JP4129205B2 - Method for manufacturing perpendicular magnetic recording head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a perpendicular magnetic recording head having at least an inductive magnetic transducer for recording.DeManufacturing methodTo the lawRelated.
[0002]
[Prior art]
In recent years, for example, improvement in performance of a thin-film magnetic head has been demanded with improvement in surface recording density of a magnetic recording medium such as a hard disk (hereinafter simply referred to as “recording medium”). As a recording method of this thin film magnetic head, for example, a longitudinal recording method in which the direction of the signal magnetic field is in the in-plane direction (longitudinal direction) of the recording medium, or a perpendicular direction in which the direction of the signal magnetic field is perpendicular to the surface of the recording medium. Recording methods are known. At present, the longitudinal recording method is widely used. However, in consideration of the market trend accompanying the improvement of the surface recording density, it is expected that the perpendicular recording method will be promising instead of the longitudinal recording method in the future. This is because the perpendicular recording method can provide an advantage that a high linear recording density can be secured and a recorded recording medium is hardly affected by thermal fluctuation.
[0003]
A perpendicular recording thin film magnetic head mainly includes a thin film coil that generates a magnetic flux for recording, and a magnetic pole layer that executes a recording process by releasing the magnetic flux generated in the thin film coil toward a recording medium. ing. As the configuration of the magnetic pole layer, for example, the main magnetic pole layer partially rides on the yoke layer and is magnetically coupled (for example, see Patent Document 1), or the pole tip on the trailing side of the main magnetic pole layer. Is already known and is magnetically coupled (see, for example, Patent Document 2).
[0004]
[Patent Document 1]
JP 2002-197611 A
[Patent Document 2]
JP 2003-036503 A
[0005]
[Problems to be solved by the invention]
By the way, the pole layer generally extends rearward from the air bearing surface and is connected to a track width defining portion having a constant width that defines the recording track width of the recording medium, and to the rear of the track width defining portion, And a widened portion having a width larger than the width of the track width defining portion. The position where the width of the pole layer extends from the track width defining portion to the widened portion is a “flare point” which is one of the important factors determining the performance of the thin film magnetic head. The distance between is “neck height”. In order to stably mass-produce perpendicular recording type thin film magnetic heads, for example, it is necessary to form a track width demarcating portion, which is a main portion that substantially executes recording processing, with as high accuracy as possible.
[0006]
However, when a pole layer including a narrow track width defining portion and a wide widened portion is formed at a time, a photoresist pattern for forming the pole layer using a photolithography process is formed. In the photoresist film, the exposure amount of the large area region corresponding to the widened portion is significantly larger than the exposure amount of the small area region corresponding to the track width defining portion. There is a problem that it becomes easy to expand under the influence of exposure, and as a result, it becomes difficult to form a track width demarcating portion with high accuracy so as to have a uniform width in the extending direction. This problem becomes more prominent as the neck height is reduced by bringing the flare point closer to the air bearing surface, that is, the length of the track width defining portion is reduced.
[0007]
  The present invention has been made in view of such problems.EyesThe purpose of the present invention is to provide a method of manufacturing a perpendicular magnetic recording head capable of forming a magnetic pole layer with high accuracy and stably mass-producing a perpendicular magnetic recording head.
[0010]
[Means for Solving the Problems]
  According to the present inventionFirstPerpendicular magnetic recording headManufacturing methodIsA method of manufacturing a perpendicular magnetic recording head comprising: a thin film coil that generates magnetic flux; and a magnetic pole layer that emits the magnetic flux generated in the thin film coil toward a recording medium that moves in the medium traveling direction. A first step of forming the first pole layer portion so that the forming step extends from the recording medium facing surface facing the recording medium toward the rear with a constant width defining the recording track width; And a second step of forming the second magnetic pole layer portion so as to have a width larger than that of the first magnetic pole layer portion, which are magnetically coupled to the rear of the magnetic pole layer portion in the same layer as the first magnetic pole layer portion. And the first magnetic pole layer portion and the second magnetic pole layer portion are separated from each other so that the surfaces on the medium traveling direction side are included in the same plane. And the second step is Patterning the two magnetic pole layer portions to define a widening position where the width of the magnetic pole layer extends from the first magnetic pole layer portion to the second magnetic pole layer portion at the front end of the second magnetic pole layer portion; By patterning the precursor magnetic pole layer so that a portion having a constant width corresponding to the constant width described above partially rides on the second magnetic pole layer portion from the front region of the second magnetic pole layer portion, A step of defining the constant width in a portion of the pole layer having a constant width, a step of forming an insulating layer so as to cover the peripheral region together with the second pole layer portion and the precursor pole layer, and an etching process To planarize the insulating layer and the precursor magnetic pole layer until at least the second magnetic pole layer portion is exposed, and to selectively remove the portion of the precursor magnetic pole layer that rides on the second magnetic pole layer portion. Ri is obtained by such a step of forming a first magnetic pole layer portion so as to be adjacent in direct contact with the second pole layer portion.
[0011]
  According to the present inventionSecondPerpendicular magnetic recording headIs a method of manufacturing a perpendicular magnetic recording head including a thin film coil that generates magnetic flux and a magnetic pole layer that emits the magnetic flux generated in the thin film coil toward a recording medium that moves in the medium traveling direction. A first pole layer portion is formed so that the step of forming the pole layer extends from the recording medium facing surface facing the recording medium toward the rear with a constant width defining the recording track width. And a second step of forming the second magnetic pole layer portion so as to be magnetically coupled to the rear of the first magnetic pole layer portion in the same layer and to have a width larger than that of the first magnetic pole layer portion. And the first magnetic pole layer portion and the second magnetic pole layer portion are separated from each other so that the surfaces in the medium traveling direction are included in the same plane. The first step and In step 2, the second magnetic pole layer portion is patterned to increase the width of the magnetic pole layer from the first magnetic pole layer portion to the second magnetic pole layer portion at the front end of the second magnetic pole layer portion. A step of defining the position, a step of forming a seed layer so as to cover the second magnetic pole layer portion and its peripheral region, and a plating film is grown using the seed layer, and a constant corresponding to the constant width described above By patterning the precursor pole layer such that the portion having the width partially rides on the seed layer from the front region of the second pole layer portion to the second pole layer portion; The step of defining the constant width in the portion having the constant width, the step of forming the insulating layer so as to cover the peripheral region together with the second magnetic pole layer portion and the precursor magnetic pole layer, and the etching process are used to reduce the width. When By flattening the insulating layer, the precursor magnetic pole layer, and the seed layer until the second magnetic pole layer portion is exposed, and selectively removing the portion of the precursor magnetic pole layer that rides on the second magnetic pole layer portion, Forming a first magnetic pole layer portion so as to be indirectly adjacent to the magnetic pole layer portion via a seed layer.
[0013]
  According to the present inventionFirst or secondIn the method of manufacturing the perpendicular magnetic recording head, the first magnetic pole layer portion and the second magnetic pole layer portion constituting the magnetic pole layer are formed in separate steps, so that the first magnetic pole layer portion and the first magnetic pole layer portion The two magnetic pole layer portions are separated from each other and located in the same layer, and the surfaces on the medium traveling direction side are included in the same plane. Thus, when forming a photoresist pattern for forming the pole layer using photolithography, an exposure range of a small area corresponding to the narrow first pole layer portion in the photoresist film. However, it becomes difficult to expand under the influence of exposure of a large area corresponding to the wide second magnetic pole layer portion.
