0004179096
Figure 0004179096

また、本実施の形態では金属板４の材質はアルミとしたが、銅、銀など熱反射性、放熱性の優れるものであれば同様の効果が得られる。   In the present embodiment, the metal plate 4 is made of aluminum, but the same effect can be obtained as long as it has excellent heat reflectivity and heat dissipation such as copper and silver.

また、本実施の形態では放熱体の一例として放電抵抗器を用いる例を示したが、これに限られるものではなく、その他の発熱体であっても本実施の形態による効果は得られる。 In this embodiment, an example in which a discharge resistor is used as an example of a heat radiating body is shown. However, the present invention is not limited to this, and the effect of this embodiment can be obtained even with other heat generating bodies.

以上のように、本実施の形態によれば、放電抵抗器７等の発熱体と向かい合う外装ケース３の外側面に放熱板４を設けることにより、放電抵抗器７を金属化フィルムコンデンサと一体化することができ、ユニットとして小型化に寄与することができる。 As described above, according to this embodiment, by providing the heat radiating plate 4 to the outer surface of the case 3 facing the heating element such as a discharge resistor 7, integrated discharge resistor 7 and metalized film capacitor And can contribute to miniaturization as a unit.

（実施の形態３）
本実施の形態について、本実施の形態における金属化フィルムコンデンサを示す図２を用いて説明する。 (Embodiment 3)
The present embodiment will be described with reference to FIG. 2 showing the metallized film capacitor in the present embodiment.

図２において、８は断熱材であり、図２において、実施の形態２と異なるのは、金属板４と外装ケース３の間に断熱材８を設けた二層構造である点である。 In FIG. 2 , reference numeral 8 denotes a heat insulating material. In FIG. 2 , the difference from the second embodiment is that the heat insulating material 8 is provided between the metal plate 4 and the outer case 3.

以下、本実施の形態におけるケースモールド型乾式コンデンサについて、その動作を説明する。   Hereinafter, the operation of the case mold type dry capacitor in the present embodiment will be described.

断熱材８は外部からの熱影響を緩和する作用を有する。金属板４と外装ケース３の間に断熱材８を設けることにより、コンデンサ素子１の温度上昇値は実施の形態２より更に低くすることができ、その結果、耐熱性を向上することができる。   The heat insulating material 8 has the effect | action which relieve | moderates the heat influence from the outside. By providing the heat insulating material 8 between the metal plate 4 and the outer case 3, the temperature rise value of the capacitor element 1 can be made lower than that in the second embodiment, and as a result, the heat resistance can be improved.

なお本実施の形態では、断熱材８は、シリコン系の発泡材を使用したが、熱伝導性の低い構造及び、材質であれば同じ効果が得られる。   In the present embodiment, a silicon-based foam material is used as the heat insulating material 8, but the same effect can be obtained as long as the structure and material have low thermal conductivity.

なお、実施の形態２と同じ電気的条件で、表１にコンデンサ素子１の温度上昇値結果を示す。表１で示すように、金属板のみを用いた放熱板よりもさらに温度上昇を２Ｋ抑えることができ、放熱板を全く用いない場合に比べ、９Ｋも温度上昇を抑えることができた。   Table 1 shows the temperature rise value result of capacitor element 1 under the same electrical conditions as in the second embodiment. As shown in Table 1, the temperature rise could be further suppressed by 2K compared to the heat sink using only the metal plate, and the temperature rise could be suppressed by 9K compared to the case where no heat sink was used.

なお、実施の形態１から３において金属板に放熱用フィンを設けると、さらに放熱性を高めることができる。   In addition, if the fin for heat dissipation is provided in the metal plate in Embodiments 1 to 3, the heat dissipation can be further improved.

本発明の金属化フィルムコンデンサは、平滑用コンデンサとして広く一般に用いることができ、特に車載用インバータ回路の平滑用やフィルタ用などに有用である。   The metallized film capacitor of the present invention can be widely used as a smoothing capacitor, and is particularly useful for smoothing a vehicle inverter circuit, for a filter, and the like.

本発明の金属化フィルムコンデンサの実施の形態１における概略図Schematic in Embodiment 1 of the metallized film capacitor of the present invention 本発明の金属化フィルムコンデンサの実施の形態２および３における概略図Schematic diagram in Embodiments 2 and 3 of the metallized film capacitor of the present invention 本発明の金属化フィルムコンデンサの実施の形態２における金属化フィルムコンデンサをハイブリッド車用インバータ回路に用いた電気回路の概略を示した図The figure which showed the outline of the electric circuit which used the metallized film capacitor in Embodiment 2 of the metallized film capacitor of this invention for the inverter circuit for hybrid vehicles 従来の耐熱性を向上させたフィルムコンデンサ概略図Schematic diagram of conventional film capacitor with improved heat resistance

符号の説明Explanation of symbols

１ コンデンサ素子
２ 充填樹脂
３ 外装ケース
４ 放熱板
７ 放電抵抗器
８ 断熱材 DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Filling resin 3 Exterior case 4 Heat sink 7 Discharge resistor 8 Heat insulating material

Claims (4)

金属化フィルムを巻回または積層した１つまたは複数のコンデンサ素子と、前記コンデンサ素子を内蔵した略直方体形状の外装ケースとを備え、前記外装ケース内に樹脂充填した金属化フィルムコンデンサであって、前記外装ケースの外側面のうち少なくとも１つの面に金属板部とシリコン系発泡材よりなる樹脂製の断熱材の二層構造を有する放熱板を配した金属化フィルムコンデンサ。 One or a plurality of capacitor elements wound or laminated with a metallized film, and a substantially rectangular parallelepiped outer case containing the capacitor element, a metallized film capacitor filled with resin in the outer case, A metallized film capacitor in which a heat radiating plate having a two-layer structure of a heat insulating material made of a resin made of a metal plate portion and a silicon-based foam material is disposed on at least one surface of the outer case. 前記シリコン系発泡材よりなる樹脂製の放熱板の断熱材を、金属部と外装ケースの間に挟んで配した請求項１記載の金属化フィルムコンデンサ。The metallized film capacitor according to claim 1, wherein a heat insulating material made of a resin heat radiation plate made of the silicon-based foam material is disposed between a metal portion and an outer case. 金属化フィルムを巻回または積層した１つまたは複数のコンデンサ素子と、前記コンデンサ素子を内蔵した略直方体形状の外装ケースとを備え、前記外装ケース内に樹脂充填した金属化フィルムコンデンサであって、前記外装ケースの外側面のうち少なくとも１つの面に放熱板を配し、この放熱板を配した面に、前記放熱板と所定の間隔をあけて電気素子が取り付けられた金属化フィルムコンデンサ。 One or a plurality of capacitor elements wound or laminated with a metallized film, and a substantially rectangular parallelepiped outer case containing the capacitor element, a metallized film capacitor filled with resin in the outer case, A metallized film capacitor in which a heat radiating plate is disposed on at least one of the outer surfaces of the outer case, and an electric element is attached to the surface on which the heat radiating plate is disposed at a predetermined interval from the heat radiating plate. 電気素子は放電抵抗器である請求項３記載の金属化フィルムコンデンサ。 4. A metallized film capacitor as claimed in claim 3 , wherein the electrical element is a discharge resistor.
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