JP4160005B2 - Manufacturing method of airtight parts - Google Patents

Description

The present invention relates to a method for producing a gas-tight unit products to ensure airtightness and a substrate glass made of metal or ceramic in contact with the portion.

  2. Description of the Related Art Conventionally, in a structure where glass covers a hole provided in a metal base, such as a cap for a semiconductor device, various airtight structures have been provided in order to ensure airtightness at a contact portion between the metal base and glass. It is used. As an example, the structure described in Patent Document 1 is shown in FIG.

  In FIG. 4, reference numeral 102 denotes a metal cap body, which has a top plate portion 104 and a cylindrical portion 105, and a light transmitting window hole 103 is provided in the top plate portion 104. A window glass 108 is fixed inside the window hole 103. The window glass 108 is affixed to a glass plate 101 with a resin phase difference film 107 having a phase difference of λ / 4 with respect to the light source wavelength λ due to optical anisotropy via a resin transparent adhesive 106. It is what was done. The window glass 108 is bonded to the cap body 102 via a resin adhesive 106. In addition, a method using low-melting glass instead of the resin adhesive 106 is also widely known.

  As a method for forming an airtight part without using an adhesive, an alignment sealing method for maintaining airtightness by bonding with glass through an oxide film formed on a metal outer ring, or a method for forming a metal outer ring with glass. A compression sealing method that maintains hermeticity due to a difference in shrinkage has been widely known.

  According to the former method, a material in which the difference between the coefficients of thermal expansion of the metal outer ring and the glass is substantially equal is selected, the glass is heated to a temperature sufficient to wet the metal outer ring, and the inside is heated. Seal so that no distortion remains. On the other hand, according to the latter method, a material having a difference in thermal expansion coefficient between the metal outer ring and the glass is selected, and the thermal expansion coefficient of the metal outer ring contacting the outside of the glass is made larger than the thermal expansion coefficient of the glass. After being melted, it is cooled and sealed with a force for tightening the glass due to the difference in thermal shrinkage between the metal outer ring and the glass.

When the glass cannot be melted, as in Patent Document 1, the metal outer ring and the glass are bonded via a resin adhesive.
JP 2003-37326 A

  However, in the conventional configuration described in Patent Document 1, since the cap body and the window glass are bonded with an adhesive made of UV curable resin or thermosetting resin, outgas is generated from the adhesive after curing, The applied heat causes cracks in the adhesive, which adversely affects the performance of the electronic components contained. Furthermore, the resin adhesive is porous and inferior in airtightness and moisture resistance. Moreover, when using low melting glass, it had the subject that lead and bismuth contained in low melting glass are environmentally hazardous substances.

  Further, both the alignment sealing method and the compression sealing method need to be heated to a temperature at which the glass melts to 900 ° C. to 1100 ° C., and the coating of the antireflection film of the window glass, that is, the AR (Anti-Reflection) coating In addition, work such as pre-plating treatment needs to be performed after sealing, which makes the work complicated.

The present invention is intended to solve the conventional problems, without causing a crack outgas generation and the adhesive, without the use of environmentally hazardous substances, also possible without airtight unit products for complicated sealing step It aims at providing the manufacturing method of.

A method for manufacturing an airtight part according to the present invention is a method for manufacturing an airtight part having the above-described configuration, wherein the base is placed on a mold including an upper mold and a lower mold, and the glass plate is placed in the base. And placing the outer peripheral surface of the glass plate facing the inner peripheral surface formed by a part of the base, heating the temperature near the mold near the softening point temperature of the glass plate, The peripheral edge of the glass plate or the base and the peripheral edge of the glass plate are clamped in the thickness direction of the glass plate by the mold and the lower mold, and cooled in the clamped state. To do.

  In addition, according to the above method for manufacturing an airtight component, a glass plate that has been subjected to a treatment such as an antireflection film can be directly sealed to the metal outer ring at a relatively low temperature.

