JP4152809B2 - Power converter - Google Patents

Power converter Download PDF

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Publication number
JP4152809B2
JP4152809B2 JP2003159477A JP2003159477A JP4152809B2 JP 4152809 B2 JP4152809 B2 JP 4152809B2 JP 2003159477 A JP2003159477 A JP 2003159477A JP 2003159477 A JP2003159477 A JP 2003159477A JP 4152809 B2 JP4152809 B2 JP 4152809B2
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Prior art keywords
smoothing capacitor
switching element
control circuit
power conversion
solder
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JP2004364406A (en
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敏則 山根
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

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Description

【０００１】
【発明の属する技術分野】
この発明は、スイッチングにより電力変換を行うスイッチング素子を備えた電力変換装置に関するものである。
【０００２】
【従来の技術】
スイッチングにより電力変換を行うスイッチング素子を備えた電力変換装置として、特許文献１に示すものがあった。
【０００３】
【特許文献１】
特開２０００−３３３４７６号公報
【０００４】
【発明が解決しようとする課題】
上記特許文献１に示された電力変換装置では、電磁シールド板としての役目を持つ平滑用コンデンサ基板は、銅張ガラスエポキシ基板等であり、銅ベタパターンが電磁シールド効果を出すことになるが、この銅ベタパターンの厚みは厚くても百数十μｍ程度であり、その形状も平板に限られ、さらに銅パターンは半田レジストで覆われているため、十分な電磁シールド効果及び放熱効果を出すことができなかった。また、本来、ゲル状充填材は、スイッチング素子、フリーホイールダイオード及び接続導体を覆っていればよいのであるが、上記構成の電力変換装置では、平滑用コンデンサの冷却を行うため、平滑用コンデンサを覆い尽くせるよう、ゲル状充填材を余分に入れる必要があった。
【０００５】
この発明は、上記のような問題点を解決するためになされたものであり、小型でかつ信頼性の高い電力変換装置を得ることを目的としている。
【０００６】
【課題を解決するための手段】
この発明に係る電力変換装置は、スイッチングにより電力変換を行うスイッチング素子を搭載した絶縁基板、このスイッチング素子を駆動する駆動回路部とこの駆動回路を制御する制御回路部を搭載した駆動制御回路基板、上記絶縁基板と駆動制御回路基板との間に配置され、片面に上記スイッチング素子に供給する電源の電圧変動を抑制する平滑用コンデンサを実装した平滑用コンデンサ基板、及び該平滑用コンデンサ基板のコンデンサ実装面と反対のほぼ全面に形成され、格子状の半田レジストで区切られた多数の半田スポットによる凸部を有する導体膜を備えたものである。
【０００７】
【発明の実施の形態】
実施の形態１．
以下この発明の実施の形態１に係る電力変換装置について説明する。図１は、直流電源６の直流電力を三相交流電力に変換して、三相交流モータ等の交流負荷７を駆動する電力変換装置を示す回路ブロック図である。この電力変換装置は、スイッチング素子２、フリーホイールダイオード３、スイッチング素子２を駆動する駆動回路部４、この駆動回路部４を制御してスイッチング素子２を制御する制御回路部５、及びスイッチング素子２に供給する直流電源出力を平滑するための平滑用コンデンサ８を有するスイッチングパワーモジュール１で構成される。
