JP4165940B2 - Processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a process equipment which can improve the operation rate of each processing unit in a production line which is disposed a different processor of processing tact line with each other.
[0002]
[Prior art]
For example, in manufacturing a liquid crystal panel, in the step of connecting the lead of an IC component that drives liquid crystal to the transparent electrode formed on the glass substrate, an anisotropic conductive sheet is placed on the transparent electrode arrangement portion of the substrate. The transparent electrode and the lead are connected by pasting and placing the lead part of the IC component thereon and heating and pressing.
[0003]
An anisotropic conductive sheet is a sheet in which metal particles or metal-plated particles are dispersed in a resin, as is well known, and dispersed in a portion that is strongly pressed when pressed and heated. show conductivity plated particles are in contact with each other, the other portion shows a insulating.
[0004]
In a conventional liquid crystal panel production line, as shown in FIG. 7, an ACF attachment for attaching an anisotropic conductive sheet (hereinafter sometimes abbreviated as ACF) on a substrate along a substrate transfer line 40. Machine 41, IC mounting machine 42 for mounting the IC component on the substrate, and pressurizing machine 43 for connecting the transparent electrode and the lead by heating and pressurizing the lead of the IC component to the substrate via the ACF. . In addition, when referring to any of these ACF sticking machines 41, IC mounting machines 42, and pressurizing machines 43, they are collectively referred to as processing machines.
[0005]
In these processing machines, an XY table 44 that positions a substrate with respect to each processing unit and performs a required process is configured to move to the transfer line 40 and deliver the substrate to the transfer line 40. It is not necessary to separately provide a transfer means having a complicated structure for transferring a substrate between the line and each processing machine, thereby simplifying the structure and reducing the equipment cost.
[0006]
[Problems to be solved by the invention]
By the way, in the ACF sticking machine 41, the IC mounting machine 42, and the pressurizing machine 43, there is a variation in processing tact per IC component. For example, the ACF sticking machine 41 may be 5 to 10 seconds, the IC mounting machine 42 may be 3 to 6 seconds, and the pressure machine 43 may be 10 to 30 seconds. In this case, the flow of the substrate will stagnate before the pressure machine 43, There was a problem that the operating rate of the previous two processing machines was lowered, and the overall productivity was significantly lowered.
[0007]
In addition, when one processing machine stops due to trouble or inspection, there is also a problem that the entire line does not function.
[0008]
Further, particularly in the electrode connection line by ACF, the resin starts a curing reaction by heating the ACF by the ACF sticking machine 41, and for that reason, after being discharged from the ACF sticking machine 41, until the main pressurization by the pressurizing machine 43. When a long time elapses, there is a problem that the electrode connection quality by the ACF may deteriorate.
[0009]
As a means to solve these problems, it is conceivable to divide the transfer line into a plurality of lines in the processing machine part with a long processing tact, and arrange the processing machines in each of them. However, the equipment of the transfer line is large. There is a problem that the equipment cost becomes high. In addition, it is conceivable to arrange an arbitrary number of various processing machines for one transfer line and to arrange transfer means for transferring substrates between the transfer lines to each processing machine. However, since a large number of transfer means are required, there is a problem that the cost increases.
[0010]
The present invention is the light of the conventional problems, and its object is to provide a process equipment which can improve the operation rate of each processing unit in a production line which is disposed a different processor of processing tact with each other in a line.
[0011]
[Means for Solving the Problems]
The processing apparatus according to the present invention includes a processing unit carrying in and out a processing unit, a processing unit for performing a predetermined process on the processing unit, and delivering the processing unit between the loading unit and the carrying out unit. Positioning means for moving and positioning the object to be processed, and bypass means for delivering the object to be processed between the loading means and the unloading means when the positioning means is separated from the loading means and the unloading means and a processing device, carry means and unloading means comprises a carrying rail which is arranged in a straight line at intervals therebetween unloading rail, bypass means is available between the loading rail unloading rails And a switching means for moving the relay rail between a rail connection position and a standby position where the relay rail is retracted to a position where it does not interfere with the positioning means. Characterized in that it consists of an arm which is rotatably supported in a horizontal axis around the one side, a rotary drive means for rotating the arm. According to the present invention, while the workpiece is received by the positioning means and processed by the processing means, the subsequent workpiece to be loaded can be unloaded via the bypass means as it is, It is possible to obtain a processing apparatus that can be bypassed as needed at low cost without separately providing a transfer means for transferring an object to be processed, and in a production line provided with processing apparatuses having different processing tacts. It is possible to level out the processing tact and improve the operating rate and productivity at a low cost.