[0019]
  According to the present inventionSecondIn the manufacturing method of the perpendicular magnetic recording headThe secondIn the step of patterning the two magnetic pole layer portions, it is preferable to form the second magnetic pole layer portion so that the front end face is inclined rearward with respect to the extending direction of the second magnetic pole layer portion.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0022]
[First Embodiment]
First, the configuration of the thin film magnetic head according to the first embodiment of the invention will be described with reference to FIGS. 1A and 1B show a cross-sectional configuration of a thin film magnetic head. FIG. 1A shows a cross section parallel to the air bearing surface, and FIG. 1B shows a cross section perpendicular to the air bearing surface. FIG. 2 shows a plan configuration of the main part of the thin film magnetic head shown in FIG. An arrow M shown in FIG. 1 represents a direction (medium traveling direction) in which a recording medium (not shown) travels relative to the thin film magnetic head.
[0023]
In the following description, the distance in the X-axis direction shown in FIGS. 1 and 2 is expressed as “width”, the distance in the Y-axis direction is “length”, and the distance in the Z-axis direction is “thickness”. Further, the side near the air bearing surface in the Y-axis direction is referred to as “front”, and the opposite side is referred to as “rear”. These notation contents are the same also in FIG.
[0024]
This thin film magnetic head is, for example, a composite head capable of performing both recording and reproduction functions. For example, as shown in FIG.₂O_ThreeOn the substrate 1 made of a ceramic material such as TiC, for example, aluminum oxide (Al₂O_ThreeHereinafter referred to simply as “alumina”. ) Or the like, a reproducing head portion 100A that performs a reproducing process using a magnetoresistive effect (MR), and a nonmagnetic insulating material such as alumina. The constituted separation layer 7, a single-pole type recording head unit 100 </ b> B that executes a recording process of a perpendicular recording method, and an overcoat layer 19 made of a nonmagnetic insulating material such as alumina are laminated in this order. It has a configuration.
[0025]
The reproducing head unit 100A has, for example, a configuration in which a lower read shield layer 3, a shield gap film 4, and an upper read shield layer 5 are stacked in this order. An MR element 6 as a reproducing element is embedded in the shield gap film 4 so that one end face is exposed on a recording medium facing surface (air bearing surface) 50 facing the recording medium.
[0026]
The lower read shield layer 3 and the upper read shield layer 5 magnetically isolate the MR element 6 from the surroundings. For example, a nickel iron alloy (NiFe (for example, Ni: 80 wt%, Fe: 20 wt%)); Hereinafter, it is simply made of a magnetic material such as “Permalloy (trade name)”, and the thickness thereof is about 1.0 μm to 2.0 μm.
[0027]
The shield gap film 4 electrically isolates the MR element 6 from the surroundings, and is made of a nonmagnetic insulating material such as alumina.
[0028]
The MR element 6 performs a reproducing process using, for example, a giant magnetoresistive effect (GMR; Giant Magneto-resistive) or a tunnel magnetoresistive effect (TMR; Tunneling Magneto-resistive).
[0029]
The recording head portion 100B is embedded with, for example, a magnetic pole layer 30 whose periphery is embedded by insulating layers 9 and 13, a gap layer 14 provided with a magnetic coupling opening (back gap 14BG), and an insulating layer 18. The thin film coil 17 and the write shield layer 40 are laminated in this order. In FIG. 2, only the magnetic pole layer 30 (except for a seed layer 10 described later), the thin film coil 17 and the write shield layer 40 in the recording head portion 100B are shown.
[0030]
The pole layer 30 accommodates the magnetic flux generated in the thin film coil 17 and emits the magnetic flux toward the recording medium, and extends rearward from the air bearing surface 50. In particular, the pole layer 30 has a configuration in which, for example, the auxiliary pole layer 8, the seed layer 10, and the main pole layer 20 are stacked. The insulating layers 9 and 13 electrically separate the magnetic pole layer 30 from the surroundings, and are made of, for example, a nonmagnetic insulating material such as alumina.
[0031]
The auxiliary magnetic pole layer 8 functions as an auxiliary magnetic flux accommodating portion for securing the magnetic volume (magnetic flux accommodation amount) of the main magnetic pole layer 20, and from the air bearing surface 50 on the leading side of the main magnetic pole layer 20. It extends rearward from the retracted position and is magnetically coupled to the main magnetic pole layer 20 via the seed layer 10. The auxiliary magnetic pole layer 8 is made of, for example, the same magnetic material as that of the main magnetic pole layer 20, and has a rectangular planar shape having a width W2, as shown in FIG.
[0032]
The seed layer 10 is used for performing a plating process in a manufacturing process of a thin film magnetic head, which will be described later. In particular, in order to form a main magnetic pole layer 20 (both a front magnetic pole layer 11 and a rear magnetic pole layer 12 described later). For example, it is made of the same magnetic material as that of the rear end pole layer 12.
[0033]
The main magnetic pole layer 20 functions as a main magnetic flux release portion, and extends rearward from the air bearing surface 50. For example, as shown in FIG. 2, the main magnetic pole layer 20 extends from the air bearing surface 50 toward the rear with a constant width W1 (W1 = about 0.15 μm) that defines the recording track width of the recording medium. The tip pole layer 11 (first pole layer portion) and the trailing end pole magnetically coupled to the rear of the tip pole layer 11 and having a width W2 (W2> W1) larger than the width W1 of the tip pole layer 11 Layer 12 (second pole layer portion). The tip pole layer 11 and the trailing pole layer 12 are separate from each other, and the trailing side surface 11M of the leading pole layer 11 and the trailing side surface 12M of the trailing pole layer 12 are the same plane. Contained within. In particular, the front pole layer 11 and the rear pole layer 12 are adjacent to each other in direct contact with each other, for example. The position where the width of the main magnetic pole layer 20 extends from the front magnetic pole layer 11 (width W1) to the rear magnetic pole layer 12 (width W2) is one of important factors that determine the recording performance of the thin film magnetic head. "Flare point FP (widening position)". The distance between the flare point FP and the air bearing surface 50 is “neck height NH”, for example, about 0.1 μm to 1.0 μm.
[0034]
The above-mentioned “tip magnetic pole layer 11 and rear end magnetic pole layer 12 are separate from each other” means that front magnetic pole layer 11 and rear end magnetic pole layer 12 are formed in separate steps, It means that one continuous body (integral product) is not constituted. Further, “the surfaces 11M and 12M are included in the same surface” means that the surfaces 11M and 12M constitute a part of the same plane (a plane including the X axis and the Y axis). ing. Further, the “trailing side” refers to the flow out side (medium traveling direction side) when the moving state of the recording medium traveling in the medium traveling direction M shown in FIG. In this case, the upper side in the thickness direction (Z-axis direction). On the other hand, the side into which the flow flows is called the “leading side” and here refers to the lower side in the thickness direction.
[0035]
The tip pole layer 11 has a substantially uniform width W1 in the length direction (Y-axis direction). For example, permalloy or iron cobalt alloy (for example, iron cobalt alloy (FeCo) or iron cobalt nickel alloy (FeCoNi)). ) Etc. In particular, the tip pole layer 11 is made of, for example, a magnetic material having a saturation magnetic flux density higher than that of the trailing edge pole layer 12, and specifically made of iron-cobalt alloy.