【０００８】
スイッチング素子２は、直流から三相交流へ電力変換を行うものであり、トランジスタやＩＧＢＴ、ＭＯＳＦＥＴ等が使用される。また、フリーホイールダイオード３は三相交流から直流へ電力変換を行うものである。平滑用コンデンサ８は、スイッチング素子２に供給する直流電源６の電圧変動を抑制し、電圧の跳ね上がり等を平滑するものである。制御回路部５は、スイッチングパワーモジュール１内の駆動回路部４に制御信号を出力してスイッチング素子２を制御するものである。なお、駆動回路部４及び制御回路部５は、三相交流モータ等の交流負荷７を駆動及び制御する一般的な回路であるため、詳細図示は省略する。
【０００９】
この電力変換装置では、電気自動車を例にすると、車両を始動または加速する際には、バッテリである直流電源６の放電出力を直流から三相交流に変換して三相交流モータである交流負荷７を駆動する。また、車両を回生制動する際には、交流負荷７からの回生電力を三相交流から直流に変換してバッテリである直流電源６に戻す。
【００１０】
図２は、図１の電力変換装置１の内部構成を示す図である。図において、ケース９内のスイッチングパワーモジュール１は、直流入力配線１４（Ｐ、Ｎ）、交流出力配線１５（Ｕ、Ｖ、Ｗ）、及び駆動制御回路基板接続配線１６の各配線をインサート成型した樹脂部２１と、例えば銅で構成されたベース板１２と、このベース板１２上でスイッチング素子２及びフリーホイールダイオード３を搭載するセラミック等でできた絶縁基板１３と、駆動回路部４と制御回路部５が両面に組み込まれた駆動制御回路基板１０と、絶縁基板１３と駆動制御回路基板１０との間に取り付けられ、例えば銅張りガラスエポキシ基板を使用し、平滑用コンデンサ８を絶縁基板１３側に実装した平滑用コンデンサ基板２０と、絶縁基板１３と平滑用コンデンサ基板２０との間に充填されたシリコン系ゲルからなるゲル状充填材１８と、ベース板１２の下部に設けられた冷却部材１９を備えている。
【００１１】
スイッチング素子２及びフリーホイールダイオード３は、ベース板１２上に設置された導体パターン付きの絶縁基板１３に半田等の接着部材で固定されている。直流入力配線１４（Ｐ、Ｎ）、交流出力配線１５（Ｕ、Ｖ、Ｗ）、及び駆動制御回路基板接続配線１６は、ワイヤボンディング等の接続導体１７により、スイッチング素子２及びフリーホイールダイオード３と接続されている。また、駆動制御回路基板１０と駆動制御回路基板接続配線１６とは、半田等にて電気的に接続されている。
【００１２】
平滑用コンデンサ８は、複数個のセラミックコンデンサが並列接続されて構成されている。これら複数個のセラミックコンデンサは平滑用コンデンサ基板２０の絶縁基板１３側の面に実装されている。平滑用コンデンサ８は、平滑用コンデンサ基板２０を樹脂部２１に固定するネジ１１を介して直流入力配線１４（Ｐ、Ｎ）と電気的に接続されている。
【００１３】
ここで平滑用コンデンサ基板２０の構造について説明する。上述のようにこの基板は銅張りガラスエポキシからなるもので、その片面、すなわち平滑用コンデンサ実装面と反対の面が導体膜である銅ベタパターン２３により銅張りがなされ、この銅ベタパターン２３上は半田レジスト２４で覆われている。この発明では、後述のように、上記半田レジストを、格子状を残して除去し、半田レジストを除去した部分に凸状の半田スポットを設けたものである。
【００１４】
図３は、平滑用コンデンサ基板２０の平滑用コンデンサ８の実装面と反対の面を示す図である。図３に示すように、平滑用コンデンサ基板２０の銅ベタパターン２３を覆っている半田レジスト２４は、基板製造時にあらかじめその大半が格子状部を残して取り除かれており、この半田レジストを取り除いた部分に半田スポット２２が付着され凸部が形成される。半田スポット２２を付着させる方法としては、開口を有する格子状のメタルマスクを掛けておいてクリーム半田を印刷し、リフローする等の方法がある。
【００１５】
平滑用コンデンサ基板２０は、汎用的な表面実装型のセラミックコンデンサで構成された平滑用コンデンサ８を実装し、平滑用コンデンサ８の自己発熱により発生するジュール熱を放熱し、平滑用コンデンサ８を冷却するとともに、電力変換時にスイッチング素子２から発生する放射ノイズを駆動回路部４及び制御回路部５に伝達させないようにする電磁シールド板の役目を持つ。