[0012]
Also, only the position switching RELAY rail can perform bypass switching of the workpiece, it is possible to obtain the above effects by a simple and inexpensive structure.
[0013]
Furthermore, switching means, and arm the relay rail is rotatably supported on the horizontal axis around the fixed and one side, since composed of a rotary drive means for rotating the arm, the relay only rotation of the arm The position of the rail can be switched, and the relay rail can be positioned stably and accurately with a simpler configuration.
[0014]
[0015]
[0016]
[0017]
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a process equipment of the present invention will be described with reference to FIGS.
[0019]
FIG. 1 shows a schematic configuration of the processing apparatus 1. As shown in FIG. 4, the processing apparatus 1 in this embodiment includes an ACF sticking machine 1 (A) for sticking an ACF to a substrate of a liquid crystal panel, and an IC mounting machine 1 for mounting an IC component for driving a liquid crystal on the substrate. (B) or a pressurizing machine 1 (C) that performs main pressurization of the ACF to connect the transparent electrode of the substrate and the electrode of the IC component, and each processing means 2 is configured according to the processing content. The overall configuration is the same.
[0020]
In FIG. 1, a processing means 2 is disposed at the rear portion of the processing apparatus 1, and a carry-in rail 3 and a carry-out rail 4 are arranged in a straight line on both sides of the front portion with an appropriate interval in the central portion. Reference numeral 5 denotes an XY table serving as a positioning means for positioning a received substrate with respect to the processing means 2 while delivering a substrate to be processed between the carry-in rail 3 and the carry-out rail 4.
[0021]
The XY table 5 includes a Y table 6 movable in the Y-axis direction between a delivery position at the lower part of the space between the carry-in rail 3 and the carry-out rail 4 and an arbitrary processing position at the lower part of the processing means 2. The X table 7 is arranged so as to be movable in the X-axis direction orthogonal to the Y-axis direction, and the delivery rail 8 is arranged to be movable up and down on both sides of the X table 7 in the Y-axis direction. The delivery rail 8 is in a state of being connected to the carry-in rail 3 and the carry-out rail 4 at the raised position, and is arranged below the board installation surface of the X table 7 to deliver the board to the X table 7 at the lowered position. Has been. Reference numeral 8 a denotes a connecting member for both delivery rails 8. Reference numeral 6a denotes a drive means for the Y table 6 comprising a drive motor and a ball screw feed mechanism, and reference numeral 7a denotes a drive means for the X table 7. 9a is a guide rail for the Y table 6, and 9b is a guide rail for the X table 7.
[0022]
At the front part of the space between the carry-in rail 3 and the carry-out rail 4, while the XY table 5 is moving from this space toward the processing means 2, the board subsequently carried in from the carry-in rail 3 is carried out. Bypass means 10 for delivering toward the rail 4 is disposed. The bypass means 10 includes a relay rail 11 that can be connected between the carry-in rail 3 and the carry-out rail 4. The relay rail 11 is fixed to an arm 12 that is supported so as to be rotatable around a horizontal axis, It is configured to move between a rail connection position indicated by a solid line in FIG. 1B and a standby position retracted to a position that does not interfere with the XY table 5 indicated by an imaginary line.
[0023]
Detailed configurations of the carry-in and carry-out rails 3 and 4 and the bypass means 10 will be described with reference to FIGS. The carry-in and carry-out rails 3 and 4 are configured so as to be able to convey the substrate by belt driving, and include belt driving means 13a and 14a. Further, as shown in FIG. 2, the carry-in and carry-out rails 3 and 4 are provided with rail width adjusting means 13b and 14b so that the rail width can be varied according to the size of the board. Therefore, the arm 12 is provided with an adjustment long groove 12a for adjusting the position of one rail 11, and the rail 11 is fixed at an arbitrary position so that the rail width of the relay rail 11 can be varied. ing.
[0024]
The arm 12 is fixed via attachment brackets 18 in the vicinity of both ends of a rotating shaft 17 whose both ends are rotatably supported by a pair of bearings 16 fixed to a support plate 15. A rotation drive gear 19 is fixed at the center of the rotary shaft 17, and a rack member 20 meshing with the gear 19 is supported by a slide guide 21 fixed to the support plate 15 so as to be movable in the vertical direction. The lower end of the rack member 20 is connected to the cylinder 22 via the connecting piece 20a, and the cylinder 22 is fixed to the mounting bracket 23. Thus, the rack member 20 moves up and down as the cylinder 22 moves in and out, the arm 12 rotates through the gear 19, and the position of the relay rail 11 is switched between the rail connection position and the standby position. In order to adjust the height of the relay rail 11, the support plate 15 is fixed to the upper portion of the mounting bracket 23 so that the vertical position can be adjusted. Reference numeral 24 denotes a height adjusting bolt.