[0036]
The rear magnetic pole layer 12 has, for example, a constant width W2 at the rear and gradually narrows toward the front magnetic pole layer 11 at the front, and is made of the same magnetic material as that of the front magnetic pole layer 11. . In particular, the trailing pole layer 12 is made of, for example, a magnetic material having a saturation magnetic flux density lower than that of the leading pole layer 11, and is specifically made of permalloy. As shown in FIG. 2, an angle θ formed between the extending direction (Y-axis direction) of the tip pole layer 11 and the front edge WE located on both sides of the tip pole layer 11 in the trailing pole layer 12. Is within a range of about 25 ° to 90 ° (25 ° ≦ θ ≦ 90 °), for example.
[0037]
The gap layer 14 constitutes a gap for magnetically separating the pole layer 30 and the write shield layer 40 and is made of, for example, a nonmagnetic insulating material such as alumina, and has a thickness of about 0.2 mm. 2 μm or less.
[0038]
The thin film coil 17 generates a magnetic flux for recording, and has, for example, a winding structure that is wound spirally around the back gap 14BG, and is made of a highly conductive material such as copper (Cu). ing. In FIGS. 1 and 2, only a part of the plurality of windings constituting the thin film coil 17 is shown.
[0039]
The insulating layer 18 covers the thin film coil 17 and is electrically separated from the surroundings, and is disposed on the gap layer 14 so as not to block the back gap 14BG. The insulating layer 18 is made of, for example, a photoresist (photosensitive resin) or spin-on glass (SOG) that exhibits fluidity when heated, and has a rounded slope in the vicinity of the edge. is doing. The position of the foremost end of the insulating layer 18 is a “throat height zero position TP” which is one of important factors that determine the recording performance of the thin film magnetic head. The distance between the throat height zero position TP and the air bearing surface 50 is “throat height TH”, for example, about 0.3 μm or less. 1 and 2 show, for example, a case where the throat height zero position TP coincides with the flare point FP, that is, the throat height TH and the neck height NH coincide with each other.
[0040]
The write shield layer 40 takes in the spreading component of the magnetic flux emitted from the pole layer 30 and prevents the spreading of the magnetic flux. The write shield layer 40 extends rearward from the air bearing surface 50 on the trailing side of the magnetic pole layer 30, and is separated from the magnetic pole layer 30 by the gap layer 14 on the side close to the air bearing surface 50, and the air bearing surface. The magnetic layer is magnetically coupled adjacent to the pole layer 30 through the back gap 14BG on the side far from 50. In particular, the write shield layer 40 functions as two components that are separate from each other, that is, a TH defining layer 15 that functions as a main magnetic flux intake port, and a flow path for magnetic flux that is captured from the TH defining layer 15. And a yoke layer 16.
[0041]
The TH defining layer 15 is adjacent to the gap layer 14 and is located from the air bearing surface 50 to a position between the air bearing surface 50 and the back gap 14BG (more specifically, between the air bearing surface 50 and the thin film coil 17). Extended to position). The TH defining layer 15 is made of a magnetic material such as permalloy or iron-cobalt alloy, for example, and has a width W3 (W3> W2) larger than the width W2 of the pole layer 30, for example, as shown in FIG. ) Having a rectangular planar shape. The TH defining layer 15 is adjacent to an insulating layer 18 in which the thin film coil 17 is embedded. That is, the TH defining layer 15 defines the foremost end position (throat height zero position TP) of the insulating layer 18, and more specifically. In particular, it plays the role of defining the throat height TH.
[0042]
The yoke layer 16 extends from the air bearing surface 50 to the back gap 14BG so as to cover the insulating layer 18. The yoke layer 16 rides on the TH defining layer 15 on the front side and is magnetically coupled, and on the rear side, the back gap 14BG. And is magnetically coupled adjacent to the pole layer 30. The yoke layer 16 is made of, for example, the same magnetic material as that of the TH defining layer 15 and has a rectangular planar shape having a width W3 like the TH defining layer 15 as shown in FIG. ing.
[0043]
Next, the operation of the thin film magnetic head will be described with reference to FIGS.
[0044]
In this thin film magnetic head, when information is recorded, if a current flows through the thin film coil 17 of the recording head unit 100B through an external circuit (not shown), a magnetic flux is generated in the thin film coil 17. The magnetic flux generated at this time is accommodated in the auxiliary magnetic pole layer 8 and the main magnetic pole layer 20 constituting the magnetic pole layer 30, and then flows mainly in the main magnetic pole layer 20 from the rear magnetic pole layer 12 to the front magnetic pole layer 11. At this time, the magnetic flux flowing in the main magnetic pole layer 20 is focused at the flare point FP as the width of the main magnetic pole layer 20 is reduced. The trailing edge) is concentrated in the vicinity of TE. When the magnetic flux concentrated in the vicinity of the trailing edge TE is emitted to the outside from the tip pole layer 11, a recording magnetic field is generated in a direction perpendicular to the surface of the recording medium, and the recording medium is magnetized in the vertical direction by the recording magnetic field. Therefore, information is magnetically recorded on the recording medium. When information is recorded, since the spread component of the magnetic flux emitted from the tip pole layer 11 is taken into the write shield layer 40, the spread of the magnetic flux is prevented. The magnetic flux taken into the write shield layer 40 is circulated to the pole layer 30 through the back gap 14BG.
[0045]
On the other hand, at the time of reproduction, when a sense current flows through the MR element 6 of the reproducing head unit 100A, the resistance value of the MR element 6 changes according to the reproduction signal magnetic field from the recording medium. Since this resistance change is detected as a change in the sense current, information recorded on the recording medium is magnetically read out.
[0046]
In the thin film magnetic head according to the present embodiment, with respect to the magnetic pole layer 30 including the auxiliary magnetic pole layer 8, the seed layer 10, and the main magnetic pole layer 20, the front pole layer 11 and the rear end constituting the main magnetic pole layer 20 are included. Since the pole layer 12 is separated from each other and the trailing-side surfaces 11M and 12M are included in the same plane, in order to form the main pole layer 20 having this characteristic configuration, The manufacturing method of the thin film magnetic head of the present invention described below can be applied. Therefore, since mass productivity can be obtained stably, recording performance can be secured stably.
[0047]
In particular, in the present embodiment, the tip magnetic pole layer 11 has a higher saturation magnetic flux density than the trailing magnetic pole layer 12, so that magnetic flux saturation that prevents execution of the recording process does not occur in the front magnetic pole layer 11, and The flow of magnetic flux is optimized in both the front pole layer 11 and the rear pole layer 12 so that unintended writing due to the outflow of magnetic flux does not occur in the end pole layer 12. Accordingly, a stable magnetic flux flow can be obtained as the main magnetic pole layer 20 as a whole, and this aspect can also contribute to ensuring stable recording characteristics.
[0048]
In the present embodiment, the angle θ between the extending direction of the front pole layer 11 and the front end edge WE of the rear pole layer 12 satisfies the condition of 25 ° ≦ θ ≦ 90 °. A step in the width direction is formed between the pole layer 11 and the trailing end pole layer 12, and the magnetic flux is appropriately focused at the flare point FP. Accordingly, since necessary and sufficient magnetic flux is supplied from the trailing end magnetic pole layer 12 to the leading end magnetic pole layer 11, it is possible to contribute to ensuring stable recording characteristics from this viewpoint.
