JP4112888B2 - Manufacturing method of micro optical system having three-dimensional structure and micro optical system implementing the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a micro optical system having a three-dimensional structure and a micro optical system that implements the method.
The manufacturing method of a micro optical system having a three-dimensional structure according to the present invention and a micro optical system that implements the method realize a micro optical system having a three-dimensional structure by bending a flat substrate on which elements are manufactured by flat photolithography or the like. It is a thing.
[0002]
[Prior art]
In general, an optical system is configured by combining a plurality of different and different bulk materials, and it is necessary to provide a space in which light is propagated including an alignment adjusting mechanism, so that the optical system has a large volume. This point is often negative in terms of usability and cost from the side of using the optical system. In addition, an optical system having a large volume has a drawback that it is easily affected by drifts such as thermal fluctuations and air fluctuations.
In order to increase the stability of the optical system, various proposals have been made because it is necessary to make the optical system small and highly integrated. Attempts to integrate conventional optical systems have mainly embedded various functions on the optical path based on a planar waveguide. Although this method may be used for applications that do not require light to be emitted to the outside, it is inevitable that light is propagated through a free space and irradiated with a distance sensor that measures the distance of an object.
For example, special lenses and diffraction gratings are required to efficiently couple the waveguide and free space, but these are expensive and special elements, so the elements are placed actively using free space. A method for realizing a compact optical system has been proposed. Devices that use this free space for the optical path are attractive because of less crosstalk and a high degree of freedom in the optical system that can be configured. However, a processing method that has a proven record in mass production is two-dimensional photolithography mainly for a plane, and it is difficult to prepare a three-dimensional structure required by an optical system.
[0003]
For this reason, in an optical system that has been realized in the past, complete integration from the light source to the detector is difficult, and the device is manufactured at a high cost for assembly.
A feature of the free space type integrated optical device is that a fine mechanical structure including a microactuator can be manufactured in large quantities at a low cost. As a method for constructing a three-dimensional structure that has been studied in the field of optical application with the development of MEMS, there is a so-called silicon optical bench. In this method, a planar silicon substrate is viewed on an optical bench, and a thin film of mainly polycrystalline silicon is vertically formed on the surface to form a three-dimensional deep structure. Various optical systems are used. Has been demonstrated.
However, this method cannot be used with a proven flip chip bonding technique when mounting a bulk device element prepared by another manufacturing method typified by a semiconductor laser chip. Is leaving.
[0004]
[Problems to be solved by the invention]
From the viewpoint of heat dissipation of the semiconductor laser and ease of wiring, it is desirable to arrange the device elements in close contact with the substrate, but it is not possible to make a three-dimensional deep structure from bulk silicon with such a configuration. It was not easy, and there was no technical solution that achieved both the three-dimensional deep structure unique to free-space optical devices and the ease of assembling bulk device elements. For this reason, a free space type optical device for pre-aligning and arranging the elements in a three-dimensional manner after securing the optical path through which the light should pass in a configuration in which the device elements are arranged in close contact with the substrate. Realization of a technology for manufacturing a three-dimensional structure is required.
[0005]
[Means for Solving the Problems]
The present invention creates a three-dimensional arrangement from a planar arrangement by bending an element manufactured and arranged on a planar substrate such as a silicon wafer using a photolithography technique together with the substrate, and a free space type micro optical system is formed. The problem is solved by realizing the method of configuring.
In the manufacturing method of the micro optical system having a three-dimensional structure and the micro optical system implementing the same according to the present invention, the silicon substrate is selectively divided into two or more parts through straight creases and handled while being connected. Therefore, the silicon substrates are not displaced from each other, and can be kept in a prealigned position using planar lithography.
According to the present invention, since the conventional planar lithography processing method is used as it is, and a three-dimensional structure is created from the planar substrate in a subsequent process, the entire optical system can be obtained without unnecessarily increasing the technical difficulty level. Can be designed and manufactured.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a diagram for explaining a method for manufacturing a micro-optical system having a three-dimensional structure according to the present invention and the configuration of a micro-optical system that implements the method.