【００１６】
本発明のポイントは、上述のように、平滑用コンデンサ基板２０のセラミックコンデンサの実装面と反対の面に多数の半田スポット２２を設け、また半田スポット２２を設けた銅ベタパターンをアースに接続したことにより、導体膜上の表面積増加による上述した放熱作用と、電磁シールド作用を、平滑用コンデンサ基板２０に持たせたものである。また、半田によるスポットで凸部形成を容易にしている。
【００１７】
平滑用コンデンサ基板２０には、セラミックコンデンサの実装面と反対の面に、銅ベタパターンが設けられており、電源ＧＮＤ（Ｎ）の全面アースにすることで電磁シールド効果を得ている。従来の技術では、平滑用コンデンサ基板２０に銅張ガラスエポキシ基板だけを使用しており、銅ベタパターンが電磁シールド効果及び若干の冷却効果を出すことになるが、この銅ベタパターンの厚みは厚くても百数十μｍ程度であり、また、その形状も平板に限られるため、十分な電磁シールド効果及び放熱効果を出すことができなかった。
【００１８】
本発明では、平滑用コンデンサ基板２０の銅ベタパターンを覆っている半田レジストの大半をなくし、そこに半田スポット２２を付着させているため、強力な電磁シールド効果を出すことができる。また、格子状を残して半田レジストをなくし、そこに半田スポット２２を付着させることにより、半田付着部の表面積が大きくなり、強力な放熱効果を出すことができる。また、銅ベタパターン部に半田を付着させていない銅張ガラスエポキシ基板等に比べ、剛性が高くなるため、耐振性も向上する。さらに、半田を用いてスポットを形成することは容易であるため製造コストを節減できる。
【００１９】
ゲル状充填材１８は、湿気や塵埃などによりスイッチング素子２が故障または誤動作しないように、スイッチング素子２、フリーホイールダイオード３及び接続導体１７を保護する役目を持っている。同時に、従来はゲル状充填剤１８で平滑用コンデンサ８の冷却も行わせていたため平滑用コンデンサ８全体が浸るようにゲル状充填剤１８を封入していたが、この発明ではその必要はなくなり、ゲル状充填剤１８の封入量を少なくしてコストを削減することができる。
【００２０】
ケース９には、空冷、水冷、油冷等でスイッチング素子２を冷却する冷却部材１９が取り付けられている。スイッチング素子２から発生するジュール熱は、絶縁基板１３及びベース１６を介して冷却部材１９に放熱されて、スイッチング素子２は冷却される。
【００２１】
【発明の効果】
以上説明したように、この発明によれば、小型でかつ信頼性が高く、安価な電力変換装置を得ることができる。
【図面の簡単な説明】
【図１】 この発明の実施の形態１に係る電力変換装置を示す回路ブロック図である。
【図２】 この発明の実施の形態１に係る電力変換装置の構造を示す断面図である。
【図３】 この発明の実施の形態１に係る電力変換装置に使用される平滑用コンデンサ基板の部分平面図である。
【符号の説明】
１ スイッチングパワーモジュール、 ２ スイッチング素子、
３ フリーホイールダイオード、 ４ 駆動回路部、
５ 制御回路部、 ６ 直流電源、
７ 交流負荷、 ８ 平滑用コンデンサ、
９ ケース、 １０ 駆動制御回路基板、
１１ ネジ、 １２ ベース板、
１３ 絶縁基板、 １４ 直流入力配線、
１５ 交流出力配線、 １６ 駆動制御回路基板接続配線、
１７ 接続導体、 １８ ゲル状充填材、
１９ 冷却部材、 ２０ 平滑用コンデンサ基板、
２１ 樹脂部、 ２２ 半田スポット、
２３ 銅ベタパターン、 ２４ 半田レジスト。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a power conversion device including a switching element that performs power conversion by switching.
[0002]
[Prior art]
As a power conversion device provided with a switching element that performs power conversion by switching, there is one shown in Patent Document 1.
