JP4042920B2 - Cu alloy for electrical and electronic parts with excellent strength and punchability - Google Patents

Description

【００１９】
各種Ｃｕ合金の熱間加工性を評価する目的で、上記面削段階で熱延板全長にわたって目視にて５mm以上の側端部割れの数および最大側端部割れの長さを観察し、その結果を表２に示した。
【００２０】
上記側端部割れが観察された熱延板については、粗圧延後、割れ部をスリットして除き、それ以降は５mm以上の側端部割れのない熱延板と同様の工程で製造した。
【００２１】
このようにして得られた本発明Ｃｕ合金１〜１２、比較Ｃｕ合金１〜４および従来Ｃｕ合金からなるＣｕ合金板について、下記の引張試験、導電率測定試験および打抜き加工性試験を行った。
【００２２】
（１） 引張試験
上記各種Ｃｕ合金板の圧延方向に平行に採取したＪＩＳ５号試験片を用いて引張強さと伸びを測定し、それらの測定結果を表２に示した。
【００２３】
（２） 導電率測定試験
ＪＩＳＨ０５０５に定める測定方法で導電率を測定し、その測定結果を表２に示した。
【００２４】
（３） 打抜き加工性試験
金型として市販のＣｏ：１６％、ＷＣ：残りからなる組成を有するＷＣ基超硬合金製のものを用い、直径：５mmの円形チップを１００万個打抜き、打抜き加工開始から２０個の穴径と１００万個の打抜き加工終了直前の２０個の穴径をそれぞれ測定し、それぞれの２０個の平均値から変化量を求めて金型の摩耗量とし、表１の従来Ｃｕ合金からなるＣｕ合金板を打抜き加工して摩耗した金型の摩耗量を１とし、これに対する相対値として表わした値を表２に示した。
【００２５】
【表２】

【００２６】
表１〜表２に示される結果から、本発明Ｃｕ合金１〜１２は、従来Ｃｕ合金と比較して引張り強さが優れ、さらに打抜き加工による金型摩耗量が小さいところから打抜き加工性に優れていることがわかる。
【００２７】
しかし、Ｃの含有量が０．００１％を越えて含有する比較Ｃｕ合金４は熱間加工性が悪くなり、さらにＣｒおよび／またはＺｒの添加によりＣｕ合金の引張り強さが一層向上するが、０．３％を越えて含有する比較Ｃｕ合金２，３および４は熱間加工性が悪くなるとともに打抜き加工性の改善も小さくなることがわかる。
【００２８】
なお、本発明Ｃｕ合金１〜１２について、初期状態のばね限界値、曲げ加工によるばね限界値の低下率、応力緩和率（耐熱クリープ特性）、曲げ部のはんだ剥離の有無、メッキふくれ発生の有無、最大漏洩電流（耐マイグレーション特性）等について測定したが、いずれも従来Ｃｕ合金と比べて差がないところから、この発明の範囲内でのＣおよびＣｒ，Ｚｒ添加による諸特性に対して悪影響を与えないことも確認した。一方、比較Ｃｕ合金２，３，４についてはメッキふくれが観察された。
【００２９】
【発明の効果】
この発明の電気電子部品用Ｃｕ合金は、従来のＣｕ合金のもつ優れた導電性、耐熱クリープ特性、耐マイグレーション特性、耐メッキふくれ性、曲げ部の耐はんだ剥離性および熱間加工性を維持し、さらに強度および打抜き加工性にも優れているもので、この発明のＣｕ合金を用いて板を製造する場合、溶体化処理−時効硬化処理等の製造工程を行なわずとも比較的高い強度が得られるとともに、打抜き加工性に優れているところから金型の補修および交換回数を減らすことができ、電気電子部品製造の高効率化および生産性向上にも大いに寄与し、産業上すぐれた効果をもたらすものである。[0001]
[Industrial application fields]
The present invention relates to a Cu alloy suitable for manufacturing electrical and electronic parts.