1A shows a silicon substrate before bending, and FIGS. 1B and 1C show an overview of a structure in which the silicon substrate is bent.
In FIGS. 1A and 1B, reference numeral 10 denotes a silicon substrate having a planar structure. Reference numeral 11 denotes one substrate on which the silicon substrate 10 is bent, and reference numeral 12 denotes the other substrate to be bent. On one substrate 11 and the other substrate 12 of the silicon substrate 10, elements that are necessary when a three-dimensional structure is formed by using a planar lithography processing method are finely processed or arranged.
Reference numeral 20 denotes a linear groove indicating a bending position for bending the silicon substrate 10, and is formed by thinly cutting the silicon substrate into a V shape by etching. Reference numeral 21 denotes a photoresist, which is a soft material for connecting between the substrates 11 and 12.
[0007]
In order to prepare a straight soft bending position 20 for bending the silicon substrate 10, there is a method in which the silicon substrate is selectively thinned by dicing or replaced with a soft material softened by heating such as a photoresist. Can be used.
Reference numeral 30 denotes a jig used to bend the flat silicon substrate 10, and has two flat surfaces 31 and 32 having an angle necessary for bending with respect to the straight line 41. The jig 30 is processed by normal machining.
The micro optical system having a three-dimensional structure according to the present invention is manufactured as follows.
A silicon substrate 10 subjected to microfabrication shown in FIG. 1A is placed on a jig 30 as shown in FIG. 1B, and a linear groove 20 for bending the silicon substrate 10 is formed. Place it along the straight line 41 of the jig 30 and heat it to around 150 ° C.
As shown in FIG. 1C, the silicon substrate 10 is bent in a straight groove 20 like an origami as the temperature rises by heating. One substrate 11 that bends the silicon substrate 10 in a high temperature state and the other substrate 12 that is to be folded are in close contact with the flat surfaces 31 and 32 of the jig 30 without any gap, and when the temperature is lowered in the close contact state, along the jig. Fixed at an angle.
[0008]
When the temperature of the photoresist of the soft material connecting the flat substrates 11 and 12 decreases to room temperature, the bending angle is fixed and there is no problem in handling.
Actually, when a tensile load was applied to the bent position, it was confirmed that it could withstand a load of at least 217 gf / cm. However, the bending angle is deformed when a load is applied.
In addition, when it is necessary to firmly fix the bending angle, it is possible to use the silicon substrate 10 and the jig 30 that are completely fixed by bonding.
FIG. 2A shows a photograph of a jig that serves as a reference for the bending angle using the actually obtained 45 ° bent structure of the silicon substrate in FIG.
FIG. 3 shows data obtained by measuring the substrate shape after the temperature of the silicon substrate is lowered. The data in FIG. 3 is for an angle of 20 °. The data in FIG. 3 shows that deformation has occurred only in the central portion, and the other has maintained a planar structure.
[0009]
FIG. 4 shows data obtained by measuring the reproducibility of the bending angle after repeatedly deforming the same wafer against the jig repeatedly. The data in FIG. 4 indicates that reproducibility with an angle error of ± 0.2 ° is obtained.
Various three-dimensional optical systems can be realized by using the method for manufacturing a micro-optical system having the three-dimensional structure described above. Hereinafter, examples in which several optical systems are manufactured will be described.
FIG. 5 shows an embodiment in which a distance sensor and a speed sensor are manufactured by applying the present invention to a triangulation optical system. The embodiment of FIG. 5 is a case where there is one fold.
In FIG. 5, the same parts as those in FIG. The BD is a beam position detector disposed on the flat substrate 11 and is configured by a photodiode. LS is a semiconductor laser disposed on the flat substrate 11, and L 1 is a collimation lens disposed on the flat substrate 11.
MS is a reflection mirror formed on the flat substrate 12.
DT is a sample to be measured. L2 is a condenser lens.
The planar substrate 11 and the planar substrate 12 are fixed at a predetermined angle by a photoresist 21 to form a triangulation optical system micro-optical system having a three-dimensional structure.