[0049]
Next, a method for manufacturing the thin film magnetic head shown in FIGS. 1 and 2 will be described with reference to FIGS. 3 to 8 are for explaining the manufacturing process of the thin film magnetic head, and all show the cross-sectional structure corresponding to FIG. 9 to 11 show the planar configuration of the main part of the thin film magnetic head being manufactured, and correspond to FIGS. 3, 4 and 8, respectively.
[0050]
In the following, first, the outline of the manufacturing process of the entire thin film magnetic head will be described with reference to FIG. 1, and then the main part (main magnetic pole layer 20) forming process of the thin film magnetic head will be described with reference to FIGS. This will be described in detail. Note that descriptions of materials, dimensions, structural features, and the like of a series of constituent elements of the thin film magnetic head will be omitted from time to time.
[0051]
This thin-film magnetic head mainly uses an existing thin-film process including a film forming technique such as plating and sputtering, a patterning technique such as photolithography, and an etching technique such as dry etching. Manufactured by sequentially forming and laminating. That is, as shown in FIG. 1, first, after forming the insulating layer 2 on the substrate 1, the lower read shield layer 3 and the shield gap film 4 in which the MR element 6 is embedded on the insulating layer 2, The read head portion 100A is formed by laminating the upper read shield layer 5 in this order. Subsequently, after forming the separation layer 7 on the reproducing head portion 100A, the magnetic pole layer 30 (auxiliary magnetic pole layer 8, seed layer 10 and main magnetic pole layer) is embedded on the separation layer 7 by insulating layers 9 and 13. Layer 20 (tip magnetic pole layer 11, rear magnetic pole layer 12)), gap layer 14 having a back gap 14BG, insulating layer 18 in which a thin film coil 17 is embedded, and write shield layer 40 (TH defining layer 15, yoke layer). 16) are stacked in this order to form the recording head portion 100B. Finally, after the overcoat layer 19 is formed on the recording head portion 100B, the air bearing surface 50 is formed using machining or polishing, thereby completing the thin film magnetic head.
[0052]
The purpose of the method of manufacturing the thin film magnetic head according to the present embodiment is to form the main magnetic pole layer 20 of the magnetic pole layer 30 and to form the front magnetic pole layer 11 and the rear magnetic pole layer 12 constituting the main magnetic pole layer 20. Are formed in separate steps, as shown in FIG. 1, the leading pole layer 11 and the trailing pole layer 12 are separated from each other, and the surfaces 11M and 12M on the trailing side are the same. It is intended to be included in the plane. In particular, in the method of manufacturing the thin film magnetic head, in the step of forming the front pole layer 11, a constant width W 1 that defines the recording track width is defined, and in the step of forming the rear pole layer 12, A flare point FP whose width extends from the leading end pole layer 11 to the trailing end pole layer 12 is defined.
[0053]
That is, when the main magnetic pole layer 20 is formed, after patterning the auxiliary magnetic pole layer 8 so as to be embedded by the insulating layer 9 on the separation layer 7, first, for example, sputtering is performed as shown in FIG. In use, the seed layer 10 for performing the plating process is formed so as to cover the auxiliary magnetic pole layer 8 and its peripheral region.
[0054]
Subsequently, after applying a photoresist on the seed layer 10 to form a photoresist film (not shown), and subsequently forming a photoresist pattern by patterning the photoresist film using a photolithography process, By growing the plating film using the seed layer 10 together with this photoresist pattern, the rear end pole layer 12 is patterned on the seed layer 10 as shown in FIG. When the rear end magnetic pole layer 12 is formed, for example, as shown in FIG. 9, the rear end magnetic pole layer 12 has a hexagonal planar shape having a constant width W2 at the rear and gradually narrowing at the front. In particular, the width W4 of the front edge FE is made substantially equal to the width W1 of the tip pole layer 11 formed in a later step, and more specifically, the width W4 matches the width W1 (W4 = W1). ). Further, for example, as shown in FIG. 3, in order to define the flare point FP at the front end of the rear end pole layer 12, the front end is positioned at the target flare point FP. In the process, the front end is positioned by retreating by about 0.1 μm to 1.0 μm from the position where the air bearing surface 50 is formed (see FIG. 1). Further, for example, the thickness T1 of the trailing end magnetic pole layer 12 is made larger than the thickness T (see FIG. 8) of the main magnetic pole layer 20 to be finally formed (T1> T).
[0055]
Subsequently, after removing the photoresist pattern used to form the trailing end magnetic pole layer 12 and newly forming another photoresist pattern (not shown), the seed layer 10 is continued together with this other photoresist pattern. As shown in FIG. 4, the precursor magnetic pole layer 111 for forming the tip magnetic pole layer 11 is patterned as shown in FIG. When the precursor magnetic pole layer 111 is formed, for example, as shown in FIG. 10, a constant width corresponding to the constant width W1 of the tip magnetic pole layer 11, specifically, a constant width W0 (W0 larger than the width W1). > W1) and a rear end 111B that is magnetically coupled to the rear of the front end 111A and has a width W5 (W5> W0) larger than the width W0 of the front end 111A. As shown in FIG. 4, the tip end portion 111 </ b> A runs on the rear end pole layer 12 from the front region of the rear end pole layer 12. Also, for example, as shown in FIG. 4, the thickness T2 of the main magnetic pole layer 20 in which the thickness T2 of the precursor magnetic pole layer 111 is finally formed is the same as the thickness T1 of the trailing magnetic pole layer 12 described above. (T2> T).
[0056]
Subsequently, for example, ion milling is used, and the seed layer 10 is etched using the trailing end magnetic pole layer 12 and the precursor magnetic pole layer 111 as a mask, so that as shown in FIG. ), The insulating layer 9 is exposed by selectively removing portions of the seed layer 10 other than the portions corresponding to the rear end magnetic pole layer 12 and the precursor magnetic pole layer 111 by etching. . At this time, for example, the seed layer 10 and the precursor magnetic pole layer 111 are also etched, and the tip 111A is etched mainly using the etching action in the width direction, so that the width of the tip 111A is reduced to W0. From W1 to W1. Thus, a constant width W1 that defines the recording track width is defined based on the constant width W1 of the tip end portion 111A.
[0057]
Subsequently, as shown in FIG. 6, the insulating layer 13 is formed so as to cover the peripheral region thereof together with the trailing end magnetic pole layer 12 and the precursor magnetic pole layer 111 using, for example, sputtering. When the insulating layer 13 is formed, for example, the rear end magnetic pole layer 12 and the precursor magnetic pole layer 111 are completely covered and buried, and in particular, the thickness thereof is equal to the thickness of the rear end magnetic pole layer 12 and the precursor magnetic pole layer 111. It should be larger than the sum of the thickness and thickness.
[0058]
Subsequently, as shown in FIG. 7, the rear end magnetic pole layer 12 and the precursor magnetic pole layer 111 are planarized. Specifically, the rear end magnetic pole layer 12 and the precursor magnetic pole layer 111 are polished together with the insulating layer 13 at least until the rear end magnetic pole layer 12 is exposed by polishing the entire surface using, for example, a CMP method. And flatten. This polishing process selectively removes the portion of the precursor magnetic pole layer 111 that has run over the trailing end magnetic pole layer 12, so that the trailing edge TE is defined based on the polished surface as shown in FIG. As shown in FIG. 11, the tip pole layer 11 having a width W <b> 1 is formed so as to be in direct contact with and adjacent to the trailing pole layer 12. Thereby, the main magnetic pole layer 20 including the front magnetic pole layer 11 (width W1) and the rear magnetic pole layer 12 (width W2) is completed. In the main magnetic pole layer 20, the front magnetic pole layer 11 and the rear magnetic pole layer 12 are separate from each other, and the trailing-side surfaces 11M and 12M are included in the same plane. When the tip pole layer 11 is formed, for example, the trailing pole layer 12 is not exposed due to an error in polishing accuracy, and a portion of the precursor pole layer 111 that has run over the trailing pole layer 12 is not exposed. In order to prevent unintentional remaining, the thickness T of the main magnetic pole layer 20 finally formed is larger than the thickness T1 of the trailing magnetic pole layer 12 and the thickness T2 of the precursor magnetic pole layer 111. It is preferable to perform the polishing process until it becomes smaller (T <T1, T2).