[0002]
[Prior art]
As a Cu alloy for electrical and electronic parts that has good conductivity, resistance to solder peeling at bent parts, heat-resistant creep characteristics, migration resistance, and excellent hot workability and punching workability, in weight% (below) % Indicates weight%),
Ni: 0.5 to 3%, Sn: 0.1 to 0.9%,
Si: 0.08 to 0.8%, Zn: 0.1 to 3%,
Fe: 0.007 to 0.25%, P: 0.001 to 0.2%,
Mg: 0.001 to 0.2%,
It is already known that there is a Cu alloy having a composition containing Cu and the remainder consisting of Cu and inevitable impurities (see JP-A-6-145877, hereinafter, this Cu alloy is referred to as a conventional Cu alloy).
[0003]
[Problems to be solved by the invention]
However, in recent years, with the mass production of electrical and electronic parts, there has been a demand for further reduction in manufacturing cost and processing cost, and at the same time, a Cu alloy having higher strength than before is demanded.
[0004]
[Means for Solving the Problems]
Therefore, the present inventors have maintained the characteristics such as conductivity, solder peeling resistance, heat-resistant creep resistance, migration resistance, hot workability, etc. of the conventional Cu alloy, while maintaining the strength and punching. As a result of research to further improve workability,
Conventional Ni: 0.5-3%, Sn: 0.1-0.9%, Si: 0.08-0.8%, Zn: 0.1-3%, Fe: 0.007-0. A Cu alloy containing 25%, P: 0.001 to 0.2%, Mg: 0.001 to 0.2%, and the remainder consisting of Cu and inevitable impurities, and further C: 0.0001 Addition of ˜0.001% (more preferably 0.0002 to 0.0008%) further improves the strength and punching workability, and if necessary, one or two of Cr and Zr : When 0.001 to 0.3% (more preferably more than 0.01% to 0.2%) is added, Ni and Si compounds are refined to further improve the strength of the alloy and C in the Cu alloy It has been found that it is easier to contain in the composition.
[0005]
This invention has been made based on such knowledge,
(1) Ni: 0.5-3%, Sn: 0.1-0.9%,
Si: 0.08 to 0.8%, Zn: 0.1 to 3%,
Fe: 0.007 to 0.25%, P: 0.001 to 0.2%,
Mg: 0.001 to 0.2%, C: 0.0001 to 0.001%,
And having the composition comprising Cu and inevitable impurities in the remainder, having good conductivity, solder peeling resistance at the bent portion, heat resistant creep characteristics, migration resistance characteristics, and further strength and punching processing Cu alloy for electrical and electronic parts with excellent properties,
(2) Ni: 1.3 to 2.7%, Sn: 0.2 to 0.79%,
Si: 0.2-0.8%, Zn: 0.4-2.0%,
Fe: 0.01-0.12%, P: 0.002-0.10%,
Mg: 0.001 to 0.10%, C: 0.0002 to 0.0008%,
And having the composition comprising Cu and inevitable impurities in the remainder, having good conductivity, solder peeling resistance at the bent portion, heat resistant creep characteristics, migration resistance characteristics, and further strength and punching processing Cu alloy for electrical and electronic parts with excellent properties,
(3) Ni: 0.5-3%, Sn: 0.1-0.9%,
Si: 0.08 to 0.8%, Zn: 0.1 to 3%,
Fe: 0.007 to 0.25%, P: 0.001 to 0.2%,
Mg: 0.001 to 0.2%, C: 0.0001 to 0.001%,
In addition,
One or two of Cr and Zr: 0.001 to 0.3%,
And having the composition comprising Cu and inevitable impurities in the remainder, having good conductivity, solder peeling resistance at the bent portion, heat resistant creep characteristics, migration resistance characteristics, and further strength and punching processing Cu alloy for electrical and electronic parts with excellent properties,
(4) Ni: 1.3 to 2.7%, Sn: 0.2 to 0.79%,
Si: 0.2-0.8%, Zn: 0.4-2.0%,
Fe: 0.01-0.12%, P: 0.002-0.10%,
Mg: 0.001 to 0.10%, C: 0.0002 to 0.0008%,
In addition,
One or two of Cr and Zr: more than 0.01% to 0.2%,
And having the composition comprising Cu and inevitable impurities in the remainder, having good conductivity, solder peeling resistance at the bent portion, heat resistant creep characteristics, migration resistance characteristics, and further strength and punching processing Cu alloy for electrical and electronic parts with excellent properties,
It has the characteristics.
