JP4056365B2 - Substrate processing fluid supply system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing fluid supply device for supplying a processing fluid in which carbon dioxide gas is dissolved in a cleaning liquid to a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, or a substrate for an optical disk. .
[0002]
[Prior art]
As a conventional substrate processing fluid supply device, in order to prevent the generation of static electricity on the substrate surface by reducing the specific resistance of the cleaning liquid and improve the cleaning performance, carbon dioxide gas is dissolved in a cleaning liquid such as pure water, and the cleaning liquid Is supplied to the surface of the substrate loaded in the processing chamber.
[0003]
[Problems to be solved by the invention]
However, in the case of the conventional substrate processing fluid supply apparatus, when the temperature of the processing liquid rises during transfer, dissolved carbon dioxide gas bubbles in the cleaning liquid, and the specific resistance value of the cleaning liquid changes from a desired value, Carbon dioxide bubbles in the filter in the flow path absorb the pressure for pumping the cleaning liquid, making it difficult to supply the cleaning liquid.
[0004]
The present invention was made in view of such circumstances, during the transfer of processing fluid, and an object thereof is to allow preventing the bubbles of carbon dioxide gas with a simple configuration.
[0005]
[Means for Solving the Problems]
The invention according to claim 1, in order to achieve the above-described object, a nozzle for supplying a cleaning liquid to the substrate, and dissolving means for dissolving carbon dioxide gas in the cleaning solution, substrate processing connected through a transfer pipe In the fluid supply device,
The melting means is provided with a temperature adjusting means, and by supplying constant temperature water at a temperature of about 25 ° C., which is higher than the temperature in the clean room, to the temperature adjusting means, the temperature of the cleaning liquid flowing in the transfer pipe is from the melting means side. Also, it is configured to keep it from becoming high .
[0006]
[0007]
[Action]
According to the configuration of the substrate processing fluid supply apparatus of the invention according to claim 1, the melting means is provided with the temperature adjusting means, and the processing liquid in which the carbon dioxide gas is dissolved in the cleaning liquid is transferred from the dissolving means side during the transfer in the transfer pipe. However, the temperature can be maintained so as not to increase, and the substrate can be supplied to the substrate surface via the transfer tube in a state where the temperature is lower than that of the melting means. Therefore, the carbon dioxide gas dissolved in the treatment liquid does not become saturated in the transfer pipe.
[0008]
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic longitudinal sectional view showing a rotary substrate cleaning apparatus using a substrate processing fluid supply apparatus according to a first embodiment of the present invention. FIG. 2 is a plan view of the main part of FIG. A rotary table 24 for holding the substrate W by vacuum suction is provided at the upper end of the rotary shaft 23 of one electric motor 22 to constitute a substrate holding means 25. The substrate holding means 25 holds the substrate W so as to be rotatable around a vertical axis. at a predetermined position above the substrate W to be, the rotation displaceably supported bracket 27 is provided by the second electric motor 26, its supporting bracket 27, Roh nozzle washing liquid obtained by dissolving carbon dioxide gas you supplied at high pressure 28 is provided, and a substrate processing fluid supply device 29 is connected to the nozzle 28.
[0010]
The substrate holding means 25 is not limited to the one that holds the substrate W by vacuum suction. For example, a plurality of substrate support members that support the outer peripheral edge of the substrate W are provided on the turntable 24, and the upper end of the substrate support member is provided. A positioning pin that regulates the horizontal position of the substrate W may be provided, and the substrate W may be configured to be rotatably held in a state of being separated from the upper surface of the turntable 24.
[0011]
The substrate holding means 25 and the periphery of the substrate W held thereby are covered with a cup 30 that can be lifted and lowered by a lift drive mechanism (not shown), and the cleaning liquid supplied onto the substrate W when the substrate W is cleaned. It is configured to prevent scattering. In the figure, reference numeral 31 denotes a cleaning brush for cleaning the substrate surface that can be displaced up to the surface of the substrate W, and reference numeral 32 denotes a cleaning brush 31 when the cleaning brush 31 is in a non-cleaning standby position that is off the upper side of the substrate W. The standby pot which removes the dust adhering to is shown.
[0012]
The substrate processing fluid supply device 29 connects a carbon dioxide introduction pipe 34 to a stainless steel or resin pure water tank 33 for storing pure water as a cleaning liquid, and connects the nozzle 28 and the pure water tank 33 to each other. It is configured to be connected via a transfer pipe 35. The structure in which the carbon dioxide gas introduction pipe 34 is connected to the pure water tank 33 in order to dissolve the carbon dioxide gas in the pure water as the cleaning liquid is referred to as a dissolution means.
[0013]
A regulator 34 a that supplies carbon dioxide gas at a constant pressure is attached to the introduction pipe 34. Further, the transfer pipe 35 is provided with a flow rate control valve 36 and a filter 37 for controlling the supply amount of the cleaning liquid.
[0014]
A pure water supply pipe 38 for supplying pure water to the pure water tank 33 is connected, and an open / close valve 39 is provided in the pure water supply pipe 38. A communication pipe 40 is connected to the bottom side and the upper side of the pure water tank 33, and a pair of liquid level gauges 19a, 19a, 19b, 19b are provided above and below the communication pipe 40, respectively. The level gauges 19a, 19a, 19b, 19b are connected to the controller 20, and the controller 20 and the on-off valve 39 are connected to maintain the amount of processing liquid in the pure water tank 33 between the upper level gauges 19a, 19a. On the other hand, when the on-off valve 39 is automatically controlled to open and close, while the on-off valve 39 is opened due to a failure in the processing liquid supply source, the amount of the processing liquid is abnormally reduced. Is configured so that an alarm device (not shown) such as a buzzer or a lamp can be actuated by detecting this by the lower level gauges 19b and 19b.