[0059]
In the method of manufacturing a thin film magnetic head according to the present embodiment, with respect to the magnetic pole layer 30 including the auxiliary magnetic pole layer 8, the seed layer 10 and the main magnetic pole layer 20, the tip magnetic pole layer 11 constituting the main magnetic pole layer 20 is included. And the trailing end pole layer 12 are formed in separate steps, the leading end pole layer 11 and the trailing end pole layer 12 are separated from each other, and the surfaces 11M and 12M on the trailing side are the same. Since it is included in the plane, the main magnetic pole layer 20 can be formed with high accuracy and the thin film magnetic head can be stably mass-produced for the following reason.
[0060]
That is, as a comparative example with respect to the present embodiment, for example, when the front pole layer 11 and the rear pole layer 12 are integrally formed in one step, the main magnetic pole layer 20 is formed using photolithography. When forming a photoresist pattern for forming a photoresist pattern, both a small area region corresponding to the narrow front pole layer 11 and a large area region corresponding to the wide rear pole layer 12 are formed in one photoresist film. Therefore, as described in the above section “Problem to be Solved by the Invention”, the exposure range of the small area region is easily enlarged due to the exposure of the large area region. In this case, even if the tip pole layer 11 is finally formed to have a uniform width W1 in the extending direction, in practice, for example, as shown in FIG. Direction), the width of the tip pole layer 11 gradually increases from W1 to W11 larger than this (W11> W1), making it difficult to form the tip pole layer 11 with high accuracy. In particular, when the width of the tip pole layer 11 is increased as described above, the flare point FP is shifted rearward from the target position as shown in FIG. 12, so that it is difficult to control the flare point FP. . Note that “(flare point) FP” shown in FIG. 12 represents the initial target position.
[0061]
On the other hand, in the present embodiment, the front pole layer 11 and the rear pole layer 12 are formed in separate steps, whereby the flare point FP and the constant width W1 that defines the recording track width are different. Defined in the process. Specifically, as shown in FIG. 3, the flare point FP is defined at the front end of the rear end pole layer 12, and as shown in FIG. 5, the flare point FP is formed in a separate process from the rear end pole layer 12. On the basis of the width W1 of the front end portion 111A in the precursor magnetic pole layer 111, a constant width W1 that defines the recording track width is defined. In this case, the photoresist pattern used for forming the trailing end pole layer 12 and the photoresist pattern used for forming the precursor pole layer 111 are formed in separate steps, and the trailing end pole layer is formed. Since the large area region corresponding to the layer 12 and the small area region corresponding to the precursor magnetic pole layer 111 are not included in one photoresist film, the exposure range of the small area region is hardly affected by the exposure of the large area region. That is, it becomes difficult to expand the exposure range of the small area region. As a result, as shown in FIG. 11, it is possible to form the tip pole layer 11 so as to finally have a uniform width W1 in the extending direction. Of course, in this case, since the tip pole layer 11 has a uniform width W1, the flare point FP can be set to a desired target position, and the flare point FP is easily controlled. Therefore, in the present embodiment, the main magnetic pole layer 20 can be formed with high accuracy and the thin film magnetic head can be stably mass-produced.
[0062]
In addition to the above, in the present embodiment, the tip pole layer 11 is formed by polishing the precursor pole layer 111 using a polishing process, so that the trailing edge TE of the main pole layer 20 is based on the polished surface. It is prescribed. This trailing edge TE is a substantial recording portion of the main magnetic pole layer 20 and is required to be sufficiently flat in order to ensure the recording density. In this regard, in this embodiment, unlike the case where the tip pole layer 11 is formed by using only the plating process without using the polishing process in combination, the trailing edge is utilized by utilizing the flat processing characteristics by the polishing process. Since TE is flattened with high accuracy, it is possible to contribute to high-precision formation of the main magnetic pole layer 20 also from this viewpoint.
[0063]
In the present embodiment, since the gap layer 13 is extremely thin (thickness of about 0.2 μm or less) on the flat surface after polishing (a flat surface including the surfaces 11M and 12M), it is uneven. Unlike the case where the extremely thin gap layer 13 is formed on the surface, the formation thickness of the gap layer 13 can be controlled with high accuracy.
[0064]
In the present embodiment, as shown in FIGS. 6 to 8, a polishing process typified by a CMP method is used as a means for planarizing the trailing end magnetic pole layer 12 and the precursor magnetic pole layer 111. However, the present invention is not necessarily limited to this. As long as the main magnetic pole layer 20 including the front magnetic pole layer 11 and the rear magnetic pole layer 12 can be formed by planarizing the rear magnetic pole layer 12 and the precursor magnetic pole layer 111, Other methods may be used instead of the polishing process. As this “other method”, for example, an etching process typified by ion milling can be mentioned. When this ion milling is used, for example, the insulating layer 13 shown in FIG. 6 is made of a photoresist instead of alumina, and the etching rate with respect to the trailing end magnetic pole layer 12 and the precursor magnetic pole layer 111 and the insulating layer 13 are compared. If the etching process is performed under such etching conditions that the etching rates are substantially equal to each other, the main magnetic pole layer 20 can be formed as in the case where the polishing process is used, as shown in FIG. The “etching conditions” include, for example, a perpendicular (line in the Y-axis direction) to the extending surface (a plane including the X axis and the Y axis) of the trailing end magnetic pole layer 12 and the precursor magnetic pole layer 111 and the irradiation direction of the ion beam. Is an angle between about 65 ° and 70 °. Even in this case, the same effect as the above embodiment can be obtained.
[0065]
Further, in the present embodiment, as shown in FIG. 10, the precursor magnetic pole is included so as to include a front end portion 111A having a constant width W0 and a rear end portion 111B having a width W5 larger than the width W0 of the front end portion 111A. Although the layer 111 is formed, the present invention is not necessarily limited to this. For example, as shown in FIG. 13, the precursor magnetic pole layer 111 may be formed so as to have a constant width W0 as a whole. In this case, at the time of forming the photoresist pattern, only a small area corresponding to the narrow front end 111A is included in the photoresist film, and a large area corresponding to the wide rear end 111B is included. Therefore, the small area is exposed with high accuracy without being affected by the exposure of the large area. Therefore, the width W0 of the precursor magnetic pole layer 111 can be controlled with higher accuracy.
[0066]
[Second Embodiment]
Next, a second embodiment of the present invention will be described.
[0067]
14A and 14B show a cross-sectional configuration of a thin film magnetic head according to the second embodiment of the present invention. FIG. 14A shows a cross section parallel to the air bearing surface, and FIG. 14B shows a cross section perpendicular to the air bearing surface. Is shown. In FIG. 14, the same components as those described in the first embodiment are denoted by the same reference numerals.