[0003]
[Patent Document 1]
JP 2000-333476 A
[Problems to be solved by the invention]
In the power conversion device disclosed in Patent Document 1, the smoothing capacitor substrate having a role as an electromagnetic shield plate is a copper-clad glass epoxy substrate or the like, and the solid copper pattern exerts an electromagnetic shielding effect. The thickness of this copper solid pattern is about several hundreds of μm even if it is thick, its shape is limited to a flat plate, and the copper pattern is covered with a solder resist, so that a sufficient electromagnetic shielding effect and heat dissipation effect can be obtained. I could not. In addition, the gel-like filler is essentially only required to cover the switching element, the free wheel diode, and the connection conductor. However, in the power conversion device having the above configuration, the smoothing capacitor is used to cool the smoothing capacitor. It was necessary to add extra gel filler so that it could be covered.
[0005]
The present invention has been made to solve the above-described problems, and an object thereof is to obtain a small-sized and highly reliable power conversion device.
[0006]
[Means for Solving the Problems]
The power conversion device according to the present invention includes an insulating substrate on which a switching element that performs power conversion by switching is mounted, a drive circuit unit that drives the switching element, and a drive control circuit board that includes a control circuit unit that controls the drive circuit, A smoothing capacitor board that is disposed between the insulating substrate and the drive control circuit board and that suppresses voltage fluctuations of a power source supplied to the switching element on one side, and a capacitor mounting of the smoothing capacitor board is formed on substantially the entire surface opposite to the surface, but with a conductor film having a convex portion due to a large number of solder spots separated by lattice-shaped solder resist.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
A power conversion apparatus according to Embodiment 1 of the present invention will be described below. FIG. 1 is a circuit block diagram showing a power converter that converts DC power from a DC power source 6 into three-phase AC power and drives an AC load 7 such as a three-phase AC motor. This power converter includes a switching element 2, a free wheel diode 3, a drive circuit unit 4 that drives the switching element 2, a control circuit unit 5 that controls the drive circuit unit 4 to control the switching element 2, and the switching element 2 It comprises a switching power module 1 having a smoothing capacitor 8 for smoothing the DC power supply output supplied to.
[0008]
The switching element 2 performs power conversion from direct current to three-phase alternating current, and a transistor, IGBT, MOSFET, or the like is used. The freewheel diode 3 performs power conversion from three-phase alternating current to direct current. The smoothing capacitor 8 suppresses voltage fluctuations of the DC power supply 6 supplied to the switching element 2 and smoothes voltage jumps and the like. The control circuit unit 5 outputs a control signal to the drive circuit unit 4 in the switching power module 1 to control the switching element 2. Since the drive circuit unit 4 and the control circuit unit 5 are general circuits that drive and control an AC load 7 such as a three-phase AC motor, detailed illustration is omitted.
[0009]
In this power conversion device, taking an electric vehicle as an example, when starting or accelerating the vehicle, the discharge output of the DC power source 6 that is a battery is converted from DC to three-phase AC to be an AC load that is a three-phase AC motor. 7 is driven. When the vehicle is regeneratively braked, regenerative power from the AC load 7 is converted from three-phase AC to DC and returned to the DC power source 6 that is a battery.
[0010]
FIG. 2 is a diagram showing an internal configuration of the power conversion device 1 of FIG. In the figure, the switching power module 1 in the case 9 is insert-molded with each of the DC input wiring 14 (P, N), the AC output wiring 15 (U, V, W), and the drive control circuit board connection wiring 16. Resin portion 21, base plate 12 made of, for example, copper, insulating substrate 13 made of ceramic or the like on which switching element 2 and free wheel diode 3 are mounted on base plate 12, drive circuit portion 4 and control circuit Mounted between the drive control circuit board 10 in which the part 5 is incorporated on both sides, the insulating board 13 and the drive control circuit board 10, for example, a copper-clad glass epoxy board is used, and the smoothing capacitor 8 is connected to the insulating board 13 side. A smoothing capacitor substrate 20 mounted on the substrate, and a gel-like filling made of silicon gel filled between the insulating substrate 13 and the smoothing capacitor substrate 20. With product 18, and a cooling member 19 provided at a lower portion of the base plate 12.