[0025]
Further, as shown in FIG. 3, the substrate transported to the front end of the carry-in rail 3 is supplied onto the delivery rail 8 by pushing the rear end, and the substrate on the delivery rail 8 is discharged to the front end of the carry-out rail 4. Alternatively, in order to pass over the relay rail 11 to the tip of the carry-out rail 4, the feeding means 25 is disposed at the front portion of the bypass means 10. The feeding means 25 includes a dog 26 that pushes the rear end of the substrate, an attachment arm 27 for the dog 26, and a drive means 28 that moves and drives the attachment arm 27.
[0026]
Next, a liquid crystal panel production line 30 using the processing apparatus 1 will be described with reference to FIG. In the production line 30 of this embodiment, the processing tact in each processing apparatus 1 is leveled according to the processing tact of each of the ACF sticking machine 1 (A), the IC mounting machine 1 (B), and the pressurizing machine 1 (C). As shown, the ACF sticking machine 1 (A) and the IC mounting machine 1 (B) are arranged one by one, and the two pressurizing machines 1 (C) are arranged in parallel. The two pressurizing machines 1 (C) are the same as the processing apparatus 1 provided with the bypass means 10 in addition to the XY table 5 as the positioning means, and the ACF sticking machines 1 (one by one) ( A) and the IC mounting machine 1 (B) are provided with only the XY table 5 as the positioning means without providing the bypass means 10.
[0027]
Next, in the production line 30 having the above-described configuration, a process of attaching the ACF to the substrate of the liquid crystal panel, mounting the IC component, and connecting the substrate and the electrode of the IC component will be described. The substrate on which the electrodes are formed is put into the production line 30 and supplied from the carry-in rail 3 of the ACF sticking machine 1 (A) onto the XY table 5 as positioning means, and the processing means 2 of this ACF sticking machine 1 (A). The ACF is pasted at a predetermined position on the substrate and then carried out by the carry-out rail 4. Next, the substrate is supplied onto the XY table 5 from the carry-in rail 3 of the IC mounter 1 (B), and the IC components are mounted by the processing means 2 of the IC mounter 1 (B), and then to the carry-out rail 4. Are carried out. Next, the substrate is supplied onto the XY table 5 from the carry-in rail 3 of the superior pressurizer 1 (C), and the processing means 2 of the pressurizer 1 (C) uses the electrode part of the IC component and the transparent electrode of the substrate. The electrode part of the IC component is heated and pressurized from above with the ACF interposed therebetween, thereby connecting the substrate and the electrode of the component. The tact of the electrode connecting operation due to this pressurization is long, and if the substrate that has been processed by the ACF sticking machine 1 (A) and the IC mounting machine 1 (B) is supplied during the connecting operation, The bypassing means 10 of the pressurizing machine 1 (C) is operated, the substrate is bypassed, and the lower pressurizing machine 1 (C) is supplied. As a result, the substrate is supplied onto the XY table 5 from the carry-in rail 3 of the lower pressurizer 1 (C), and the substrate and the component electrodes are connected by the processing means 2 of the pressurizer 1 (C). Thereafter, when the connection operation by the upper pressurizer 1 (C) is completed, it is unloaded from the XY table 5 by the carry-out rail 4 and the bypass means 10 of the lower pressurizer 1 (C) is operated so that the subsequent process is continued. It is carried out. Moreover, when the electrode connection by the lower pressure machine 1 (C) is completed, it is carried out to the subsequent process as it is.
[0028]
By repeating the above operation, even if the processing operation tact of the pressurizer 1 (C) is about twice as long as the processing operation tact of the ACF sticking machine 1 (A) and the IC mounting machine 1 (B), the production line In the state where the processing operation tact of each of the 30 processing apparatuses 1 is leveled, the ACF main pressurization can be performed to connect the substrate and the IC component electrodes.
[0029]
As described above, in the production line 30 of the present embodiment, a plurality of processing apparatuses 1 having the bypass means 10 are installed to level the processing tact, so that the operating rate of each processing apparatus 1 in the production line 30 is increased. The production line 30 with high productivity can be configured at low cost. Further, even when any one of the plurality of processing apparatuses 1 is stopped due to trouble or inspection, maintenance can be performed while continuing production without stopping the entire line. In addition, it is possible to connect the electrodes of the board and the parts with high productivity as described above, and for the connection of all the boards and parts, the main pressure can be applied almost evenly and quickly after the ACF is pasted, so a high quality connection can be achieved. Obtainable.