[0068]
In this thin-film magnetic head, the pole layer 30 is configured including the auxiliary pole layer 8, the seed layer 10, and the main pole layer 20, and the leading pole layer 11 and the trailing pole layer 12 constituting the main pole layer 20 are directly connected to each other. Unlike the first embodiment, which is adjacent to and in contact with each other, the magnetic pole layer 30 includes the auxiliary magnetic pole layer 8, the seed layer 10, and the main magnetic pole layer 20 together with another seed layer 110. 11 and the trailing end magnetic pole layer 12 have the same configuration as that of the thin film magnetic head described in the first embodiment except that they are adjacent to each other via the seed layer 11.
[0069]
In the present embodiment, the seed layer 10 is used to form the entire main magnetic pole layer 20 (both the front magnetic pole layer 11 and the rear magnetic pole layer 12), and the first embodiment. Is different from the main magnetic pole layer 20 in order to form only the rear end magnetic pole layer 12. On the other hand, the seed layer 110 is used for performing a plating process in a manufacturing process of a thin film magnetic head, which will be described later, similarly to the seed layer 10, and is used particularly for forming only the tip pole layer 11. Is. The seed layer 110 is made of, for example, the same magnetic material as that of the tip pole layer 11.
[0070]
The front end face 12FM of the rear end pole layer 12 is inclined rearward with respect to the extending direction (Y-axis direction) of the rear end pole layer 12, and the rear end face RM of the front end pole layer 11 is rear end pole layer. The front end surface 12FM of 12 is inclined rearward. The seed layer 10 is disposed only behind the flare point FP corresponding to the region where the rear end pole layer 12 is disposed, and the seed layer 110 is formed from the region ahead of the flare point FP from the rear end pole layer. 12 are disposed so as to ride on the front end face 12FM. That is, the portion of the seed layer 110 that rides on the front end face 12FM is sandwiched between the front end face 12FM and the rear end face 11RM, and as described above, the front pole layer 11 and the rear pole layer 12 are mutually connected. Adjacent through the seed layer 110.
[0071]
In the thin film magnetic head according to the present embodiment, with respect to the magnetic pole layer 30 including the auxiliary magnetic pole layer 8, the seed layers 10 and 110, and the main magnetic pole layer 20, the tip magnetic pole layer 11 constituting the main magnetic pole layer 20 and Since the trailing end magnetic pole layer 12 is separated from each other, and the trailing-side surfaces 11M and 12M are included in the same plane, the following description will be made in the same manner as in the first embodiment. The manufacturing method of the thin film magnetic head of the present invention can be applied. Accordingly, even in this case, stable mass productivity can be obtained, so that stable performance can be ensured.
[0072]
Next, a method of manufacturing the thin film magnetic head shown in FIG. 14 will be described with reference to FIGS. 15 to 20 are for explaining the manufacturing process of the thin film magnetic head, and all show the cross-sectional structure corresponding to FIG.
[0073]
When the main magnetic pole layer 20 is formed in the present embodiment, the seed layer 10 for performing the plating process is formed through the same process (see FIG. 3) as the first embodiment, and then the seed is continuously formed. A flare point FP is formed at the front end of the rear end pole layer 12 by forming a rear end pole layer 12 (thickness T1) by growing a plating film using a photoresist pattern (not shown) together with the layer 10. After the definition, for example, ion milling is used, and the seed layer 10 is etched using the back pole layer 12 as a mask. By this etching process, as shown in FIG. 15, mainly using the etching action in the vertical direction, by etching and digging out portions other than the portion corresponding to the rear end pole layer 12 of the seed layer 10, An unnecessary portion of the seed layer 10 is selectively removed to expose the insulating layer 9. When performing this etching process, for example, the seed layer 10 is etched and the rear end magnetic pole layer 12 is also etched, and the front end surface 12FM of the rear end magnetic pole layer 12 is continuously retracted in the thickness direction. The front end face 12FM is inclined backward with respect to the extending direction (Y-axis direction) of the rear end pole layer 12.
[0074]
Subsequently, as shown in FIG. 16, another seed layer 110 different from the previously formed seed layer 10 is formed so as to cover the rear end pole layer 12 and its peripheral region by using, for example, sputtering. .
[0075]
Subsequently, by growing a plating film using a photoresist pattern (not shown) together with the seed layer 110, a precursor magnetic pole layer 111 (thickness) for forming the tip magnetic pole layer 11 as shown in FIG. To form a pattern. When this precursor magnetic pole layer 111 is formed, it includes a front end portion 111A (width W0) and a rear end portion 111B (width W5> W0; see FIG. 10), and the front end portion 111A is formed on the seed layer 110 on the rear end magnetic pole. It rides on the rear end pole layer 12 from the front region of the layer 12.
[0076]
Subsequently, for example, ion milling is used to etch the seed layer 110 using the precursor magnetic pole layer 111 as a mask, thereby using the etching action mainly in the vertical direction as shown in FIG. By etching away the portion other than the portion corresponding to the precursor magnetic pole layer 111, unnecessary portions of the seed layer 110 are selectively removed to expose the insulating layer 9. At this time, for example, the seed layer 110 and the precursor magnetic pole layer 111 are also etched, and the tip 111A is etched mainly using the etching action in the width direction, so that the width of the tip 111A is reduced to W0. From W1 to W1. Thus, a constant width W1 that defines the recording track width is defined based on the constant width W1 of the tip end portion 111A.
[0077]
Subsequently, as illustrated in FIG. 19, the insulating layer 13 is formed so as to cover the peripheral region thereof together with the rear end magnetic pole layer 12 and the precursor magnetic pole layer 111 using, for example, sputtering.
[0078]
Subsequently, the rear end magnetic pole layer 12, the seed layer 110, and the precursor magnetic pole layer 111 are planarized. Specifically, for example, by performing a polishing process using the CMP method, the rear end magnetic pole layer 12, the seed layer 110, and the precursor magnetic pole layer 111 are formed together with the insulating layer 13 until at least the rear end magnetic pole layer 12 is exposed. Polish and dig. This polishing process selectively removes the portion of both the precursor magnetic pole layer 111 and the seed layer 110 that has ridden on the trailing end magnetic pole layer 12, and as shown in FIG. A front edge pole layer 11 (thickness T) having a ring edge TE and having a width W1 is formed adjacent to the rear end pole layer 12 with the seed layer 110 interposed therebetween. At this time, the seed layer 110 rides on the front end face 12FM of the rear end pole layer 12 from a region ahead of the flare point FP, and the rear end face 11RM of the front end pole layer 11 corresponds to the front end face 12FM of the rear end pole layer 12. Tilt. Thereby, the main magnetic pole layer 20 including the front magnetic pole layer 11 (width W1) and the rear magnetic pole layer 12 (width W2) is completed. In the main magnetic pole layer 20, the front magnetic pole layer 11 and the rear magnetic pole layer 12 are separate from each other, and the trailing-side surfaces 11M and 12M are included in the same plane.
[0079]
In the method of manufacturing a thin film magnetic head according to the present embodiment, with respect to the magnetic pole layer 30 including the auxiliary magnetic pole layer 8, the seed layers 10 and 110, and the main magnetic pole layer 20, the tip magnetic pole constituting the main magnetic pole layer 20 is used. By forming the layer 11 and the trailing end pole layer 12 in separate steps, the leading end pole layer 11 and the trailing end pole layer 12 are separated from each other, and the trailing-side surfaces 11M and 12M are formed. Since they are included in the same plane, the main magnetic pole layer 20 can be formed with high precision and the thin-film magnetic head can be stably mass-produced by the same action as in the first embodiment.