[0011]
The switching element 2 and the freewheel diode 3 are fixed to an insulating substrate 13 with a conductor pattern installed on the base plate 12 by an adhesive member such as solder. The DC input wiring 14 (P, N), the AC output wiring 15 (U, V, W), and the drive control circuit board connection wiring 16 are connected to the switching element 2 and the free wheel diode 3 by a connection conductor 17 such as wire bonding. It is connected. The drive control circuit board 10 and the drive control circuit board connection wiring 16 are electrically connected by solder or the like.
[0012]
The smoothing capacitor 8 is configured by connecting a plurality of ceramic capacitors in parallel. The plurality of ceramic capacitors are mounted on the surface of the smoothing capacitor substrate 20 on the insulating substrate 13 side. The smoothing capacitor 8 is electrically connected to the DC input wiring 14 (P, N) via a screw 11 that fixes the smoothing capacitor substrate 20 to the resin portion 21.
[0013]
Here, the structure of the smoothing capacitor substrate 20 will be described. As described above, this substrate is made of copper-clad glass epoxy, and one surface thereof, that is, the surface opposite to the smoothing capacitor mounting surface is copper-coated with a copper solid pattern 23 which is a conductor film. Is covered with a solder resist 24. In the present invention, as will be described later, the solder resist is removed leaving a lattice shape, and a convex solder spot is provided at a portion where the solder resist is removed.
[0014]
FIG. 3 is a diagram showing a surface of the smoothing capacitor substrate 20 opposite to the mounting surface of the smoothing capacitor 8. As shown in FIG. 3, most of the solder resist 24 covering the copper solid pattern 23 of the smoothing capacitor substrate 20 has been removed in advance, leaving a lattice-like portion at the time of substrate manufacture, and this solder resist has been removed. A solder spot 22 is attached to the portion to form a convex portion. As a method for attaching the solder spot 22, there is a method in which cream solder is printed on a grid-like metal mask having openings and reflowed.
[0015]
The smoothing capacitor substrate 20 is mounted with a smoothing capacitor 8 composed of a general-purpose surface-mount ceramic capacitor, dissipates Joule heat generated by the self-heating of the smoothing capacitor 8, and cools the smoothing capacitor 8. In addition, it serves as an electromagnetic shield plate that prevents transmission noise generated from the switching element 2 during power conversion from being transmitted to the drive circuit unit 4 and the control circuit unit 5.
[0016]
The point of the present invention is that, as described above, a large number of solder spots 22 are provided on the surface of the smoothing capacitor substrate 20 opposite to the ceramic capacitor mounting surface, and the copper solid pattern provided with the solder spots 22 is connected to the ground. As a result, the smoothing capacitor substrate 20 has the above-described heat dissipation action and electromagnetic shielding action due to the increase in surface area on the conductor film. In addition, the formation of convex portions is facilitated by spots made of solder.
[0017]
The smoothing capacitor substrate 20 is provided with a solid copper pattern on the surface opposite to the mounting surface of the ceramic capacitor, and an electromagnetic shielding effect is obtained by grounding the entire surface of the power supply GND (N). In the prior art, only the copper-clad glass epoxy substrate is used for the smoothing capacitor substrate 20, and the solid copper pattern provides an electromagnetic shielding effect and a slight cooling effect, but the solid copper pattern is thick. However, since the shape is limited to a flat plate, a sufficient electromagnetic shielding effect and heat dissipation effect could not be obtained.
[0018]
In the present invention, since most of the solder resist covering the copper solid pattern of the smoothing capacitor substrate 20 is eliminated and the solder spot 22 is adhered thereto, a strong electromagnetic shielding effect can be obtained. Further, by leaving the grid shape and eliminating the solder resist, and attaching the solder spot 22 thereto, the surface area of the solder attachment portion is increased, and a strong heat radiation effect can be obtained. Moreover, since the rigidity is higher than that of a copper-clad glass epoxy substrate or the like in which solder is not attached to the copper solid pattern portion, vibration resistance is also improved. Furthermore, since it is easy to form spots using solder, manufacturing costs can be reduced.