[0006]
Next, the reason why the component composition of the Cu alloy of the present invention is limited as described above will be described.
[0007]
(A) Ni and Si
These components form a compound in the state of coexistence, thereby improving the strength and spring property without significantly reducing the conductivity, increasing the softening temperature, and improving the creep resistance at high temperatures. However, even if the content is less than 0.5% Ni or less than 0.08% Si, the formation of the compound is insufficient, and the above effect cannot be obtained, while the content of Ni Even if the Si content exceeds 3% and the Si content exceeds 0.8%, the hot rollability and the conductivity will decrease. , Si: determined to be 0.08 to 0.8%. More preferable ranges of Ni and Si are Ni: 1.3 to 2.7% and S: 0.2 to 0.8%, respectively.
[0008]
(B) Sn
The Sn component has the effect of further improving the spring property and the bending workability, but if the content is less than 0.1%, the desired spring property cannot be ensured, while the content is 0. If it exceeds 9%, a tendency to decrease in migration resistance and conductivity will appear, so the content was determined to be 0.1 to 0.9%.
[0009]
A more preferable range of the Sn content is 0.2 to 0.79%.
[0010]
(C) Zn
The Zn component has an effect of improving the solder heat resistance and migration resistance, but if its content is less than 0.1%, the above effect cannot be obtained, while its content is 3%. If it exceeds V, solderability will be impaired, so the content was determined to be 0.1 to 3%. A more preferable range of the Zn content is 0.4 to 2.0%.
[0011]
(D) Fe
The Fe component has the effect of improving the hot rolling property (the effect of suppressing the occurrence of surface cracks and ear cracks) and the effect of reducing the Ni and Si compound precipitation and thus improving the plating heat adhesion, etc. However, if the content is less than 0.007%, the above effect cannot be obtained. On the other hand, if the content exceeds 0.25%, the hot rolling effect is obtained. The content is determined to be 0.007 to 0.25% because it tends to be saturated and rather has a decreasing tendency and adversely affects conductivity.
A more preferable range of the Fe content is 0.01 to 0.12%.
[0012]
(E) P
The P component has an effect of suppressing a decrease in spring property caused by bending, thereby improving the insertion / extraction characteristics of the connector obtained by molding and improving the migration resistance, but its content is 0. If the content is less than 0.001%, the desired effect cannot be obtained. On the other hand, if the content exceeds 0.2%, the heat-resistant peelability of the solder is significantly impaired. 2%. A more preferable range of the P content is 0.002 to 0.10%.
[0013]
(F) Mg
Mg component suppresses hot rolling cracks due to solidification strain and segregation of S and other impurity elements promoted by upsizing of ingots, and improves punching workability to reduce punching die wear However, if the content is less than 0.001%, the desired effect cannot be obtained. On the other hand, if the content exceeds 0.2%, Mg oxide or the like is easily caught in the ingot. The hot rolling property (hot workability) is impaired, and the conductivity is also lowered. Therefore, the content is determined to be 0.001 to 0.2%. A more preferable range of the Mg content is 0.001 to 0.10%.