[0080]
In particular, in the present embodiment, as shown in FIG. 15, the front end face 12FM of the rear end pole layer 12 is inclined rearward, so that the following is compared with the first embodiment. For this reason, an advantage can be obtained when the precursor magnetic pole layer 111 is formed in a later step. That is, as shown in FIG. 3 in the first embodiment, the front end face 12FM is substantially perpendicular to the extending direction of the trailing end pole layer 12, and with respect to the extending direction of the trailing end pole layer 12. If not inclined, for example, as shown in FIG. 4, the photoresist film is subjected to pattern exposure using a photolithography process to form a photoresist pattern (not shown) for forming the precursor magnetic pole layer 111. In this case, the vicinity of the corner C1 where the trailing end pole layer 12 and the seed layer 10 are in contact with each other in the photoresist film is hidden behind the trailing end pole layer 12 and is not sufficiently exposed. It may be difficult to perform pattern exposure with high accuracy. As a result, an unexposed photoresist film tends to remain in the vicinity of the corner C1, and the formation accuracy of the finally formed photoresist pattern may be lowered. On the other hand, when the front end face 12FM is inclined rearward as shown in FIG. 15 in the present embodiment, for example, during pattern exposure of the photoresist film as shown in FIG. Since the corner C2 corresponding to the above-described corner C1 is not exposed to the shadow of the trailing end pole layer 12 and is sufficiently exposed, the photoresist film can be subjected to pattern exposure with high accuracy. As a result, an unexposed photoresist film is unlikely to remain in the vicinity of the corner C2, and an advantage is obtained that the formation accuracy of the finally formed photoresist pattern is improved.
[0081]
The other configurations, operations, functions and effects relating to the thin film magnetic head according to the present embodiment and the operations, effects and modifications other than those described above relating to the method of manufacturing the thin film magnetic head are the same as those in the first embodiment. Since there is, explanation is omitted.
[0082]
This is the end of the description of the thin film magnetic head according to the embodiment of the invention.
[0083]
Next, with reference to FIG. 21 and FIG. 22, the configuration of a magnetic recording apparatus equipped with the thin film magnetic head of the present invention will be described. FIG. 21 shows a notched general configuration of the magnetic recording apparatus, and FIG. 22 shows an enlarged external configuration of the main part of the magnetic recording apparatus. This magnetic recording apparatus is mounted with the thin film magnetic head described in the first and second embodiments, and is a hard disk drive, for example.
[0084]
As shown in FIG. 21, the magnetic recording device is arranged in a housing 200 corresponding to each of the magnetic disks 201 and a plurality of magnetic disks 201 as recording media on which information is recorded. And a plurality of arms 202 having head sliders 210 attached to the tips. The magnetic disk 201 is rotatable about a spindle motor 203 fixed to the housing 200. The arm 202 is connected to a drive unit 204 serving as a power source, and can turn around a fixed shaft 205 fixed to the housing 200 via a bearing 206. The drive unit 204 includes a drive source such as a voice coil motor, for example. Note that FIG. 21 shows a model in which a plurality of arms 202 rotate integrally around a fixed shaft 205, for example.
[0085]
As shown in FIG. 22, the head slider 210 has one side surface orthogonal to the air bearing surface 220 in a substantially rectangular parallelepiped base body 211 provided with a concavo-convex structure in order to reduce air resistance generated when the arm 202 turns. A perpendicular recording type thin film magnetic head 212 is disposed on the front side surface in FIG. The thin film magnetic head 212 has, for example, the configuration described in the above embodiment. In FIG. 22, in order to make the structure of the head slider 210 on the air bearing surface 220 side easier to see, the state shown in FIG.
[0086]
The detailed configuration of the thin-film magnetic head 212 has already been described in detail in each of the above embodiments, and the description thereof will be omitted.
[0087]
In this magnetic recording apparatus, the head slider 210 moves to a predetermined area (recording area) of the magnetic disk 201 by turning the arm 202 during information recording. When the thin film magnetic head 212 is energized while facing the magnetic disk 201, the thin film magnetic head 212 records information on the magnetic disk 201 by operating as described in the above embodiments.
[0088]
Since this magnetic recording apparatus is provided with the thin film magnetic head 212 of the present invention, the recording performance can be secured stably.
[0089]
Note that the configuration, operation, action, and effects of the magnetic recording apparatus other than those described above are the same as those in the above-described embodiments, and thus description thereof is omitted.
[0090]
While the present invention has been described with reference to the embodiments, the present invention is not limited to these embodiments, and various modifications can be made. Specifically, for example, in the above embodiment, the case where the present invention is applied to a single pole type head has been described. However, the present invention is not necessarily limited thereto, and may be applied to a ring type head. In the above embodiment, the case where the present invention is applied to the composite thin film magnetic head has been described. However, the present invention is not limited to this. For example, a recording-only thin film having an inductive magnetic conversion element for writing. The present invention can also be applied to a magnetic head and a thin film magnetic head having an inductive magnetic transducer for both recording and reproduction. Of course, the present invention can also be applied to a thin film magnetic head having a structure in which the stacking order of the writing element and the reading element is reversed.
[0091]
In the above embodiment, the case where the present invention is applied to a perpendicular recording type thin film magnetic head has been described. However, the present invention is not necessarily limited to this, and the present invention is applied to a longitudinal recording type thin film magnetic head. Is also possible.
[0092]
【The invention's effect】
  As described above, according to the present inventionFirst or secondPerpendicular magnetic recording headManufacturing methodAccording toBy forming the first magnetic pole layer portion and the second magnetic pole layer portion constituting the magnetic pole layer in separate steps, the first magnetic pole layer portion and the second magnetic pole layer portion are separated from each other. In addition, the first magnetic pole layer portion and the second magnetic pole layer portion are integrated in one step because the surfaces on the medium traveling direction side are included in the same plane. Compared to the formation, when forming a photoresist pattern for forming the pole layer using a photolithography process, a small portion corresponding to the narrow first pole layer portion in the photoresist film is formed. The exposure range of the area area is difficult to expand due to the exposure of the large area area corresponding to the wide second magnetic pole layer portion. Accordingly, the first pole layer portion can be formed so as to finally have a uniform width in the extending direction. Therefore, the pole layer is formed with high accuracy and the perpendicular magnetic recording head is stably mass-produced. be able to.
[0097]
  Further, according to the present inventionSecondIn the method of manufacturing a perpendicular magnetic recording head, when forming the pattern of the second magnetic pole layer portion, if the front end surface is inclined backward with respect to the extending direction of the second magnetic pole layer portion, the precursor magnetic pole When pattern exposure of a photoresist film is performed using a photolithography process to form a photoresist pattern for forming a layer, the photoresist film can be pattern exposed with high accuracy. As a result, a photoresist pattern can be formed with high accuracy.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a cross-sectional configuration of a thin film magnetic head according to a first embodiment of the invention.
2 is a plan view showing a planar configuration of a main part of the thin film magnetic head shown in FIG. 1. FIG.
FIG. 3 is a cross-sectional view for explaining one step in the manufacturing process of the thin film magnetic head according to the first embodiment of the invention.