  In the method for manufacturing an airtight part according to the present invention, preferably, the step of pressing is performed in a plurality of stages, and the temperature in the vicinity of the mold is lowered from the vicinity of the softening point temperature of the glass plate as the later stage is reached. Let

  Preferably, the step of clamping is performed in a plurality of stages, and the pressure applied to the mold is increased as the later stage is reached.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
1 is a cross-sectional view of an airtight component according to Embodiment 1. FIG. Reference numeral 1 denotes a glass plate formed in a disk shape made of borosilicate hard glass, and 2 denotes a disk-shaped substrate made of alumina ceramic containing about 90% alumina. The base 2 is provided with a window hole 3, and the glass plate 1 is fitted into the window hole 3. Thus, a sealing portion 4 extending in the vertical direction is formed between the inner peripheral surface of the window hole portion 3 and the outer peripheral surface of the glass plate 1.

An example of the dimensions of each part is as follows. The substrate 2 has a thickness of 0.17 mm, and the window hole portion 3 has an inner diameter of 1.63 mm. The glass plate 1 is formed in a disk shape having a diameter of 1.59 mm and a thickness of 0.19 mm, and has a thermal expansion coefficient of 30 × 10 ⁻⁷ / ° C. to 80 × 10 ⁻⁷ / ° C. Preferably, the glass plate 1 has a thermal expansion coefficient of 57 × 10 ⁻⁷ / ° C., and at least one surface is provided with an AR coating (not shown) as an antireflection film. The substrate 2 is made of alumina ceramic and has a thermal expansion coefficient of 67 × 10 ⁻⁷ / ° C.

  The outer peripheral surface of the glass plate 1 and the base 2 are directly sealed in the sealing portion 4 without interposing another adhesive or the like. According to this, outgas does not generate | occur | produce from the adhesive agent after hardening which was the subject of the prior art, and a crack does not generate | occur | produce in the adhesive agent by the heat added later.

  The substrate 2 is not limited to alumina ceramic, and iron or iron alloy can also be used.

(Embodiment 2)
FIG. 2 is a cross-sectional view of the hermetic component in the second embodiment. Reference numeral 6 denotes a glass plate formed in a disc shape made of borosilicate hard glass. Reference numeral 7 denotes a cap body made of an iron-nickel alloy, which constitutes a base. The cap body 7 includes a top plate portion 8 and a cylindrical portion 9 extending from the top plate portion 8 in the vertical direction. A window hole portion 10 is provided in the top plate portion 8. The glass plate 6 is fitted into the tube upper portion 9 in close contact with the window hole portion 10, and a sealing portion 11 is formed between the outer peripheral surface of the glass plate 6 and the inner peripheral surface of the tube upper portion 9.

An example of the dimensions of each part is as follows. The cylindrical portion 9 has an inner diameter of 3.3 mm, the glass plate 6 is formed in a disk shape with a diameter of 3.25 mm and a thickness of 0.25 mm, and a thermal expansion coefficient of 30 × 10 ⁻⁷ / ° C. to 80 × 10. ^-7 / ° C. Preferably, the glass plate has a thermal expansion coefficient of 657 × 10 ⁻⁷ / ° C., and at least one surface is coated with an AR coating (not shown) as an antireflection film. The cap body 7 is made of an iron-nickel alloy and has a thermal expansion coefficient of 97 × 10 ⁻⁷ / ° C.

  The outer peripheral surface of the glass plate 6 and the cap body 7 are directly sealed at the sealing portion 11 of the cylindrical portion 9. According to this, outgas does not generate | occur | produce from the adhesive agent after hardening which was the subject of the prior art, and a crack does not generate | occur | produce in an adhesive agent by the heat added later.

  The substrate 7 is not limited to an iron-nickel alloy, and an alumina ceramic can be used.

(Embodiment 3)
FIGS. 3A to 3C are cross-sectional views showing the steps of the method for manufacturing the hermetic component in the third embodiment. This manufacturing method is a method for manufacturing the hermetic component of the second embodiment, and shows a manufacturing process of a cap for a semiconductor device. 3, the same components as those in FIG. 2 are denoted by the same reference numerals, and description thereof is omitted.

  In FIG. 3, reference numeral 12 denotes an upper die, which is a nonmagnetic corrosion-resistant cemented carbide having a flatness of Rms 0.03 μm or less coated with DLC (Diamond Like Carbon). Reference numeral 13 denotes a lower die, which is a nonmagnetic corrosion-resistant cemented carbide having a concave shape and is DLC coated. A pressing portion 14 that directly applies pressure to the glass plate 6 is formed in the peripheral portion of the lower mold 13, and a gap portion 15 that prevents direct pressure from being applied to the glass plate 6 is formed in an inner region thereof. .