[0014]
(G) C
The component C has an effect of improving the punching workability, and further has an effect of improving the strength of the alloy by refining the Ni and Si compound, but if the content is less than 0.0001%, the desired effect is obtained. On the other hand, if the content exceeds 0.001%, the hot workability is adversely affected. Therefore, the C content is set to 0.0001 to 0.001%. A more preferable range of the C content is 0.0002 to 0.0008%.
[0015]
(H) Cr, Zr
These components have a strong affinity for C and make it easy to contain C in the Cu alloy, as well as an action to further refine the Ni and Si compounds to improve the strength of the alloy and to further improve the strength by precipitation of itself. However, even if the content of one or two of Cr and Zr is less than 0.001%, the effect of improving the strength of the alloy cannot be obtained. A large precipitate of Cr and / or Zr is formed, which deteriorates the plating property, deteriorates the punching workability, and further deteriorates the hot workability.
[0016]
Therefore, the content of one or two of Cr and Zr is set to 0.001 to 0.3%. A more preferable range of one or two of Cr and Zr is more than 0.01% and 0.2% or less.
[0017]
【Example】
Using an ordinary low-frequency groove type melting furnace, each of the molten alloys of the present invention Cu alloys 1 to 12, comparative Cu alloys 1 to 4 and conventional Cu alloys having the composition shown in Table 1 are prepared, and the semi-continuous casting method is used. Ingots having dimensions of thickness: 170 mm, width: 520 mm, and length: 4800 mm were manufactured. This ingot is hot-rolled at a predetermined rolling start temperature within a range of 750 to 950 ° C. to produce a hot rolled sheet with a thickness of 11 mm, and then water-cooled. .Chamfered by 5 mm to a thickness of 10 mm. This face-cutting plate is subjected to cold rolling and annealing alternately under normal conditions, and finally annealed at a predetermined temperature in the range of 250 to 550 ° C. for 1 hour. Cu alloy plates having a thickness of 0.25 mm made of alloys 1 to 12, comparative Cu alloys 1 to 4 and a conventional Cu alloy were prepared.
[0018]
[Table 1]

[0019]
In order to evaluate the hot workability of various Cu alloys, the number of side edge cracks of 5 mm or more and the length of the maximum side edge cracks were visually observed over the entire length of the hot-rolled sheet at the above-mentioned chamfering stage. The results are shown in Table 2.
[0020]
About the hot-rolled sheet in which the said side edge part crack was observed, after rough rolling, the crack part was slit and removed and it manufactured by the process similar to the hot-rolled sheet without a side edge part crack of 5 mm or more after that.
[0021]
The following tensile test, conductivity measurement test, and punching workability test were performed on the Cu alloy plates made of the present invention Cu alloys 1 to 12, comparative Cu alloys 1 to 4, and conventional Cu alloys.
[0022]
(1) Tensile test Tensile strength and elongation were measured using JIS No. 5 test pieces taken in parallel with the rolling direction of the various Cu alloy sheets, and the measurement results are shown in Table 2.
[0023]
(2) Conductivity measurement test The conductivity was measured by the measurement method defined in JISH0505, and the measurement results are shown in Table 2.
[0024]
(3) Punching workability test As a mold, commercially available Co: 16%, WC: WC-based cemented carbide having the remaining composition, 1 million circular chips with a diameter of 5 mm are punched and punched 20 hole diameters from the start and 20 hole diameters immediately before the end of the punching process of 1 million were measured, and the amount of change was determined from the average value of each 20 to determine the wear amount of the mold. The amount of wear of a die that had been worn by punching a Cu alloy plate made of a conventional Cu alloy was taken as 1, and the value expressed as a relative value to this was shown in Table 2.
[0025]
[Table 2]

[0026]
From the results shown in Tables 1 and 2, the Cu alloys 1 to 12 of the present invention are superior in tensile strength as compared to conventional Cu alloys, and are excellent in punching workability because of a small amount of die wear due to punching. You can see that
[0027]
However, the comparative Cu alloy 4 containing C in excess of 0.001% has poor hot workability, and the addition of Cr and / or Zr further improves the tensile strength of the Cu alloy. It can be seen that Comparative Cu Alloys 2, 3 and 4 containing more than 0.3% have poor hot workability and small improvement in punching workability.