4 is a cross-sectional view for explaining a process following the process in FIG. 3; FIG.
FIG. 5 is a cross-sectional view for explaining a process following the process in FIG. 4;
6 is a cross-sectional view for illustrating a process following the process in FIG. 5. FIG.
7 is a cross-sectional view for explaining a process following the process in FIG. 6; FIG.
FIG. 8 is a cross-sectional view for explaining a step following the step of FIG. 7;
9 is a plan view showing a planar configuration of a main part of a thin film magnetic head in the middle of manufacture corresponding to the sectional configuration shown in FIG. 3;
10 is a plan view showing a planar configuration of a main part of a thin film magnetic head in the middle of manufacture corresponding to the sectional configuration shown in FIG.
11 is a plan view showing a planar configuration of a main part of a thin film magnetic head in the middle of manufacture corresponding to the sectional configuration shown in FIG.
FIG. 12 is a plan view for explaining problems with the method of manufacturing a thin film magnetic head.
FIG. 13 is a plan view for explaining a modification example of the method of manufacturing the thin film magnetic head according to the first embodiment of the invention.
FIG. 14 is a cross-sectional view showing a cross-sectional configuration of a thin film magnetic head according to a second embodiment of the invention.
FIG. 15 is a cross-sectional view for explaining a step in the manufacturing process of the thin-film magnetic head according to the second embodiment of the invention.
16 is a cross-sectional view for illustrating a process following the process in FIG. 15. FIG.
FIG. 17 is a cross-sectional view for explaining a process following the process in FIG. 16;
FIG. 18 is a cross-sectional view for explaining a process following the process in FIG. 17;
FIG. 19 is a cross-sectional view for illustrating a process following the process in FIG. 18;
FIG. 20 is a cross-sectional view for explaining a process following the process in FIG. 19;
FIG. 21 is a perspective view showing a cut-out appearance configuration of a magnetic recording apparatus on which the thin film magnetic head of the invention is mounted.
22 is an enlarged perspective view showing the external configuration of the main part of the magnetic recording apparatus shown in FIG. 21. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Substrate, 2, 9, 13, 18 ... Insulating layer, 3 ... Lower lead shield layer, 4 ... Shield gap film, 5 ... Upper lead shield layer, 6 ... MR element, 7 ... Separation layer, 8 ... Auxiliary magnetic pole layer DESCRIPTION OF SYMBOLS 10,110 ... Seed layer, 11 ... Front pole layer, 11M, 12M ... Face, 11RM ... Rear end face, 12 ... Rear end pole layer, 12FM ... Front end face, 14 ... Gap layer, 14BG ... Back gap, 15 ... TH Specified layer, 16 ... yoke layer, 17 ... thin film coil, 19 ... overcoat layer, 20 ... main magnetic pole layer, 30 ... magnetic pole layer, 40 ... write shield layer, 50, 220 ... air bearing surface, 100A ... reproducing head part, DESCRIPTION OF SYMBOLS 100B ... Recording head part, 111 ... Precursor magnetic pole layer, 111A ... Front end part, 111B ... Rear end part, 200 ... Case, 201 ... Magnetic disk, 202 ... Arm, 203 ... Spindle motor, 204 Drive unit, 205 ... fixed shaft, 206 ... bearing, 210 ... head slider, 211 ... base, 212 ... thin film magnetic head, FP ... flare point, M ... medium traveling direction, NH ... neck height, TE ... trailing edge, TH ... Throat height, TP ... Throat height zero position, WE ... Front edge.

Claims (3)

A method of manufacturing a perpendicular magnetic recording head comprising: a thin film coil that generates magnetic flux; and a magnetic pole layer that emits the magnetic flux generated in the thin film coil toward a recording medium that moves in the medium traveling direction,
The first pole layer portion is formed so that the step of forming the pole layer extends from the recording medium facing surface facing the recording medium with a constant width defining a recording track width backward. A second magnetic pole layer portion that is magnetically coupled to the rear of the first magnetic pole layer portion in the same level as the first magnetic pole layer portion and has a larger width than the first magnetic pole layer portion. Are included as separate processes,
The first magnetic pole layer portion and the second magnetic pole layer portion are separated from each other so that the surfaces on the medium traveling direction side are included in the same plane ,
The first step and the second step are:
By forming the pattern of the second magnetic pole layer portion, a widening position at which the width of the magnetic pole layer extends from the first magnetic pole layer portion to the second magnetic pole layer portion at the front end of the second magnetic pole layer portion. A process of defining
By patterning the precursor magnetic pole layer so that a portion having a constant width corresponding to the constant width partially climbs from the front region of the second magnetic pole layer portion to the second magnetic pole layer portion, the precursor magnetic pole layer is formed. Defining the constant width in a portion of the layer having the constant width;
Forming an insulating layer so as to cover the second magnetic pole layer portion and the precursor magnetic pole layer and their peripheral regions;
The insulating layer and the precursor magnetic pole layer are planarized using an etching process until at least the second magnetic pole layer portion is exposed, and a portion of the precursor magnetic pole layer that rides on the second magnetic pole layer portion is selected. Removing the first magnetic pole layer portion so that the first magnetic pole layer portion is directly in contact with and adjacent to the second magnetic pole layer portion.
A method of manufacturing a perpendicular magnetic recording head, comprising: A method of manufacturing a perpendicular magnetic recording head comprising: a thin film coil that generates a magnetic flux; and a magnetic pole layer that emits the magnetic flux generated in the thin film coil toward a recording medium that moves in the medium traveling direction,
The first pole layer portion is formed so that the step of forming the pole layer extends from the recording medium facing surface facing the recording medium with a constant width defining a recording track width backward. A second magnetic pole layer portion that is magnetically coupled to the rear of the first magnetic pole layer portion in the same level as the first magnetic pole layer portion and has a larger width than the first magnetic pole layer portion. Are included as separate processes,
The first magnetic pole layer portion and the second magnetic pole layer portion are separated from each other so that the surfaces on the medium traveling direction side are included in the same plane,
The first step and the second step are:
By forming the pattern of the second magnetic pole layer portion, a widening position at which the width of the magnetic pole layer extends from the first magnetic pole layer portion to the second magnetic pole layer portion at the front end of the second magnetic pole layer portion. A process of defining
Forming a seed layer so as to cover the second magnetic pole layer portion and its peripheral region;
A plating film is grown using the seed layer, and a portion having a constant width corresponding to the constant width is a portion on the seed layer from the front region of the second magnetic pole layer portion to the second magnetic pole layer portion. Patterning the precursor magnetic pole layer so as to ride on, and defining the constant width in a portion of the precursor magnetic pole layer having the constant width; and
Forming an insulating layer so as to cover the second magnetic pole layer portion and the precursor magnetic pole layer and their peripheral regions;
The insulating layer, the precursor magnetic pole layer, and the seed layer are planarized using an etching process until at least the second magnetic pole layer portion is exposed, and the second magnetic layer of the precursor magnetic pole layer is planarized. Forming the first magnetic pole layer portion so as to be indirectly adjacent to the second magnetic pole layer portion via the seed layer by selectively removing a portion riding on the polar layer portion;
including
A method of manufacturing a perpendicular magnetic recording head. Forming the second magnetic pole layer portion so that the front end surface is inclined backward with respect to the extending direction of the second magnetic pole layer portion in the step of patterning the second magnetic pole layer portion; The method of manufacturing a perpendicular magnetic recording head according to claim 2 .

Images