[0010]
The operation of the micro-optical system configured as described above is performed as follows.
A parallel beam BM is generated by a semiconductor laser LS serving as a light source and a collimation lens L1 disposed on the flat substrate 11. The parallel beam BM is obliquely incident on the reflection mirror MS formed on the flat substrate 12.
The parallel beam BM is reflected by the reflection mirror MS and emitted upward with respect to the mirror.
The parallel beam BM reflected by the reflecting mirror MS hits the sample DT to be measured and is reflected. A part of the light of the parallel beam BM reflected by the sample DT is condensed by the condenser lens L2, projected onto the flat substrate 11, and the reflection position is measured by the beam position detector BD disposed on the flat substrate 11. . Since light propagates through a triangular optical path, the velocity can be detected from the position of the object and its temporal change by the principle of triangulation.
[0011]
FIG. 6 shows an embodiment in which an encoder having a bending structure is manufactured by applying the present invention to an encoder. The embodiment of FIG. 6 is a case where there are two folds.
In FIG. 6, the same parts as those in FIG. Reference numeral 13 denotes a third substrate formed on the silicon substrate 10.
A light emitting diode LE is disposed on the first substrate 11 disposed on the silicon substrate 10, and a diffraction grating photodiode AD is disposed on the third substrate 13. . TK is a transmission type diffraction grating.
The first substrate 11, the second substrate 12, and the third substrate 13 are bent at right angles to each other and fixed in a U shape, and the first substrate 11 and the third substrate 13 are in a parallel state. It is fixed with.
A transmission type diffraction grating TK is arranged between the first substrate 11 and the third substrate 13 so as to be movable in parallel with the substrate 11 and the substrate 13, thereby constituting a micro optical system of the encoder. .
[0012]
The operation of the micro-optical system configured as described above is performed as follows.
A light beam is emitted from a light emitting diode LE, which is a light source, disposed on the flat substrate 11. This light beam is incident on the transmissive diffraction grating TK, and the beam diffracted by the diffraction grating TK is detected by the diffraction grating photodiode AD of the third substrate 13.
The signal detected by the diffraction grating photodiode AD on the third substrate 13 is changed by the movement of the diffraction pattern caused by the movement of the transmission type diffraction grating TK. Therefore, the diffraction grating photodiode AD is changed. Can be used as an encoder signal.
[0013]
FIG. 7 shows an embodiment in which a barcode reader is manufactured by applying the present invention to an optical scanner. The embodiment of FIG. 7 is a case where there is one fold.
In FIG. 7, the same parts as those in FIG. PD is a photodiode disposed on the planar substrate 11. LS is a semiconductor laser disposed on the planar substrate 11, L1 is a collimation lens disposed on the planar substrate 11, and L2 is a condenser lens L2.
SM is a scanning mirror of an optical scanner disposed on the flat substrate 12. The scanning mirror SM is operated by a microactuator and can change the out-of-plane emission angle of light. BC is a barcode to be measured.
The planar substrate 11 and the planar substrate 12 are fixed at a predetermined angle by a photoresist 21 to constitute a micro optical system of a barcode reader having a three-dimensional structure.
[0014]
The operation of the micro-optical system configured as described above is performed as follows.
A parallel beam BM is generated by a semiconductor laser LS serving as a light source and a collimation lens L1 disposed on the flat substrate 11. The parallel beam BM is obliquely incident on the scanning mirror SM disposed on the flat substrate 12.
The parallel beam BM is reflected by the scanning mirror SM and emitted upward with respect to the mirror.
The parallel beam BM reflected by the scanning mirror SM hits the barcode BC to be measured and is reflected. Part of the light of the parallel beam BM reflected by the barcode BC is incident on the planar substrate 11 through the condenser lens L2 and detected by a photodiode disposed on the planar substrate 11, and is detected at one point on the barcode. The light from is detected.