[0015]
A heat exchange coil 41 as a temperature control means is provided below the pure water tank 33, and constant temperature water having a temperature higher than about 23 ° C. in the clean room is supplied to the heat exchange coil 41. It is configured as follows.
[0016]
With the above configuration, the temperature of the cleaning liquid flowing in the transfer pipe 35 is maintained so as not to be higher than that of the pure water tank 33 side. Thereby, the carbon dioxide dissolved in the cleaning liquid is not saturated in the transfer pipe 35. Accordingly, the carbon dioxide dissolved in the cleaning liquid is prevented from being bubbled and separated in the transfer pipe 35, and the cleaning liquid in which the specific resistance is reduced by dissolving the carbon dioxide in the pure water tank 33 is transferred from the nozzle 28 to the substrate W. The surface of the substrate W can be satisfactorily cleaned without generating static electricity.
[0017]
FIG. 3 is a schematic longitudinal sectional view showing a rotary substrate cleaning apparatus using the substrate processing fluid supply apparatus according to the second embodiment of the present invention. The difference from the first embodiment is as follows.
That is, a melting device 45 as a melting means is configured by being partitioned into an upper chamber 43 and a lower chamber 44 by a carbon dioxide gas permeable film 42. Connected to the upper chamber 43 is an introduction pipe 47 for supplying carbon dioxide gas having an on-off valve 46 and an exhaust pipe 48. On the other hand, a pure water supply pipe 49 is connected to the lower chamber 44, and the lower chamber 44 and the nozzle 50 are connected via a transfer pipe 51.
[0018]
A heat exchange coil 52 is provided in the lower chamber 44 as temperature control means, and constant temperature water at a temperature of about 25 ° C., which is higher than the temperature in the clean room, about 23 ° C. is supplied to the heat exchange coil 52. Yes. Other configurations are the same as those of the first embodiment, and the same reference numerals are given and description thereof is omitted.
[0019]
According to the second embodiment, carbon dioxide gas is supplied into the pure water through the membrane 42, and therefore, there is an advantage that dust and impurities in the carbon dioxide gas can be more effectively removed.
In the above-described embodiment, the heat exchange coils 41 and 52 for flowing constant temperature water are provided as temperature control means, but a heater or a cooling device may be provided.
Moreover, in the said Example, although the heat exchange coils 41 and 52 are provided in the pure water tank 33 and the melting | dissolving apparatus 45 as temperature control means, it does not restrict to this, For example, the pure water tank 33 and the melting | dissolving apparatus 45 are made constant temperature. It is good also as a structure covered with a water jacket. In these embodiments, the temperature control means is provided only on the pure water tank 33 or the melting device 45 side so that the configuration can be simplified. For example, in the present invention, the transfer pipes 35 and 51 are provided. , Toka inserted into the pipe for heat exchange through the constant-temperature water, such as contacting the pipe for heat exchange through the heat transfer can be constant-temperature water on the outer circumference of the transfer pipe 35,51, temperature control means on the side of both May be provided.
[0021]
The present invention is not limited to the circular substrate as in the above-described embodiment, but can be applied to a rotary substrate cleaning apparatus for a square substrate.
[0022]
【The invention's effect】
As described above, according to the substrate processing fluid supply apparatus of the first aspect of the present invention, the temperature of the processing liquid obtained by dissolving the carbon dioxide gas in the cleaning liquid is supplied from the dissolving means side until it is supplied to the substrate surface through the transfer pipe. Therefore, it is possible to avoid the carbon dioxide dissolution concentration from exceeding the saturation point during the transfer of the processing fluid, to prevent the formation of carbon dioxide bubbles, and to improve the static electricity removal effect without causing poor pumping of the cleaning liquid. It has become possible to demonstrate.
In addition, since the temperature adjusting means is provided in the melting means to prevent the carbon dioxide gas from being bubbled, the configuration can be simplified and economical compared to the case where the temperature adjusting means is provided in the entire transfer pipe.
[0023]
[Brief description of the drawings]
FIG. 1 is a schematic longitudinal sectional view showing a rotary substrate cleaning apparatus using a substrate processing fluid supply apparatus according to a first embodiment of the present invention.
FIG. 2 is a plan view of the main part of FIG.
FIG. 3 is a schematic longitudinal sectional view showing a rotary substrate cleaning apparatus using a substrate processing fluid supply apparatus according to a second embodiment of the present invention.
[Explanation of symbols]
33 ... Pure water tank constituting melting means 34 ... Introducing pipes 35, 51 constituting melting means ... Transfer pipes 41, 52 ... Heat exchange coil as temperature control means 45 ... Melting apparatus W ... Substrate

Claims (1)

A nozzle for supplying a cleaning liquid to the substrate, and dissolving means for dissolving carbon dioxide gas in the cleaning liquid, the fluid supply device substrate processing connected via a transfer tube,
The melting means is provided with a temperature control means, and by supplying constant temperature water of about 25 ° C., which is higher than the temperature in the clean room, to the temperature control means, the temperature of the cleaning liquid flowing in the transfer pipe is set to be higher than that of the melting means side. A substrate processing fluid supply apparatus, wherein the substrate processing fluid supply apparatus is maintained so as not to become high .

Images