[0028]
In addition, about this invention Cu alloys 1-12, the spring limit value of an initial state, the fall rate of the spring limit value by bending, a stress relaxation rate (heat-resistant creep characteristic), the presence or absence of solder peeling of a bending part, the presence or absence of plating blistering The maximum leakage current (migration resistance) was measured, but there was no difference compared to the conventional Cu alloy, and there was an adverse effect on the various characteristics due to the addition of C, Cr, and Zr within the scope of the present invention. It was also confirmed not to give. On the other hand, plating blisters were observed for the comparative Cu alloys 2, 3 and 4.
[0029]
【The invention's effect】
The Cu alloy for electrical and electronic parts of the present invention maintains the excellent electrical conductivity, heat-resistant creep characteristics, migration resistance, plating blistering resistance, solder peeling resistance of the bent portion, and hot workability of conventional Cu alloys. Furthermore, it is also excellent in strength and punching workability. When a plate is produced using the Cu alloy of the present invention, a relatively high strength can be obtained without carrying out production steps such as solution treatment and age hardening treatment. In addition, because of its excellent punching processability, it can reduce the number of repairs and replacements of dies, greatly contributing to the improvement of the efficiency and productivity of electrical and electronic parts manufacturing, and has excellent industrial effects. Is.

Claims (4)

% By weight
Ni: 0.5 to 3%, Sn: 0.1 to 0.9%,
Si: 0.08 to 0.8%, Zn: 0.1 to 3%,
Fe: 0.007 to 0.25%, P: 0.001 to 0.2%,
Mg: 0.001 to 0.2%, C: 0.0001 to 0.001%,
And having the composition comprising Cu and inevitable impurities in the remainder, having good conductivity, solder peeling resistance at the bent portion, heat resistant creep characteristics, migration resistance characteristics, and further strength and punching processing Cu alloy for electrical and electronic parts with excellent properties. % By weight
Ni: 1.3 to 2.7%, Sn: 0.2 to 0.79%,
Si: 0.2-0.8%, Zn: 0.4-2.0%,
Fe: 0.01-0.12%, P: 0.002-0.10%,
Mg: 0.001 to 0.10%, C: 0.0002 to 0.0008%,
And having the composition comprising Cu and inevitable impurities in the remainder, having good conductivity, solder peeling resistance at the bent portion, heat resistant creep characteristics, migration resistance characteristics, and further strength and punching processing Cu alloy for electrical and electronic parts with excellent properties. % By weight
Ni: 0.5 to 3%, Sn: 0.1 to 0.9%,
Si: 0.08 to 0.8%, Zn: 0.1 to 3%,
Fe: 0.007 to 0.25%, P: 0.001 to 0.2%,
Mg: 0.001 to 0.2%, C: 0.0001 to 0.001%,
In addition,
One or two of Cr and Zr: 0.001 to 0.3% is contained, and the remainder has a composition composed of Cu and inevitable impurities. A Cu alloy for electrical and electronic parts that has solder releasability, heat-resistant creep characteristics, and migration resistance characteristics, as well as excellent strength and punching workability. % By weight
Ni: 1.3 to 2.7%, Sn: 0.2 to 0.79%,
Si: 0.2-0.8%, Zn: 0.4-2.0%,
Fe: 0.01-0.12%, P: 0.002-0.10%,
Mg: 0.001 to 0.10%, C: 0.0002 to 0.0008%,
In addition,
One or two of Cr and Zr: more than 0.01% to 0.2%, with the balance being composed of Cu and inevitable impurities, good conductivity, bending Cu alloy for electrical and electronic parts that has excellent solder peel resistance, heat-resistant creep characteristics, and migration resistance, as well as excellent strength and punching workability.