[0030]
Further, according to the processing apparatus 1 of the present embodiment, there is no need to provide a transfer means for transferring a substrate between each separately provided transfer line and each independent processing apparatus. Production equipment can be configured at low cost.
[0031]
Further, since the bypass means 10 is configured so that the bypass switching can be performed only by switching the position of the relay rail 11, the above effect can be achieved with a simple and inexpensive configuration. Since the position is switched only by the rotation of the arm 12, the relay rail 11 can be positioned stably and accurately with a simpler configuration.
[0032]
In the description of the above embodiment, since the processing operation tact of the pressurizer 1 (C) is long, an example in which only a plurality of pressurizers 1 (C) are installed is shown. It goes without saying that the number of processing apparatuses 1 to be installed may be appropriately set so that the processing operation tact in each processing apparatus is leveled according to the length of the processing operation tact of the processing apparatus 1.
[0033]
Further, in the bypass means 10 of the above-described embodiment, an example in which only the relay rail 11 is provided and the substrate feeding means 25 is separately provided is shown. However, a drive belt that can be driven is attached to the relay rail 11, or the rail You may comprise so that it may drive according to the conveyance belt of the carrying-in rail 3 or the carrying-out rail 4 when it positions in a connection position.
[0034]
In the above embodiment, the relay rail 11 is switched between the rail connection position and the standby position below the side by the arm 12 that can be turned up and down around the horizontal axis. However, as in the reference example shown in FIG. 5, the relay rail 11 may be configured to be movable between the rail connection position and the standby position obliquely above by an appropriate movable support mechanism using a parallel link mechanism or the like. good. Further, as in the reference example shown in FIG. 6, instead of the feeding means 25, an adsorption conveyance means 31 that adsorbs and conveys the substrate is disposed so as to be movable between the carry-in rail 3 and the carry-out rail 4, and the board is loaded. It is also possible to arbitrarily convey between the rail 3, the XY table 5, and the carry-out rail 4.
[0035]
【The invention's effect】
According to the processing apparatus of the present invention, while in position-decided Me means is performing the process in receiving and processing means to be processed, that the carried-in subsequent processing object as it is transported through the bypass means It is possible to obtain a processing device that can be bypassed at a low cost if necessary, leveling the processing tact on a production line in which processing devices having different processing tacts are arranged, and thereby improving the operating rate and productivity. It can be realized at low cost.
[0036]
Also, it is possible to easy enough position switching of RELAY rail at an inexpensive structure exhibits the above effects.
[0037]
Furthermore, switching means, and arm the relay rail is rotatably supported on the horizontal axis around the fixed and one side, since composed of a rotary drive means for rotating the arm, the relay only rotation of the arm The position of the rail can be switched, and the relay rail can be positioned stably and accurately with a simpler configuration.
[0038]
[0039]
[0040]
[0041]
[Brief description of the drawings]
FIG. 1 shows a schematic configuration of a processing apparatus according to an embodiment of the present invention, in which (a) is an overall plan view and (b) is a perspective view of a main part.
FIG. 2 is a plan view showing the configuration of carry-in means, carry-out means, and bypass means in the same embodiment.
3 is an AA arrow view of FIG.
FIG. 4 is a plan view conceptually showing the structure of the production line in the same embodiment.
FIG. 5 is a front view of a reference example of bypass means.
FIG. 6 is a perspective view of another reference example of bypass means.
FIG. 7 is a plan view conceptually showing the structure of a production line in a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Processing means 3 Carry-in rail 4 Carry-out rail 5 XY table (positioning means)
8 Delivery rail 10 Bypass means 11 Relay rail 12 Arm 17 Rotating shaft

Claims (1)

Processing object carrying-in means and carrying-out means, processing means for performing predetermined processing on the processing object, delivering the processing object between the carrying-in means and the carrying-out means, and moving the processing object toward the processing means and positioning means for positioning and, a processing device which includes a bypass means for transferring the object to be treated between the carrying means and the carrying-out means when spaced from between the positioning means carried means and unloading means The carry-in means and the carry-out means are composed of a carry-in rail and a carry-out rail arranged in a straight line with a gap therebetween, and the bypass means is a relay rail that can connect between the carry-in rail and the carry-out rail, and the relay rail. Switching means for moving the rail between a rail connection position and a standby position retracted to a position where it does not interfere with the positioning means, the switching means having a relay rail fixed and around one horizontal axis An arm which is rotatably supported, processing device characterized by comprising a rotary drive means for rotating the arm.

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