By changing the scanning angle of the scanning mirror SM and making the scanning angle correspond to the optical signal detected by the photodiode, the width of one point on the barcode can be measured, so the barcode BC to be measured is read. I can do it.
[0015]
FIG. 8 shows an embodiment in which the present invention is applied to a two-dimensional optical scanner to produce a laser beam operation type display. The embodiment of FIG. 8 is a case where there are two folds.
In FIG. 8, the same parts as those of FIG. Reference numeral 13 denotes a third substrate formed from the silicon substrate 10. The third substrate 13 is bent and fixed at a predetermined angle along a straight groove for bending the silicon substrate 10 with a photoresist 22 which is a soft material for connecting the substrate 12 to the third substrate 13.
LS is a semiconductor laser disposed on the flat substrate 11, and L 1 is a collimation lens disposed on the flat substrate 11. SM1 is a scanning mirror of the first optical scanner disposed on the flat substrate 12. SM2 is a scanning mirror of the second optical scanner disposed on the flat substrate 13.
The scanning mirrors SM1 and SM2 can change the out-of-plane emission angle of light.
The first substrate 11, the second substrate 12, and the third substrate 13 are bent and fixed at a predetermined angle to constitute a micro-optical system of a laser beam operation type display.
[0016]
The operation of the micro-optical system configured as described above is performed as follows.
A laser beam BM is generated by the semiconductor laser LS and the collimation lens L1 disposed on the planar substrate 11. This laser beam is incident on the scanning mirror SM1 disposed on the flat substrate 12 at an angle.
The laser beam BM incident on the scanning mirror SM1 is reflected by the scanning mirror SM1 and emitted obliquely upward with respect to the mirror.
The laser beam BM reflected by the scanning mirror SM1 is obliquely incident on the scanning mirror SM2 of the second optical scanner disposed on the flat substrate 13, reflected by the scanning mirror SM2, and emitted obliquely upward with respect to the mirror. .
By arbitrarily changing the scanning angle of the scanning mirrors SM1 and SM2, the laser beam BM reflected and emitted by the scanning mirror SM2 can be changed two-dimensionally, so that it can function as a laser beam operation type display. .
[0017]
FIG. 9 shows an embodiment in which an optical switch is manufactured by applying the present invention. The embodiment of FIG. 9 is a case where there is one fold.
In FIG. 9, the same parts as those in FIG. FB1 is a first optical fiber disposed on the first substrate 11, FB2 is a second optical fiber disposed on the first substrate 11, and FB3 is a third optical fiber disposed on the first substrate 11. It is.
The first optical fiber FB1, the second optical fiber FB2, and the third optical fiber FB3 are arranged radially on the first substrate 11 with a certain angle around a certain point on the second substrate 12. Yes.
SM is a scanning mirror disposed on the flat substrate 12.
The scanning mirror SM can change the out-of-plane emission angle of light.
The first substrate 11 and the second substrate 12 are bent and fixed at right angles to each other.
Scanning mirror SM of the optical scanner disposed on the flat substrate 12 at a position corresponding to the center of the first optical fiber FB1, the second optical fiber FB2, and the third optical fiber FB3 provided radially on the first substrate 11. Are arranged to constitute a micro optical system of the optical switch.
[0018]
The operation of the micro-optical system configured as described above is performed as follows.
The first optical fiber FB1 disposed on the flat substrate 11 is used as an input port, and an optical signal is introduced. The second optical fiber FB2 and the third optical fiber FB3 disposed on the planar substrate 11 are used as output ports, and a switched optical signal is output.
The optical signal introduced into the first optical fiber FB1 disposed on the planar substrate 11 enters the scanning mirror SM disposed on the planar substrate 12.
The optical signal of the first optical fiber FB1 incident on the scanning mirror SM is reflected by the scanning mirror SM.
By adjusting the angle of the scanning mirror SM, the optical signal reflected and emitted from the scanning mirror SM is used as the second optical fiber FB2 or the third optical fiber FB3 used as an output port disposed on the surface substrate 11. It can be switched by allocating.