  The DLC coating is effective for releasing the upper and lower molds 12 and 13 and the glass plate 6 and improving the life of the upper and lower molds 12 and 13.

  First, as shown in FIG. 3A, the glass plate 6 is mounted inside the top plate portion 8 of the cap body 7 and placed on the lower mold 13, and the upper mold 12 is attached to the cap body 7. Place at the top. At this time, the upper and lower molds 12 and 13 and the vicinity thereof are heated to a temperature in the vicinity of the softening point of the glass plate 6. For example, when a borosilicate hard glass having a softening point of 736 ° C. is used, it is heated from 600 ° C. to 736 ° C.

  Next, as shown in FIG. 3 (b), the top plate portion 8 of the cap body 7 is sandwiched and pressed by the upper mold 12 and the glass plate 6 is sandwiched and pressed by the pressing portion 14 of the lower mold 13. The clamping / pressing is performed with heating and cooling under the conditions shown in Table 1. That is, this process is performed in a plurality of stages, and the temperature in the vicinity of the mold is lowered from the vicinity of the softening point temperature of the glass plate 6 in the later stage. Further, the pressure applied to the upper and lower molds 12 and 13 is increased in the later stage. As a result, the cap for a semiconductor device shown in FIG.

  According to such a process, the peripheral part of the softened glass plate 6 spreads to the sealing part 11 by clamping and pressing. Furthermore, since it cools in the state which applied the pressure, the glass plate 6 will be supported by the sealing part 9 in the state which maintained the force which spreads toward the cylindrical part 9. FIG. Further, due to the difference in thermal expansion coefficient between the glass plate 6 and the cap body 7, the glass plate 6 is tightened by the cap body 7 and the sealing becomes strong.

  According to this method, unlike the conventional alignment sealing and compression sealing, it is not necessary to heat to the glass melting temperature, and the influence on the AR coating (not shown) formed on at least one surface of the glass plate 6 is small. .

  As in this embodiment, a method of forming a sealing portion between the inner peripheral surface of the substrate by sandwiching and pressing a glass plate with upper and lower molds is applied to the manufacture of the airtight component in the first embodiment. can do.

  The material of the cap for a semiconductor device to which the manufacturing method of the present embodiment is applied is not limited to the combination of borosilicate hard glass and iron-nickel, but is applied to hermetic sealing of metal or ceramic and glass. I can do it.

  According to the configuration of the hermetic component of the present invention, hermetic sealing between glass and metal or ceramic can be performed without melting the glass, which is useful for a cap for a semiconductor device or the like.

Sectional drawing of the airtight components in Embodiment 1 Sectional drawing of the airtight components in Embodiment 2 Sectional drawing which shows the process of the manufacturing method of the airtight components in Embodiment 3 Cross section of conventional airtight parts

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass plate 2 Base | substrate 3 Window hole 4 Sealing part 6 Glass plate 7 Cap main body 8 Top plate part 9 Cylindrical part 10 Window hole part 11 Sealing part 12 Upper metal mold 13 Lower metal mold 14 Holding part 15 Space | gap part 101 Glass Plate 102 Cap body 103 Window hole 104 Top plate portion 105 Cylindrical portion 106 Adhesive 107 Retardation film 108 Window plate glass

Claims (3)

In a method of manufacturing an airtight component comprising a substrate having a through hole and a glass plate hermetically sealing the through hole,
The base is placed on a mold including an upper mold and a lower mold,
The glass plate is placed in the base, with the outer peripheral surface of the glass plate facing the inner peripheral surface formed by a part of the base,
Heating the temperature near the mold near the softening point temperature of the glass plate,
The said upper die and the lower die, the periphery of the glass plate, or a peripheral portion of said substrate and said glass plate, nipped in the thickness direction of the glass plate,
A method for manufacturing an airtight part, wherein the cooling is performed in a pinched state. Performed dividing the clamping pressure step in a plurality of stages, in accordance becomes a later stage, the temperature of the mold near a process for producing gas-tight component according to claim 1 is lowered from the vicinity softening point temperature of said glass plate . The method for manufacturing an airtight part according to claim 1 or 2 , wherein the clamping step is performed in a plurality of stages, and the pressure applied to the mold is increased as the subsequent stage is reached.

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