[0019]
The gel filler 18 serves to protect the switching element 2, the free wheel diode 3, and the connection conductor 17 so that the switching element 2 does not fail or malfunction due to moisture or dust. At the same time, since the smoothing capacitor 8 has been cooled with the gel filler 18 in the past, the gel filler 18 is sealed so that the entire smoothing capacitor 8 is soaked. Costs can be reduced by reducing the amount of gel filler 18 enclosed.
[0020]
A cooling member 19 that cools the switching element 2 by air cooling, water cooling, oil cooling, or the like is attached to the case 9. Joule heat generated from the switching element 2 is radiated to the cooling member 19 through the insulating substrate 13 and the base 16, and the switching element 2 is cooled.
[0021]
【The invention's effect】
As described above, according to the present invention, it is possible to obtain a power converter that is small in size, highly reliable, and inexpensive.
[Brief description of the drawings]
FIG. 1 is a circuit block diagram showing a power conversion apparatus according to Embodiment 1 of the present invention.
FIG. 2 is a cross-sectional view showing the structure of the power conversion device according to Embodiment 1 of the present invention.
FIG. 3 is a partial plan view of a smoothing capacitor substrate used in the power conversion device according to Embodiment 1 of the present invention.
[Explanation of symbols]
1 switching power module, 2 switching element,
3 Freewheel diode, 4 Drive circuit,
5 Control circuit section, 6 DC power supply,
7 AC load, 8 smoothing capacitor,
9 case, 10 drive control circuit board,
11 screws, 12 base plate,
13 Insulating board, 14 DC input wiring,
15 AC output wiring, 16 Drive control circuit board connection wiring,
17 connecting conductor, 18 gel filler,
19 cooling member, 20 smoothing capacitor substrate,
21 resin part, 22 solder spot,
23 Copper solid pattern, 24 Solder resist.

Claims (4)

スイッチングにより電力変換を行うスイッチング素子を搭載した絶縁基板、このスイッチング素子を駆動する駆動回路部とこの駆動回路を制御する制御回路部を搭載した駆動制御回路基板、上記絶縁基板と駆動制御回路基板との間に配置され、片面に上記スイッチング素子に供給する電源の電圧変動を抑制する平滑用コンデンサを実装した平滑用コンデンサ基板、及び該平滑用コンデンサ基板のコンデンサ実装面と反対のほぼ全面に形成され、格子状の半田レジストで区切られた多数の半田スポットを有する導体膜を備えたことを特徴とする電力変換装置。An insulating substrate on which a switching element that performs power conversion by switching is mounted; a drive circuit section that drives the switching element; a drive control circuit board that includes a control circuit section that controls the drive circuit; the insulating substrate and the drive control circuit board; It is disposed between, formed almost all the surface of the smoothing capacitor board mounted with the smoothing capacitor to suppress voltage fluctuations of the power source supplied to the switching element on one side, and a capacitor mounting surface of the smooth capacitor substrate opposite And a conductive film having a large number of solder spots separated by a grid-shaped solder resist . 上記導体膜は上記半田スポットが設けられている部分を除き半田レジストで覆われていることを特徴とする請求項１に記載の電力変換装置。  The power conversion device according to claim 1, wherein the conductor film is covered with a solder resist except for a portion where the solder spot is provided. 上記平滑用コンデンサはセラミックコンデンサであることを特徴とする請求項１または請求項２に記載の電力変換装置。  The power converter according to claim 1 or 2, wherein the smoothing capacitor is a ceramic capacitor. 上記導体膜はアースに接続されていることを特徴とする請求項１〜請求項３のいずれか一項に記載の電力変換装置。  The power conversion device according to claim 1, wherein the conductor film is connected to a ground.
JP2003159477A 2003-06-04 2003-06-04 Power converter Expired - Fee Related JP4152809B2 (en)

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JP5393841B2 (en) * 2012-05-25 2014-01-22 三菱電機株式会社 Power converter and method for manufacturing power converter
JP2014128045A (en) * 2012-12-25 2014-07-07 Panasonic Corp Motor drive unit and electrical apparatus including the same
JP6584333B2 (en) * 2016-01-28 2019-10-02 三菱電機株式会社 Power module

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