Since the scanning mirror SM can switch the optical signal to the second optical fiber FB2 or the third optical fiber FB3, it can function as a 1 * 2 type optical switch.
An optical switch that switches an optical signal to an arbitrary number of output ports can be manufactured by increasing the number of optical fibers used as output ports.
[0019]
FIG. 10 shows an embodiment in which an optical variable attenuator having a bent structure is manufactured by applying the present invention to a variable attenuator. The embodiment of FIG. 10 is a case where there is one fold.
In FIG. 10, the same parts as those of FIG.
FB1 is a first optical fiber disposed on the first substrate 11, and FB2 is a second optical fiber disposed on the first substrate 11.
The first optical fiber FB1 and the second optical fiber FB2 are radially arranged on the first substrate 11 with a certain angle around a certain point on the second substrate 12.
SM is a scanning mirror disposed on the flat substrate 12.
The scanning mirror SM can change the out-of-plane emission angle of light.
The first substrate 11 and the second substrate 12 are bent and fixed at right angles to each other.
The scanning mirror SM of the optical scanner disposed on the flat substrate 12 is disposed at a position corresponding to the center of the first optical fiber FB1 and the second optical fiber FB2 provided radially on the first substrate 11, and the optical variable An attenuator micro-optical system is constructed.
[0020]
The operation of the micro-optical system configured as described above is performed as follows.
The first optical fiber FB1 disposed on the flat substrate 11 is used as an input port, and an optical signal is introduced. The second optical fiber FB2 disposed on the flat substrate 11 is used as an output port, and an attenuated optical signal is output.
The optical signal introduced into the first optical fiber FB1 arranged on the flat substrate 11 is incident on the scanning mirror SM arranged on the flat substrate 12.
The optical signal of the first optical fiber FB1 incident on the scanning mirror SM is reflected and emitted by the scanning mirror SM.
By adjusting the angle of the scanning mirror SM, the light signal reflected and emitted from the scanning mirror SM is projected onto the end face of the second optical fiber FB2 used as an output port disposed on the flat substrate 11. The amount of can be changed. For this reason, the amount of the optical signal incident on the second optical fiber FB2 can be arbitrarily changed by adjusting the angle of the scanning mirror SM, so that it can function as an optical variable attenuator.
[0021]
FIG. 11 shows an embodiment in which a wavelength filter is manufactured by applying the present invention. The embodiment of FIG. 11 is a case where there is one fold.
In FIG. 11, the same parts as those in FIG.
The FB 1 is an optical fiber fixed to a guide formed on the flat substrate 11.
SM is a scanning mirror disposed on the flat substrate 12. The scanning mirror SM can change the out-of-plane reflection direction of light.
KA is a reflection type diffraction grating arranged opposite to each other.
The planar substrate 11 and the planar substrate 12 are fixed with a predetermined angle by a photoresist, and the planar substrate 12 and the diffraction grating KA are arranged in parallel with a certain interval, and have a three-dimensional structure. The micro optical system is configured.
The operation of the micro-optical system configured as described above is performed as follows.
Incident light introduced into the optical fiber FB1 disposed on the planar substrate 11 is incident obliquely on the diffraction grating KA disposed parallel to the planar substrate 12.
Incident light that has entered the diffraction grating KA is diffracted by the diffraction grating KA, and a specific wavelength component is emitted upward, and is incident perpendicularly to the scanning mirror SM of the optical scanner disposed on the flat substrate 12. Incident light having a specific wavelength emitted from the diffraction grating KA is reflected by the scanning mirror SM, and travels back on the same optical path to enter the diffraction grating KA again.
The light incident on the diffraction grating KA is diffracted again by the diffraction grating KA, and a specific wavelength component is output as outgoing light to the optical fiber FB disposed on the flat substrate 11.
By changing the scanning angle of the scanning mirror SM, the specific wavelength component in the incident light that is finally output to the optical fiber FB changes, so that it can function as a wavelength filter.
[0022]
FIG. 12 shows an embodiment in which a wavelength variable light source is manufactured by applying the present invention. The embodiment of FIG. 12 is a case where there are two folds.
