JP4076110B2 - Method for manufacturing composite semiconductor device - Google Patents

Description

[0001]
The present invention relates to a method for manufacturing a composite semiconductor device, and more particularly, to a method for manufacturing a composite semiconductor device using a semiconductor storage container formed by fitting an insulating case having openings at both ends to an outer peripheral portion of a metal heat sink. .
[0002]
[Prior art]
There are the following assembling processes of a composite semiconductor device. In FIG. 2, an electronic component 3 such as a semiconductor chip, a resistor, or an IC is mounted and fixed on a metal heat radiating plate 1 drawn upside down via an insulating substrate 2. While the outer peripheral portion of the metal heat sink plate 1 is fitted into one open end of the insulating case 4 in which both ends are open, pre-adhesive 5 over its entire periphery to the inner step portion 4a of the outer periphery of the insulating case 4 Is applied.
[0003]
Next, the metal heat dissipating plate 1 on which the electronic component 3 is mounted and fixed is fitted into one opening end of the insulating case 4 in an inverted state as shown in the figure, thereby forming a semiconductor storage container.
[0004]
Next, although not shown, an external lead-out terminal is drawn out from the conductor pattern on the insulating substrate 2, and then a coating agent is sealed inside the insulating case 4, and finally the upper end opening of the insulating case 4 is covered with a lid. A body (not shown) is put on to complete the composite semiconductor device.
[0005]
[Problems to be solved by the invention]
In the manufacturing method of the above composite semiconductor device, it is necessary to apply an adhesive in advance to the stepped portion 4a at the one opening end of the insulating case 4, and it is necessary to make the amount of the applied adhesive uniform. This requires a complicated and laborious process.
Moreover, the curing time of the applied adhesive must also be expected, and it takes a long time to manufacture the composite semiconductor device as a whole.
[0006]
OBJECT OF THE INVENTION
The present invention has been made to solve the above-described problems, and includes a step of fixing one opening end of an insulating case having both ends to the outer periphery of a metal heat sink, and a coating of an electronic component mounted on an insulating substrate. The purpose of the present invention is to provide a method for manufacturing a composite semiconductor device in which the manufacturing process is completed in one step, and the manufacturing time is reduced as a whole, and the manufacturing cost is reduced by omitting complicated and time-consuming processes. is there.
[0007]
[Means for Solving the Problems]
According to the first aspect of the present invention, one end portion of the insulating case (4) having both ends opened is fitted to the outer peripheral portion of the metal heat radiating plate (1) to be insulated from the outer peripheral portion of the metal heat radiating plate (1). In a method for manufacturing a composite semiconductor device having a semiconductor storage container (17) formed by adhering a fitting portion with one end of a case (4),
A semiconductor storage container (17) is placed on a rotary table (12) provided with a hot plate and the hot plate itself rotates,
The semiconductor container (17) is rotated in a horizontal plane, and the casing agent (16) is dropped from above into the semiconductor container (17) to fit the insulating case (4) and the metal heat sink (1). A method of manufacturing a composite semiconductor device is provided, in which a casing agent (16) is collected in a portion by centrifugal force, and heated and cured to form a semiconductor storage container (17).
[0008]
According to the invention described in claim 2, the step of mounting and fixing the electronic component (3) on the metal heat radiating plate (1) via the insulating substrate (2);
Next, a step of fitting one end of the insulating case (4) having both ends opened to the outer peripheral portion of the metal heat sink (1);
Next, the semiconductor storage container (17) formed of the metal heat radiating plate (1) and the insulating case (4) is placed on a rotary table (12) provided with a hot plate and rotating itself. And a process of
Then, rotating the rotary table (12) and dropping the casing agent (16) from the other open end of the insulating case (4),
A composite semiconductor device characterized in that the dropped casing agent (16) is cured and a fitting portion between the metal heat radiating plate (1) and the insulating case (4) is bonded to form a semiconductor storage container (17). A manufacturing method is provided.
[0009]
According to a third aspect of the present invention, there is provided the method for manufacturing a composite semiconductor device according to the first or second aspect, wherein the casing agent (16) is made of silicone rubber.
[0010]
According to invention of Claim 4, casing agent (16) is comprised from the substance which combines the coating agent of the electronic component (3) mounted on the metal heat sink (1), It is characterized by the above-mentioned. A method of manufacturing a composite semiconductor device according to claim 2 is provided.
[0012]
【Example】
Hereinafter, an embodiment of the present invention will be described with reference to FIG.
In the figure, reference numeral 10 denotes an entire rotary table device used in the present invention.
The turntable device 10 includes a turntable 12 made of a hot plate that is rotated in a horizontal plane by a drive motor 11. The turntable 12 is supplied with electric power via the electric power supply unit 13 and heated to a predetermined temperature.
Reference numeral 14 denotes a control unit which can set various conditions such as the rotational speed and time of the drive motor 11 and the temperature of the rotary table 12.
[0013]
Above the rotary table 12, a nozzle 15 of a dispenser device (not shown) for dropping the casing agent is provided. The nozzle 15 is provided so as to be able to reciprocate from the center to the outer periphery of the rotary table 12.
[0014]
Next, a method for manufacturing a composite semiconductor device according to the present invention using the rotary table device 10 will be described. First, an electronic component 3 is mounted and fixed on the metal heat sink 1 via an insulating substrate 2. Next, a stepped portion 4 a provided at one open end (lower side in the figure) of the insulating case 4 having both ends opened is fitted to the outer peripheral portion of the metal heat radiating plate 1 to form the semiconductor storage container 17.
[0015]
Next, the semiconductor storage container 17 is mounted so that the metal heat radiating plate 1 is accommodated in the positioning convex portion 12 a on the turntable 12. The turntable 12 is heated to a predetermined temperature by the control unit 14 of the turntable device 10 in advance.
[0016]
Next, after the rotary table 12 is rotated by the drive motor 11, a casing agent 16 made of, for example, silicone rubber is dropped from the nozzle 15 of the dispenser device installed above the rotary table 12. The dropped casing agent 16 is diffused by centrifugal force in the outer circumferential direction of the metal heat radiating plate 1.
The diffused casing agent 16 gathers at the fitting portion between the inner wall of the insulating case 4 and the metal heat sink 1.
Moreover, the role of the coating agent of the electronic component 3 mounted on the insulating substrate 2 can be fulfilled by controlling the dropping amount of the casing agent 16.
[0017]
Next, an external lead-out terminal (not shown) is drawn out by a known method, and then a predetermined composite semiconductor device is completed through steps similar to those in the prior art.
In addition, in the above-described process, the position of the nozzle 15 of the dispenser device is not located at the center of the metal heat radiating plate 1 but in the vicinity of the outer peripheral portion, so that the fitting portion between the insulating case 4 and the metal heat radiating plate 1 is located. The casing agent 16 can be collected better.
[0018]
It is also possible to use both optionally casing agent and coating agent by for the next step to the electronic component 3 is applied to other coating agents. Furthermore, the external lead-out terminals described above may be soldered onto the conductor pattern of the insulating substrate 2 in advance before the casing agent is applied. In the above embodiment, silicone rubber is used as the casing agent. However, other materials may be used, and in particular, a coating process for the casing can be achieved by using a material that also serves as a coating agent for the electronic component 3. The coating step of the coating agent is preferable as one step.
[0019]
【The invention's effect】
As described above, according to the present invention, the semiconductor storage container is rotated in a horizontal plane, and a casing agent is dropped into the semiconductor storage container from above, and the casing is formed by centrifugal force on the fitting portion between the insulating case and the metal heat sink. Since the agent is collected, heated and cured to form a semiconductor storage container, the step of fixing one open end of the insulating case at both ends to the outer peripheral portion of the metal heat sink, and the electronic component mounted on the insulating substrate The coating can be completed in one process, and the manufacturing time can be shortened as a whole, and the manufacturing cost can be reduced by omitting complicated and time-consuming processes.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a rotary table device used in a method for manufacturing a composite semiconductor device of the present invention.
FIG. 2 is a diagram for explaining a method of forming a semiconductor storage container used in a conventional composite semiconductor device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal heat sink 2 Insulation board 3 Electronic component 4 Insulation case 10 Rotary table apparatus 11 Drive motor 12 Rotary table 13 Electric power supply part 14 Control part 15 Nozzle 16 Casing agent 17 Semiconductor storage container