In FIG. 12, the same parts as those in FIG.
The LD is a laser diode fixed on the flat substrate 11. L1 is a lens disposed on the flat substrate 11.
SM is a scanning mirror of an optical scanner disposed on the flat substrate 12. The scanning mirror SM can change the out-of-plane emission angle of light.
KA is a reflective diffraction grating.
The planar substrate 11 and the planar substrate 12 are fixed at a predetermined angle by a photoresist 21, and the planar substrate 12 and the diffraction grating KA are arranged in parallel with a certain interval, and have a three-dimensional structure. A variable light source micro-optical system is configured.
[0023]
The operation of the micro-optical system configured as described above is performed as follows.
Laser light output from the laser diode LD disposed on the planar substrate 11 is incident obliquely on the diffraction grating KA disposed parallel to the planar substrate 12 through the lens L1.
The laser light incident on the diffraction grating KA is diffracted by the diffraction grating KA, a specific wavelength component is emitted vertically upward, and is perpendicularly incident on the scanning mirror SM disposed on the flat substrate 12. The light having a specific wavelength emitted from the diffraction grating KA is reflected by the scanning mirror SM and is incident on the diffraction grating KA again.
The specific wavelength component of the laser light incident on the diffraction grating KA is diffracted by the diffraction grating KA, and the specific wavelength component is emitted in the direction of the lens L1 disposed on the flat substrate 11, and passes through the lens L1. It is fed back to the laser diode LD to form an external resonator to determine the oscillation wavelength of the laser diode LD.
A part of the laser light of the laser diode LD having the specific wavelength is specularly reflected by the diffraction grating KA arranged in parallel with the planar substrate 12, and is output as outgoing light. The wavelength of the laser light from the laser diode LD can function as a wavelength tunable light source because the wavelength for forming the external resonator is changed by changing the scanning angle of the scanning mirror SM.
[0024]
As described in detail above, in the manufacturing method of the micro optical system having the three-dimensional structure of the present invention and the micro optical system that implements the method, the silicon substrate is selectively linearly thinned, By replacing the material softened by heating, it becomes possible to divide the silicon substrate into two or more parts and handle them in a connected state.
Further, in the present invention, in order to bend the silicon substrate divided into each part on a desired straight line, the silicon substrates are not shifted from each other except for rotation, and can be maintained at the prealigned position using planar lithography. it can. In addition, a jig is used so that the angle of bending is fixed at a desired angle. However, since the dimensions of the jig are relative to the substrate of the bulk material, the accuracy of conventional machining is sufficient. In addition, the accuracy of the bending angle is transferred with the accuracy of the jig, and another degree of freedom that cannot be realized by planar lithography is created. It is also possible to change the bending angle once set by using another jig.
In addition, according to the present invention, since the conventional planar lithography processing method is used as it is and a three-dimensional structure is created from the planar substrate in the subsequent process, the components and machine prepared by the planar lithography technique are used in the subsequent process. Since it is a combination of three-dimensional jigs prepared for processing, the entire optical system can be designed and manufactured without unnecessarily increasing the technical difficulty.
[0025]
【The invention's effect】
As is apparent from the above description, the method for manufacturing a micro-optical system having a three-dimensional structure according to the present invention and the micro-optical system that implements the method have various free-space types by bending a silicon wafer that was originally a flat surface. It is possible to realize an optical system.
In the present invention, a technique of making a functional element such as a MEMS structure or a photodiode in advance using a conventional planar lithography technique can be used for a planar sample before bending. In addition, the angle at which the substrate is bent can be arbitrarily set and controlled accurately by using a jig prepared by using a conventional machining technique. For this reason, the device can be manufactured by previously aligning at the manufacturing stage, and the manufactured bent structure and jig can be bonded and fixed for stable use.
For this reason, the integration of a free space type optical system can be promoted by using a combination of conventional established techniques.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a method of manufacturing a micro optical system having a three-dimensional structure according to the present invention and a configuration of a micro optical system that implements the method.
FIG. 2 shows an actually obtained 45 ° bent structure of a silicon substrate and a jig used as a reference for the used bending angle.
FIG. 3 shows data obtained by measuring a substrate shape after the temperature of the silicon substrate is lowered.
FIG. 4 shows data obtained by measuring the angle reproducibility after repeatedly deforming the same wafer by applying it to a jig.
FIG. 5 shows an embodiment in which a distance sensor and a speed sensor are manufactured by applying the present invention to a triangulation optical system.
FIG. 6 shows an embodiment in which an encoder having a bending structure is manufactured by applying the present invention to an encoder.
FIG. 7 shows an embodiment in which a barcode reader is manufactured by applying the present invention to an optical scanner.
FIG. 8 shows an embodiment in which a laser beam operation type display is manufactured by applying the present invention to a two-dimensional optical scanner.
FIG. 9 shows an embodiment in which the present invention is applied to an optical switch to manufacture an optical switch having a bent structure.
FIG. 10 shows an embodiment in which an optical variable attenuator having a bent structure is manufactured by applying the present invention to a variable attenuator.
FIG. 11 shows an embodiment in which a wavelength filter is manufactured by applying the present invention.
FIG. 12 shows an embodiment in which a wavelength tunable light source is manufactured by applying the present invention.
[Explanation of symbols]
10 ... Silicon substrate having a planar structure,
11: One substrate to be bent,
12 ... The other substrate to be bent,
13 ... A third substrate to be bent,
20: Straight groove for bending the silicon substrate 10;
21, 22 ... Photoresist,
30... Jig used for bending a flat silicon substrate 10,
31 ... A reference for a plane when the substrate 10 is bent,
32 ... The other reference when the substrate 10 is bent,
41 ... Linear reference for bending the silicon substrate 10,
BD: Beam position detector,
PD: Photodiode for detecting the amount of light,
LS ... semiconductor laser,
L1 ... collimation lens,
SM: Scanning mirror on micro scanner,
MS ... reflective mirror,
LD ... wavelength-tunable laser diode,
DT: Sample to be measured,
L2 ... Condensing lens,
LE ... Light emitting diode,
AD: diffraction grating photodiode,
TK ... Transmission diffraction grating,
KA: Reflective diffraction grating,
BC: Bar code to be measured,
SM1 ... scanning mirror on the first micro scanner,
SM2 Scanning mirror on the second micro scanner,
FB1 ... first optical fiber,
FB2 ... second optical fiber,
FB3 ... Third optical fiber,

Claims (5)

On a flat substrate of a silicon wafer, after manufacturing a linear soft folding position and a plurality of device elements in which the thickness of silicon is selectively reduced, the device element is planarized by folding the planar substrate at the folding position. A method of manufacturing a micro-optical system that manufactures an optical system having a free space type three-dimensional structure by replacing the arrangement with a three-dimensional arrangement. On a flat substrate of a silicon wafer, a plurality of linear soft bending positions where the thickness of silicon is selectively reduced and a plurality of free spaces such as microactuators, micromirrors, and microlenses using photolithography technology. After manufacturing the elements, the flat substrate is bent at a straight, soft bending position, thereby replacing a plurality of elements arranged in the free space from a flat arrangement to a three-dimensional arrangement. A method of manufacturing a micro optical system for manufacturing an optical system having 3. A micro optical system according to claim 1, wherein a planar substrate of a silicon wafer is placed on a jig with a bending angle and is closely attached to the substrate to fix the bending angle of the substrate. Method. A planar substrate of a silicon wafer consisting of a plurality of manufactured device elements arranged in free space;
And a fixing portion configured to selectively thin the silicon provided on the planar substrate in a straight line and to be bent and fixed at a predetermined angle in order to partition a plurality of portions on the planar substrate. A micro-optical system with a free space type three-dimensional structure. 5. The micro optical system having a free space type three-dimensional structure according to claim 4, wherein a micromirror is provided on a device element arranged in the free space.

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