Claims (4)

One end of the insulating case (4) with both ends opened is fitted to the outer peripheral part of the metal heat sink (1), and the outer peripheral part of the metal heat sink (1) and one end of the insulating case (4) In a method for manufacturing a composite semiconductor device having a semiconductor storage container (17) formed by adhering fitting portions,
A semiconductor storage container (17) is placed on a rotary table (12) provided with a hot plate and the hot plate itself rotates,
Is rotated in the semiconductor storage container (17) in a horizontal plane, fitting inside was dropped casing agent (16) from above the semiconductor storage container (17), and an insulating casing (4) metal heat sink plate (1) method for manufacturing a composite semiconductor device by Ri casing agent centrifugal force attracting (16), heating and cured, and forming a semiconductor storage container (17) in the section. Mounting and fixing the electronic component (3) on the metal heat sink (1) via the insulating substrate (2) ;
Next, a step of fitting one end of the insulating case (4) having both ends opened to the outer peripheral portion of the metal heat sink (1) ;
Then, placing the metal radiator plate (1) and Ru is formed from the insulating case (4) semiconductor storage container (17), with a heat plate, and, on the rotary table (12) to which the heating plate itself is rotated And a process of
Then, comprising rotates the rotary table (12), and a step of dropping the casing material (16) from the other open end of the insulating case (4),
Droplets Do casings agent (16) is cured, the composite semiconductor, characterized in that by adhering the fitting portion between the metal radiator plate (1) and an insulating casing (4) to form a semiconductor storage container (17) Device manufacturing method. 3. The method of manufacturing a composite semiconductor device according to claim 1, wherein the casing agent (16) is made of silicone rubber . 3. The composite semiconductor device according to claim 2 , wherein the casing agent (16) is made of a material that also serves as a coating agent for the electronic component (3) mounted on the metal heat sink (1) . Production method.

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